CN114783988B - Display substrate, display panel, and method for manufacturing display panel - Google Patents
Display substrate, display panel, and method for manufacturing display panel Download PDFInfo
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- CN114783988B CN114783988B CN202210350501.7A CN202210350501A CN114783988B CN 114783988 B CN114783988 B CN 114783988B CN 202210350501 A CN202210350501 A CN 202210350501A CN 114783988 B CN114783988 B CN 114783988B
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- 239000000758 substrate Substances 0.000 title claims abstract description 97
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 25
- 229910000679 solder Inorganic materials 0.000 claims abstract description 154
- 238000003466 welding Methods 0.000 claims abstract description 98
- 230000004888 barrier function Effects 0.000 claims abstract description 38
- 230000003746 surface roughness Effects 0.000 claims abstract description 14
- 230000000903 blocking effect Effects 0.000 claims description 27
- 239000002245 particle Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 18
- 238000005476 soldering Methods 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 229910052709 silver Inorganic materials 0.000 claims description 15
- 239000004332 silver Substances 0.000 claims description 15
- 229910052718 tin Inorganic materials 0.000 claims description 15
- 239000011135 tin Substances 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 239000004973 liquid crystal related substance Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000002159 abnormal effect Effects 0.000 description 7
- 239000011241 protective layer Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
本申请公开了一种显示基板、显示面板及显示面板的制造方法。显示基板包括：驱动基板，包括基底，以及阵列设置于基底上的多个间焊接端子和多个阻隔件，焊接端子设置于相邻的阻隔件之间；多个锡膏件，设置于多个焊接端子上；多个发光二极管，发光二极管通过锡膏件电连接对应的焊接端子；其中，阻隔件远离基底一侧表面的表面粗糙度大于0.1微米，相邻的锡膏件相互分离设置。本申请通过在阻隔件远离基底一侧的表面设置粗糙的表面，焊接端子上的锡膏不容易扩散，可以避免焊接端子上的锡膏流动连接相邻的焊接端子上的锡膏，从而避免出现相邻焊接端子之间的短路的问题。
The present application discloses a display substrate, a display panel and a method for manufacturing a display panel. The display substrate includes: a driving substrate, including a substrate, and a plurality of welding terminals and a plurality of barriers arranged in an array on the substrate, wherein the welding terminals are arranged between adjacent barriers; a plurality of solder paste parts arranged on the plurality of welding terminals; a plurality of light-emitting diodes, wherein the light-emitting diodes are electrically connected to the corresponding welding terminals through the solder paste parts; wherein the surface roughness of the surface of the barrier away from the substrate is greater than 0.1 microns, and adjacent solder paste parts are arranged separately from each other. The present application provides a rough surface on the surface of the barrier away from the substrate, so that the solder paste on the welding terminal is not easy to diffuse, and the solder paste on the welding terminal can be prevented from flowing and connecting the solder paste on the adjacent welding terminal, thereby avoiding the problem of short circuit between adjacent welding terminals.
Description
Technical Field
The application relates to the field of display, in particular to a display substrate, a display panel and a manufacturing method of the display panel.
Background
Each large panel factory is actively developing a light emitting diode display panel (LED panel), particularly a micro light emitting diode display panel (MinLED panel or MicroLED panel), which is expected to be a core technology of the next generation display panel, has been a hot spot.
However, with miniaturization of Light Emitting Diodes (LEDs), the precision requirement for solder paste screen printing is gradually increased, and the difference in the precision of solder paste spraying leads to solder paste adhesion, so that a short circuit phenomenon between adjacent welding terminals is very easy to occur, abnormal display occurs in the micro light emitting display panel, and the yield of the micro light emitting diode display panel is reduced.
