CN114765924B - electronic device - Google Patents

Abstract

The invention discloses an electronic device which comprises a supporting plate, an electric plate and a plurality of electronic units. The supporting plate is provided with a circuit layer. The electric plate is provided with a plate body, a plurality of through holes penetrating through the plate body, an electric layer arranged on the plate body, and a plurality of main conductive pieces respectively arranged on the through holes, wherein the plate body defines a corresponding first surface and a corresponding second surface, the through holes are communicated with the first surface and the second surface of the plate body, and the main conductive pieces are electrically connected with the electric layer to a circuit layer of the supporting plate. The electronic units are arranged on the first surface of the plate body, each electronic unit and one of the through holes are partially overlapped along the projection direction of the electric plate, and each electronic unit is provided with an electronic component and a secondary conductive piece which is electrically connected with the electronic component to the electric layer; the secondary conductive elements of the electronic units and the main conductive elements of the electric plate are arranged in a staggered mode along the projection direction of the electric plate.

Description

electronic device

Technical field

The present invention relates to an electronic device, and in particular to an electronic device that is different from traditional electrical connection technology.

Background technique

In the field of manufacturing electronic devices, Surface Mount Technology (SMT) is a technology that solders electronic components to the surface of, for example, a Printed Circuit Board (PCB). Using surface mount technology It can greatly reduce the size of electronic products and achieve the purpose of being lighter, thinner and shorter.

Traditionally, the soldering of electronic components (such as surface mount components) to the contacts of the circuit board is mainly done through solder paste. As long as the solder paste is printed on the soldering pads of the components to be soldered on the circuit board (or pad), and then place the electronic parts on the pads so that the solder legs of the electronic parts correspond to the position of the solder paste, and then pass the high-temperature reflow furnace to melt the solder paste into a liquid, and the liquid solder paste will coat the electronics The soldering feet of the parts can be soldered to the circuit board after cooling.

Contents of the invention

The object of the present invention is to provide an electronic device that is different from traditional electrical connection technology.

To achieve the above object, an electronic device according to the present invention includes a support plate, an electrical board and a plurality of electronic units. The support board is provided with a circuit layer; the electrical board has a board body, a plurality of through holes passing through the board body, an electrical layer arranged on the board body, and a plurality of main conductive components respectively provided in these through holes. The definition of the board body Corresponding to the first side and the second side, these through holes connect the first side and the second side of the board body, and these main conductive components electrically connect the electrical layer to the circuit layer of the support board; these electronic units are arranged on the board body. On the first side, each electronic unit partially overlaps one of the through holes along the projection direction of the electrical board. Each electronic unit has an electronic component and a sub-conductive component that electrically connects the electronic component to the electrical layer; wherein, these The secondary conductive parts of the electronic unit and the main conductive parts of the electrical plate are disposed in an offset manner along the projection direction of the electrical plate.

In one embodiment, each electronic unit has multiple corners, and one corner of each electronic unit is covered by one of the through holes along the projection direction of the electrical board.

In one embodiment, each electronic unit has a plurality of corners, and one of the through holes covers one of the corners of the electronic units along the projection direction of the electrical board.

In one embodiment, these electronic units are a plurality of electronic structures, each electronic structure has a carrier board, and the electronic components are arranged on the carrier board.

In one embodiment, the electronic units constitute an electronic structure, the electronic structure has a carrier board, and the electronic components of the electronic units are disposed on the carrier board.

In one embodiment, the electronic units are arranged in an mxn matrix and cover at least one of the through holes along the projection direction of the electrical board, where m and n may be equal or unequal positive integers.

In one embodiment, these electronic units are arranged in a 2x2 matrix.

In one embodiment, the number of sub-conductive parts of each electronic unit is multiple, and each sub-conductive part is electrically connected to the corresponding electronic component to the electrical layer.

In one embodiment, each electronic unit has multiple electronic components.

In one embodiment, the electronic component is a micro-optoelectronic chip.

In one embodiment, the electronic component is a drive component.

In one embodiment, the electrical board further includes a plurality of driving components, and the driving components respectively correspond to the electronic components of the electronic units.

In one embodiment, the number of electrical boards is multiple.

In one embodiment, the carrier board is a rigid board, a flexible board, or a composite board.

In one embodiment, the carrier plate is a transparent plate.

In one embodiment, the ratio of the projected area of the electronic unit to the projected area of the electronic component is not less than 5.

In one embodiment, the electronic component defines a component width of no greater than 80 mils.

In one embodiment, the electronic component defines a component width of no greater than 12 mils.

In one embodiment, the electronic component defines a component width of no less than 0.005 mm.

In one embodiment, the carrier board defines a working surface with electronic components and a connection surface corresponding to the working surface. The carrier board has a conductive layer and a through hole connecting the working surface and the connection surface. The sub-conductive member is electrically connected to the conductor through the through hole. layer to the electrical layer of the electrical board.

In one embodiment, the boards of the support board and the electrical board are rigid boards, flexible boards, or composite boards respectively.

In one embodiment, the supporting board and/or the board body of the electrical board is a transparent board.

To achieve the above object, an electronic device according to the present invention includes a support plate, an electrical board and a plurality of electronic units. The support board is provided with a circuit layer; the electrical board has a board body, an electrical layer arranged on the board body, and a plurality of main conductive components electrically connected to the electrical layers respectively; wherein the board body defines a corresponding first surface and a third On both sides, the main conductive component electrically connects the conductive layer to the circuit layer of the support board; the electronic units are arranged on the first side of the board, and each electronic unit partially overlaps with one of the main conductive components along the projection direction of the conductive board. ; Wherein, each electronic unit has an electronic component, and a sub-conductive component that electrically connects the electronic component to the electrical layer; wherein, the sub-conductive component of the electronic unit and the main conductive component of the electrical board are disposed in a misaligned manner along the projection direction of the electrical board. .

