CN114794566A - A kind of liquid-conducting glass substrate and preparation method of heating element - Google Patents

Abstract

The application provides a preparation method of a liquid guiding glass substrate and a heating body, the liquid guiding glass substrate is used for heating and atomizing a liquid aerosol generating substrate, and the specific preparation method comprises the following steps: carrying out first laser induction and corrosion on a matrix to be processed to form a prefabricated hole of a first micropore, wherein the prefabricated hole has a prefabricated hole diameter; carrying out second laser induction and corrosion on the substrate to be processed to form second micropores with a second aperture, wherein the preformed holes of the first micropores are expanded from the preformed aperture to the first aperture in the process of carrying out second corrosion on the substrate to be processed, so that the liquid-guiding glass substrate with liquid-guiding micropores with different apertures is obtained; and forming a heating film on the first surface of the liquid guide glass substrate to finally form the heating body with different apertures. Through the process, the porosity of the heating body can be accurately controlled in batch production, the fluctuation range is small, the heating power can be accurately matched, and therefore a good atomization effect is achieved, and the process is suitable for large-batch standardized production.

Description

A kind of liquid-conducting glass substrate and preparation method of heating element

technical field

The invention relates to the technical field of atomizers, in particular to a liquid-conducting glass substrate and a method for preparing a heating element.

Background technique

A typical electronic atomization device consists of a heating element, a battery and a control circuit. The heating element is the core component of the electronic atomization device, and its characteristics determine the atomization effect and use experience of the electronic atomization device.

Existing heating elements are mainly cotton core heating elements and ceramic heating elements. The cotton core heating element is mostly a structure in which a spring-like metal heating wire is wound around a cotton rope or fiber rope; the liquid aerosol to be atomized is absorbed by the two ends of the cotton rope, and then transferred to the central metal heating wire for heating and atomization. Most of the ceramic heating elements form a heating film on the surface of the porous ceramic body, and the porous ceramic body plays the role of conducting liquid and storing liquid.

With the advancement of technology, users have higher and higher requirements for the atomization effect of electronic atomization devices. In order to meet the needs of users, it is necessary to provide a heating element with better atomization effect.

SUMMARY OF THE INVENTION

In view of the above problems, the present application provides a method for manufacturing a heating body, so as to solve how to meet the user's demand for atomization effect in the prior art.

In order to solve the above-mentioned technical problems, the technical solution provided by the present application is to provide a method for manufacturing a heating body, which includes: performing a first laser induction and corrosion on a substrate to be processed to form a prefabricated hole of the first microhole, and the prefabricated hole has a prefabricated hole. Aperture; the substrate to be processed is subjected to the second laser induction and corrosion to form second micropores, and the second micropores have a second aperture, wherein the process of performing the second etching of the substrate to be processed makes the prefabricated aperture expand to the first aperture, Further, the prefabricated pores are transformed into first micropores, thereby obtaining a liquid-conducting glass substrate having liquid-conducting micropores with different pore diameters.

Wherein, the substrate to be processed includes a first surface and a second surface opposite and parallel to the first surface, and the first microholes and the second microholes are through holes penetrating and perpendicular to the first surface and the second surface.

The step of performing the first laser induction and etching on the substrate to be processed to form the prefabricated holes of the first micropores includes: performing laser induction on the substrate to be processed according to the distribution of the micropores of the first aperture; The substrate is etched for the first time, and the etching time is the total etching time (N) required for the first aperture minus the etching time (M) required for the second aperture;

The second laser induction and corrosion are performed on the substrate to be processed, and the step of forming the second micropore includes: performing laser induction on the substrate to be processed according to the distribution of the micropores of the second aperture, and performing the second laser induction on the substrate for the first time. The second etching for the etching time (M) required for two apertures.

Wherein, the first laser induction and etching are performed on the substrate to be processed, and the step of forming the prefabricated holes of the first micropores includes: forming a prefabricated hole array including a plurality of prefabricated holes with prefabricated apertures;

Carrying out the second laser induction and etching on the substrate to be processed, and the step of forming the second microholes includes: forming a second microhole array including a plurality of second microholes with a second aperture and a plurality of first apertures with a first aperture A first microwell array of microwells.

The ratio of the thickness of the liquid-conducting glass substrate to the diameter of the liquid-conducting micropores is 20:1-3:1.

The ratio of the thickness of the liquid-conducting glass substrate to the diameter of the liquid-conducting micropores is 15:1-5:1.

Wherein, the ratio of the hole center distance between two adjacent liquid-conducting micro-holes to the diameter of the liquid-conducting micro-holes is 3:1-1.5:1.

Wherein, the substrate to be processed is glass.

The substrate to be processed is glass, and the glass is one or more of borosilicate glass, quartz glass and photosensitive lithium aluminosilicate glass.

In order to solve the above technical problems, the second technical solution provided by the present application is to provide a method for preparing a heating element, the preparation method comprising: preparing a liquid-conducting glass substrate, and the preparation method of the liquid-conducting glass substrate is the preparation of any of the above method; forming a heating film on the first surface of a liquid-conducting glass substrate.

Wherein, the step of forming a heating film on the first surface of the liquid-conducting glass substrate includes: forming a heating film with a resistance of 0.5 ohm-2 ohm and a thickness of 200 nanometers to 5 microns by physical vapor deposition or chemical vapor deposition; For aluminum, copper, silver, gold or alloys thereof.

Wherein, after the step of forming a heating film on the first surface of the liquid-conducting glass substrate, it includes: forming a protective film with a thickness of 100 nanometers to 1000 nanometers on the surface of the heating film far from the liquid-conducting glass substrate by physical vapor deposition or chemical vapor deposition; The material of the membrane is one or any combination of stainless steel, nickel-chromium-iron alloy, and nickel-based corrosion-resistant alloy.

Wherein, the step of forming a heating film on the first surface of the liquid-conducting glass substrate includes: forming a heating film with a resistance of 0.5 ohm-2 ohm and a thickness of 5 microns-100 microns by printing or chemical vapor deposition; the material of the heating film is nickel One of chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum and titanium.

Wherein, after the step of forming a heating film on the first surface of the liquid-conducting glass substrate, it includes: forming a protective film with a thickness of 5 microns to 20 microns on the surface of the heating film away from the liquid-conducting glass substrate by printing or chemical vapor deposition; Material is stainless steel.

Beneficial effects of the present application: Different from the prior art, the heating element in the present application includes a liquid-conducting glass substrate and a heating film; the specific preparation method includes: performing the first laser induction and corrosion on the substrate to be processed to form the first micropores. Prefabricated holes, the prefabricated holes have prefabricated apertures; the substrate to be processed is subjected to a second laser induction and etching to form second micropores, and the second micropores have a second aperture, wherein the second etching process of the substrate to be processed makes the prefabricated The pore size is expanded to the first pore size, and the prefabricated holes are transformed into first micropores, thereby obtaining a liquid-conducting glass substrate with liquid-conducting micropores of different pore sizes; a heating film is formed on the first surface of the liquid-conducting glass substrate. Through the above process, in mass production, the porosity of the heating element can be precisely controlled, the fluctuation range is small, and the heating power can be accurately matched, thereby achieving a better atomization effect, which is suitable for mass standardized production. In addition, due to the second etching process of the substrate to be processed, the first micropores are enlarged from prefabricated apertures to first apertures, compared with preparing second micropores with second apertures and first micropores with first apertures The method is simple in process and low in cost.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

Fig. 1 is the structural representation of the electronic atomization device provided by the application;

Fig. 2 is the structural representation of the atomization assembly provided by the application;

Fig. 3 is the structural representation of the heating element provided by this application;

Fig. 4 is the structural representation of the dense matrix in the heating element provided by Fig. 3;

5a is a schematic structural diagram of the first embodiment of the micropores in the dense matrix provided in FIG. 3;

5b is a schematic structural diagram of the second embodiment of the micropores in the dense matrix provided in FIG. 3;

5c is a schematic structural diagram of a third embodiment of micropores in the dense matrix provided in FIG. 3;

5d is a schematic structural diagram of the fourth embodiment of the micropores in the dense matrix provided in FIG. 3;

6a is a schematic top view of the structure of the first embodiment of the dense substrate provided in FIG. 3;

Fig. 6b is a top-view structural schematic diagram of the second embodiment of the dense matrix provided in Fig. 3;

7 is a schematic diagram of a manufacturing process flow of the dense matrix provided in FIG. 6b;

Fig. 8a is a top-view structural schematic diagram of step S1 in Fig. 7;

Fig. 8b is a side view structural schematic diagram of step S1 in Fig. 7;

Fig. 8c is a top-view structural schematic diagram of step S2 in Fig. 7;

FIG. 8d is a schematic side view of the structure of step S2 in FIG. 7;

9a is a schematic top view of the structure of the heating element provided by the present application when the heating film is a thick film;

Fig. 9b is the top-view structure schematic diagram of the heating element provided by Fig. 3;

10 is a schematic structural diagram of the heating body provided by the application including a protective film and the heating film being a thin film;

11 is a schematic top-view structural diagram of the heating element provided by the present application including a protective film and the heating film is a thick film;

12 is a schematic structural diagram of the atomization assembly provided by the present application including a loose matrix;

13 is a SEM image of an embodiment of the heating film provided by the present application;

14 is a comparison diagram of the amount of atomized aerosol of the heating element of the present application and the conventional porous ceramic heating element;

Figure 15 is a failure diagram of the heating film in the heating element provided by the application;

Figure 16 is a SEM image and an EDS image of the heating film failure map provided in Figure 15;

Figure 17 is a graph showing the relationship between the lifetime of the heating film and the thickness of the protective film in the heating element provided by the application;

18 is a schematic diagram of a heating element wet burning experiment provided by the application;

FIG. 19 is a graph showing the relationship between the thickness of the dense matrix/micropore diameter and the amount of atomization of the heating element provided by the present application;

Figure 20 is a graph showing the relationship between the atomization temperature and the heating power of the conventional porous ceramic heating element;

Figure 21 is a graph showing the relationship between the atomization temperature and the heating power of the heating element provided by the application;

FIG. 22 is a graph showing the relationship between the atomization temperature of the heating element provided by the present application and the suction time.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

The terms "first", "second" and "third" in this application are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first", "second", "third" may expressly or implicitly include at least one of that feature. In the description of the present application, "a plurality of" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined. All directional indications (such as up, down, left, right, front, rear...) in the embodiments of the present application are only used to explain the relative positional relationship between components under a certain posture (as shown in the accompanying drawings). , motion situation, etc., if the specific posture changes, the directional indication also changes accordingly. Furthermore, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally also includes For other steps or units inherent to these processes, methods, products or devices.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor a separate or alternative embodiment that is mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

Please refer to FIG. 1 , which is a schematic structural diagram of an electronic atomization device provided by the present application.