Disclosure of Invention
The embodiment of the application provides a display substrate, a display panel and a manufacturing method of the display panel. The problem that the short circuit between adjacent welding terminals is easy to occur due to the fact that the precision requirement on solder paste screen printing is gradually improved along with the miniaturization of a light-emitting diode (LED) can be solved, and therefore the problem that the display of the light-emitting diode display panel is abnormal is solved, and the yield of the light-emitting diode display panel is reduced.
The embodiment of the application provides a display substrate, which comprises:
the driving substrate comprises a base, a plurality of welding terminals and a plurality of blocking pieces, wherein the welding terminals and the blocking pieces are arranged on the base in an array mode, and the welding terminals are arranged between the adjacent blocking pieces;
A plurality of solder paste pieces arranged on the plurality of welding terminals;
The light emitting diodes are arranged on the driving substrate in an array manner, and the light emitting diodes are electrically connected with the corresponding welding terminals through the solder paste pieces;
Wherein, the surface roughness of the surface of the separation piece far away from one side of the substrate is more than 0.1 micron, and the adjacent solder paste pieces are mutually separated.
Alternatively, in some embodiments of the application, the surface roughness of the barrier away from the substrate side surface is 0.5 to 1.5 microns.
Optionally, in some embodiments of the present application, the material of the solder paste piece includes tin, silver, and copper, wherein the mass percentage of tin is greater than 99%, the mass percentage of silver is 0.3% to 0.5%, and the mass percentage of copper is less than 0.2%.
Optionally, in some embodiments of the application, the material of the barrier is a light shielding material.
Optionally, in some embodiments of the present application, a plurality of the welding terminals form a plurality of welding terminal groups, the welding terminal groups include a first sub-welding terminal and a second sub-welding terminal, and the light emitting diode includes a first connection terminal and a second connection terminal;
One welding terminal group corresponds one emitting diode, first sub-welding terminal with the second sub-welding terminal sets up one the both sides end of separation piece, emitting diode set up in first sub-welding terminal the second sub-welding terminal the first sub-welding terminal with the second sub-welding terminal between the separation piece keep away from one side of basement, first connecting terminal passes through one the solder paste spare is connected first sub-welding terminal, the second connecting terminal passes through another the solder paste spare is connected the second sub-welding terminal.
Alternatively, in some embodiments of the application, the barrier has a cross-section that is any one of trapezoidal, semi-circular, and semi-elliptical.
Accordingly, an embodiment of the present application further provides a display panel, including the display substrate described above, where the display substrate is used as a backlight of the display panel, or the light emitting diode of the display substrate is used as a display pixel of the display panel.
Correspondingly, the embodiment of the application also provides a manufacturing method of the display panel, which comprises the following steps:
step S100, providing a driving substrate, wherein the driving substrate comprises a base, a plurality of welding terminals and a plurality of blocking pieces, wherein the welding terminals and the blocking pieces are arranged on the base in an array manner, and the welding terminals are arranged between the adjacent blocking pieces;
Step 200, forming a rough surface on the surface of one side of the barrier away from the substrate, wherein the surface roughness of the rough surface is 0.5-1.5 microns;
Step S300, forming solder paste on a plurality of welding terminals, wherein the solder paste comprises a solvent and solder paste particles, the solder paste comprises a plurality of solder paste drops, and one solder paste drop is formed on one welding terminal;
and S400, providing a light emitting diode, welding the light emitting diode on the driving substrate, and melting the solder paste particles to form a solder paste piece, wherein the light emitting diode is electrically connected with the corresponding welding terminal through the solder paste piece.
Optionally, in some embodiments of the present application, the material of the solder paste particles includes tin, silver, and copper, wherein the mass percentage of tin in the solder paste particles is greater than 99%, the mass percentage of silver is 0.3% to 0.5%, and the mass percentage of copper is less than 0.2%.
Alternatively, in some embodiments of the present application, in the step S200, the method of forming the roughened surface of the barrier includes at least one of bombardment with plasma and scanning with laser.
