CN114725002A - Chip bonding clamp and using method thereof - Google Patents
Chip bonding clamp and using method thereof Download PDFInfo
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- CN114725002A CN114725002A CN202210356672.0A CN202210356672A CN114725002A CN 114725002 A CN114725002 A CN 114725002A CN 202210356672 A CN202210356672 A CN 202210356672A CN 114725002 A CN114725002 A CN 114725002A
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- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 3
- BIJOYKCOMBZXAE-UHFFFAOYSA-N chromium iron nickel Chemical compound [Cr].[Fe].[Ni] BIJOYKCOMBZXAE-UHFFFAOYSA-N 0.000 claims description 3
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
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Abstract
The invention relates to the technical field of communication, and provides a chip bonding clamp and a use method thereof. Wherein including lower plate, punch holder and the clamping piece of setting between lower plate and punch holder, it is specific: the edge of the lower clamping plate is provided with a plurality of groove positions for placing chips; elastic pieces are arranged on the edges of the clamping pieces and in the positions corresponding to the groove positions in a one-to-one correspondence mode, and when the elastic pieces are pressed downwards, pins of the elastic pieces are abutted to the edges of the chips, so that the chips are fixed in the corresponding groove positions; the upper clamping plate is used for applying downward force to the elastic sheet when the upper clamping plate, the clamping piece and the lower clamping plate are clamped. The invention greatly improves the efficiency of chip batch production. And the fixing of each chip can still be realized under the condition that the process dimension error exists in the clamp or the chip.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a chip bonding clamp and a using method thereof.
Background
With the rapid development of 5G communication and the increasing demand of data centers, the market demand for multiplexing optical modules of 100G, 400G and the like is increasing, the demand for various electronic component chips used in optical modules is increasing, and generally, in order to obtain good high-frequency performance, the size of the chip is designed to be very small, so when the chip is bonded and welded, a clamp needs to be used to fix the chip correspondingly to ensure that the subsequent operation is performed normally, the current clamps on the market often use a single elastic sheet to fix the chip, and each chip needs to be bonded, the spring plates are required to be used for fixing, so that the labor consumption is high when the large-scale chip bonding is carried out, the efficiency is low, the large-scale chip processing requirements cannot be met, when a single elastic sheet is used for fixing a plurality of chips, part of the chips cannot be completely fixed due to the technological dimension error of the clamp or the chips.
In view of this, overcoming the drawbacks of the prior art is a problem to be solved urgently in the art.
Disclosure of Invention
The invention aims to solve the technical problem that when a plurality of chips are fixed by the conventional chip clamp, part of the chips can not be completely fixed.
The invention adopts the following technical scheme:
in a first aspect, the present invention provides a chip bonding fixture, which includes a lower clamp plate 1, an upper clamp plate 2, and a clamping plate 3 disposed between the lower clamp plate 1 and the upper clamp plate 2, specifically:
the edge of the lower clamping plate 1 is provided with a plurality of groove positions 11 for placing chips;
the clip 3 is provided with elastic pieces 31 at positions corresponding to the slots 11, and when the elastic pieces 31 are pressed downwards, pins 310 of the elastic pieces 31 are abutted against the edges of the chips, so that the chips are fixed in the corresponding slots 11;
the upper clamp 2 is used for applying a downward force to the elastic sheet 31 when the upper clamp 2, the clamping sheet 3 and the lower clamp 1 are clamped.
Preferably, the ends of the pins 310 of the elastic sheet 31 are provided with right-angled recesses, so that when the pins 310 are abutted against the edge of the chip, the right-angled recesses catch the right-angled edge of the chip.
Preferably, the device further comprises a detection plate 4 which is arranged above the clamping piece 3 and is used in replacement with the upper clamping plate 2, specifically:
the edge of the detection plate 4 and the position corresponding to the elastic sheet 31 are correspondingly provided with pressure detection components 41 one by one, when the detection plate 4, the clamping sheet 3 and the lower clamping plate 1 are clamped tightly, the pressure detection components 41 apply downward force to the elastic sheet 31 and detect the elastic force from the elastic sheet 31, so that the elastic state of the elastic sheet 31 is detected, and whether the clamping sheet 3 needs to be replaced or not is judged.
Preferably, the pressure detecting assembly 41 includes a first pressure sensor 410 and a detecting pin 411, specifically:
the detection pin 411 is disposed below the first pressure sensor 410, and the detection pin 411 contacts and presses the elastic sheet 31 by clamping the detection plate 4, the clamping sheet 3 and the lower clamp plate 1, and transmits the elastic force from the elastic sheet 31 to the first pressure sensor 410.
Preferably, the pressure detection assembly 41 is further connected to a processing module, specifically:
the processing module is used for receiving the pressure value from the pressure detection assembly 41, judging the elastic state of the elastic sheet 31 according to the pressure value, and judging whether the clamping sheet 3 needs to be replaced according to the elastic states of all the elastic sheets 31 in the clamping sheet 3.
Preferably, a distance detection assembly 42 is disposed below the detection plate 4 for measuring a distance between the detection plate 4 and the clip 3.
