CN114686154A - Heat-to-phase change damping potting adhesive and preparation method thereof - Google Patents
Heat-to-phase change damping potting adhesive and preparation method thereof Download PDFInfo
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- CN114686154A CN114686154A CN202210193683.1A CN202210193683A CN114686154A CN 114686154 A CN114686154 A CN 114686154A CN 202210193683 A CN202210193683 A CN 202210193683A CN 114686154 A CN114686154 A CN 114686154A
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- phase change
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4266—Polycondensates having carboxylic or carbonic ester groups in the main chain prepared from hydroxycarboxylic acids and/or lactones
- C08G18/4269—Lactones
- C08G18/4277—Caprolactone and/or substituted caprolactone
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/73—Polyisocyanates or polyisothiocyanates acyclic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Polyurethanes Or Polyureas (AREA)
Abstract
The invention relates to the field of C09J175/04, in particular to a thermal-to-phase-change damping potting adhesive and a preparation method thereof, wherein a polyurethane prepolymer component A30-100 parts and a curing agent component B10-100 parts are adopted, a polyurethane elastomer with high crystallinity and excellent damping performance at room temperature is prepared by controlling the hardness-hardness section proportion of polyurethane and the pre-polymerization degree of the prepolymer, solid-solid phase change occurs firstly when the polyurethane elastomer is heated, and solid-liquid phase change occurs when the temperature is further increased, so that a large amount of heat is absorbed in the phase change process, the temperature is controlled, the polyurethane elastomer can be used in damping, vibration reduction, high-temperature combustion, impact resistance and other environments, electronic components and the like in the impact environment are protected from being damaged, and the polyurethane elastomer has high practical application value and market application potential.
Description
Technical Field
The invention relates to the field of C09J175/04, in particular to a heat-to-phase change damping potting adhesive and a preparation method thereof.
Background
In the field of electronic potting, the potting adhesive mainly comprises polyurethane potting adhesive, organic silicon potting adhesive and epoxy resin potting adhesive, and different use environments have different requirements on the performance and safety of the potting adhesive, so that the types of the potting adhesive are different, and the raw materials of the potting adhesive, the use amount of each raw material and the selection of corresponding preparation processes are different.
Chinese patent CN103396655B discloses a potting adhesive for a magnetorheological damper and a preparation and use method thereof, the epoxy powder potting adhesive is prepared according to the strength, heat resistance and operability of the epoxy potting adhesive, the provided epoxy potting adhesive has low viscosity and longer operation time, but has weak cold and heat change resistance, and is easy to generate cracks after being impacted by cold and heat, so that water vapor permeates into electronic components from the cracks, and the moisture resistance is poor. And after curing, the colloid has high hardness and is brittle, electronic components are easy to be damaged by pulling, and the colloid cannot be opened after encapsulation, so that the repairability is poor. The polyurethane potting adhesive is mostly soft and elastic after being cured and can be repaired, Chinese patent CN102102006B discloses a preparation method of a two-component polyurethane potting adhesive and a product thereof, the A component is polyether polyol, a defoaming agent, oligomer polyol, a catalyst, a plasticizer and a flame retardant, the B component is polyether polyol, isocyanate, an antioxidant, a plasticizer and a catalyst to prepare the two-component polyurethane potting adhesive, the viscosity of the potting adhesive is small, the curing is carried out at normal temperature, the curing speed and the curing time can be regulated and controlled, but the temperature cannot be effectively controlled, and multiple raw materials are adopted to be not beneficial to the stability of an adhesive system, bubbles are more generated after the potting, the surface of the cured colloid is not smooth, and the service life of the potting adhesive is greatly shortened.
Therefore, the thermal-to-phase-change damping potting adhesive is prepared by controlling the hardness-hardness section proportion of polyurethane and the prepolymerization degree of prepolymer, a polyurethane elastomer with higher crystallinity and excellent damping performance at room temperature is prepared, solid-solid phase change occurs firstly when the polyurethane elastomer is heated, solid-liquid phase change occurs when the temperature is further raised, and a large amount of heat is absorbed in the phase change process, so that the aim of controlling the temperature is fulfilled.
Disclosure of Invention
The invention provides a heat-to-phase change damping potting adhesive which comprises the following raw materials in parts by weight: the polyurethane prepolymer comprises a polyurethane prepolymer component A30-100 parts and a curing agent component B10-100 parts.
