CN114765167A - Display module and manufacturing method thereof - Google Patents

Abstract

The invention discloses a display module and a manufacturing method thereof, wherein the display module comprises a circuit board with a first surface and a second surface which are opposite, a first conductive circuit arranged on the first surface of the circuit board, a light-emitting chip, a matte layer and a first ink black layer; the light-emitting chip is in conductive connection with the first conductive circuit; the matte layer wraps the surface and the exposed side face of the light-emitting chip on the first surface; the first black ink layer is located on the matte layer, and the first black ink layer is provided with at least one first opening corresponding to the upper part of the light-emitting chip, and the matte layer located above the light-emitting chip is exposed. According to the display module, the matte layer, the black ink layer and the light-emitting chip are arranged in a matched mode, so that the inherent contradiction between the high light transmittance of the light-emitting surface and the high black ink degree of the non-light-emitting surface is solved, the contrast and the brightness are greatly improved, the power consumption of the display module is further reduced, and the display module is simple to process, low in cost and good in reliability.

Description

Display module and manufacturing method thereof

technical field

The present invention relates to the technical field of display modules, and in particular, to a display module and a manufacturing method thereof.

Background technique

RGB display modules based on semiconductor light-emitting elements have been widely used in indoor and outdoor display fields. With the reduction of pixel size and pixel pitch, miniLED-based high-definition ultra-fine pitch display module is one of the keys to achieve 8K ultra-high resolution, medium and large size TVs and displays.

A common display module structure is shown in FIG. 1 , which includes a substrate 11 and a light-emitting element 12 disposed on the substrate 11 . In order to realize RGB display, each light-emitting element 12 generally includes at least one red light chip, one blue light chip and one green light chip. As can be seen from FIG. 1 , since each light-emitting element 12 has a bracket 121 , the miniaturization of the light-emitting element 12 is greatly limited. Even if the size of the light-emitting element 12 can be made very small, for example, 1 mm×1 mm, since each light-emitting element 12 includes at least one red light chip, one blue light chip and one green light chip, each light-emitting element 12 includes at least four external pads . Because the size of the light-emitting element 12 is too small, the size of the pad is limited, the strength of the light-emitting element 12 to be reflowed to the substrate 11 is relatively low, and the flatness and spacing are difficult to control. Thousands of light-emitting elements 12 that are closely arranged and reflow soldered on the substrate 11 can easily fall off under the action of external forces such as collision, vibration, extrusion, etc., resulting in poor display effect, tedious repair work, and high cost.

In order to solve the problems encountered in the miniaturization of light-emitting elements, another common display module is shown in FIG. 2 , including a substrate 21 , a light-emitting chip 22 and a light-transmitting layer 23 . As shown in FIG. 2 , the light-emitting chip 22 replaces the light-emitting element 12 in FIG. 1 . Since the light-emitting chip 22 itself has no bracket, the size can be minimized. The light-transmitting layer 23 can not only protect the gold wire, but also prevent moisture and moisture. Due to the dust-proof effect, the light-emitting chip 22 is not easily damaged by external force.

When the display module shown in FIG. 2 is used for RGB display, in order to improve the contrast or contrast of the displayed image, the reflectivity of the non-light-emitting surface must be reduced. Ideally, the non-light-emitting surface is completely blackened. Based on the structure shown in FIG. 2 , in order to improve the contrast or contrast of the displayed image, the usual practice is to add a colorant into the light-transmitting layer 23 to increase the blackness of the light-transmitting layer 23 . The light transmittance of the light-transmitting layer 23 will also be greatly reduced, resulting in nearly 40% of the light emitted by the light-emitting chip 22 being absorbed by the light-transmitting layer 23 . Under the same power density, the brightness of the display module will be greatly reduced. Increasing brightness by increasing power density imposes burdens on power configuration, driver selection, thermal and thermal design, and increases cost. It can be seen from FIG. 2 that there is an irreconcilable contradiction between increasing the blackness of the non-light-emitting surface and increasing the light transmittance of the light-transmitting layer. The higher the blackness, the lower the light transmittance; or, the higher the light transmittance, the lower the blackness. In terms of display effects, the higher the contrast or contrast, the greater the sacrifice in brightness; or, the higher the brightness, the lower the contrast or contrast.

Therefore, due to the inherent defects and deficiencies of the above-mentioned display module structure, the contradiction between the high transmittance of the light-emitting surface and the high blackness of the non-light-emitting surface cannot be solved, and the contradiction between improving the brightness and increasing the contrast or contrast cannot be solved.

SUMMARY OF THE INVENTION

The technical problem to be solved by the present invention is to provide a display module and its manufacturing method which solve the inherent contradiction between the high light transmittance of the light emitting surface and the high blackness of the non-light emitting surface, and improve the contrast and brightness.

The technical solution adopted by the present invention to solve the technical problem is to provide a display module, which includes a circuit board with opposite first and second surfaces, and a first conductive circuit board disposed on the first surface of the circuit board. a circuit, a light-emitting chip, a matte layer and a first black layer;

the light-emitting chip is conductively connected to the first conductive circuit; the matte layer wraps the surface and the exposed side of the light-emitting chip on the first surface;

The first ink black layer is located on the matte layer, and the first ink black layer is provided with at least one first opening corresponding to the top of the light-emitting chip, exposing the matte light above the light-emitting chip Floor.

Preferably, the matt layer is made of silica gel or epoxy resin, and is mixed with one or more combinations of diffusion powder, matt powder and coloring powder;

The first black layer is made of one or more combinations of silica gel, epoxy resin, photosensitive ink and photosensitive glue; the silica gel or epoxy resin is mixed with diffusion powder, matte powder and color powder. one or more.

Preferably, the display module further includes a second black layer;

The second ink black layer is disposed between the first surface and the matte layer, and the second ink black layer is provided with at least one second opening, and the light-emitting chip is located in the second opening.

Preferably, the inner wall surface of the second opening is attached to the corresponding side surface of the light-emitting chip; or,

A gap is left between the inner wall surface of the second opening and the corresponding side surface of the light-emitting chip, and the matte layer fills the gap.

Preferably, the second black layer is made of one or more combinations of silica gel, epoxy resin, photosensitive ink, and photosensitive adhesive; the silica gel or epoxy resin is mixed with diffusing powder, matt powder and coloring one or more of the powders.

