CN114779401A - Planar optical waveguide-optical fiber array device for silicon optical coupling - Google Patents

Abstract

The invention relates to a planar optical waveguide-optical fiber array device for silicon optical coupling, wherein a planar optical waveguide chip comprises a substrate, a waveguide layer and a coating layer, a plurality of optical waveguides are arranged in the waveguide layer, the optical waveguides at two ends of the planar optical waveguide chip are respectively marked as a first waveguide array and a second waveguide array, the first end of the planar optical waveguide chip and the optical fiber array have complementary shapes, optical fibers in the optical fiber array are aligned with the first waveguide array in an optical coupling mode, the second end of the planar optical waveguide chip and the silicon optical chip have complementary shapes, and waveguides in the silicon optical chip are aligned with the second waveguide array in a planar evanescent wave coupling mode. Compared with the prior art, the optical fiber array and the silicon optical chip are respectively coupled at two ends of the planar optical waveguide chip, the planar optical waveguide chip is transferred from the input waveguide with narrow distance intervals to the output waveguide with wide distance, the optical signal of the silicon optical chip can be communicated and transmitted through the optical fiber, and thus the optical signal transmission of the silicon optical chip and the optical fiber array in mode spot matching can be realized.

Description

Planar optical waveguide-optical fiber array device for silicon optical coupling

Technical Field

The invention relates to the technical field of semiconductor silicon optical chips, in particular to a planar optical waveguide-optical fiber array device for silicon optical coupling.

Background

With the continuous acceleration of the global informatization process, cloud computing, mobile internet, data centers and the like are vigorously constructed, and the coming of the datamation era makes the global market have urgent needs for bandwidth and broadband networks. Silicon-based photonic integrated chips play an important role in integrated optical communication systems due to their advantages of low cost, large bandwidth, high speed, and large capacity. However, the silicon-based photonic integrated chip has a small spot size, and is coupled with a single-mode fiber to face the problems of large coupling insertion loss, high alignment accuracy requirement and the like, which is one of the major bottlenecks that limit the industrial development of silicon light. In order to realize high-performance transmission of optical signals between a silicon-based chip and an optical fiber, a coupling device is required to build a transmission bridge of the optical signals in two media.

In the traditional optical fiber direct coupling mode, the minimum spacing of a waveguide array of a silicon-based photonic integrated chip is 127 mu m, so that the high-density integration characteristic of a silicon waveguide is difficult to fully utilize. In order to solve the problem, the planar optical waveguide chip and the silicon optical chip are coupled and packaged, so that the size and the cost of the system are basically kept unchanged. The silicon dioxide planar optical waveguide device has the advantages of low loss, high process tolerance, compatibility with a CMOS (complementary metal oxide semiconductor) process, good matching with a single-mode fiber mode field and the like, and is widely applied to the aspects of optical communication systems, optical interconnection networks, microwave photonic signal processing systems and the like. At present, the prior art adopts a spot-size conversion chip as a feasible scheme. The spot size conversion chip is a spot size transition technology, and can perform transition connection on a silicon waveguide with a smaller spot size and a single-mode optical fiber with a larger spot size so as to achieve the purpose of reducing coupling loss.

Disclosure of Invention

The present invention is directed to overcoming the above-mentioned drawbacks of the prior art and providing a planar lightwave circuit-fiber array device for silicon optical coupling.

The purpose of the invention can be realized by the following technical scheme:

the planar optical waveguide-optical fiber array device for silicon optical coupling comprises an optical fiber array, a planar optical waveguide chip and a silicon optical chip, wherein the planar optical waveguide chip comprises a substrate, a waveguide layer and a coating layer, a plurality of optical waveguides are arranged in the waveguide layer, the optical waveguides are respectively marked as a first waveguide array and a second waveguide array at two ends of the planar optical waveguide chip, the first end of the planar optical waveguide chip and the optical fiber array have complementary shapes, optical fibers in the optical fiber array are in optical coupling alignment with the first waveguide array, the second end of the planar optical waveguide chip and the silicon optical chip have complementary shapes, and waveguides in the silicon optical chip are in planar evanescent wave coupling alignment with the second waveguide array.

Preferably, at the first end of the planar optical waveguide chip, the waveguide layer and the cladding layer are aligned, the substrate is provided with a guide structure and a coupling alignment structure, the optical fiber array comprises an optical fiber fixing structure and a plurality of optical fibers, the optical fibers are fixed by the optical fiber fixing structure, the optical fiber fixing structure is matched with the guide structure, and the optical fibers are matched with the coupling alignment structure.