The polyurethane pouring sealant presents completely different performance differences due to different raw materials, the consumption of the raw materials and corresponding preparation processes, and in order to enable the provided pouring sealant adhesive to meet the requirements of practical use environments such as damping, vibration reduction, high-temperature combustion and impact resistance and to protect electronic components and the like under the impact environment from being damaged, a large number of creative tests prove that when the mass ratio of the polyurethane prepolymer component A to the curing agent component B in the system is (30-100): (35-100), the provided pouring sealant adhesive has excellent damping performance, bonding strength and mechanical property, effectively realizes temperature control from heat to phase change, is applied to effective filling and sealing in damping, vibration damping and impact resistant use environments, and effectively protects sensitive circuits or electronic components for a long time.
As a preferred technical scheme, the polyurethane prepolymer component A at least comprises diisocyanate; as a preferred technical scheme, the component A of the polyurethane prepolymer also comprises polyester glycol and an organic tin catalyst; as a preferred technical scheme, the curing agent component B at least comprises polyalcohol and organic tin catalyst;
as a preferred technical scheme, diisocyanate in the polyurethane prepolymer component A is diphenylmethane-4, 4' -diisocyanate or hexamethylene diisocyanate with a symmetrical structure;
as a preferable technical scheme, the polyester diol in the polyurethane prepolymer component A is polycaprolactone diol, the number average molecular weight of the polycaprolactone diol is 500-3000, and the molecular distribution coefficient is 1.2-1.5; preferably, the number average molecular weight of the polycaprolactone diol is 1000;
as a preferred technical scheme, the organic tin catalyst in the polyurethane prepolymer component a is at least one selected from dibutyltin dilaurate, dibutyltin oxide and stannous octoate; preferably, the organic tin catalyst in the polyurethane prepolymer component A is stannous octoate or dibutyl tin oxide;
as a preferable technical solution, the polyol in the curing agent component B is at least one of polycaprolactone diol, castor oil, polyether polyol N210, polyether polyol N303, and 1, 4-butanediol; preferably, the polyol in the curing agent component B is polyether polyol N303 or polycaprolactone diol;
as a preferable technical scheme, the organic tin catalyst in the curing agent component B is at least one selected from dibutyltin dilaurate, dibutyltin oxide and stannous octoate; preferably, the organotin catalyst in the curing agent component B is dibutyltin dilaurate or stannous octoate;
the invention also provides a preparation method of the heat-to-phase-change damping potting adhesive, which at least comprises the following steps:
and adding the curing agent component B into the polyurethane prepolymer component A, defoaming in vacuum for 5-10min, reacting at room temperature for 1-5h, and curing at 60-100 ℃ for 2-10h to obtain the thermal-to-phase change damping potting adhesive for pouring and potting.
As a preferred technical scheme, the preparation method of the heat-to-phase change damping potting adhesive specifically comprises the following steps:
(1) dehydrating polyol: adding polyalcohol into a three-mouth bottle with stirring, starting stirring, controlling the stirring speed to be 40-60 r/min, heating, starting vacuumizing and dehydrating when the temperature rises to 90 ℃, keeping the temperature at 100 ℃ and 140 ℃, keeping the vacuum degree below-0.098 MPa, dehydrating for 3-4h, and keeping the vacuum temperature to be below 33 ℃ after the dehydration is finished for later use;
(2) synthesizing a polyurethane prepolymer component A: preheating diisocyanate to 30-40 ℃, adding dehydrated and cooled polyester diol and organic tin catalyst into a three-neck flask with a stirrer, controlling the stirring speed to be 40-60 r/m, and carrying out moisture-proof reaction at 60-100 ℃ for 2-5h to obtain a polyurethane prepolymer component A for later use;
(3) preparing a curing agent component B: mixing the dehydrated polyhydric alcohol and an organic tin catalyst to obtain a curing agent component B;
(4) and (3) curing: and adding the curing agent component B into the polyurethane prepolymer component A, defoaming in vacuum for 5-10min, reacting at room temperature for 1-5h, and curing at 60-100 ℃ for 2-10h to obtain the thermal-to-phase change damping potting adhesive for pouring and potting.
