CN114706092B

CN114706092B - Time-of-flight module and assembly method thereof, shooting component and terminal

Info

Publication number: CN114706092B
Application number: CN202210239082.XA
Authority: CN
Inventors: 戴阳; 刘海亮
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2022-03-11
Filing date: 2022-03-11
Publication date: 2025-03-11
Anticipated expiration: 2042-03-11
Also published as: CN114706092A; WO2023169057A1

Abstract

The present application discloses a time-of-flight module and its assembly method, shooting component and terminal. The time-of-flight module includes an integrated bracket, a heat sink, a circuit board, a light source, a sensor, and a first optical component and a second optical component fixed to the bracket. Among them: the heat sink includes a first area and a second area, the first side of the circuit board is combined with the first area, the light source is arranged in the second area, and the light source and the sensor are both electrically connected to the circuit board; the bracket is installed on the second side of the circuit board, and forms a receiving cavity with the circuit board that can accommodate the light source and the sensor, and the second side of the circuit board is opposite to the first side of the circuit board. The first optical component is installed on the bracket and corresponds to the light source, and is used to guide the light emitted by the light source to the outside of the time-of-flight module. The second optical component is installed on the bracket and corresponds to the sensor, and is used to receive at least part of the light reflected back by the object and guide the light to the sensor.

Description

Time-of-flight module, assembly method thereof, shooting assembly and terminal

Technical Field

The present application relates to the field of ranging technologies, and in particular, to a time-of-flight module, an assembly method thereof, a shooting assembly, and a terminal.

Background

Time of flight (ToF) is a technique that calculates the distance measurement between an object and a sensor by measuring the Time difference between the transmitted signal and the signal reflected back by the object. When the time-of-flight module works normally, heat generated by the light source can be transferred to the circuit board, so that the temperature of the circuit board is increased, and the circuit board can possibly not work normally.

Disclosure of Invention

The embodiment of the application provides a flight time module, a terminal and an assembly method of the flight time module.

The flight time module comprises an integrated bracket, a radiating plate, a circuit board, a light source, a sensor, a first optical component and a second optical component, wherein the first optical component and the second optical component are fixed on the bracket. The heat dissipation plate comprises a first area and a second area, wherein the first side of the circuit board is combined with the first area, the light source is arranged in the second area, the light source and the sensor are electrically connected with the circuit board, the bracket is arranged on the second side of the circuit board and forms a containing cavity with the circuit board, the containing cavity can contain the light source and the sensor, and the second side of the circuit board is opposite to the first side of the circuit board. The first optical component is arranged on the bracket and corresponds to the light source, and is used for guiding the light emitted by the light source to the outside of the flight time module. The second optical component is arranged on the bracket and corresponds to the sensor and is used for receiving at least part of the light reflected by the object and guiding the light to the sensor.

The terminal of the embodiment of the application comprises a shell and a flight time module, wherein the shell is combined with the flight time module. The flight time module comprises an integrated bracket, a radiating plate, a circuit board, a light source, a sensor and a first optical component and a second optical component which are fixed on the bracket. The heat dissipation plate comprises a first area and a second area, wherein the first side of the circuit board is combined with the first area, the light source is arranged in the second area, the light source and the sensor are electrically connected with the circuit board, the bracket is arranged on the second side of the circuit board and forms a containing cavity with the circuit board, the containing cavity can contain the light source and the sensor, and the second side of the circuit board is opposite to the first side of the circuit board. The first optical component is arranged on the bracket and corresponds to the light source, and is used for guiding the light emitted by the light source to the outside of the flight time module. The second optical component is arranged on the bracket and corresponds to the sensor and is used for receiving at least part of the light reflected by the object and guiding the light to the sensor.

The shooting assembly comprises a two-dimensional camera module and a flight time module. The two-dimensional camera module is used for acquiring a two-dimensional image, the flight time module is used for acquiring a depth information image, and the distance between the center of the sensor of the flight time module and the center of the two-dimensional camera module is smaller than a second preset distance. The flight time module comprises an integrated bracket, a radiating plate, a circuit board, a light source, a sensor and a first optical component and a second optical component which are fixed on the bracket. The heat dissipation plate comprises a first area and a second area, wherein the first side of the circuit board is combined with the first area, the light source is arranged in the second area, the light source and the sensor are electrically connected with the circuit board, the bracket is arranged on the second side of the circuit board and forms a containing cavity with the circuit board, the containing cavity can contain the light source and the sensor, and the second side of the circuit board is opposite to the first side of the circuit board. The first optical component is arranged on the bracket and corresponds to the light source, and is used for guiding the light emitted by the light source to the outside of the flight time module. The second optical component is arranged on the bracket and corresponds to the sensor and is used for receiving at least part of the light reflected by the object and guiding the light to the sensor.

The terminal of the embodiment of the application comprises a shell and a shooting assembly, wherein the shell is combined with the shooting assembly. The shooting assembly comprises a two-dimensional camera module and a flight time module. The two-dimensional camera module is used for acquiring a two-dimensional image, the flight time module is used for acquiring a depth information image, and the distance between the center of the sensor of the flight time module and the center of the two-dimensional camera module is smaller than a second preset distance. The flight time module comprises an integrated bracket, a radiating plate, a circuit board, a light source, a sensor and a first optical component and a second optical component which are fixed on the bracket. The heat dissipation plate comprises a first area and a second area, wherein the first side of the circuit board is combined with the first area, the light source is arranged in the second area, the light source and the sensor are electrically connected with the circuit board, the bracket is arranged on the second side of the circuit board and forms a containing cavity with the circuit board, the containing cavity can contain the light source and the sensor, and the second side of the circuit board is opposite to the first side of the circuit board. The first optical component is arranged on the bracket and corresponds to the light source, and is used for guiding the light emitted by the light source to the outside of the flight time module. The second optical component is arranged on the bracket and corresponds to the sensor and is used for receiving at least part of the light reflected by the object and guiding the light to the sensor.

The assembly method of the flight time module comprises the steps of providing a heat dissipation plate, wherein the heat dissipation plate comprises a first area and a second area, combining a first side of a circuit board with the first area, arranging a light source in the second area of the heat dissipation plate, mounting a sensor on the circuit board, enabling the light source and the sensor to be electrically connected with the circuit board, mounting the first optical component on an integral bracket, mounting the bracket with the first optical component mounted on the second side of the circuit board, forming a containing cavity with the bracket and the circuit board, enabling the sensor and the light source to be contained in the containing cavity, enabling the first optical component to correspond to the light source, and mounting a second optical component on the bracket, enabling the second optical component to correspond to the sensor.

The assembly method of the flight time module comprises the steps of providing a heat dissipation plate, wherein the heat dissipation plate comprises a first area and a second area, combining a first side of a circuit board with the first area, arranging a light source in the second area of the heat dissipation plate, mounting a sensor on the circuit board, enabling the light source and the sensor to be electrically connected with the circuit board, fixing an integral support on the second side of the circuit board, enabling the support and the circuit board to form a containing cavity so that the sensor and the light source can be contained in the containing cavity, and fixing a first optical component and a second optical component on the support so that the first optical component corresponds to the light source and the second optical component corresponds to the sensor.

According to the flight time module, the assembly method thereof, the shooting assembly and the terminal, the light source is arranged in the second area of the heat dissipation plate in the flight time module, and the first area of the heat dissipation plate is combined with the circuit board, so that compared with the situation that the light source is directly arranged on the circuit board, heat generated by the light source is prevented from being transferred to the circuit board, and the situation that the circuit board cannot work normally due to the fact that the temperature of the circuit board is increased is avoided.