The embodiment of the application provides a display substrate, a display panel and a manufacturing method of the display panel. The display substrate comprises a driving substrate, a plurality of solder paste pieces, a plurality of light emitting diodes and a plurality of light emitting diodes, wherein the driving substrate comprises a base, a plurality of inter-solder terminals and a plurality of blocking pieces, the inter-solder terminals and the blocking pieces are arranged on the base in an array mode, the solder terminals are arranged between the adjacent blocking pieces, the solder paste pieces are arranged on the plurality of solder terminals, the light emitting diodes are arranged on the driving substrate in an array mode, the light emitting diodes are electrically connected with the corresponding solder terminals through the solder paste pieces, the surface roughness of one side surface of the blocking piece, far away from the base, is larger than 0.1 micrometer, and the adjacent solder paste pieces are mutually separated. According to the application, the rough surface is arranged on the surface of the blocking piece far away from the substrate, so that when the LED is welded on the solder paste to form the solder paste piece, the solder paste on the welding terminals is not easy to diffuse, and the solder paste on the welding terminals is prevented from being connected with the solder paste on the adjacent welding terminals in a flowing way, so that the problem of short circuit between the adjacent welding terminals is avoided, abnormal display of the LED display panel is avoided, and the yield of the LED display panel is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic cross-sectional structure of a display substrate according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a display panel according to an embodiment of the present application;
fig. 3 is a schematic flow chart illustrating a method for manufacturing a display panel according to an embodiment of the application;
fig. 4 is a schematic diagram of a first process of a manufacturing method of a display panel according to an embodiment of the application;
fig. 5 is a schematic diagram illustrating a second process of a manufacturing method of a display panel according to an embodiment of the application;
fig. 6 is a schematic diagram illustrating a third process of a manufacturing method of a display panel according to an embodiment of the application;
fig. 7 is a schematic diagram of a fourth process of a manufacturing method of a display panel according to an embodiment of the application;
fig. 8 is a schematic diagram of a fifth process of a manufacturing method of a display panel according to an embodiment of the application;
fig. 9 is a schematic diagram illustrating a sixth process of a manufacturing method of a display panel according to an embodiment of the application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and description only, and is not intended to limit the application. In the present application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used to generally refer to the upper and lower directions of the device in actual use or operation, and specifically the directions of the drawings in the drawings, while "inner" and "outer" are used with respect to the outline of the device.
The embodiment of the application provides a display substrate which comprises a driving substrate, a plurality of light emitting diodes arranged on the driving substrate in an array manner, and an optical adhesive layer arranged on the driving substrate and covering the light emitting diodes, wherein the surface of the optical adhesive layer far away from the light emitting diodes comprises a plurality of microstructures, and each microstructure comprises a protrusion or a depression. The embodiment of the application also provides a display panel comprising the display substrate and a manufacturing method of the display panel. The following will describe in detail. The following description of the embodiments is not intended to limit the preferred embodiments.
Example 1
Referring to fig. 1, fig. 1 is a schematic cross-sectional structure of a display substrate 100 according to an embodiment of the application.
The embodiment of the application provides a display substrate 100, wherein the display substrate 100 comprises a driving substrate 10, a plurality of solder paste pieces 31 and a plurality of light emitting diodes 20, the driving substrate comprises a base 11, a plurality of welding terminals 12 and a plurality of blocking pieces 13, the welding terminals 12 are arranged between the adjacent blocking pieces 13 in an array manner, the plurality of solder paste pieces 31 are arranged on the plurality of welding terminals 12, the plurality of light emitting diodes 20 are arranged on the driving substrate 10 in an array manner, the light emitting diodes 20 are electrically connected with the corresponding welding terminals 12 through the solder paste pieces 31, wherein the surface roughness of one side surface of the blocking piece 13 far away from the base 11 is larger than 0.1 micrometer, and the adjacent solder paste pieces 31 are mutually separated.
