CN114828410B

CN114828410B - Bonding structure and display device

Info

Publication number: CN114828410B
Application number: CN202210444374.7A
Authority: CN
Inventors: 郑财; 黄沅江
Original assignee: Kunshan Govisionox Optoelectronics Co Ltd
Current assignee: Kunshan Govisionox Optoelectronics Co Ltd
Priority date: 2022-04-26
Filing date: 2022-04-26
Publication date: 2024-09-13
Anticipated expiration: 2042-04-26
Also published as: CN114828410A

Abstract

The application provides a bonding structure and a display device, wherein the bonding structure comprises a first bonding part and a second bonding part, the first bonding part comprises a first substrate and first bonding units respectively arranged on two opposite sides of the first substrate along the thickness direction; the second bonding piece comprises a second substrate and a second bonding unit, the second substrate forms a first accommodating space, and the second bonding unit is arranged on the inner wall of the first accommodating space. The first bonding unit is located in the first accommodating space and is in bonding connection with the second bonding unit. According to the embodiment of the application, the first accommodating space is arranged on the second substrate, so that a certain space condition can be provided for the connection of the first bonding unit and the second bonding unit, and the connection reliability is ensured. And the size of the second bonding piece is not required to be additionally increased, so that the overall size of the bonding structure is indirectly reduced.

Description

Bonding structure and display device

Technical Field

The present disclosure relates to electronic devices, and particularly to a bonding structure and a display device.

Background

With the progress of technology, digital display devices such as smart phones and tablet computers are widely used, wherein a display screen is an indispensable interpersonal communication interface in the display devices. The display device for realizing display has the characteristics of high response speed and good display effect, is focused by users, and is widely applied to terminal products such as smart phones, tablet computers and the like.

But due to the increasing performance requirements of display devices at present, the size of the display devices needs to be increased to meet the wiring requirements under high performance requirements.

Disclosure of Invention

The embodiment of the application provides a bonding structure and a display device, which can reduce the size of the bonding structure.

In a first aspect, an embodiment of the present application provides a bonding structure, including a first bonding member and a second bonding member, where the first bonding member includes a first substrate and first bonding units respectively disposed on two opposite sides of the first substrate in a thickness direction; the second bonding piece comprises a second substrate and a second bonding unit, the second substrate forms a first accommodating space, and the second bonding unit is arranged on the inner wall of the first accommodating space.

The first bonding unit is located in the first accommodating space and is in bonding connection with the second bonding unit.

In some embodiments, the second bonding member is disposed at one end of the first bonding member along a first direction, the first direction intersecting the thickness direction. Wherein, the second base plate is close to one end of first base plate in first direction and forms first accommodation space.

In some embodiments, the first substrate includes a first substrate, and a first circuit layer and a second circuit layer disposed on two sides of the first substrate in a thickness direction, and the first bonding unit is disposed on the first circuit layer and the second circuit layer, respectively.

In some embodiments, the first substrate further includes a connection portion connecting the first wiring layer and the second wiring layer. The connecting part is arranged at one end of the first substrate, which is close to the second substrate along the first direction; or the first substrate comprises a first via hole penetrating and formed along the thickness direction, and the connecting part is positioned in the first via hole.

In some embodiments, the first substrate further includes a circuit protection layer disposed on a side of the first circuit layer and the second circuit layer facing away from the first substrate, the circuit protection layer includes a second via hole formed therethrough in a thickness direction, and the first bonding unit is exposed by the second via hole.

In some embodiments, the first substrate further includes a first functional film layer disposed on a side of the circuit protection layer away from the first substrate, the first substrate protrudes from the first functional film layer along the first direction, and the first functional film layer is disposed outside the first accommodating space.

In some embodiments, the first functional film layer includes a support film.

In some embodiments, the second substrate includes a second substrate, and a third line layer and a fourth line layer disposed on both sides of the second substrate in a thickness direction, each protruding from the second substrate in a first direction, the first receiving space is formed by half-surrounding the third line layer, the fourth line layer, and the second substrate, and the second bonding unit is disposed on portions of the third line layer and the fourth line layer protruding from the second substrate.

