Disclosure of Invention
The invention provides an automatic focusing camera module which can realize automatic focusing in a smaller structural size.
In order to solve the technical problems, the application provides the following technical scheme:
the automatic focusing camera module comprises an upper lens group, a T-lens, a lower lens group, a base and a circuit board;
t-lens is arranged between the upper lens group and the lower lens group;
The top and the side wall of the lower lens group are provided with conductive circuits, and the side wall of the base corresponding to the lower lens group is also provided with conductive circuits;
the conductive circuit of the lower lens group is electrically connected with the guide circuit of the base, and the conductive circuit of the base is electrically connected with the circuit board.
The basic scheme principle and the beneficial effects are as follows:
In the prior art, the T-lens is generally directly placed at the top of the camera module, but the height of the camera is increased, and because the T-lens needs to be electrified, the X/Y direction size of the camera is increased by placing a circuit on the top, the appearance of the camera is influenced, and a small-head camera cannot be realized. According to the scheme, the T-lens is placed between the upper lens group and the lower lens group, the light path design is completed together with the whole lens, the conductive circuit is directly arranged on the outer wall of the lower lens group and the outer wall of the base, the occupied volume caused by the arrangement of the circuit is reduced, the power supply requirement of the T-lens is met, and the size of the camera is reduced. Under the action of the energizing voltage, the surface curvature of the T-lens can change, so that the lens can realize zooming. The lens module can replace an AF motor function, and the T-lens has the advantages of rapid focusing and low power consumption, and improves the performance of the camera module.
In summary, this scheme can realize automatic focusing at less structure size.
The upper lens group comprises an upper lens cone, a first lens and a second lens, wherein the first lens and the second lens are sequentially arranged in the upper lens cone;
the lower lens group comprises a lower lens cone, a third lens, a fourth lens and a fifth lens, wherein the third lens, the fourth lens and the fifth lens are sequentially arranged in the lower lens cone;
the top and the side wall of the lower lens barrel are provided with conductive circuits.
Further, the lower lens barrel and the base are molded by LDS materials, and the conductive circuit is obtained by laser carving and copper plating.
The LDS process is used for plating copper, a circuit pattern is directly transferred onto the surface of a molded plastic original piece by utilizing numerical control laser, a circuit intercommunication structure is formed by utilizing the three-dimensional surface of a three-dimensional workpiece, and T-lens conduction can be realized on the premise of not increasing the size of a module by utilizing the technology.
The automatic focusing camera module assembly method comprises the following steps:
s1, plating copper on the top and the side wall of the lower lens barrel and the side wall of the base corresponding to the lower lens barrel through an LDS process to form a conductive circuit;
S2, attaching the photosensitive chip to the circuit board;
S4, attaching the base to the circuit board and attaching the T-lens to the lower lens barrel;
s5, connecting the positive electrode and the negative electrode of the T-lens with the conductive circuit of the lower lens barrel respectively;
s6, attaching the upper lens barrel, the lower lens barrel and the base;
S7, electrically connecting the conductive circuit of the lower lens barrel with the conductive circuit of the base and the conductive circuit of the base with the circuit board.
According to the scheme, the T-lens is placed between the upper lens group and the lower lens group, the light path design is completed together with the whole lens, the conductive circuit is directly arranged on the outer wall of the lower lens group and the outer wall of the base, the occupied volume caused by the arrangement of the circuit is reduced, the power supply requirement of the T-lens is met, and the size of the camera is reduced.
Further, in the step S6, the upper lens barrel, the lower lens barrel and the base are attached through an AOA process, wherein the AOA process specifically comprises:
S601, lighting a photosensitive chip;
s602, simultaneously placing an upper lens barrel and a lower lens barrel above a photosensitive chip for imaging;
s603, confirming definition of the test chart through the photosensitive chip, and determining relative positions of the upper lens barrel and the lower lens barrel based on the definition;
s604, fixing the upper lens barrel, the lower lens barrel and the base.