Preferably, it also comprises a clamping assembly 5, in particular:
clamping assembly 5 is including setting up the fixed orifices 51 in punch holder 2, detecting plate 4, clamping piece 3 and lower plate 1 to and be located 2 tops of punch holder and lower plate 1 below bolt 52 and nut 53 respectively, through with the screw rod of bolt 52 inserts in corresponding fixed orifices 51 and screws up with nut 53, realizes the clamp of punch holder 2, clamping piece 3 and lower plate 1 or realizes detecting plate 4, clamping piece 3 and lower plate 1's the clamp of pressing from both sides tightly.
Preferably, the clip is integrally formed using a high temperature resistant material.
Preferably, the high-temperature resistant material is one or more of iron-nickel alloy, iron-chromium alloy and iron-chromium-nickel alloy.
In a second aspect, the present invention provides a method for using a chip bonding jig, the method comprising:
clamping the lower clamping plate 1, the clamping piece 3 and the detection plate 4 by using the clamping assembly 5 so as to detect the elastic state of the elastic pieces 31 in the clamping piece 3, and replacing the clamping piece 3 if the number of the elastic pieces 31 with abnormal elastic state in the clamping piece 3 exceeds a preset number;
the detection plate 4 is detached, the upper clamping plate 2 is used for replacing the position of the detection plate 4, a chip is placed in the groove position 11 of the lower clamping plate 1, the clamping piece 3 and the upper clamping plate 2 are clamped by the clamping assembly 5, and the chip is fixed by the elastic piece 31 and the groove position 11 together, so that the chip can be used for bonding of the chip.
Compared with the prior art, the invention has the beneficial effects that: according to the invention, the plurality of groove positions are arranged on the lower clamping plate and are used for placing a plurality of chips, so that the plurality of chips can be fixed and bonded at high temperature at one time when large-scale chip bonding is carried out, and the efficiency of chip batch production is greatly improved. And the elastic sheets are arranged in each slot position in a one-to-one correspondence manner, so that under the condition that the fixture or the chip has process dimension errors, the chip can be fixed through the abutting of the elastic sheets.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is an assembly schematic diagram of a chip bonding fixture according to an embodiment of the present invention;
FIG. 2 is a top view of a chip bonding fixture provided in accordance with an embodiment of the present invention when clamped;
FIG. 3 is an enlarged view of a portion of a spring plate of a chip bonding fixture according to an embodiment of the present invention;
FIG. 4 is a schematic diagram illustrating an assembly of a chip bonding fixture according to an embodiment of the present invention;
FIG. 5 is a schematic side view of a chip bonding fixture according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a pressure probe assembly of a chip bonding fixture according to an embodiment of the present invention;
FIG. 7 is an assembled view of a chip bonding fixture according to an embodiment of the present invention;
FIG. 8 is a schematic side view of a chip bonding fixture according to an embodiment of the present invention;
fig. 9 is an assembly view of a chip bonding jig according to an embodiment of the present invention;
fig. 10 is a top view of a chip bonding fixture provided in accordance with an embodiment of the present invention when clamped;
fig. 11 is a flowchart of a method for using a chip bonding jig according to an embodiment of the present invention.
In all the figures, the reference numerals are as follows, wherein:
1. a lower splint; 11. a slot position; 2. an upper splint; 3. a clip; 31. a spring plate; 310. a pin; 4. a detection plate; 41. a pressure detection assembly; 410. a first pressure sensor; 411. detecting a pin; 42. a distance detection assembly; 5. a clamping assembly; 51. a fixing hole; 52. a bolt; 53. and (4) a nut.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are for convenience only to describe the present invention without requiring the present invention to be necessarily constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1:
the edge of the lower clamping plate 1 is provided with a plurality of groove positions 11 for placing chips;
the clamping piece 3 is integrally formed by using a high-temperature-resistant material, the elastic pieces 31 are correspondingly arranged at the edge of the clamping piece 3 and at the positions corresponding to the slot positions 11 one by one, and when the elastic pieces 31 are pressed downwards, pins 310 of the elastic pieces 31 are abutted against the edge of the chip, so that the chip is fixed in the corresponding slot positions 11;
the upper clamp 2 is used for applying a downward force to the elastic sheet 31 when the upper clamp 2, the clamping sheet 3 and the lower clamp 1 are clamped.
Wherein each slot 11 corresponds to one spring plate 31, one slot 11 is used for placing one chip, 16 slots 11 are respectively arranged at the front edge and the rear edge of the lower splint 1 as shown in figure 1, 16 elastic sheets 31 are correspondingly arranged at the front edge and the rear edge of the clamping piece 3, the elastic sheets 31 can be V-shaped elastic sheets 31 with downward openings or arc-shaped elastic sheets 31 bent downward, when the spring plate 31 is pressed downwards by the upper clamping plate 2, the pin 310 of the spring plate 31 is deformed by the compression of the upper clamping plate 2 and the lower clamping plate 1, so that the pin 310 of the elastic sheet 31 abuts against the edge of the chip, the abutting can be against one side of the chip or against a plurality of sides of the chip, the abutting specifically means that the pin 310 of the elastic sheet 31 contacts with the edge of the chip and has an interaction force, the chip can be fixed in the slot 11 by mutual pressing of the pin 310, the chip and the inner wall of the slot 11.