In some embodiments, the surface of the first substrate along the thickness direction is recessed inwards to form a second accommodating space, and the first bonding unit is positioned in the second accommodating space;

the inner wall of the first accommodation space forms a protruding part protruding into the first accommodation space, and the second bonding unit is arranged on the protruding part and at least partially positioned in the second accommodation space.

In some embodiments, the bottom wall of the second accommodation space in the thickness direction is formed protruding in a direction away from the protruding portion.

In some embodiments, the bottom wall includes a first wall surface and a second wall surface disposed in conjunction, the first wall surface and the second wall surface intersecting.

In a second aspect, an embodiment of the present application provides a display device including a bonding structure according to any one of the foregoing embodiments.

The embodiment of the application provides a bonding structure and a display device, wherein a plurality of first bonding units in the bonding structure are respectively arranged at two sides of a first substrate, so that the number of the first bonding units positioned at one side of the first substrate can be reduced, and the size of a first bonding part is further reduced. On the basis, the embodiment of the application also provides a first accommodating space on the second substrate, so that a certain space condition can be provided for the connection of the first bonding unit and the second bonding unit, and the connection reliability is ensured. And the size of the second bonding piece is not required to be additionally increased, so that the overall size of the bonding structure is indirectly reduced.

Drawings

In order to more clearly illustrate the technical solution of the embodiments of the present application, the drawings that are needed to be used in the embodiments of the present application will be briefly described, and it is possible for a person skilled in the art to obtain other drawings according to these drawings without inventive effort.

FIG. 1 is a schematic diagram of a bonding structure according to an embodiment of the present application;

FIG. 2 is a schematic cross-sectional view of A-A of FIG. 1;

FIG. 3 is a schematic diagram of a first bonding member in a bonding structure according to an embodiment of the present application;

FIG. 4 is a schematic cross-sectional view of the structure B-B of FIG. 3;

FIG. 5 is a schematic cross-sectional view of a first bonding member of a bonding structure according to an embodiment of the present application;

FIG. 6 is a schematic cross-sectional view of yet another bonding structure according to an embodiment of the present application;

FIG. 7 is a schematic cross-sectional view of a second bonding member in a bonding structure according to an embodiment of the present application;

FIG. 8 is a schematic cross-sectional view of a second bonding member of a bonding structure according to an embodiment of the present application;

FIG. 9 is a schematic cross-sectional view of a bonding structure according to an embodiment of the present application;

fig. 10 is a partial enlarged view of a region Q in fig. 9;

FIG. 11 is a schematic cross-sectional view of a bonding structure according to an embodiment of the present application;

fig. 12 is a partial enlarged view of the region P in fig. 11;

fig. 13 is a schematic structural diagram of a display device according to an embodiment of the present application.

Marking:

1. A first bonding member; 11. a first substrate; 111. a first substrate; 1111. a first via; 112. A first circuit layer; 113. a second circuit layer; 114. a connection part; 115. a driving chip; 116. A circuit protection layer; 1161. a second via; 117. a first functional film layer; 118. a second accommodation space; 1181. a bottom wall; 1182. a first wall surface; 1183. a second wall surface; 12. a first bonding unit;

2. a second bonding member; 21. a second substrate; 211. a second substrate; 212. a third circuit layer; 213. A fourth line layer; 22. a second bonding unit; 23. a first accommodation space; 231. an inner wall; 232. A protruding portion;

AA. A display area; NA, non-display area;

X, a first direction; y, thickness direction.

Detailed Description

Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail below with reference to the accompanying drawings and the detailed embodiments. It should be understood that the particular embodiments described herein are meant to be illustrative of the application only and not limiting. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the application by showing examples of the application.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

In a display device, there is a Bonding process for electrically connecting an array substrate and a circuit board. With the progress of the technology level, the requirements of display devices are also increasing. The higher performance requirements mean that more traces need to be routed on the array substrate. On this basis, a multi-row pad structure is required to be provided for electrical connection with the circuit board, which may cause the display device to become large in size, thereby affecting the use feeling.