Specifically, the driving substrate 10 may include a substrate made of any material, for example, the driving substrate 10 may include a substrate made of glass, the driving substrate 10 may be an array substrate, and the driving substrate 10 may include wirings or/and thin film transistors for driving Light Emitting Diodes (LEDs).
Specifically, the light emitting diode may be a conventional size LED or a micro light emitting diode (MinLED, microLED).
Specifically, the surface of the barrier 13 on the side away from the substrate 11 is the first surface 131.
Specifically, by providing a rough surface on the surface of the barrier 13 far away from the substrate, when the light emitting diode 20 is welded on the solder paste to form a solder paste piece, the solder paste on the welding terminal 12 is not easy to diffuse, and the solder paste on the welding terminal 12 is prevented from being connected with the solder paste on the adjacent welding terminal 12 in a flowing manner, so that the problem of short circuit between the adjacent welding terminals 12 is avoided, abnormal display of the light emitting diode display panel is avoided, and the yield of the light emitting diode display panel is improved.
In some embodiments, the surface roughness of the side of the barrier 13 remote from the substrate 11 is 0.5 to 1.5 microns.
Specifically, the surface roughness of the side surface (the first surface 131) of the barrier member 13 away from the substrate 11 is preferably 0.5 to 1.5 micrometers, so that the solder paste on the soldering terminals 12 can be better prevented from flowing and diffusing, the solder paste on the adjacent soldering terminals 12 can be prevented from being connected, and the problem of short circuit between the adjacent soldering terminals 12 can be better avoided.
In some embodiments, the material of the solder paste 31 includes tin, silver, and copper, wherein the mass percent of tin is greater than 99%, the mass percent of silver is 0.3% to 0.5%, and the mass percent of copper is less than 0.2%.
Specifically, the materials of the solder paste member 31 include tin, silver, and copper, and the beneficial effects of the content of each material in the solder paste member 31 will be described in detail in the following embodiments.
In some embodiments, the material of the barrier 13 is a light shielding material.
Specifically, the blocking member 13 is made of a light shielding material, so as to avoid crosstalk of light or color between adjacent leds, and the plurality of leds may include a red led, a green led, and a blue led, for example, crosstalk or interference of red light emitted by the red led and green light emitted by the green led may be avoided.
Specifically, the barrier 13 may be a black light shielding material. More specifically, the barrier member 13 may be a black photoresist, a Black Matrix (BM).
In particular, the height of the barrier member 13 is 2 micrometers to 4 micrometers, so that crosstalk of light or color between adjacent leds can be well avoided.
In some embodiments, the plurality of welding terminals 12 form a plurality of welding terminal groups 120, the welding terminal groups 120 comprise a first sub-welding terminal 121 and a second sub-welding terminal 122, the light emitting diode 20 comprises a first connecting terminal 21 and a second connecting terminal 22, one welding terminal group 120 corresponds to one light emitting diode 20, the first sub-welding terminal 121 and the second sub-welding terminal 122 are arranged at two side ends of one blocking piece 13, the light emitting diode 20 is arranged at one side of the blocking piece 13 between the first sub-welding terminal 121, the second sub-welding terminal 122 and the first sub-welding terminal 121 and the second sub-welding terminal 122, which is far away from the substrate 11, the first connecting terminal 21 is connected with the first sub-welding terminal 121 through one solder paste 31, and the second connecting terminal 22 is connected with the second sub-welding terminal 122 through the other solder paste 31.
Specifically, the display substrate 100 includes a plurality of light emitting diodes 20 and a plurality of soldering terminal sets 120, one soldering terminal set 120 corresponds to one light emitting diode 20, the first connecting terminal 21 is connected to the first sub-soldering terminal 121 through one solder paste member 31, the second connecting terminal 22 is connected to the second sub-soldering terminal 122 through another solder paste member 31, and the solder paste member 31 between the first connecting terminal 21 and the first sub-soldering terminal 121 and the solder paste member 31 between the second connecting terminal 22 and the second sub-soldering terminal 122 are mutually independent and mutually insulated, so as to avoid a short circuit phenomenon.