As a preferable technical scheme, the mass ratio of the polyurethane prepolymer component A to the curing agent component B is (30-45): (80-100), the polyurethane prepolymer component A is diisocyanate, the curing agent component B comprises polyol and organic tin catalyst, and the mass ratio of the polyol to the organic tin catalyst in the curing agent component B is 100: (0.1-0.001);
as a preferable technical scheme, the mass ratio of the polyurethane prepolymer component A to the curing agent component B is 100: (40-60), wherein the polyurethane prepolymer component A comprises diisocyanate, polyester diol and an organic tin catalyst, and the mass ratio of the diisocyanate, the polyester diol and the organic tin catalyst in the polyurethane prepolymer component A is (60-90): (80-100): 0.005; the curing agent component B comprises polyalcohol and an organic tin catalyst, wherein the mass ratio of the polyalcohol to the organic tin catalyst in the curing agent component B is 100: 0.001;
the invention takes polycaprolactone diol with the number average molecular weight of 500-3000 and the molecular distribution coefficient of 1.2-1.5 and diphenylmethane-4, 4' -diisocyanate or hexamethylene diisocyanate with a symmetrical structure as raw materials, and controls the hardness-hardness segment proportion of polyurethane and the pre-polymerization degree of prepolymer to ensure that the provided phase change damping potting adhesive has higher crystallinity at room temperature, and simultaneously has the damping coefficient of more than or equal to 0.3 at 25-50 ℃, thus being applicable to the environments of damping, vibration reduction, high-temperature combustion, shock resistance and the like.
The heat-to-phase change damping potting adhesive provided by the invention firstly undergoes solid-solid phase change when being heated, and undergoes solid-liquid phase change when the temperature is further increased, so that a large amount of heat is absorbed in the phase change process, and the temperature is controlled.
Based on the specific formula of the system, the polyol is dehydrated and then reacts with the diisocyanate, and vacuum defoaming is performed during reaction, so that the diisocyanate and the polyol in the system are fully and completely reacted, the provided heat-to-phase change damping potting adhesive has excellent tensile strength, elongation at break and bonding tensile shear strength, a large amount of bubbles are avoided after potting, the surface of a cured colloid is smooth, and the service life of the potting adhesive is prolonged.
Has the advantages that:
1. the invention controls the mass ratio of the polyurethane prepolymer component A to the curing agent component B to be (30-100): (35-100), the provided pouring sealant adhesive has excellent damping performance, bonding strength and mechanical property, effectively realizes temperature control from heat to phase change, is applied to effective pouring and sealing under damping, vibration reduction and impact resistance use environments, and effectively protects sensitive circuits or electronic components for a long time.
2. The invention uses polycaprolactone diol with the number average molecular weight of 500-3000 and the molecular weight distribution coefficient of 1.2-1.5 and diphenylmethane-4, 4' -diisocyanate or hexamethylene diisocyanate with a symmetrical structure as raw materials, and controls the hardness-hardness section proportion of polyurethane and the pre-polymerization degree of prepolymer to ensure that the provided phase change damping potting adhesive has higher crystallinity at room temperature, and simultaneously the damping coefficient is more than or equal to 0.3 at 25-50 ℃, thus the invention can be used in the environments of damping, vibration reduction, high-temperature combustion, shock resistance and the like.
3. The thermal-to-phase change damping potting adhesive provided by the invention firstly undergoes solid-solid phase change when being heated, and undergoes solid-liquid phase change when the temperature is further increased, so that a large amount of heat is absorbed in the phase change process, thereby achieving the purpose of controlling the temperature, being used in the environments of damping, vibration reduction, high-temperature combustion, impact resistance and the like, and protecting electronic components and the like under the impact environment from being damaged, and having high practical application value and market application potential.
4. Based on the specific formula of the system, the polyol is dehydrated and then reacts with the diisocyanate, and vacuum defoaming is performed during reaction, so that the diisocyanate and the polyol in the system are fully and completely reacted, the provided heat-to-phase change damping potting adhesive has excellent tensile strength, elongation at break and bonding tensile shear strength, a large amount of bubbles are avoided after potting, the surface of a cured colloid is smooth, and the service life of the potting adhesive is prolonged.
Detailed Description
Example 1
The embodiment 1 of the invention provides a heat-to-phase change damping potting adhesive, which comprises the following raw materials in parts by weight: a polyurethane prepolymer component A45 parts and a curing agent component B80 parts.
The mass ratio of the polyurethane prepolymer component A to the curing agent component B is 45: 80, the polyurethane prepolymer component A is diisocyanate, the curing agent component B comprises polyol and organic tin catalyst, and the mass ratio of the polyol to the organic tin catalyst in the curing agent component B is 100: 0.08;
diisocyanate in the polyurethane prepolymer component A is diphenylmethane-4, 4' -diisocyanate with a symmetrical structure; the diphenylmethane-4, 4' -diisocyanate was liquefied MDI, purchased from Nicotiana Vanhua chemical group, Inc.
The organic tin catalyst in the polyurethane prepolymer component A is dibutyltin oxide;
the polyol in the curing agent component B is polycaprolactone diol, and the number average molecular weight of the polycaprolactone diol is 1000;
the organotin catalyst in the curing agent component B is stannous octoate;
example 2
The embodiment 2 of the invention provides a heat-to-phase change damping potting adhesive, which comprises the following preparation raw materials in parts by weight: 100 parts of polyurethane prepolymer component A and 60 parts of curing agent component B.