In one embodiment, the electronic unit is a surface mount component.

In one embodiment, each electronic unit has multiple corners, and one corner of each electronic unit is covered by one of the main conductors along the projection direction of the conductive plate.

In one embodiment, each electronic unit has a plurality of corners, and one of the main conductors covers one of the corners of the plurality of electronic units along the projection direction of the conductive plate.

In one embodiment, the electronic unit is a plurality of electronic structures, each electronic structure has a carrier board, and the electronic components are arranged on the carrier board.

In one embodiment, the electronic component is a micro-optoelectronic chip.

In one embodiment, the electronic unit further includes an encapsulation layer covering the electronic components.

In one embodiment, the electronic unit constitutes an electronic structure, the electronic structure has a carrier board, and the electronic components of the electronic unit are arranged on the carrier board.

In one embodiment, the electronic units are arranged in an mxn matrix and cover at least one main conductor along the projection direction of the electrical plate, where m and n may be equal or unequal positive integers.

In one embodiment, the electronic units are arranged in a 4x4 matrix.

In one embodiment, the number of sub-conductive parts of each electronic unit is multiple, and each sub-conductive part is electrically connected to the corresponding electronic component to the electrical layer.

In one embodiment, the secondary conductive component of each electronic unit is a solder ball.

In one embodiment, the electrical board further includes a plurality of driving components, and the driving components respectively correspond to electronic components of the electronic unit.

In one embodiment, the driving component is a thin film transistor or an integrated circuit.

As mentioned above, in the electronic device of the present invention, the electrical layer of the electrical board is electrically connected to the circuit layer of the support board through the main conductive component, and the electronic unit is electrically connected to the conductive layer of the carrier board and the electrical board through the secondary conductive component. electrical layer; these electronic units are arranged on the first surface of the board body of the electrical board, and each electronic unit partially overlaps with one of the main conductive components of the electrical board along the projection direction of the electrical board; and these The structural design of the secondary conductive elements of the electronic unit and the main conductive elements of the electrical plate are staggered along the projection direction of the electrical plate, making the electronic device of the present invention an electronic product that is different from traditional electrical connection technology.

Description of drawings

FIG. 1A is a partial schematic diagram of an electronic device according to an embodiment of the present invention.

FIG. 1B is a partially exploded schematic view of the electronic device of FIG. 1A .

FIG. 1C is a schematic cross-sectional view of the electronic device of FIG. 1A taken along the cutting plane line 1C-1C.

2 to 4 are partial schematic diagrams of electronic devices according to different embodiments of the present invention.

FIG. 5A is a partial schematic diagram of an electronic device according to another embodiment of the invention.

FIG. 5B is a partially exploded schematic view of the electronic device of FIG. 5A .

FIG. 5C is a schematic cross-sectional view of the electronic device of FIG. 5A taken along line 5C-5C.

Detailed ways

Electronic devices according to some embodiments of the present invention will be described below with reference to relevant drawings, where the same components will be described with the same reference numerals.

Please refer to FIGS. 1A to 1C , wherein FIG. 1A is a partial schematic view of an electronic device according to an embodiment of the present invention, FIG. 1B is a partial exploded schematic view of the electronic device of FIG. 1A , and FIG. 1C is a partial schematic view of the electronic device of FIG. 1A , a schematic cross-sectional view along the 1C-1C cut plane line. The electronic device in this embodiment may be an active matrix (AM) electronic device or a passive matrix (PM) electronic device, and is not limited thereto.

The electronic device 1 of this embodiment includes a support plate 11 , an electrical board 12 and a plurality of electronic units 13 . The electrical board 12 is disposed on the support plate 11; these electronic units 13 are disposed on the electrical board 12. In some embodiments, the electrical board 12 is, for example, but not limited to, disposed on the support plate 11 in a glued manner (the two are bonded by insulating glue), and is electrically connected to the support plate 11; in some embodiments, these electronic units 13 is, for example, but not limited to, disposed on the electrical board 12 by gluing (the two are bonded by insulating glue), and is electrically connected to the electrical board 12 .

In addition to its supporting function, the support plate 11 is also provided with a circuit layer 111 (Fig. 1C) for electrical connection. The circuit layer 111 may be located on the surface facing the electrical board 12 and/or away from the electrical board 12 . Here, the circuit layer 111 is located on the surface facing the electrical board 12 as an example. In some embodiments, the circuit layer 111 includes a conductive layer or wire that transmits conductive signals, so that the support board 11 can serve as a driving circuit board for driving these electronic units 13 . The support board 11 can be a rigid board, a flexible board, or a composite board, without limitation.

