CN114715883A - Preparation method of high-density thermal reduction graphene oxide film - Google Patents
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 112
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 101
- 230000009467 reduction Effects 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 238000005192 partition Methods 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 12
- 230000001681 protective effect Effects 0.000 claims abstract description 11
- 230000008569 process Effects 0.000 claims abstract description 8
- 238000000280 densification Methods 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims description 16
- 239000007789 gas Substances 0.000 claims description 11
- 229910002804 graphite Inorganic materials 0.000 claims description 11
- 239000010439 graphite Substances 0.000 claims description 11
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 229910000851 Alloy steel Inorganic materials 0.000 claims description 2
- 229910000975 Carbon steel Inorganic materials 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 239000001569 carbon dioxide Substances 0.000 claims description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 2
- 239000010962 carbon steel Substances 0.000 claims description 2
- 238000009750 centrifugal casting Methods 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000003618 dip coating Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 230000006698 induction Effects 0.000 claims description 2
- 238000000707 layer-by-layer assembly Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 238000004528 spin coating Methods 0.000 claims description 2
- 238000003828 vacuum filtration Methods 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000011946 reduction process Methods 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 5
- 238000003490 calendering Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005087 graphitization Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910021383 artificial graphite Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000007906 compression Methods 0.000 description 1
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- 230000007797 corrosion Effects 0.000 description 1
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- 238000005336 cracking Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
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- 229910001220 stainless steel Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/182—Graphene
- C01B32/184—Preparation
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2204/00—Structure or properties of graphene
- C01B2204/20—Graphene characterized by its properties
- C01B2204/24—Thermal properties
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2204/00—Structure or properties of graphene
- C01B2204/20—Graphene characterized by its properties
- C01B2204/26—Mechanical properties
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2204/00—Structure or properties of graphene
- C01B2204/20—Graphene characterized by its properties
- C01B2204/32—Size or surface area
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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Abstract
The invention belongs to the field of preparation of heat conducting and dissipating materials, and particularly relates to a preparation method of a high-density thermal reduction graphene oxide film. And alternately stacking the graphene oxide film and the partition plate, controlling the temperature of the graphene oxide film and the partition plate, applying a preset pressure in the direction vertical to the graphene oxide film and the partition plate, and finishing the thermal reduction and densification processes of the graphene oxide film in a protective atmosphere through the program temperature and the program pressure to obtain the high-density thermal reduction graphene oxide film. The method can efficiently and rapidly prepare the reduced graphene oxide film with high density and high plane thermal conductivity, and can be widely applied to the field of heat conducting and radiating materials.
Description
Technical Field
The invention belongs to the field of preparation of heat conducting and dissipating materials, and particularly relates to a preparation method of a high-density thermal reduction graphene oxide film.
Background
With the improvement of integrated circuit technology, integration level and working speed, electronic equipment is developing towards miniaturization, the density of elements is increased, the endurance of a power supply is improved, the power consumption of an electronic equipment system is increased, heat generated by unit volume is continuously increased, the performance and the service life of an electronic device are seriously influenced, and therefore the heat dissipation problem becomes extremely important. The traditional heat conduction material mainly comprises a metal film, a graphite rolling film, a carbonized polyimide film and the like. The metal film has the defects of heavy mass, easy corrosion, low heat conductivity and the like, and the graphite calendered film and the carbonized polyimide film are brittle and easy to fall off powder in the use process, so that the graphite calendered film and the carbonized polyimide film are not suitable for the field of precise instrument management with complex structures and high cleanliness requirements. Meanwhile, the heat dissipation requirements of electronic products are increasing continuously, and the new heat dissipation scheme not only requires that the heat conducting film has higher heat conductivity, but also requires that the heat conducting film has a certain thickness so as to improve the heat conduction flux in the plane direction.
Graphene is a two-dimensional material with ultra-high thermal conductivity (5000W/mK), and the thermal conductivity of a macroscopic sheet formed by orderly stacking graphene can reach 1600W/mK. In the artificial graphite film, the graphitized polyimide heat-conducting film has higher heat conductivity only when the thickness is smaller due to the orientation degree of polyimide molecules. The graphene heat-conducting film is easy to be made into a heat-conducting film (about 100 mu m) with larger thickness, and has good application prospect in a novel electronic device heat management system. (Zhang Y. -F., et al., High-performance thermal interface materials regulating of vertical aligned graphene film and polymer, 2016, 109, 552-557; Chinese patent application No. 202110346875.7, publication No. CN 112937065A).
