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CN114710609B - Auto-focus camera module and auto-focus camera module assembly method - Google Patents

Auto-focus camera module and auto-focus camera module assembly method Download PDF

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Publication number
CN114710609B
CN114710609B CN202210343018.6A CN202210343018A CN114710609B CN 114710609 B CN114710609 B CN 114710609B CN 202210343018 A CN202210343018 A CN 202210343018A CN 114710609 B CN114710609 B CN 114710609B
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Prior art keywords
lens
lens barrel
lower lens
base
camera module
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CN114710609A (en
Inventor
徐淦洲
宋凯静
张昊
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Shengtai Xinyu Electronics Industry Co ltd
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Jiangxi Shinetech Precision Optical Company Ltd
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60Control of cameras or camera modules
    • H04N23/67Focus control based on electronic image sensor signals

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Lens Barrels (AREA)
  • Studio Devices (AREA)

Abstract

The invention relates to the technical field of cameras, and particularly discloses an automatic focusing camera module which comprises an upper lens group, T-lens, a lower lens group, a base and a circuit board, wherein the T-lens is arranged between the upper lens group and the lower lens group, conductive circuits are arranged on the top and the side wall of the lower lens group, conductive circuits are also arranged on the side wall of the base corresponding to the lower lens group, the conductive circuits of the lower lens group are electrically connected with the guide circuits of the base, and the conductive circuits of the base are electrically connected with the circuit board. By adopting the technical scheme of the invention, automatic focusing can be realized in a smaller structural size.

Description

Automatic focusing camera module and automatic focusing camera module assembling method
Technical Field
The invention relates to the technical field of cameras, in particular to an automatic focusing camera module and an automatic focusing camera module assembling method.
Background
At present, cameras are widely applied to a plurality of fields such as mobile phones, flat plates, notebooks, security, vehicle-mounted, medical treatment, monitoring and the like, different requirements are put forward for various parameters of the cameras in the application process of the cameras in different fields, for example, the mobile phone cameras applied to the consumption field are required to be smaller in structural size, the quality requirements of pictures shot by the cameras are continuously improved when the structural size of the cameras is reduced, and the functions of small head and focusing are realized when the mobile phone is arranged in front of the camera.
Therefore, there is a need for an auto-focus camera module with a smaller structural size and an auto-focus camera module assembling method.
Disclosure of Invention
The invention provides an automatic focusing camera module which can realize automatic focusing in a smaller structural size.
In order to solve the technical problems, the application provides the following technical scheme:
the automatic focusing camera module comprises an upper lens group, a T-lens, a lower lens group, a base and a circuit board;
t-lens is arranged between the upper lens group and the lower lens group;
The top and the side wall of the lower lens group are provided with conductive circuits, and the side wall of the base corresponding to the lower lens group is also provided with conductive circuits;
the conductive circuit of the lower lens group is electrically connected with the guide circuit of the base, and the conductive circuit of the base is electrically connected with the circuit board.
The basic scheme principle and the beneficial effects are as follows:
In the prior art, the T-lens is generally directly placed at the top of the camera module, but the height of the camera is increased, and because the T-lens needs to be electrified, the X/Y direction size of the camera is increased by placing a circuit on the top, the appearance of the camera is influenced, and a small-head camera cannot be realized. According to the scheme, the T-lens is placed between the upper lens group and the lower lens group, the light path design is completed together with the whole lens, the conductive circuit is directly arranged on the outer wall of the lower lens group and the outer wall of the base, the occupied volume caused by the arrangement of the circuit is reduced, the power supply requirement of the T-lens is met, and the size of the camera is reduced. Under the action of the energizing voltage, the surface curvature of the T-lens can change, so that the lens can realize zooming. The lens module can replace an AF motor function, and the T-lens has the advantages of rapid focusing and low power consumption, and improves the performance of the camera module.
In summary, this scheme can realize automatic focusing at less structure size.
The upper lens group comprises an upper lens cone, a first lens and a second lens, wherein the first lens and the second lens are sequentially arranged in the upper lens cone;
the lower lens group comprises a lower lens cone, a third lens, a fourth lens and a fifth lens, wherein the third lens, the fourth lens and the fifth lens are sequentially arranged in the lower lens cone;
the top and the side wall of the lower lens barrel are provided with conductive circuits.