Preferably, the display module further comprises a second conductive circuit disposed on the second surface of the circuit board, a conductive channel disposed in the circuit board and penetrating the first surface and the second surface; the The second conductive circuit is conductively connected to the first conductive circuit through the conductive channel.

Preferably, the display module further includes an auxiliary circuit board and/or an electronic device electrically connected to the second conductive circuit.

The present invention also provides a manufacturing method of the display module described in any one of the above, comprising the following steps:

S1. A first conductive circuit is arranged on the first surface of the circuit board;

S2, disposing a light-emitting chip on the first surface of the circuit board, and making the light-emitting chip conductively connect with the first conductive circuit;

S3. A matte layer is arranged on the first surface of the circuit board, and the matt layer wraps the surface and the exposed side of the light-emitting chip;

S4. A first ink black layer is provided on the first surface of the circuit board, and at least one first opening is formed on the first ink black layer, and the first opening corresponds to the top of the light-emitting chip, and is exposed on the the matte layer above the light-emitting chip.

Preferably, step S4 includes:

S4.1, setting a first ink black layer on the first surface of the circuit board;

S4.2, setting a mask on the surface of the first black layer;

S4.3, exposing and curing the first ink black layer not covered by the mask;

S4.4, remove the mask;

S4.5, developing and removing the first ink black layer covered by the mask to form a first opening, exposing the matte layer above the light-emitting chip;

S4.6, heat curing the first ink black layer;

Alternatively, step S4 includes:

S4.1, setting a first ink black layer on the first surface of the circuit board;

S4.2, setting a mask on the surface of the first black layer;

S4.3, exposing the first ink black layer not covered by the mask;

S4.4, remove the mask;

S4.5, developing and removing the first ink black layer not covered by the mask, forming a first opening, and exposing the matte layer above the light-emitting chip;

S4.6, heat curing the first ink black layer;

Alternatively, step S4 includes:

S4.1, setting a mask on the first surface of the circuit board;

S4.2, setting a first ink black layer on the mask;

S4.3, removing the mask or removing the mask after pre-curing, forming a first opening on the first black layer, exposing the matte layer above the light-emitting chip;

S4.4, curing the first ink black layer.

Preferably, step S2 also includes the following steps:

S2.1. A second ink black layer is arranged on the first surface of the circuit board, the second ink black layer is provided with at least one second opening, and the light-emitting chip is arranged in the second opening; the first The inner wall surfaces of the two openings are in contact with the corresponding side surfaces of the light-emitting chip or leave a gap;

In step S3, the matte layer is arranged above the second black layer; when there is a gap between the inner wall surface of the second opening and the side surface of the corresponding light-emitting chip, the matte layer will Fill the voids described above.

Preferably, step S2.1 includes:

S2.1.1. Disposing the second ink black layer on the first surface of the circuit board;

S2.1.2, heating and curing the second ink black layer;

Alternatively, step S2.1 includes:

S2.1.1, setting a mask on the first surface of the circuit board;

S2.1.2, setting a second ink black layer on the mask;

S2.1.3. Remove the mask or remove the mask after pre-curing, and form a second ink black layer with a second opening on the first surface, and the light-emitting chip is disposed in the second opening ;

S2.1.4, curing the second black layer;

Alternatively, step S2.1 includes:

S2.1.1. A second ink black layer is arranged on the first surface of the circuit board;

S2.1.2, setting a mask on the surface of the second black layer;

S2.1.3, exposing and curing the second ink black layer not covered by the mask;

S2.1.4, remove the mask;

S2.1.5, developing and removing the second ink black layer covered by the mask, forming a second opening, and exposing the light-emitting chip disposed in the second opening;

S2.1.6, heat curing the second ink black layer;

Alternatively, step S2.1 includes:

S2.1.1. Disposing the second ink black layer on the first surface of the circuit board;

S2.1.2, setting a mask on the surface of the second black layer;

S2.1.3, exposing the second ink black layer not covered by the mask;

S2.1.4, remove the mask;

S2.1.5, developing and removing the second ink black layer not covered by the mask, forming a second opening, and exposing the light-emitting chip disposed in the second opening;

S2.1.6, heat curing the second ink black layer.

Preferably, step S1 further includes: arranging a conductive channel on the circuit board penetrating the first surface and the second surface thereof, arranging a second conductive circuit on the second surface, and making the first conductive circuit and the second conductive circuit are respectively conductively connected with the conductive channel.

Preferably, the manufacturing method of the display module further comprises the following steps:

S5. Disposing an electronic device on the second surface of the circuit board, and making the electronic device conductively connect the second conductive circuit; and/or, disposing at least one auxiliary device on the second surface of the circuit board circuit board, and make the auxiliary circuit board conductively connect with the second conductive circuit.

The present invention provides another display module, comprising a circuit board with opposite first and second surfaces, a first conductive circuit disposed on the first surface of the circuit board, a light-emitting chip, a matte layer and ink black Floor;

the light-emitting chip is conductively connected to the first conductive circuit; the matte layer wraps the surface and the exposed side of the light-emitting chip on the first surface;

The ink black layer is disposed between the first surface and the matte layer, and the ink black layer is provided with at least one opening, and the light-emitting chip is located in the opening.

Preferably, the inner wall surface of the opening is attached to the corresponding side surface of the light-emitting chip; or,

A gap is left between the inner wall surface of the opening and the corresponding side surface of the light-emitting chip, and the matte layer fills the gap.

Preferably, the matt layer is made of silica gel or epoxy resin, and is mixed with one or more combinations of diffusion powder, matt powder and coloring powder;

The black layer is made of one or more combinations of silica gel, epoxy resin, photosensitive ink and photosensitive glue; the silica gel or epoxy resin is mixed with one of diffusing powder, matte powder and coloring powder or more.

Preferably, the display module further comprises a second conductive circuit disposed on the second surface of the circuit board, a conductive channel disposed in the circuit board and penetrating the first surface and the second surface; the The second conductive circuit is conductively connected to the first conductive circuit through the conductive channel.

Preferably, the display module further includes an auxiliary circuit board and/or an electronic device electrically connected to the second conductive circuit.