This embodiment is through setting up a plurality of trench on the lower plate for place a plurality of chips, thereby can once only fix and high temperature bonding a plurality of chips when carrying out extensive chip bonding, greatly improve chip batch production's efficiency. And the elastic sheets are arranged in each slot position in a one-to-one correspondence manner, so that under the condition that the fixture or the chip has process dimension errors, the chip can be fixed through the abutting of the elastic sheets.
In practical situations, bonding of chips generally requires high temperature conditions, and in view of this problem, in combination with the above embodiments, there is a preferred implementation method, specifically including: the clamping piece is integrally formed by using high-temperature-resistant materials.
Because the clamping piece 3 is integrally formed by high-temperature-resistant materials, the heat-conducting property and the temperature resistance of the clamping piece are better, and the requirement of high-temperature bonding of a chip can be met. The high temperature resistant material is one or more of iron-nickel alloy, iron-chromium alloy and iron-chromium-nickel alloy, for example, the clamping piece 3 is made of stainless steel material of iron-chromium alloy. The upper plate 2 may be a rectangular plate capable of covering each of the elastic pieces 31.
This implementation is fixed through using the clamping piece 3 by high temperature resistant material integrated into one piece preparation to carry out the butt to the chip, prevent that clamping piece 3 from taking place because of the condition that the high temperature condition becomes fragile rupture or softens the unable condition of fixing the chip, thereby can satisfy the chip and need carry out the demand of bonding under the high temperature condition, and because lower plate 1 is provided with a plurality of trench 11, can place a plurality of chips, and this embodiment is because it is anchor clamps itself, can not only be applied to the bonding of chip, still can be used to the ageing of chip, a great deal of scenes such as test.
In the above embodiment, the fixing of the chip is realized by abutting the pins 310 of the elastic sheet 31 against the edge of the chip, and in order to further improve the fixing effect of the chip, in combination with the above embodiment, there is the following preferred implementation manner, as shown in fig. 3, which specifically includes:
the tail end of the pin 310 of the elastic sheet 31 is provided with a right-angled concave part, so that when the pin 310 abuts against the edge of the chip, the right-angled concave part clamps the right-angled edge of the chip.
The ends of the pins 310 of the elastic sheet 31 are arranged into right-angle concave parts, and the right-angle edges of the chip are clamped into the right-angle concave parts, so that the elastic sheet 31 applies inward force to two adjacent edges of the chip, and the chip is fixed more stably.
Since the chip is placed in the slot 11 and the direction of the chip is determined by the slot 11, the right angle direction is also determined by the slot 11, and the direction of the spring 31 and the direction of the right angle recess are determined according to the slot 11 in order to clamp the right angle edge of the chip.
This preferred implementation mode makes the chip fixed more firm through carrying out the butt to two adjacent limits of chip, avoids the bonding failure that leads to because of the chip is not completely fixed in the chip high temperature bonding process, improves the bonding efficiency of chip.
In the above embodiment, in order to ensure the heat resistance and elasticity of the clip 3, the clip 3 and the elastic sheet 31 on the clip 3 are usually made of metal, and the metal usually has elasticity limit, that is, when the external force applied exceeds the corresponding elastic allowable range, the elastic sheet 31 loses elasticity to cause deformation and failure to recover or the elastic sheet 31 is broken, that is, the elastic state of the elastic sheet 31 is abnormal, and long-term repeated deformation and recovery of the elastic sheet 31 in the using process also affects the service life of the elastic sheet 31, and the high temperature environment will aggravate the arrival of the elasticity limit of the elastic sheet 31, and if the elastic sheet 31 with abnormal elasticity state is used, the situation that the force applied to the chip when the elastic sheet 31 is abutted against the chip is not enough to keep the chip fixed or the elastic sheet 31 cannot be abutted against the chip normally may occur, in combination with the above embodiments, there are the following preferred embodiments, as shown in fig. 4 and 5, the clamp further includes a detection plate 4 disposed above the clamping piece 3 and used in place of the upper clamping plate 2, specifically:
the edge of the detection plate 4 and the position corresponding to the elastic sheet 31 are correspondingly provided with pressure detection components 41 one by one, when the detection plate 4, the clamping sheet 3 and the lower clamping plate 1 are clamped tightly, the pressure detection components 41 apply downward force to the elastic sheet 31 and detect the elastic force from the elastic sheet 31, so that the elastic state of the elastic sheet 31 is detected, and whether the clamping sheet 3 needs to be replaced or not is judged.
The replacement specifically means that the upper plate 2 is used when the chip is fixed and bonded, and the detection plate 4 is used before and after the chip is fixed and when it is necessary to detect whether the clip 3 can be used normally.
