CN114671614A - A kind of low dielectric and low loss calcium aluminum borosilicate glass-ceramic material and preparation method - Google Patents
A kind of low dielectric and low loss calcium aluminum borosilicate glass-ceramic material and preparation method Download PDFInfo
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- 239000006112 glass ceramic composition Substances 0.000 title claims abstract description 17
- 238000002360 preparation method Methods 0.000 title abstract description 6
- ULGYAEQHFNJYML-UHFFFAOYSA-N [AlH3].[Ca] Chemical compound [AlH3].[Ca] ULGYAEQHFNJYML-UHFFFAOYSA-N 0.000 title description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000005245 sintering Methods 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000010791 quenching Methods 0.000 claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 12
- 238000005469 granulation Methods 0.000 claims abstract description 11
- 230000003179 granulation Effects 0.000 claims abstract description 11
- 235000013619 trace mineral Nutrition 0.000 claims abstract description 11
- 239000011573 trace mineral Substances 0.000 claims abstract description 11
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 7
- 239000011575 calcium Substances 0.000 claims abstract description 7
- 238000002844 melting Methods 0.000 claims abstract description 7
- 230000008018 melting Effects 0.000 claims abstract description 7
- 230000000171 quenching effect Effects 0.000 claims abstract description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 5
- 239000010703 silicon Substances 0.000 claims abstract description 5
- 239000011521 glass Substances 0.000 claims description 47
- 239000000843 powder Substances 0.000 claims description 28
- 229910052593 corundum Inorganic materials 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 9
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 8
- 238000000498 ball milling Methods 0.000 claims description 8
- -1 calcium-aluminum-boron-silicon Chemical compound 0.000 claims description 8
- 239000008367 deionised water Substances 0.000 claims description 8
- 229910021641 deionized water Inorganic materials 0.000 claims description 8
- 229910052726 zirconium Inorganic materials 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052681 coesite Inorganic materials 0.000 claims description 4
- 229910052906 cristobalite Inorganic materials 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 229910052682 stishovite Inorganic materials 0.000 claims description 4
- 229910052905 tridymite Inorganic materials 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 2
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Inorganic materials [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 claims 5
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L calcium carbonate Substances [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims 3
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum oxide Inorganic materials [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 claims 3
- 229910000029 sodium carbonate Inorganic materials 0.000 claims 3
- 229910001845 yogo sapphire Inorganic materials 0.000 claims 3
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims 1
- 239000006063 cullet Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000000265 homogenisation Methods 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000009740 moulding (composite fabrication) Methods 0.000 claims 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 abstract description 10
- 239000000758 substrate Substances 0.000 abstract description 9
- 229910052796 boron Inorganic materials 0.000 abstract description 6
- 239000000919 ceramic Substances 0.000 abstract description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 229910052709 silver Inorganic materials 0.000 abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- 230000008054 signal transmission Effects 0.000 abstract description 3
- 239000004332 silver Substances 0.000 abstract description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 16
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 15
- 239000002241 glass-ceramic Substances 0.000 description 15
- 238000005516 engineering process Methods 0.000 description 8
- 238000004321 preservation Methods 0.000 description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 239000010431 corundum Substances 0.000 description 6
- 239000006060 molten glass Substances 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B19/00—Other methods of shaping glass
- C03B19/06—Other methods of shaping glass by sintering, e.g. by cold isostatic pressing of powders and subsequent sintering, by hot pressing of powders, by sintering slurries or dispersions not undergoing a liquid phase reaction
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C1/00—Ingredients generally applicable to manufacture of glasses, glazes, or vitreous enamels
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- Materials Engineering (AREA)
- Organic Chemistry (AREA)
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- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
本发明属于电子陶瓷及其制造领域,涉及一种低介低损钙铝硼硅基微晶玻璃材料及其制备方法。本发明通过对钙硼硅基微晶玻璃材料的原料组分以及比例的重大幅度调整,最终以钙、铝、硼和硅为基料,辅以BaCO3、P2O5,并微量添加CeO2、La2O3和Na2CO3作为微量元素,通过将原料熔融、水淬、造粒等工艺,即可在850~950℃的低温下烧结获得低介(εr=4~5)、低损(Tanδ<0.0006)的微晶玻璃陶瓷材料。其具有高信号传输速度,大大降低了功耗;烧结温度低(850℃~950℃),能很好的和低电阻率的银电极共烧,适用于制造低温共烧多层陶瓷基板,满足LTCC的工艺条件要求,且性能更佳,为高速电路的需求提供了更好的选择。
The invention belongs to the field of electronic ceramics and its manufacture, and relates to a low-dielectric and low-loss calcium-aluminum-borosilicate-based glass-ceramic material and a preparation method thereof. In the present invention, the raw material components and proportions of the calcium borosilicate-based glass-ceramic material are greatly adjusted, and finally calcium, aluminum, boron and silicon are used as the base materials, BaCO 3 and P 2 O 5 are supplemented, and CeO is added in a small amount. 2. As trace elements, La 2 O 3 and Na 2 CO 3 can be sintered at a low temperature of 850~950℃ to obtain low intermediary ( εr =4~5) by melting the raw materials, water quenching, granulation and other processes. , Low loss (Tanδ<0.0006) glass-ceramic material. It has high signal transmission speed, which greatly reduces power consumption; low sintering temperature (850 ℃ ~ 950 ℃), can well co-fire with low-resistivity silver electrodes, suitable for manufacturing low-temperature co-fired multi-layer ceramic substrates, satisfying The process conditions of LTCC are required, and the performance is better, which provides a better choice for the needs of high-speed circuits.
