CN114679866B - Housing components and electronic devices - Google Patents
Housing components and electronic devices Download PDFInfo
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- CN114679866B CN114679866B CN202210355236.1A CN202210355236A CN114679866B CN 114679866 B CN114679866 B CN 114679866B CN 202210355236 A CN202210355236 A CN 202210355236A CN 114679866 B CN114679866 B CN 114679866B
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- Prior art keywords
- glass substrate
- housing assembly
- fiber cloth
- glass
- thickness
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Links
- 239000011521 glass Substances 0.000 claims abstract description 108
- 239000000758 substrate Substances 0.000 claims abstract description 90
- 239000004744 fabric Substances 0.000 claims abstract description 60
- 239000003365 glass fiber Substances 0.000 claims abstract description 53
- 239000011230 binding agent Substances 0.000 claims abstract description 10
- 239000011148 porous material Substances 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 32
- 229920000642 polymer Polymers 0.000 claims description 16
- 239000011241 protective layer Substances 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000011247 coating layer Substances 0.000 claims description 12
- 230000003666 anti-fingerprint Effects 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims 1
- 238000005452 bending Methods 0.000 description 26
- 238000000034 method Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000013329 compounding Methods 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000013003 hot bending Methods 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 238000005034 decoration Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000004594 Masterbatch (MB) Substances 0.000 description 2
- 238000003426 chemical strengthening reaction Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 101100110009 Caenorhabditis elegans asd-2 gene Proteins 0.000 description 1
- 208000025174 PANDAS Diseases 0.000 description 1
- 208000021155 Paediatric autoimmune neuropsychiatric disorders associated with streptococcal infection Diseases 0.000 description 1
- 240000000220 Panda oleosa Species 0.000 description 1
- 235000016496 Panda oleosa Nutrition 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005326 engraved glass Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010702 perfluoropolyether Substances 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 description 1
- 229910001414 potassium ion Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
本发明公开了壳体组件和电子设备，壳体组件包括：玻璃基材，玻璃基材具有底面和多个侧壁，底面和多个侧壁限定出容纳空间；玻璃纤维布，玻璃纤维布位于玻璃基材朝向容纳空间的一侧，玻璃纤维布具有孔隙，孔隙内具有粘结剂。由此，可以通过玻璃基材与玻璃纤维布的复合减薄壳体组件的厚度。
The present invention discloses a housing component and an electronic device, wherein the housing component comprises: a glass substrate, the glass substrate having a bottom surface and a plurality of side walls, the bottom surface and the plurality of side walls defining a receiving space; and a glass fiber cloth, the glass fiber cloth being located on a side of the glass substrate facing the receiving space, the glass fiber cloth having pores, and a binder in the pores. Thus, the thickness of the housing component can be reduced by combining the glass substrate and the glass fiber cloth.
Description
Technical Field
The present invention relates to the field of electronic devices, and in particular to a housing assembly and an electronic device.
Background
With the continuous improvement of mobile communication technology, the frequency of use of electronic devices in people's daily life is increasing. In order to improve the aesthetic feeling, handfeel and durability of electronic devices, more and more manufacturers adopt glass as a rear cover of the electronic devices to improve the overall texture and durability of the electronic devices, but the rear cover of the glass in the related art generally has a thicker thickness, so that the total thickness of the electronic devices is thicker, and the overall appearance effect of the electronic devices is poorer.
Accordingly, there is a need for improvements in the present housing assemblies and electronic devices.
Disclosure of Invention
The present invention aims to at least partially alleviate or solve at least one of the above mentioned problems.
In one aspect, the invention provides a housing assembly comprising a glass substrate having a bottom surface and a plurality of side walls defining a receiving space, and a glass fiber cloth positioned on a side of the glass substrate facing the receiving space, the glass fiber cloth having an aperture with an adhesive therein. Thus, the thickness of the housing assembly can be reduced by compounding the glass substrate with the glass fiber cloth.