Further, the lower lens barrel and the base are molded by LDS materials, and the conductive circuit is obtained by laser carving and copper plating.
The LDS process is used for plating copper, a circuit pattern is directly transferred onto the surface of a molded plastic original piece by utilizing numerical control laser, a circuit intercommunication structure is formed by utilizing the three-dimensional surface of a three-dimensional workpiece, and T-lens conduction can be realized on the premise of not increasing the size of a module by utilizing the technology.
The automatic focusing camera module assembly method comprises the following steps:
s1, plating copper on the top and the side wall of the lower lens barrel and the side wall of the base corresponding to the lower lens barrel through an LDS process to form a conductive circuit;
S2, attaching the photosensitive chip to the circuit board;
S4, attaching the base to the circuit board and attaching the T-lens to the lower lens barrel;
s5, connecting the positive electrode and the negative electrode of the T-lens with the conductive circuit of the lower lens barrel respectively;
s6, attaching the upper lens barrel, the lower lens barrel and the base;
S7, electrically connecting the conductive circuit of the lower lens barrel with the conductive circuit of the base and the conductive circuit of the base with the circuit board.
According to the scheme, the T-lens is placed between the upper lens group and the lower lens group, the light path design is completed together with the whole lens, the conductive circuit is directly arranged on the outer wall of the lower lens group and the outer wall of the base, the occupied volume caused by the arrangement of the circuit is reduced, the power supply requirement of the T-lens is met, and the size of the camera is reduced.
Further, in the step S6, the upper lens barrel, the lower lens barrel and the base are attached through an AOA process, wherein the AOA process specifically comprises:
S601, lighting a photosensitive chip;
s602, simultaneously placing an upper lens barrel and a lower lens barrel above a photosensitive chip for imaging;
s603, confirming definition of the test chart through the photosensitive chip, and determining relative positions of the upper lens barrel and the lower lens barrel based on the definition;
s604, fixing the upper lens barrel, the lower lens barrel and the base.
The lens is divided into an upper group and a lower group, the lens cannot be finished by adopting a conventional AA process, the upper group and the lower group are required to be simultaneously placed above the photosensitive chip to form images after the photosensitive chip is lightened, the definition of a test chart is confirmed through the photosensitive chip to determine the reduction required by the upper group and the lower group, and the positions of the upper group and the lower group are fixed through drawing glue to meet the performance requirement of the camera.
Further, in the step S5, the positive electrode and the negative electrode of the T-lens are connected to the conductive lines of the lower barrel, respectively, by a gold wire bonding process.
Further, in step S603, it is further determined whether the offset between the upper lens barrel and the lower lens barrel exceeds a preset offset range based on the relative positions of the upper lens barrel and the lower lens barrel, and if so, an alarm is given.
The upper barrel and the lower barrel having an excessively large offset can be prevented from being assembled.
Drawings
FIG. 1 is an exploded view of an auto-focus camera module according to an embodiment;
fig. 2 is a partial enlarged view of the portion a in fig. 1.
Detailed Description
The following is a further detailed description of the embodiments:
The marks in the drawing of the specification comprise an upper lens group 1, a T-lens2, a lower lens group 3, a base 4, an optical filter 5, a photosensitive chip 6, a circuit board 7, a conductive circuit 8 and a gold wire 9.
Example 1
As shown in fig. 1, the auto-focusing camera module of the present embodiment includes an upper lens group 1, a T-lens2, a lower lens group 3, a base 4, an optical filter 5, a photosensitive chip 6 and a circuit board 7.