Description
技术领域technical field
本发明属于电子陶瓷及其制造领域,涉及一种低介电常数、低介电损耗钙铝硼硅基微晶玻璃材料及其制备方法。The invention belongs to the field of electronic ceramics and its manufacture, and relates to a low dielectric constant and low dielectric loss calcium-aluminum borosilicate-based glass-ceramic material and a preparation method thereof.
背景技术Background technique
随着电子产品对所使用的封装基板的各项性能的要求也越来越高,使得封装基板具有极大的研究价值。电子产品制造商不得不努力研究一种新型先进的集成、封装、互联技术。低温共烧陶瓷(Low Temperature Co-Fired Ceramic,LTCC)技术应运而生。LTCC技术是美国的休斯公司在上世纪80年代中期提出的一种能够将多层基板共烧的颠覆传统的工艺技术,由于其采用了新型、先进、独特的材料体系,能在较低温度(<950℃)下与低熔点、高导电率的金属导体(Ag,Au)共烧,并且其整套工艺难度较低,极大地提高了各类电子器件的运行性能以及元件的使用可靠性。As electronic products have higher and higher requirements for various properties of the packaging substrates used, the packaging substrates have great research value. Electronic product manufacturers have to work hard to develop a new advanced integration, packaging, interconnection technology. Low Temperature Co-Fired Ceramic (LTCC) technology came into being. LTCC technology is a subversive process technology proposed by Hughes Company in the United States in the mid-1980s that can co-fire multi-layer substrates. (<950°C) co-firing with metal conductors (Ag, Au) with low melting point and high conductivity, and the whole process is less difficult, which greatly improves the operating performance of various electronic devices and the reliability of components.
目前,LTCC技术在日本、美国等发达国家已经实现产业化。然而,在中国该技术仍处于起步阶段,在材料、系统和设备方面很少有自主知识产权。我国急需开发一系列具有自主知识产权的LTCC陶瓷材料和基板产品。低温烧结的低介电常数陶瓷材料可分为三类:微晶玻璃(也称玻璃陶瓷)、玻璃与陶瓷填料复合体系和非晶玻璃体系。近年来,人们对微晶玻璃进行了大量的研究,开发了许多低介电常数体系的玻璃。微晶玻璃是一种微晶体和玻璃相均匀分布的复合材料,由硼和硅组成的玻璃网状结构。许多LTCC用微晶玻璃是基于硼硅酸盐玻璃制备而成的,如CaO-B2O3-SiO2玻璃陶瓷。At present, LTCC technology has been industrialized in developed countries such as Japan and the United States. However, the technology is still in its infancy in China, and there are few independent intellectual property rights in materials, systems and equipment. my country urgently needs to develop a series of LTCC ceramic materials and substrate products with independent intellectual property rights. Low-dielectric constant ceramic materials sintered at low temperature can be divided into three categories: glass-ceramic (also called glass-ceramic), glass-ceramic filler composite system and amorphous glass system. In recent years, a lot of research has been done on glass-ceramics, and many glasses with low dielectric constant systems have been developed. Glass-ceramic is a composite material with uniform distribution of microcrystals and glass phases, and a glass network structure composed of boron and silicon. Many glass-ceramics for LTCC are based on borosilicate glasses, such as CaO-B2O3 - SiO2 glass - ceramics.
中国发明专利(申请号201110051412.4),由电子科技大学发明了一种电子基板用微晶玻璃材料,由CaO、B2O3、SiO2、P2O5、TiO2、ZrO2组成,各成分配比为CaCO333~50mol%、B2O3 12~30mol%、SiO230~50mol%、ZnO 0~2mol%、P2O5 0~2mol%、TiO2 0~2mol%、ZrO20~2mol%。该玻璃陶瓷材料的制备方法采用传统玻璃工艺,最后制备的玻璃陶瓷具有低介电常数(6.0~7.2,1MHz)和低介电损耗(tg<0.003,1MHz)且烧结温度较低(850~950℃),符合LTCC技术要求。Chinese invention patent (application number 201110051412.4 ) , a glass - ceramic material for electronic substrates was invented by the University of Electronic Science and Technology of China . The distribution ratio is CaCO 3 33-50 mol%, B 2 O 3 12-30 mol %, SiO 2 30-50 mol %, ZnO 0-2 mol %, P 2 O 5 0-2 mol %, TiO 2 0-2 mol %,
但是随着5G时代的到来,电子产品对封装基板性能的要求越来越高,当面对高速电路的低信号延迟需求时,我们需要尽可能降低材料的介电和电损性能。However, with the advent of the 5G era, electronic products have higher and higher requirements on the performance of packaging substrates. When facing the low signal delay requirements of high-speed circuits, we need to reduce the dielectric and electrical loss properties of materials as much as possible.