The elastic state of the elastic sheet 31 includes normal elasticity and abnormal elasticity. Each elastic sheet 31 is provided with a pressure detection assembly 41, when the elastic sheet 31 is subjected to a downward force applied by the pressure detection assembly 41, the elastic sheet 31 deforms, and the trend of deformation recovery exists due to the elasticity of the elastic sheet, so that the upward elastic force is generated on the pressure detection assembly 41, and the elastic state of the elastic sheet 31 can be known according to the elastic force.
This preferred embodiment detects the elastic state of shell fragment 31 through using the probe board 4 to the life-span of detectable clamping piece 3 is changed the clamping piece 3 that shell fragment 31 reachd elastic limit, avoids in large-scale chip bonding process, leads to the chip not fixed completely and arouses the bonding failure because of using unqualified anchor clamps, and then improves the success rate of chip bonding, avoids unnecessary material loss.
In the above preferred embodiment, there is a detailed implementation manner for the pressure detection assembly 41 in combination with the above embodiments, as shown in fig. 6, the pressure detection assembly 41 includes a first pressure sensor 410 and a detection pin 411, specifically:
the detection pin 411 is disposed below the first pressure sensor 410, and the detection pin 411 contacts and presses the elastic sheet 31 by clamping the detection plate 4, the clip 3 and the lower clamp plate 1, and transmits the elastic force from the elastic sheet 31 to the first pressure sensor 410.
The first pressure sensor 410 may employ a ceramic pressure sensor, a piezoresistive first pressure sensor 410, or the like, which may be disposed inside the detection plate to prevent contact with the clip when clamping the clip. The detection pin 411 may be a cylinder disposed below the stressed surface of the first pressure sensor 410, one end of the cylinder contacts with the first pressure sensor 410, and the other end contacts with the elastic sheet 31, for example, when a ceramic pressure sensor is used, the cylinder may be directly adhered to the stressed surface of the pressure sensor, or a soft belt may be disposed around the pressure sensor, so as to fix the cylinder in a manner of connecting the cylinder with the soft belt, and more so as to prevent the cylinder from dropping by disposing a limiting housing as shown in fig. 6 outside the cylinder. In order to optimize the accuracy of the first pressure sensor 410 for detecting the elastic force of the elastic sheet 31, the detection pin 411 may act on the main stressed position of the elastic sheet 31, for example, if the elastic sheet 31 is a V-shaped elastic sheet 31 with a downward opening, the detection pin 411 may act on an upward protruding position of the elastic sheet 31, so as to most obviously sense the elastic force change of the elastic sheet 31 when being deformed.
In some cases, when the success rate of chip bonding is required, the clip 3 may be detected once every time one or more bonding is performed, and even in order to improve the efficiency of chip bonding, the assembly of the fixture, the bonding of the chip, and the detection of the lifetime of the clip 3 may all be completed by using a mechanical automation means, at this time, after the bonding is completed, the temperature of the clip 3 may not wait for the complete drop of the temperature, and the process of detecting the lifetime of the clip 3 is already entered, and the temperature generally affects the precision of the first pressure sensor 410, the first pressure sensor 410 generally has a preset working temperature range, when the working temperature range is exceeded, the pressure value detected by the first pressure sensor may have a certain deviation, if the influence of the temperature needs to be eliminated, and if the accuracy of the measured pressure value is maintained, the first pressure sensor 410 needs to be temperature compensated according to the temperature at which the first pressure sensor 410 is located, this not only has increased the technical difficulty, has additionally introduced the temperature sensor for measuring the temperature, has increased the manufacturing cost of anchor clamps, and in above-mentioned implementation, because first pressure sensor 410 is not direct with shell fragment 31 contact, but contacts and transmits pressure through detecting pin 411, thus can prevent that the temperature of shell fragment 31 from directly influencing the measurement accuracy of first pressure sensor 410, and on the basis of above-mentioned implementation, still can design detecting pin 411 to be made by thermal insulation material, thereby slows down the speed that the heat transmits to first pressure sensor 410, and the consuming time of carrying out the detection of clamping piece 3 through mechanical automation means is short, thereby can guarantee the measurement accuracy of first pressure sensor 410 in short detection time.
In the above embodiments, whether the chip is fixed or the clip 3 is detected, the clamp needs to be clamped, and for this, in combination with the above embodiments, there is also a preferred embodiment, as shown in fig. 7, that is, the clamp further includes a clamping assembly 5, specifically:
the clamping assembly 5 comprises fixing holes 51 arranged in the upper clamping plate 2, the detection plate 4, the clamping piece 3 and the lower clamping plate 1, and bolts 52 and nuts 53 respectively positioned above the upper clamping plate 2 and below the lower clamping plate 1, and the clamping of the clamp is realized by inserting screws of the bolts 52 into the corresponding fixing holes 51 and screwing the bolts with the nuts 53.
The clamping of the clamp is realized as follows: when the chip is fixed, the upper clamping plate 2, the clamping piece 3 and the lower clamping plate 1 are clamped, and when the elastic state of the elastic piece 31 is detected, the detection plate 4, the clamping piece 3 and the lower clamping plate 1 are clamped.