The present invention also provides a manufacturing method of the display module described in any one of the above, comprising the following steps:

S1. A first conductive circuit is arranged on the first surface of the circuit board;

S2, disposing a light-emitting chip on the first surface of the circuit board, and making the light-emitting chip conductively connect with the first conductive circuit;

S3. An ink black layer is arranged on the first surface of the circuit board, at least one opening is formed on the ink black layer, and the light-emitting chip is arranged in the opening;

S4. A matte layer is provided on the first surface of the circuit board, the matt layer wraps the surface and the exposed side of the light-emitting chip, and covers the black layer.

Preferably, step S3 includes:

S3.1, the ink black layer is arranged on the first surface of the circuit board;

S3.2, heating and curing the black layer;

Alternatively, step S3 includes:

S3.1, setting a mask on the first surface of the circuit board;

S3.2, setting a black layer on the mask;

S3.3. Remove the mask or remove the mask after pre-curing, and form an ink black layer with an opening on the first surface, and the light-emitting chip is arranged in the opening;

S3.4, curing the black layer;

Alternatively, step S3 includes:

S3.1, setting a black layer on the first surface of the circuit board;

S3.2, set a mask on the surface of the black layer;

S3.3, exposing and curing the black layer not covered by the mask;

S3.4, remove the mask;

S3.5, developing and removing the ink black layer covered by the mask, forming an opening, and exposing the light-emitting chip disposed in the opening;

S3.6, heat curing the black layer;

Alternatively, step S3 includes:

S3.1, disposing the ink black layer on the first surface of the circuit board;

S3.2, set a mask on the surface of the black layer;

S3.3, exposing the black layer not covered by the mask;

S3.4, remove the mask;

S3.5, developing and removing the ink black layer not covered by the mask, forming an opening, and exposing the light-emitting chip disposed in the opening;

S3.6, heat curing the ink black layer.

Preferably, step S1 further includes: arranging a conductive channel on the circuit board penetrating the first surface and the second surface thereof, arranging a second conductive circuit on the second surface, and making the first conductive circuit and the second conductive circuit are respectively conductively connected with the conductive channel.

Preferably, the manufacturing method of the display module further comprises the following steps:

S5. Disposing an electronic device on the second surface of the circuit board, and making the electronic device conductively connect the second conductive circuit; and/or, disposing at least one auxiliary device on the second surface of the circuit board circuit board, and make the auxiliary circuit board conductively connect with the second conductive circuit.

The display module of the present invention solves the inherent contradiction between the high light transmittance of the light-emitting surface and the high blackness of the non-light-emitting surface through the cooperative arrangement of the matt layer, the black layer and the light-emitting chip, thereby greatly improving the contrast and brightness, and further The power consumption of the display module is reduced, the processing is simple, the cost is low, and the reliability is good.

The manufacturing method of the display module of the present invention has short process flow, simple process and low manufacturing cost, and is suitable for large-scale and large-area industrialized production.

Description of drawings

The present invention will be further described below in conjunction with the accompanying drawings and embodiments, in which:

Fig. 1, Fig. 2 are respectively the cross-sectional structure schematic diagram of two kinds of display modules in the prior art;

3 is a schematic cross-sectional structure diagram of the display module according to the first embodiment of the present invention;

4 is a schematic cross-sectional structure diagram of a display module according to a second embodiment of the present invention;

FIG. 5 is a schematic cross-sectional structure diagram of a display module according to a third embodiment of the present invention.

Detailed ways

In order to have a clearer understanding of the technical features, objects and effects of the present invention, the specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

As shown in FIG. 3 , the display module of the first embodiment of the present invention may include a circuit board 30 , a first conductive circuit 31 , a second conductive circuit 32 , a light-emitting chip 33 , a matte layer 34 and a first black layer 35 .

The wiring board 30 has opposing first and second surfaces. The first conductive circuit 31 is provided on the first surface, and the second conductive circuit 32 is provided on the second surface and is conductively connected to the first conductive circuit 31 . Alternatively, the circuit board 30 is provided with a conductive channel 300 penetrating the first surface and the second surface, and the second conductive circuit 32 is conductively connected to the first conductive circuit 31 through the conductive channel 300 .

The circuit board 30 may be, but is not limited to, a ceramic-based circuit board, a glass-based circuit board, or a conventional PCB board. The first conductive circuit 31 and the second conductive circuit 32 may be formed of single-layer or multi-layer lines, respectively.

The light-emitting chip 33 is disposed on the first surface of the circuit board 30 and is conductively connected to the first conductive circuit 31. The connection method can be but not limited to one or more of laser welding, reflow welding, hot pressure welding, and metal bonding wires. combination. The light-emitting chips 33 may be one or more. The light emitting chip 33 may be, but not limited to, one or more combinations of flip chip, positive chip, and vertical chip.

The matte layer 34 wraps the surface and the exposed side surface of the light-emitting chip 33 on the first surface of the circuit board 30 . The matte layer 34 may also cover part or all of the first surface on which the light emitting chip 33 is not disposed. The upper surface of the matte layer 34 away from the circuit board 30 may be a flat surface (not shown) or a concave-convex surface (as shown in FIG. 3 ). The concave-convex surface is formed by wrapping the light-emitting chip 33 with the matte layer 34 .

The matt layer 34 is made of epoxy resin or silica gel, partially transparent, and mixed with one or more of matt powder, diffusing powder and coloring powder. The matte layer 34 is usually formed by mask spraying, spraying or molding.

The first black layer 35 is disposed on the first surface of the circuit board 30 and forms at least one first opening 350 . One first opening 350 may correspond to above one or more light emitting chips 33 .

The first jet black layer 35 is jet black, with a glossy surface or a matte surface, and is made of one or more combinations of silica gel, epoxy resin, photosensitive ink, and photosensitive adhesive; for silica gel or epoxy resin, it is mixed with One or more of diffusing powder, matt powder and coloring powder.

Referring to FIG. 3 , the first ink black layer 35 is opaque black. Since the first opening 350 is left, the ink black level of the first ink black layer 35 will not affect the light emitted by the light-emitting chip 33 passing through the matte layer above it. 34 degree of light transmission. At the same time, the adjustment of the light transmittance of the matte layer 34 exposed by the first opening 350 will not affect the blackness of the first black layer 35, so that the difference between the blackness and the light transmittance can be well resolved. contradiction between. From the perspective of display effect, the contrast or contrast can be improved by increasing the blackness of the first ink-black layer 35 without sacrificing the brightness, or the transparency of the matte layer 34 can be improved without sacrificing the contrast or contrast. light rate to increase the brightness.