Additional aspects and advantages of embodiments of the application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a schematic cross-sectional view of a three-dimensional structure of a time-of-flight module in certain embodiments of the application;

FIG. 2 is an exploded schematic view of a three-dimensional structure of a time-of-flight module in some embodiments of the application;

FIGS. 3 and 4 are schematic diagrams of the relationship between the baseline and the distance traveled by the spot in the sensor in the time-of-flight module in some embodiments of the present application;

FIG. 5 is a schematic diagram of the structure of a time-of-flight module in some embodiments of the application;

FIG. 6 is a schematic diagram of a conventional time-of-flight module and a time-of-flight module according to some embodiments of the present application

FIG. 7 is a schematic diagram of a prior art time of flight module portion structure and a time of flight module portion structure according to certain embodiments of the present application;

FIGS. 8 and 9 are schematic diagrams of time-of-flight modules in accordance with certain embodiments of the present application;

FIGS. 10 and 11 are schematic diagrams of electrical connection of a light source to a circuit board in a time-of-flight module according to certain embodiments of the present application;

FIG. 12 is a schematic illustration of the structure of a portion of a time-of-flight module in accordance with certain embodiments of the application;

FIGS. 13-15 are schematic illustrations of the structure of a first optical component in a time-of-flight module in accordance with certain embodiments of the present application;

FIG. 16 is a schematic diagram showing the relationship between the back focal size of an optical component in a light emitting module and the length, width, and height of the light emitting module;

FIGS. 17 and 18 are schematic diagrams of a second optical component of a time-of-flight module according to certain embodiments of the present application;

Fig. 19 and 20 are schematic structural views of terminals according to some embodiments of the present application;

fig. 21-24 are flow diagrams of methods of assembling a time-of-flight module according to certain embodiments of the application.

Detailed Description

Embodiments of the present application are further described below with reference to the accompanying drawings. The same or similar reference numbers in the drawings refer to the same or similar elements or elements having the same or similar functions throughout.

In addition, the embodiments of the present application described below with reference to the drawings are exemplary only for explaining the embodiments of the present application and are not to be construed as limiting the present application.

In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

Referring to fig. 1 and 2, an embodiment of the present application provides a time-of-flight module 100. The time-of-flight module 100 includes an integral bracket 50, a heat sink 20, a circuit board 10, a light source 30, a sensor 40, and first and second optical assemblies 60 and 70 secured to the bracket 50. The heat dissipation plate 20 includes a first region 201 and a second region 202, the first side 11 of the circuit board 10 is combined with the first region 201, the light source 30 is disposed in the second region 202, and the light source 30 and the sensor 40 are electrically connected with the circuit board 10. The bracket 50 is mounted on the second side 12 of the circuit board 10, and forms a housing cavity 501 with the circuit board 10 capable of housing the light source 30 and the sensor 40, the second side 12 of the circuit board 10 being opposite to the first side 11 of the circuit board 10. The first optical assembly 60 is mounted on the bracket 50 and corresponds to the light source 30, and is used for guiding the light emitted by the light source 30 to the outside of the time-of-flight module 100. A second optical assembly 70 is mounted to the support 50 and corresponds to the sensor 40 for receiving at least a portion of the light reflected back by the object and directing the light to the sensor 40.

In the time-of-flight module 100 of the present application, by disposing the light source 30 in the second region 202 of the heat dissipation plate 20, and combining the first region 201 of the heat dissipation plate 20 with the circuit board 10, compared with directly disposing the light source 30 on the circuit board 10, the heat generated by the light source 30 is prevented from being transferred to the circuit board 10, thereby preventing the circuit board 10 from being unable to operate normally due to the temperature rise of the circuit board 10.

Further description is provided below with reference to the accompanying drawings.

Referring to fig. 1 and 2, the time-of-flight module 100 includes an integral bracket 50, a heat sink 20, a circuit board 10, a light source 30, a sensor 40, a first optical component 60 and a second optical component 70. The sensor 40 and the light source 30 provided on the heat sink 20 are electrically connected to the circuit board 10. The light source 30 is configured to emit light outwards, the first optical component 60 is disposed on the bracket 50 and is disposed corresponding to the light source 30 to guide the light emitted by the light source 30 out of the time-of-flight module 100, and the second optical component 70 is disposed on the bracket 50 and is disposed corresponding to the sensor 40 to guide the received light reflected by the object back to the sensor 40, and the sensor 40 is configured to convert the received light into an electrical signal.

Specifically, the heat dissipation plate 20 includes a first region 201 and a second region 202, the circuit board 10 includes a first side 11 and a second side 12 opposite to each other, and the first region 201 of the heat dissipation plate 20 is combined with the first side 11 of the circuit board 10. The light source 30 is disposed in the second region 202 of the heat sink 20, and the heat sink 20 is configured to dissipate heat from the light source 30. Because the heat dissipation plate 20 can dissipate heat of the light source 30, that is, heat generated by the light source 30 arranged on the heat dissipation plate during normal operation can be dissipated through the heat dissipation plate 20, compared with the case that the light source 30 is directly arranged on the circuit board 10, the heat generated by the light source 30 can be prevented from being transferred to the circuit board 10, and therefore the situation that the circuit board 10 cannot normally work due to temperature rise of the circuit board 10 is avoided. It should be noted that, in some embodiments, the heat dissipation plate 20 may be made of a ceramic material, that is, the heat dissipation plate 20 may be a ceramic plate. Of course, the heat dissipation plate 20 may be made of other heat dissipation materials, which is not limited thereto

Referring to fig. 1, in some embodiments, the distance between the center of the sensor 40 and the center of the light source 30 is less than a first predetermined distance. This facilitates the time-of-flight module 100 to obtain depth information of the object under test. In some embodiments, the first preset distance may be 5mm, i.e. the distance between the center of the sensor 40 and the center of the light source 30 is less than 5mm. For example, the distance between the center of the sensor 40 and the center of the light source 30 may be 4mm, 3.5mm, 2mm, etc., without limitation. Of course, in some embodiments, the distance between the center of the sensor 40 and the center of the light source 30 may also be equal to 5mm. Preferably, in some embodiments, the distance between the center of the sensor 40 and the center of the light source 30 may be 3.6mm. The distance between the optical centers of the sensor 40 and the light source 30 is defined as a baseline, and the baseline will be explained in the following, and will not be described in detail.

It should be noted that, in the embodiment of the present application, the Time-of-flight module 100 obtains depth information of the object to be measured based on Time-of-flight (ToF). The time-of-flight technique calculates depth information of an object to be measured based on a time difference between an emitted light ray and a light ray reflected back from the received object to be measured. Therefore, in the design process, the position of the light spot irradiated to the sensor in the receiving end is expected not to change as much as possible, so that the design of the sensor reading circuit is facilitated to be simplified.

