CN114763986A - Device and method for measuring thickness of dielectric layer in circuit board - Google Patents

Abstract

The method for measuring the thickness of the dielectric layer in the circuit board of the present invention includes the following steps. First, a circuit board is provided, the circuit board includes at least one dielectric layer and at least two circuit layers, the dielectric layer is interposed between the circuit layers, and the circuit board further includes a test area, and a test area is provided on the test area Test pattern and consistent perforation. Next, a measuring device is provided. The measuring device includes a main body, at least one light source and a lens module. Wherein, when the main body portion penetrates into the through hole, the light source emits light to illuminate the dielectric layer and the metal layer, and the lens module captures the dielectric layer and the metal layer to form a captured image, and the dielectric layer is obtained by capturing the image. layer thickness. The beneficial effect of the present invention is that the thickness of the dielectric layer of the circuit board can be measured quickly and conveniently without destroying the circuit board.

Description

Measuring device and measuring method of dielectric layer thickness in circuit board

technical field

The present invention relates to a measuring device and method for measuring the thickness of a dielectric layer in a circuit board, in particular to a measuring device and method for measuring the thickness of a dielectric layer in a circuit board with a light source and a lens module.

Background technique

At present, the thickness of the dielectric layer of the circuit board is mainly measured by destructive methods. For example, a part of the circuit board to be tested must be cut off first, and a measurement slice is made, and then an optical microscope (Optical Microscope) or scanning method is used. Electron microscope (Scanning Electron Microscope) measures the thickness of the dielectric layer. However, this measurement method is very time-consuming and labor-intensive, and also damages a large area of the circuit board and makes the circuit board scrapped.

Therefore, how to quickly and conveniently measure the thickness of the dielectric layer of the circuit board is worthy of consideration by those with ordinary knowledge in the art.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a method for measuring the thickness of the dielectric layer in the circuit board, which can quickly and conveniently measure the thickness of the dielectric layer in the circuit board without destroying the circuit. plate.

The method for measuring the thickness of the dielectric layer in the circuit board of the present invention includes the following steps:

First, a circuit board is provided, the circuit board includes at least one dielectric layer and at least two circuit layers, the dielectric layer is interposed between the circuit layers, and the circuit board further includes a test area, and a test area is provided on the test area A test pattern and a through hole, the test pattern includes at least two metal layers, the metal layer is a part of the circuit layer, and the side surface of the through hole includes the section of the dielectric layer and the section of the metal layer.

Next, a measuring device is provided. The measuring device includes a main body, at least one light-emitting source and a lens module. The light-emitting source and the lens module are arranged on the main body. The main body part is used to penetrate deep into the through hole. Wherein, when the main body part penetrates deep into the through hole, the light source emits light to illuminate the dielectric layer and the metal layer, and the lens module captures the dielectric layer and the metal layer to form a captured image. Know the thickness of the dielectric layer.

In the above-mentioned method for measuring the thickness of the dielectric layer in the circuit board, the light source and the lens module are arranged on the same side of the main body.

In the above-mentioned method for measuring the thickness of a dielectric layer in a circuit board, the number of light-emitting sources is multiple, the light-emitting sources and the lens module are arranged at one end of the main body, and the light-emitting sources surround the lens module.

In the above-mentioned method for measuring the thickness of the dielectric layer in the circuit board, the light-emitting source is a light-emitting diode.

In the above-mentioned method for measuring the thickness of the dielectric layer in the circuit board, the lens module is a CCD lens module or a CMOS lens module.

Another object of the present invention is to provide a measuring device, which can quickly and conveniently measure the thickness of the dielectric layer of the circuit board without destroying the circuit board.

The measuring device of the present invention is applied to measure the thickness of a dielectric layer of a circuit board. The circuit board includes at least one dielectric layer and at least two circuit layers. The dielectric layer is between the circuit layers, and the circuit board includes at least one dielectric layer and at least two circuit layers. It also includes a test area, a test pattern and a through hole are arranged on the test area, the test pattern includes at least two metal layers, the metal layer is a part of the circuit layer, and the side surface of the through hole is the dielectric layer The cross section of the metal layer is composed of the cross section of the metal layer, and the measuring device includes a main body, at least one light source and a lens module. Wherein, the main body part is used to penetrate into the through hole, and the light source and the lens module are arranged in the main body part. Wherein, when the main body portion penetrates into the through hole, the light source emits light to illuminate the dielectric layer and the metal layer, and the lens module is used for photographing the dielectric layer and the metal layer to form a photographed image.

In the above-mentioned measuring device, the light source and the lens module are arranged on the same side of the main body.