Specifically, the light emitting diode 20 includes a first connection terminal 21, a second connection terminal 22, and a light emitting body 23, and the first connection terminal 21 and the second connection terminal 22 supply an electrical signal to the light emitting body 23.
In some embodiments, the barrier 13 is any one of trapezoidal, semicircular, and semi-elliptical in cross-section.
Specifically, the cross section of the blocking member 13 is any one of trapezoid, semicircle and semi-ellipse, so that when the solder paste is welded to the light emitting diode 20 to form a solder paste member, the solder paste on the welding terminal 12 is not easy to diffuse, is more easy to gather and reflow on the corresponding welding terminal 12, and can avoid the solder paste on the welding terminal 12 from being connected with the solder paste on the adjacent welding terminal 12 in a flowing manner, thereby avoiding the problem of short circuit between the adjacent welding terminals 12, avoiding abnormal display of the light emitting diode display panel, and improving the yield of the light emitting diode display panel.
Example two
Referring to fig. 2, fig. 2 is a schematic diagram of a display panel 300 according to an embodiment of the application.
The present embodiment provides a display panel 300, the display panel 300 including any one of the display substrates 100 of the above embodiments.
Specifically, the display substrate 100 is used as a backlight of the display panel 300, or the light emitting diode 20 of the display substrate 100 is used as a display pixel of the display panel 300, which is not limited herein.
Specifically, the display substrate 100 is used as a component in the backlight of the display panel 300, the light emitting side of the display substrate 100 or the side of the light emitting diode 20 away from the base 11 is further provided with a display panel body 200, the display panel body 200 is used for displaying an image, and the display substrate 100 is used as a light source of the display panel body 200.
Specifically, the display panel body 200 may be a liquid crystal display panel, and the type of the liquid crystal display panel is not limited herein, and for example, the liquid crystal display panel may be a vertical alignment type liquid crystal display panel (VA mode liquid crystal display panel), a fringe field switching type liquid crystal display panel (FFS mode or IPS mode liquid crystal display panel), a twisted nematic type liquid crystal display panel (TN mode liquid crystal display panel).
Specifically, when the light emitting diode 20 of the display substrate 100 is used as a display pixel of the display panel 300, the display substrate 100 directly displays an image.
Example III
Referring to fig. 3 to 9, fig. 3 is a schematic flow chart of a manufacturing method of a display panel according to an embodiment of the application, fig. 4 is a schematic flow chart of a first process of a manufacturing method of a display panel according to an embodiment of the application, fig. 5 is a schematic flow chart of a second process of a manufacturing method of a display panel according to an embodiment of the application, fig. 6 is a schematic flow chart of a third process of a manufacturing method of a display panel according to an embodiment of the application, fig. 7 is a schematic flow chart of a fourth process of a manufacturing method of a display panel according to an embodiment of the application, fig. 8 is a schematic flow chart of a fifth process of a manufacturing method of a display panel according to an embodiment of the application, and fig. 9 is a schematic flow chart of a sixth process of a manufacturing method of a display panel according to an embodiment of the application.
The present embodiment provides a display panel, any one of the display panels 300 in the above embodiment may be manufactured by the manufacturing method of the display panel in the present embodiment, or any one of the display substrates 100 in the above embodiment may be manufactured by the manufacturing method of the display panel in the present embodiment, and the manufacturing method of the display panel includes steps of step S100, step S200, step S300, and step S400.
Step S100, providing a driving substrate, wherein the driving substrate comprises a base, a plurality of welding terminals and a plurality of blocking pieces, wherein the welding terminals and the blocking pieces are arranged on the base in an array mode, and the welding terminals are arranged between the adjacent blocking pieces.