Since the baseline distance of the time-of-flight module 100 can be shortened in the present embodiment, the time-of-flight module 100 is facilitated to acquire depth information of the object to be measured. Specifically, when the light is projected out, it is reflected back to the receiving end by the target, and may be received by a pixel or pixels of the sensor 40 in the receiving end. For the same pixel, when the distance between the target object and the module is changed, the position on which the pixel is finally projected is also changed. For example, as shown in fig. 3, the point D emits a laser beam, which is reflected through the focal point C of the receiving end when the target is at the F position, and finally irradiates the point a of the image plane (plane of the point AB) of the sensor 40, and irradiates the point B of the sensor 40 after passing through the focal point C of the receiving end lens group (i.e., the second optical assembly 70) when the target is at the E position. It can be seen that the same laser beam, due to the different distances of the target object from the module, may eventually be received by different areas/pixels of the sensor 40. Defining the above-mentioned difference of moving distance on the sensor 40 as L _disparity, the focal length of the receiving lens (i.e. the second optical component 70) as f, the distance between the optical center of the light emitting module and the optical center of the light receiving module as a base line L _baseline, and the distance between the target object and the laser radar ranging module as L _range, the above-mentioned parameters follow the following relationships: That is, in the case that the focal length f of the receiving lens (i.e. the second optical component 70) and the distance L _range between the target object and the lidar ranging module are fixed, the moving distance difference L _disparity on the sensor 40 is proportional to the baseline L _baseline. Assuming that the baseline L _baseline is 3mm (a typical value of 10mm from the center of the emission module and the light receiving module in the existing time-of-flight module 100 to the baseline), the equivalent focal length of the second optical component 70 is 1.63mm, and the size of the pixel in the sensor 40 is 10um. The distance between the current measured object changes, and the movement relationship of the light spot on the sensor 40 is shown in FIG. 4. It will be appreciated that under the influence of the baseline L _baseline, there is a major impact on the close range (e.g. less than 2 m) laser spot position. Since the time-of-flight module 100 calculates depth information of the object based on the time difference between the emitted light and the light reflected by the received object. Therefore, it is desirable that the position where the light spot irradiates the sensor 40 does not change as much as possible during the design process, which is advantageous in simplifying the design of the readout circuit of the sensor 40. As can be seen from fig. 4, when the target distance is 0.3m, the spot position is shifted by only about 2.5 pixels when the center distance of the emission module and the light receiving module is small (3 mm), but the center distance of the emission module and the light receiving module is large (10 mm), and the spot position is shifted by about 8 pixels. Thus, shortening the baseline distance of the time-of-flight module 100 may prove advantageous for the time-of-flight module 100 to obtain depth information for the object under test.

Referring to fig. 5, in some embodiments, the circuit board 10 is provided with a first through hole 13 penetrating through the first side 11 and the second side 12, and the first through hole 13 corresponds to the second area 202, so that the light emitted by the light source 30 disposed on the second area 202 can be emitted smoothly.

For example, referring to fig. 5, in some embodiments, the light source 30 is disposed in the second region 202 and is accommodated in the first through hole 13. On the one hand, since the light source 30 is disposed in the second region 202 of the heat dissipating plate 20, compared to the light source 30 being directly disposed on the circuit board 10, the heat generated by the light source 30 can be prevented from being transferred to the circuit board 10. On the other hand, since other electronic devices 801 are usually disposed around the light source 30, a certain space is required between the electronic devices 801 and the light source 30 (as shown in the left side of fig. 6), and the light source 30 is disposed in the second region 202 and accommodated in the first through hole 13, the lateral distance between the electronic devices 801 and the light source 30 can be shortened, and at the same time, the electronic devices 801 can be prevented from contacting the light source 30 (as shown in the right side of fig. 6). Thus, the baseline distance of the time-of-flight module 100 can be further shortened under the premise of ensuring the normal operation of the time-of-flight module 100. On the other hand, as shown in the left diagram of fig. 7, when the light source 30 is directly disposed on the second side 12 of the circuit board 10, the light emitted by the light source 30 may directly enter the second optical component 70 and then be directed to the sensor 40, i.e. unnecessary stray light is introduced. In the present application (as shown in the right side of fig. 7), since the light source 30 is disposed in the second region 202 and is accommodated in the first through hole 13 of the circuit board 10, the circuit board 10 can block at least part of the light emitted by the light source 30 from entering the second optical component 70, so as to reduce the stray light interference in the time-of-flight module 100, and facilitate the accuracy of the time-of-flight module 100 to obtain the depth information of the object to be measured, compared with the light source 30 directly disposed on the second side 12 of the circuit board 10. On the other hand, since the light source 30 is disposed in the second region 202 and is accommodated in the first through hole 13, the overall thickness of the optical time-of-flight module 100 can be reduced without changing the distance between the light source 30 and the first optical component 60.

For another example, referring to fig. 8, in some embodiments, the second region 202 includes a protruding portion 21 protruding toward the circuit board 10, the protruding portion 21 can be exposed from the second side 12 of the circuit board 10 through the first through hole 13, and the light source 30 is disposed on a side of the protruding portion 21 away from the circuit board 10. On the one hand, since the light source 30 is disposed in the second region 202 of the heat dissipating plate 20, compared to the light source 30 being directly disposed on the circuit board 10, the heat generated by the light source 30 can be prevented from being transferred to the circuit board 10. On the other hand, since the protruding portion 21 can be exposed from the second side 12 of the circuit board 10 through the first through hole 13, the light source 30 is disposed on a side of the protruding portion 21 away from the circuit board 10, and there is a height difference between the light source 30 and the second side 12 of the circuit board 10 in the light emitting direction of the light source 30. In this way, by providing the light source 30 on the side of the boss 21 away from the circuit board 10, the electronic device 801 and the light source 30 can be prevented from contacting while the lateral distance between the electronic device 801 and the light source 30 is shortened. That is, the light source 30 is disposed on the side of the protruding portion 21 away from the circuit board 10, so that the baseline distance of the time-of-flight module 100 can be further shortened on the premise of ensuring the normal operation of the time-of-flight module 100.

It should be noted that, in some embodiments, as shown in fig. 9, the area of the circuit board 10 is smaller than the area of the heat dissipation plate 20 in some embodiments. That is, the circuit board 10 cannot entirely cover the heat dissipation plate 20, and a portion of the heat dissipation plate 20 not covered by the circuit board 10 is the second region 202. This also enables the light emitted from the light source 30 provided on the second region 202 to be smoothly emitted.

In some embodiments, referring to fig. 5, the time-of-flight module 100 further includes an electronic device 801, where the electronic device 801 is disposed on the second side 12 of the circuit board 10. The distance between the electronics 801 and the light source 30 is less than a preset threshold. Thus, the lateral distance between the electronic device 801 and the light source 30 can be shortened, and the electronic device 801 can be prevented from contacting the light source 30, so that the baseline distance of the time-of-flight module 100 is shortened. The electronic device 801 may be a register for controlling the emission time interval of the light source 30, or the electronic device 801 may be a digital-to-analog converter or an analog-to-digital converter, etc., without limitation.

Referring to fig. 5, the light source 30 is electrically connected to the circuit board 10, and the circuit board 10 can provide power to the light source 30 to enable the light source 30 to emit light. Specifically, referring to fig. 10 and 11, in some embodiments, a side of the light source 30 near the heat sink 20 has a first electrode end 31, and a side far from the heat sink 20 has a second electrode end 32. Wherein the first electrode terminal 31 and the second electrode terminal 32 are opposite electrodes. For example, the first electrode terminal 31 is an anode and the second electrode terminal 32 is a cathode, or the first electrode terminal 31 is a cathode and the second electrode terminal 32 is an anode, without limitation. The first electrode terminal 31 and the second electrode terminal 32 of the light source 30 are electrically connected to corresponding electrodes in the circuit board 10, respectively, so that the light source 30 is electrically connected to the circuit board 10.