Preferably, the optical fiber fixing structure comprises an optical fiber base and an optical fiber pressing plate, a plurality of aligning grooves are formed in the optical fiber base, a plurality of pressing grooves are formed in the optical fiber pressing plate, the aligning grooves correspond to the pressing grooves, the optical fiber is fixed between the aligning grooves and the pressing grooves, the guide structure is a clamping groove formed in the tail end of the substrate, and the optical fiber base is matched with the clamping groove and is arranged in the clamping groove.

Preferably, two sides of the optical fiber base are provided with first fixing holes for fixing the optical fiber base and the planar optical waveguide chip together.

Preferably, the first fixing hole is used for filling optical path glue to fix the optical fiber base and the planar optical waveguide chip.

Preferably, the coupling alignment structure is arranged between the guide structure and the end face of the waveguide layer, and includes waveguide alignment grooves and array coupling grooves arranged on the substrate, the number and positions of the waveguide alignment grooves are matched with the first waveguide array, the optical fiber is pressed into the waveguide alignment grooves and then extends into the array coupling grooves, and the fiber core of the optical fiber is aligned with the optical waveguide in the first waveguide array and is coupled and packaged.

Preferably, the second end of the planar optical waveguide chip exposes the second waveguide array in the waveguide layer, the substrate, the waveguide layer and the cladding layer form a first guiding structure, the silicon optical chip comprises a chip substrate, a chip waveguide layer and a chip cladding layer, a plurality of optical waveguides are arranged in the chip waveguide layer, a third waveguide array is formed by the optical waveguides in the chip waveguide layer, the third waveguide array in the chip waveguide layer exposes, the second guiding structure is formed by the chip substrate, the chip waveguide layer and the chip cladding layer, and the first guiding structure and the second guiding structure are matched with each other.

Preferably, the substrate, the waveguide layer and the cladding layer form a stepped structure, the chip waveguide layer is aligned with the chip substrate and forms a stepped structure with the chip cladding layer, the chip waveguide layer is matched with the waveguide layer, and the second waveguide array and the third waveguide array are attached to each other and realize planar evanescent wave coupling.

Preferably, two sides of the substrate and the waveguide layer are provided with second fixing holes for fixing the silicon optical chip and the planar optical waveguide chip together.

Preferably, the second fixing hole is used for filling optical path glue to fix the silicon optical chip and the planar optical waveguide chip.

Preferably, the silicon optical chip adopts semiconductor SiO₂SiN, SiON semiconductor compound materials, etc.

Preferably, the planar optical waveguide chip is made of a semiconductor material or a polymer material.

Compared with the prior art, the invention has the following beneficial effects:

(1) the coupling tolerance is large: the coupling mode of the planar optical waveguide chip and the silicon optical chip is planar evanescent wave coupling, and only the planar optical waveguide chip and a coating layer of the silicon optical chip are required to be etched, so that a waveguide structure on the silicon optical chip can be coupled with the planar optical waveguide chip to generate evanescent waves to transmit optical signals.

(2) Easy packaging: the planar optical waveguide chip is transferred from the input waveguide with narrow distance interval to the output waveguide with wide distance interval, the two ends are respectively coupled with the optical fiber array and the silicon optical chip, and the optical signal of the silicon optical chip can be communicated and transmitted through the optical fiber, so that the optical signal transmission of the silicon optical chip and the optical fiber array for realizing the mode spot matching can be realized.

(3) The stability is good: the coupling mode of the silicon optical chip and the planar optical waveguide chip is evanescent wave coupling, the operation is simple, the planar optical waveguide chip only needs to be directly attached to the waveguide surface of the silicon optical chip, the contact area is large, the size of the whole system is not increased, the performance is reliable and stable, and the industrial development of the silicon optical technology can be realized.