Electronic atomization devices can be used for atomization of liquid substrates. The electronic atomization device includes an atomization assembly 1 and a power supply assembly 2 that are connected to each other. The atomization assembly 1 is used to store the liquid aerosol generation substrate and atomize the aerosol generation substrate to form an aerosol that can be inhaled by the user. The assembly 1 can be used in different fields, for example, medical treatment, electronic aerosolization, and the like. The power supply assembly 2 includes a battery (not shown in the figure), an airflow sensor (not shown in the figure), a controller (not shown in the figure), etc.; the battery is used to supply power to the atomizing assembly 1, so that the atomizing assembly 1 can be atomized to be atomized The matrix forms an aerosol; the airflow sensor is used to detect the airflow change in the electronic atomization device, and the controller activates the electronic atomization device according to the airflow change detected by the airflow sensor. The atomizing assembly 1 and the power supply assembly 2 may be integrally provided, or may be detachably connected, and are designed according to specific needs.

Please refer to FIG. 2 , which is a schematic structural diagram of the atomizing assembly provided by the present application.

The atomization assembly 1 includes a liquid storage chamber 10 , a heating body 11 , a suction nozzle 12 , and a mist outlet channel 13 . The liquid storage chamber 10 is used to store the liquid aerosol generation substrate, and the heating element 11 is used to atomize the aerosol generation substrate in the liquid storage chamber 10 . In this embodiment, a lower liquid channel 14 is formed between the liquid storage chamber 10 and the heating element 11 to guide the liquid in the liquid storage chamber 10 to the heating element 11; in another embodiment, the heating element 11 is also It can be directly exposed to the liquid storage chamber 10 to atomize the liquid in the liquid storage chamber 10 . The aerosol channel 13 atomized by the heating body 11 reaches the suction nozzle 12 and is sucked by the user. Wherein, the heating element 11 is electrically connected to the power supply assembly 2 to generate a matrix by atomizing the aerosol.

At present, the commonly used heating elements 11 include cotton core heating elements and porous ceramic heating elements. The structure of the cotton core heating element is mostly a spring-shaped metal heating wire wrapped around a cotton rope or fiber rope; the spring-shaped metal heating wire needs to play a structural support role in the structure of the cotton core heating element. In order to achieve sufficient strength, metal heating The diameter of the wire is usually hundreds of microns; the liquid aerosol-generating matrix to be atomized is absorbed by both ends of the cotton rope or fiber rope, and then transferred to the central metal heating wire to be heated and atomized. A structure of the porous ceramic heating body is that a spring-shaped metal heating wire is embedded in a cylindrical porous ceramic body; the porous ceramic body plays the role of conducting liquid and storing liquid. Another structure of the porous ceramic heating element is to print a thick metal film slurry on the porous ceramic body, and then sinter at high temperature to form metal wires on the porous ceramic body; because the pore size distribution of the porous ceramic surface varies from 1 micron to 100 microns , resulting in the roughness of the porous ceramic surface. In order to form a continuous and stable metal film wire, the thickness of the metal film wire usually exceeds 100 microns.

Porous ceramic heating elements are more and more popular in the market due to their high temperature stability and relative safety. The common structure of the porous ceramic heating element is to print metal thick film wires on the surface of the porous ceramic. The materials of the metal thick-film wires of the existing electronic atomization device are usually selected from nickel-chromium alloys, nickel-chromium-iron alloys, and iron-chromium-aluminum alloys with high resistivity. When the metal thick film wire repeatedly heats the liquid aerosol to form the matrix, heavy metal ions such as nickel and chromium are often detected in the aerosol, and the accumulation of heavy metal ions will damage human organs such as lung, liver, kidney, etc. Users bring huge security risks.

In addition, for the above-mentioned structure of the cotton core heating element and the porous ceramic heating element, the metal heating wire or the metal thick film wire is heated when energized, and the heat is conducted to the liquid in the cotton rope or the porous ceramic body, so that the liquid is heated and atomized. Since the metal heating wire or metal thick-film wire is a dense entity, the metal heating wire or metal thick-film wire needs to be preferentially heated when electrified, and only the liquid near the metal heating wire or metal thick-film wire is heated by the metal heating wire or metal thick-film wire. Direct heating, the liquid in the distance needs to be heated and atomized by the heat conducted by the cotton rope or the porous ceramic body. The energy provided by the battery needs to heat the metal heating wire or the metal thick film wire, and also needs to heat the entire liquid transmission medium. This heating method has the disadvantage of low atomization efficiency.

The power of the existing electronic atomization device does not exceed 10 watts, and the power is usually 6 watts-8.5 watts, and the voltage range of the battery used by the existing electronic atomizing device is 2.5 volts-4.4 volts. For closed electronic atomization devices (electronic atomization devices that do not require the user to inject the substrate to be atomized), the voltage range of the battery used is 3V-4.4V.

The inventors of the present application have found that the liquid-conducting substrate made of dense materials such as glass has a smooth surface, so physical vapor deposition or chemical vapor deposition can be used to deposit continuous and stable liquid-conducting substrates on the surface of the liquid-conducting substrate. Metal heating film, the thickness of the metal heating film is in the range of a few micrometers or nanometers. In this way, not only the heating body 11 can be miniaturized, but also the heating film material can be saved.

However, the inventors of the present application have found that, compared with the existing cotton core heating element and porous ceramic heating element, the liquid supply channel of the liquid-conducting matrix made of dense materials such as glass is shorter and the liquid supply speed is faster, but the risk of liquid leakage Liquid is bigger. Therefore, using a liquid-conducting substrate made of a dense material such as glass to prepare the heating body 11 often requires a higher sealing design for the atomizing assembly 1, which increases the difficulty and cost of preparing the atomizing assembly 1, and even in A liquid storage tank and other structures are designed in the atomization assembly 1 to collect the leakage liquid to prevent the leakage liquid from flowing out of the atomization assembly 1, but the utilization rate of the aerosol generation substrate is relatively low.

Further, the inventors of the present application have found that due to the high resistivity of existing nickel-chromium alloys, nickel-chromium-iron alloys, iron-chromium-aluminum alloys and other materials, under the same shape, the thickness of the heating film is reduced to a few microns or less. , the resistance of the heating film will increase significantly. For example, if the thickness of the heating film is reduced from 100 microns to 10 microns, the resistance is increased by 10 times; if the power of the heating element 11 is to remain unchanged, the voltage of the battery needs to be increased, which will lead to The cost of the electronic atomization device increases; moreover, such a heating body 11 cannot match the voltage of the battery in the power supply assembly 2 of the current electronic atomization device, which leads to inconvenience for consumers to use.

Based on the problems of the existing heating elements, the present application provides a heating element 11 to solve the above problems. The structure of the heating element 11 of the present application will be described in detail below.

Please refer to FIG. 3 and FIG. 4 , FIG. 3 is a schematic structural diagram of a heating body provided by the present application, and FIG. 4 is a structural schematic diagram of a dense matrix in the heating body provided in FIG. 3 .

The heat generating body 11 includes a dense base body 111 and a heat generating film 112 . The dense matrix 111 includes a first surface and a second surface 1112 opposite to the first surface 1111; the dense matrix 111 is provided with a plurality of micropores 113, the micropores 113 are through holes, and the micropores 113 are used for conducting the aerosol-generating matrix. Lead to the first surface 1111 . The pores 113 have capillary action. The heating film 112 is formed on the first surface 1111; the resistance of the heating film 112 at normal temperature is 0.5 ohm-2 ohm, wherein the normal temperature is 25°C. It can be understood that the dense base body 111 plays a structural support role, and the heating film 112 in the heating body 11 is electrically connected to the power supply assembly 2 . When the power of the electronic atomizer device is 6W-8.5W and the voltage range of the battery is 2.5V-4.4V, in order to achieve the working resistance of the battery, the resistance range of the heating film 112 of the heating element 11 at room temperature is 0.5 ohm- 2 ohms.

In the present application, by arranging a plurality of micropores 113 with capillary force on the dense substrate 111, the size of the porosity of the heating body 11 can be precisely controlled, and the consistency of the product is improved. That is to say, in mass production, the porosity of the dense matrix 111 in the heating element 11 is basically the same, and the thickness of the heating film 112 formed on the dense matrix 111 is uniform, so that the atomization effect of the electronic atomizers from the same batch is consistent.