In another aspect, the invention provides an electronic device, which comprises a housing assembly, a battery and a main board, wherein the housing assembly is the housing assembly, the battery and the main board are positioned in an accommodating space defined by the housing assembly, and the main board is electrically connected with the battery. Thus, the electronic device has all the features and advantages of the foregoing housing assembly, and will not be described herein.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 shows a schematic structural view of a housing assembly according to one embodiment of the invention;
FIG. 2 shows a schematic view of a portion of a housing assembly according to yet another embodiment of the invention;
FIG. 3 shows a schematic view of a portion of a housing assembly according to yet another embodiment of the invention;
FIG. 4 shows a schematic view of a portion of a housing assembly according to yet another embodiment of the invention;
fig. 5 shows a surface topography of a fiberglass cloth according to one embodiment of the present invention.
Reference numerals illustrate:
100 parts of glass substrate, 200 parts of glass fiber cloth, 310 parts of polymer protective layer, 320 parts of decorative film layer, 321 parts of coating film layer, 322 parts of ink layer and 330 parts of fingerprint resistant layer.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In one aspect of the present invention, referring to FIG. 1, a housing assembly is provided, comprising a glass substrate 100, the glass substrate 100 having a bottom surface and a plurality of side walls, the bottom surface and the plurality of side walls defining an accommodating space, and a glass fiber cloth 200, the glass fiber cloth 200 being positioned on a side of the glass substrate facing the accommodating space, the glass fiber cloth 200 having an aperture with an adhesive therein referring to FIG. 5. The glass fiber cloth and the glass substrate are bonded together through the adhesive in the holes of the glass fiber cloth, so that the bending strength, the hardness and other mechanical properties of the shell assembly can be improved on the premise of reducing the overall thickness of the shell assembly, and the shell assembly is compared with the shell assembly formed by the pure glass substrate. On the premise that the shell components have the same mechanical properties, the shell components obtained by compounding the glass base material and the glass fiber cloth are thinner than the shell components only provided with the glass base material, and on the premise that the shell components have the same thickness, the shell components obtained by compounding the glass base material and the glass fiber cloth are better in mechanical properties than the shell components only provided with the glass base material.
For ease of understanding, the principle of the housing assembly of the present application having the foregoing advantageous effects is explained as follows:
In the present application, the inventors found that the hardness of a single glass substrate is large, and the hardness of the glass cloth is small and the whole is soft. Only for the thinned glass substrate, the pressure of the thinned glass substrate, which can bear bending, is reduced compared with the glass substrate with thicker thickness before thinning, but after the thinned glass substrate is compounded with the glass fiber cloth, the deformation amount after stress is larger due to the higher ductility of the glass fiber cloth. The bending strength P of the plate is in a proportional relation with the bending bearing pressure F of the plate and the deformation X of the plate, so that the plate obtained after the glass substrate and the glass fiber cloth are compounded can bear slightly reduced bending pressure F, but the tolerable deformation X is obviously improved, and finally, the glass substrate with the thickness equivalent to the bending strength of the plate formed by compounding the glass substrate and the glass fiber cloth is relatively higher, and the glass substrate with the thickness equivalent to the bending strength of the plate formed by compounding the glass substrate and the glass fiber cloth is relatively thinner.
According to some embodiments of the present invention, referring to fig. 1, the connection surface of the bottom surface and the sidewall of the glass substrate 100 may be a curved surface, and the bending angle of the curved surface is not particularly limited, for example, the bending angle of the curved surface may be 40-90 °. According to other embodiments of the present invention, the glass cloth 200 may have a similar shape to the glass substrate 100, that is, the glass cloth may also have a bottom surface and a plurality of sidewalls, the connection surface of the bottom surface and the sidewalls may be curved, and the curved surface may have a bending angle of 40-90 °.
According to some embodiments of the present invention, the thickness of the case assembly is not particularly limited, and for example, the thickness of the case assembly may be less than 0.5mm, and the case assembly having a thickness of less than 0.5mm has a significant thickness reduction with respect to the case assembly in the related art, and has a high value for the reduction of the entire thickness of the electronic device.