In order to solve the above-mentioned problems, referring to fig. 1 and 2, an embodiment of the present application provides a bonding structure, which includes a first bonding member 1 and a second bonding member 2, wherein the first bonding member 1 includes a first substrate 11 and first bonding units 12 respectively disposed on two opposite sides of the first substrate 11 along a thickness direction Y. The second bonding member 2 includes a second substrate 21 and a second bonding unit 22, the second substrate 21 forms a first accommodating space 23, and the second bonding unit 22 is disposed on an inner wall 231 of the first accommodating space 23. The first bonding unit 12 is located in the first accommodating space 23 and is bonded to the second bonding unit 22.

The bonding structure comprises a first bonding piece 1 and a second bonding piece 2, wherein the first bonding piece 1 can be an array substrate, and the second bonding piece 2 can be a circuit board. It should be noted that, in some embodiments, the first bonding member 1 and the second bonding member 2 are both circuit boards, that is, the bonding structure provided in the embodiments of the present application may be used to realize connection between the array substrate and the circuit boards, and may also be applied to connection between structures such as two circuit boards, which is not limited in the embodiments of the present application. In addition, a connection between the array substrate and the circuit board will be specifically described herein.

The first bonding element 1 includes a first substrate 11 and a plurality of first bonding units 12 disposed on both sides of the first substrate 11 along the thickness direction Y, and the plurality of first bonding units 12 disposed on one side of the first substrate 11 may be disposed in one row or may be disposed in multiple rows. In the embodiment of the application, the first bonding units 12 are arranged on two sides of the first substrate 11, so that the number of the first bonding units 12 positioned on one side of the first substrate 11 is reduced, the number of rows of the first bonding units 12 positioned on one side of the first substrate 11 is reduced, and the size of the first bonding member 1 is further reduced.

The second bonding element 2 includes a second substrate 21, and a thickness direction Y of the second substrate 21 is parallel to a thickness direction Y of the first substrate 11, and it should be noted that, the thickness direction Y mentioned later herein is the thickness direction Y of the first substrate 11, and corresponds to the thickness direction Y of the second substrate 21.

The second substrate 21 has a first accommodating space 23 formed thereon, and the second bonding unit 22 is disposed in the first accommodating space 23 and connected to the second substrate 21. Specifically, the first accommodation space 23 has two inner walls 231 facing each other in the thickness direction Y, and the plurality of second bonding units 22 are respectively disposed on the two inner walls 231. The first substrate 11 partially extends into the first accommodating space 23, and the first bonding unit 12 is located in the first accommodating space 23, and the first bonding unit 12 and the second bonding unit 22 are correspondingly connected. Illustratively, a conductive adhesive may be disposed between first bonding unit 12 and second bonding unit 22 to effect the connection. Optionally, the number and arrangement of the plurality of second bonding units 22 on the single inner wall 231 are the same as the number and arrangement of the corresponding plurality of first bonding units 12 on the single side of the first substrate 11, so that positioning and mounting of the first bonding units 12 and the second bonding units 22 are facilitated.

It should be noted that, in the embodiment of the present application, the first bonding unit 12 and the second bonding unit 22 include, but are not limited to, pad structures, as long as the first bonding member 1 and the second bonding member 2 are electrically connected to the second bonding unit 22 through the first bonding unit 12.

In the embodiment of the present application, the plurality of first bonding units 12 are respectively disposed on two sides of the first substrate 11, so that the number of first bonding units 12 located on one side of the first substrate 11 can be reduced, and the size of the first bonding member 1 can be further reduced. On this basis, the embodiment of the application further provides the first accommodating space 23 on the second substrate 21, so that a certain space condition can be provided for the connection of the first bonding unit 12 and the second bonding unit 22, and the connection reliability is ensured. And the size of the second bonding piece 2 does not need to be additionally increased, so that the whole size of the bonding structure is indirectly reduced.

In some embodiments, second bonding element 2 is disposed at one end of first bonding element 1 along a first direction X, which intersects thickness direction Y. Wherein the second substrate 21 forms a first accommodation space 23 near one end of the first substrate 11 in the first direction X.

