CN114678208B - A kind of manufacturing method of all-resin chip inductor - Google Patents

Abstract

The invention provides a manufacturing method of a full-resin sheet inductor, which comprises the following steps: manufacturing a first coil and a first layer of electrode, and then, sticking a film, exposing, developing and electroplating to manufacture a first copper column and a second layer of electrode; manufacturing a second coil, a third layer electrode, a second copper column and a fourth layer electrode by using the same method as the previous step; the method comprises the steps of taking an alternating structure of a first coil, a first copper column, a second coil and a second copper column as a basic unit, and circularly manufacturing the basic unit upwards to obtain a full-resin sheet type inductor; compared with the traditional chip inductor manufacturing method, the manufacturing process is greatly simplified, and the process difficulty is reduced. Meanwhile, the chip inductor manufactured by the invention realizes the integrated manufacture of the L-shaped terminal electrode and the coil.

Description

A kind of manufacturing method of all-resin chip inductor

technical field

The invention belongs to the field of inductors, and in particular relates to a method for manufacturing an all-resin chip inductor.

Background technique

Inductors can convert electrical energy into magnetic energy and store it, and play the role of energy storage, filtering, and resonance in the circuit. With the vigorous development of mobile communication technology, the high integration and thinning of communication equipment have led to the development of miniaturization of electronic components, and the chipping of inductive components is also an inevitable trend to reduce product volume and improve assembly efficiency. Chip inductors are divided into two types: wire wound type and multilayer type. Wire-wound inductors are made by winding thin wires on a soft ferrite core, and the outer layer is generally sealed with resin. Its process inheritance is strong, but its size miniaturization is limited. The chip multilayer inductor does not need to be wound, but is alternately printed, laminated, and sintered with ferrite paste and conductive paste to form a closed magnetic circuit; it uses advanced thick-film multi-layer passivation technology and lamination production process to achieve ultra-small surface mount. The traditional production method has a complicated production process, poor reliability of the inductor, and cannot realize the integrated production of the coil and the electrode, and cannot continue to reduce the size of the chip inductor. Therefore, it is necessary to develop a new process for production.

The Chinese invention patent "A Manufacturing Method for SMD Power Inductors" (application number CN201910078314.6) discloses a manufacturing method for chip inductors that combines wire winding technology and multi-layer printing technology. This method can produce multilayer chip inductors without high-temperature sintering, but the size reduction of inductors is limited. The Chinese invention patent "A SMD Inductor and Its Manufacturing Method" (application number CN201811209431.3) discloses a manufacturing method for alternately forming insulating layers and patterned metal structures, which can realize the miniaturization of chip inductors and the inductance Precise control of size. The insulating layer in this method needs to make a through-hole structure to connect the inductance coil of the adjacent layer, which makes the manufacturing process very complicated, and the reliability of the connection between the through-hole metal and the coil cannot be guaranteed.

Contents of the invention

In view of the above, in view of the complex process flow of the existing chip inductors and the fact that the size cannot be further reduced, the present invention provides a method for manufacturing an all-resin chip inductor. The coil circuit and electrode pattern are made by an additive method, which simplifies the chip size. The production process of the type inductor is realized, and the integrated production of the terminal electrode is realized at the same time. In addition, fine circuits can be made by using the additive method, which can further reduce the size of chip inductors.

Technical scheme of the present invention is as follows:

A method for manufacturing an all-resin chip inductor, comprising the steps of:

Step (1): forming the first layer of graphics, the first layer of graphics includes the first coil and the first layer of electrodes, and one of the following two methods is used for graphics production:

Method 1: spray the catalytic ink on the first substrate 101 by inkjet printing, and then perform electroless plating to form the first coil and the first layer of electrodes in the ink area to obtain the second substrate 102 with the first coil 304;