According to requirements, the display module of this embodiment further includes an auxiliary circuit board 310 and/or an electronic device 320 that are conductively connected to the second conductive circuit 32 . For the display module provided with both the auxiliary circuit board 310 and the electronic device 320 , the electronic device 320 may be disposed on the auxiliary circuit board 310 and electrically connected to the second conductive circuit 32 through the auxiliary circuit board 310 .

The manufacturing method of the display module of the first embodiment may include the following steps:

S1. A first conductive circuit 31 is provided on the first surface of the circuit board 30, a second conductive circuit 32 is provided on the second surface of the circuit board 30, and a conductive circuit 30 is provided on the circuit board 30 penetrating the first surface and the second surface channel 300 , and the first conductive circuit 31 and the second conductive circuit 32 are respectively conductively connected to the conductive channel 300 .

S2 , disposing the light-emitting chip 33 on the first surface of the circuit board 30 , and making the light-emitting chip 33 conductively connect with the first conductive circuit 31 .

S3. A matte layer 34 is provided on the first surface of the circuit board 30. The matt layer 34 wraps the surface and exposed sides of the light-emitting chip 33, and the matt layer 34 also covers part or all of the first surface without the light-emitting chip 33.

S4. A first ink black layer 35 is provided on the first surface of the circuit board 30, and at least one first opening 350 is formed on the first ink black layer 35. The first opening 350 corresponds to the top of the light-emitting chip 33 and is exposed on the light-emitting chip 33. The matte layer 34 above.

S5, disposing the electronic device 320 on the second surface of the circuit board 30, and making the electronic device 320 conductively connect with the second conductive circuit 32; and/or, disposing at least one auxiliary circuit board 310 on the second surface of the circuit board 30 , and make the auxiliary circuit board 310 conductively connect with the second conductive circuit 32 . The electronic device 320 may be directly located on the second surface, or may be located on the auxiliary circuit board 310 .

Specifically, in the first embodiment, step S4 includes:

S4.1. A first ink black layer 35 is provided on the first surface of the circuit board, and the first ink black layer 35 is usually provided by printing or spin coating photosensitive ink or photosensitive adhesive.

S4.2, setting a mask on the surface of the first ink black layer 35 .

S4.3, exposing and curing the first ink black layer 35 not covered by the mask.

S4.4, remove the mask.

S4.5, developing and removing the first black layer 35 covered by the mask, forming a first opening 350, and exposing the matte layer 34 above the light-emitting chip 33.

S4.6, heat curing the first ink black layer 35.

In the second embodiment, step S4 includes:

S4.1. A first ink black layer 35 is provided on the first surface of the circuit board, and the first ink black layer 35 is usually provided by printing or spin coating photosensitive ink or photosensitive adhesive.

S4.2, setting a mask on the surface of the first ink black layer 35 .

S4.3, exposing the first ink black layer 35 not covered by the mask.

S4.4, remove the mask.

S4.5, developing and removing the first black layer 35 not covered by the mask, forming a first opening 350, and exposing the matte layer 34 above the light-emitting chip 33.

S4.6, heat curing the first ink black layer 35.

In the third embodiment, step S4 includes:

S4.1. A mask is arranged on the first surface of the circuit board, and the opening of the mask corresponds to the first surface where the light-emitting chip 33 is not arranged.

S4.2. Set the first black layer 35 on the mask. Usually, the first black layer 35 is formed by printing or spraying epoxy resin or silica gel. The silica gel or epoxy resin is mixed with diffusion powder, matte powder, One or more combinations of coloring powders.

S4.3. After removing the mask or pre-curing, the mask is removed to form the first ink black layer 35 with the first opening 350 .

S4.4, curing the first ink black layer 35 .

As shown in FIG. 4 , the display module of the second embodiment of the present invention may include a circuit board 30 , a first conductive circuit 31 , a second conductive circuit 32 , a light-emitting chip 33 , a matte layer 34 , a first black layer 35 and The second ink black layer 36 .

Compared with the first embodiment, the second ink black layer 36 is added in the second embodiment. The specific settings of the circuit board 30 , the first conductive circuit 31 , the second conductive circuit 32 , the light-emitting chip 33 , the matte layer 34 and the first black layer 35 can refer to the above-mentioned first embodiment, and are not repeated here.

In this embodiment, the second black layer 36 is disposed between the first surface of the circuit board 30 and the matte layer 34 . For the portion of the first surface that is not covered with the matte layer 34, the second ink black layer 36 may also be simultaneously disposed between the first ink black layer 35 and the first surface.

The second black layer 36 has at least one second opening 360 , and the light-emitting chip 33 is located in the second opening 360 ; one second opening 360 may have one or more light-emitting chips 33 .

The inner wall surface of the second opening 360 is in contact with the side surface of the corresponding light emitting chip 33 or has a gap. For voids left, the matt layer 34 fills the voids.

The matte layer 34 wraps the surface and the exposed side of the light-emitting chip 33 on the first surface, and covers part or all of the surface of the second black layer 36 . In addition, the matt layer 34 may also cover part or all of the exposed first surface of the circuit board 30 that is not provided with the light-emitting chip 33 and is not covered by the second ink black layer 36 .

The second jet black layer 36 is jet black, and is made of one or more combinations of silica gel, epoxy resin, photosensitive ink, and photosensitive glue. Wherein, silica gel or epoxy resin is mixed with one or more of diffusing powder, matt powder and coloring powder.

In this embodiment, the existence of the second black layer 36 can reduce or eliminate light channeling between the light-emitting chips 33, reduce the light guiding effect of the matte layer 34, and improve the display effect.

The manufacturing method of the display module of the second embodiment may include the following steps:

S1. A first conductive circuit 31 is provided on the first surface of the circuit board 30, a second conductive circuit 32 is provided on the second surface of the circuit board 30, and a conductive circuit 30 is provided on the circuit board 30 penetrating the first surface and the second surface channel 300 , and the first conductive circuit 31 and the second conductive circuit 32 are respectively conductively connected to the conductive channel 300 .

S2 , disposing the light-emitting chip 33 on the first surface of the circuit board 30 , and making the light-emitting chip 33 conductively connect with the first conductive circuit 31 .