The aerosol-generating matrix in the liquid storage chamber 10 reaches the dense matrix 111 of the heating element 11 through the lower liquid channel 14 , and the aerosol-generating matrix is guided to the first part of the dense matrix 111 by the capillary force of the micropores 113 on the dense matrix 111 . On the surface 1111 , the aerosol-generating substrate is atomized by the heating film 112 ; that is, the micropores 113 communicate with the liquid storage chamber 10 through the lower liquid channel 14 . The material of the dense matrix 111 may be glass or dense ceramic; when the dense matrix 111 is glass, it may be one of ordinary glass, quartz glass, borosilicate glass or photosensitive lithium aluminosilicate glass.

Compared with the existing cotton core heating element and porous ceramic heating element, the heating element 11 with microporous sheet structure provided by the present application has shorter liquid supply channels, faster liquid supply speed, but greater liquid leakage risk. . Therefore, the inventors of the present application studied the influence of the ratio of the thickness of the dense matrix 111 to the pore size of the micropores 113 on the liquid conduction of the heating element 11, and found that increasing the thickness of the dense matrix 111 and reducing the pore size of the micropores 113 can reduce liquid leakage Risks but also reduce the liquid supply rate. Reducing the thickness of the dense matrix 111 and increasing the pore size of the micropores 113 can increase the liquid supply rate but increase the risk of liquid leakage. The two are contradictory. To this end, the present application designs the thickness of the dense matrix 111, the diameter of the micropores 113, and the ratio of the thickness of the dense matrix 111 to the diameter of the micropores 113, so that the heating element 11 can operate at a power of 6 watts-8.5 watts and a voltage of 2.5 volts- When working at 4.4 volts, it can not only achieve sufficient liquid supply, but also prevent liquid leakage. The thickness of the dense substrate 111 is the distance between the first surface 1111 and the second surface 1112 .

In addition, the inventors of the present application studied the ratio of the hole center distance of the adjacent micro holes 113 to the diameter of the micro holes 113, and found that if the ratio of the hole center distance of the adjacent micro holes 113 to the diameter of the micro holes 113 is too large, the density of the dense matrix 111 If the strength is high, it is easy to process, but the porosity is too small, which will easily lead to insufficient liquid supply; if the ratio of the hole center distance of the adjacent micropores 113 to the diameter of the micropores 113 is too small, the porosity is large, and the liquid supply is sufficient. However, the strength of the dense matrix 111 is relatively small and it is not easy to process; for this reason, the present application also designs the ratio of the distance between the centers of the adjacent micropores 113 to the diameter of the micropores 113, and improves the liquid supply capacity as much as possible on the premise of satisfying the liquid supply capacity. The strength of the dense matrix 111 is improved.

In the following, the material of the dense matrix 111 is glass.

Specifically, both the first surface 1111 and the second surface 1112 include smooth surfaces, and the first surface 1111 is flat. That is to say, the first surface 1111 of the dense substrate 111 is a smooth surface and is flat, and the heating film 112 is formed on the first surface 1111. membrane.

In one embodiment, the first plane 1111 and the second surface 1112 of the dense matrix 111 are both smooth surfaces, and both are planes, and the first surface 1111 and the second surface 1112 of the dense matrix 111 are arranged in parallel; A surface 1111 and a second surface 1112, the axis of the micropore 113 is perpendicular to the first surface 1111 and the second surface 1112, and the cross section of the micropore 113 is circular; at this time, the thickness of the dense matrix 111 is equal to the length of the micropore 113 . It can be understood that the second surface 1112 is parallel to the first surface 1111 , and the microholes 113 penetrate from the first surface 1111 to the second surface 1112 , so that the production process of the dense substrate 111 is simple and the cost is reduced. The thickness of the dense matrix 111 is the distance between the first surface 1111 and the second surface 1112 . The micropores 113 can be straight through holes with uniform pore diameters, or can be straight through holes with non-uniform pore diameters, as long as the variation range of the pore diameters is within 50%. For example, due to the limitation of the manufacturing process, the micro-holes 113 opened on the glass by laser induction and etching usually have large apertures at both ends and small apertures in the middle. Therefore, it is only necessary to ensure that the diameter of the middle portion of the micropore 113 is not less than half of the diameter of the ports at both ends.

In another embodiment, the first surface 1111 of the dense base 111 is a smooth surface and is flat, so as to facilitate the deposition and formation of a metal material with a small thickness. The second surface 1112 of the dense substrate 111 is a smooth surface, and the second surface 1112 can be non-planar, for example, a sloped surface, an arc surface, a sawtooth surface, etc. The second surface 1112 can be designed according to specific needs, only the micropores 113 It is sufficient to penetrate the first surface 1111 and the second surface 1112 .

In the following, when the material of the dense base 111 is glass, and the first surface 1111 and the second surface 1112 of the dense base 111 are both smooth planes and are arranged in parallel, the difference between the thickness of the dense base 111 , the thickness of the dense base 111 and the diameter of the micropores 113 The ratio, the ratio of the hole center distance between two adjacent micro holes 113 and the diameter of the micro holes 113 will be introduced.

The thickness of the dense matrix 111 is 0.1 mm to 1 mm. When the thickness of the dense matrix 111 is greater than 1 mm, the liquid supply demand cannot be met, resulting in a decrease in the amount of aerosol, and the resulting heat loss is high, and the cost of setting the micropores 113 is high; when the thickness of the dense matrix 111 is less than 0.1 mm, it cannot be guaranteed dense The strength of the base body 111 is not conducive to improving the performance of the electronic atomization device. Preferably, the thickness of the dense matrix 111 is 0.2 mm to 0.5 mm. The diameter of the micropores 113 on the dense substrate 111 is 1 micrometer to 100 micrometers. When the pore size of the micropores 113 is less than 1 micron, the liquid supply requirement cannot be met, resulting in a decrease in the amount of aerosol; when the pore size of the micropores 113 is greater than 100 microns, the aerosol-generating matrix easily flows out from the micropores 113 to the first surface 1111, causing leakage liquid, resulting in a decrease in atomization efficiency. Preferably, the diameter of the micropores 113 is 20-50 micrometers. It can be understood that the thickness of the dense matrix 111 and the diameter of the micropores 113 are selected according to actual needs.

The ratio of the thickness of the dense matrix 111 to the diameter of the micropores 113 is 20:1-3:1; preferably, the ratio of the thickness of the dense matrix 111 to the diameter of the micropores 113 is 15:1-5:1 (refer to FIG. When the ratio of the thickness of the substrate 111 to the diameter of the micropores 113 is 15:1-5:1, it has a better atomization effect). When the ratio of the thickness of the dense matrix 111 to the pore size of the micropores 113 is greater than 20:1, the aerosol-generating matrix supplied by the capillary force of the micropores 113 is difficult to meet the atomization demand of the heating element 11, which not only easily leads to dry burning , and the amount of aerosol generated by a single atomization decreases; when the ratio of the thickness of the dense matrix 111 to the pore size of the micropores 113 is less than 3:1, the aerosol generation matrix easily flows out from the micropores 113 to the first surface 1111, The aerosol-generating substrate is wasted, resulting in a decrease in atomization efficiency, which in turn reduces the total aerosol volume.

The ratio of the hole center distance between two adjacent micropores 113 to the diameter of the micropores 113 is 3:1-1.5:1, so that the micropores 113 on the dense matrix 111 can meet the liquid supply capacity as far as possible. It is possible to improve the strength of the dense matrix 111; preferably, the ratio of the distance between the centers of the holes between two adjacent micro holes 113 to the diameter of the micro holes 113 is 3:1-2:1; more preferably, the two adjacent micro holes 113 The ratio of the center-to-center distance of the pores to the diameter of the micropores 113 is 3:1-2.5:1.

In a specific embodiment, preferably, the ratio of the thickness of the dense matrix 111 to the diameter of the micropores 113 is 15:1-5:1, and the distance between the centers of the holes between two adjacent micropores 113 and the diameter of the micropores 113 The ratio is 3:1-2.5:1.

Please refer to FIGS. 5a , 5b , 5c and 5d , FIG. 5a is a schematic structural diagram of the first embodiment of the micropores in the dense matrix provided in FIG. 3 , and FIG. 5b is the second embodiment of the micropores in the dense matrix provided by FIG. 3 FIG. 5c is a schematic structural diagram of the third embodiment of the micropores in the dense matrix provided in FIG. 3 , and FIG. 5d is a schematic structural diagram of the fourth embodiment of the micropores in the dense matrix provided by FIG. 3 .

In other embodiments, the micropores 113 may also have other structures, please refer to FIG. 5a, FIG. 5b, FIG. 5c and FIG. 5d. The extending direction of the micropores 113 is perpendicular to the thickness direction of the dense matrix 111 . Specifically, the longitudinal section of the micro-hole 113 may be rectangular (as shown in FIG. 5a ), trapezoid (as shown in FIG. 5b ), dumbbell-shaped with large ends and small in the middle (as shown in FIG. 5c ). In another embodiment, the extension direction of the micropores 113 forms an angle with the thickness direction of the dense substrate 111, and the angle is in the range of 80 degrees to 90 degrees; when the longitudinal section of the micropores 113 is rectangular, the structure is as shown in FIG. 5d . Show. Since the micropores 113 are arranged in a regular geometric shape, the volume of the micropores 113 in the heating body 11 can be calculated, so that the porosity of the entire heating body 11 can also be calculated, so that the pores of the heating body 11 of similar products can be calculated. The consistency of the rate can be well guaranteed.

Please refer to FIGS. 6 a and 6 b , FIG. 6 a is a schematic top view of the first embodiment of the dense matrix provided in FIG. 3 , and FIG. 6 b is a top view of the structure of the second embodiment of the dense matrix provided in FIG. 3 .