Method 2: Form a seed layer with a thickness of 2 μm on the first substrate 101, and then carry out filming, exposure, and development on the seed layer to expose the area where the coil and the electrode are located, and the pattern of the coil and the electrode area is exposed by electroplating. Thickening, after the film is withdrawn, the second substrate 102 containing the seed layer and the first coil is obtained;

Step (2): making a second layer of graphics, the second layer of graphics includes the first copper pillar and the second layer of electrodes, divided into the following two situations:

Situation 1: After making the first coil and the first layer of electrodes by using method 1 in step (1), carry out filming, exposure, and development on the graphic surface of the second substrate 102, so as to expose the area of copper pillars and electrode patterns, and then electroplate and grow The first copper pillar and the second layer of electrodes are removed to obtain the third substrate 103; a resin layer is formed on the pattern surface of the third substrate 103, and then ground, so that the top of the first copper pillar and the second layer of electrode patterns are exposed;

Situation 2: After the first layer of graphics is made by method 2 in step (1), film, exposure, and development are performed on the graphics surface of the second substrate 102 to expose the areas of copper pillars and electrode graphics, and the first layer is grown by electroplating. Copper pillars and a second layer of electrodes, the second layer of electrodes are grown directly on the first layer of electrodes; differential etching is performed after the film is removed, and the third substrate 103 is obtained after the seed layer is etched; on the third substrate 103 forming a resin layer on the graphic surface, followed by grinding, so that the top of the first copper pillar and the second electrode pattern are exposed;

Step (3) According to the manufacturing method of the coil and the electrode described in step (1), continue to manufacture the second coil and the third layer of electrodes on the ground third substrate 103 to obtain the fourth substrate 104 with the second coil 307 The third layer of graphics;

Step (4) According to the manufacturing method of the copper pillars and electrodes described in step (2), continue to make the second copper pillars and the fourth layer of electrodes on the fourth substrate 104 to obtain the fifth substrate 105 with the second copper pillars 308 The fourth layer of graphics;

Step (5) takes the alternating structure of the first coil, the first copper column, the second coil, and the second copper column from bottom to top as the basic unit, and makes it circularly upward according to the method described in steps (1) to (4), Obtain a sixth substrate 106 with a multilayer coil structure of (2N-1) layer pattern, N≥3;

Step (6) Use the pattern making method described in step (1) to continue to thicken the electrode pattern, and obtain the seventh substrate 107 after film removal and differential etching; continue to use the pattern making method described in step (1) to add Wide electrodes, N-turn coil inductor 108 with L-shaped terminal electrodes can be obtained after stripping the film and differential etching.

As a preferred manner, the seed layer in the step (1) is one of Cu, Ti and Cu double-layer structure, Ni, Sn, and has a thickness of 1-3 μm.

As a preferred mode, the method for forming the resin layer in the step (2) is to choose heat-pressing prepreg or printing photocurable resin.

As a preferred manner, the width of the coil pattern in the steps (1) and (3) is 8-25 μm.

As a preferred manner, the copper pillars in the steps (2) and (4) are respectively interconnected with the upper and lower adjacent coils.

As a preferred manner, the bottom coil and the top coil of the inductor 108 produced in the step (6) are respectively interconnected with the electrodes on both sides.

As a preferred manner, the number of turns of the inductor coil in the step (6) is N, wherein the odd-numbered layers are coils, and the even-numbered layers are copper columns connecting the coils.

Principle of the present invention and beneficial effect are as follows:

The invention proposes a method for manufacturing all-resin chip inductors by using an additive method. Compared with the traditional manufacturing method of chip inductors, the invention greatly simplifies the manufacturing process and reduces the difficulty of the process. At the same time, each layer of the chip inductor prepared by the present invention has an electrode pattern, which realizes the integrated production of the L-shaped terminal electrode and the coil. In addition, the coil width of the inductor structure prepared by the invention is 8-25 μm, which can reduce the volume of the chip inductor. Compared with the traditional ceramic inductance, the loss of the resin used in the inductance of the present invention is low, which is beneficial to improve the quality factor of the inductance.