Step S2 also includes the following steps:

S2.1. A second ink black layer 36 is provided on the first surface of the circuit board 30 , the second ink black layer 36 is provided with at least one second opening 360 , and the light-emitting chip 33 is arranged in the second opening 360 .

The inner wall surface of the second opening 360 is attached to the exposed side surface of the corresponding light-emitting chip 33 or has a gap.

Specifically, in the first embodiment, step S2.1 includes:

S2.1.1. Set the second ink black layer 36 on the first surface of the circuit board 30. Usually, the second ink black layer 36 can be formed by dispensing and adding natural leveling silica gel or epoxy resin. The silica gel or epoxy resin is mixed with diffusion One or more of powder, matte powder and coloring powder.

S2.1.2, under vacuum or non-vacuum conditions, heating and curing the second ink black layer 36 .

In the second embodiment, step S2.1 includes:

S2.1.1. A mask is provided on the first surface of the circuit board 30, and the exposed portion of the mask opening exposes the first surface where the light-emitting chip 33 is not provided.

S2.1.2. Set the second black layer 36 on the mask. Usually, the second black layer 36 can be set by printing or spraying silica gel or epoxy resin. The silica gel or epoxy resin is mixed with diffusing powder, matte powder, coloring one or more of the powders.

S2.1.3. Remove the mask or remove the mask after pre-curing, form a second ink black layer 36 on the first surface where the light-emitting chip 33 is not provided, and form a second opening 360 where the light-emitting chip 33 is provided, so that the light-emitting chip 33 is provided 33 is located within the second opening 360 .

The second opening 360 exposes the surface of the light-emitting chip 33 , or exposes the surface of the light-emitting chip 33 and the gap formed between the light-emitting chip 33 and the second black layer 36 .

S2.1.4. Under vacuum or non-vacuum conditions, the second ink black layer 36 is cured.

In a third embodiment, step S2.1 includes:

S2.1.1. Disposing the second ink black layer 36 on the first surface of the circuit board 30, usually by printing or spin coating photosensitive ink or photosensitive glue to provide the second ink black layer 36.

S2.1.2, setting a mask on the surface of the second black layer 36 .

The mask opening corresponds to above the second black layer 36 where the light emitting chip 33 is not disposed.

S2.1.3, exposing and curing the second ink black layer 36 not covered by the mask.

S2.1.4. Remove the mask.

S2.1.5, developing and removing the second ink black layer 36 covered by the mask, forming a second opening 360 , exposing the light-emitting chip 33 disposed in the second opening 360 .

The surface of the light-emitting chip 33 , or the surface of the light-emitting chip 33 and the gap formed between the light-emitting chip 33 and the second black layer 36 are exposed in the second opening 360 .

S2.1.6, heat curing the second ink black layer 36 .

In a fourth embodiment, step S2.1 includes:

S2.1.1. Disposing the second ink black layer 36 on the first surface of the circuit board 30, usually by printing or spin coating photosensitive ink or photosensitive glue to provide the second ink black layer 36.

S2.1.2, setting a mask on the surface of the second black layer 36 .

The mask opening corresponds to above the light emitting chip 33 and the second black layer 36 .

S2.1.3, exposing the second black layer 36 not covered by the mask.

S2.1.4. Remove the mask.

S2.1.5, developing and removing the second black layer 36 not covered by the mask, forming a second opening 360 , exposing the light-emitting chip 33 disposed in the second opening 360 .

The surface of the light-emitting chip 33 , or the surface of the light-emitting chip 33 and the gap formed between the light-emitting chip 33 and the second black layer 36 are exposed in the second opening 360 .

S2.1.6, heat curing the second ink black layer 36 .

Alternatively, the light-emitting chip 33 may be disposed on the first surface of the circuit board 30 first, and then the second ink black layer 36 may be disposed; or, the second ink black layer 36 may be disposed on the first surface of the circuit board 30 first, Then, the light-emitting chip 33 is disposed on the first surface of the circuit board 30 in the second opening 360 of the second black layer 36 . An appropriate embodiment is selected according to the order in which the light-emitting chip 33 and the second ink black layer 36 are arranged.

S3 . A matte layer 34 is provided on the first surface of the circuit board 30 , and the matt layer 34 wraps the surface and the exposed side surface of the light-emitting chip 33 .

The matte layer 34 is disposed above the second ink black layer 36 and covers part or all of the surface of the second ink black layer 36 . When a gap is left between the inner wall surface of the second opening 360 of the second black layer 36 and the side surface of the corresponding light-emitting chip 33 , the matte layer 34 fills the gap. The matte layer 34 also covers part or all of the exposed first surface of the circuit board 30 that is not provided with the light-emitting chip 33 and is not covered by the second black layer 36 .

S4. A first ink black layer 35 is provided on the first surface of the circuit board 30, and at least one first opening 350 is formed on the first ink black layer 35. The first opening 350 corresponds to the top of the light-emitting chip 33 and is exposed on the light-emitting chip 33. The matte layer 34 above.

For the specific setting method of the first ink black layer 35, reference may be made to the setting of the above-mentioned first embodiment, which will not be repeated here.

S5, disposing the electronic device 320 on the second surface of the circuit board 30, and making the electronic device conductively connect with the second conductive circuit 32; and/or, disposing at least one auxiliary circuit board 310 on the second surface of the circuit board 30, The auxiliary circuit board 310 is electrically connected to the second conductive circuit 32 . The electronic device 320 may be directly located on the second surface, or may be located on the auxiliary circuit board 310 .

As shown in FIG. 5 , the display module according to the third embodiment of the present invention includes a circuit board 30 , a first conductive circuit 31 , a second conductive circuit 32 , a light-emitting chip 33 , a matte layer 34 and a black layer 37 .

The wiring board 30 has opposing first and second surfaces. The first conductive circuit 31 is provided on the first surface, and the second conductive circuit 32 is provided on the second surface and is conductively connected to the first conductive circuit 31 . Alternatively, the circuit board 30 is provided with a conductive channel 300 penetrating the first surface and the second surface, and the second conductive circuit 32 is conductively connected to the first conductive circuit 31 through the conductive channel 300 .

The circuit board 30 may be, but is not limited to, a ceramic-based circuit board, a glass-based circuit board, or a conventional PCB board. The first conductive circuit 31 and the second conductive circuit 32 may be formed of single-layer or multi-layer lines, respectively.