Specifically, as shown in fig. 4, a driving substrate 10 is provided, the driving substrate 10 includes a base 11, and a plurality of solder terminals 12 and a plurality of barriers 13 disposed on the base 11 in an array, and the solder terminals 12 are disposed between adjacent barriers 13.
Step S200, forming a rough surface on the surface of the side, far away from the substrate, of the barrier, wherein the surface roughness of the rough surface is 0.5-1.5 microns.
Specifically, as shown in fig. 5, a roughened surface is formed on the surface of the barrier member 13 on the side away from the substrate 11, and the roughened surface has a surface roughness of 0.5 to 1.5 μm.
Specifically, the surface of the barrier 13 on the side far from the substrate 11 is a first surface 131, and the surface roughness of the first surface 131 is 0.5 to 1.5 micrometers.
Step S300, forming a solder paste on the plurality of solder terminals, the solder paste including a solvent and solder paste particles, the solder paste including a plurality of solder paste drops, and forming a solder paste drop on one solder terminal.
Specifically, as shown in fig. 6, a solder paste 30 is formed on a plurality of the solder terminals 12, the solder paste 30 including a solvent 321 and solder paste particles 322, the solder paste 30 including a plurality of solder paste droplets 32, one solder paste droplet 32 being formed on one solder terminal 12.
Specifically, the solder paste 30 is precisely printed onto the solder terminals 12 using a high precision paste coater or an inkjet printing apparatus, and the viscosity of the solvent 321 in the solder paste 30 is 140 to 180pa.s.
In particular, the material of the solvent may include an epoxy resin.
And S400, providing a light emitting diode, welding the light emitting diode on the driving substrate, and melting the solder paste particles to form a solder paste piece, wherein the light emitting diode is electrically connected with the corresponding welding terminal through the solder paste piece.
Specifically, as shown in fig. 7, 8 and 9, the light emitting diode 20 is provided, the light emitting diode 20 is soldered to the driving substrate 10, the solder paste particles 322 are melted to form a solder paste 31, and the light emitting diode 20 is connected to the corresponding soldering terminal 12 through the solder paste 31.
Specifically, the soldering process of the light emitting diode 20 may include pre-press bonding and reflow soldering of the light emitting diode. The pre-press conditions of the light emitting diode are that the temperature is 110-130 degrees celsius, the time is 50-70s, and the distance between the first connection terminal 21 and the second connection terminal 22 of the light emitting diode 20 and the welding terminal 12 is 6-12 micrometers. The reflow soldering condition is that the air pressure is 0.1Mpa, the temperature is 220-250 ℃ and the time is 120-150s.
In some embodiments, the material of the solder paste particles 322 includes tin, silver, copper, the mass percent of tin in the solder paste particles 322 is greater than 99%, the mass percent of silver is 0.3% to 0.5%, and the mass percent of copper is less than 0.2%.
In some embodiments, in step S200, the method of forming the roughened surface of the barrier 13 includes at least one of bombardment with plasma and scanning with laser.
Specifically, a rough surface may be formed by bombarding a side surface of the barrier 13 away from the substrate 11 with plasma, and a rough surface may be formed by scanning a side surface of the barrier 13 away from the substrate 11 with laser.
Specifically, the cross section of the barrier 13 is any one of trapezoid, semicircle, and semi-ellipse, so that the solder paste droplets 32 are not easily spread from their corresponding solder terminals to the adjacent solder terminals, and are more easily reflowed onto the corresponding solder terminals 12 when the solder paste droplets 32 are on the surface of the barrier 13 away from the substrate 11.
Specifically, when a rough surface is disposed on the surface of the barrier 13 away from the substrate, as shown in fig. 7 and 9, the rough surface can block or prevent the solder paste droplet 32 from flowing from the corresponding portion of one solder terminal 12 to the corresponding portion of the adjacent solder terminal 12, that is, the solder paste on the solder terminal 12 is not easy to spread, so as to avoid the problem of short circuit between the adjacent solder terminals 12, as shown in fig. 8 and 9, avoid the contact of one solder paste droplet 32 at the first portion 41 and the other solder paste droplet 32 at the second portion 42, thereby avoiding abnormal display of the light-emitting diode display panel, and improving the yield of the light-emitting diode display panel.