Specifically, the dense substrate 111 has a regular shape, such as a rectangular plate shape, a circular plate shape, and the like. In this embodiment, the plurality of micropores 113 disposed on the dense substrate 111 are arranged in an array; that is, the plurality of micropores 113 disposed on the dense substrate 111 are regularly arranged, and the plurality of micropores 113 are arranged in a regular pattern. The hole center distances between adjacent micro holes 113 are the same. Optionally, the plurality of microwells 113 are arranged in a rectangular array; or the plurality of microwells 113 are arranged in a circular array; or the plurality of microwells 113 are arranged in a hexagonal array. The pore diameters of the plurality of micropores 113 may be the same or different, and may be designed as required.

In one embodiment, the dense base 111 is in the shape of a rectangular plate, and the plurality of micropores 113 disposed on the dense base 111 have the same shape and diameter and are arranged in a rectangular array, as shown in FIG. 6a .

In another embodiment, the dense matrix 111 is in the shape of a rectangular plate, and the first surface 1111 of the dense matrix 111 includes a first aperture microwell array area 1113 and a second aperture microwell array area 1114, and the second aperture microwell array area 1114 The diameter of the micropores 113 is different from that of the micropores 113 of the first aperture microwell array area 1113, and the shape of the micropores 113 of the second aperture microwell array area 1114 is different from that of the first aperture microwell array area 1113. The microwells 113 in the second aperture microwell array area 1114 and the microwells 113 in the first aperture microwell array area 1113 are arranged in a rectangular array; the first aperture microwell array area 1113 is located in the second aperture microwell array On both sides of the area 1114, the diameter of the microholes 113 in the second aperture microwell array area 1114 is smaller than the diameter of the microholes 113 in the first aperture microwell array area 1113, as shown in FIG. 6b. It can be understood that the second aperture microwell array area 1114 may also be located on both sides of the first aperture microwell array area 1113, and the aperture of the microwells 113 in the second aperture microwell array area 1114 is smaller than that of the first aperture microwell array. The apertures of the microholes 113 in the area 1113 , the first aperture microhole array area 1113 , the second aperture microhole array area 1114 and the microholes 113 disposed therein are designed as required.

In other embodiments, the axes of the micro-holes 113 are not perpendicular to the first surface 1111 and the second surface 1112 . One end opening of the micropore 113 is located on the first surface 1111 , and the other end opening of the micropore 113 may be located on the third surface (not shown) connecting the first surface 1111 and the second surface 1112 ; or, the other end of the micropore 113 The opening is located on the second surface 1112 , and the micropores 113 extend in a curve; the structure of the micropores 113 can be designed as required, and the aerosol-generating substrate can be guided to the first surface 1111 by its capillary force.

Please refer to FIG. 7. FIG. 7 is a schematic diagram of a manufacturing process flow of the dense substrate provided in FIG. 6b. Fig. 8a is a schematic top view structure of step S1 in Fig. 7; Fig. 8b is a side view structure view of step S1 in Fig. 7; Fig. 8c is a top view structure diagram of step S2 in Fig. 7; Fig. 8d is a side view of step S2 in Fig. 7 View the schematic diagram of the structure.

In one embodiment, the dense substrate is glass, which is called a liquid-conducting glass substrate, and the manufacturing method of the liquid-conducting glass substrate includes the following steps:

Step S1: the substrate to be processed is subjected to the first laser induction and corrosion to form prefabricated holes of the first micro-holes.

Specifically, referring to FIGS. 8a-8b, a substrate 111a to be processed is provided, the substrate 111a to be processed includes a first surface 1111a and a second surface 1111b opposite to the first surface 1111a, and the substrate 111a to be processed is subjected to the first laser induction, which will be performed The substrate 111a to be processed after the first laser induction is immersed in the etching solution to form prefabricated holes of the first micro-holes 113a. The prefabricated holes of the first micropores 113a have prefabricated diameters, and the prefabricated holes penetrate through the first surface 1111a and the second surface 1111b.

After step S1, a first microhole array 113c including a plurality of prefabricated holes with prefabricated apertures is formed on the substrate 111a to be processed.

Step S2: performing the second laser induction and etching on the substrate to be processed to form second micro-holes, and the second micro-holes have a second aperture, wherein the process of performing the second etching on the substrate to be processed makes the prefabricated holes of the first micro-holes The prefabricated aperture is enlarged to the first aperture.

Specifically, referring to FIGS. 8c-8d, the substrate 111a to be processed is subjected to a second laser induction according to the second aperture, and the substrate 111a to be processed after the second laser induction is immersed in an etching solution to form second micropores 113b. The two micro-holes 113b have a second aperture, wherein the second etching process of the substrate 111a to be processed causes the pre-fabricated aperture of the first micro-hole 113a to expand from the pre-fabricated aperture to the first aperture, and the first micro-hole 113a penetrates the first surface 1111a and the second surface 1111b, thereby obtaining a liquid-conducting glass substrate 116 having liquid-conducting micropores 113 with different pore sizes.

After step S2, a second microwell array 113d comprising a plurality of second microwells 113b having a second aperture and a first microwell array 113d comprising a plurality of first microwells 113a having a first aperture are formed on the liquid-conducting glass substrate 116 Hole array 113c.

In a specific embodiment, in order to control the pore size of the first micropores 113a and the second micropores 113b, the manufacturing method of the dense matrix includes:

S11: The substrate to be processed is subjected to laser induction according to the distribution of the first micropores of the third aperture.

8a-8b, the material of the substrate 111a to be processed is glass, the glass can be one or more of borosilicate glass, quartz glass and photosensitive lithium aluminosilicate glass, the substrate 111a to be processed includes a first surface 1111a and a On the second surface 1111b opposite the first surface 1111a, the substrate 111a to be processed is first irradiated with an infrared picosecond or femtosecond laser with a frequency of 100kHz-200kHz and a pulse width of less than 10 picoseconds according to the first aperture. In this step, the material of the substrate to be processed 111a within the first aperture range is induced by the laser and can be removed in the subsequent etching process.

S12: perform the first etching on the substrate subjected to the first laser induction, and the etching time is the total etching time (N) required for the first micropores of the first aperture minus the etching time required for the second micropores of the second aperture (M).

Specifically, the substrate 111a to be processed after the first laser induction is immersed in a corrosion solution with a temperature of 30° C. to 60° C. The corrosion solution can be selected from an acidic corrosion solution, a hydrofluoric acid solution, or an alkaline corrosion solution, a sodium hydroxide solution. The corrosion rate of the laser-modified portion is several tens of times higher than that of the unmodified portion, so prefabricated holes with prefabricated apertures are formed on the substrate 111a to be processed, and the prefabricated holes penetrate the first surface 1111a and the second surface 1111b.

Specifically, before preparation, it is determined through experiments that it takes N minutes to etch out the first micropores 113a of the first aperture, and it is determined that it takes M minutes to etch the second micropores 113b of the second aperture. Then, in this step, for the first time The etching time is N-M minutes. That is to say, N is the first etching time for forming the first micro-holes 113a with the first aperture, M is the second etching time for forming the second micro-holes 113b The time difference between the first etching time of the first micro-holes 113a and the second etching time of forming the second micro-holes 113b having the second pore diameter.

In other specific embodiments, the first etching of the substrate 111a to be processed adopts etching methods such as spraying, stirring, and air blasting, so that the etching solution can be fully exchanged and flowed, and the sidewalls of the etched first micro-holes 113a are more uniform and smooth. . Further, preheating the temperature of the etching solution to between 30°C and 60°C can speed up the corrosion rate.

In a specific embodiment, after steps S11 and S12, a first microhole array 113c including a plurality of prefabricated holes with prefabricated apertures is formed on the substrate 111a to be processed.

S13: The substrate to be processed is subjected to laser induction according to the second aperture.

Referring to Figs. 8c-8d, the substrate 111a to be processed after the first laser induction and corrosion is irradiated for the second time using an infrared picosecond or femtosecond laser with a frequency of 100kHz-200kHz and a pulse width of less than 10 picoseconds according to the second aperture. . The area of the second shot is different from the area of the first shot. In this step, the material of the substrate to be processed 111a within the second aperture range is induced by the laser and can be removed in the subsequent etching process.

S14: performing a second etching on the substrate subjected to the second laser induction for the etching time (M) required for the second micropore of the second aperture.

In this step, the substrate 111a to be processed after the second laser induction is immersed in the etching solution, and after the immersion time of M minutes, a second micropore 113b with a second aperture is formed on the substrate 111a to be processed, wherein the substrate to be processed is The second etching process of the substrate 111a causes the prefabricated holes to be enlarged from the prefabricated apertures to the first apertures to form the first micropores 113a. Specifically, the thickness of the substrate 111a to be processed is reduced to a certain extent after being immersed in the etching solution twice, and the first micropores 113a and the second micropores 113b penetrate the first surface 1111a and the second surface 1111b, so that different pore diameters are obtained. The liquid-conducting glass substrate 116 of the liquid-conducting micro-holes 113 . It can be understood that when the liquid-conducting glass base 116 is made of borosilicate glass, quartz glass, or photosensitive lithium aluminosilicate glass or other glass or dense ceramic, it is the dense base 111 .

In a specific embodiment, after steps S13 and S14, a second microwell array 113d comprising a plurality of second microwells 113b having a second aperture and a plurality of The first microwell array 113c of the first microwell 113a.

Since the dense matrix 111 in the heating element 11 is a dense material, it can play the role of structural support. Compared with the spring-shaped metal heating wire of the existing cotton core heating element and the metal thick film wire of the porous ceramic heating element, there is no requirement for the strength and thickness of the heating film 112 in the heating element 11, and the heating film 112 can be made of low resistance. rate of metallic materials.