The reduced graphene oxide film (RGO) can be obtained after the graphene oxide film is subjected to reduction treatment, and heat treatment is used as a common means, in the heating process, because a large amount of gas is released due to the removal of oxygen-containing functional groups and defect repair, the volume expansion is caused, so that the obtained reduced graphene oxide film has low density, large interlayer spacing and poor heat conduction performance, the application of the graphene film in the fields of heat conduction and heat dissipation materials is seriously restricted, and a preparation method is urgently needed for realizing the densification in the thermal reduction process of the graphene oxide film and ensuring the high density and high heat conduction performance of the thermal reduced graphene oxide film.
Disclosure of Invention
Aiming at the defects existing in the reduction process of the existing graphene oxide film, the invention aims to provide a preparation method of a high-density thermal reduction graphene oxide film,the graphene oxide film and the partition board are alternately stacked, the temperature of the graphene oxide film and the partition board is controlled, and a predetermined pressure is applied in the direction vertical to the graphene oxide film and the partition board, so that the problems of low density and untight lap joint of the reduced graphene oxide film caused by volume expansion in the reduction process of the graphene oxide film are solved, and the density of the prepared thermal reduced graphene oxide film can reach 2.0g/cm3The highest thermal conductivity of the plane thermal conductivity can reach 1500W/mK.
The technical scheme of the invention is as follows:
a preparation method of a high-density thermal reduction graphene oxide film comprises the steps of alternately stacking a graphene oxide film and a partition plate, controlling the temperature of the graphene oxide film and the partition plate, applying preset pressure in the direction perpendicular to the graphene oxide film and the partition plate, and completing thermal reduction and densification of the graphene oxide film in a protective atmosphere through program temperature and program pressure to obtain the high-density thermal reduction graphene oxide film.
The preparation method of the high-density thermal reduction graphene oxide film comprises but is not limited to one or a combination of more than two of a vacuum filtration method, a blade coating method, a spin coating method, a dip coating method, an electrostatic self-assembly method and a centrifugal casting method, and the area range of the graphene oxide film is 1-2000000 mm2The thickness of the graphene oxide film is 1-10000 [ mu ] m (preferably 100-1000 [ mu ] m), and the density of the graphene oxide film is 0.1-2.0 g/cm3(preferably 1.0 to 2.0 g/cm)3)。
According to the preparation method of the high-density thermal reduction graphene oxide film, the graphene oxide film is reduced in a protective atmosphere, and the protective gas comprises one or more than two mixed gases of nitrogen, argon, hydrogen and carbon dioxide.
According to the preparation method of the high-density thermal reduction graphene oxide film, the graphene oxide film and the partition plates are alternately stacked to form a block body, the partition plates are arranged above and below the block body, and the number ratio value of the partition plates to the graphene oxide film ranges from 0.001 to 10; the material of the partition board includes but is not limited to one or a combination of two or more of carbon steel, alloy steel, graphite, ceramic and glass, and the thickness of the partition board ranges from 1 to 10000 μm (preferably 100 to 1000 μm).
The preparation method of the high-density thermal reduction graphene oxide film controls the temperature of the graphene oxide film and the partition board, the heating mode includes but is not limited to one or the combination of more than two modes of resistance heating, induction heating, microwave heating and radiation heating, the heating temperature range is 20-3000 ℃ (preferably 500-2000 ℃), and the temperature rise rate range is 0.01-20 ℃/min (preferably 5-15 ℃/min).
The preparation method of the high-density thermal reduction graphene oxide film applies preset pressure in the direction vertical to the graphene oxide film and the partition plate, and the type of the pressure includes but is not limited to one or the combination of more than two of air pressure, hydraulic pressure and rolling pressure.
The preparation method of the high-density thermal reduction graphene oxide film comprises a pressurizing mode including but not limited to one or a combination of more than two modes of constant pressurizing and program gradient pressurizing, and the range of the applied pressure is 0.1-100 MPa (preferably 5-20 MPa).