The lens is divided into an upper group and a lower group, the lens cannot be finished by adopting a conventional AA process, the upper group and the lower group are required to be simultaneously placed above the photosensitive chip to form images after the photosensitive chip is lightened, the definition of a test chart is confirmed through the photosensitive chip to determine the reduction required by the upper group and the lower group, and the positions of the upper group and the lower group are fixed through drawing glue to meet the performance requirement of the camera.
Further, in the step S5, the positive electrode and the negative electrode of the T-lens are connected to the conductive lines of the lower barrel, respectively, by a gold wire bonding process.
Further, in step S603, it is further determined whether the offset between the upper lens barrel and the lower lens barrel exceeds a preset offset range based on the relative positions of the upper lens barrel and the lower lens barrel, and if so, an alarm is given.
The upper barrel and the lower barrel having an excessively large offset can be prevented from being assembled.
Detailed Description
The following is a further detailed description of the embodiments:
The marks in the drawing of the specification comprise an upper lens group 1, a T-lens2, a lower lens group 3, a base 4, an optical filter 5, a photosensitive chip 6, a circuit board 7, a conductive circuit 8 and a gold wire 9.
Example 1
As shown in fig. 1, the auto-focusing camera module of the present embodiment includes an upper lens group 1, a T-lens2, a lower lens group 3, a base 4, an optical filter 5, a photosensitive chip 6 and a circuit board 7.
The upper lens group 1 comprises an upper lens barrel, first lenses, second lenses and a plurality of first space rings, wherein in the embodiment, the number of the first space rings is1, the first lenses, the second lenses and the first space rings are arranged in the upper lens barrel, and the first space rings are arranged between the first lenses and the second lenses and used for separating the first lenses and the second lenses, controlling the spacing between the first lenses and the second lenses and preventing the first lenses and the second lenses from rubbing against each other. In this embodiment, the first lens edge thickness is 0.2mm, the second lens edge thickness is 0.1mm,
The lower lens group 3 comprises a lower lens cone, a third lens, a fourth lens, a fifth lens and a plurality of second space rings. In this embodiment, the number of second spacers is 3. The third lens, the fourth lens, the fifth lens and the second space ring are arranged in the lower lens cone. The 3 second space rings are respectively arranged between the lower lens barrel and the third lens, between the third lens and the fourth lens and between the fourth lens and the fifth lens. In this embodiment, the third lens edge thickness is 0.18mm.
T-lens2 is disposed between upper lens group 1 and lower lens group 3. T-lens2 includes piezoelectric thin film, glass film, high molecular polymer and glass bracket.
The optical filter 5 is fixed in the base 4, the photosensitive chip 6 is arranged on the circuit board 7, the upper lens group 1, the T-lens2 and the lower lens group 3 are sequentially combined from top to bottom to form the camera module by the base 4, the photosensitive chip 6 and the circuit board 7.
The top and side walls of the lower lens barrel are provided with conductive lines 8, and the side walls of the base 4 corresponding to the lower lens barrel are also provided with conductive lines 8. In this embodiment, the lower lens barrel and the base 4 are molded from LDS material, and the conductive trace 8 is obtained by laser engraving and copper plating. The LDS material is a modified plastic containing an organic metal compound, and after laser irradiation, the organic metal compound can release particles.
The conductive line 8 of the lower barrel is electrically connected with the guide line of the base 4, and the conductive line 8 of the base 4 is electrically connected with the circuit board 7.
As shown in fig. 2, the positive and negative electrodes of the T-lens2 are connected to the conductive lines 8 of the lower barrel with gold wires 9, respectively. When the circuit board 7 is electrified, the photosensitive chip 6 is lightened, and the T-lens2 is electrified at the same time.