According to some embodiments of the invention, the thickness of the fiberglass cloth may be selected according to the thickness of the glass substrate, so long as the sum of the two is less than 0.5 mm. For example, the thickness of the glass substrate may be 0.2 to 0.3mm, and the thickness of the glass cloth may be 0.2 to 0.3mm. When the thickness of the glass substrate is more than 0.3mm, the thickness of the glass fiber cloth needs to be less than 0.2mm in order to ensure that the total thickness of the shell component is less than 0.5mm, at the moment, the thickness of the glass fiber cloth is too thin, the glass fiber cloth cannot fully exert the advantages of good ductility, the bending strength of the shell component is poor, when the thickness of the glass substrate is less than 0.2mm, the thickness of the glass substrate is too thin, the bearable bending pressure of a composite board formed by the glass substrate and the glass fiber cloth is too low, so that the bending strength of the shell component is too poor, and in addition, when the thickness of the glass substrate is less than 0.2mm, the glass substrate has the problems of too large warping degree, poor flatness and the like, and the basic requirements of the shell component cannot be met.
According to some embodiments of the present invention, the thickness of the glass substrate is not particularly limited, so long as the flatness of the glass substrate can meet the use requirement of the housing assembly, thereby improving the flatness of the composite board formed by the glass substrate and the glass fiber cloth, and the overall appearance effect of the electronic device is smoother and no abnormal protrusions exist when the composite board is attached to the electronic device as the housing assembly.
According to some embodiments of the invention, the composite formed by the glass substrate and the glass fiber cloth can reduce the thickness of the shell component and improve the bending strength of the shell component, for example, the bending strength of the shell component can be 380-600MPa, when the bending strength of the shell component is in the range, the bending stress born by the shell component when the shell component is assembled to the electronic equipment can not obviously influence the structural stability of the shell component, and when the electronic equipment assembled by the shell component is impacted by external force, the shell component also can have higher structural stability and is not easy to crack or break under the impact of the external force.
According to some embodiments of the present invention, the kind of the binder is not particularly limited, and for example, the binder may be an epoxy resin. The epoxy resin adhesive has high transparency, and the appearance effect of the shell component is not adversely affected by filling the epoxy resin as the adhesive in the glass fiber cloth.
According to some embodiments of the present invention, the structure of the housing assembly is not particularly limited, and for example, referring to fig. 2 and 3, the housing assembly may further include a polymer protection layer 310, the polymer protection layer 310 being located between the glass substrate 100 and the glass fiber cloth 200, and a decoration film layer 320, the decoration film layer 320 being located between the glass substrate 100 and the glass fiber cloth 200, the decoration film layer 320 being located on a side of the polymer protection layer 310 remote from the glass substrate 100. Through the setting of polymer protective layer 310, can regard as the bottom layer of decorating rete 320 structure, improve the intensity of glass substrate 100, reduce the setting of decorating rete 320 and to the attenuation effect of glass substrate intensity, and the thickness of polymer protective layer is thinner, compares in the thickness of glass substrate negligible. Specifically, the decorative film 320 may include an ink layer 322 and a coating layer 321, where the coating layer 321 is located on a side of the polymer protective layer 310 away from the glass substrate 100, and the ink layer 322 is located on a side of the coating layer 321 away from the polymer protective layer 310. The shell component has metallic luster through the arrangement of the coating layer, and the aesthetic degree of the shell component is improved, and the shell component has good shielding property and a certain color through the arrangement of the ink layer, so that the internal structure is protected, and the aesthetic degree of the shell component is improved. The thickness of the coating layer and the ink layer is thinner, and is negligible compared with the thickness of the glass substrate.
The structure of the case assembly according to some embodiments of the present invention is not particularly limited, and for example, referring to fig. 4, the case assembly may further include an anti-fingerprint layer 330, where the anti-fingerprint layer 330 is located on a side of the glass substrate 100 away from the glass fiber cloth 200, i.e., on a surface of the glass substrate facing away from the inside of the electronic device. The fingerprint residue on the surface of the shell component in the using process can be relieved through the arrangement of the fingerprint-resistant layer, and the attractiveness of the shell component is improved.