In the above-mentioned measuring device, the number of the light-emitting sources is plural, the light-emitting sources and the lens module are disposed at one end of the main body, and the light-emitting sources surround the lens module.

In the above-mentioned measuring device, the light-emitting source is a light-emitting diode.

In the above-mentioned measuring device, the lens module is a CCD lens module or a CMOS lens module.

In the above-mentioned measuring device, the number of layers of the dielectric layer is plural, and the number of layers of the metal layer is plural.

The invention has the following advantages: only need to form a through hole in the preset test area, that is, the measuring device can be inserted into the through hole to photograph the dielectric layers of each layer of the circuit board, and the required area is small and fast and convenient , without destroying the circuit board.

In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the following detailed description will be given by taking the embodiments and the accompanying drawings as follows. It should be noted that each component in the accompanying drawings is only for illustration, and is not drawn according to the actual scale of each component.

Description of drawings

FIG. 1 is a schematic diagram of a method for measuring the thickness of a dielectric layer in a circuit board according to the present invention.

FIG. 2A is a schematic partial cross-sectional view of the circuit board 10 .

FIG. 2B is a schematic diagram of the measuring device 8 of the present invention.

FIG. 3A is a schematic view of the measuring device 8 about to penetrate into the through hole 10H.

FIG. 3B is a schematic diagram of the measuring device 8 moving into the through hole 10H.

FIG. 3C is a schematic diagram of the captured image 8P.

FIG. 4 is a schematic diagram of a measuring device 8 ′ according to another embodiment.

Detailed ways

Please refer to FIG. 1 . FIG. 1 is a schematic diagram of a method for measuring the thickness of a dielectric layer in a circuit board according to the present invention. The measurement method of the thickness of the dielectric layer in the circuit board includes the following steps:

First, please refer to step S1 and FIG. 2A . FIG. 2A is a schematic partial cross-sectional view of the circuit board 10 , and a circuit board 10 is provided. Those with ordinary knowledge should understand that in practice, the circuit board 10 may include more dielectric layers 12 and circuit layers 13 , or the circuit board 10 may only include one dielectric layer 12 and two circuit layers 13 . Moreover, the dielectric layer 12 is interposed between the two circuit layers 13 .

In addition, the circuit board 10 further includes a test area 10T, and a test pattern 102 and a through hole 10H are arranged on the test area 10T. In detail, in the manufacturing process of the circuit board 10 , the metal layer 1022 and the circuit layer 13 are formed at the same time, so the number of layers of the metal layer 1022 and the circuit layer 13 in this embodiment is the same as four layers. In addition, in this embodiment, the side surface of the through hole 10H is composed of the section of the dielectric layer 12 and the section of the metal layer 1022 . That is, the side surface of the through hole 10H exposes the dielectric layer 12 and the metal layer 1022 .

After that, please refer to step S2 and FIG. 2B. FIG. 2B is a schematic diagram of the measuring device 8 of the present invention, and a measuring device 8 is provided. The measuring device 8 includes a main body portion 80, at least one light-emitting source 81 and A lens module 82, the light source 81 is, for example, a light emitting diode (LED), and the lens module 82 is, for example, a CCD lens module or a CMOS lens module. Moreover, the light source 81 and the lens module 82 are disposed on the same side of the main body portion 80 , and the main body portion 80 is used to penetrate into the through hole 10H.

After that, please refer to step S3 and FIGS. 3A to 3C . FIG. 3A shows a schematic diagram of the measuring device 8 about to penetrate into the through hole 10H, and FIG. 3B shows a schematic diagram of the measuring device 8 moving into the through hole 10H. FIG. 3C is a schematic diagram of the captured image 8P. When the main body portion is 80 deep into the through hole 10H, the light source 81 emits light to illuminate the dielectric layer 12 and the metal layer 1022 in the through hole 10H, and the lens module 82 simultaneously captures the dielectric layer 12 and the metal layer 1022 to form A captured image 8P. During the photographing process, the lens module 82 can photograph the cross-sections of the multiple layers of the dielectric layer 12 and the metal layer 1022 at one time to form the photographed image 8P. Alternatively, the lens module 82 can also take pictures of different dielectric layers 12 and metal layers 1022 in stages from top to bottom, and then combine the pictures into a photographed image 8P in a post-production manner.

Since the material of the metal layer 1022 is metal, it will have a higher light reflectivity than the dielectric layer 12. Therefore, the light reflection difference between the metal layer 1022 and the dielectric layer 12 in the captured image 8P is used to form a bright part. and the dark portion, the thickness of each dielectric layer 12 can be calculated. Therefore, compared with the traditional method of measuring the thickness of the dielectric layer of the circuit board, the method for measuring the thickness of the dielectric layer in the circuit board of the present invention can quickly and conveniently measure the thickness of the dielectric layer of the circuit board 10 without the need for Destroy the circuit board 10 .