Drawings

FIG. 1 is a schematic structural diagram of a fiber array-planar optical waveguide-silicon optical chip coupling structure;

FIG. 2 is a schematic structural diagram of a planar lightwave circuit chip;

FIG. 3 is a schematic structural diagram of a first end of a planar lightwave circuit chip;

FIG. 4 is a schematic structural diagram of an optical fiber array;

FIG. 5 is a schematic diagram of the coupling of an optical fiber array and a planar lightwave circuit chip;

FIG. 6 is a schematic diagram of a second end of a planar lightwave circuit chip;

FIG. 7 is a schematic structural diagram of a silicon microchip;

FIG. 8 is a side view of a fiber array-planar optical waveguide-silicon photonic chip coupling structure;

FIG. 9 is a diagram of planar evanescent wave coupling optical field assignments for a silicon optical chip and a planar lightwave chip;

FIG. 10 shows a simulation result of planar evanescent coupling between a silicon optical chip and a planar optical waveguide chip;

reference numerals are as follows: 100. the optical fiber array comprises a planar optical waveguide chip 200, an optical fiber array 300 and a silicon optical chip;

1A, a substrate, 1B, a waveguide layer, 1C, a cladding layer, 101, a guide structure, 102A-D, waveguide alignment grooves, 103, an array coupling groove, 104A-D, a first waveguide array, 105A-D, a second waveguide array, 106 and a second fixing hole;

201. the optical fiber fixing device comprises an optical fiber pressing plate 202, optical fiber bases 203A-D, optical fibers 204A-D, pressing grooves 205A-D, alignment grooves 206 and first fixing holes;

3A, a chip substrate, 3B, a chip waveguide layer, 3C, a chip cladding layer, 301A-D and a third waveguide array.

Detailed Description

The invention is described in detail below with reference to the figures and the specific embodiments. The present embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and a specific operation process are given, but the scope of the present invention is not limited to the following embodiments.

In the drawings, elements that are structurally identical are represented by like reference numerals, and elements that are structurally or functionally similar in each instance are represented by like reference numerals. The size and thickness of each component shown in the drawings are arbitrarily illustrated, and the present invention is not limited to the size and thickness of each component. Parts are exaggerated in the drawing where appropriate for clarity of illustration.

Example 1:

a planar optical waveguide-optical fiber array device for silicon optical coupling, as shown in FIG. 1, includes an optical fiber array 200, a planar optical waveguide chip 100 and a silicon optical chip 300. The planar optical waveguide chip 100 includes a substrate 1A, a waveguide layer 1B and a cladding layer 3C, a plurality of optical waveguides are provided in the waveguide layer 1B, the silicon optical chip 300 includes a chip substrate 3A, a chip waveguide layer 3B and a chip cladding layer 3C, and a plurality of optical waveguides are provided in the chip waveguide layer 3B.

The structure of a Planar Lightwave Circuit (PLC) is shown in fig. 2, optical waveguides at two ends of the Planar Lightwave Circuit 100 are respectively marked as a first waveguide array 104 and a second waveguide array 105, a first end of the Planar Lightwave Circuit 100 is an array optical fiber coupling area and has a complementary shape with the optical fiber array 200, an optical fiber 203 in the optical fiber array 200 is optically coupled and aligned with the first waveguide array 104, a second end of the Planar Lightwave Circuit 100 is a Planar evanescent coupling area and has a complementary shape with the silicon optical chip 300, and a waveguide in the silicon optical chip 300 is aligned with the Planar evanescent coupling of the second waveguide array 105.

(1) First, the coupling between the planar optical waveguide chip 100 and the optical fiber array 200 is as follows:

as shown in fig. 3, at the first end of the planar lightwave circuit chip 100, the waveguide layer 1B is aligned with the cladding layer 3C, the substrate 1A is provided with a guiding structure 101 and a coupling alignment structure, the guiding structure 101 is a card slot disposed at the end of the substrate 1A, the width of the card slot is L1, the coupling alignment structure is disposed between the guiding structure 101 and the end surface of the waveguide layer 1B, and includes a waveguide alignment slot 102 and an array coupling slot 103 disposed on the substrate 1A, and the number and the position of the waveguide alignment slot 102 are matched with the first waveguide array 104.

As shown in fig. 4, the optical fiber array 200 includes an optical fiber fixing structure and a plurality of optical fibers 203, the optical fibers 203 are fixed by the optical fiber fixing structure, the optical fiber fixing structure is matched with the guiding structure 101, the optical fibers 203 are matched with the coupling alignment structure, specifically, the optical fiber fixing structure includes an optical fiber base 202 and an optical fiber pressing plate 201, a plurality of alignment grooves 205 are arranged on the optical fiber base 202, a plurality of pressing grooves 204 are arranged on the optical fiber pressing plate 201, the alignment grooves 205 and the pressing grooves 204 correspond to each other, and the optical fibers 203 are fixed between the alignment grooves 205 and the pressing grooves 204.

