CN114700637B - Laser cutting device, equipment and method - Google Patents
Laser cutting device, equipment and method Download PDFInfo
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- CN114700637B CN114700637B CN202210455655.2A CN202210455655A CN114700637B CN 114700637 B CN114700637 B CN 114700637B CN 202210455655 A CN202210455655 A CN 202210455655A CN 114700637 B CN114700637 B CN 114700637B
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 79
- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000005520 cutting process Methods 0.000 claims abstract description 66
- 239000002131 composite material Substances 0.000 claims abstract description 20
- 230000003287 optical effect Effects 0.000 claims description 8
- 238000000605 extraction Methods 0.000 claims 2
- 230000002277 temperature effect Effects 0.000 claims 1
- 238000004383 yellowing Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 description 19
- 230000000875 corresponding effect Effects 0.000 description 14
- 239000010410 layer Substances 0.000 description 11
- 239000011185 multilayer composite material Substances 0.000 description 7
- 230000001276 controlling effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 206010057040 Temperature intolerance Diseases 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000008543 heat sensitivity Effects 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The embodiment of the application discloses a laser cutting device, equipment and a method, wherein the laser cutting device comprises a first light emitting part and a second light emitting part, and the first light emitting part is configured as a laser emitting end; the second light emitting part is configured as a laser emitting end, and a light emitting opening of the second light emitting part is arranged opposite to a light emitting opening of the first light emitting part. According to the embodiment of the application, the first light emitting part and the second light emitting part which are both provided with the laser emitting function are adopted, and then the light emitting port of the second light emitting part and the light emitting port of the first light emitting part are oppositely arranged, so that when a composite material needs to be cut, the composite material is arranged between the light emitting port of the second light emitting part and the light emitting port of the first light emitting part, and the second light emitting part and the first light emitting part are correspondingly adjusted and controlled to execute matched cutting, namely, the corresponding positions of the two opposite sides of the composite material can be cut respectively or simultaneously, and further, the problems of yellowing, blackening, bubbles and the like of the opposite sides of the composite material can be solved when one side of the composite material is cut by single-side laser, so that the yield is improved.
Description
Technical Field
The application relates to the technical field of cutting, in particular to a laser cutting device, equipment and a method.
Background
At present, laser is used for processing various products with high-precision processing requirements, such as steel cutting, plastic cutting, leather cutting, glass cutting and the like, and the cutting process of the single material is finished by adopting main stream single laser beam cutting.
For the multi-layer structure composite material, the materials corresponding to different layers are different, and the material properties corresponding to each layer are generally different, and a certain thermal effect is generated in laser cutting, so that when the traditional single-side cutting laser cutting technology is adopted for cutting, the thermal effect is transmitted to the side opposite to the processing side, thereby causing the adverse conditions of different colors (such as yellowing, blackening, bubbles and the like) of the materials on the opposite side, and influencing the product quality.
Therefore, the yield of the existing laser cutting is still to be improved.
Disclosure of Invention
The embodiment of the application relates to a laser cutting device, equipment and a method, so as to improve the yield of laser cutting.
The embodiment of the application discloses a laser cutting device, which comprises a first light emitting part and a second light emitting part, wherein the first light emitting part is configured as a laser emitting end; the second light emitting part is configured as a laser emitting end, and a light emitting opening of the second light emitting part is arranged opposite to a light emitting opening of the first light emitting part.
Optionally, the laser cutting device further includes a carrying fixture, where the carrying fixture is disposed between the light outlet of the second light outlet portion and the light outlet of the first light outlet portion.
Optionally, the carrying jig is provided with at least one hollowed-out positioning port for placing a product to be cut.
Optionally, the laser cutting device further comprises a laser emitter and a beam splitter, wherein the beam splitter comprises a light inlet end, a first light outlet end and a second light outlet end; the laser emission end of the laser emitter is connected with the light inlet end, the first light outlet part is connected with the first light outlet end, and the second light outlet part is connected with the second light outlet end.