The second bonding member 2 is disposed on one side of the first bonding member 1 along the first direction X, and the first substrate 11 and the second substrate 21 may be formed by extending along the first direction X. Illustratively, the first direction X is perpendicular to the thickness direction Y.

In the embodiment of the present application, since the first accommodating space 23 is located at one end of the second substrate 21 in the first direction, and the first substrate 11 and the second substrate 21 are connected in the first direction X, the size of the bonding structure in the first direction X can be reduced to a certain extent by the arrangement of the first accommodating space 23.

In some embodiments, as shown in fig. 1 and 2, the first substrate 11 includes a first substrate 111, and a first wire layer 112 and a second wire layer 113 disposed on two sides of the first substrate 111 along a thickness direction Y, and the first bonding unit 12 is disposed on the first wire layer 112 and the second wire layer 113, respectively.

The first circuit layer 112 and the second circuit layer 113 are the same and are used for realizing electrical connection of different structures, so that different functions are realized, and wires can be included in the first circuit layer 112 and the second circuit layer 113. In addition, the first circuit layer 112 is located at a side of the first substrate 11 facing the light emitting surface, and the second circuit layer 113 is located at a side of the first substrate 11 facing the backlight surface. On this basis, the first bonding element 1 may be divided into two areas, i.e., a display area AA and a non-display area NA, and the first circuit layer 112 located in the display area AA may include a driving circuit, while the non-display area NA may include a driving chip 115 connected to the first circuit layer 112, where the driving chip 115 is used to control the light emitting or touch functions. The first bonding unit 12 is located at a side of the driving chip 115 along the first direction X, which is close to the second bonding member 2, and is electrically connected to the first circuit layer 112.

It should be noted that, in the embodiment of the present application, various functional film layers, such as a buffer layer, a planarization layer, etc., may be disposed between the first substrate 111 and the first circuit layer 112, and between the first substrate 111 and the second circuit layer 113.

In some embodiments, referring to fig. 3 and 4, the first substrate 11 further includes a connection portion 114 connecting the first circuit layer 112 and the second circuit layer 113, and the connection portion 114 is disposed at an end of the first substrate 111 near the second substrate 21 along the first direction X.

As can be seen from the foregoing, the first bonding units 12 are required to be disposed on both sides of the first substrate 11 along the thickness direction Y, and the first bonding units 12 disposed on both sides are connected to the first circuit layer 112 and the second circuit layer 113, respectively. This design can reduce the number of first bonding units 12 located on first and second wire layers 112 and 113, thereby reducing the size of first bonding member 1.

On this basis, in order to realize the connection between the first circuit layer 112 and the second circuit layer 113, a connection portion 114 is further added in the embodiment of the present application. Both ends of the connection portion 114 are connected to the first circuit layer 112 and the second circuit layer 113, respectively, while the connection portion 114 is located on a side of the first substrate 111 adjacent to the second substrate 21 along the first direction X, that is, the connection portion 114 is disposed on an outer peripheral side of the first substrate 111. After the first bonding element is electrically connected to the second bonding element, the connection portion 114 is located in the first accommodating space. Alternatively, a circuit protection layer 116 may be disposed on a side of the connection portion 114 away from the first substrate 111, and the circuit protection layer 116 may be disposed to avoid direct contact between the connection portion 114 and the second substrate 21, thereby improving reliability.

In some embodiments, referring to fig. 5, the first substrate 111 includes a first via 1111 formed therethrough in a thickness direction Y, and the connection portion 114 is located in the first via 1111.

The connection portion 114 is disposed in the first via 1111, and is connected to the first circuit layer 112 and the second circuit layer 113 through the first via 1111, and the first via 1111 is disposed on a side of the first bonding unit 12 away from the second substrate along the first direction X. The first via 1111 in this design may be located outside the first receiving space, and the provision of the first via 1111 may reduce the risk of damage to the connection portion 114.

In some embodiments, referring to fig. 3 and 4, the first substrate 11 further includes a circuit protection layer 116 disposed on a side of the first circuit layer 112 and the second circuit layer 113 facing away from the first substrate 111, the circuit protection layer 116 includes a second via 1161 formed therethrough in the thickness direction Y, and the first bonding unit 12 is exposed by the second via 1161.