For example, referring to fig. 10, in some embodiments, the time-of-flight module 100 may further include a conductive member 81 and a first lead 82. One end of the conductive member 81 is positioned between the light source 30 and the heat dissipation plate 20 to be electrically connected to the first electrode terminal 31, and the other end is positioned between the circuit board 10 and the heat dissipation plate 20 to be electrically connected to the circuit board 10, so that the first electrode terminal 31 of the light source 30 can be electrically connected to the circuit board 10 through the conductive member 81. One end of the first lead 82 is electrically connected to the second electrode terminal 32, and the other end is electrically connected to an electrode located on a side of the circuit board 10 remote from the heat dissipation plate 20, so that the second electrode terminal 32 of the light source 30 can be electrically connected to the circuit board 10 through the first lead 82. Thus, even if the light source 30 is not directly disposed on the circuit board 10, the light source 30 can be normally supplied with power by the circuit board 10 through the conductive member 81 and the first lead 82.

For another example, referring to fig. 11, in some embodiments, the time-of-flight module 100 can further include a conductive member 81, a first lead 82, and a second lead 83. One end of the conductive member 81 is positioned between the light source 30 and the heat dissipation plate 20, electrically connected to the first electrode terminal 31, and the other end is positioned at the second region 202 of the heat dissipation plate 20, and electrically connected to an electrode positioned at a side of the circuit board 10 remote from the heat dissipation plate 20 through the second lead 83. Thus, even if the light source 30 is not directly disposed on the circuit board 10, the light source 30 can be normally supplied with power by the circuit board 10 through the conductive member 81 and the first lead 82.

Referring to fig. 10 and 11, in some embodiments, in the light emitting direction of the light source 30, the distance between the second electrode end 32 and the electrode located on the second side 12 of the circuit board 10 is different from the distance between the opposite sides of the light source 30. It will be appreciated that when the side of the light source 30 adjacent to the heat sink 20 is disposed at the same level as the second side 12 of the circuit board 10, the distance between the second electrode end 32 and the electrode located on the second side 12 of the circuit board 10 in the light emitting direction of the light source 30 must be equal to the distance between the opposite sides of the light source 30. If the second electrode end 32 is located at the electrode on the second side 12 of the circuit board 10 and the electrode on the second side 12 of the circuit board 10 is in direct contact with the light source 30, faults such as short circuit can easily occur, so that the time-of-flight module 100 cannot work normally. Therefore, it is necessary to maintain a certain distance between the electrode located on the second side 12 of the circuit board 10 and the light source 30. However, in the present embodiment, since the distance between the second electrode end 32 and the electrode located on the second side 12 of the circuit board 10 is different from the distance between the opposite sides of the light source 30 in the light emitting direction of the light source 30, the side of the light source 30 close to the heat dissipation plate 20 and the second side 12 of the circuit board 10 are not disposed on the same horizontal plane, that is, there is a difference in height between the side of the light source 30 close to the heat dissipation plate 20 and the second side 12 of the circuit board 10. At this time, even if the lateral distance between the electrode on the second side 12 of the circuit board 10 and the light source 30 is shortened, the two are not in direct contact, so that the baseline distance of the time-of-flight module 100 can be further shortened while ensuring the normal operation of the time-of-flight module 100.

It should be noted that, in some embodiments, the distance between the second electrode end 32 and the electrode located on the second side 12 of the circuit board 10 in the light emitting direction of the light source 30 is within a preset range. That is, in the light emitting direction of the light source 30, the distance between the side of the light source 30 away from the heat dissipation plate 20 and the second side 12 of the circuit board 10 is within a preset range. Gold wires are generally used as the first leads 82, but gold wires have a limited curvature based on the current technology, i.e. the curvature of the gold wires cannot be too great. In the present embodiment, the distance between the second electrode end 32 and the electrode located on the second side 12 of the circuit board 10 is within the preset range, so that the curvature of the first lead 82 connecting the second electrode end 32 and the electrode located on the second side 12 of the circuit board 10 can be maintained within a certain range, i.e. the limit curvature of the gold wire is not exceeded, thereby being beneficial to reducing the difficulty of manufacturing the time-of-flight module 100.

Referring to fig. 1 and 2, in some embodiments, the sensor 40 is mounted on the second side 12 of the circuit board 10 and is electrically connected to the circuit board 10. Referring to fig. 12, in some embodiments, the heat dissipation plate 20 further includes a third region 203, and the circuit board 10 is further provided with a second through hole 14 penetrating the first side 11 and the second side 12. The sensor 40 is disposed in the third region 203 of the heat sink 20 and is accommodated in the second through hole 14. At this time, the heat dissipation plate 20 may also be used to dissipate heat from the sensor 40. Therefore, compared with the sensor 40 directly arranged on the circuit board 10, the heat generated by the sensor 40 is prevented from being transferred to the circuit board 10, the temperature of the circuit board 10 is increased, and the circuit board 10 cannot work normally. It should be noted that, even if the sensor 40 is disposed in the heat dissipation plate 20, the sensor 40 is still electrically connected to the circuit board 10, and the specific connection manner is similar to that of the light source 30 and the circuit board 10 in the above embodiment, and will not be described herein.

Referring to fig. 1 and 2, the integral bracket 50 is fixedly mounted on the second side 12 of the circuit board 10, and forms a containing cavity 501 with the circuit board 10 for containing the light source 30 and the sensor 40. The first optical assembly 60 fixed in the holder 50 can correspond to the light source 30, and the second optical assembly 70 fixed in the holder 50 can correspond to the sensor 40. In some embodiments, the number of the accommodating cavities 501 may be 1, where the light source 30 and the sensor 40 are accommodated in the accommodating cavities 501, or in some embodiments, the number of the accommodating cavities 501 may be two, where the light source 30 and the sensor 40 are accommodated in different accommodating cavities 501.

Because the first optical component 60 and the second optical component 70 are fixedly mounted on the integral bracket 50 in the time-of-flight module 100 of the present application, the time-of-flight module 100 can be more compact and the baseline distance of the time-of-flight module 100 can be reduced compared with the conventional time-of-flight module (the transmitting end and the receiving end each have a separate bracket and a separate circuit board).

Specifically, referring to fig. 1 and 2, in some embodiments, the integrated bracket 50 includes a first support 51, a second support 52, and a connection assembly 53 connecting the first support 51 and the second support 52. The first supporting member 51 and the second supporting member 52 are disposed at intervals, and are respectively fixed to the second side 12 of the circuit board 10. The first supporting member 51 and the second supporting member 52 may be fixedly connected to the second side 12 of the circuit board 10 through different connection manners, and of course, the first supporting member 51 and the second supporting member 52 may also be fixedly connected to the second side 12 of the circuit board 10 through the same connection manner, which is not limited herein. Further, the manner of attachment includes, but is not limited to, bonding, clamping, threading, and the like.

More specifically, the first support 51 is closer to the light source 30 than the second support 52, and in some embodiments, both the first support 51 and the second support 52 are carried on the second side 12 of the circuit board 10. In particular, as shown in fig. 9, in some embodiments, the first support member 51 may be further carried on the heat dissipation plate 20 and fixed on the heat dissipation plate 20, and the second support member 52 may be carried on a side of the circuit board 10 away from the heat dissipation plate 20.