Optionally, the first light emitting part includes a first light reflecting member and a first switch, and the first light reflecting member is respectively connected with the first switch and the first light emitting end in a light path conduction manner; the second reflecting piece is respectively connected with the second switch and the second light-emitting end in a conducting way.
Optionally, the first light emitting part further includes a first galvanometer, and the first galvanometer is connected with the first switch optical path in a conducting manner; the second light emitting part further comprises a second vibrating mirror, and the second vibrating mirror is connected with the second switch light path in a conducting way; the lens of the first vibrating mirror is arranged opposite to the lens of the second vibrating mirror.
Optionally, the first light emitting part further includes a first beam expanding element disposed between the first switch and the first galvanometer, and the second light emitting part further includes a second beam expanding element disposed between the second switch and the second galvanometer; the first beam expanding piece is respectively connected with the first switch and the first vibrating mirror optical path in a conducting way, and the second beam expanding piece is respectively connected with the second switch and the second vibrating mirror optical path in a conducting way.
The embodiment of the application also discloses laser cutting equipment, the laser cutting equipment comprises a control system and the laser cutting device, wherein the laser cutting device is arbitrarily arranged above, the control system is connected with the laser cutting device, machining parameters are recorded in the control system, and the control system controls the laser cutting device to correspondingly execute according to the machining parameters.
The embodiment of the application also discloses a laser cutting method, which is applied to the laser cutting device and the laser cutting equipment, and comprises the following steps:
controlling the first light emergent part to work independently;
controlling the second light emitting part to work independently;
the first light emergent part and the second light emergent part are controlled to work simultaneously.
Optionally, the laser cutting method further includes the steps of:
formulating a first parameter for the first light-emitting portion to execute alone;
formulating a second parameter for individual execution by the second light-emitting section;
a third parameter is formulated for simultaneous execution of the first light exit portion and the second light exit portion. .
Optionally, the first parameter and the second parameter respectively include:
the processing speed is 3000-8000 mm/s;
the laser frequency is 500-1000 KHz;
cutting lines are filled with the space of 0.005-0.02 mm;
laser power, 3-5W.
Optionally, the third parameter includes:
the processing speed is 3000-5000 mm/s;
the laser frequency is 500-1000 KHz;
cutting lines are filled with the space of 0.005-0.02 mm;
laser power, 3-5W.
Optionally, the number of the cutting lines is at least one, and each cutting line is designed in a head-to-tail closed manner.
Because this embodiment has adopted all to possess first light-emitting part and the second light-emitting part that jets out the laser function, then make the light-emitting opening of second light-emitting part and the light-emitting opening of first light-emitting part set up relatively, like this, when needs cutting combined material, only need set up this combined material between the light-emitting opening of second light-emitting part and the light-emitting opening of first light-emitting part, carry out the cooperation cutting through corresponding regulation control second light-emitting part and first light-emitting part, the corresponding position of the relative both sides of combined material can be cut respectively or simultaneously, and then when can solve unilateral laser cutting combined material one side, its opposite side produces the problem of the ill-condition such as yellowing, blackening, bubble because of the laser cutting thermal action, thereby cut the yields has been promoted, moreover, cutting speed and cutting efficiency have been promoted.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive faculty for a person skilled in the art. In the drawings:
fig. 1 is a schematic structural view of a laser cutting device disclosed in an embodiment of the present application;
FIG. 2 is a block diagram of a laser cutting apparatus according to an embodiment of the present disclosure;
FIG. 3 is a schematic diagram of a laser cutting process according to an embodiment of the present disclosure;
FIG. 4 is a schematic flow chart of formulating parameters according to an embodiment of the present application;
FIG. 5 is a schematic view of a conventional cut line arrangement;
FIG. 6 is a schematic structural view of a cutting line arrangement disclosed in an embodiment of the present application;
FIG. 7 is a view of a cut edge obtained by a conventional single-sided laser cutting process;
FIG. 8 is a view of a cut edge from the contralateral laser cutting process disclosed in the examples of this application;
FIG. 9 is a cut surface view obtained by a conventional single-sided laser cutting transparent multilayer composite material process;
fig. 10 is a cut surface view of a transparent multilayer composite material cut by an opposite side laser process as disclosed in the examples of this application.