The upper lens group 1 comprises an upper lens barrel, first lenses, second lenses and a plurality of first space rings, wherein in the embodiment, the number of the first space rings is1, the first lenses, the second lenses and the first space rings are arranged in the upper lens barrel, and the first space rings are arranged between the first lenses and the second lenses and used for separating the first lenses and the second lenses, controlling the spacing between the first lenses and the second lenses and preventing the first lenses and the second lenses from rubbing against each other. In this embodiment, the first lens edge thickness is 0.2mm, the second lens edge thickness is 0.1mm,
The lower lens group 3 comprises a lower lens cone, a third lens, a fourth lens, a fifth lens and a plurality of second space rings. In this embodiment, the number of second spacers is 3. The third lens, the fourth lens, the fifth lens and the second space ring are arranged in the lower lens cone. The 3 second space rings are respectively arranged between the lower lens barrel and the third lens, between the third lens and the fourth lens and between the fourth lens and the fifth lens. In this embodiment, the third lens edge thickness is 0.18mm.
T-lens2 is disposed between upper lens group 1 and lower lens group 3. T-lens2 includes piezoelectric thin film, glass film, high molecular polymer and glass bracket.
The optical filter 5 is fixed in the base 4, the photosensitive chip 6 is arranged on the circuit board 7, the upper lens group 1, the T-lens2 and the lower lens group 3 are sequentially combined from top to bottom to form the camera module by the base 4, the photosensitive chip 6 and the circuit board 7.
The top and side walls of the lower lens barrel are provided with conductive lines 8, and the side walls of the base 4 corresponding to the lower lens barrel are also provided with conductive lines 8. In this embodiment, the lower lens barrel and the base 4 are molded from LDS material, and the conductive trace 8 is obtained by laser engraving and copper plating. The LDS material is a modified plastic containing an organic metal compound, and after laser irradiation, the organic metal compound can release particles.
The conductive line 8 of the lower barrel is electrically connected with the guide line of the base 4, and the conductive line 8 of the base 4 is electrically connected with the circuit board 7.
As shown in fig. 2, the positive and negative electrodes of the T-lens2 are connected to the conductive lines 8 of the lower barrel with gold wires 9, respectively. When the circuit board 7 is electrified, the photosensitive chip 6 is lightened, and the T-lens2 is electrified at the same time.
When the T-lens2 is used, the piezoelectric film forms extrusion force after the voltage is applied to the positive electrode and the negative electrode of the T-lens2, the high polymer is extruded to deform, and the glass film protrudes along with the extrusion force, so that the focal length of the T-lens2 is changed. The T-lens2 focal length change is combined with the upper lens group 1 and the lower lens group 3 to achieve the whole lens focal length change.
When the camera module shoots scenes with different distances, the T-lens2 can focus for one cycle rapidly, and the T-lens2 is fixed in deformation at the most clear position of the light sensing of the sightseeing chip, so that the most clear picture can be obtained by focusing rapidly.
Based on the auto-focusing camera module, the embodiment also provides an auto-focusing camera module assembling method, which comprises the following steps:
S1, plating copper on the top and the side wall of the lower lens barrel and the side wall of the base 4 corresponding to the lower lens barrel through an LDS process to form a conductive circuit 8, wherein the LDS process is used for plating copper, namely, a technology of directly transferring a circuit pattern onto the surface of a molded plastic original piece by utilizing numerical control laser and forming a circuit intercommunication structure by utilizing the three-dimensional surface of a three-dimensional workpiece.
S2, attaching the photosensitive chip 6 to the circuit board 7 through a COB packaging process;
And S4, bonding the base 4 with the circuit board 7 through LHA equipment and bonding the T-lens2 with the lower lens barrel, wherein the LHA equipment is provided with an upper adsorption jig, a lower adsorption jig and an upper CCD and a lower CCD, taking bonding the base 4 with the circuit board 7 as an example, the upper adsorption jig adsorbs the base 4, the edge contour of the base 4 is identified through the lower CCD, the lower adsorption jig adsorbs the circuit board 7, the chip contour is identified through the upper CCD, then the circuit board 7 is coated with glue, and the center of the base 4 and the circuit board 7 is calculated according to the edge contour of the base 4 identified by the upper CCD and the lower CCD and the chip contour, so that the base 4 and the circuit board are assembled and bonded together. The fitting of the T-lens2 and the lower lens barrel is also to calculate the center of the T-lens2 and the lower lens barrel according to the edge profile of the T-lens2 and the edge profile of the lower lens barrel, and then the fitting is carried out.