With continued reference to fig. 1 and 2, the connecting component 53 is connected to the first support 51 and the second support 52, and the connecting component 53 includes a first mounting hole 531 and a second mounting hole 532. Wherein the first mounting hole 531 is used to mount the first optical assembly 60 and the second mounting hole 532 is used to mount the second optical assembly 70. For example, the first mounting hole 531 is a through hole with an axis perpendicular to the circuit board 10 and the heat dissipation plate 20, so as to facilitate propagation of light beams, the first optical component 60 is disposed in the first mounting hole 531, and the first optical component 60 is fixedly connected to the first mounting hole 531 by an adhesive, and an optical axis of the first optical component 60 coincides with an optical axis of the light source 30, so that after the bracket 50 and the circuit board 10 are fixedly connected, the corresponding arrangement of the first optical component and the light source 30 is implemented, so that the first optical component 60 can guide the light emitted by the light source 30 to the outside of the time-of-flight module 100. Of course, the first optical assembly 60 may be mounted and fixed in the first mounting hole 531 by other methods, which are not limited herein.

The second mounting hole 532 is a through hole with an axis perpendicular to the circuit board 10, so as to facilitate propagation of the light beam, and the second optical component 70 is connected with the second mounting hole 532, and after the bracket 50 is fixedly connected with the circuit board 10, the second optical component can be correspondingly arranged with the light source 30, so that the light reflected by the object to be measured is guided to the sensor 40 through the second optical component 70.

It should be noted that, in some embodiments, the time-of-flight module 100 further includes a filter 84, the filter 84 is disposed between the second optical component 70 and the sensor 40, and the filter 84 is used for filtering light outside the predetermined wavelength range. Specifically, in some embodiments, the second mounting hole 532 includes a first cavity 5321 and a second cavity 5322 that are in communication, and after the bracket 50 and the circuit board 10 are fixedly connected, the first cavity 5321 is closer to the circuit board 10 than the second cavity 5322. The second optical component 70 is installed in the second cavity 5322, and the optical filter 84 is installed in the first cavity 5321, so that the light reflected by the object to be measured sequentially passes through the second optical component 70 and the optical filter 84 and then enters the sensor 40.

In some embodiments, the light emitted by the light source 30 forms a planar pattern. Illustratively, the light source 30 includes a plurality of light emitting elements (not shown), each of which is capable of emitting a light beam, and the light beams emitted by the plurality of light emitting elements form a planar pattern. Referring to fig. 1 and 13-15, the first optical component 60 may include a diffractive optical element 61. The diffractive optical element 61 is provided with an integrated microstructure 611, which integrated microstructure 611 is capable of collimating the planar pattern and reproducing the planar pattern to eject the speckle pattern out of the time of flight module 100. Because the integrated microstructures 611 on the diffractive optical element 61 can collimate the planar pattern and replicate the planar pattern to emit the speckle pattern, the time-of-flight module 100 of the present application can reduce the volume of the time-of-flight module 100 and reduce the manufacturing cost of the time-of-flight module 100 without affecting the optical effect of projecting the speckle image, as compared to using different optical elements to achieve the collimation and replication functions, respectively.

In addition, while keeping the distance between the first optical component 60 and the circuit board 10 unchanged, when the light source 30 is disposed in the second region of the heat dissipation plate 20 and is located in the first through hole 13 (as shown in fig. 5), the first optical component 60 needs to have a larger back focus than when the light source 30 is directly disposed on the second side 12 of the circuit board 10. And the back focus of the first optical assembly 60 is also increased due to the electronics 801 and gold wires around the light source 30. Referring to fig. 16, it can be understood that the larger the back focal length of the first optical component 60, the larger the volume of the light emitting module formed by combining the light source 30 and the first optical component 60, and thus the larger the volume of the time-of-flight module 100. In this embodiment, the integrated microstructure 611 is used to realize the functions of the conventional lens assembly and the diffraction element, so that the space of the light emitting module can be released to the greatest extent, which is helpful for compressing the baseline of the time-of-flight module 100. That is, the integrated microstructures 611 on the diffractive optical element 61 are capable of collimating the planar pattern and replicating the planar pattern to emit the speckle pattern, which can further shorten the baseline of the time-of-flight module 100 as compared to using different optical elements to achieve the collimating and replication functions, respectively.

In particular, the integrated microstructure 611 may be formed by fusing a virtual phase-based first microstructure and a virtual second microstructure. The first microstructure is used for collimating light rays, and the second microstructure is used for copying light spots formed by the received light rays. For example, in some embodiments, the first microstructure is a microstructure of an n-step diffraction lens or a microstructure of a superlens, where n is 2 or more. The first microstructure can thus be used for collimating light. For another example, in some embodiments, the second microstructure is a grating-based diffractive microstructure or a superlens-based diffractive microstructure. The second microstructure can thus be used to replicate the light spot formed by the received light.

Further, referring to fig. 13 and 14, the diffractive optical element 61 includes a first surface 6101 and a second surface 6102 opposite to each other, wherein the first surface 6101 faces the light source 30, and the second surface 6102 is away from the light source 30. That is, the light emitted by the light source 30 enters the first surface 6101 of the diffractive optical element 61 and exits the second surface of the diffractive optical element 61. The integrated microstructures 611 may be disposed on the first face 6101 and/or the second face 6102 of the diffractive optical element 61. For example, referring to fig. 13, in some embodiments, the integrated microstructure 611 may be disposed on the first surface 6101 of the diffractive optical element 61, which is advantageous for preventing the integrated microstructure 611 from being scratched and preventing moisture and dust from entering the integrated microstructure 611, compared to the second surface 6102 of the diffractive optical element 61, so as to prolong the service life of the time of flight module 100. For another example, referring to fig. 14, in some embodiments, the integrated microstructure 611 may also be disposed on the second surface 6102 of the diffractive optical element 61. Glare may occur due to direct incidence of strong light to the integrated microstructure 611, and the stray light is relatively severe, which may affect the detection accuracy of the time-of-flight module 100. Therefore, the integrated microstructure 611 is disposed on the second surface 6102 far from the light source 30, so that the volume of the time-of-flight module 100 can be reduced, and the glare and stray light can be avoided, which is beneficial to improving the detection accuracy of the time-of-flight module 100. Of course, in some embodiments, the opposite sides of the diffractive optical element 61 are each provided with an integrated microstructure 611, without limitation.

Referring to fig. 15, in some embodiments, the diffractive optical element 61 includes a first layer 612 and a second layer 613, and the first layer 612 is closer to the light source 30 than the second layer 613. The integrated microstructure 611 is located within a sealed cavity 614 formed by the first layer 612 and the second layer 613. Because the integrated microstructure 611 is contained in the sealed cavity 614, moisture and dust can be prevented from entering the integrated microstructure 611, which is beneficial to prolonging the service life of the time-of-flight module 100. The first layer 612 and the second layer 613 of the diffractive optical element 61 may be made of plastic. Of course, the first layer 612 and the second layer 613 of the diffractive optical element 61 may be made of other materials capable of preventing water and dust, and are not limited thereto.

In some embodiments, a filler 615 (shown in fig. 13) is disposed between the voids of the integrated microstructures 611. In this way, on one hand, moisture and dust can be prevented from entering the gaps of the integrated microstructure 611, so that the service life of the time-of-flight module 100 is prolonged, and on the other hand, light beams emitted by the light source 30 can be prevented from being directly emitted into human eyes from the gaps of the integrated microstructure 611, so that the safety of the time-of-flight module 100 is improved. It should be noted that in some embodiments, the filler may include an organic or silica.