When the T-lens2 is used, the piezoelectric film forms extrusion force after the voltage is applied to the positive electrode and the negative electrode of the T-lens2, the high polymer is extruded to deform, and the glass film protrudes along with the extrusion force, so that the focal length of the T-lens2 is changed. The T-lens2 focal length change is combined with the upper lens group 1 and the lower lens group 3 to achieve the whole lens focal length change.
When the camera module shoots scenes with different distances, the T-lens2 can focus for one cycle rapidly, and the T-lens2 is fixed in deformation at the most clear position of the light sensing of the sightseeing chip, so that the most clear picture can be obtained by focusing rapidly.
Based on the auto-focusing camera module, the embodiment also provides an auto-focusing camera module assembling method, which comprises the following steps:
S1, plating copper on the top and the side wall of the lower lens barrel and the side wall of the base 4 corresponding to the lower lens barrel through an LDS process to form a conductive circuit 8, wherein the LDS process is used for plating copper, namely, a technology of directly transferring a circuit pattern onto the surface of a molded plastic original piece by utilizing numerical control laser and forming a circuit intercommunication structure by utilizing the three-dimensional surface of a three-dimensional workpiece.
S2, attaching the photosensitive chip 6 to the circuit board 7 through a COB packaging process;
And S4, bonding the base 4 with the circuit board 7 through LHA equipment and bonding the T-lens2 with the lower lens barrel, wherein the LHA equipment is provided with an upper adsorption jig, a lower adsorption jig and an upper CCD and a lower CCD, taking bonding the base 4 with the circuit board 7 as an example, the upper adsorption jig adsorbs the base 4, the edge contour of the base 4 is identified through the lower CCD, the lower adsorption jig adsorbs the circuit board 7, the chip contour is identified through the upper CCD, then the circuit board 7 is coated with glue, and the center of the base 4 and the circuit board 7 is calculated according to the edge contour of the base 4 identified by the upper CCD and the lower CCD and the chip contour, so that the base 4 and the circuit board are assembled and bonded together. The fitting of the T-lens2 and the lower lens barrel is also to calculate the center of the T-lens2 and the lower lens barrel according to the edge profile of the T-lens2 and the edge profile of the lower lens barrel, and then the fitting is carried out.
S5, connecting the positive electrode and the negative electrode of the T-lens2 with the conductive circuit 8 of the lower lens barrel respectively through a gold wire bonding process;
Compared with the existing lens, in the embodiment, the camera module is divided into an upper lens group 1 and a lower lens group 3, and the conventional AA process cannot be adopted to finish the lamination. The AOA process specifically comprises the following steps:
s601, lighting the photosensitive chip 6;
s602, simultaneously placing an upper lens barrel and a lower lens barrel above a photosensitive chip 6 for imaging;
S603, confirming the definition of the test Chart through the photosensitive chip 6, and determining the relative positions of the upper lens barrel and the lower lens barrel based on the definition, wherein in the embodiment, the side view is a Chart Chart.
S604, fixing the upper lens barrel, the lower lens barrel and the base 4 in a glue drawing mode;
and S7, communicating the T-lens2 with the circuit board 7 through a silver paste supplementing process, and specifically supplementing silver paste between the conductive line 8 of the lower lens barrel and the conductive line 8 of the base 4 and between the conductive line 8 of the base 4 and the circuit board 7.
The conventional application is that the T-lens2 is directly placed at the top of the camera module, so that the height of the camera module is increased, and because the T-lens2 needs to be electrified, the arrangement of the circuit at the top can also increase the size of the camera module in the X/Y direction, the appearance of the camera module is affected, and the size of the camera module cannot be reduced. The scheme is that the T-lens2 is placed between the second lens and the third lens, and the light path design is completed together with the whole lens, so that the appearance of the camera module is beautified, and the size of the camera module is reduced. In the scheme, the T-lens2 is arranged between the upper lens group 1 and the lower lens group 3, and the surface curvature of the T-lens2 can be changed under the action of the power-on voltage, so that the lens can realize zooming. The lens module can replace an AF motor function, and the T-lens2 has the advantages of rapid focusing and low power consumption, and improves the performance of the camera module.