Description of drawings

FIG. 1 shows the first substrate 101 after printing catalytic ink when using method 1 in step 1.

FIG. 2 shows the second substrate 102 after the first coil and the first layer of electrodes are formed by electroless plating when method 1 is used in step 1.

FIG. 3 is the first substrate 101 after depositing the seed layer when the method 2 is used in step 1 .

FIG. 4 shows the second substrate 102 obtained after the first coil and the first layer of electrodes are formed by electroplating when method 2 is used in step 1 .

FIG. 5 is the second substrate 102 after film stripping in step 1. Referring to FIG.

Fig. 6 is a schematic diagram of exposure and development of the film in step 2.

FIG. 7 is the third substrate 103 obtained after electroplating in step 2.

FIG. 8 is the third substrate 103 after film stripping in step 2.

FIG. 9 is the third substrate 103 after differential etching in step 2. Referring to FIG.

FIG. 10 is the third substrate 103 after step 2 grinding.

FIG. 11 is the fourth substrate 104 obtained in step 3.

FIG. 12 is the fifth substrate 105 obtained in step 4.

FIG. 13 is the sixth substrate 106 obtained in step 5.

FIG. 14 is the seventh substrate 107 obtained in step 6.

Fig. 15 is the inductance 108 obtained in step 6.

Fig. 16 is a flow chart of coil production in the present invention.

Fig. 17 is a 3D rendering of the inductor of the present invention.

101 is the first substrate, 102 is the second substrate, 103 is the third substrate, 104 is the fourth substrate, 105 is the fifth substrate, 106 is the sixth substrate, 107 is the seventh substrate, 108 is the inductor, 202 is the electrode area 203 is the catalytic ink in the coil area, 301 is the seed layer, 302 is the dry film, 303 is the electrode, 304 is the first coil, 305 is the resin, 306 is the first copper pillar, 307 is the second coil, 308 is the second copper pillar.

Detailed ways

In order to make those skilled in the art understand the solutions and principles of the present invention, the following describes in detail with reference to the drawings and specific embodiments.

Example 1

A method for manufacturing an all-resin chip inductor, comprising the steps of:

Step (1): forming the first layer of graphics, the first layer of graphics includes the first coil and the first layer of electrodes, and the method for making the graphics is:

Spray the catalytic ink on the first substrate 101 by inkjet printing, and then perform electroless plating to form the first coil and the first layer of electrodes in the ink area to obtain the second substrate 102 with the first coil 304;

Step (2): making a second layer of graphics, the second layer of graphics includes the first copper pillar and the second layer of electrodes, divided into the following two situations:

After the first coil and the first layer of electrodes are made by using method 1 in step (1), the pattern surface of the second substrate 102 is pasted, exposed, and developed to expose the area of the copper pillar and the electrode pattern, and the first layer is grown by electroplating. Copper pillars and second-layer electrodes to obtain a third substrate 103; forming a resin layer on the pattern surface of the third substrate 103, followed by grinding, so that the tops of the first copper pillars and the second-layer electrode patterns are exposed;

Step (3) According to the manufacturing method of the coil and the electrode described in step (1), continue to manufacture the second coil and the third layer of electrodes on the ground third substrate 103 to obtain the fourth substrate 104 with the second coil 307 The third layer of graphics;

Step (4) According to the manufacturing method of the copper pillars and electrodes described in step (2), continue to make the second copper pillars and the fourth layer of electrodes on the fourth substrate 104 to obtain the fifth substrate 105 with the second copper pillars 308 The fourth layer of graphics;

Step (5) takes the alternating structure of the first coil, the first copper column, the second coil, and the second copper column from bottom to top as the basic unit, and makes it circularly upward according to the method described in steps (1) to (4), A sixth substrate 106 having a multilayer coil structure with 17 layers of patterns as shown in FIG. 12 is obtained;

Step (6) Use the pattern making method described in step (1) to continue to thicken the electrode pattern, and obtain the seventh substrate 107 after film removal and differential etching; continue to use the pattern making method described in step (1) to add The wide electrode, the 9-turn coil inductor 108 with the L-shaped terminal electrode can be obtained after stripping the film and differential etching.