The circuit protection layer 116 is located at a side of the first circuit layer 112 and the second circuit layer 113 away from the first substrate 111, and the circuit protection layer 116 is mainly used for protecting the first circuit layer 112 and the second circuit layer 113, so that the risk of corrosion or damage of the first circuit layer 112 and the second circuit layer 113 due to the influence of external environment is reduced, and the service lives of the first circuit layer 112 and the second circuit layer 113 are prolonged. The circuit protection layer 116 is provided with two parts for covering the first circuit layer 112 and the second circuit layer 113, respectively. It should be noted that, the two portions of the circuit protection layer 116 may be integrated or may be separately provided, which is not limited in the embodiment of the present application.

The second via hole 1161 penetrates through the circuit protection layer 116 along the thickness direction Y, and the position of the second via hole 1161 is the position corresponding to the first bonding unit 12, and the first bonding unit 12 is exposed by the second via hole 1161 and is connected with the second bonding unit 22. The first bonding unit 12 may be partially protruding from the second via 1161, or may be completely located in the second via 1161, which is not limited in this embodiment of the present application.

The circuit protection layer 116 is arranged on the first circuit layer 112 and the second circuit layer 113, so that the first circuit layer 112 and the second circuit layer 113 are protected and the service life of the circuit protection layer is prolonged. Meanwhile, the circuit protection layer 116 is provided with a second via 1161, and the first bonding unit 12 is exposed by the second via 1161 and connected with the second bonding unit 22.

In some embodiments, referring to fig. 6, the first substrate 11 further includes a first functional film layer 117 disposed on a side of the circuit protection layer 116 facing away from the first substrate 111, where the first substrate 111 protrudes from the first functional film layer 117 along the first direction X, and the first functional film layer 117 is located outside the first accommodating space 23.

The first functional film 117 is located on a side of the circuit protection layer 116 away from the first substrate 111, for performing effects such as supporting, protecting and packaging, and the number and type of the first functional film 117 are not limited in the embodiment of the present application.

The first substrate 111 is disposed to protrude from the first functional film layer 117 in the first direction X, and similarly, the first wiring layer 112 and the second wiring layer 113 on the first substrate 111 are also disposed to partially protrude from the first functional film layer 117. This kind of design makes first substrate 111, first circuit layer 112 and second circuit layer 113 can go deep into first accommodation space 23, and first functional film layer 117 is located outside first accommodation space 23 to make first functional film layer 117 realize dodging the second bonding piece, avoid first functional film layer 117 and second bonding piece direct contact, reduce first functional film layer 117 and second bonding piece and produce the risk of friction loss. Optionally, the first functional film layer 117 comprises a support film.

In some embodiments, referring to fig. 7, the second substrate includes a second substrate 211, and a third circuit layer 212 and a fourth circuit layer 213 disposed on two sides of the second substrate 211 along a thickness direction Y, wherein the third circuit layer 212 and the fourth circuit layer 213 protrude from the second substrate 211 along a first direction X, the first accommodating space 23 is formed by half-surrounding the third circuit layer 212, the fourth circuit layer 213 and the second substrate 211, and the second bonding unit 22 is disposed on the portions of the third circuit layer 212 and the fourth circuit layer 213 protruding from the second substrate 211.

The second substrate 211 is used to support the third and fourth line layers 212 and 213, and the second substrate 211 and the first substrate 111 may be the same or different in material, and the first and second substrates 111 and 211 may include polyimide, for example.

The third and fourth wiring layers 212 and 213 are disposed on both sides of the second substrate 211 along the thickness direction Y, and compared to the conventional single-sided wiring layer structure, the embodiment of the present application may provide more wirings on the third and fourth wiring layers 212 and 213. While the third wiring layer 212 and the fourth wiring layer 213 are provided protruding from the second substrate 211 in the first direction X, the portions of the third wiring layer 212 and the fourth wiring layer 213 protruding from the second substrate 211 and one side surface of the second substrate 211 in the first direction X together constitute the first accommodation space 23.