S5, connecting the positive electrode and the negative electrode of the T-lens2 with the conductive circuit 8 of the lower lens barrel respectively through a gold wire bonding process;
Compared with the existing lens, in the embodiment, the camera module is divided into an upper lens group 1 and a lower lens group 3, and the conventional AA process cannot be adopted to finish the lamination. The AOA process specifically comprises the following steps:
s601, lighting the photosensitive chip 6;
s602, simultaneously placing an upper lens barrel and a lower lens barrel above a photosensitive chip 6 for imaging;
S603, confirming the definition of the test Chart through the photosensitive chip 6, and determining the relative positions of the upper lens barrel and the lower lens barrel based on the definition, wherein in the embodiment, the side view is a Chart Chart.
S604, fixing the upper lens barrel, the lower lens barrel and the base 4 in a glue drawing mode;
and S7, communicating the T-lens2 with the circuit board 7 through a silver paste supplementing process, and specifically supplementing silver paste between the conductive line 8 of the lower lens barrel and the conductive line 8 of the base 4 and between the conductive line 8 of the base 4 and the circuit board 7.
The conventional application is that the T-lens2 is directly placed at the top of the camera module, so that the height of the camera module is increased, and because the T-lens2 needs to be electrified, the arrangement of the circuit at the top can also increase the size of the camera module in the X/Y direction, the appearance of the camera module is affected, and the size of the camera module cannot be reduced. The scheme is that the T-lens2 is placed between the second lens and the third lens, and the light path design is completed together with the whole lens, so that the appearance of the camera module is beautified, and the size of the camera module is reduced. In the scheme, the T-lens2 is arranged between the upper lens group 1 and the lower lens group 3, and the surface curvature of the T-lens2 can be changed under the action of the power-on voltage, so that the lens can realize zooming. The lens module can replace an AF motor function, and the T-lens2 has the advantages of rapid focusing and low power consumption, and improves the performance of the camera module.
Because the thickness of the T-lens2 body is 0.4mm, the height of the anode and the cathode also needs to be 0.08mm for gold-wire-bonding arc and be Cheng Jiaohou 0.12.12 mm for AA (gold-wire-bonding arc), namely, the reserved distance between the second lens and the third lens is 0.42mm, and the design distance of the conventional lens is 0.06mm, so that the light design difficulty is greatly increased. In this scheme, through reducing first lens edge thickness 0.3mm to 0.2mm, second lens edge thickness 0.3mm reduces to 0.1mm, and third lens edge thickness 0.3mm reduces to 0.18mm and reserves required distance.
Example two
In step S603, it is further determined whether the offset of the upper lens barrel and the lower lens barrel exceeds a preset offset range, if yes, an alarm is given, an external power source is used to supply power to the T-lens barrel, the curvature of the T-lens barrel is adjusted, the definition of the test chart is confirmed by the photosensitive chip, the relative positions of the upper lens barrel and the lower lens barrel are determined based on the definition, whether the offset of the upper lens barrel and the lower lens barrel exceeds the preset offset range is continuously determined, if no, the offset of the upper lens barrel and the lower lens barrel is determined to be a T-lens problem, if yes, the edge profile of the T-lens barrel and the edge profile of the lower lens barrel of the camera module, the edge profile of the T-lens barrel of the camera module and the edge profile of the lower lens barrel of the last camera module are compared, whether there is a difference or not is determined to be a difference, and if no difference is determined to be a lens problem.