Specifically, further, when a rough surface is provided on the surface of the barrier 13 away from the substrate, and the self-focusing solder paste of the present application is used, the solder paste 30 includes the solvent 321 and the solder paste particles 322, the material of the solder paste particles 322 includes tin, silver and copper, the mass percentage of tin in the solder paste particles 322 is greater than 99%, the mass percentage of silver is 0.3% to 0.5%, the mass percentage of copper is less than 0.2%, the solder paste of the present application is self-focusing solder paste, the self-focusing solder paste is matched with the rough surface of the barrier 13 away from the substrate, compared with fig. 7 and 8, and referring to fig. 9, the solder paste particles 322 in the solder paste drops 32 will reflow toward the corresponding solder terminals 12 after being heated, as shown in fig. 7 and 8, at the first adjacent portion 40 (shown by the dashed circle in fig. 7), the solder paste particles 322 of the first portion 41 and the solder paste particles 322 of the second portion 42 flow back to the corresponding welding terminals 12, respectively, and the principle is that the solder paste particles 322 form stable metal complex substances on the welding terminals 12, thereby inducing other solder paste particles 322 in the solder paste drops 32 to move to the corresponding welding terminals 12, and finally forming solder paste pieces 31 on the welding terminals 12, and the rough surface and self-focusing solder paste are matched, so that the problem of short circuit between the adjacent welding terminals 12 can be better prevented, thereby avoiding abnormal display of the light-emitting diode display panel and improving the yield of the light-emitting diode display panel.
As shown in fig. 9, the solvent 321 in the solder paste drops forms the protective layer 33 of the solder paste 31 after the light emitting diode 20 is soldered, and the protective layer 33 is located outside the solder paste 31. It will be appreciated that after soldering is completed, the solvent 321 in the solder paste 32 solidifies to form the protective layer 33, the solder paste particles 322 in the solder paste 32 melt to form the solder paste 31, and the solder paste 32 forms a connector after soldering, the connector including the solder paste 31 and the protective layer 33.
The foregoing describes in detail a display substrate, a display panel and a method for manufacturing a display panel according to the embodiments of the present application, wherein specific examples are used to illustrate the principles and embodiments of the present application, and the above examples are only used to help understand the method and core idea of the present application, and meanwhile, the present application should not be construed as being limited to the embodiments and application range according to the idea of the present application.
Claims (10)
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| CN110416248A (en) * | 2019-08-06 | 2019-11-05 | 京东方科技集团股份有限公司 | A display substrate, its preparation method, and display device |
| CN111258097A (en) * | 2020-02-19 | 2020-06-09 | 厦门天马微电子有限公司 | Display substrate, display panel and display device |
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| CN105870291A (en) * | 2015-01-21 | 2016-08-17 | 展晶科技(深圳)有限公司 | Light emitting diode module and manufacturing method thereof |
| CN109950270B (en) * | 2019-03-27 | 2021-01-08 | 京东方科技集团股份有限公司 | Driving back plate of light emitting diode chip, manufacturing method of driving back plate and display panel |
| CN111599834B (en) * | 2020-05-29 | 2022-07-12 | 京东方科技集团股份有限公司 | A display substrate and its preparation method |
| CN213519934U (en) * | 2020-10-14 | 2021-06-22 | 重庆康佳光电技术研究院有限公司 | Display panel and electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110416248A (en) * | 2019-08-06 | 2019-11-05 | 京东方科技集团股份有限公司 | A display substrate, its preparation method, and display device |
| CN111258097A (en) * | 2020-02-19 | 2020-06-09 | 厦门天马微电子有限公司 | Display substrate, display panel and display device |
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