The embodiment of the present application forms the first accommodating space 23 by adjusting the lengths of the second substrate 211, the third line layer 212, and the fourth line layer 213 in the first direction X. No additional process is required to process the second bonding member to form the first receiving space 23, thereby simplifying the manufacturing process.

In some embodiments, referring to fig. 8, a side of the third line layer 212 and/or the fourth line layer 213 facing away from the second substrate 211 may be provided with other line layers.

The plurality of circuit layers may be symmetrically distributed on both sides of the second substrate 211 or asymmetrically distributed. The arrangement of multiple wiring layers may be arranged with more traces to cope with the need for higher refresh rates and higher resolutions.

In some embodiments, referring to fig. 9 and 10, the surface of the first substrate 11 in the thickness direction Y is recessed inward to form a second accommodating space 118, and the first bonding unit 12 is located in the second accommodating space 118. The inner wall 231 of the first accommodating space 23 forms a protrusion 232 protruding into the first accommodating space 23, and the second bonding unit 22 is disposed on the protrusion 232 and at least partially located in the second accommodating space 118.

The second accommodating space 118 may be disposed on the first substrate 111 or the first wiring layer 112 of the first substrate 11 and the second wiring layer 113, and the first bonding unit 12 is completely located in the second accommodating space 118. The inner wall 231 of the first accommodating space 23 is provided with a protrusion 232, the shape and size of the protrusion 232 are matched with those of the second accommodating space 118, the protrusion 232 can be inserted into the second accommodating space 118, and meanwhile, the second bonding unit 22 is arranged on the protrusion 232, so that the first bonding unit 12 and the second bonding unit 22 can be connected in the second accommodating space 118.

The embodiment of the application is provided with the second accommodating space 118 and the protruding part 232 which are matched with each other, so that the positioning between the first bonding piece and the second bonding piece can be realized, the binding force between the first bonding piece and the second bonding piece after bonding is finished can be improved, and the bonding reliability is improved.

In some alternative embodiments, the second accommodating space 118 may be disposed on the second substrate 21, and the protrusion 232 is disposed on the first substrate 11, and the specific structure may refer to the relationship between the second accommodating space 118 and the protrusion 232 in the above embodiments, which will not be described in detail in the embodiments of the present application.

In some embodiments, referring to fig. 11 and 12, the bottom wall 1181 of the second accommodating space 118 in the thickness direction Y is formed protruding in a direction away from the protruding portion 232.

The bottom wall 1181 of the second accommodating space 118 in the embodiment of the present application is not a single plane, but protrudes in a direction away from the protruding portion 232, which can further improve the bonding force between the first bonding member and the second bonding member.

Further, since the first bonding unit 12 is provided to the bottom wall 1181 of the second accommodation space 118, in the case where the first bonding unit 12 is sized, the bottom wall 1181 is provided to protrude in the direction away from the protruding portion 232, so that the width of the single first bonding unit 12 is reduced, whereby the number of arrangement of the first bonding units 12 on the first substrate 11 can be further increased.

In some embodiments, the bottom wall 1181 includes a first wall 1182 and a second wall 1183 disposed in connection, with the first wall 1182 intersecting the second wall 1183.

The bottom wall 1181 is formed by two intersecting wall surfaces, and the bottom wall 1181 forms a folded line-like structure when viewed in cross-section, so that the bonding force between the first bonding member and the second bonding member can be further improved.

In some embodiments, as shown in fig. 6, the orthographic projection of first bonding unit 12 on first substrate 11 overlaps the orthographic projection of second bonding unit 22 on first substrate 11.

In the embodiment of the present application, the first bonding unit 12 and the second bonding unit 22 are correspondingly arranged, and the orthographic projections of the two on the first substrate 11 overlap each other, so that positioning of the first bonding unit 12 and the second bonding unit 22 is facilitated in the bonding process, and bonding difficulty is reduced.