10, a laser cutting device; 11. a laser cutting device; 12. a control system; 13. a first light emitting unit; 14. a second light emitting unit; 15. a carrying jig; 16. a positioning port; 17. a laser emitter; 18. a beam splitter; 19. a light inlet end; 20. a first light emitting end; 21. the second light emitting end; 22. a first light reflecting member; 23. a first switch; 24. a second switch; 25. a first galvanometer; 26. a second galvanometer; 27. cutting lines; 28. a first beam expander; 29. a second beam expander; 30. and a second light reflecting member.
Detailed Description
It should be understood that the terminology, specific structural and functional details disclosed herein are merely representative for purposes of describing particular embodiments, but that the embodiments of the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the embodiments of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or implicitly indicating the number of technical features indicated. Thus, unless otherwise indicated, features defining "first", "second" may include one or more such features either explicitly or implicitly; the meaning of "plurality" is two or more. The terms "comprises," "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or groups thereof may be present or added.
In addition, terms of orientation or positional relationship indicated by "vertical", "horizontal", etc. are described based on the orientation or relative positional relationship shown in the drawings, and are merely for convenience of description of the embodiments of the present application, and are not intended to indicate that the apparatus or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present application.
Furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.
The present application is described in detail below with reference to the attached drawings and alternative embodiments.
As shown in fig. 1, an embodiment of the present application discloses a laser cutting device 11, where the laser cutting device 11 includes a first light emitting portion 13 and a second light emitting portion 14, and the first light emitting portion 13 is configured as a laser emitting end; the second light emitting portion 14 is configured as a laser emitting end, and a light emitting opening of the second light emitting portion 14 is disposed opposite to a light emitting opening of the first light emitting portion 13.
Because this embodiment has adopted all to possess first light-emitting part 13 and the second light-emitting part 14 that send out laser function, then make the light-emitting opening of second light-emitting part 14 and the light-emitting opening of first light-emitting part 13 set up relatively, like this, when needs cutting combined material, only need set up this combined material between the light-emitting opening of second light-emitting part 14 and the light-emitting opening of first light-emitting part 13, carry out the cooperation cutting through corresponding regulation control second light-emitting part 14 and first light-emitting part 13, namely the corresponding position of the relative both sides of combined material can be cut respectively or simultaneously, and then when can solve laser cutting combined material one side, the problem of the relative side production such as yellowing, blackening, bubble, thereby cut yields has been promoted, moreover, cutting speed and cutting efficiency have been promoted. Of course, the embodiment of the application can be used for cutting and processing the composite material with the multi-layer structure and processing the material with the single-layer structure.
The laser cutting device 11 disclosed in the embodiment of the present application further includes a carrying fixture 15, where the carrying fixture 15 is disposed between the light outlet of the second light outlet portion 14 and the light outlet of the first light outlet portion 13. The carrying jig 15 for placing the product to be cut is arranged between the light outlet of the second light outlet portion 14 and the light outlet of the first light outlet portion 13, so that the product can be conveniently cut by the laser emitted by the first light outlet portion 13 and the second light outlet portion 14.
Wherein, the carrying jig 15 is provided with at least one hollowed-out positioning opening 16 for placing the product to be cut. The hollowed-out positioning port 16 can be used for positioning products, preventing waste products caused by movement in processing, and also can be used for double-sided processing of the first light-emitting part 13 and the second light-emitting part 14. Of course, the positioning and fixing manner of the positioning opening 16 in the embodiment of the present application may be mechanical clamping, pneumatic adsorption, or other manners, which are not limited specifically, and should be considered as falling within the protection scope of the present application.