The electrical board 12 has a board body 121 , a plurality of through holes H1 , an electrical layer 122 and a plurality of main conductive components 123 . The plate body 121 defines corresponding first surface S1 and second surface S2. These through holes H1 penetrate the plate body 121 and connect the first surface S1 and the second surface S2 of the plate body 121. Here, the second surface S2 of the plate body 121 faces the support plate 11 . The electrical layer 122 in this embodiment includes a conductive layer that transmits conductive signals, and is arranged (but not limited to) on the first surface S1 of the board 121 . The main conductive members 123 are respectively disposed in the through holes H1 of the conductive plate 12 and slightly protrude from the through holes H1 , and the main conductive members 123 electrically connect the conductive layer 122 to the circuit layer 111 of the support plate 11 . In other words, the electrical layer 122 of the electrical board 12 is electrically connected to the circuit layer 111 of the support plate 11 below through the main conductive component 123 located in the through hole H1, so that through the conductive layer 122, the main conductive component 123 And the circuit layer 111 transmits electrical signals. Wherein, the plate body 121 usually has a uniform thickness, but it is not limited; when the thickness of the plate body 121 is uneven, the thickness is defined as the minimum thickness of the plate body 121 itself. In addition, the material of the circuit layer 111 and/or the electrical layer 122 may include, for example, metals such as gold, copper, or aluminum, or any combination thereof, or an alloy of any combination, or other conductive materials. In some embodiments, the holes of these through holes H1 can be further electroplated, electroplated or evaporated. In some embodiments, the board bodies 121 of the support board 11 and the electrical board 12 may be rigid boards, flexible boards, or composite boards respectively; when the board bodies 121 of the support board 11 and the electrical board 12 are both flexible boards, The electronic device 1 can be made into a rollable and flexible electronic device, which is easy to store. In some embodiments, the support board 11 and/or the board body 121 of the electrical board 12 may be a transparent board or a non-transparent board; when the support board 11 and the board body 121 of the electrical board 12 are respectively transparent boards, they may be The electronic device 1 becomes a transparent electronic product, such as but not limited to a transparent display; the support plate 11 and the board body 121 of the electrical board 12 respectively have the characteristics of transparent and flexible boards, and can achieve two-way light transmission. For example, when the electronic unit 13 The electronic component is Mini LED or Micro LED, etc., and the electronic device 1 can become a bidirectional light-transmitting flexible light source or flexible display.

These electronic units 13 are arranged on the first surface S1 of the board 121 , and each electronic unit 13 partially overlaps with one of the through holes H1 along the projection direction of the electrical board 12 ( FIG. 1A ). Here, the projection direction of the electrical board 12 is a direction perpendicular to the first surface S1 of the board body 121 . In this embodiment, every four electronic units 13 share one through hole H1 , and each of the four electronic units 13 partially overlaps with the through hole H1 along the projection direction of the electrical board 12 . It is worth noting that each electronic unit 13 has multiple corners, and at least one corner of one of the electronic units 13 is covered by one of the through holes H1 along the projection direction of the electrical board 12 . In some embodiments, one corner of each electronic unit 13 is covered by one of the through holes H1 along the projection direction of the electrical board 12 (that is, one corner of each electronic unit 13 is covered along the projection direction of the electrical board 12 One of the through holes H1). It is worth noting that at least one of the through holes H1 covers a corresponding corner of the plurality of electronic units 13 along the projection direction of the electrical board 12 . In some embodiments, the electronic units 13 may be, for example, rectangular in the projection direction, and may be arranged in an mxn matrix, where m and n may be equal or unequal positive integers, and the electronic units 13 may be arranged along the electrical board. This projection direction of 12 covers at least one through-hole H1 of these through-holes H1. In this embodiment, the four electronic units 13 are arranged in a 2x2 matrix and cover one through hole H1 as an example. In some embodiments, these electronic units 13 may also be arranged in a 4x4 matrix and cover one through hole H1, which is not limited by the present invention. In different embodiments, these electronic units 13 can also be arranged in other ways, such as a one-dimensional matrix arrangement or an irregular arrangement, which is not limited. It can be understood that the configuration and number of angles of each electronic unit 13 are arbitrary, and the angles defined in each unit 13 can also extend to the geometric center or mass center of each electronic unit 13 . In this embodiment, the electronic unit 13 has four corners. One corner of the four electronic units 13 corresponds to one of the through holes H1 along the projection direction of the electrical board 12 and is covered by the corresponding through hole H1 .

It should be noted that there is a gap between two adjacent carrier boards 133 shown in FIG. 1A . It can be understood that in actual operation, the two adjacent carrier boards 133 can be tightly connected without gaps or gaps. The distance between two adjacent electronic units 13 on two adjacent carrier boards 133 is equivalent to the distance between two adjacent electronic units 13 on the same carrier board 133 . Therefore, the overall size of the electronic device 1 can be reduced. , improve the layout density of the electronic units 13 on the electronic device 1, or make the spliced carrier board 133 have visual consistency, and other advantages.

Each electronic unit 13 has at least one electronic component 131 and at least one sub-conductive component 132. The sub-conductive component 132 enables the electronic component 131 to be electrically connected to the electrical layer 122 of the electrical board 12. That is to say, the electronic component 131 is connected through the sub-conductive component 132. The conductive member 132 is electrically connected to the electrical layer 122 of the electrical plate 12 . In this embodiment, each electronic unit 13 has multiple electronic components 131 and sub-conductive members 132 , and each sub-conductive member 132 can electrically connect the corresponding electronic component 131 to the electrical layer 122 . In other words, each An electronic component 131 can be electrically connected to the electrical layer 122 of the electrical board 12 through the corresponding sub-conductive member 132 . In some embodiments, the material of the primary conductive member 123 or the secondary conductive member 132 may include, but is not limited to, solder paste, copper paste, silver paste, or a combination thereof.