Because the thickness of the T-lens2 body is 0.4mm, the height of the anode and the cathode also needs to be 0.08mm for gold-wire-bonding arc and be Cheng Jiaohou 0.12.12 mm for AA (gold-wire-bonding arc), namely, the reserved distance between the second lens and the third lens is 0.42mm, and the design distance of the conventional lens is 0.06mm, so that the light design difficulty is greatly increased. In this scheme, through reducing first lens edge thickness 0.3mm to 0.2mm, second lens edge thickness 0.3mm reduces to 0.1mm, and third lens edge thickness 0.3mm reduces to 0.18mm and reserves required distance.
Example two
In step S603, it is further determined whether the offset of the upper lens barrel and the lower lens barrel exceeds a preset offset range, if yes, an alarm is given, an external power source is used to supply power to the T-lens barrel, the curvature of the T-lens barrel is adjusted, the definition of the test chart is confirmed by the photosensitive chip, the relative positions of the upper lens barrel and the lower lens barrel are determined based on the definition, whether the offset of the upper lens barrel and the lower lens barrel exceeds the preset offset range is continuously determined, if no, the offset of the upper lens barrel and the lower lens barrel is determined to be a T-lens problem, if yes, the edge profile of the T-lens barrel and the edge profile of the lower lens barrel of the camera module, the edge profile of the T-lens barrel of the camera module and the edge profile of the lower lens barrel of the last camera module are compared, whether there is a difference or not is determined to be a difference, and if no difference is determined to be a lens problem.
In this embodiment, when the upper lens barrel, the lower lens barrel and the base are attached, the offset of the upper lens barrel and the lower lens barrel may exceed the preset offset range, and at this time, the optical path of the lens or the T-lens may be problematic, which results in the offset being too large, and the primary judgment of the cause is required. By using an external power supply, the T-lens can be electrified in advance, imaging is performed after the curvature of the surface of the T-lens is regulated, the relative positions of the upper lens barrel and the lower lens barrel are regulated, and if the relative positions of the upper lens barrel and the lower lens barrel do not exceed a preset offset range, the problem of an optical path is proved to be solved. Since there is a high possibility that the initial surface curvature of T-lens is problematic, it is judged as a T-lens problem. If the condition that the deviation exceeds the preset deviation range still exists, the problem of the light path cannot be solved by adjusting the curvature of the surface of the T-lens; by comparing the edge profile of the T-lens of the camera module with the edge profile of the lower lens barrel and comparing the edge profile of the T-lens of the last camera module with the edge profile of the lower lens barrel, if the difference exists, the calculated T-lens and the center of the lower lens barrel are possibly caused to be different due to the difference of the edge profiles, and then the problem of the fit between the T-lens and the lower lens barrel is caused. If the difference is not generated, the centers of the T-lens of the camera module and the lower lens cone are consistent with the center of the last camera module, and the situation that the T-lens and the lower lens cone are attached to each other is eliminated, so that the problem occurs when the lens is installed.
The foregoing is merely an embodiment of the present application, the present application is not limited to the field of this embodiment, and the specific structures and features well known in the schemes are not described in any way herein, so that those skilled in the art will know all the prior art in the field before the application date or priority date of the present application, and will have the capability of applying the conventional experimental means before the date, and those skilled in the art may, in light of the present application, complete and implement the present scheme in combination with their own capabilities, and some typical known structures or known methods should not be an obstacle for those skilled in the art to practice the present application. It should be noted that modifications and improvements can be made by those skilled in the art without departing from the structure of the present application, and these should also be considered as the scope of the present application, which does not affect the effect of the implementation of the present application and the utility of the patent. The protection scope of the present application is subject to the content of the claims, and the description of the specific embodiments and the like in the specification can be used for explaining the content of the claims.