The light-emitting chip 33 is disposed on the first surface of the circuit board 30 and is conductively connected to the first conductive circuit 31. The connection method can be but not limited to one or more of laser welding, reflow welding, hot pressure welding, and metal bonding wires. combination. The light-emitting chips 33 may be one or more. The light emitting chip 33 may be, but not limited to, one or more combinations of flip chip, positive chip, and vertical chip.

The matte layer 34 wraps the surface and the exposed side surface of the light-emitting chip 33 on the first surface of the circuit board 30 . The upper surface of the matte layer 34 away from the circuit board 30 may be a flat surface or a concave-convex surface; the concave-convex surface is formed by wrapping the light-emitting chip 33 with the matte layer 34 .

The matt layer 34 is made of epoxy resin or silica gel, partially transparent, and mixed with one or more of matt powder, diffusing powder and coloring powder. The matte layer 34 is usually formed by mask spraying, spraying or molding.

The ink black layer 37 is disposed between the first surface of the circuit board 30 and the matte layer 34, the ink black layer 37 is provided with at least one opening 370, the light-emitting chip 33 is located in the opening 370, and one opening 370 can have one or more light-emitting chips 33. The jet black layer 37 is jet black and is made of one or more combinations of silica gel, epoxy resin, photosensitive ink, and photosensitive glue; silica gel or epoxy resin is mixed with one of diffusing powder, matt powder and coloring powder or more.

The inner wall surface of the opening 370 is attached to the exposed side surface of the corresponding light-emitting chip 33 or a gap is left; if there is a gap, the matte layer 34 fills the gap.

The matte layer 34 wraps the surface and the exposed side of the light-emitting chip 33 on the first surface, and covers part or all of the surface of the black layer 37 . In addition, the matte layer 34 may also cover part or all of the exposed first surface of the circuit board 30 not provided with the light-emitting chip 33 and not covered by the ink black layer 37 .

The existence of the ink black layer 37 can reduce or eliminate the channeling light between the light-emitting chips 33, reduce the light guiding effect of the matte layer 34, and improve the display effect. In terms of the display effect, the blackness of the matte layer 34 can be improved by increasing the blackness of the black layer 37 without sacrificing the brightness, or it can be achieved without sacrificing the contrast or contrast. The light transmittance of the matte layer 34 is increased to improve the brightness, thereby solving the contradiction between the high light transmittance of the light-emitting surface and the high blackness of the non-light-emitting surface, and solving the contradiction between improving the brightness and increasing the contrast or contrast.

The display module of this embodiment may further include an auxiliary circuit board 310 and/or an electronic device 320 that are conductively connected to the second conductive circuit 32 . For the display module provided with both the auxiliary circuit board 310 and the electronic device 320 , the electronic device 320 may be disposed on the auxiliary circuit board 310 and electrically connected to the second conductive circuit 32 through the auxiliary circuit board 310 .

The manufacturing method of the display module of the third embodiment may include the following steps:

S1. A first conductive circuit 31 is arranged on the first surface of the circuit board 30, a conductive channel 300 is arranged on the circuit board 30 through the first surface and the second surface thereof, and a second conductive circuit 32 is arranged on the second surface, The first conductive circuit 31 and the second conductive circuit 32 are respectively conductively connected to the conductive channel 300 .

S2 , disposing the light-emitting chip 33 on the first surface of the circuit board 30 , and making the light-emitting chip 33 conductively connect with the first conductive circuit 31 .

S3. The ink black layer 37 is provided on the first surface of the circuit board 30 , the ink black layer 37 is provided with at least one opening 370 , and the light-emitting chip 33 is provided in the opening 370 .

The inner wall surface of the opening 370 is attached to the exposed side surface of the corresponding light-emitting chip 33 or has a gap.

Specifically, in the first embodiment, step S3 includes:

S3.1. Set the ink black layer 37 on the first surface of the circuit board 30. Usually, the ink black layer 37 can be set by the method of dispensing and adding natural leveling silica gel or epoxy resin. The silica gel or epoxy resin is mixed with diffusing powder, matt One or more of powder and coloring powder.

S3.2, under vacuum or non-vacuum conditions, heating and curing the ink black layer 37 .

In the second embodiment, step S3 includes:

S3.1. A mask is provided on the first surface of the circuit board 30, and the exposed portion of the mask opening exposes the first surface where the light-emitting chip 33 is not provided.

S3.2. Set the black layer 37 on the mask. Usually, the black layer 37 can be set by printing or spraying silica gel or epoxy resin. The silica gel or epoxy resin is mixed with one of diffusing powder, matte powder and coloring powder. one or more.

S3.3. Remove the mask or remove the mask after pre-curing, and form a black layer 37 having an opening 370 on the first surface, and the light-emitting chip 33 is disposed in the opening 370 .

S3.4. Under vacuum or non-vacuum conditions, the black layer 37 is cured.

In a third embodiment, step S3 includes:

S3.1. The ink black layer 37 is provided on the first surface of the circuit board 30, and the ink black layer 37 is usually provided by the method of printing or spin coating photosensitive ink or photosensitive glue.

S3.2, setting a mask on the surface of the ink black layer 37 .

The mask opening corresponds to above the ink black layer 37 where the light emitting chip 33 is not disposed.

S3.3, exposing and curing the ink black layer 37 not covered by the mask.

S3.4, remove the mask.

S3.5, developing and removing the ink black layer 37 covered by the mask, forming an opening 370, and exposing the light-emitting chip 33 disposed in the opening 370.

The surface of the light-emitting chip 33 , or the surface of the light-emitting chip 33 and the gap formed between the light-emitting chip 33 and the ink black layer 37 are exposed in the opening 370 .

S2.1.6, heat curing ink black layer 37.

In a fourth embodiment, step S3 includes:

S3.1. The ink black layer 37 is provided on the first surface of the circuit board 30, and the ink black layer 37 is usually provided by the method of printing or spin coating photosensitive ink or photosensitive glue.

S3.2, setting a mask on the surface of the ink black layer 37 .

The mask opening corresponds to above the light emitting chip 33 and the ink black layer 37 .

S3.3, exposing the black layer 37 not covered by the mask.

S3.4, remove the mask.

S3.5, developing and removing the ink black layer 37 not covered by the mask, forming an opening 370, and exposing the light-emitting chip 33 disposed in the opening 370.