The laser cutting device 11 disclosed in the embodiment of the present application further includes a laser emitter 17 and a beam splitter 18, where the beam splitter 18 includes an light-in end 19, a first light-out end 20, and a second light-out end 21; the laser emitting end of the laser emitter 17 is connected to the light inlet end 19, the first light outlet portion 13 is connected to the first light outlet end 20, and the second light outlet portion 14 is connected to the second light outlet end 21. According to the embodiment of the application, the laser transmitter 17 is matched with the beam splitter 18 to finish the transmission of multiple lasers, so that the occupied space is reduced, the cost is saved, and the cutting processing requirement is met. Of course, in the embodiment of the present application, a plurality of laser transmitters 17 may be used to correspondingly transmit a plurality of lasers, which is not limited in particular, as long as the corresponding laser requirements can be met, and all the laser transmitters should be considered as falling within the protection scope of the present application.
Further, in order to control each laser conveniently, the first light emitting portion 13 disclosed in the embodiment of the present application includes a first light reflecting member 22 and a first switch 23, where the first light reflecting member 22 is respectively connected to the first switch 23 and the first light emitting end 20 in a light path conduction manner; the second reflecting member 30 is respectively connected with the second switch 24 and the second light emitting end 21 in a light path conducting manner. The light path of each laser is adjusted through the corresponding reflecting piece, and then the on or off of the laser is controlled through the corresponding switch, so that each laser is controllable, and the cutting is convenient. The positions of the first switch 23 and the second switch 24 and the corresponding first reflecting member 22 and the corresponding second reflecting member 30 in the embodiment of the present application are not limited, and the first switch 23 and the second switch 24 may be optical shutters, or may be other designs for conducting controllable light paths, and the first reflecting member 22 and the second reflecting member 30 may be optical foldback mirrors, or may be other designs for guiding light paths, so long as the corresponding effects can be satisfied, and all the designs should be regarded as belonging to the protection scope of the present application.
The first light emitting portion 13 disclosed in the embodiment of the present application may further include a first galvanometer 25, where the first galvanometer 25 is connected to the first switch 23 in a light path conduction manner; the second light-emitting portion 14 may further include a second galvanometer 26, where the second galvanometer 26 is connected to the second switch 24 in a light path conducting manner; the lens of the first galvanometer 25 is disposed opposite to the lens of the second galvanometer 26. The adoption of the vibrating mirror (also called as a laser vibrating mirror) can realize accurate cutting control, and can effectively improve the laser cutting yield.
The first light-emitting portion 13 of the embodiment of the present application may further include a first beam expander 28 disposed between the first switch 23 and the first galvanometer 25, and the second light-emitting portion 14 may further include a second beam expander 29 disposed between the second switch 24 and the second galvanometer 26; the first beam expander 28 is respectively connected with the first switch 23 and the first galvanometer 25 in a light path conduction manner, and the second beam expander 29 is respectively connected with the second switch 24 and the second galvanometer 26 in a light path conduction manner. The first beam expander 28 and the second beam expander 29 are arranged to facilitate the adjustment and control of the laser beam diameter and the laser divergence angle. Of course, the first beam expander 28 and the second beam expander 29 may be beam expanders, or may be other designs meeting the requirements, which should not be limited, and should be regarded as falling within the scope of the present application.
As shown in fig. 2, the embodiment of the application further discloses a laser cutting device 10, where the laser cutting device 10 includes a control system 12 and the laser cutting device 11 as described above, the control system 12 is connected with the laser cutting device 11, machining parameters are recorded in the control system 12, and the control system 12 controls the laser cutting device 11 to correspondingly execute according to the machining parameters. The control system 12 in the embodiment of the present application may include a PLC system, and controls the relevant controllable components in the laser cutting device 11 by entering corresponding control programs to automatically complete the laser cutting operation. Of course, the laser cutting device 10 of the embodiment of the present application may further include a mechanical arm to complete the feeding and discharging operation.
As shown in fig. 3, the embodiment of the application also discloses a laser cutting method, which is applied to the laser cutting device and the laser cutting equipment, and comprises the following steps:
s1, controlling the first light emitting part to work independently;
s2, controlling the second light emitting part to work independently; and
s3, controlling the first light emergent part and the second light emergent part to work simultaneously.