In one embodiment, the heating film 112 formed on the first surface 1111 of the dense substrate 111 is a thin film, and the thickness of the heating film 112 ranges from 200 nanometers to 5 microns, that is, the thickness of the heating film 112 is relatively thin; The thickness of the heating film 112 is in the range of 200 nanometers to 1 micrometer; more preferably, the thickness of the heating film 112 is in the range of 200 nanometers to 500 nanometers. When the heating film 112 is a thin film, the micropores 113 penetrate through the heating film 112 . Further, the heating film 112 is also formed on the inner surface of the micro-hole 113; preferably, the heating film 112 is also formed on the entire inner surface of the micro-hole 113 (the structure is shown in FIG. 3). A heating film 112 is disposed on the inner surface of the micro-holes 113, so that the aerosol-generating substrate can be atomized in the micro-holes 113, which is beneficial to improve the atomization effect.

The thinner the heating film 112 is, the smaller the influence on the pore size of the micropores 113 is, thereby achieving a better atomization effect; and the thinner the heating film 112 is, the less heat absorbed by the heating film 112 itself, the lower the electric heat loss, and the higher the temperature of the heating body 11. high speed. On the basis that the resistance of the heating film 112 at room temperature is 0.5 ohm-2 ohm, the present application uses a metal material with low conductivity to form a thinner metal film and minimize the influence on the pore size of the micropores 113 . Optionally, the resistivity of the heating film 112 is not greater than 0.06*10 ⁻⁶ Ω·m. The low-conductivity metal materials of the heating film 112 include silver and its alloys, copper and its alloys, aluminum and its alloys, gold and its alloys; optionally, the materials of the heating film 112 may include aluminum and its alloys, gold and its alloys. alloy. When heated by electricity, the heating film 112 can heat up rapidly, and directly heat the aerosol-generating matrix in the micropores 113 to achieve efficient atomization.

Further, the inventors of the present application have found that the liquid aerosol generation matrix contains various flavors and fragrances and additives, and contains elements such as sulfur, phosphorus, and chlorine. When the heating film 122 is electrically heated, silver and copper are prone to corrosion failure. Gold has very strong chemical inertness, and a dense oxide film will be formed on the surface of aluminum. These two materials are very stable in the liquid aerosol generating matrix, and are preferably used as the material of the heating film 122 .

The heating film 112 can be formed on the dense substrate 111 by physical vapor deposition (eg, magnetron sputtering, vacuum evaporation, ion plating) or chemical vapor deposition (ion-assisted chemical deposition, laser-assisted chemical deposition, metal organic compound deposition) of the first surface 1111. It can be understood that the formation process of the heating film 112 is such that it does not cover the micropores 113 , that is, the micropores 113 penetrate the heating film 112 . When the heating film 112 is formed on the first surface 1111 of the dense substrate 111 by physical vapor deposition or chemical vapor deposition, the heating film 112 is also formed on the inner surface of the micropores 113 . When the heating film 112 is formed on the first surface 1111 of the dense substrate 111 by magnetron sputtering, the metal atoms are perpendicular to the first surface 1111 and parallel to the inner surface of the micro-hole 113 during magnetron sputtering, and the metal atoms are easier to It is deposited on the first surface 1111; it is assumed that the thickness of the heating film 112 formed by the deposition of metal atoms on the first surface 1111 is 1 micrometer. At this time, the thickness of the metal atoms deposited on the inner surface of the micropore 113 is much less than 1 micrometer, or even less than 1 micrometer. 0.5 μm; the thinner the thickness of the heating film 112 deposited on the first surface 1111 , the thinner the thickness of the heating film 112 formed on the inner surface of the micropores 113 , and the smaller the influence on the pore size of the micropores 113 . Since the thickness of the heating film 112 is much smaller than the diameter of the micropores 113, and the thickness of the part of the heating film 112 deposited in the micropores 113 is smaller than the thickness of the part deposited on the first surface 1111 of the dense substrate 111, the heating film 112 The effect of deposition in the micropores 113 on the pore size of the micropores 113 is negligible.

In another embodiment, the heating film 112 formed on the first surface 1111 of the dense substrate 111 is a thick film, and the thickness of the heating film 112 ranges from 5 microns to 100 microns, preferably, 5 microns to 50 microns. On the basis that the resistance of the heating film 112 is 0.5 ohm-2 ohm, the material of the heating film 112 includes one of nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum, and titanium. The heating film 112 is formed on the first surface 1111 of the dense base 111 by printing; because the roughness of the first surface 1111 of the dense base 111 is low, the thickness of the heating film 112 can form a continuous film with a thickness of 100 microns. At this time, the first surface 1111 of the dense base 111 includes a micro-hole pattern area 1115 and a non-micro-hole pattern area 1116, and the heating film 112 is formed on the non-micro-hole pattern area 1116; that is, on the first surface 1111 of the dense base 111 The micropores 113 are not provided where the heating film 112 is arranged to ensure the stability and consistency of the heating film 112 . (As shown in FIG. 9a, FIG. 9a is a schematic top view of the structure of the heating element provided by the present application when the heating film is a thick film).

Please refer to FIG. 9b , which is a schematic top view of the structure of the heating element provided in FIG. 3 .

The shape of the heating film 112 may be a sheet shape, a mesh shape or a strip shape. The sheet-shaped and strip-shaped finger heating films 112 in the present application have different aspect ratios, and the aspect ratio greater than 2 can be regarded as a strip shape, and less than 2 can be regarded as a sheet shape. Under the condition of the same material and thickness, the resistance of the strip-shaped heating film 112 is greater than that of the sheet-shaped heating film 112 . When the heating film 112 is in the form of a sheet, the heating film 112 can cover the entire first surface 1111, and the temperature field formed on the first surface 1111 of the dense substrate 111 is uniform; since the aerosol-generating matrix usually contains a variety of components, the temperature field is uniform , which is not conducive to the reduction of aerosol-generating substrates. When the heating film 112 is strip-shaped, the heating film 112 only covers part of the first surface 1111 , and the heating film 112 forms a temperature field with a gradient on the first surface 1111 of the dense substrate 111 , and the gradient temperature field is respectively included in the aerosol-generating matrix. The boiling point temperature of different components can make each component in the aerosol generation substrate atomized at its boiling point to achieve better atomization effect, which is beneficial to improve the reduction degree of the aerosol generation substrate. When the heating film 112 is in the shape of a mesh, the size of the mesh determines whether the temperature field formed by the heating film 112 on the first surface 1111 of the dense substrate 111 is uniform, and the size of the mesh is designed according to needs; even if the size of the mesh is set In order to enable the heating film 112 to form a temperature gradient temperature field on the first surface 1111 of the dense substrate 111 , the atomization effect is not as good as that when the heating film 112 is strip-shaped.

In other embodiments, when the heating film 112 is in a sheet shape, the heating film 112 can cover the entire first surface 1111. By making the thicknesses of the heating films 112 in different regions uneven, or the materials of the heating films 112 in different regions are different, the heating film 112 can be heated. The film 112 forms a temperature field with a gradient on the first surface 1111 of the dense substrate 111 . It can be understood that the heating film 112 is deposited by physical vapor deposition or chemical vapor deposition, and the heating film 112 with gradient thickness can be easily realized by adjusting the positional relationship between the dense substrate 111 and the material source.

The strip shape of the heating film 112 is introduced, and the structure is shown in FIG. 9b. The dense substrate 111 is in the shape of a rectangular plate, and the heating film 112 includes a heating film body 1121 and an electrode 1122 . Electrodes 1122 include positive electrodes and negative electrodes. In order to achieve a better atomization effect, the heating film body 1121 is designed as an S-shaped curved strip, so as to form a temperature field with a temperature gradient on the first surface 1111 of the dense matrix 111 , that is, in the dense matrix 111 The first surface 1111 forms a high temperature area and a low temperature area, and atomizes various components in the aerosol-generating matrix to the maximum extent. One end of the heating film body 1121 is connected to the positive electrode, and the other end is connected to the negative electrode. The size of the electrode 1122 is larger than that of the heating film body 1121 , so that the electrode 1122 can be better electrically connected with the power supply assembly 2 . In this embodiment, the heating film body 1121 and the electrode 1122 are integrally formed, that is, the material of the heating film body 1121 and the electrode 1122 are the same; function.

The inventor of the present application has found that, because the strip-shaped heating film 112 is a strip-shaped elongated structure, the resistance is higher than that of the sheet-shaped heating film 112 under the same conditions. -500 nanometer strip-shaped heating film 112, the material of heating film 112 can only be selected from materials such as aluminum, gold, silver and copper whose resistivity is not greater than 0.03*10-6Ω·m.

The first surface 1111 of the dense substrate 111 includes a microporous area 1117 and a non-microporous area 1118 . The electrode 1122 is disposed in the non-microporous area 1118 , and the heating film body 1121 is disposed in the microporous area 1117 . Since the heating film 112 shown in FIG. 9b is a thin film, some of the micropores 113 penetrate through the heating film body 1121 .

It can be understood that when the pore diameters of the plurality of micropores 113 provided on the dense substrate 111 are different, the micropore region 1117 includes a first pore diameter micropore array region 1113 and a second pore diameter micropore array region 1114, and the first pore diameter micropores The apertures of the microwells 113 in the array area 1113 are the same, the apertures of the microwells 113 in the second aperture microwell array area 1114 are the same, and the apertures of the microwells 113 in the first aperture microwell array area 1113 are the same as the second aperture microwell array area 1114 The diameters of the mesopores 113 are different, and are specifically designed according to requirements. When the heating film 112 formed on the first surface 1111 of the dense substrate 111 is a thick film, the heating film body 1121 is arranged in the microporous area 1117, and the electrode 1122 is arranged in the non-microporous area 1118; Process conditions, the microporous area 1117 is provided with the heating film body 1121 without micropores 113; that is, the microporous area 1117 includes a microporous pattern area 1115 and a non-microporous pattern area 1116, and the heating film body 1121 is provided in the non-microporous pattern. District 1116.