The mass ratio of the polyurethane prepolymer component A to the curing agent component B is 100: 60, the polyurethane prepolymer component A comprises diisocyanate, polyester diol and an organic tin catalyst, and the mass ratio of the diisocyanate to the polyester diol to the organic tin catalyst in the polyurethane prepolymer component A is 80: 100: 0.005; the curing agent component B comprises polyalcohol and an organic tin catalyst, wherein the mass ratio of the polyalcohol to the organic tin catalyst in the curing agent component B is 100: 0.001;
diisocyanate in the polyurethane prepolymer component A is diphenylmethane-4, 4' -diisocyanate with a symmetrical structure; the diphenylmethane-4, 4' -diisocyanate was a liquefied MDI, purchased from Nicotiana Vanhua chemical group, Inc.
The polyester diol in the polyurethane prepolymer component A is polycaprolactone diol, and the number average molecular weight of the polycaprolactone diol is 1000;
the organic tin catalyst in the polyurethane prepolymer component A is stannous octoate;
the polyol in the curing agent component B is polyether polyol N303;
the organotin catalyst in the curing agent component B is stannous octoate;
in another aspect, embodiment 2 of the present invention provides a method for preparing a heat-to-phase change damping potting adhesive, comprising the following steps:
(1) dehydrating polyol: adding polyol into a three-mouth bottle with stirring, starting stirring, controlling the stirring speed to be 50 rpm, heating, starting vacuumizing and dehydrating when the temperature rises to 90 ℃, keeping the temperature at 120 ℃, keeping the vacuum degree below-0.098 MPa, dehydrating for 3 hours, and keeping the vacuum temperature to be below 33 ℃ after the dehydration is finished for later use;
(2) synthesizing a polyurethane prepolymer component A: preheating diisocyanate to 35 ℃, adding dehydrated polyester diol and organic tin catalyst into a stirred three-neck flask, controlling the stirring speed to be 50 r/min, and carrying out a moisture-proof reaction for 3 hours at 80 ℃ to obtain a polyurethane prepolymer component A for later use;
(3) preparing a curing agent component B: mixing the dehydrated polyalcohol and the organotin catalyst to obtain a curing agent component B;
(4) and (3) curing: and adding the curing agent component B into the polyurethane prepolymer component A, defoaming for 8min in vacuum, reacting for 1h at room temperature, and curing for 4h at 70 ℃ to obtain the hot-to-phase change damping potting adhesive for pouring and potting.
The thermal-to-phase change damping potting adhesive has a damping coefficient of more than 0.3 at 25-60 ℃, can generate solid-solid phase change at room temperature of 110 ℃, and can generate solid-liquid phase change at the temperature of more than 110 ℃.
Comparative example 1
The invention provides a comparative example 1 of a heat-to-phase change damping pouring sealant adhesive, which is the same as the embodiment 1 in the specific implementation mode, and is characterized in that the polyol in the curing agent component B is polycaprolactone diol P210.
Comparative example 2
The invention provides a comparative example 2 of a heat-to-phase change damping pouring sealant adhesive, which is the same as the embodiment 1 in the specific implementation mode, and is characterized in that diisocyanate in the polyurethane prepolymer component A is toluene diisocyanate.
Comparative example 3
The invention provides a comparative example 3 of a heat-to-phase change damping pouring sealant adhesive, which has the same specific implementation mode as that of example 1, and is characterized in that the polyol in the curing agent component B is polyether polyol N210.
Performance test method
(1) The tensile strength of the heat to phase change damping potting adhesives prepared in the examples and comparative examples was tested with reference to national standards.
(2) The elongation at break of the thermal to phase change damping potting adhesive prepared in the examples and comparative examples was tested with reference to national standards.
(3) The aluminum-aluminum bond tensile shear strength of the heat to phase change damping potting adhesives prepared in the examples and comparative examples was tested with reference to national standards.
(4) The hardness of the heat to phase change damping potting adhesives prepared in the examples and comparative examples was tested with reference to national standards.
Table 1 results of performance tests of the heat to phase change damping potting adhesives prepared in examples 1-2 and comparative examples 1-3.
Claims (10)
1. The heat-to-phase change damping potting adhesive is characterized by at least comprising the following raw materials in parts by weight: the polyurethane prepolymer comprises a polyurethane prepolymer component A30-100 parts and a curing agent component B10-100 parts.