In this embodiment, when the composite material with the multilayer structure needs to be cut by laser, firstly, a side surface of the composite material is cut by one end depth, then the opposite side of the composite material is cut by one end, and finally, two sides of the composite material are cut synchronously, of course, the cutting positions are communicated along a straight line, thus, after the first single cutting, the opposite side of the composite material can generate slight color change due to heat conduction, the second single cutting can cut the slight color change region, and then the third single cutting is continuous and simultaneous laser cutting is performed on the opposite sides of the composite material until the two sides are opened, so that the occurrence of the defects such as yellowing, blackening, bubbles and the like can be effectively prevented, the problem that the two-way cutting cannot be cut through during the one-way cutting can be solved, and the cutting efficiency and the yield are increased.
However, the step S1 and the step S2 should be performed after the step S1 and the step S2, because if the two-way simultaneous cutting is adopted when the cutting is started, the generated higher temperature may cause serious adverse conditions in the composite material, which may lead to irreparable repair.
As shown in fig. 4, each laser is controlled by the control system to automatically emit, so the laser cutting method disclosed in the embodiment of the application further includes the steps of:
s4, formulating a first parameter which is independently executed by the first light emitting part;
s5, formulating a second parameter which is independently executed by the second light emitting part;
s6, formulating a third parameter for simultaneously executing the first light emitting part and the second light emitting part.
Since the action is performed after the parameter is formulated, the step S4 in the embodiment of the present application is performed before the step S1, the step S5 is performed before the step S2, and the step S6 is performed before the step S3, and, of course, if all the parameters are formulated before the first cutting, the execution sequence of steps S4, S5, and S6 is not limited.
Specifically, the first parameter, the second parameter, and the third parameter disclosed in the embodiments of the present application include a processing speed, a laser frequency, a cutting line filling pitch, and a laser power, respectively.
The processing speed of the first parameter and the second parameter is set in a range of 3000-8000 mm/s, the laser frequency is set in a range of 500-1000 KHz, the filling pitch L of the cutting lines is set in a range of 0.005-0.02 mm, and the laser power is set in a range of 3-5W.
And the processing speed of the third parameter is set in the range of 3000-5000 mm/s, the laser frequency is set in the range of 500-1000 KHz, the filling pitch L of the cutting lines is set in the range of 0.005-0.02 mm, and the laser power is set in the range of 3-5W.
Since the influence of the temperature generated by the laser is large in the steps S1 and S2, the processing speed range is large, and the heat dissipation speed can be conveniently adjusted, while the influence of the temperature generated by the laser is small in the step S3, so the processing speed range is set small. The specific implementation parameters, which are different depending on the material and the corresponding thickness, are not specifically mentioned herein and should be considered as falling within the scope of the present application.
As shown in fig. 5 and fig. 6, at least one cutting line 27 in the cutting line filling space is provided, each cutting line 27 is in a head-to-tail closed design, the cutting lines 27 disclosed in the embodiment of the present application are greater than or equal to two cutting lines 27, and the space between two adjacent cutting lines 27 is the cutting line 27 filling space. The conventional cutting line 27 is designed as a line segment as shown in fig. 5, so that when the product is cut, the edge opening of the product is dense and the edge is easily broken. Therefore, the dicing line 27 employed in the embodiment of the present application is designed as shown in fig. 6, and the edge breakage phenomenon during dicing can be prevented by setting the filling pitch L in the range of 0.005-0.02 mm.
As shown in fig. 7, a cut edge map obtained by using a conventional single-sided laser cutting process is shown.
As shown in fig. 8, a cut edge diagram obtained by using the opposite side laser cutting process disclosed in the embodiment of the present application is shown.
As can be clearly seen by comparing the broken line frames of fig. 7 and 8, the different color range of the cutting edge obtained by the conventional single-side laser cutting process is obvious and large. The cutting edge obtained by the opposite-side laser cutting process disclosed by the embodiment of the application is basically free of heterochromatic color, the process progress is obvious, and the yield is greatly improved.