It should be noted that, in fig. 2,3 and 4, only the bottom surface structure of the housing assembly is shown, and the side edges and the connection surfaces between the bottom surface and the side walls are not shown, it is understood that the side walls of the housing assembly and the connection surfaces between the bottom surface and the side walls have the same laminated structure as the bottom surface.
For ease of understanding, the following description is given for a simple method of preparing the aforementioned housing assembly, specifically comprising the steps of:
S100 providing a glass substrate
According to some embodiments of the present invention, a glass substrate is provided at this step, and the thickness of the glass substrate may be 0.2 to 0.3mm, for example, the glass substrate of the above thickness range may be obtained by thinning a glass master batch having a thickness of not less than 0.5mm, and in particular, the thinning process may be chemical thinning. Compared with physical thinning, the chemical thinning has controllable thinning speed, and the surface flatness of the glass substrate obtained after thinning is higher. Further, the glass master batch may be a high alumina glass having an aluminum content of not less than 15%, such as at least one of commercially available corning GG5, panda 1681 and DT Star 2.
S200, sequentially arranging a polymer protective layer and a decorative film layer on the glass substrate
According to some embodiments of the invention, the arrangement of the polymer protective layer and the device film layer can specifically comprise the steps of engraving a glass substrate, cutting the glass substrate into a required shape and size, polishing the edges of the engraved glass substrate, performing hot bending forming on the edge-polished glass substrate, for example, arranging the glass substrate in a profiling jig, heating and bending the glass substrate to form a bottom surface and a plurality of side walls, wherein the bottom surface and the side walls are connected through arc-shaped connecting surfaces, the bottom surface and the side walls define an accommodating space, and performing chemical strengthening treatment on the glass substrate after the hot bending forming, for example, performing high-temperature sodium-potassium ion exchange to improve the stress value of glass.
According to some embodiments of the present invention, a polymer protective layer is formed on a side of the glass substrate subjected to the chemical strengthening treatment facing the accommodating space, and specifically, the polymer protective layer may be disposed by a jet printing process, and a coating layer is formed on a side of the polymer protective layer facing away from the glass substrate, and the process of forming the coating layer is not particularly limited. Specifically, the coating layer may be formed by at least one of magnetron sputtering coating or evaporation coating, and the ink layer is formed on the side of the coating layer remote from the polymer protective layer, and the ink used in forming the ink layer is not particularly limited. Specifically, the ink used in forming the humor layer may be at least one of a thermosetting ink, a UV curable ink, and a yellow light type ink, and further, after finishing the screen printing of the ink on the surface of the glass substrate, the ink may be cured by a baking process.
S300, arranging glass fiber cloth on one side surface of the glass substrate facing the accommodating space
According to some embodiments of the present invention, a glass fiber cloth is provided on a side surface of the glass substrate facing the receiving space in this step, and the thickness of the glass fiber cloth may be selected according to the thickness of the glass substrate, so long as the sum of the two is less than 0.5mm, for example, the thickness of the glass fiber cloth may range from 0.2 to 0.3mm.
According to some embodiments of the invention, providing the glass fiber cloth may include immersing the glass fiber cloth in a binder solution such that the binder fills the pores of the glass fiber cloth, profiling the glass fiber cloth having the binder therein into the receiving space of the glass substrate, wherein the glass fiber cloth has a certain adhesion property with the glass substrate due to the initial adhesion property of the binder, and performing a heat curing treatment on the binder to cure the binder resin, thereby firmly adhering the glass fiber cloth to the glass substrate.
According to some embodiments of the present invention, the temperature and time of the adhesive curing treatment are not particularly limited as long as the adhesive can be cured, for example, when the adhesive is an epoxy resin, the temperature of the curing treatment may be 80 to 150 ℃ and the time may be 30 to 60 minutes.