The method for forming the resin layer in the step (2) is to choose hot pressing prepreg or printing photocurable resin.

The width of the coil pattern in the steps (1) and (3) is 8-25 μm.

The copper pillars in the steps (2) and (4) are respectively interconnected with the upper and lower adjacent two-layer coils.

The bottom coil and the top coil of the inductor 108 prepared in the step (6) are respectively interconnected with the electrodes on both sides.

In the step (6), the number of turns of the inductance coil is N, wherein the odd-numbered layers are coils, and the even-numbered layers are copper pillars connecting the coils.

Example 2

This embodiment provides a method for manufacturing an all-resin chip inductor, including the following steps:

Step (1): forming the first layer of graphics, the first layer of graphics includes the first coil and the first layer of electrodes, and the method for making the graphics is:

A seed layer with a thickness of 2 μm is formed on the first substrate 101, and then film, exposure, and development are performed on the seed layer to expose the area where the coil and the electrode are located, and the pattern of the coil and electrode area is thickened by electroplating. After the film is withdrawn, a second substrate 102 containing the seed layer and the first coil is obtained;

Step (2): making a second layer of graphics, the second layer of graphics includes the first copper pillars and the second layer of electrodes,

After the first layer of graphics is made by method 2 in step (1), film, exposure, and development are carried out on the graphics surface of the second substrate 102, so that the copper pillars and electrode patterns are exposed, and the first copper pillars and electrode patterns are grown by electroplating. The second layer of electrodes, the second layer of electrodes is grown directly on the first layer of electrodes by electroplating; after the film is removed, differential etching is performed, and the third substrate 103 is obtained after the seed layer is etched; on the graphic surface of the third substrate 103 forming a resin layer, followed by grinding, so that the top of the first copper pillar and the second layer of electrode patterns are exposed;

Step (3) According to the manufacturing method of the coil and the electrode described in step (1), continue to manufacture the second coil and the third layer of electrodes on the ground third substrate 103 to obtain the fourth substrate 104 with the second coil 307 The third layer of graphics;

Step (4) According to the manufacturing method of the copper pillars and electrodes described in step (2), continue to make the second copper pillars and the fourth layer of electrodes on the fourth substrate 104 to obtain the fifth substrate 105 with the second copper pillars 308 The fourth layer of graphics;

Step (5) takes the alternating structure of the first coil, the first copper column, the second coil, and the second copper column from bottom to top as the basic unit, and makes it circularly upward according to the method described in steps (1) to (4), Obtain a sixth substrate 106 with a multilayer coil structure of (2N-1) layer pattern, N≥3;

Step (6) Use the pattern making method described in step (1) to continue to thicken the electrode pattern, and obtain the seventh substrate 107 after film removal and differential etching; continue to use the pattern making method described in step (1) to add Wide electrodes, N-turn coil inductor 108 with L-shaped terminal electrodes can be obtained after stripping the film and differential etching.

In the step (1), the seed layer is one of Cu, Ti and Cu double-layer structure, Ni and Sn, and has a thickness of 1-3 μm.

The method for forming the resin layer in the step (2) is to choose hot pressing prepreg or printing photocurable resin.

The width of the coil pattern in the steps (1) and (3) is 8-25 μm.

The copper pillars in the steps (2) and (4) are respectively interconnected with the upper and lower adjacent two-layer coils.

The bottom coil and the top coil of the inductor 108 prepared in the step (6) are respectively interconnected with the electrodes on both sides.

In the step (6), the number of turns of the inductance coil is N, wherein the odd-numbered layers are coils, and the even-numbered layers are copper pillars connecting the coils.

The above-mentioned embodiments only illustrate the principles and effects of the present invention, but are not intended to limit the present invention. Anyone skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical ideas disclosed in the present invention shall still be covered by the claims of the present invention.