In this embodiment, when the upper lens barrel, the lower lens barrel and the base are attached, the offset of the upper lens barrel and the lower lens barrel may exceed the preset offset range, and at this time, the optical path of the lens or the T-lens may be problematic, which results in the offset being too large, and the primary judgment of the cause is required. By using an external power supply, the T-lens can be electrified in advance, imaging is performed after the curvature of the surface of the T-lens is regulated, the relative positions of the upper lens barrel and the lower lens barrel are regulated, and if the relative positions of the upper lens barrel and the lower lens barrel do not exceed a preset offset range, the problem of an optical path is proved to be solved. Since there is a high possibility that the initial surface curvature of T-lens is problematic, it is judged as a T-lens problem. If the condition that the deviation exceeds the preset deviation range still exists, the problem of the light path cannot be solved by adjusting the curvature of the surface of the T-lens; by comparing the edge profile of the T-lens of the camera module with the edge profile of the lower lens barrel and comparing the edge profile of the T-lens of the last camera module with the edge profile of the lower lens barrel, if the difference exists, the calculated T-lens and the center of the lower lens barrel are possibly caused to be different due to the difference of the edge profiles, and then the problem of the fit between the T-lens and the lower lens barrel is caused. If the difference is not generated, the centers of the T-lens of the camera module and the lower lens cone are consistent with the center of the last camera module, and the situation that the T-lens and the lower lens cone are attached to each other is eliminated, so that the problem occurs when the lens is installed.
The foregoing is merely an embodiment of the present application, the present application is not limited to the field of this embodiment, and the specific structures and features well known in the schemes are not described in any way herein, so that those skilled in the art will know all the prior art in the field before the application date or priority date of the present application, and will have the capability of applying the conventional experimental means before the date, and those skilled in the art may, in light of the present application, complete and implement the present scheme in combination with their own capabilities, and some typical known structures or known methods should not be an obstacle for those skilled in the art to practice the present application. It should be noted that modifications and improvements can be made by those skilled in the art without departing from the structure of the present application, and these should also be considered as the scope of the present application, which does not affect the effect of the implementation of the present application and the utility of the patent. The protection scope of the present application is subject to the content of the claims, and the description of the specific embodiments and the like in the specification can be used for explaining the content of the claims.

Claims (5)

1.自动对焦摄像头模组组装方法,其特征在于,包括如下步骤:1. An auto-focus camera module assembly method, characterized in that it comprises the following steps: S1、下镜筒的顶部和侧壁、底座与下镜筒对应的侧壁通过LDS工艺镀铜形成导电线路;S1, the top and side walls of the lower lens barrel, the base and the side walls corresponding to the lower lens barrel are copper plated by LDS process to form a conductive circuit; S2、将感光芯片贴合在电路板上;S2, attaching the photosensitive chip to the circuit board; S4、将底座与电路板贴合,以及将T-lens与下镜筒贴合;S4. Fit the base to the circuit board, and fit the T-lens to the lower lens barrel; S5、将T-lens的正极和负极分别与下镜筒的导电线路连接;S5, connect the positive and negative electrodes of the T-lens to the conductive circuits of the lower lens barrel respectively; S6、将上镜筒与下镜筒、下镜筒与底座之间贴合;S6, fit the upper lens barrel to the lower lens barrel, and the lower lens barrel to the base; S7、将下镜筒的导电线路与底座的导电线路,以及底座的导电线路与电路板电连接;S7, electrically connecting the conductive circuit of the lower lens barrel and the conductive circuit of the base, and the conductive circuit of the base and the circuit board; 所述S6中,通过AOA工艺将上镜筒与下镜筒、下镜筒与底座之间贴合;AOA工艺具体包括:In S6, the upper lens