Referring to fig. 17 and 18, in some embodiments, the second optical component 70 includes a phase lens 71, and the phase lens 71 is configured to receive at least a portion of the light reflected back by the object and adjust the phase of the light exiting the phase lens 71 to the sensor 40. Since the phase lens 71 capable of adjusting the phase of the light is provided to replace the conventional refractive lens set in the present embodiment, the volume of the time-of-flight module 100 can be reduced, the illuminance of the light reaching the sensor 40 can be improved, and the sensor 40 can receive the light, so as to improve the detection accuracy of the time-of-flight module 100.

It should be noted that, in some embodiments, the illuminance of the light reaching the sensor 40 through the phase lens 71 is greater than or equal to 98%. Specifically, the phase lens 71 includes a substrate 711 and a phase microstructure 712 provided on the substrate 711. The phase structure is used to adjust the phase of the light rays exiting the phase lens 71 to the sensor 40.

More specifically, the substrate 711 includes first and second opposite sides 7111, 7112, the first side 7111 being further from the sensor 40 than the second side 7112. The phase microstructures 712 may be disposed on the first side 7111 and/or the second side 7112 of the substrate 711. For example, referring to fig. 17, in some embodiments, a phase microstructure 712 may be disposed on a first face 7111 of a substrate 711. Since the phase microstructure 712 adjusts the phase of the light emitted from the phase lens 71 to the sensor 40, the illuminance of the light reaching the image sensor can be improved as compared with the case where the light directly passes through the lens and then is emitted to the sensor 40. For another example, referring to fig. 18, in some embodiments, a phase microstructure 712 may also be disposed on the second face 7112 of the substrate 711. Glare may occur due to direct incidence of strong light to the behavior microstructure, and the stray light is relatively severe, which is unfavorable for the sensor 40 to receive light, thereby affecting the detection accuracy of the time-of-flight module 100. Therefore, compared with the case where the phase microstructure 712 is disposed on the second surface 7112 of the substrate 711, the present embodiment can avoid glare and reduce stray light while improving the illuminance of light reaching the sensor 40, which is beneficial for the sensor 40 to receive light, so as to improve the detection accuracy of the time-of-flight module 100. Of course, in some embodiments, opposite sides of the substrate 711 may each be provided with a phase microstructure 712, without limitation.

It should be noted that in some embodiments, the phase lens 71 is a planar phase lens, where the phase microstructure 712 includes a nano-microstructure, or in some embodiments, the phase lens 71 is a fresnel lens, where the phase microstructure 712 includes a circular fresnel microstructure, without limitation.

Referring to fig. 19, the embodiment of the application further provides a terminal 1000. Terminal 1000 can include a housing 200 and a time of flight module 100 as described in any of the embodiments above, with time of flight module 100 being coupled to housing 200. It should be noted that, terminal 1000 can be a mobile phone, a computer, a tablet computer, a smart watch, a smart wearable device, etc., and is not limited herein.

In the terminal 1000 of the present application, by disposing the light source 30 in the second region 202 of the heat dissipation plate 20 in the time-of-flight module 100, and combining the first region 201 of the heat dissipation plate 20 with the circuit board 10, compared with directly disposing the light source 30 on the circuit board 10, the heat generated by the light source 30 is prevented from being transferred to the circuit board 10, thereby preventing the circuit board 10 from being unable to operate normally due to the temperature rise of the circuit board 10.

Referring to fig. 20, the embodiment of the application further provides a photographing assembly 300. The camera assembly 300 includes a two-dimensional camera module 301 and a time-of-flight module 100 as described in any of the embodiments above. The two-dimensional camera module 301 is used for acquiring a two-dimensional image, and the time-of-flight module 100 is used for acquiring a depth information image. The distance between the center of the sensor 40 of the time-of-flight module 100 and the center of the two-dimensional camera module 301 is less than a second preset distance. Because the distance between the center of the sensor 40 of the time-of-flight module 100 and the center of the two-dimensional camera module 301 is smaller than the second preset distance, the field of view of the time-of-flight module 100 and the field of view of the two-dimensional camera module 301 can be made to be close to each other, so that the shooting assembly 300 can acquire two-dimensional images and depth information images under the same field of view at the same time. The two-dimensional camera module 301 may be a color camera module, in which case the two-dimensional image obtained is a color image, or the two-dimensional camera module 301 may be a black-and-white camera module, in which case the two-dimensional image obtained is a black-and-white image, which is not limited herein.

It should be noted that, in some embodiments, the second preset distance may be 2cm. I.e. the distance between the center of the sensor 40 of the time-of-flight module 100 and the center of the two-dimensional camera module 301 is less than 2cm. For example, the distance between the center of the sensor 40 of the camera module 100 and the center of the two-dimensional camera module 301 may be 1.8cm, 1.3cm, 1cm, 0.8cm, etc., without limitation. Of course, in some embodiments, the distance between the center of the sensor 40 of the time of flight module 100 and the center of the two-dimensional camera module 301 may also be 2cm. Preferably, in some embodiments, the distance between the center of the sensor 40 of the time-of-flight module 100 and the center of the two-dimensional camera module 301 is 1.5cm, so that the field of view of the time-of-flight module 100 can be kept close to the field of view of the two-dimensional camera module 301, and a certain distance between the time-of-flight module 100 and the two-dimensional camera module 301 can be kept, so that the temperature generated by the time-of-flight module 100 in the engineering process is prevented from affecting the normal operation of the two-dimensional camera module 301.

In some embodiments, the temperature of the time-of-flight module 100 is less than a preset temperature when the camera assembly 300 is in operation. Wherein, in some embodiments, the preset temperature may be 60 ℃. That is, the temperature of the time-of-flight module 100 is less than 60 ℃ when the photographing assembly 300 is operated. For example, the temperature of the time-of-flight module 100 may be 55 ℃,50 ℃, 48 ℃, 45 ℃, 42 ℃, 35 ℃, 30 ℃, etc. when the shooting assembly 300 is in operation. Since the temperature of the time of flight module 100 is less than the preset temperature, it is possible to prevent the temperature of the time of flight module 100 from being too high, which affects the normal operation of the elements (e.g., the two-dimensional camera module 301) disposed therearound. Preferably, in some embodiments, the temperature of the time-of-flight module 100 stabilizes around 45 ℃ while the shooting assembly 300 is in operation.

Referring to fig. 20, the embodiment of the application further provides a terminal 1000. Terminal 1000 can include a housing 200 and a camera assembly 300 as described in any of the embodiments above, with camera assembly 300 being coupled to housing 200. It should be noted that, terminal 1000 can be a mobile phone, a computer, a tablet computer, a smart watch, a smart wearable device, etc., and is not limited herein.

The terminal 1000 of the present application is configured such that a distance between a center of the sensor 40 of the time-of-flight module 100 and a center of the two-dimensional camera module 301 is smaller than a second preset distance by setting the photographing assembly 300. This allows the field of view of the time-of-flight module 100 to be similar to the field of view of the two-dimensional camera module 301, thereby facilitating the terminal 1000 to acquire two-dimensional images and depth information images at the same field of view at the same time.