The width of the optical fiber base 202 is S2, which is adapted to the size of the card slot, when the planar optical waveguide chip 100 is coupled to the optical fiber array 200, the optical fiber base 202 is adapted to the card slot and is placed in the card slot, the optical fiber 203 is pressed into the waveguide alignment slot 102 and then extends into the array coupling slot 103, the fiber core of the optical fiber 203 is aligned to the optical waveguide in the first waveguide array 104, and the high-power coupling effect is achieved. First fixing holes 206 are formed in two sides of the optical fiber base 202, the first fixing holes 206 are used for filling optical path glue to fix the optical fiber base 202 and the planar optical waveguide chip 100, and the optical fiber array 200 is coupled with the planar optical waveguide chip 100 as shown in fig. 5.

(2) After being coupled with the optical fiber array 200, the planar optical waveguide chip 100 is coupled with the silicon optical chip 300 as follows:

as shown in fig. 6, at the second end of the planar optical waveguide chip 100, the second waveguide array 105 in the waveguide layer 1B is exposed, the substrate 1A, the waveguide layer 1B and the cladding layer 3C form a first guiding structure, as shown in fig. 7, the optical waveguides in the chip waveguide layer 3B form a third waveguide array 301, the third waveguide array 301 in the chip waveguide layer 3B is exposed, the chip substrate 3A, the chip waveguide layer 3B and the chip cladding layer 3C form a second guiding structure, and the first guiding structure and the second guiding structure are matched with each other.

When the planar optical waveguide chip 100 and the silicon optical chip 300 are coupled, the coating layer corresponding to the planar evanescent wave coupling area is ground or etched to reduce the thickness of the coating layer integrally, so that the reserved thickness of the coating layer can meet the condition of evanescent wave coupling, then the reserved coating layer is etched continuously, the waveguide structures in the chips are exposed, the waveguide structures on the two chips can generate evanescent wave coupling, and meanwhile, alignment guide structures with complementary shapes are respectively processed in the coating layer areas above the waveguide structures of the silicon optical chip 300 and the planar optical waveguide chip 100 in the etching process.

In this embodiment, the substrate 1A, the waveguide layer 1B, and the cladding layer 3C form a step-shaped structure as the first guide structure, the chip waveguide layer 3B is aligned with the chip substrate 3A and forms a step-shaped structure with the chip cladding layer 3C as the second guide structure, the chip waveguide layer 3B is matched with the waveguide layer 1B, and the second waveguide array 105 and the third waveguide array 301 are attached to each other and implement planar evanescent coupling. Second fixing holes 106 are formed at both sides of the substrate 1A and the waveguide layer 1B, and the second fixing holes 106 are used for filling optical path glue to fix the silicon optical chip 300 and the planar optical waveguide chip 100. In other embodiments, the guiding structure may also be configured as a guiding groove and a guiding strip, which may be rectangular, trapezoidal, and is not limited to any shape.

In the present embodiment, a four-waveguide structure is described as an example, but the number of waveguides in the silicon optical chip 300, optical waveguides in the planar optical waveguide chip 100, and optical fibers 203 in the optical fiber array 200 is not limited to the four-waveguide structure, and may be any number. It should be noted that, the waveguide interval on the silicon optical chip 300 is in the order of hundreds of nanometers, and the fiber interval in the fiber array 200 may be 127 μm at the minimum, and through the planar optical waveguide chip 100, the optical waveguide interval of the first waveguide array 104 is in interval fit with the fiber of the fiber array 200, and the optical waveguide interval of the second waveguide array 105 is in interval fit with the waveguide of the silicon optical chip 300, so that the silicon optical chip 300 and the fiber array 200 can realize optical signal transmission with mode spot matching.

The silicon optical chip 300 adopts semiconductor SiO₂SiN, SiON semiconductor compound material, etc., and the planar optical waveguide chip 100 is made of semiconductor material or polymer material, etc.