According to some embodiments of the present invention, in order to simplify the process steps, the above-mentioned bonding process may be performed using a glass fiber cloth having an area larger than the inner surface area of the glass substrate, and after the curing process is completed, the glass fiber cloth that is more than the bonded glass fiber cloth may be trimmed by using a CNC trimming process, so that the shapes of the glass fiber cloth and the glass substrate are identical.
In order to further improve the performance of the shell component prepared by the method, the residue of fingerprints on the surface of the shell component in the using process is relieved, the smoothness of the shell component is improved, and the method for preparing the shell component can further comprise the following steps:
S400, forming an anti-fingerprint layer on the surface of one side of the glass substrate, which is away from the accommodating space
According to some embodiments of the invention, an anti-fingerprint layer having a water contact angle greater than 110 degrees is formed on a side of the surface of the glass substrate in contact with the outside in this step. The manner of forming the fingerprint-preventing layer is not particularly limited, and specifically, may be at least one of magnetron sputtering plating film or evaporation plating film. The material forming the anti-fingerprint layer may be a perfluoropolyether.
In another aspect, the invention provides an electronic device, which comprises a housing assembly, a battery and a main board, wherein the housing assembly is the housing assembly, the battery and the main board are positioned in an accommodating space defined by the housing assembly, and the main board is electrically connected with the battery. Thus, the electronic device has all the features and advantages of the foregoing housing assembly, and will not be described in detail herein.
According to some embodiments of the present invention, the electronic device may be any of various types of computer system devices that are mobile or portable and that perform wireless communications. In particular, the electronic device may be a mobile phone or a smart phone (e.g., phone based on iPhone TM, android TM), a portable gaming device (e.g., nintendo DS TM,PlayStation Portable TM,Gameboy Advance TM,iPhone TM), a laptop, a PDA, a portable internet device, a music player, and a data storage device, other handheld devices, and devices such as watches, in-ear headphones, pendants, headsets, etc., and the electronic device may also be other wearable devices (e.g., a head-mounted device (HMD) such as electronic glasses, electronic clothing, electronic bracelets, electronic necklaces, electronic tattoos, or smart watches).
The following description of the present application is made by way of specific examples, which are given for illustration of the present application and should not be construed as limiting the scope of the application. The examples are not to be construed as limiting the specific techniques or conditions described in the literature in this field or as per the specifications of the product. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
Example 1:
Glass substrate with the thickness of 0.3mm is selected, glass fiber cloth with the thickness of 0.2mm is compounded to obtain a shell component, the adhesive is epoxy resin, the adhesive is arranged in the pores of the glass fiber cloth, the glass fiber cloth is bonded with the glass substrate through the adhesive, the glass substrate is subjected to hot bending forming, the connecting surface of the bottom surface and the side wall of the glass substrate is a curved surface, and the bending angle of the curved surface is 90 degrees.
Example 2:
Example 2 was consistent with example 1 except that the thickness of the glass substrate was 0.2mm and the thickness of the glass cloth was 0.2mm.
Comparative example 1:
a glass substrate with the thickness of 0.5mm is selected for hot bending forming to obtain a shell component, the connecting surface of the bottom surface and the side wall of the glass substrate is a curved surface, and the bending angle of the curved surface is 90 DEG
Comparative example 2:
Comparative example 2 was identical to comparative example 1 except that the thickness of the glass substrate was 0.4mm.