In some embodiments, the electronic component 131 may be a millimeter- or micron-scale optoelectronic chip or optoelectronic package. In some embodiments, the electronic component 131 may include, for example, but not limited to, at least one LED chip, Mini LED chip, MicroLED chip, Micro sensing chip. sensor chip) or at least one package, or an optoelectronic chip or optoelectronic package with no size limit of millimeter, micron or below. Among them, millimeter-level packages can include micron-level chips. In some embodiments, the electronic unit 13 may include one optoelectronic chip or package, whereby the electronic unit 13 may be understood as a single pixel; in some embodiments, the electronic unit 13 may include multiple optoelectronic chips or packages, and may It is understood that the electronic unit 13 includes a plurality of pixels. In some embodiments, the electronic unit 13 may include LEDs, MiniLEDs, or MicroLED chips such as red, blue, or green, or LEDs, MiniLEDs, or MicroLED chips or packages of other colors. When the three electronic components 131 (optoelectronic chips or packages) of the electronic unit 13 are red, blue and green LED, Mini LED or Micro LED chips respectively, a full-color LED, Mini LED or micro LED display can be formed. The aforementioned chip can be a horizontal electrode, a flip-chip electrode, or a vertical electrode die, and is electrically connected to the electrode by wire bonding or flip chip bonding. It can be understood that when the electronic components 131 are optoelectronic chips, each electronic unit 13 further includes a packaging layer (not shown) that arranges the electronic components 131 in a continuous or discontinuous manner and can isolate external moisture and dirt. ) is understandable. The aforementioned packages are not limited to packages with active components or passive packages without active components. Active components include, but are not limited to, thin film transistors (TFTs), or silicon or non-silicon integrated circuits (Silicon IC or non-Silicon IC). . In some embodiments, the electronic device 1 may further include one or more active components such as but not limited to thin film transistors (TFTs) or silicon semiconductor-based components corresponding to at least one of the aforementioned electronic components 131 . In some embodiments, the electronic component 131 itself can also be a driving component, which can include at least one thin film transistor (TFT) or a silicon (or non-silicon) semiconductor-based integrated circuit (IC) to drive other components. Component or package.

As shown in FIG. 1A , the four electronic units 13 of this embodiment are four electronic structures. Each electronic structure has a carrier board 133 , and the electronic components 131 are provided on the carrier board 133 . In other words, four independent electronic structures (electronic units 13) are spliced and arranged in a 2x2 matrix. Therefore, if a certain electronic unit is found to be faulty, it can be installed (for example, attached) to the electrical board 12 before The faulty electronic unit is eliminated and replaced with a good electronic unit. Therefore, the fault repair is very easy. Therefore, the electronic device 1 can achieve a high process yield. The present invention integrates the electronic component 131 into the form of an electronic unit. When an electronic component fails, only the electronic unit where the failed electronic component is located needs to be eliminated, rather than the entire electronic device 1; in addition, the present invention The invention is applicable to electronic components at the micron level or below, so that the electronic unit can have a size of micron level or above that can detect electrical properties, but is not limited to this. The above-mentioned carrier board 133 may be a rigid board, a flexible board, or a composite board. In some embodiments, the carrier plate 133 can be a transparent plate or a non-transparent plate, which is not limited by the present invention.

In some embodiments, the aforementioned electronic structures (for example, but not limited to) include active components (and/or integrated components thereof) such as thin film transistors (TFTs) or silicon (or non-silicon) integrated circuits (Silicon ICs). devices, or passive components including capacitors, resistors, inductors, conductors, encoders, potentiometers, antennas, transformers, filters, attenuators, couplers, oscillators, radio frequency components or microwave (or millimeter wave) components ( and/or its integrated components) and other passive components.

Please refer to FIG. 1C , each carrier board 133 defines a working surface S3 where the electronic components 131 are arranged, and a connecting surface S4 corresponding to the working surface S3; the carrier board 133 has a conductive layer 1331, and connects the working surface S3 and the connecting surface S4. of perforation H2. Here, the conductive layer 1331 is located on the working surface S3 and may include thin film circuits, for example. In addition, the through hole H2 is a hole that passes through the carrier board 133 and the conductive layer 1331, and the sub-conductive member 132 is provided in the through hole H2 and protrudes outward, and covers part of the conductive layer 1331 outside the through hole H2, so that the sub-conductive member 132 can pass through the through hole H2. The conductive layer 1331 is electrically connected to the electrical layer 122 of the electrical plate 12 . In other words, the electronic component 131 is electrically connected to the electrical layer 122 of the electrical board 12 through the conductive layer 1331 of the carrier board 133 and the sub-conductive element 132 located in the through hole H2 (and the conductive layer 1331). In some embodiments, the electrical board 12 may further include a plurality of driving components (not shown). These driving components may respectively correspond to the electronic components 131 of the electronic unit 13 to correspond to the electronic components 131 of the driving electronic unit 13 . . Here, the driving component of the electrical board 12 can be provided on the first surface S1 and/or the second surface S2 of the board body 121, without limitation. In addition, in some embodiments, since the electrical layer 122 of the electrical board 12 can be electrically connected to the circuit layer 111 of the support board 11 through the main conductor 123 located in the through hole H1, the support board 11 can include multiple Driving components (not shown), these driving components of the support plate 11 can correspond to the electronic components 131 of the driving electronic unit 13 through the electrical board 12 . In addition, in some embodiments, the driving component can also be provided on the carrier board 133 of the electronic unit 13 to drive the corresponding electronic component 131 . The aforementioned driving component may include at least one thin film transistor (TFT) or silicon (or non-silicon) semiconductor-based integrated circuit (IC). In some embodiments, in addition to thin film transistors, the driving components may also include other thin film components or circuits, such as thin film resistors, capacitors, or insulating film layers. This is not limited and depends on the driving method of the electronic component 131 . It can be understood that since the driving components of the support plate 11 or the active components of the electronic unit 13 both have active driving characteristics, they can be understood as electronic components with the same function, or the driving components are electronic components that can cover active components. The electronic device 1 You can choose to provide multiple driving components (corresponding to these electronic units 13) on the support plate 11, or provide one or more active components (corresponding to these electronic components 131 in this embodiment) on each electronic unit 13; of course, in order to achieve It is not limited to arrange corresponding driving components or active components on the support plate 11 and the electronic unit 13 at the same time for a specific purpose. It can also be understood that when the driving component or the active component is applied to the support board 11 or the electronic unit 13, the circuit layer 111 on the support board 11 provides a simple transmission of current, which does not conflict with the foregoing embodiments.