More specifically, the laser cutting technology disclosed in the embodiments of the present application may also be used to cut a transparent multilayer composite material, as shown in fig. 9, which is a cut surface diagram obtained by using a conventional single-side laser cutting process for transparent multilayer composite materials.
FIG. 10 is a view of a cut surface obtained by the process of cutting a transparent multilayer composite material with a contralateral laser as disclosed in the examples of the present application.
The light absorption characteristics of each layer of material in the transparent multi-layer structure composite material are generally different, the heat sensitivity of each material layer is strong, the problems of blackening and yellowing of the inner bottom layer and the back surface of the cut transparent multi-layer structure composite material cannot be effectively avoided by traditional single laser beam processing, even the multilayer material cannot be completely cut through by using lower power, and the problem of blackening and dust caused by burning and the layer blurring of the cut surface of the transparent multi-layer composite material obtained by adopting the traditional single-side laser cutting process can be clearly seen by comparing the broken line frames of fig. 9 and 10. The transparent multilayer composite material obtained by the contralateral laser cutting process disclosed by the embodiment of the application has smooth cutting surface, clear material layers and obvious process progress, and greatly improves the cutting quality.
The same laser emitter 17 is correspondingly adopted in fig. 7 and 8, the same laser emitter 17 is correspondingly adopted in fig. 9 and 10, and picosecond lasers, particularly ultraviolet picosecond lasers, are adopted in the laser emitter 17, so that high-precision cutting can be realized, and meanwhile, heat is not generated or is generated relatively low, and the influence of heat on cutting is weakened. According to the embodiment of the application, the picosecond laser and the laser cutting technology are combined, accurate, rapid and high-quality cutting can be achieved, and the problem that untoward conditions such as abnormal colors (such as yellowing and blackening) and bubbles are generated at unprocessed parts of materials caused by the traditional single-side laser cutting technology is solved.
Of course, other types of lasers may be used for the laser transmitter 17 in the embodiments of the present application, and then the cutting quality may be improved by combining the above-mentioned cutting techniques.
The foregoing is a further detailed description of the present application in connection with specific alternative embodiments, and it is not intended that the practice of the present application be limited to such descriptions. It should be understood that those skilled in the art to which the present application pertains may make several simple deductions or substitutions without departing from the spirit of the present application, and all such deductions or substitutions should be considered to be within the scope of the present application.
Claims (11)
1. A laser cutting method applied to a laser cutting apparatus for cutting a composite material of a multilayer structure, the laser cutting apparatus comprising:
a first light emitting section configured as a laser light emitting end; and
the second light emitting part is configured as a laser emitting end, and a light emitting opening of the second light emitting part is arranged opposite to a light emitting opening of the first light emitting part; it is characterized in that the method comprises the steps of,
the laser cutting method comprises the following steps:
controlling the first light emitting part to work independently, and cutting one side surface of the composite material of the multilayer structure to a preset depth independently;
controlling the second light-emitting part to work independently, and cutting the opposite side of the composite material of the multilayer structure independently to cut off a color-changing area generated by the high temperature effect of the opposite side when the first light-emitting part works independently;
and controlling the first light emergent part and the second light emergent part to work simultaneously so as to cut through the composite material of the multilayer structure.
2. The laser cutting method as defined in claim 1, wherein the laser cutting method further comprises the steps of:
formulating a first parameter for the first light-emitting portion to execute alone;
formulating a second parameter for individual execution by the second light-emitting section;
a third parameter is formulated for simultaneous execution of the first light exit portion and the second light exit portion.
3. The laser cutting method of claim 2, wherein the first parameter and the second parameter each include:
the processing speed is 3000-8000 mm/s;
the laser frequency is 500-1000 KHz;
cutting lines are filled with the space of 0.005-0.02 mm;
laser power, 3-5W.