According to the preparation method of the high-density thermal reduction graphene oxide film, the thermal reduction graphene oxide film densification process is completed through the program temperature and the program pressure, the program temperature and the program pressure are two independent systems, and the two independent systems are operated independently or in combination.
The technical principle of the invention is as follows:
as shown in figure 1, the graphene oxide film and the separators are alternately stacked to form a block, pressure F is applied in the direction perpendicular to the separators and the graphene oxide film, heat treatment is carried out while applying the pressure, volume expansion in the reduction process is limited by program temperature control and program pressurization, gas generated inside is slowly discharged, and the inter-lamellar lap joint close state of the inside is maintained, so that the high-graphitization thermal reduction graphene oxide film with high heat diffusion coefficient is obtained. Meanwhile, the graphene film has high density, high heat conductivity and good appearance, and is not required to be compacted by calendering, so that the production is more efficient.
The invention has the advantages and beneficial effects that:
1. the invention solves the problems of low density and easy cracking of the reduced graphene oxide film caused by volume expansion in the thermal reduction process of the graphene oxide film, and the obtained graphene film does not need to be calendered and densified and can be directly applied to production.
2. The invention solves the problems of untight sheet layer overlapping and low graphitization degree caused by internal gas release in the reduction process of the graphene oxide film, and the obtained thermal reduction graphene oxide film has high density and high thermal conductivity.
Drawings
Fig. 1 is a schematic flow chart of a process for preparing a graphene oxide film by high-density thermal reduction.
Detailed Description
The following three examples are illustrative of the present invention and are not intended to limit the scope of the present invention.
Example 1.
In this example, the graphene oxide film was prepared by a fluid ordering process, and had dimensions of 150 × 100mm in length × width2A thickness of 300 μm and a density of 1.7g/cm3The number of the sheets is 10. The partition board is made of graphite sheet with length and width of 170-120 mm2The thickness was 300 μm and the number was 11 sheets. The separators and the graphene oxide film are alternately stacked to form a block, the separators are arranged above and below the block, and the stacking thickness is 6.3 mm. And (3) performing programmed gradient pressurization to 5MPa in the direction perpendicular to the graphene oxide film and the partition plate, compressing the thickness to 4.3mm, simultaneously performing programmed temperature rise to 3000 ℃, wherein the temperature rise rate is 10 ℃/min, the protective gas is argon, and the holding time is 0.5 h.
In this example, the parameters of obtaining 10 sheets of high density thermal reduction graphene oxide films are as follows, and the dimensions are 150 × 100mm long × wide2Thickness of 100 (+ -3) mu m and density of 2.0g/cm3The horizontal thermal conductivity is 1400W/mK.
Example 2.
In this example, the graphene oxide film was prepared by a fluid ordering process, and had dimensions of 150 × 100mm in length × width2Thickness of 300 μm and density of 1.7g/cm3The number of the sheets is 10. The partition board is made of graphite sheet with length and width of 170-120 mm2Thickness of 300 μmThe number is 11. The separators and the graphene oxide film are alternately stacked to form a block, the separators are arranged above and below the block, and the stacking thickness is 6.3 mm. The graphene oxide film and the partition plate are constantly pressurized at 0.1MPa in the direction perpendicular to the graphene oxide film, and the temperature is programmed to 1000 ℃ at a temperature rise rate of 10 ℃/min. After keeping for 3h, the pressure is increased to 10MPa in a programmed gradient manner, the compression thickness is increased to 4.3mm, the temperature is increased to 3000 ℃ in a programmed manner at the speed of 5 ℃/min, the protective gas is argon, and the keeping time is 0.5 h.
In this example, the parameters of obtaining 10 sheets of high density thermal reduction graphene oxide films are as follows, and the dimensions are 150 × 100mm long × wide2Thickness of 100 (+ -3) mu m and density of 2.0g/cm3The horizontal thermal conductivity was 1500W/mK.
Example 3.