As mentioned above, in order to prepare the heating film 112 with a thickness of less than 5 microns or even nano-scale, aluminum, gold, silver and copper are the preferred materials. However, the heating film 112 made of silver and copper is easily corroded in the liquid aerosol-generating matrix and fails. In addition, the heating film 112 made of aluminum also has the risk of failure during long-term high-power use. For this reason, the inventors of the present application have studied the protective layer of the heating film 112 and found that the existing oxide and nitride protective layers, such as silicon dioxide, have a large difference in thermal expansion coefficient with that of metals, and the internal stress between the film layers during thermal cycling It will cause the protective layer to fail rapidly. Moreover, oxides and nitrides have poor conductivity. As a protective layer, if they cover the heating film and the electrodes, it will lead to the effect of electrical contact between the electrodes and the leads or thimbles; if the electrodes are not covered, the preparation process is complicated. In order to solve the above problems, the present application further provides a protective film 115 on the heating film 112 of the heating element 11 .

Please refer to FIG. 10 and FIG. 11 , FIG. 10 is a schematic diagram of the partial structure of the heating element provided by the application including a protective film and the heating film is a thin film, and FIG. 11 is a top view of the heating element provided by the application including a protective film and the heating film is a thick film Schematic.

Further, the heating body 11 further includes a protective film 115 . The protective film 115 is formed on the surface of the heating film 112 away from the dense substrate 111. The material of the protective film 115 is a metal alloy resistant to the corrosion of the aerosol-generating matrix, so as to prevent the aerosol-generating matrix from corroding the heating film 112 and realize the protection of the heating film 112. protection, thereby improving the performance of the electronic atomization device.

When the heating film 112 is a thin film (the structure is shown in FIG. 10 ), the thickness of the heating film 112 is 200 nm to 5 μm, the resistivity of the heating film 112 is not greater than 0.06*10 ^-6 Ω·m, and the material of the heating film 112 For copper and its alloys, silver and its alloys, aluminum and its alloys, gold and its alloys, the heating film 112 is formed on the first surface 1111 of the dense base 111 by physical vapor deposition or chemical vapor deposition; optionally, the heating film 112 The material is one of copper, silver, aluminum, gold, aluminum alloy, and aluminum-gold alloy. The thickness of the protective film 115 is 100 nanometers to 1000 nanometers, and the material of the protective film 115 is one of stainless steel, nickel-chromium-iron alloy, and nickel-based corrosion-resistant alloy; wherein, the stainless steel can be 304 stainless steel, 316L stainless steel, 317L stainless steel, 904L stainless steel etc., the nickel-chromium-iron alloy can be inconel625, inconel718, etc., and the nickel-based corrosion-resistant alloy can be nickel-molybdenum alloy B-2, nickel-chromium-molybdenum alloy C-276, etc. Preferably, the material of the protective film 115 is stainless steel. The protective film 115 is formed on the heating film 112 away from the heating film 112 by physical vapor deposition (eg, magnetron sputtering, vacuum evaporation, ion plating) or chemical vapor deposition (ion-assisted chemical deposition, laser-assisted chemical deposition, metal organic compound deposition). The surface of the dense matrix 111 . It can be understood that the formation process of the heating film 112 and the protective film 115 is such that the micropores 113 are not covered, that is, the micropores 113 penetrate through the heating film 112 and the protective film 115 . Since the protective film 115 can effectively prevent the aerosol generation matrix from corroding the heating film 112 , the heating film 112 can be made of copper and silver, thereby preparing the heating film 112 in nanometer scale.

When the heating film 112 is a thick film (the structure is shown in FIG. 11 ), the thickness of the heating film 112 is 5 μm-100 μm, and the material of the heating film 112 is nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, gold, One of silver, nickel, platinum, and titanium. The thickness of the protective film 115 is 5 microns to 20 microns, and the material of the protective film 115 is one of stainless steel, nickel-chromium-iron alloy, and nickel-based corrosion-resistant alloy; wherein, the stainless steel can be 304 stainless steel, 316L stainless steel, 317L stainless steel, 904L stainless steel etc., the nickel-chromium-iron alloy can be inconel625, inconel718, etc., and the nickel-based corrosion-resistant alloy can be nickel-molybdenum alloy B-2, nickel-chromium-molybdenum alloy C-276, etc. Preferably, the material of the protective film 115 is stainless steel. When both the heating film 112 and the protective film 115 are sequentially formed on the first surface 1111 of the dense base 111 by printing, the material of the heating film 112 is nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum, titanium One, the material of the protective film 115 is stainless steel; when the heating film 112 is formed on the first surface 1111 of the dense substrate 111 by printing, the protective film 115 is formed on the heating film 112 by physical vapor deposition or chemical vapor deposition away from the dense substrate. On the surface of 111, the material of the heating film 112 is one of nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum, and titanium, and the material of the protective film 115 is stainless steel, nickel-chromium-iron alloy, nickel-based corrosion-resistant alloy one of the. By disposing the protective film 115 on the surface of the thick film heating film 112 , the aerosol generation matrix can be prevented from corroding the heating film 112 .

The protective film 115 is arranged on the surface of the heating film 112, and the protective film 115 is a metal alloy. In theory, when the heating film 112 generates heat, the protective film 115 is also heating; resistance, the protective film 115 hardly generates heat, and the heating film 112 heats the atomized aerosol to generate the matrix. For example, the resistance of the heating film 112 is about 1 ohm, the protective film 115 is made of stainless steel, the resistance of the protective film 115 is about 30 ohms, the resistance of the protective film 115 is too large, and the resistance of the protective film 115 is much larger than that of the heating film 112, Under the condition that the power of the electronic atomization device is 6W-8.5W and the voltage of the battery is 2.5V-4.4V, the protective film 115 cannot play the role of the heating film 112, that is, the protective film 115 cannot be heated to generate atomized aerosol matrix.

In this application, the heating film 112 includes a heating film body 1121 and an electrode 1122 , the heating film body 1121 and the electrode 1122 are made of the same material, and the protective film 115 is provided on the heating film body 1121 and the surface of the electrode 1122 at the same time. It can be understood that the protective film 115 is only formed on the heating film body 1121, and the protective film 115 is not provided on the electrode 1122 to reduce the resistance of the electrode 1122, thereby reducing the resistance consumption between the electrode 1122 and the thimble of the power supply assembly 2, and also That is, the protective film 115 exposes a part of the heating film 112 to serve as the electrode 1122 of the heating film 112; further, the electrode 1122 can be made of a different material from the heating film body 1121, so that the resistance of the electrode 1122 is lower, so as to reduce the electrode 1122 Resistor dissipated to the thimble of power pack 2.

It can be understood that the thickness of the dense matrix 111, the diameter of the micropores 113, the ratio of the thickness of the dense matrix 111 to the diameter of the micropores 113, the distance between the centers of the adjacent micropores 113 and the diameter of the micropores 113 provided in the present application can be The combination design is carried out according to the needs; the dense matrix 111 can be combined with the thin film heating film 112 (the thickness of the heating film 112 is 200 nanometers to 5 microns, the resistivity of the heating film 112 is not more than 0.06*10 ^-6 Ω·m, and the material of the heating film 112 is It is copper and its alloys, silver and its alloys, aluminum and its alloys, gold and its alloys) or a thick-film heating film 112 (the thickness of the heating film 112 is 5 microns to 100 microns, and the material of the heating film 112 is nickel-chromium alloy, One of nickel-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum, and titanium) can be combined and designed according to needs; the protective film 115 can be designed according to needs. The protective film 115 in the heating element 11 provided by the present application can be applied to the surface of a conventional porous ceramic heating element to protect the heating film thereof.

Please refer to FIG. 12. FIG. 12 is a partial structural schematic diagram of the atomizing assembly provided by the present application including a loose matrix.

Further, the atomizing assembly 1 further includes a loose substrate 114 , and the loose substrate 114 is disposed on the second surface 1112 of the dense substrate 111 of the heating body 11 . The loose matrix 114 can be made of materials such as porous ceramics, sponges, foams, and fiber layers, which can achieve the effects of liquid storage, liquid conduction, and heat insulation. That is to say, the aerosol-generating matrix in the liquid storage chamber 10 is first guided to the second surface 1112 of the dense matrix 111 through the loose matrix 114 , and then guided to the first surface 1112 of the dense matrix 111 through the micropores 113 on the dense matrix 111 . The surface 1111 is atomized by the heat generating film 112 .

The following experiments are used to verify the effects of the arrangement of the micropores 113 on the dense substrate 111, the selection of the material of the heating film 112, and the protective film 115 provided by the present application.

Experiment 1: Material selection when the heating film 112 is a thin film.

Taking the common pattern of the heating film 112 in the industry as an example (the shape of the heating film 112 shown in Figure 9b), the heating film 112 has a length of 8.5 mm, a width of 0.4 mm, and a resistance of 1 ohm at room temperature. For different materials, the required theoretical thickness of the heating film 112 can be obtained according to the resistivity of different metal materials, and the results are shown in Table 1.