In general, in order to ensure the convenience of mounting and taking the device to be fixed, the common fixture will set the clamping assembly 5 to be more easily assembled and disassembled, for example, the fixture is clamped by using an artificial clamping rod, and then the clamping fixture is clamped and fixed by fixing the clamping rod, while in the preferred embodiment, because the actual scene of chip bonding, i.e. the chip has a small volume and the requirement of bonding precision is high, the chip is welded by mechanical automation or semi-automation means, when welding, the fixture is integrally placed on the corresponding welding device, so that the firmness of fixture assembly needs to be preferentially ensured, so as to prevent the loosening of the fixture when rotating in the welding device from influencing the bonding welding of the chip, the fixture is fixed by using the bolts 52 and the nuts 53, and when the chip needs to be mechanically assembled and disassembled, i.e. the whole line of the fixture is assembled and disassembled, When the welding of the chip is completed by a machine, the clamping mode of the bolt 52 and the nut 53 can be adapted with mechanized equipment under the condition of no change, so that the automatic clamping of the clamp is realized, the labor cost is reduced, and the efficiency of chip large-batch bonding is improved.
This embodiment is through last splint 2, detection board 4, set up fixed orifices 51 in clamping piece 3 and the lower plate 1, and realize the clamp of anchor clamps and fix through bolt 52 and nut 53, thereby need not the manpower and maintain the tight state of clamp's clamp, and the tight degree of form accessible control screw in nut 53 through bolt 52 degree control anchor clamps, make when using detection board 4 to detect clamping piece 3, the size of adjustable pressure detection subassembly 41 to the power of shell fragment 31, thereby find the most suitable measuring size, make the elastic state detection of shell fragment 31 more accurate.
In practical situations, the magnitude of the elastic force of the elastic sheet 31 is related to the degree of deformation thereof, and generally, the greater the degree of deformation, the greater the elastic force, and in the above preferred embodiment, when the bolt 52 and the nut 53 are tightened manually to clamp the fixture, there may be a case where the clamping degrees of different clamping sheets 3 are inconsistent, resulting in inconsistent deformation degree of the elastic sheet 31, so as to detect that the magnitude of the elastic force of the elastic sheet 31 in different clamping sheets 3 is inconsistent, which affects the judgment of the elastic state of the elastic sheet 31, and according to inconsistent clamping degrees, there may be a case where the pressure detection component 41 applies too much pressure to the elastic sheet 31, resulting in exceeding the elastic limit of the elastic sheet 31, for this problem, there are the following preferred implementation manners, as shown in fig. 8, specifically including:
a distance detection assembly 42 is arranged below the detection plate 4 and used for measuring the distance between the detection plate 4 and the clamping piece 3.
This embodiment is through measuring the interval between detecting plate 4 and the clamping piece 3 to calculate the deformation degree of shell fragment 31, can reverse the derivation by the deformation degree and obtain the elasticity size that shell fragment 31 should produce, when measuring the elasticity size that obtains and the deformation degree mismatch, then think that shell fragment 31 elastic state is unusual. Thereby, the elastic state of the elastic sheet 31 can be judged more accurately. And through monitoring and controlling the interval between the detection plate 4 and the clamping piece 3, the situation that the interval between the detection plate 4 and the clamping piece 3 is too small to cause too large force application to the elastic piece 31 can be prevented, and the elastic piece 31 is prevented from being damaged in the elastic state detection process.
In a general case, the assembly for measuring the distance or distance is a distance sensor, an optional distance sensor is an infrared sensor, and there is also an implementation that the distance detection assembly 42 includes a first pressure sensor 410 and an elastic probe disposed below the first pressure sensor 410, specifically:
the inside spring that is provided with of probe, when pressing from both sides tight with detecting board 4, clamping piece 3 and lower plate 1, the probe contacts with clamping piece 3 and is compressed to the extrusion spring is to the second pressure sensor application of force, calculates the interval between obtaining detecting board 4 and the clamping piece 3 according to the pressure value that second pressure sensor measured.
The first pressure sensor 410 can be arranged on the lower surface of the detection plate 4, a groove matched with the first pressure sensor 410 can be dug below the detection plate 4, the first pressure sensor 410 is embedded into the groove to be arranged and installed, the installation position of the first pressure sensor depends on the allowable minimum distance between the detection plate 4 and the clamping piece 3, and when the allowable minimum distance is smaller than the thickness of the pressure sensor, the pressure sensor is embedded into the detection plate 4, so that the detection plate 4 and the clamping piece 3 can be effectively prevented from being blocked by the pressure sensor.
This embodiment is through the mode measurement that uses elasticity probe and second pressure sensor combination to survey the interval between 4 and the clamping piece 3, thereby the measurement of applicable small interval, and because elasticity probe usually has compression limit, when elasticity probe is compressed to minimum height, elasticity probe can't be continued to compress, thereby the minimum interval between control detection board 4 and the clamping piece 3, in order to prevent that pressure detection subassembly 41 from surpassing the elasticity limit of shell fragment 31 to the too big and elastic force of shell fragment 31 application, protection shell fragment 31 does not detect the damage because of elasticity.