In different embodiments, the carrier board 133 may have a conductive layer 1331 and a through hole connecting the working surface S3 and the connection surface S4, but the through hole is closed by the conductive layer 1331 or a conductive pad extending from the conductive layer 1331 (not shown in the figure) (shown); the secondary conductive member 132 is also disposed in the through hole. In other words, when the carrier board 133 is viewed from the upper side of the carrier board 133, the through holes may or may not be covered by the conductive layer 1331, and the sub-conductive members 132 in the through holes may be electrically connected to the conductive layer 1331; in this embodiment , the conductive layer 1331 covers the through hole and the sub-conductive member 132 . In addition, in some embodiments, in addition to the conductive layer 1331 , the carrier board 133 may also include a plurality of signal lines (eg, scan lines, data lines) for transmitting corresponding driving or control signals to the electronic component 131 .

Please refer to FIG. 1A again. The number of electronic components 131 of each electronic unit 13 in this embodiment is three, and each of them is a micro-optoelectronic chip, such as a micro-light emitting diode chip, and is connected to the electrical component through the corresponding sub-conductive member 132. The electrical layers 122 of the electrical board 12 are electrically connected. Of course, in different embodiments, the number of electronic components 131 of each electronic unit 13 can also be 1, 2, or more than 3, and each electronic component 131 can be an optoelectronic chip or package of other sizes, and not limited.

In this embodiment, the three electronic components 131 (micro-light emitting diode chips) of each electronic unit 13 may, for example, be of a common anode or common cathode design and have four connection terminals. This is a common cathode design as an example, so it has three corresponding positive terminals and a shared negative terminal. As shown in Figure 1B, the three positive terminals can correspond to three smaller through holes H21 (H2) and are located in these Of the three sub-conductive members 132 in the through-hole H21, one negative terminal can correspond to a larger through-hole H22 (H2) and the sub-conductive member 132 located in the through-hole H22 (the through-hole H21 and the through-hole H22 can be called the through-hole H2), so that The three electronic components 131 can be electrically connected to the electrical layer 122 of the electrical board 12 through the four sub-conductive members 132 of the four through holes H2 (ie, 3 H21 and 1 H22) respectively. In addition, in this embodiment, the secondary conductive elements 132 of the electronic units 13 and the main conductive elements 123 of the conductive plate 12 are disposed in an offset manner along the projection direction of the conductive plate 12 . In other words, the four through holes H2 corresponding to each electronic unit 13 and the corresponding through holes H1 are also offset along the projection direction of the electrical board 12 .

In some embodiments, the through holes H2 of the same nature on multiple carrier boards 133 can correspond to one of the through holes H1, and the number of the through holes H1 is equivalent to the number of the through holes H2 of the same nature. Taking micro-light emitting diode chips as an example, multiple through holes H1 One of the through holes H21 corresponding to the anode of the red micro-light emitting diode chip on the carrier board 133 jointly corresponds to one of the through holes H1, and by analogy, multiple carrier boards 133 jointly correspond to at least four through holes H1; but this is not used as an example. For example, on the same electrical board 12, multiple carrier boards 133 correspond to at least four through holes H1; multiple carrier boards 133 on multiple electrical boards 12 can pass through one or two conductive members. The electrical connections belong to two adjacent electronic units 13 on two adjacent carrier boards 133, and the number of through holes is further reduced to less than four. For another example, whether on the same electrical board 12 or on multiple electrical boards 12 , through the extended design of one or more extended circuit boards (such as flexible printed circuit boards, etc.), the number of circuit boards can be further reduced to less than four. Number of vias. It can be understood that one corner of each electronic unit 13 can be covered by a through hole H1, that is, the four corners of each electronic unit 13 can be covered by different through holes H1; and a through hole H1 can Covering one corner of many electronic units 13 , for example, the same through hole H1 can cover one corner of four electronic units 13 respectively. The two define different contents, and the different contents do not conflict with each other and coexist.

In some embodiments, in the projection direction along the electrical board 12 , the ratio of the projected area of the electronic unit 13 to the projected area of the electronic component 131 is not less than 5, that is, the projected area of the electronic unit 13 / the projection of the electronic component 131 Area ≥5. For example, the projected area of the electronic unit 13 may be, for example, 0.4mm*0.4mm=0.16mm ² , and the projected area of the electronic component 131 may be, for example, (3*0.0254)mm*(5*0.0254)mm=0.0096774mm ² . Therefore, the projected area of the electronic unit 13/the projected area of the electronic component 131 is >16.53. For example, the projected area of the electronic unit 13 may be, for example, 0.8mm*0.8mm=0.64mm ² , and the projected area of the electronic component 131 may be, for example, (5*0.0254)mm*(9*0.0254)mm=0.0290322mm ² . Therefore, the projected area of the electronic unit 13/the projected area of the electronic component 131 is >22.04. For example, the projected area of the electronic unit 13 may be, for example, 0.4mm*0.4mm=0.16mm ² , and the projected area of the electronic component 131 may be, for example, (5*0.0254)mm*(9*0.0254)mm=0.0290322mm ² . Therefore, the projected area of the electronic unit 13/the projected area of the electronic component 131 is >5.51.