barrel and the lower lens barrel, and the lower lens barrel and the base are bonded together by the AOA process; the AOA process specifically includes: S601、点亮感光芯片;S601, light up the photosensitive chip; S602、将上镜筒、下镜筒同时放置在感光芯片上方成像;S602, placing the upper lens barrel and the lower lens barrel simultaneously above the photosensitive chip for imaging; S603、通过感光芯片确认测试图清晰度,基于清晰度确定上镜筒、下镜筒的相对位置;S603, confirming the clarity of the test image through the photosensitive chip, and determining the relative positions of the upper lens barrel and the lower lens barrel based on the clarity; S604、固定上镜筒、下镜筒以及底座;S604, fixing the upper lens barrel, the lower lens barrel and the base; 步骤S603中,还判断上镜筒与下镜筒的偏移量是否超过预设偏移范围,若超过,进行报警,还使用外接电源对T-lens进行供电,调节T-lens表面曲率,再次通过感光芯片确认测试图清晰度,基于清晰度确定上镜筒、下镜筒的相对位置,继续判断上镜筒与下镜筒的偏移量是否超过预设偏移范围,若未超过,判断为T-lens问题,若超过,获取步骤S4中,本摄像头模组的T-lens的边缘轮廓与下镜筒的边缘轮廓,以及上一摄像头模组的T-lens的边缘轮廓与下镜筒的边缘轮廓,分别将两T-lens的边缘轮廓以及两下镜筒的边缘轮廓进行对比,判断是否有差异,若有差异,判断为T-lens问题,若无差异,判断为镜片问题。In step S603, it is also determined whether the offset between the upper lens barrel and the lower lens barrel exceeds the preset offset range. If so, an alarm is issued, and the T-lens is powered by an external power supply to adjust the surface curvature of the T-lens. The clarity of the test image is confirmed again by the photosensitive chip, and the relative positions of the upper lens barrel and the lower lens barrel are determined based on the clarity. It is further determined whether the offset between the upper lens barrel and the lower lens barrel exceeds the preset offset range. If not, it is determined to be a T-lens problem. If so, the edge contour of the T-lens of the present camera module and the edge contour of the lower lens barrel, as well as the edge contour of the T-lens of the previous camera module and the edge contour of the lower lens barrel, are obtained in step S4. The edge contours of the two T-lens and the edge contours of the two lower lens barrels are compared to determine whether there are any differences. If there are differences, it is determined to be a T-lens problem. If there are no differences, it is determined to be a lens problem. 2.根据权利要求1所述的自动对焦摄像头模组组装方法,其特征在于:所述步骤S5中,通过打金线工艺将T-lens的正极和负极分别与下镜筒的导电线路连接。2. The auto-focus camera module assembly method according to claim 1, characterized in that: in the step S5, the positive electrode and the negative electrode of the T-lens are respectively connected to the conductive circuit of the lower lens barrel by a gold wire punching process. 3.自动对焦摄像头模组,使用上述权利要求1到2任一项的自动对焦摄像头模组组装方法,其特征在于,包括上镜头群组、T-lens、下镜头群组、底座和电路板;3. An auto-focus camera module, using the auto-focus camera module assembly method according to any one of claims 1 to 2, characterized in that it comprises an upper lens group, a T-lens, a lower lens group, a base and a circuit board; T-lens设置在上镜头群组与下镜头群组之间;The T-lens is set between the upper lens group and the lower lens group; 下镜头群组的顶部和侧壁设置导电线路;底座与下镜头群组对应的侧壁也设置有导电线路;Conductive circuits are arranged on the top and side walls of the lower lens group; conductive circuits are also arranged on the side walls corresponding to the base and the lower lens group; 下镜头群组的导电线路与底座的导向线路电连接,以及底座的导电线路与电路板电连接。The conductive circuit of the lower lens group is electrically connected to the guide circuit of the base, and the conductive circuit of the base is electrically connected to the circuit board. 4.根据权利要求3所述的自动对焦摄像头模组,其特征在于:所述上镜头群组包括上镜筒、第一镜片、第二镜片;第一镜片、第二镜片依次设置在上镜筒内;4. The auto-focus camera module according to claim 3, characterized in that: the upper lens group comprises an upper lens barrel, a first lens, and a second lens; the first lens and the second lens are sequentially arranged in the upper lens barrel; 下镜头群组包括下镜筒、第三镜片、第四镜片、第五镜片;第三镜片、第四镜片、第五镜片依次设置在下镜筒内;The lower lens group includes a lower lens barrel, a third lens, a fourth lens, and a fifth lens; the third lens, the fourth lens, and the fifth lens are sequentially arranged in the lower lens barrel; 下镜筒的顶部和侧壁设置导电线路。Conductive circuits are arranged on the top and side walls of the lower lens barrel. 5.根据权利要求3所述的自动对焦摄像头模组,其特征在于:所述下镜筒和底座由LDS材料模塑成型,导电线路通过激光镭雕,再镀铜得到。5. The auto-focus camera module according to claim 3, characterized in that: the lower lens barrel and the base are molded from LDS material, and the conductive circuit is obtained by laser engraving and then copper plating.
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