In the above preferred embodiment, the elastic force of the elastic sheet 31 is measured by the pressure detection component 41, but obtaining the elastic state of the elastic sheet 31 according to the elastic force of the elastic sheet 31 still requires a series of calculation and analysis processes, and for this problem, in combination with the above embodiment, there is also a preferred implementation manner that the pressure detection component 41 is further connected with a processing module, specifically:
the processing module is used for receiving the pressure value from the pressure detection assembly 41, judging the elastic state of the corresponding elastic sheet 31 according to the pressure value, and judging whether the clamping sheet 3 needs to be replaced according to the elastic states of all the elastic sheets 31 in the clamping sheet 3.
The processing module may be directly disposed on the detection plate 4, or a corresponding signal transmission device may be disposed on the detection plate 4, and the pressure value detected by the pressure detection component 41 is transmitted to a remote processing module.
The determining the elastic state of the corresponding elastic sheet 31 according to the pressure value specifically includes:
aiming at the elastic sheet 31 with the normal standard elastic state, the corresponding elastic values of the elastic sheet 31 with the normal standard elastic state in different deformation states are obtained through testing, the preset elastic range is set according to the corresponding elastic values of the elastic sheets 31 with the normal elastic state, when the pressure detection assembly 41 detects that the obtained pressure value is not in the preset elastic range, the elastic state of the elastic sheet 31 is considered to be abnormal, and the chip is fixed by using the elastic sheet 31 with the abnormal elastic state to be unreliable. Without limiting or measuring the deformation degree of the spring 31, the preset elastic force range for comparison should be all possible elastic force values within the deformable range of the spring 31.
When the number of the elastic pieces 31 with abnormal elasticity state in the clamping piece 3 exceeds the preset number, the clamping piece 3 is considered to reach the service life limit, and the clamping piece 3 needs to be replaced. The predetermined amount is obtained by a person skilled in the art from experience and analysis of the material properties of the clip 3.
When the deformation degree of the elastic sheet 31 is limited or measured, the corresponding preset elastic force range can be set according to the deformation degree of the elastic sheet 31, and the elastic state of the elastic sheet 31 can be judged more accurately according to the mode. That is to say, in combination with the above embodiment, the processing module further receives a pressure value from the second pressure sensor in the distance detection assembly 42, calculates and obtains a distance between the detection plate 4 and the clip 3 according to the pressure value of the second pressure sensor, obtains a deformation degree of the elastic piece 31 according to the distance, and comprehensively determines an elastic state of the elastic piece 31 according to the deformation degree of the elastic piece 31 and an elastic force of the elastic piece 31, and specifically includes:
the processing module judges the elastic state of the elastic sheet 31 according to the pressure value and the deformation degree of the corresponding elastic sheet 31, and judges whether the clamping sheet 3 needs to be replaced according to the elastic states of all the elastic sheets 31 in the clamping sheet 3.
One specific implementation method is as follows: according to the distance between the detection plate 4 and the clamping piece 3, a plurality of distance intervals and the preset elastic force ranges of the elastic pieces 31 corresponding to the corresponding intervals are set, the distance measured by the distance detection assembly 42 is matched with the distance intervals to find the corresponding preset elastic force ranges, and whether the pressure value detected by the pressure detection assembly 41 is within the preset elastic force ranges is judged, so that the elastic state of the elastic pieces 31 is normal or abnormal.
In this implementation, there is also a preferred implementation manner, that is, in the process of tightening the bolt 52, the distance between the probe piece and the clip piece 3 and the elastic force of the elastic piece 31 are measured in real time, the variation trend of the distance and the elastic force is obtained, and the elastic state of the elastic piece 31 is determined to be normal or abnormal according to the variation trend of the distance and the elastic force.
The distance between the probe plate 4 and the clip 3 is measured by the distance detection assembly 42 and received by the processing module for subsequent processing.
On the basis of the above preferred embodiment, a display module may be provided to prompt an operator to complete corresponding operations, specifically including:
each elastic sheet 31 of the clamp is provided with a preset number, when the processing module obtains that the elastic state of the corresponding elastic sheet 31 is abnormal, the processing module informs an operator through the display module, so that the operator does not use the slot position 11 corresponding to the elastic sheet 31 when fixing the chip; when the processing module obtains that the number of the elastic sheets 31 with abnormal elastic states in one clamp exceeds the preset number, the processing module informs an operator to replace the clamping sheet 3 through the display module; when the processing module is combined with the distance detection assembly, the processing module is further used for receiving the distance between the detection plate and the clamping piece measured by the distance detection assembly, comparing the distance with the preset minimum distance, and if the measured distance is smaller than or equal to the preset minimum distance, sending an audible and visual alarm through the display module to prompt an operator to increase the distance between the detection plate and the clamping piece so as to prevent the elastic piece from being damaged due to overlarge stress, wherein the preset minimum distance is set by a person skilled in the art according to the common analysis of the elastic limit of the elastic piece and the requirement of elastic force measurement.
And corresponding identification wafers can be respectively embedded into the clamp and the clamping pieces 3, and a basis is provided for full-automatic mechanization of detection and replacement of the clamping pieces 3 in the clamp and fixed welding of chips in a mechanical scanning and server management mode.