In this example, the graphene oxide film was prepared by a fluid ordering process, and had dimensions of 400 × 200mm in length × width2A thickness of 300 μm and a density of 1.7g/cm3The number is 100. The partition board is made of stainless steel sheet with the size of 420 mm by 220mm2The thickness was 300 μm and the number was 101. The separators and the graphene oxide film are alternately stacked to form a block, the separators are arranged above and below the block, and the stacking thickness is 60.3 mm. Performing constant pressurization of 0.2MPa in the direction perpendicular to the graphene oxide film and the partition plate, simultaneously performing temperature programming to 500 ℃, taking out after the protective gas is nitrogen and keeping for 1h to obtain the graphene oxide film with the thickness of 150 mu m and the density of 1.33g/cm3Reduced graphene oxide film 100 sheets. Adopts a graphite clapboard with the size of length multiplied by width multiplied by 420 multiplied by 220mm2The thickness of the graphite block is 300 mu m, the number of 20 reduced graphene oxide films is 1, the graphite block and 6 graphite sheet thin plates are alternately stacked to form a block body, the upper surface and the lower surface of the block body are provided with clapboards, and the stacking thickness is 16.8 mm. And (3) performing programmed gradient pressurization to 5MPa in the direction of the vertical reduced graphene oxide film and the partition plate, compressing the thickness to 11.8mm, simultaneously performing programmed temperature rise to 3000 ℃, wherein the temperature rise rate is 10 ℃/min, the protective gas is argon, and the holding time is 0.5 h.
In this example, the technical parameters of obtaining 100 sheets of high-density thermal reduction graphene oxide thermal conductive film are as follows, and the length × width is 400 × 200mm2Thickness of 100 (+ -3) μm and density of 2.0g/cm3Water, waterThe square thermal conductivity was 1350W/mK.
The embodiment result shows that the method is more efficient and energy-saving, the prepared thermal reduction graphene oxide film can obtain high thermal diffusion coefficient, meanwhile, the high density and the surface flatness of the heat conducting film are ensured, and the technical parameters of the obtained high-density thermal reduction graphene oxide film are as follows: a thickness of 80 to 120 μm and a density of 1.5 to 2.5g/cm3The horizontal thermal conductivity is 1300-1500W/mK, and the material can be used as a heat conduction and heat dissipation material in the fields of heat conduction and heat dissipation.
The above three examples are further illustrative of the present invention, wherein the separator materials, the shielding gas, the stacking, the pressurizing, and the heating are used in a variety of changes and modifications, and changes and modifications without departing from the principle of the present invention should be considered as the protection scope of the present invention.
Claims (8)
1. A preparation method of a high-density thermal reduction graphene oxide film is characterized by alternately stacking a graphene oxide film and a partition plate, controlling the temperature of the graphene oxide film and the partition plate, applying preset pressure in the direction perpendicular to the graphene oxide film and the partition plate, and completing thermal reduction and densification processes of the graphene oxide film in a protective atmosphere through program temperature and program pressure to obtain the high-density thermal reduction graphene oxide film.
2. The method for preparing a high-density graphene oxide film according to claim 1, wherein the graphene oxide film is prepared by one or a combination of two or more methods selected from a vacuum filtration method, a blade coating method, a spin coating method, a dip coating method, an electrostatic self-assembly method and a centrifugal casting method, and has an area of 1-2000000 mm2The thickness range of the graphene oxide film is 1-10000 mu m, and the density range of the graphene oxide film is 0.1-2.0 g/cm3。
3. The method for preparing a high-density graphene oxide film according to claim 1, wherein the graphene oxide film is reduced in a protective atmosphere, and the protective gas includes one or a mixture of two or more of nitrogen, argon, hydrogen and carbon dioxide.
4. The method for preparing a high-density thermal reduced graphene oxide film according to claim 1, wherein the graphene oxide film and the partition plates are alternately stacked to form a block, the partition plates are disposed above and below the block, and the ratio of the number of the partition plates to the number of the graphene oxide film is in the range of 0.001 to 10; the material of the partition plate comprises but is not limited to one or the combination of more than two of carbon steel, alloy steel, graphite, ceramic and glass, and the thickness range of the partition plate is 1-10000 mu m.
5. The method for preparing a high-density graphene oxide film according to claim 1, wherein the temperature of the graphene oxide film and the temperature of the partition plate are controlled, the heating method includes but is not limited to one or a combination of two or more of resistance heating, induction heating, microwave heating and radiation heating, the heating temperature range is 20-3000 ℃, and the temperature rise rate range is 0.01-20 ℃/min.