4. The laser cutting method of claim 2, wherein the third parameter comprises:
the processing speed is 3000-5000 mm/s;
the laser frequency is 500-1000 KHz;
cutting lines are filled with the space of 0.005-0.02 mm;
laser power, 3-5W.
5. The laser cutting method of claim 3 or 4, wherein at least one cutting line is provided, and each cutting line is of a closed end-to-end design.
6. The laser cutting method of claim 1, wherein the laser cutting device further comprises a carrier jig, and the carrier jig is disposed between the light outlet of the second light outlet and the light outlet of the first light outlet.
7. The laser cutting method of claim 6, wherein the carrier fixture is provided with at least one hollowed-out positioning opening for placing a product to be cut.
8. The laser cutting method of claim 1, wherein the laser cutting device further comprises a laser transmitter and a beam splitter, the beam splitter comprising an light-in end, a first light-out end, and a second light-out end;
the laser emission end of the laser emitter is connected with the light inlet end, the first light outlet part is connected with the first light outlet end, and the second light outlet part is connected with the second light outlet end.
9. The laser cutting method of claim 8, wherein the first light-emitting portion includes a first light-reflecting member and a first switch, and the first light-reflecting member is respectively connected with the first switch and the first light-emitting end in a light path conduction manner;
the second light emitting part comprises a second light reflecting piece and a second switch, and the second light reflecting piece is respectively connected with the second switch and the second light emitting end in a light path conduction mode.
10. The laser cutting method of claim 9, wherein the first light-emitting portion further comprises a first galvanometer, and the first galvanometer is in conductive connection with the first switching optical path;
the second light emitting part further comprises a second vibrating mirror, and the second vibrating mirror is connected with the second switch light path in a conducting way;
the lens of the first vibrating mirror is arranged opposite to the lens of the second vibrating mirror.
11. The laser cutting method of claim 10, wherein the first light extraction section further comprises a first beam expander disposed between the first switch and the first galvanometer, and the second light extraction section further comprises a second beam expander disposed between the second switch and the second galvanometer;
the first beam expanding piece is respectively connected with the first switch and the first vibrating mirror optical path in a conducting way, and the second beam expanding piece is respectively connected with the second switch and the second vibrating mirror optical path in a conducting way.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103008887A (en) * | 2012-06-29 | 2013-04-03 | 苏州德龙激光有限公司 | Method and device for cutting machined target from two surfaces by using ultra-short pulse laser |
| CN104014936A (en) * | 2013-02-28 | 2014-09-03 | 深圳市大族激光科技股份有限公司 | Laser processing method and laser cutting systems of high molecular workpieces |
| RU2634338C1 (en) * | 2016-05-23 | 2017-10-25 | Лев Семенович Гликин | Method and device for laser cutting of materials |
| WO2019119853A1 (en) * | 2017-12-20 | 2019-06-27 | 广东工业大学 | Laser impact forging and laser cutting combined additive manufacturing device and method |
| WO2020239133A1 (en) * | 2019-05-31 | 2020-12-03 | 大族激光科技产业集团股份有限公司 | Laser cutting device and laser cutting method |
-
2022
- 2022-04-28 CN CN202210455655.2A patent/CN114700637B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103008887A (en) * | 2012-06-29 | 2013-04-03 | 苏州德龙激光有限公司 | Method and device for cutting machined target from two surfaces by using ultra-short pulse laser |
| CN104014936A (en) * | 2013-02-28 | 2014-09-03 | 深圳市大族激光科技股份有限公司 | Laser processing method and laser cutting systems of high molecular workpieces |
| RU2634338C1 (en) * | 2016-05-23 | 2017-10-25 | Лев Семенович Гликин | Method and device for laser cutting of materials |
| WO2019119853A1 (en) * | 2017-12-20 | 2019-06-27 | 广东工业大学 | Laser impact forging and laser cutting combined additive manufacturing device and method |
| WO2020239133A1 (en) * | 2019-05-31 | 2020-12-03 | 大族激光科技产业集团股份有限公司 | Laser cutting device and laser cutting method |
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