In some embodiments, the ratio of the aforementioned projected area of the electronic unit 13 to the projected area of the electronic component 131 may be no less than 50. For example, the projected area of the electronic unit 13 can be, for example, 0.4mm*0.4mm=0.16mm ² , and the projected area of the electronic component 131 can be, for example, 0.03mm*0.06mm=0.0018mm ² . Therefore, the projected area of the electronic unit 13 / The projected area of the electronic component 131=88.88. For example, the projected area of the electronic unit 13 may be, for example, 0.8mm*0.8mm=0.64mm ² , and the projected area of the electronic component 131 may be, for example, (3*0.0254)mm*(5*0.0254)mm=0.0096774mm ² . Therefore, the projected area of the electronic unit 13/the projected area of the electronic component 131 is >66.13. In some embodiments, the ratio of the projected area of the electronic unit 13 to the projected area of the electronic component 131 may be no less than 100. For example, the projected area of the electronic unit 13 can be, for example, 0.46mm*0.46mm=0.2116mm ² , and the projected area of the electronic component 131 can be, for example, 0.03mm*0.06mm=0.0018mm ² , so the projected area of the electronic unit 13/ The projected area of the electronic component 131=117.56. The above numerical values are only examples and cannot be used to limit the present invention. It is worth noting that the aforementioned projected area of the electronic unit 13 and the projected area of the electronic component 131 are usually calculated using a square as an example, but are not limited to a square.

In some embodiments, in the projection direction along the electrical board 12, the size of the electronic component 131 is also defined as a component width, and the component width may not be greater than 80 mil, that is, the component width is ≤ 80 mil. In some embodiments, the component width may be no greater than 12 mil (ie, component width ≤ 12 mil). In some embodiments, the component width may be no less than 0.005mm (ie, component width ≥ 0.005mm), such as 0.008mm, 0.01mm, 3mil, 4mil, 5mil, or 7mil, etc.

Following the above, in the electronic device 1 of this embodiment, the first surface S1 and the second surface S2 of the board body 121 are connected through the through holes H1 of the electrical board 12, and the main conductive components 123 are respectively provided in the through holes H1. And electrically connect the electrical layer 122 of the electrical board 12 to the circuit layer 111 of the support plate 11; these electronic units 13 are arranged on the first surface S1 of the board body 121 of the electrical board 12, and each electronic unit 13 is connected to the electrical board 12. One of the through holes H1 of 12 partially overlaps along the projection direction of the electrical board 12; and the secondary conductive elements 132 (or through holes H2) of the electronic units 13 and the main conductive elements 123 of the electrical plate 12 (or through holes H1 ) are arranged in a staggered structure along the projection direction of the electrical board 12 , making the electronic device 1 an electronic product that is different from the traditional electrical connection technology between the electronic unit and the support board.

2 to 4 are partial schematic diagrams of electronic devices according to different embodiments of the present invention.

As shown in Figure 2, the main difference from the electronic device 1 of the previous embodiment is that in the electronic device 1a of this embodiment, four electronic units 13 constitute an electronic structure, and the electronic structure has a carrier board 133. These electronic components 131 of the unit 13 are arranged on the carrier board 133 . In other words, four electronic units 13 constitute an electronic structure and share the same carrier board 133 . Therefore, if a certain electronic unit is found to be faulty, the fault can be removed before being placed (for example, attached) to the electrical board 12 . Part of the electronic units can be cut (for example, by laser cutting) and removed, and then replaced with well-tested electronic units and attached to the electrical board 12 . Therefore, fault repair is also quite easy. Therefore, the electronic device 1 a is also High process yield can be achieved.

In addition, as shown in FIG. 3 , the main difference from the electronic device 1 of the previous embodiment is that in the electronic device 1 b of this embodiment, there are multiple electrical boards 12 , and these electrical boards 12 are spliced into a structure such as Two-dimensional matrix. In this embodiment, four electronic units 13 are provided on each electrical board 12. The four electronic units 13 are arranged in a 2x2 matrix, and the sub-conductive elements 132 of the four electronic units 13 and the electrical boards 12 The main conductor 123 is also disposed in a staggered manner along the projection direction of the conductive plate 12 .

In addition, as shown in FIG. 4 , the main difference from the electronic device 1 b of the previous embodiment is that in the electronic device 1 c of this embodiment, nine electronic units 13 are provided on each electrical board 12 . The nine electronic units 13 are arranged in a 3x3 matrix. In each electrical board 12 , nine electronic units 13 are electrically connected to the circuit layer 111 of the support board 11 through the main conductive components 123 of the two through holes H1 . In other words, an electronic unit 13 located between two through holes H1 simultaneously shares the two main conductors 123 of the two through holes H1 and is electrically connected to the circuit layer 111 of the support plate 11 .

In another embodiment of the present invention, the electronic device can also be applied to any of the aforementioned embodiments of FIGS. 1A to 4 , but at least one of the through hole H1 and the through hole H2 can be further omitted. Taking FIGS. 5A to 5C as an example, they are respectively a partial schematic diagram, a partial exploded schematic diagram and a cross-sectional schematic diagram along the 5C-5C cut plane line of the electronic device with the perforation H2 omitted.