The surface of the light-emitting chip 33 , or the surface of the light-emitting chip 33 and the gap formed between the light-emitting chip 33 and the ink black layer 37 are exposed in the opening 370 .

S3.6, heat curing ink black layer 37.

Alternatively, steps S2 and S3 may be performed in sequence, or step S3 may be performed prior to step S2. That is, the light-emitting chip 33 can be disposed on the first surface of the circuit board 30 first, and then the ink black layer 37 can be disposed; is disposed on the first surface of the circuit board 30 and in the opening 370 of the black layer 37 . An appropriate embodiment is selected according to the order in which the light-emitting chip 33 and the ink black layer 37 are arranged.

S4 , a matte layer 34 is provided on the first surface of the circuit board 30 , and the matt layer 34 wraps the surface and the exposed side surface of the light-emitting chip 33 .

The matte layer 34 is disposed above the ink black layer 37 and covers part or all of the surface of the ink black layer 37 . When there is a gap between the inner wall surface of the opening 370 of the ink black layer 37 and the side surface of the corresponding light-emitting chip 33 , the matte layer 34 fills the gap. The matte layer 34 also covers part or all of the exposed first surface of the circuit board 30 that is not provided with the light-emitting chip 33 and is not covered by the ink black layer 37 .

S5, disposing the electronic device 320 on the second surface of the circuit board 30, and making the electronic device conductively connect with the second conductive circuit 32; and/or, disposing at least one auxiliary circuit board 310 on the second surface of the circuit board 30, The auxiliary circuit board 310 is electrically connected to the second conductive circuit 32 . The electronic device 320 may be directly located on the second surface, or may be located on the auxiliary circuit board 310 .

The above descriptions are only the embodiments of the present invention, and are not intended to limit the scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied to other related technologies Fields are similarly included in the scope of patent protection of the present invention.

Claims (22)

1. A display module is characterized by comprising a circuit board, a first conductive circuit, a light emitting chip, a matte layer and a first ink black layer, wherein the circuit board is provided with a first surface and a second surface which are opposite to each other;

The light-emitting chip is electrically connected with the first conductive circuit; the matte layer wraps the surface and the exposed side face of the light-emitting chip on the first surface;

the first ink black layer is located on the matt layer, is provided with at least one first opening corresponding to the upper portion of the light emitting chip, and exposes the matt layer located above the light emitting chip.

2. The display module according to claim 1, wherein the matte layer is made of silica gel or epoxy resin and doped with one or more of diffusion powder, matte powder and coloring powder;

the first ink black layer is made of one or a combination of silica gel, epoxy resin, photosensitive ink and photosensitive glue; one or more of diffusion powder, matt powder and coloring powder are doped in the silica gel or the epoxy resin.

3. The display module of claim 1, further comprising a second ink black layer;

the second ink black layer is arranged between the first surface and the matte layer, at least one second opening is formed in the second ink black layer, and the light-emitting chip is located in the second opening.

4. The display module assembly according to claim 3, wherein an inner wall surface of the second opening is attached to a side surface of the corresponding light emitting chip; or,

and a gap is reserved between the inner wall surface of the second opening and the side surface of the corresponding light-emitting chip, and the matte layer fills the gap.

5. The display module according to claim 3, wherein the second black layer is made of one or more of silicone, epoxy, photosensitive ink and photosensitive glue; one or more of diffusion powder, matte powder and coloring powder are doped in the silica gel or the epoxy resin.

6. The display module according to any one of claims 1-5, further comprising a second conductive circuit disposed on the second surface of the circuit board, a conductive via disposed within the circuit board and extending through the first and second surfaces; the second conductive circuit is conductively connected to the first conductive circuit through the conductive via.

7. The display module of claim 6, further comprising an auxiliary circuit board and/or an electronic device in conductive connection with the second conductive circuit.

8. A method for manufacturing a display module according to any one of claims 1 to 7, comprising the steps of:

s1, arranging a first conductive circuit on the first surface of the circuit board;

s2, arranging a light-emitting chip on the first surface of the circuit board, and electrically connecting the light-emitting chip with the first conductive circuit;

s3, arranging a matte layer on the first surface of the circuit board, wherein the matte layer wraps the surface and the exposed side surface of the light-emitting chip;

and S4, arranging a first black ink layer on the first surface of the circuit board, wherein at least one first opening is formed on the first black ink layer, the first opening is correspondingly arranged above the light-emitting chip, and the matt layer arranged above the light-emitting chip is exposed.

9. The method for manufacturing a display module according to claim 8, wherein step S4 includes:

s4.1, arranging a first ink black layer on the first surface of the circuit board;

s4.2, arranging a mask on the surface of the first ink black layer;

s4.3, exposing and curing the first ink black layer uncovered by the mask;

s4.4, removing the mask;

s4.5, developing and removing the first ink black layer covered by the mask to form a first opening, and exposing the matt layer positioned above the light-emitting chip;

S4.6, thermally curing the first ink black layer;

alternatively, step S4 includes:

s4.1, arranging a first ink black layer on the first surface of the circuit board;

s4.2, arranging a mask on the surface of the first ink black layer;

s4.3, exposing the first ink black layer uncovered by the mask;

s4.4, removing the mask;

s4.5, developing and removing the first ink black layer which is not covered by the mask to form a first opening, and exposing the matt layer positioned above the light-emitting chip;

s4.6, thermally curing the first ink black layer;

alternatively, step S4 includes:

s4.1, arranging a mask on the first surface of the circuit board;

s4.2, arranging a first ink black layer on the mask;

s4.3, removing the mask or removing the mask after pre-curing, forming a first opening on the first ink black layer, and exposing the matte layer positioned above the light-emitting chip;

and S4.4, curing the first ink black layer.

10. The method for manufacturing a display module according to claim 8, wherein the step S2 further comprises the steps of:

s2.1, arranging a second ink black layer on the first surface of the circuit board, wherein the second ink black layer is provided with at least one second opening, and the light-emitting chip is arranged in the second opening; the inner wall surface of the second opening is attached to the side surface of the corresponding light-emitting chip or a gap is reserved;

In step S3, the matte layer is provided over the second ink black layer; and when a gap is reserved between the inner wall surface of the second opening and the side surface of the corresponding light-emitting chip, the sub-optical layer fills the gap.