Four-point bending test was conducted on the case assemblies of the above examples and comparative examples, and the test results were that the case assembly of example 1 had a bending strength of 512MPa, the case assembly of example 2 had a bending strength of 397MPa, the case assembly of comparative example 1 had a bending strength of 478MPa, and the case assembly of comparative example 2 had a bending strength of 370MPa. The results show that the bending stress born by the housing components in the embodiments 1 and 2 can not significantly affect the structural stability of the housing components when the housing components are assembled to the electronic device, and the electronic device assembled by the housing components in the embodiments 1 and 2 also can have higher structural stability when the housing components are impacted by external force, so that cracks or breakage are not easy to occur under the impact of the external force. The housing assemblies in comparative examples 1 and 2 were vulnerable to breakage of the structure when subjected to external impact, and could not meet the use requirements. The shell component obtained by compounding the glass substrate and the glass fiber cloth in the embodiments 1 and 2 has better bending strength compared with the shell component prepared by glass with equal thickness, and the thickness reduction of the whole electronic equipment can be realized by utilizing the glass fiber composite glass battery cover.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. All patents and publications referred to herein are incorporated by reference in their entirety. The terms "comprising" or "including" are used in an open-ended fashion, i.e., including the teachings described herein, but not excluding additional aspects. In the present invention, all numbers disclosed herein are approximate, whether or not the word "about" or "about" is used. The numerical value of each number may vary by less than 10% or reasonably as considered by those skilled in the art, such as 1%, 2%, 3%, 4% or 5%.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
In the description of the present invention, "plurality" means two or more.
In the description of the present specification, reference to the term "one embodiment," "another embodiment," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction. In addition, it should be noted that, in this specification, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.
Claims (9)
1. A housing assembly, comprising:
a glass substrate having a bottom surface and a plurality of side walls, the bottom surface and the plurality of side walls defining a receiving space;
the glass fiber cloth is positioned on one side of the glass substrate, which faces the accommodating space, and is provided with pores, and the pores are internally provided with binders;
The high polymer protective layer is positioned between the glass substrate and the glass fiber cloth;
the decorative film layer is positioned between the glass substrate and the glass fiber cloth, and is positioned on one side of the high polymer protective layer away from the glass substrate.
2. The housing assembly of claim 1, wherein the interface of the bottom surface and the side wall is curved, and wherein the curved surface has a bend angle of 40-90 °.
3. The housing assembly of claim 2, wherein the housing assembly has a thickness of less than 0.5mm.
4. A housing assembly according to claim 3, wherein the glass substrate has a thickness of 0.2-0.3mm and the glass cloth has a thickness of 0.2-0.3mm.
5. The housing assembly of claim 4, wherein the housing assembly has a flexural strength of 380-600MPa.
6. The housing assembly of claim 1, wherein the adhesive is an epoxy.
7. The housing assembly of claim 1, wherein the decorative film layer comprises an ink layer and a coating layer, the coating layer being located on a side of the polymeric protective layer remote from the glass substrate, the ink layer being located on a side of the coating layer remote from the polymeric protective layer.
8. The housing assembly of claim 1, further comprising:
and the anti-fingerprint layer is positioned on one side of the glass substrate far away from the glass fiber cloth.
9. An electronic device, comprising:
a housing assembly according to any one of claims 1-8;
the battery and the main board are positioned in the accommodating space defined by the shell component, and the main board is electrically connected with the battery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210355236.1A CN114679866B (en) | 2022-04-06 | 2022-04-06 | Housing components and electronic devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210355236.1A CN114679866B (en) | 2022-04-06 | 2022-04-06 | Housing components and electronic devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114679866A CN114679866A (en) | 2022-06-28 |
| CN114679866B true CN114679866B (en) | 2025-02-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210355236.1A Active CN114679866B (en) | 2022-04-06 | 2022-04-06 | Housing components and electronic devices |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110191605A (en) * | 2019-06-27 | 2019-08-30 | Oppo广东移动通信有限公司 | Shell assembly, preparation method and electronic equipment |
| CN215897772U (en) * | 2021-08-13 | 2022-02-22 | 惠州市众力电子科技有限公司 | Take fine 3D cell-phone shell of transparent glass of texture |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US11709291B2 (en) * | 2018-01-25 | 2023-07-25 | Corning Incorporated | Fiberglass composite cover for foldable electronic display and methods of making the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110191605A (en) * | 2019-06-27 | 2019-08-30 | Oppo广东移动通信有限公司 | Shell assembly, preparation method and electronic equipment |
| CN215897772U (en) * | 2021-08-13 | 2022-02-22 | 惠州市众力电子科技有限公司 | Take fine 3D cell-phone shell of transparent glass of texture |
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