Referring to fig. 1,2 and 21, an assembly method of the time-of-flight module 100 is further provided in an embodiment of the present application. The assembly method comprises the following steps:

011, providing a heat dissipation plate 20, wherein the heat dissipation plate 20 comprises a first region 201 and a second region 202, and combining the first side 11 of the circuit board 10 with the first region 201;

012, arranging the light source 30 in the second region 202 of the heat dissipation plate 20, and mounting the sensor 40 to the circuit board 10, and electrically connecting the light source 30 and the sensor 40 with the circuit board 10;

013, mounting the first optical assembly 60 to the integral bracket 50;

014 that a bracket 50 with a first optical component 60 mounted thereon is mounted on the second side 12 of the circuit board 10, the bracket 50 and the circuit board 10 form a housing cavity 501 such that the sensor 40 and the light source 30 are housed in the housing cavity 501 and the first optical component 60 corresponds to the light source 30, and

015, Mounting the second optical group 70 to the bracket 50 such that the second optical assembly 70 corresponds to the sensor 40.

According to the assembly method of the time-of-flight module 100, the light source 30 is arranged in the second area 202 of the heat dissipation plate 20, and the first area 201 of the heat dissipation plate 20 is combined with the circuit board 10, so that heat generated by the light source 30 can be prevented from being transferred to the circuit board 10, and the situation that the circuit board 10 cannot work normally due to the temperature rise of the circuit board 10 is avoided.

Specifically, first region 201 of heat spreader 20 is first bonded to first side 11 of circuit board 10. The heat sink 20 may be fixed to the first side 11 of the circuit board 10 by gluing. After the sensor 40 is mounted to the circuit board 10 and the light source 30 is mounted to the second region 202 of the heat dissipation plate 20, the light source 30 and the sensor 40 may be electrically connected to the circuit board 10 through a gold wire bonding process. The first optical assembly 60 is mounted to the integral bracket 50, for example, the first optical assembly 60 is mounted in the first mounting hole 531 of the bracket 50.

The bracket 50 with the first optical component 60 mounted thereon is then mounted on the second side 12 of the circuit board 10 provided with the sensor 40 and the light source 30, the bracket 50 and the circuit board 10 form a housing cavity 501, such that the sensor 40 and the light source 30 are housed in the housing cavity 501, and the first optical component 60 corresponds to the light source 30.

For example, in some embodiments, the first optical component 60 mounted on the bracket 50 is aligned with the light source 30 disposed on the heat dissipation plate 20 through an alignment process (ACTIVE ALIGNMENT, AA process), the bracket 50 is fixed on the second side 12 of the circuit board 10 after the alignment is completed, the bracket 50 and the circuit board 10 form a housing cavity 501, so that the sensor 40 and the light source 30 are housed in the housing cavity 501, and the first optical component 60 corresponds to the light source 30. It should be noted that, in some embodiments, the first optical element assembly and the light source 30 are aligned by an alignment process, and the relative positions between the first optical element assembly 60 and the light source 30 are gradually adjusted, so that the first optical element assembly 60 and the light source 30 are gradually disposed close to being opposite to each other. After the relative position between the first optical assembly 60 and the light source 30 is adjusted to meet the alignment precision of the first optical assembly 60 and the light source 30, the bracket 50 is fixed with the circuit board 10, so that the stability of connection is ensured.

After the first optical assembly 60 is mounted, the second optical assembly 70 is mounted to the bracket 50 such that the second optical assembly 70 corresponds to the sensor 40. Illustratively, in some embodiments, the second optical assembly 70 is aligned with the sensor 40 provided on the circuit board 10 by an alignment process, and the second optical assembly 70 is mounted within the second mounting hole 532 of the bracket 50 after the alignment is completed such that the second optical assembly 70 corresponds to the sensor 40.

In some embodiments, the method of assembly further includes mounting a filter 84 within the second mounting hole 532 of the bracket 50 prior to mounting the bracket 50 with the first optical assembly 60 mounted to the second side 12 of the circuit board 10, the filter 84 for filtering light outside of the predetermined wavelength range at step 014. Specifically, in some embodiments, the optical filter 84 may also be mounted in the second mounting hole 532 of the bracket 50 before the bracket 50 with the first optical assembly 60 mounted thereon is mounted on the second side 12 of the circuit board 10, and then the bracket 50 with the first optical assembly 60 and the optical filter 84 mounted thereon is mounted on the second side 12 of the circuit board 10. The filter 84 may be mounted before the first optical component 60 is mounted, or after the first optical component 60 is mounted, which is not limited herein.

Referring to fig. 1,2 and 22, the embodiment of the application further provides a method for assembling the time-of-flight module 100. The assembly method comprises the following steps:

021 providing a heat dissipation plate 20, wherein the heat dissipation plate 20 comprises a first region 201 and a second region 202, and the first side 11 of the circuit board 10 is combined with the first region 201;

022, arranging the light source 30 in the second area 202 of the heat dissipation plate 20, mounting the sensor 40 to the circuit board 10, and electrically connecting the light source 30 and the sensor 40 with the circuit board 10;

023 fixing the integral bracket 50 to the second side 12 of the circuit board 10, wherein the bracket 50 and the circuit board 10 form a receiving cavity 501 such that the sensor 40 and the light source 30 are received in the receiving cavity 501;

024, the first optical assembly 60 and the second optical assembly 70 are fixed on the bracket 50 such that the first optical assembly 60 corresponds to the light source 30 and the second optical assembly 70 corresponds to the sensor 40.

Specifically, first region 201 of heat spreader 20 is first bonded to first side 11 of circuit board 10. The heat sink 20 may be fixed to the first side 11 of the circuit board 10 by gluing. After the sensor 40 is mounted to the circuit board 10, the light source 30 is mounted to the heat dissipation plate 20 and received in the first through hole 13, and then both the light source 30 and the sensor 40 may be electrically connected to the circuit board 10 through a gold wire bonding process. The bracket 50 is then fixedly mounted on the circuit board 10 provided with the sensor 40 and the light source 30, and the bracket 50 and the circuit board 10 form a containing cavity 501, so that the sensor 40 and the light source 30 are contained in the containing cavity 501.

After the bracket 50 is fixedly connected to the circuit board 10 provided with the sensor 40 and the light source 30, the first optical component 60 and the second optical component 70 are fixed to the bracket 50 such that the first optical component 60 corresponds to the light source 30 and the second optical component 70 corresponds to the sensor 40. Specifically, referring to FIG. 23, in some embodiments, step 024 of fixing the first optical component 60 and the second optical component 70 on the bracket 50 comprises:

0241 fixing the first optical component 60 to the bracket 50 after alignment by alignment process to make the first optical component 60 correspond to the light source 30, and

0242 The second optical component 70 is aligned by an alignment process and then fixed to the bracket 50 so that the second optical component 70 corresponds to the sensor 40.

For example, after the bracket 50 is fixedly connected to the circuit board 10 provided with the sensor 40 and the light source 30, the first optical assembly 60 and the light source 30 are aligned by an alignment process, and after the alignment is completed, the first optical assembly 60 is fixed in the first mounting hole 531 of the bracket 50, so as to realize that the first optical assembly 60 corresponds to the light source 30. Then, after the second optical assembly 70 and the sensor 40 are aligned by the alignment process, the second optical assembly 70 is fixed in the second mounting hole 532 of the bracket 50 after the alignment is completed, so as to achieve the correspondence between the second optical assembly 70 and the sensor 40. Since the first optical component 60 and the second optical component 70 are mounted to the bracket 50 after being aligned respectively, the mounting of the first optical component 60 and the second optical component 70 can be completed without providing two jigs on a machine for implementing the alignment process. Of course, in some embodiments, the second optical component 70 may be installed first and then the first optical component 60 may be installed, which is not limited herein.