As shown in FIGS. 5A to 5C , the carrier board 133' can be provided with a plurality of conductive pads P on the connection surface S4. These conductive pads P can be electrically connected to the electronics through the conductive layer (not shown) of the carrier board 133'. component 131'; and the electronic unit 13' can electrically connect these conductive pads P to the electrical layer 122 of the electrical board 12 through a plurality of sub-conductive members 132'. Here, the conductive layer of the carrier board 133' can be located on the working surface S3, the connection surface S4, or between the two; these sub-conductive components 132' can be solder balls, solder paste or their equivalents; these sub-conductive components 132' They may be disposed on the electrical board 12 or on the carrier board 133'. When these sub-conductive members 132' are disposed on the carrier board 133', these conductive pads P may not be visible; these conductive pads P The number of these sub-conductive members 132' is not limited to the same number as when the aforementioned electronic component 131 adopts a common cathode or a common anode; each electronic unit 13' can be a surface mount component (SMD), and the electronic unit 13' can further These electronic components 131' are covered on the carrier board 133' with a package or package layer. It can be understood that each electronic unit 13' can be electrically connected (direct contact electrical connection) through one of the secondary conductive members 132' directly contacting the main conductive member 123 located in the through hole H1; or these secondary conductive members 132 of each electronic unit 13' The conductive component 132' is electrically connected to the electrical layer 122 of the electrical board 12, and is electrically connected to the main conductive component 123 located in the through hole H1 through the electrical layer 122 of the electrical board 12 (indirect contact electrical connection); or, These conductive pads P can be regarded as extensions or parts of the electrical layer 122 . It can be understood that when each electronic unit 13' is electrically connected through one of the sub-conductive parts 132' and the main conductive part 123 located in the through hole H1, the conductive pad P, the sub-conductive part 132' and the main conductive part 123 are electrically connected. The electrical components 123 can be arranged in a staggered manner along the projection direction of the electrical board 12 , as long as they can be electrically connected to each other. Here, the misaligned arrangement means that the sub-conductive element 132' and the main conductive element 123 are completely staggered or partially staggered along the projection direction of the conductive plate 12, as long as the sub-conductive element 132' and the main conductive element 123 do not completely overlap. (completely covered).

In other words, when the carrier board 133' is viewed from the upper side of the carrier board 133', at least a part or all of each sub-conductive member 132' will not be visible due to the coverage of the carrier board 133'. Each carrier board 133' simultaneously covers a main conductive component 123 located in the through hole H1 (same as the previous embodiment), so the main conductive component 123 may be completely shielded or slightly exposed. In this embodiment, the electronic component 131' is electrically connected to the electrical layer 122 of the electrical board 12 through the conductive layer (and conductive pad P) of the carrier 133' and the sub-conductive component 132'. The electrical board 12 The electrical layer 122 is electrically connected to the circuit layer 111 of the support plate 11 below through the main conductive component 123 located in the through hole H1, so as to transmit electrical signals through the circuit layer 111, the electrical layer 122 and the main conductive component 123. . It can also be understood that one corner of each electronic unit 13' can be covered by one main conductive component 123, that is, the four corners of each electronic unit 13' can be covered by different main conductive components 123; and One main conductor 123 can cover one corner of many electronic units 13'. For example, the same main conductor 123 can cover one corner of four electronic units 13' respectively. The two define different contents, and these different contents are not the same. conflict with and coexist with each other.

In another embodiment of the present invention, the electronic device can also be applied to any of the above-mentioned implementations of FIGS. 1A to 4 , but the through hole H1 (not shown) can be further omitted. Here, the electrical board omits the through hole H1, and uses surface mounting technology to electrically connect the electrical layer of the electrical board to the circuit layer of the support board. The electronic unit can be placed on the electrical board before or after the electrical board is placed on the support board, and the order is not limited. In some embodiments, the electronic unit can be placed on the electrical board before the electrical board is placed on the support board, so that the electronic unit and the electrical board can together form a unit or a module.

In another embodiment of the present invention, the electronic device can also be applied to any of the above-mentioned embodiments of FIGS. 1A to 4 , but the through hole H1 and the through hole H2 can be omitted at the same time, which will not be described again.

To sum up, in the electronic device of the present invention, the electrical layer of the electrical board is electrically connected to the circuit layer of the support board through the main conductive component, and the electronic unit is electrically connected to the conductive layer of the carrier board and the electrical circuit layer through the secondary conductive component. The electrical layer of the board, and the structural design of the secondary conductive parts of the electronic units and the main conductive parts of the electrical board are disposed along the projection direction of the electrical board, making the electronic device of the present invention a kind of device that is different from Electronic products with traditional electrical connection technology; the electronic device of the present invention has the following advantages: reducing the overall size of the electronic device, increasing the layout density of electronic units on the electronic device, and allowing the carrier board or electrical board to still have a visual appearance even if it is spliced. Consistency (equal pitch), easy to eliminate or repair defective products, and improve the yield rate of electronic devices; or, the main conductive component can achieve the effect of electrical connection by dislocating the secondary conductive component, and the projected size of the main conductive component can be It is not reduced due to the reduction of the spacing of electronic components, so it is beneficial to increase the placement density of electronic components. Through the structure of the electronic device in this case and the electrical connection relationship of its components, if one of the multiple electronic units is found to be faulty, the faulty electronic unit can be eliminated before being installed on the electrical board, and good products can be reused. It is replaced by an electronic unit, so fault repair is very easy, thereby achieving high process yield. The present invention integrates electronic components into the form of electronic units. When one of the electronic components fails, only the electronic unit where the failed electronic component is located needs to be eliminated, rather than the entire electronic device. Therefore, the present case Electronic devices are also easy to eliminate or repair defective products, which can improve the yield rate of electronic devices. In addition, it can be understood that the electronic unit, the electrical board, and the support board can each be used as an independent electronic component, and the staggered electrical connections are achieved through through-hole or surface mounting techniques.

The above is only illustrative and not restrictive. Any equivalent modifications or changes without departing from the spirit and scope of the invention shall be included in the scope of the appended claims.