Please refer to FIG. 4 , which is a schematic diagram of a measuring device 8 ′ according to another embodiment. Light Sources In the embodiment shown in FIG. 4 , the number of light sources 81 ′ of the measuring device 8 ′ is multiple, and the light sources 81 ′ and the lens module 82 ′ are both disposed at one end of the main body 80 ′, And these light sources 81' surround the lens module 82'. During the photographing process, the lens modules 82 ′ photograph the dielectric layers 12 layer by layer, and then combine them into a photographed image 8P in a post-production manner.

To sum up, the present invention only needs to form the through hole 10H on the preset test area 10T, that is, the measuring device 8 or the measuring device 8 ′ can be inserted into the through hole 10H to photograph the dielectric layers of each layer of the circuit board 12 thickness, the required area is small and fast and convenient. Therefore, compared with the traditional method of measuring the thickness of the dielectric layer of the circuit board, the method for measuring the thickness of the dielectric layer in the circuit board of the present invention can quickly and conveniently measure the thickness of the dielectric layer 12 of the circuit board 10, and No need to destroy the circuit board.

The above-mentioned embodiments are only examples for the convenience of description, although any modifications may be made by those skilled in the art, they will not deviate from the scope of protection as claimed in the claims.

Claims (11)

1. A method for measuring the thickness of a dielectric layer in a circuit board, comprising: A circuit board is provided, the circuit board includes at least one dielectric layer and at least two circuit layers, the dielectric layer is between the circuit layers, and the circuit board also includes a test area, and a test area is provided on the test area A test pattern and a through hole, the test pattern includes at least two metal layers, the metal layer is a part of the circuit layer, and the side surface of the through hole includes a section of the dielectric layer and a section of the metal layer. ;and A measuring device is provided, the measuring device includes a main body, at least one light-emitting source and a lens module, the light-emitting source and the lens module are arranged on the main body, and the main body is used to penetrate into the through hole; Wherein, when the main body part penetrates into the through hole, the light source emits light to illuminate the dielectric layer and the metal layer, and the lens module captures the dielectric layer and the metal layer to form a captured image, by The captured image is used to know the thickness of the dielectric layer. 2 . The method for measuring the thickness of a dielectric layer in a circuit board as claimed in claim 1 , wherein the light-emitting source and the lens module are disposed on the same side of the main body. 3 . 3 . The method for measuring the thickness of a dielectric layer in a circuit board as claimed in claim 1 , wherein the number of the light-emitting sources is plural, and the light-emitting sources and the lens module are disposed at one end of the main body portion, 4 . And these light sources surround the lens module. 4. The method for measuring the thickness of a dielectric layer in a circuit board as claimed in claim 1, wherein the light-emitting source is a light-emitting diode. 5. The method for measuring the thickness of a dielectric layer in a circuit board according to claim 1, wherein the lens module is a CCD lens module or a CMOS lens module. 6. A measuring device, characterized in that it is used for measuring the thickness of a dielectric layer of a circuit board, the circuit board comprising at least one dielectric layer and at least two circuit layers, the dielectric layer being interposed between the circuit layers between, and the circuit board also includes a test area, a test pattern and a through hole are arranged on the test area, the test pattern includes at least two metal layers, the metal layer is a part of the circuit layer, and the The side surface of the through hole includes a section of the dielectric layer and a section of the metal layer, and the measuring device includes: a main body part for penetrating into the through hole; at least one light-emitting source disposed on the main body portion; and a lens module disposed on the main body; and Wherein, when the main body portion penetrates into the through hole, the light source emits light to illuminate the dielectric layer and the metal layer, and the lens module is used for photographing the dielectric layer and the metal layer to form a photographed image. 7 . The measuring device of claim 6 , wherein the light-emitting source and the lens module are disposed on the same side of the main body. 8 . 8 . The measuring device of claim 6 , wherein the number of the light-emitting sources is plural, the light-emitting sources and the lens module are disposed at one end of the main body portion, and the light-emitting sources surround the lens. 9 . module. 9. The measuring device of claim 6, wherein the light-emitting source is a light-emitting diode. 10 . The measuring device of claim 6 , wherein the lens module is a CCD lens module or a CMOS lens module. 11 . 11 . The measuring device of claim 6 , wherein the number of layers of the dielectric layer is plural, and the number of layers of the metal layer is plural. 12 .

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