In this embodiment, the coupling of the optical fiber array-planar optical waveguide-silicon optical chip structure is as follows:

(1) respectively preparing a planar optical waveguide chip 100, a silicon optical chip 300 and an optical fiber array 200;

the optical fibers in the optical fiber array 200 are 203A, 203B, 203C and 203D, the pressing grooves on the optical fiber pressing plate 201 are 204A, 204B, 204C and 204D, the alignment grooves on the optical fiber base 202 are 205A, 205B, 205C and 205D, the optical fibers are placed in the alignment grooves on the optical fiber base 202, and the optical fiber pressing plate 201 is pressed, so that the optical fibers 203 are fixed, and the shapes of the pressing grooves 204 and the alignment grooves 205 are not limited and can be various shapes such as rectangular, trapezoidal and the like;

the waveguides in the silicon optical chip 300 are 301A, 301B, 301C and 301D in sequence, namely a third waveguide array 301, and the width of the output waveguide is 220 nm;

the width and height of the optical waveguide in the planar optical waveguide chip 100 are respectively 7 μm and 7 μm, the output waveguides at the first end are respectively 104A, 104B, 104C and 104D, i.e. the first waveguide array 104, and the output waveguides can be an array with a minimum interval of 127 μm, and correspond to the optical fibers 203 in the optical fiber array 200; the input waveguides at the second end are respectively 105A, 105B, 105C and 105D, that is, the second waveguide array 105, the input waveguides correspond to the four output waveguides of the silicon optical chip 300 at the same interval, and evanescent coupling is adopted.

(2) Etching the cladding layers on the planar evanescent wave coupling areas of the planar optical waveguide chip 100 and the silicon optical chip 300 to enable the waveguide structures on the chips to generate evanescent wave coupling; in addition, in the etching process, alignment guide structures are respectively processed in the cladding layer areas above the waveguide structures of the planar optical waveguide and the chip silicon optical chip 300;

(3) the planar optical waveguide chip 100 and the optical fiber array 200 are optically coupled, the optical fiber array 200 is aligned with the waveguide alignment groove 102 on the planar optical waveguide chip 100 to realize a high-power coupling effect, and the optical fiber array 200 and the planar optical waveguide chip 100 are fixed by glue;

when the optical fiber base 202 is positioned in the card slot, the width and height of the optical fiber alignment groove 205 are consistent with those of the waveguide alignment groove 102, the alignment grooves 205A, 205B, 205C, and 205D are aligned with the waveguide alignment grooves 102A, 102B, 102C, and 102D, the optical fibers 203A, 203B, 203C, and 203D are pressed into the waveguide alignment grooves 102A, 102B, 102C, and 102D, respectively, and the centers of the optical fibers 203A, 203B, 203C, and 203D are optically aligned with the centers of the first waveguide arrays 104A, 104B, 104C, and 104D, respectively, so as to realize optical coupling and output, and the optical fibers are fixed by the first fixing holes 206.

(4) The planar optical waveguide chip 100 and the alignment guide structure on the silicon optical chip 300 are bonded and coupled and fixed by glue, so as to realize evanescent coupling.

Evanescent wave coupling of the silicon optical chip 300 and the planar optical waveguide chip 100 can be packaged only by end face fitting, and a waveguide layer with the length of W2 and the height of H2 is arranged in a coupling area of the silicon optical chip 300; the second waveguide array 105 is coupled with evanescent waves, the waveguide layer 1B with the length of W1 and the height of H1 is arranged in the coupling area of the planar optical waveguide chip 100, the chip waveguide layer 3B is matched with the waveguide layer 1B, and the second waveguide arrays 105A, 105B, 105C and 105D are attached to the third waveguide arrays 301A, 301B, 301C and 301D, so that the chip is fixed through the second fixing holes 106 after the evanescent wave coupling is realized.

Therefore, the whole system realizes the communication connection and the optical transmission between the silicon optical chip 300 and the optical fiber 203, and has the characteristics of easy packaging, large alignment tolerance, good stability, easy implementation and the like.

As shown in fig. 8, the planar optical waveguide chip 100 is integrated with the optical fiber array 200, and then coupled to the silicon optical chip 300, the planar optical waveguide chip 200 is converted from an input waveguide with a narrow distance interval to an output waveguide with a wide distance interval, so as to realize the conversion output of the silicon optical chip 300 and the optical fiber array 200.

In an embodiment of the disclosure, a planar evanescent coupling optical field pattern of the silicon optical chip 300 and the planar optical waveguide chip 100 is shown in fig. 9, and waveguide energy in the silicon optical chip 300 can be well coupled to a waveguide in the planar optical waveguide chip 100. Fig. 10 shows the coupling loss of planar evanescent waves when optical signals are transmitted to or from the silicon optical chip 300 in the Transverse Electric (TE) mode and the Transverse Magnetic (TM) mode, as a result of simulation of coupling of planar evanescent waves between the silicon optical chip 300 and the planar optical waveguide chip 100. As shown in fig. 10, as the offset in the X-axis increases, the coupling loss increases.