In a second aspect, referring to fig. 13, an embodiment of the present application provides a display device including a bonding structure according to any of the foregoing embodiments. Therefore, the display device provided in the embodiment of the present application has the technical effects of the bonding structure in any of the above embodiments, and the explanation of the same or corresponding structure and terms as those of the above embodiments is not repeated herein. The display device provided by the embodiment of the application can be a mobile phone or any electronic product with a display function, including but not limited to the following categories: television, notebook computer, desktop display, tablet computer, digital camera, smart bracelet, smart glasses, vehicle-mounted display, medical equipment, industrial control equipment, touch interactive terminal, etc., which are not particularly limited in this embodiment of the application.

Although the embodiments of the present application are disclosed above, the embodiments are only used for the convenience of understanding the present application, and are not intended to limit the present application. Any person skilled in the art can make any modification and variation in form and detail without departing from the spirit and scope of the present disclosure, but the scope of the present disclosure is still subject to the scope of the present disclosure as defined by the appended claims.

In the foregoing, only the specific embodiments of the present application are described, and it will be clearly understood by those skilled in the art that, for convenience and brevity of description, substitution of other connection modes described above may refer to the corresponding processes in the foregoing method embodiments, which are not repeated herein. It should be understood that the scope of the present application is not limited thereto, and any equivalent modifications or substitutions can be easily made by those skilled in the art within the technical scope of the present application, and they should be included in the scope of the present application.

Claims

1. A bonding structure, comprising:

The first bonding piece comprises a first substrate and first bonding units respectively arranged on two opposite sides of the first substrate in the thickness direction;

The second bonding piece comprises a second substrate and a second bonding unit, wherein the second substrate forms a first accommodating space, and the second bonding unit is arranged on the inner wall of the first accommodating space;

The first bonding unit is positioned in the first accommodating space and is bonded and connected with the second bonding unit;

The first substrate comprises a first substrate and a first circuit layer and a second circuit layer which are arranged on two sides of the first substrate along the thickness direction, and the first bonding unit is respectively arranged on the first circuit layer and the second circuit layer;

the first substrate further comprises a connecting part for connecting the first circuit layer and the second circuit layer, and the connecting part is positioned in the first accommodating space;

The first substrate further comprises a circuit protection layer, and the circuit protection layer is at least partially positioned between the connecting part and the second substrate.

2. The bonding structure of claim 1, wherein the second bonding member is disposed at an end of the first bonding member along a first direction, the first direction intersecting the thickness direction;

Wherein the second substrate forms the first accommodation space near one end of the first substrate in the first direction.

3. The bonding structure according to claim 2, the connection portion being disposed at an end of the first substrate that is adjacent to the second substrate in the first direction.

4. The bonding structure of claim 2, wherein the first substrate further comprises a line protection layer disposed on a side of the first line layer and the second line layer facing away from the first substrate, the line protection layer comprising a second via formed therethrough along the thickness direction, the first bonding unit being exposed by the second via.

5. The bonding structure of claim 4, wherein the first substrate further comprises a first functional film layer disposed on a side of the circuit protection layer facing away from the first substrate, the first substrate protruding along the first direction from the first functional film layer, and the first functional film layer being located outside the first accommodating space.

6. The bonding structure of claim 5, wherein the first functional film layer comprises a support film.

7. The bonding structure according to claim 2, wherein the second substrate includes a second substrate, and third and fourth wiring layers disposed on both sides of the second substrate in the thickness direction, the third and fourth wiring layers each protruding from the second substrate in the first direction, the first accommodation space is formed by half-surrounding the third, fourth, and second wiring layers, and the second bonding unit is disposed on portions of the third and fourth wiring layers protruding from the second substrate.

8. The bonding structure according to claim 1, wherein a surface of the first substrate in the thickness direction is recessed inward to form a second accommodation space, the first bonding unit being located in the second accommodation space;

the inner wall of the first accommodating space forms a protruding part protruding into the first accommodating space, and the second bonding unit is arranged on the protruding part and at least partially positioned in the second accommodating space.

9. The bonding structure according to claim 8, wherein the bottom wall of the second accommodation space in the thickness direction is formed protruding in a direction away from the protruding portion.

10. The bonding structure of claim 9, wherein the bottom wall comprises a first wall surface and a second wall surface that are disposed in connection, the first wall surface and the second wall surface intersecting.

11. A display device comprising a bonding structure according to any one of claims 1 to 10.