6. The method of preparing a graphene oxide film by thermal reduction at high density according to claim 1, wherein a predetermined pressure is applied in a direction perpendicular to the graphene oxide film and the separator, and the pressure is selected from the group consisting of, but not limited to, air pressure, hydraulic pressure, and roll pressure.
7. The method for preparing a high-density graphene oxide thermal reduction film according to claim 1, wherein the pressurization mode includes but is not limited to one or a combination of two or more of constant pressurization and program gradient pressurization, and the range of the applied pressure is 0.1-100 MPa.
8. The method of preparing a high-density graphene oxide membrane according to claim 1, wherein the graphene oxide membrane densification process is accomplished by a programmed temperature and a programmed pressure, wherein the programmed temperature and the programmed pressure are two independent systems, operating alone or in combination.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115367739A (en) * | 2022-08-05 | 2022-11-22 | 云南云天墨睿科技有限公司 | Preparation method of high-density graphene multilayer composite heat-conducting film |
| CN115504787A (en) * | 2022-09-28 | 2022-12-23 | 深圳烯材科技有限公司 | A kind of preparation method of graphene/artificial graphite composite heat conduction film |
| CN116675221A (en) * | 2023-06-01 | 2023-09-01 | 南京工业大学 | A graphene film with high electrical conductivity and high thermal conductivity and its preparation method and application |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111055552A (en) * | 2019-06-08 | 2020-04-24 | 王雅静 | Batch preparation method of high-performance graphene film, graphene film and antenna |
| US20200339423A1 (en) * | 2019-04-29 | 2020-10-29 | Nanotek Instruments, Inc. | Oriented graphene sheet-enhanced vapor-based heat transfer device and process for producing same |
| CN112850697A (en) * | 2021-02-04 | 2021-05-28 | 常州富烯科技股份有限公司 | Preparation method of high-density graphene heat-conducting film |
| CN113354415A (en) * | 2021-07-06 | 2021-09-07 | 中国科学院山西煤炭化学研究所 | Preparation method of ultrahigh-thermal-conductivity graphene film |
| CN113817327A (en) * | 2021-10-26 | 2021-12-21 | 深圳烯材科技有限公司 | Preparation method of graphene-based composite material heat conduction pad |
-
2022
- 2022-04-13 CN CN202210386805.9A patent/CN114715883A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200339423A1 (en) * | 2019-04-29 | 2020-10-29 | Nanotek Instruments, Inc. | Oriented graphene sheet-enhanced vapor-based heat transfer device and process for producing same |
| CN111055552A (en) * | 2019-06-08 | 2020-04-24 | 王雅静 | Batch preparation method of high-performance graphene film, graphene film and antenna |
| CN112850697A (en) * | 2021-02-04 | 2021-05-28 | 常州富烯科技股份有限公司 | Preparation method of high-density graphene heat-conducting film |
| CN113354415A (en) * | 2021-07-06 | 2021-09-07 | 中国科学院山西煤炭化学研究所 | Preparation method of ultrahigh-thermal-conductivity graphene film |
| CN113817327A (en) * | 2021-10-26 | 2021-12-21 | 深圳烯材科技有限公司 | Preparation method of graphene-based composite material heat conduction pad |
Non-Patent Citations (1)
| Title |
|---|
| 张锦等: "《石墨烯材料在半导体中的应用》", 西安电子科技大学出版社, pages: 156 - 159 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115367739A (en) * | 2022-08-05 | 2022-11-22 | 云南云天墨睿科技有限公司 | Preparation method of high-density graphene multilayer composite heat-conducting film |
| CN115504787A (en) * | 2022-09-28 | 2022-12-23 | 深圳烯材科技有限公司 | A kind of preparation method of graphene/artificial graphite composite heat conduction film |
| CN116675221A (en) * | 2023-06-01 | 2023-09-01 | 南京工业大学 | A graphene film with high electrical conductivity and high thermal conductivity and its preparation method and application |
| CN116675221B (en) * | 2023-06-01 | 2024-04-09 | 南京工业大学 | Graphene film with high electrical conductivity and high thermal conductivity as well as preparation method and application thereof |
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