The foregoing detailed description of the preferred embodiments of the invention has been presented. It should be understood that numerous modifications and variations can be devised by those skilled in the art in light of the above teachings. Therefore, the technical solutions that can be obtained by a person skilled in the art through logical analysis, reasoning or limited experiments based on the prior art according to the concepts of the present invention should be within the scope of protection determined by the claims.

Claims (10)

1. The planar optical waveguide-optical fiber array device for silicon optical coupling is characterized by comprising an optical fiber array, a planar optical waveguide chip and a silicon optical chip, wherein the planar optical waveguide chip comprises a substrate, a waveguide layer and a coating layer, a plurality of optical waveguides are arranged in the waveguide layer, the optical waveguides at two ends of the planar optical waveguide chip are respectively marked as a first waveguide array and a second waveguide array, the first end of the planar optical waveguide chip and the optical fiber array have complementary shapes, optical fibers in the optical fiber array are in optical coupling alignment with the first waveguide array, the second end of the planar optical waveguide chip and the silicon optical chip have complementary shapes, and waveguides in the silicon optical chip are in planar evanescent coupling alignment with the second waveguide array.

2. The device of claim 1, wherein the waveguide layer and the cladding layer are aligned at the first end of the planar lightwave circuit chip, the substrate has a guiding structure and a coupling alignment structure, the fiber array comprises a fiber fixing structure and a plurality of optical fibers, the plurality of optical fibers are fixed by the fiber fixing structure, the fiber fixing structure is matched with the guiding structure, and the optical fibers are matched with the coupling alignment structure.

3. The device of claim 2, wherein the optical fiber fixing structure comprises an optical fiber base and an optical fiber pressing plate, the optical fiber base is provided with a plurality of alignment grooves, the optical fiber pressing plate is provided with a plurality of pressing grooves, the alignment grooves and the pressing grooves correspond to each other, the optical fiber is fixed between the alignment grooves and the pressing grooves, the guiding structure is a clamping groove arranged at the end of the substrate, and the optical fiber base is matched with the clamping groove and is arranged in the clamping groove.

4. The device as claimed in claim 3, wherein the optical fiber base has first fixing holes at two sides thereof for fixing the optical fiber base and the planar optical waveguide chip together.

5. The device as claimed in claim 4, wherein the first fixing hole is filled with an optical path glue to fix the optical fiber base and the planar optical waveguide chip.

6. The device of claim 2, wherein the coupling alignment structure is disposed between the guiding structure and the end surface of the waveguide layer, and comprises a waveguide alignment groove and an array coupling groove disposed on the substrate, the number and position of the waveguide alignment grooves are matched with the first waveguide array, the optical fiber is pressed into the waveguide alignment groove and then extends into the array coupling groove, and the core of the optical fiber is aligned with the optical waveguide in the first waveguide array and coupled and packaged.

7. The device as claimed in claim 1, wherein at the second end of the planar optical waveguide chip, the second waveguide array in the waveguide layer is exposed, the substrate, the waveguide layer and the cladding layer form a first guiding structure, the silicon optical chip comprises a chip substrate, a chip waveguide layer and a chip cladding layer, the chip waveguide layer is provided with a plurality of optical waveguides, the optical waveguides in the chip waveguide layer form a third waveguide array, the third waveguide array in the chip waveguide layer is exposed, the chip substrate, the chip waveguide layer and the chip cladding layer form a second guiding structure, and the first guiding structure and the second guiding structure are matched with each other.

8. The device as claimed in claim 7, wherein the substrate, the waveguide layer and the cladding layer form a step structure, the chip waveguide layer is aligned with the chip substrate and forms a step structure with the chip cladding layer, the chip waveguide layer is matched with the waveguide layer, and the second waveguide array and the third waveguide array are attached to realize planar evanescent coupling.

9. The device of claim 8, wherein the substrate and the waveguide layer are provided with second fixing holes at two sides for fixing the silicon optical chip and the planar optical waveguide chip together.

10. The device of claim 9, wherein the second fixing hole is used for filling optical path glue to fix the silicon optical chip and the planar optical waveguide chip.

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