Table 1. The resistivity of metal materials and the theoretical thickness of the heating film

According to Table 1, when traditional nickel-chromium alloys, nickel-chromium-iron alloys, and iron-chromium-aluminum alloys are used, the theoretical thickness of the heating film 112 needs to exceed 20 μm, which will seriously affect the atomization efficiency and cause the dense matrix 111 during the deposition process. The pore size of the micropores 113 is reduced, which affects the supply and atomization of the aerosol-generating substrate. When using low-resistivity metal materials such as silver, copper, gold, and aluminum, the theoretical thickness of the heating film 112 is less than 1 μm, which not only has no effect on the pore size of the micropores 113 in the dense matrix 111, but also reduces the absorption of the heating film 112 during atomization. energy of. In addition, the thermal conductivity of silver, copper, gold, aluminum and other materials is much higher than that of nickel-chromium alloy, nickel-chromium-iron alloy, and iron-chromium-aluminum alloy, which is conducive to rapid heat conduction and enhanced atomization efficiency.

The heating film 112 made of silver, copper, gold, aluminum and other materials can work stably for a long time in the PG/VG mixture (propylene glycol/glycerol mixture), but the aerosol generation matrix also contains various flavors and fragrances and additives. These flavors, fragrances and additives contain elements such as sulfur, phosphorus, and chlorine, which may cause corrosion to the heating film 112 . It is found through experiments that when silver is used as the material of the heating film 112, the resistance of the heating film 112 will continue to increase during the wet burning heat cycle, and the heating film 112 will fail after about 30 times of suction; the corrosion resistance of copper to chloride ions is better. Strong, when copper is used as the material of the heating film 112, the resistance of the heating film 112 will still increase during the wet burning heat cycle, but the life of the heating film 112 can be extended to about 80 times; Stable, the surface can form a dense oxide film structure, which can withstand more than 600 times during thermal cycling; as the most chemically stable metal, gold is more stable and reliable in thermal cycling, and the thermal cycle resistance is still no more than 1500 times. Variety.

Therefore, when the material of the heating film 112 is silver or copper, the heating film 112 is prone to corrosion failure when heated by electricity; because gold has very strong chemical inertness, a dense oxide film will be formed on the surface of aluminum, which is formed by the two materials of gold or aluminum. The heating film 112 is very stable in the aerosol generating matrix, and is not easily corroded when the heating film 112 is heated by electricity. Therefore, when the heating element 11 does not include the protective film 115, the material of the heating film 112 is aluminum and its alloys, gold and its alloys; when the heating element 11 includes the protective film 115, the protective film 115 can prevent the heating element 11 from being generated by aerosols Corrosion of the substrate does not require the material of the heating element 11, and the material of the heating film 112 is silver and its alloys, copper and its alloys, aluminum and its alloys, gold and its alloys.

Aluminum is selected as the material of the heating film 112, and is deposited on the first surface 1111 of the dense substrate 111 by magnetron sputtering, and the deposited thickness is 3 microns, and the obtained SEM image is shown in Figure 13 (Figure 13 is provided by this application. SEM image of an embodiment of the heating film). According to FIG. 13 , the deposition thickness of the heating film 112 is 3 microns, and the heating film 112 is also deposited on the inner surface of the micropores 113 , but the pore size of the micropores 113 has no obvious effect.

The heating element 11 provided by this application and the traditional porous ceramic heating element were subjected to a wet burning experiment at 6.5 watts to obtain the respective atomized aerosol amounts, and for comparison, the results shown in Figure 14 were obtained (Figure 14 is the The comparison chart of the atomized aerosol amount of the heating element and the traditional porous ceramic heating element); wherein, the heating element 11 of the present application; the porosity of the traditional porous ceramic heating element is 57%-61%, the thickness is 1.6mm, and the pore size is 1.6mm. 15-50μm. It can be seen from FIG. 14 that the aerosol amount of the heating element 11 of the present application is still stable after 650 times of wet burning, and the aerosol amount of the traditional porous ceramic heating element begins to decrease significantly after 650 times of wet burning; Therefore, the amount of aerosol atomized by the heating element 11 provided by the present application is more than that of the conventional porous ceramic heating element, that is to say, the heating element 11 provided by the present application can achieve efficient atomization.

Experiment 2: Verify the function of the protective film 115 provided in this application.

The life of the heating element 11 was evaluated by wet burning the heating element 11 with a bomb. Experimental conditions: use 6.5 watts of constant power to supply power, pump for 3 seconds and stop for 27 seconds, the aerosol-generating matrix is mint flavor, nicotine content of 50mg/100ml, and the thickness of the heating film 112 is 1-2 microns; 11. The protective film 115 is provided and the protective film 115 is not provided for comparison, and different materials are selected for the protective film 115 to be compared, and the experiment is carried out to simulate the normal use environment of the electronic atomization device. The comparison results are shown in Table 2, and the heating film is obtained. The relationship between the material of 112 and the material of the protective film 115 and the life of the heating element 11 .

Table 2. Relationship between heating film material and protective layer material and the life of the heating element

In Table 2, the thickness of the protective film 115 with silicon dioxide is 30 nm, the thickness of the protective film 115 with titanium nitride is 100 nm, and the thickness of the protective film 115 with 316L stainless steel is 800 nm. As can be seen from Table 2, when silver and copper are used as the material of the heating film 112, they are easily corroded by the flavors, fragrances and additives containing elements such as sulfur, phosphorus and chlorine in the aerosol generation matrix, and it is difficult to meet the requirements of life; when aluminum is used as the material of the heating film 112 , can withstand more than 600 thermal cycles, meeting the operating conditions of most electronic atomization devices (the power of the electronic atomization device is 6 watts-8.5 watts), but it is difficult to meet the power of the electronic atomizing device when the power is greater than 10 watts for more than 1500 times requirements.

When silicon dioxide is used as the material of the protective film 115, due to the large difference in thermal expansion coefficient between silicon dioxide and metal, the internal stress between the film layers during thermal cycling will cause the protective film 115 to fail rapidly, and it is difficult to play a protective role. It can be understood that when zirconia and alumina are used as the protective film 115, the thermal expansion coefficient of zirconia, alumina and metal is too large, which is easy to fail, and it is difficult to play a protective role.

Titanium nitride is used as a commonly used protective coating. In this application, copper is used as the material of the heating film 112 to verify whether titanium nitride is suitable for the material of the protective film 115 . During the wet burning process, the resistance of the heating film 112 increases continuously, and the heating film 112 fails after 130 thermal cycles (as shown in FIG. 15 , which is a failure diagram of the heating film in the heating body provided by the present application). Through optical microscope observation, it was found that the heating film 112 was severely corroded and fell off from the dense substrate 111 . From FIG. 16 (FIG. 16 is the SEM image and EDS image of the heating film failure diagram provided in FIG. 15), it can be found that the titanium nitride layer on the surface of the heating film 112 has been basically completely corroded, exposing the copper layer of the heating film 112, while The copper layer is also severely corroded, and the dense substrate 111 is exposed in some areas. That is, in the present application, the protective film 115 made of titanium nitride is also easily corroded by the aerosol generating matrix.

When stainless steel is used as the material of the protective film 115 , regardless of whether the material of the heating film 112 is silver, copper or aluminum, it can withstand more than 1500 thermal cycles, which can greatly increase the life of the heating element 11 . Moreover, it is found through experiments that metals with higher nickel content can protect the heating film 112 .

Therefore, this application adopts corrosion-resistant stainless steel (304, 316L, 317L, 904L, etc.), nickel-chromium-iron alloys (inconel625, inconel718, etc.), nickel-based corrosion-resistant alloys (nickel-molybdenum alloy B-2, nickel-chromium-molybdenum alloy C- 276) etc. as the material of the protective film 115 to improve the life of the heating element 11. Regardless of whether the heating film 112 is made of silver, copper or aluminum, the use of the protective film 115 can greatly improve the life of the heating element 11 .

The lifetime of the heating film 112 increases with the thickness of the protective film 115 , as shown in FIG. 17 ( FIG. 17 is a relationship diagram between the lifetime of the heating film and the thickness of the protective film in the heating element provided by the present application). As can be seen from FIG. 17 , when the aerosol generation substrate adopts mint 50 mg and the material of the protective film 115 is S316L stainless steel, with the increase of the thickness of the protective film 115, the resistance change of the heating film 112 is smaller, and the life of the heating film 112 is longer. .

Experiment 3: Influence of the thickness of the dense matrix 111 and the diameter of the micropores 113 on the liquid supply efficiency.

The liquid supply efficiency of the heating element 11 is evaluated through the heating element 11 wet burning experiment. The principle of the heating element 11 is shown in FIG. 18 ( FIG. 18 is a schematic diagram of the heating element wet burning experiment provided in this application). The DC power supply is used to supply power, and the electrodes 1122 of the heating film 112 are respectively connected through the thimble 20 of the power supply assembly 2 (the thimble 20 is electrically connected to the battery) to control the energization power and energization time, and use an infrared thermal imager or a thermocouple to measure the heating film 112. temperature.

When the heating film 112 is energized, the temperature rises instantaneously, so that the aerosol-forming matrix in the micropores 113 is vaporized. The aerosol-generating matrix is continuously replenished to the heating film 112 .

The flow of the aerosol-generating matrix in the micropores 113 with capillary action can be calculated according to the Washburn equation, where S is the pore area of the micropores 113, ρ is the density of the aerosol-generating matrix, z is the distance traveled by the aerosol-generating matrix, and γ is Surface tension, μ is the viscosity of the aerosol-generating matrix, r is the radius of the micropores 113 , and θ is the contact angle of the aerosol-generating matrix to the dense matrix 111 material. The amount of nebulization of the aerosol-generating substrate is as follows:

It can be seen from the formula that after determining the materials of the aerosol-generating matrix and the dense matrix 111, ρ, γ, μ, and θ remain unchanged. The larger the diameter of the micropores 113 is, the more sufficient the liquid supply is, but the risk of air negative pressure during the transportation of the product and the risk of liquid leakage during warm flushing during use will also be greater. Therefore, the thickness, pore diameter, and aspect ratio of the dense matrix 111 are very important, not only to ensure sufficient liquid supply during the atomization process, but also to prevent the leakage of the aerosol-generating matrix.