Claims (1)

1. The manufacturing method of the all-resin sheet inductor is characterized by comprising the following steps of:

step (1): forming a first layer of pattern, wherein the first layer of pattern comprises a first coil and a first layer of electrode, and the pattern is manufactured by one of the following two methods:

method 1: spraying catalytic ink on the first substrate (101) by using an ink-jet printing method, then performing electroless plating, and forming a first coil and a first layer electrode in an ink area to obtain a second substrate (102) with a first coil (304);

method 2: forming a seed layer with the thickness of 2 mu m on a first substrate (101), then carrying out film pasting, exposure and development on the seed layer, exposing the area where the coil and the electrode are positioned, thickening the patterns of the coil and the electrode area in an electroplating mode, and removing the film to obtain a second substrate (102) containing the seed layer and the first coil;

step (2): manufacturing a second layer of pattern, wherein the second layer of pattern comprises a first copper column and a second layer of electrode, and the two conditions are as follows:

case 1: after a first coil and a first layer of electrode are manufactured by adopting the method 1 in the step (1), film pasting, exposure and development are carried out on the pattern surface of the second substrate (102), the areas of the copper columns and the electrode patterns are exposed, and the first copper columns and the second layer of electrode are grown by electroplating, so that a third substrate (103) is obtained; forming a resin layer on the pattern surface of the third substrate (103), and then grinding the resin layer so that the tops of the first copper columns and the second electrode patterns are exposed;

case 2: after a first layer of pattern is manufactured by adopting the method 2 in the step (1), film pasting, exposure and development are carried out on the pattern surface of the second substrate (102), the areas of the copper columns and the electrode patterns are exposed, a first copper column and a second layer of electrode are grown through electroplating, and the second layer of electrode is formed by directly electroplating and growing on the first layer of electrode; performing differential etching after film removal, and obtaining a third substrate (103) after etching the seed layer; forming a resin layer on the pattern surface of the third substrate (103), and then grinding the resin layer so that the tops of the first copper columns and the second electrode patterns are exposed;

step (3) continuing to manufacture a second coil and a third layer electrode on the ground third substrate (103) according to the manufacturing method of the coil and the electrode in the step (1) to obtain a third layer pattern of a fourth substrate (104) with the second coil (307);

step (4) continuing to manufacture a second copper column and a fourth layer electrode on the fourth substrate (104) according to the manufacturing method of the copper column and the electrode in the step (2) to obtain a fourth layer pattern of a fifth substrate (105) with a second copper column (308);

step (5) takes an alternating structure of a first coil, a first copper column, a second coil and a second copper column from bottom to top as a basic unit, and circularly and upwards manufacturing the alternating structure according to the methods in the steps (1) - (4) to obtain a sixth substrate (106) with a multi-layer coil structure with a (2N-1) layer pattern, wherein N is more than or equal to 3;

step (6), continuously thickening the electrode pattern by using the pattern manufacturing method in the step (1), removing the film, and performing differential etching to obtain a seventh substrate (107); continuously using the pattern manufacturing method in the step (1) to widen the electrode at the outermost layer, removing the film, and performing differential etching to obtain an N-turn coil inductor (108) with an L-shaped end electrode;

the seed layer in the step (1) is one of Cu, ti and Cu double-layer structure, ni and Sn, and the thickness is 1-3 mu m;

the method for forming the resin layer in the step (2) selects hot-pressing prepreg or printing photo-curing resin;

the width of the coil pattern in the steps (1) and (3) is 8-25 mu m;

the copper columns in the steps (2) and (4) are respectively interconnected with the upper layer of coils and the lower layer of coils;

the bottom coil and the top coil of the inductor (108) manufactured in the step (6) are respectively interconnected with two side end electrodes;

and (3) the number of turns of the inductance coil in the step (6) is N, wherein an odd layer is a coil, and an even layer is a copper column connected with the coil.

Images