On the basis of the above embodiments, there are several preferable implementations that can be combined with each other, as shown in fig. 9 and fig. 10, which include:
the implementation mode is as follows: the anchor clamps still contain base and fixed plate, the base sets up the below at lower plate 1, nut 53 in the clamping component 5 can adopt the implementation of the nut seat in the embedding base, the fixed plate sets up in the top of punch holder 2 or detecting plate 4, is provided with the screw rod male fixed orifices 51 that supplies bolt 52 on the fixed plate, each fixed orifices 51 is inserted in proper order to the screw rod of bolt 52 from the top of fixed plate, screws up with the nut seat on the base and fixes. The clamp is clamped and fixed more stably and firmly by the base and the fixing plate, and the pressure distribution area applied to the upper clamping plate 2 by the clamping assembly 5 is wider by the fixing plate, so that the pressure is not only concentrated on the surrounding area of the bolt 52, and the force application of the upper clamping plate 2 to the plurality of elastic sheets 31 is more uniform.
The implementation mode two is as follows: when the clamp is clamped, in the distribution direction of the elastic sheets 31, the fixing plate is in contact with the upper clamping plate 2 or the detection plate 4 and applies downward force to the upper clamping plate 2 or the detection plate 4, as shown in fig. 9, when the elastic sheets 31 are horizontally distributed at the edge of the clamping piece 3, the length of the fixing plate in the horizontal direction is greater than or equal to the length of the area where the elastic sheets 31 are distributed, so that the force application of the upper clamping plate 2 to each elastic sheet 31 is consistent, the phenomenon that some elastic sheets 31 can realize the fixation of chips due to uneven force application is prevented, and some elastic sheets 31 cannot realize the fixation of chips.
The implementation mode is three: be provided with the fixed column on the base, it is corresponding be provided with corresponding through-hole on lower plate 1, clamping piece 3, punch holder 2, detection board 4 and the fixed plate to supply the fixed column to alternate fixedly, prevent that each board or piece from taking place rotatory dislocation as the center with bolt 52, guarantee the fixed steadiness of anchor clamps.
The implementation mode is four: between one or more plates or pieces between the lower clamping plate 1, the clamping piece 3, the upper clamping plate 2, the detection plate 4 and the fixing plate, bolts can be additionally installed for reinforcement and fixation to realize more stable fixation.
The implementation mode is five: and a through hole for inserting and fixing the welding device is reserved on the fixing plate and is used for fixing the welding device during bonding and welding.
The implementation mode is six: the edge of the upper clamping plate 2 is provided with pressing pieces corresponding to the elastic pieces 31 of the clamping pieces 3, each pressing piece corresponds to one elastic piece 31, and a gap exists between each pressing piece and each pressing piece, so that the force applied to the elastic pieces 31 by the upper clamping piece 3 is as uniform as possible, the situation that the force applied to the elastic pieces 31 is not uniform due to the deformation of the upper clamping piece 3 caused by different fixing positions of the bolts 52 is avoided, and the uniform stress of the elastic pieces 31 can be greatly realized by combining with the second implementation mode.
The implementation mode is seven: set up the limiting plate between clamping piece 3 and lower plate 1, at the edge of limiting plate, with chip relative position, set up the spacing groove, make when pressing from both sides tightly, the pin 310 of shell fragment 31 inserts the spacing inslot to restriction shell fragment 31 pin 310 position makes shell fragment 31 pin 310 can with chip edge butt.
The terms "first" and "second" in the present embodiment have no special limiting meaning, and are used for description only for convenience in describing different objects among the same class of objects, and should not be interpreted as having special limiting meanings in order or otherwise.
Example 2:
based on the same inventive concept, on the basis of embodiment 1, the present invention further provides a method for using a chip bonding jig, as shown in fig. 11, the method includes:
in step 201, the lower clamping plate 1, the clamping piece 3 and the detection plate 4 are clamped by the clamping assembly 5, so as to detect the elastic state of the elastic pieces 31 in the clamping piece 3, and if the number of the elastic pieces 31 with abnormal elastic state in the clamping piece 3 exceeds the preset number, the clamping piece 3 is replaced;
in step 202, the detection plate 4 is detached, the upper clamping plate 2 is used to replace the position of the detection plate 4, a chip is placed in the slot 11 of the lower clamping plate 1, the clamping piece 3 and the upper clamping plate 2 are clamped by the clamping assembly 5, and the chip is fixed by the elastic piece 31 and the slot 11 together, so as to be used for bonding the chip.
In the large-scale bonding process of the chips, a first preset number is set by a person skilled in the art, and after bonding is finished in step 202 for each pair of chips with the preset number, the clip is detected in step 201 by using a probe plate, so that the bonding process of the chips is ensured to be normally carried out.
When the processing module is arranged, if the number of the elastic sheets 31 with abnormal elasticity state in the clamping sheet 3 exceeds the second preset number, the clamping sheet 3 can be replaced by the processing module, and the display module can be connected to prompt an operator to replace the clamping sheet 3 in the display module without self calculation and processing of the operator. When the clip 3 has the elastic sheets with abnormal elasticity but the number of the elastic sheets does not exceed the second preset number, the position of the elastic sheet is prompted to an operator, and the chip is required not to be placed in the slot position corresponding to the elastic sheet with abnormal elasticity in the subsequent operation process. The second predetermined amount is obtained by a person skilled in the art through experience and analysis of material properties of the clip.