The heating element 11 was installed and tested to evaluate the relationship between the thickness of the dense matrix 111/the diameter of the micropores 113 and the amount of atomization. and the relationship between the amount of atomization). It can be seen from FIG. 19 that when the thickness of the dense matrix 111 / the pore size of the micropores 113 is too large, the aerosol-generating matrix supplied by capillary action cannot meet the demand for atomization, and the amount of atomization decreases. When the thickness of the dense matrix 111 / the pore size of the micropores 113 is too small, the aerosol-generating matrix easily flows out from the micropores 113 to the surface of the heating film 112 , resulting in a decrease in atomization efficiency and a decrease in the amount of atomization.

Experiment 4: Comparison of the performance of the heating element 11 provided by the present application with the traditional porous ceramic heating element.

If the supply of the aerosol-generating substrate is sufficient, in the thermal equilibrium state, the temperature of the heating film 112 will be maintained near the boiling point of the aerosol-generating substrate; if the supply of the aerosol-generating substrate is insufficient, dry burning will occur, and the temperature of the heating film 112 will be higher than that of the aerosol-generating substrate. Matrix boiling point. Therefore, the liquid supply efficiency of the heat generating body 11 can be evaluated by the heat generating body 11 wet burning test.

The thickness of the dense base body 111 of the heating body 11 provided by the present application is 0.2 mm, and the diameter of the micropores 113 is 30 microns. The above heating element 11 was compared with a conventional porous ceramic heating element (porosity 57%-61%, thickness 1.6 mm, pore diameter 15-50 μm).

For the traditional porous ceramic heating element, under the condition of power of 6.5w, the temperature of the heating film instantly rises to around 270°C after energization, and the temperature is almost stable within the heating duration of 3 seconds, reaching a state of thermal equilibrium; but with the increase of heating power Increase, the temperature of the heating film in the thermal equilibrium state continues to rise, indicating that the liquid supply of the porous ceramic structure responsible for the liquid conduction function is insufficient, as shown in Figure 20 (Figure 20 is the relationship between the atomization temperature and the heating power of the traditional porous ceramic heating element) .

Relatively speaking, when the thickness of the dense substrate 111 is 0.2 mm and the diameter of the micropores 113 is 30 μm for the heating element 11, the temperature of the heating film 112 in the thermal equilibrium state is around 250°C within the power range of 6.5w-11.5w. , as shown in Figure 21 (Figure 21 is the relationship between the atomization temperature and heating power of the heating element provided by this application); it shows that the dense matrix 111 of this structure has sufficient liquid supply, and no liquid leakage was found in the experiment.

Under the condition of heating power of 6.5w, the relationship between the atomization temperature of the heating element 11 provided by the application and the suction time was studied. The results are shown in Figure 22 (Figure 22 is the atomization temperature of the heating element provided by the application. vs. puff time). It can be seen from FIG. 22 that with the increase of heating time, the atomization temperature of the heating element 11 provided by the present application is also stable in the thermal equilibrium state; it shows that with the continuous consumption of the aerosol generation matrix in the micropores 113, boiling fog occurs. During the atomization, the aerosol-generating substrate in the liquid storage chamber 10 can be continuously supplied, which can meet the atomization demand and ensure the atomization amount.

The beneficial effects of the present application are different from the prior art. The heating element in the present application includes a liquid-conducting glass substrate and a heating film; the specific preparation method includes: first laser induction and corrosion of the substrate to be processed to form first micropores. Prefabricated holes, the prefabricated holes have prefabricated apertures; the substrate to be processed is subjected to a second laser induction and etching to form second micropores, and the second micropores have a second aperture, wherein the second etching process of the substrate to be processed makes the prefabricated The pore size is expanded to the first pore size, and the prefabricated holes are transformed into first micropores, thereby obtaining a liquid-conducting glass substrate with liquid-conducting micropores of different pore sizes; a heating film is formed on the first surface of the liquid-conducting glass substrate. Through the above process, in mass production, the porosity of the heating element can be precisely controlled, the fluctuation range is small, and the heating power can be accurately matched, thereby achieving a better atomization effect, which is suitable for mass standardized production. In addition, due to the second etching process of the substrate to be processed, the first micropores are enlarged from prefabricated apertures to first apertures, compared with preparing second micropores with second apertures and first micropores with first apertures The method is simple in process and low in cost.

The above description is only an embodiment of the present application, and is not intended to limit the scope of the patent of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present application, or directly or indirectly applied to other related technologies Fields are similarly included within the scope of patent protection of this application.

Claims (14)

1. A preparation method of a liquid-conducting glass substrate, which is used for heating and atomizing liquid aerosol to generate a substrate, wherein the preparation method comprises: performing the first laser induction and etching on the substrate to be processed to form a prefabricated hole of the first micropore, and the prefabricated hole has a prefabricated aperture; The second laser induction and etching are performed on the substrate to be processed to form second micropores, and the second micropores have a second aperture, wherein the process of performing the second etching on the substrate to be processed makes The prefabricated pore size is expanded into a first pore size, and the prefabricated pore is transformed into a first micropore, thereby obtaining a liquid-conducting glass substrate having liquid-conducting micropores with different pore sizes. 2 . The method for preparing a liquid-conducting glass substrate according to claim 1 , wherein the substrate to be processed comprises a first surface and a second surface opposite and parallel to the first surface, and the first microscopic surface is parallel to the first surface. 3 . The holes and the second microholes are straight through holes penetrating and perpendicular to the first surface and the second surface. 3 . The method for preparing a liquid-conducting glass substrate according to claim 1 , wherein the step of performing the first laser induction and etching on the substrate to be processed to form the prefabricated holes of the first micro-holes comprises: 4 . Perform laser induction on the substrate to be processed according to the distribution of the micropores of the first aperture; perform the first etching on the substrate subjected to the first laser induction, and the etching time is the total corrosion required for the first aperture Time (N) minus the etching time (M) required for the second aperture; The step of performing the second laser induction and corrosion on the substrate to be processed to form the second micropores includes: performing laser induction on the substrate to be processed according to the distribution of micropores of the second aperture, The second laser-induced substrate is subjected to the second etching for the etching time (M) required for the second aperture. 4 . The method for preparing a liquid-conducting glass substrate according to claim 1 , wherein the step of performing the first laser induction and etching on the substrate to be processed to form the prefabricated holes of the first micro-holes comprises: 5 . forming an array of prefabricated holes including a plurality of said prefabricated holes having said prefabricated apertures; The step of performing the second laser induction and etching on the substrate to be processed, and forming the second microholes includes: forming a second microhole array including a plurality of the second microholes with the second apertures and a plurality of first microwell arrays of said first microwells having said first apertures. 5 . The method for preparing a liquid-conducting glass substrate according to claim 1 , wherein the ratio of the thickness of the liquid-conducting glass substrate to the diameter of the liquid-conducting micropores is 20:1-3:1. 6 . 6 . The method for preparing a liquid-conducting glass substrate according to claim 5 , wherein the ratio of the thickness of the liquid-conducting glass substrate to the diameter of the liquid-conducting micropores is 15:1-5:1. 7 . 7 . The method for preparing a liquid-conducting glass substrate according to claim 1 , wherein the ratio of the hole center distance between two adjacent liquid-conducting micro-holes to the diameter of the liquid-conducting micro-holes is 3. 8 . :1-1.5:1. 8 . The method for preparing a liquid-conducting glass substrate according to claim 1 , wherein the substrate to be processed is glass. 9 . 9 . The method for preparing a liquid-conducting glass substrate according to claim 8 , wherein the substrate to be processed is glass, and the glass is one of borosilicate glass, quartz glass and photosensitive lithium aluminosilicate glass. 10 . or more. 10. A preparation method of a heating element, which is used for heating an atomized liquid aerosol to generate a matrix, wherein the preparation method comprises: preparing a liquid-conducting glass substrate, and the preparation method of the liquid-conducting glass substrate is the preparation method described in any one of the above claims 1-9; A heating film is formed on the first surface of the liquid-conducting glass substrate. 11. The method for preparing a heating element according to claim 10, wherein the step of forming a heating film on the first surface of the liquid-conducting glass substrate comprises: forming a resistance of A heating film with a thickness of 0.5 ohm-2 ohm and a thickness of 200 nanometers to 5 microns; the material of the heating film is aluminum, copper, silver, gold or alloys thereof. 12 . The method for preparing a heating element according to claim 11 , wherein after the step of forming a heating film on the first surface of the liquid-conducting glass substrate, the method comprises: by physical vapor deposition or chemical vapor deposition on the surface of the heating element. 13 . A protective film with a thickness of 100 nanometers to 1000 nanometers is formed on the surface of the heating film away from the liquid-conducting glass substrate; the material of the protective film is one or any combination of stainless steel, nickel-chromium-iron alloy, and nickel-based corrosion-resistant alloy. 13 . The method for preparing a heating element according to claim 10 , wherein the step of forming a heating film on the first surface of the liquid-conducting glass substrate comprises: forming a resistance of 0.5 ohm by printing or chemical vapor deposition. 14 . -2 ohm, a heating film with a thickness of 5 microns to 100 microns; the material of the heating film is one of nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum and titanium. 14 . The method for preparing a heating element according to claim 13 , wherein after the step of forming a heating film on the first surface of the liquid-conducting glass substrate, the method comprises: printing or chemical vapor deposition on the heating element. 15 . A protective film with a thickness of 5 microns to 20 microns is formed on the surface of the film away from the liquid-conducting glass substrate; the material of the protective film is stainless steel.

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