Referring to fig. 1,2 and 24, in some embodiments, step 024 of fixing the first optical component 60 and the second optical component 70 on the bracket 50 further includes:

0243 the first optical component 60 and the second optical component 70 are aligned by the alignment process and then fixed on the bracket 50, so that the first optical component 60 corresponds to the light source 30 and the second optical component 70 corresponds to the sensor 40.

For example, after the bracket 50 is fixedly connected to the circuit board 10 provided with the sensor 40 and the light source 30, the first optical component 60 and the second optical component 70 are aligned by an alignment process at the same time and then fixed to the bracket 50, so that the first optical component 60 corresponds to the light source 30 and the second optical component 70 corresponds to the sensor 40. Because the first optical component 60 and the second optical component 70 are aligned and mounted at the same time, the success rate of optical path alignment can be improved compared with the case where the non-optical component and the second optical component 70 are aligned and mounted separately.

In the description of the present specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "an exemplary embodiment," "an example," "a particular example," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, unless specifically defined otherwise.

Although embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives and variations may be made to the above embodiments by those skilled in the art within the scope of the application, which is defined by the claims and their equivalents.

Claims

1. The utility model provides a time of flight module, its characterized in that includes integrative support, heating panel, circuit board, light source, sensor and is fixed in first optical subassembly and the second optical subassembly of support, the circuit board has been seted up and has been run through the first side of circuit board reaches the first through-hole of the second side of circuit board, the area of circuit board is less than the area of heating panel, wherein:

the heat dissipation plate comprises a first area and a second area, the first through hole corresponds to the second area, the first side of the circuit board is combined with the first area, the second area comprises a protruding part protruding towards the circuit board, the protruding part penetrates through the first through hole and can be exposed from the second side of the circuit board, the light source is arranged on one side, far away from the circuit board, of the protruding part, and the light source and the sensor are electrically connected with the circuit board;

The bracket is arranged on the second side of the circuit board and forms a containing cavity with the circuit board, wherein the containing cavity can contain the light source and the sensor;

The first optical component is arranged on the bracket and corresponds to the light source and is used for guiding the light rays emitted by the light source to the outside of the flight time module;

The second optical component is arranged on the bracket and corresponds to the sensor and is used for receiving at least part of the light reflected by the object and guiding the light to the sensor.

2. The time of flight module of claim 1, in which the distance between the center of the sensor and the center of the light source is less than a first predetermined distance.

3. The time of flight module of claim 1, wherein the light source has a first electrode terminal on a side proximate to the heat sink and a second electrode terminal on a side distal from the heat sink, the time of flight module further comprising:

a conductive member having one end positioned between the light source and the heat dissipation plate and electrically connected to the first electrode terminal and the other end positioned between the circuit board and the heat dissipation plate and electrically connected to the circuit board, and

And one end of the first lead is electrically connected with the second electrode end, and the other end of the first lead is electrically connected with an electrode positioned on the second side of the circuit board.

4. The time of flight module of claim 1, wherein the light source has a first electrode terminal on a side proximate to the heat sink and a second electrode terminal on a side distal from the heat sink, the time of flight module further comprising:

A conductive member having one end positioned between the light source and the heat dissipation plate and electrically connected to the first electrode terminal and the other end positioned in the second region of the heat dissipation plate and electrically connected to an electrode positioned on the second side of the circuit board via a second lead, and

5. The time-of-flight module of claim 3 or 4, wherein a distance between the second electrode end and the electrode on the second side of the circuit board in a light-emitting direction of the light source is different from a distance between opposite sides of the light source.

6. The time of flight module of claim 1, wherein the sensor is mounted to a second side of the circuit board, or

The heat dissipation plate further comprises a third area, the circuit board is provided with a second through hole penetrating through the first side and the second side, the second through hole corresponds to the third area, and the sensor is arranged in the third area and is accommodated in the second through hole.

7. The time of flight module of claim 1, wherein the bracket comprises a first support, a second support, and a connection assembly connecting the first support and the second support, wherein the first support and the second support are respectively secured to a second side of the circuit board, the connection assembly comprising:

A first mounting hole for mounting the first optical component, and

And a second mounting hole for mounting the second optical assembly.

8. The time of flight module of claim 1, in which the light emitted by the light source forms a planar pattern, the first optical component comprising:

a diffractive optical element provided with an integrated microstructure capable of collimating and replicating the planar pattern to eject a speckle pattern out to the time-of-flight module.

9. The time of flight module of claim 1, in which the second optical component comprises:

a phase type lens for receiving at least part of the light reflected back by the object and adjusting the phase of the light exiting the phase type lens to the sensor.

10. A terminal, comprising:

Housing body

The time of flight module of any one of claims 1-9, the housing being coupled to the time of flight module.

11. A photographic assembly, comprising:

a two-dimensional camera module for acquiring two-dimensional images, and

The time-of-flight module of any of claims 1-9, the time-of-flight module to obtain a depth information image, the distance between the center of the sensor of the time-of-flight module and the center of the two-dimensional camera module being less than a second preset distance.

12. The shooting assembly of claim 11 wherein the temperature of the time-of-flight module is less than a preset temperature when the shooting assembly is in operation.

13. A terminal, comprising:

Housing body

The camera assembly of claim 11 or 12, the housing being coupled to the camera assembly.

14. A method of assembling a time-of-flight module, comprising:

Providing a heat dissipation plate, wherein the heat dissipation plate comprises a first area and a second area, the second area comprises a protruding part protruding towards a circuit board, the protruding part can be exposed from a second side of the circuit board through a first through hole of the circuit board, and the first side of the circuit board is combined with the first area;

A light source is arranged on one side of the protruding part far away from the circuit board, a sensor is arranged on the circuit board, and the light source and the sensor are electrically connected with the circuit board;

Mounting the first optical assembly to the integral bracket;

mounting the bracket with the first optical component mounted on the second side of the circuit board, the bracket and the circuit board forming a receiving cavity so that the sensor and the light source are received in the receiving cavity and the first optical component corresponds to the light source, and

And mounting a second optical assembly to the bracket so that the second optical assembly corresponds to the sensor.

15. A method of assembling a time-of-flight module, comprising:

fixing an integrated bracket on a second side of the circuit board, wherein the bracket and the circuit board form a containing cavity so that the sensor and the light source are contained in the containing cavity;

And fixing the first optical component and the second optical component on the bracket so that the first optical component corresponds to the light source and the second optical component corresponds to the sensor.

16. The method of assembling of claim 15, wherein said securing the first optical component and the second optical component to the bracket comprises:

the first optical component is aligned by an alignment process and then fixed on the bracket so as to correspond to the light source, and

And fixing the second optical assembly on the bracket after aligning the second optical assembly through an alignment process so as to enable the second optical assembly to correspond to the sensor.

17. The method of assembling of claim 15, wherein said securing the first optical component and the second optical component to the bracket comprises:

and simultaneously aligning the first optical component and the second optical component through an alignment process and then fixing the first optical component and the second optical component on the bracket so that the first optical component corresponds to the light source and the second optical component corresponds to the sensor.