The terms "first" and "second" in the present embodiment have no special limiting meaning, and are used for description only for convenience in describing different objects among the same class of objects, and should not be interpreted as having special limiting meanings in order or otherwise.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The utility model provides a chip bonding anchor clamps, its characterized in that includes lower plate (1), punch holder (2) and clamping piece (3) of setting between lower plate (1) and punch holder (2), and is specific:
the edge of the lower clamping plate (1) is provided with a plurality of groove positions (11) for placing chips;
elastic sheets (31) are correspondingly arranged at the edge of the clamping sheet (3) and the positions corresponding to the slot positions (11) one by one, and when the elastic sheets (31) are pressed downwards, pins (310) of the elastic sheets (31) are abutted against the edge of the chip, so that the chip is fixed in the corresponding slot positions (11);
the upper clamping plate (2) is used for applying downward force to the elastic sheet (31) when the upper clamping plate (2), the clamping piece (3) and the lower clamping plate (1) are clamped.
2. The die bonding jig according to claim 1, wherein the ends of the pins (310) of the spring plate (31) are provided as right-angled recesses, so that the right-angled recesses catch the right-angled edges of the die when the pins (310) abut the edges of the die.
3. The die bonding jig according to claim 1, further comprising a probe plate (4) provided above the clip (3) and used in place of the upper plate (2), specifically:
the detection plate (4) edge, and with the corresponding position of shell fragment (31), the one-to-one correspondence is provided with pressure detection subassembly (41), when will detect plate (4), clamping piece (3) and lower plate (1) and press from both sides tightly, downward power is applyed to shell fragment (31) in pressure detection subassembly (41) to survey the elasticity that comes from shell fragment (31), thereby detect the elastic state of shell fragment (31), judge whether need change clamping piece (3).
4. The die bonding jig of claim 3, wherein the pressure probe assembly (41) comprises a first pressure sensor (410) and probe pins (411), in particular:
the detection pin (411) is arranged below the first pressure sensor (410), and the detection pin (411) is in contact with the elastic sheet (31) and applies pressure through clamping of the detection plate (4), the clamping sheet (3) and the lower clamping plate (1), and meanwhile, the elastic force from the elastic sheet (31) is transmitted to the first pressure sensor (410).
5. The die bonding jig of claim 3, wherein the pressure probe assembly (41) is further coupled to a processing module, in particular:
the processing module is used for receiving the pressure value from the pressure detection assembly (41), judging the elastic state of the elastic sheet (31) according to the pressure value, and judging whether the clamping sheet (3) needs to be replaced according to the elastic states of all the elastic sheets (31) in the clamping sheet (3).
6. The die bonding jig according to claim 3, wherein a distance detecting member (42) is provided below the probe plate (4) for measuring a distance between the probe plate (4) and the clip (3).
7. The die bonding jig according to claim 3, further comprising a clamping assembly (5), in particular:
clamping unit (5) is including setting up fixed orifices (51) in punch holder (2), detecting plate (4), clamping piece (3) and lower plate (1) to and be located bolt (52) and nut (53) of punch holder (2) top and lower plate (1) below respectively, through with the screw rod of bolt (52) inserts in corresponding fixed orifices (51) and screws up with nut (53), realizes the clamp of punch holder (2), clamping piece (3) and lower plate (1) and presss from both sides tightly or realizes the clamp of detecting plate (4), clamping piece (3) and lower plate (1).
8. The die bonding fixture of any of claims 1-7, wherein the clip is integrally formed using a refractory material.
9. The die bonding fixture of claim 8, wherein the refractory material is one or more of an iron-nickel alloy, an iron-chromium alloy, and an iron-chromium-nickel alloy.
10. A method of using a die bonding jig, the method comprising:
clamping the lower clamping plate (1), the clamping pieces (3) and the detection plate (4) by using the clamping assembly (5), so as to detect the elastic state of the elastic pieces (31) in the clamping pieces (3), and if the number of the elastic pieces (31) with abnormal elastic state in the clamping pieces (3) exceeds a preset number, replacing the clamping pieces (3);
the chip bonding method comprises the steps of dismounting a detection plate (4), replacing the position of the detection plate (4) with an upper clamping plate (2), placing a chip in a groove (11) of a lower clamping plate (1), clamping the lower clamping plate (1), a clamping piece (3) and the upper clamping plate (2) through a clamping assembly (5), and enabling the chip to be jointly fixed by an elastic sheet (31) and the groove (11) so as to be used for bonding the chip.
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| CN202210356672.0A CN114725002B (en) | 2022-04-06 | 2022-04-06 | Chip bonding clamp and using method thereof |
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| CN202210356672.0A CN114725002B (en) | 2022-04-06 | 2022-04-06 | Chip bonding clamp and using method thereof |
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