2. The heat-to-phase change damping potting adhesive as claimed in claim 1, wherein the mass ratio of the polyurethane prepolymer component A to the curing agent component B is (30-100): (35-100).
3. The heat-to-phase change damping potting adhesive of claim 1 or 2, wherein the polyurethane prepolymer component a comprises at least diisocyanate.
4. The heat-to-phase change damping potting adhesive of claim 3, wherein the polyurethane prepolymer component A further comprises polyester diol and an organotin catalyst.
5. The heat-to-phase change damping potting adhesive of claim 2, wherein the curing agent component B comprises at least a polyol, an organotin catalyst.
6. The heat-to-phase change damping potting adhesive as claimed in claim 3, wherein the diisocyanate in the polyurethane prepolymer component A is diphenylmethane-4, 4' -diisocyanate or hexamethylene diisocyanate with a symmetrical structure.
7. The heat-to-phase change damping potting adhesive as claimed in claim 4, wherein the polyester diol in the polyurethane prepolymer component A is polycaprolactone diol, the number average molecular weight of the polycaprolactone diol is 500-3000, and the molecular distribution coefficient is 1.2-1.5.
8. The heat-to-phase change damping potting adhesive of claim 5, wherein the polyol in the curing agent component B is at least one of polycaprolactone diol, castor oil, polyether polyol N210, polyether polyol N303, 1, 4-butanediol.
9. The heat-to-phase change damping potting adhesive of claim 5, wherein the organotin catalyst in the curing agent component B is selected from at least one of dibutyltin dilaurate, dibutyltin oxide, stannous octoate.
10. A method of preparing a heat to phase change damping potting adhesive according to any of claims 1 to 9 comprising at least the steps of:
and adding the curing agent component B into the polyurethane prepolymer component A, defoaming in vacuum for 5-10min, reacting at room temperature for 1-5h, and curing at 60-100 ℃ for 2-10h to obtain the thermal-to-phase change damping potting adhesive for pouring and potting.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210193683.1A CN114686154B (en) | 2022-03-01 | 2022-03-01 | Heat-to-phase-change damping potting adhesive and preparation method thereof |
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| CN202210193683.1A CN114686154B (en) | 2022-03-01 | 2022-03-01 | Heat-to-phase-change damping potting adhesive and preparation method thereof |
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| CN114686154B CN114686154B (en) | 2023-09-26 |
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| EP1632515A2 (en) * | 2003-12-13 | 2006-03-08 | Dow Gloval Technologies Inc. | Polyurethane reactive composition |
| CN102102006A (en) * | 2010-12-20 | 2011-06-22 | 东莞市宏达聚氨酯有限公司 | A kind of preparation method of two-component polyurethane potting glue and its products |
| CN105885767A (en) * | 2016-06-24 | 2016-08-24 | 绵阳惠利电子材料有限公司 | MDI-base polyurethane electronic pouring sealant as well as preparation method and application method thereof |
| CN110606927A (en) * | 2019-08-12 | 2019-12-24 | 黎明化工研究设计院有限责任公司 | High-performance polyurethane damping material and preparation method thereof |
| CN111533883A (en) * | 2020-05-11 | 2020-08-14 | 青岛爱尔家佳新材料股份有限公司 | Ship filling sealing damping vibration attenuation material and preparation method thereof |
| CN113429541A (en) * | 2021-07-15 | 2021-09-24 | 盛鼎高新材料有限公司 | Preparation method of polyurethane elastomer |
-
2022
- 2022-03-01 CN CN202210193683.1A patent/CN114686154B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1632515A2 (en) * | 2003-12-13 | 2006-03-08 | Dow Gloval Technologies Inc. | Polyurethane reactive composition |
| CN102102006A (en) * | 2010-12-20 | 2011-06-22 | 东莞市宏达聚氨酯有限公司 | A kind of preparation method of two-component polyurethane potting glue and its products |
| CN105885767A (en) * | 2016-06-24 | 2016-08-24 | 绵阳惠利电子材料有限公司 | MDI-base polyurethane electronic pouring sealant as well as preparation method and application method thereof |
| CN110606927A (en) * | 2019-08-12 | 2019-12-24 | 黎明化工研究设计院有限责任公司 | High-performance polyurethane damping material and preparation method thereof |
| CN111533883A (en) * | 2020-05-11 | 2020-08-14 | 青岛爱尔家佳新材料股份有限公司 | Ship filling sealing damping vibration attenuation material and preparation method thereof |
| CN113429541A (en) * | 2021-07-15 | 2021-09-24 | 盛鼎高新材料有限公司 | Preparation method of polyurethane elastomer |
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| CN114686154B (en) | 2023-09-26 |
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