11. The method for manufacturing a display module according to claim 10, wherein step S2.1 comprises:

s2.1.1, arranging the second black ink layer on the first surface of the circuit board;

s2.1.2, heating and curing the second ink black layer;

alternatively, step S2.1 comprises:

s2.1.1, arranging a mask on the first surface of the circuit board;

s2.1.2, disposing a second black layer of ink on the mask;

s2.1.3, removing the mask or removing the mask after pre-curing, forming a second ink black layer with a second opening on the first surface, the light emitting chip being disposed in the second opening;

s2.1.4, curing the second black layer;

alternatively, step S2.1 comprises:

s2.1.1, disposing a second black ink layer on the first surface of the circuit board;

s2.1.2, arranging a mask on the surface of the second ink black layer;

s2.1.3, exposing and curing the second black ink layer uncovered by the mask;

s2.1.4, removing the mask;

S2.1.5, developing and removing the second ink black layer covered by the mask to form a second opening, and exposing the light emitting chip arranged in the second opening;

s2.1.6, thermally curing the second black layer;

alternatively, step S2.1 comprises:

s2.1.1, disposing the second ink black layer on the first surface of the wiring board;

s2.1.2, arranging a mask on the surface of the second ink black layer;

s2.1.3, exposing the second black layer of ink not covered by the mask;

s2.1.4, removing the mask;

s2.1.5, developing and removing the second ink black layer uncovered by the mask to form a second opening, and exposing the light emitting chip arranged in the second opening;

s2.1.6, heat curing the second ink black layer.

12. The method for manufacturing a display module according to any one of claims 8 to 11, wherein step S1 further includes: the circuit board is provided with a conductive channel penetrating through the first surface and the second surface of the circuit board, the second surface is provided with a second conductive circuit, and the first conductive circuit and the second conductive circuit are respectively in conductive connection with the conductive channel.

13. The method for manufacturing a display module according to claim 12, further comprising the steps of:

S5, arranging an electronic device on the second surface of the circuit board, and enabling the electronic device to be in conductive connection with the second conductive circuit; and/or arranging at least one auxiliary circuit board on the second surface of the circuit board, and enabling the auxiliary circuit board to be in conductive connection with the second conductive circuit.

14. A display module is characterized by comprising a circuit board with a first surface and a second surface which are opposite, a first conductive circuit arranged on the first surface of the circuit board, a light-emitting chip, a matte layer and an ink black layer;

the light-emitting chip is in conductive connection with the first conductive circuit; the matte layer wraps the surface and the exposed side face of the light-emitting chip on the first surface;

the black ink layer is arranged between the first surface and the matte layer, at least one opening is formed in the black ink layer, and the light-emitting chip is located in the opening.

15. The display module assembly according to claim 14, wherein an inner wall surface of the opening is attached to a side surface of the corresponding light emitting chip; or,

gaps are reserved between the inner wall surfaces of the openings and the corresponding side surfaces of the light-emitting chips, and the sub-optical layers fill the gaps.

16. The display module according to claim 14, wherein the matte layer is made of silica gel or epoxy resin and doped with one or more of diffusion powder, matte powder and coloring powder;

the black ink layer is made of one or a plurality of combinations of silica gel, epoxy resin, photosensitive ink and photosensitive glue; one or more of diffusion powder, matte powder and coloring powder are doped in the silica gel or the epoxy resin.

17. The display module of any one of claims 14-16, further comprising a second conductive circuit disposed on the second surface of the wiring board, a conductive via disposed within the wiring board and extending through the first and second surfaces; the second conductive circuit is conductively connected to the first conductive circuit through the conductive via.

18. The display module of claim 17, further comprising an auxiliary circuit board and/or an electronic device in conductive connection with the second conductive circuit.

19. A method for manufacturing a display module according to any one of claims 14 to 18, comprising the steps of:

s1, arranging a first conductive circuit on the first surface of the circuit board;

S2, arranging a light-emitting chip on the first surface of the circuit board, and electrically connecting the light-emitting chip with the first conductive circuit;

s3, arranging an ink black layer on the first surface of the circuit board, wherein at least one opening is formed on the ink black layer, and the light-emitting chip is arranged in the opening;

and S4, arranging a matte layer on the first surface of the circuit board, wherein the matte layer wraps the surface and the exposed side surface of the light-emitting chip and covers the black ink layer.

20. The method for manufacturing a display module according to claim 19, wherein the step S3 comprises:

s3.1, arranging the black ink layer on the first surface of the circuit board;

s3.2, heating and curing the black ink layer;

alternatively, step S3 includes:

s3.1, arranging a mask on the first surface of the circuit board;

s3.2, arranging an ink black layer on the mask;

s3.3, removing the mask or removing the mask after pre-curing, forming an ink black layer with an opening on the first surface, and arranging the light-emitting chip in the opening;

s3.4, curing the black ink layer;

alternatively, step S3 includes:

s3.1, arranging an ink black layer on the first surface of the circuit board;

S3.2, arranging a mask on the surface of the black ink layer;

s3.3, exposing and curing the black ink layer which is not covered by the mask;

s3.4, removing the mask;

s3.5, developing and removing the black layer covered by the mask to form an opening, and exposing the light-emitting chip arranged in the opening;

s3.6, thermally curing the ink black layer;

alternatively, step S3 includes:

s3.1, arranging the black ink layer on the first surface of the circuit board;

s3.2, arranging a mask on the surface of the black layer;

s3.3, exposing the ink black layer which is not covered by the mask;

s3.4, removing the mask;

s3.5, developing and removing the ink black layer which is not covered by the mask to form an opening, and exposing the light-emitting chip arranged in the opening;

and S3.6, thermally curing the ink black layer.

21. The method for manufacturing a display module according to claim 19, wherein the step S1 further comprises: and arranging a conductive channel penetrating through the first surface and the second surface of the circuit board on the circuit board, arranging a second conductive circuit on the second surface, and respectively connecting the first conductive circuit and the second conductive circuit with the conductive channel in a conductive manner.

22. The method for manufacturing a display module according to claim 21, further comprising the steps of:

s5, arranging an electronic device on the second surface of the circuit board, and enabling the electronic device to be in conductive connection with the second conductive circuit; and/or arranging at least one auxiliary circuit board on the second surface of the circuit board, and enabling the auxiliary circuit board to be in conductive connection with the second conductive circuit.

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