Claims (35)

1. An electronic device, comprising:

the support plate is provided with a circuit layer;

the electric plate is provided with a plate body, a plurality of through holes penetrating through the plate body, an electric layer arranged on the plate body and a plurality of main conductive pieces respectively arranged on the through holes; the through holes are communicated with the first surface and the second surface of the plate body, and the main conductive piece is electrically connected with the electrical layer to the circuit layer of the supporting plate; and

the electronic units are arranged on the first surface of the plate body, and each electronic unit and one of the through holes are partially overlapped along the projection direction of the electric plate; each electronic unit is provided with an electronic component and a secondary conductive element electrically connecting the electronic component to the electrical layer;

the secondary conductive piece of the electronic unit and the primary conductive piece of the electrical board are arranged in a staggered manner along the projection direction of the electrical board;

The ratio of the projection area of the electronic unit to the projection area of the electronic component is not less than 5.

2. The electronic device of claim 1, wherein each of the electronic units has a plurality of corners, one of the corners of each of the electronic units being covered by one of the through holes along the projection direction of the electrical board.

3. The electronic device of claim 1, wherein each of the electronic units has a plurality of corners, one of the through holes covering one of the corners of the electronic unit along the projection direction of the electrical board.

4. The electronic device of claim 1, wherein the electronic unit is a plurality of electronic structures, each of the electronic structures having a carrier, the electronic component being disposed on the carrier.

5. The electronic device of claim 1, wherein the electronic unit constitutes an electronic structure having a carrier board, the electronic component of the electronic unit being disposed on the carrier board.

6. The electronic device of claim 1, wherein the electronic units are arranged in an mxn matrix and cover at least one of the through holes along the projection direction of the electrical board, wherein m, n may be equal or non-equal positive integers.

7. The electronic device of claim 6, wherein the electronic units are arranged in a 2x2 matrix.

8. The electronic device of claim 1, wherein the number of the sub-conductive elements of each electronic unit is plural, and each sub-conductive element electrically connects the corresponding electronic component to the electrical layer.

9. The electronic device of claim 8, wherein the electronic component of each of the electronic units is a plurality of.

10. The electronic device of claim 1, wherein the electronic component is a micro-optoelectronic chip.

11. The electronic device of claim 1, wherein the electronic component is a drive component.

12. The electronic device of claim 1, wherein the electrical board further comprises a plurality of driving components, the driving components corresponding to the electronic components of the electronic unit, respectively.

13. The electronic device of claim 1, wherein the number of electrical boards is a plurality.

14. The electronic device of claim 1, wherein the support plate and the plate body of the electrical plate are respectively a rigid plate, a flexible plate, or a composite plate.

15. The electronic device of claim 14, wherein the support plate and/or the plate body of the electrical plate is a transparent plate.

16. The electronic device of claim 1, wherein the electronic component defines a component width of no greater than 80 mils.

17. The electronic device of claim 16, wherein the electronic component defines the component width to be no greater than 12 mils.

18. The electronic device of claim 16, wherein the electronic component defines the component width of not less than 0.005 millimeters.

19. The electronic device according to claim 4 or 5, wherein the carrier defines a working surface on which the electronic component is disposed and a connection surface corresponding to the working surface, the carrier has a conductive layer and a through hole communicating the working surface and the connection surface, and the sub-conductive member electrically connects the conductive layer to the electrical layer of the electrical board through the through hole.

20. The electronic device of claim 4 or 5, wherein the carrier plate is a rigid plate, a flexible plate, or a composite plate.

21. The electronic device of claim 20, wherein the carrier plate is a transparent plate.

22. An electronic device, comprising:

the support plate is provided with a circuit layer;

the electric plate is provided with a plate body, an electric layer arranged on the plate body and a plurality of main conductive pieces respectively and electrically connected with the electric layer; the main conductive element is electrically connected with the electrical layer to the circuit layer of the supporting plate; and

The electronic units are arranged on the first surface of the plate body, and each electronic unit and one of the main conductors are partially overlapped along the projection direction of the electric plate; each electronic unit is provided with an electronic component and a secondary conductive element electrically connecting the electronic component to the electrical layer;

the secondary conductive piece of the electronic unit and the primary conductive piece of the electrical board are arranged in a staggered manner along the projection direction of the electrical board;

the ratio of the projection area of the electronic unit to the projection area of the electronic component is not less than 5.

23. The electronic device of claim 22, wherein the electronic unit is a surface mount component.

24. The electronic device of claim 22, wherein each of the electronic units has a plurality of corners, one of the corners of each of the electronic units being covered by one of the main conductors along the projection direction of the electrical board.

25. The electronic device of claim 22, wherein each of the electronic units has a plurality of corners, one of the main conductors covering one of the corners of the plurality of electronic units along the projection direction of the electrical plate.

26. The electronic device of claim 22, wherein the electronic unit is a plurality of electronic structures, each of the electronic structures having a carrier, the electronic component being disposed on the carrier.

27. The electronic device of claim 22, wherein the electronic component is a micro-optoelectronic chip.

28. The electronic device of claim 22, wherein the electronic unit further comprises an encapsulation layer covering the electronic component.

29. The electronic device of claim 22, wherein the electronic unit forms an electronic structure having a carrier, the electronic component of the electronic unit being disposed on the carrier.

30. The electronic device of claim 22, wherein the electronic units are arranged in an mxn matrix and cover at least one of the main conductors along the projection direction of the electrical board, wherein m and n may be equal or non-equal positive integers.

31. The electronic device of claim 30, wherein the electronic units are arranged in a 4x4 matrix.

32. The electronic device of claim 22, wherein the number of the sub-conductive elements of each electronic unit is plural, and each sub-conductive element electrically connects the corresponding electronic component to the electrical layer.

33. The electronic device of claim 22, wherein the secondary conductive element of each of the electronic units is a solder ball.

34. The electronic device of claim 22, wherein the electrical board further comprises a plurality of driving components, the driving components corresponding to the electronic components of the electronic unit, respectively.

35. The electronic device of claim 34, wherein the driving component is a thin film transistor, or an integrated circuit.