发明内容SUMMARY OF THE INVENTION
针对上述存在问题或不足,本发明提供了一种低介低损钙铝硼硅基微晶玻璃材料及制备方法,以满足当前行业对电子基板LTCC材料的更低介电常数和更低介电损耗的需求。In view of the above problems or deficiencies, the present invention provides a low-dielectric and low-loss calcium-aluminum-borosilicate-based glass-ceramic material and a preparation method, so as to meet the current industry requirements for lower dielectric constant and lower dielectric of electronic substrate LTCC materials loss demand.
一种低介低损钙铝硼硅基微晶玻璃材料,其原料组分为:18~28mol%的CaCO3、18~28mol%的B2O3、15~20mol%的SiO2、11~25mol%的Al2O3、8~12mol%的BaCO3、5~8mol%的P2O5和0~6mol%的微量元素;微量元素占比不取0,具体为:0~3mol%的CeO2、0~3mol%的La2O3和/或0~3mol%的Na2CO3。依次经熔融、水淬、造粒成型和烧结制得。A low-dielectric and low-loss calcium-aluminum-borosilicate-based glass-ceramic material, whose raw material components are: 18-28 mol% CaCO 3 , 18-28 mol % B 2 O 3 , 15-20 mol % SiO 2 , 11-28 mol % 25mol% of Al 2 O 3 , 8-12mol% of BaCO 3 , 5-8mol% of P 2 O 5 and 0-6mol% of trace elements; the proportion of trace elements does not take 0, specifically: 0-3mol% of CeO 2 , 0-3 mol % La 2 O 3 and/or 0-3 mol % Na 2 CO 3 . It is obtained by melting, water quenching, granulation and sintering in sequence.
其介电常数εr=4~5,介质损耗Tanδ<0.0006,具有高信号传输速度,大大降低了功耗;烧结温度850℃~950℃。Its dielectric constant ε r =4~5, dielectric loss Tanδ<0.0006, with high signal transmission speed, greatly reducing power consumption; sintering temperature is 850℃~950℃.
上述低介低损钙铝硼硅基微晶玻璃陶瓷材料,其制备方法如下:The preparation method of the above-mentioned low-dielectric and low-loss calcium-aluminum-borosilicate-based glass-ceramic material is as follows:
步骤1:将原料CaCO3、Al2O3、B2O3、SiO2、BaCO3、P2O5、CeO2、La2O3和Na2CO3按照配方进行备料。Step 1: Prepare raw materials CaCO 3 , Al 2 O 3 , B 2 O 3 , SiO 2 , BaCO 3 , P 2 O 5 , CeO 2 , La 2 O 3 and Na 2 CO 3 according to the formula.
原料配方为:18~28mol%的CaCO3、18~28mol%的B2O3、15~20mol%的SiO2、11~25mol%的Al2O3、8~12mol%的BaCO3、5~8mol%的P2O5和0~6mol%的微量元素。微量元素占比不取0,具体为:0~3mol%的CeO2、0~3mol%的La2O3和/或0~3mol%的Na2CO3。The raw material formula is: 18-28 mol% of CaCO 3 , 18-28 mol % of B 2 O 3 , 15-20 mol % of SiO 2 , 11-25 mol % of Al 2 O 3 , 8-12 mol % of BaCO 3 , 5- 8mol% of P2O5 and 0-6mol % of trace elements. The proportion of trace elements does not take 0, specifically: 0-3 mol% of CeO 2 , 0-3 mol% of La 2 O 3 and/or 0-3 mol% of Na 2 CO 3 .
步骤2:将步骤1所备料的全部粉体与锆球、去离子水球磨并烘干。Step 2: Ball mill all the powders prepared in
步骤3:将步骤2所得烘干粉体升温至1400~1500℃保温,以熔融均匀化。Step 3: The dried powder obtained in Step 2 is heated to 1400-1500° C. for heat preservation to melt and homogenize.
步骤4:将步骤3所得熔融均匀化的熔融物水淬得碎玻璃体。Step 4: Water-quench the melted and homogenized melt obtained in Step 3 to obtain broken glass bodies.
步骤5:将步骤4所得碎玻璃体经球磨再干燥后得到玻璃粉。Step 5: The broken glass body obtained in Step 4 is ball-milled and then dried to obtain glass powder.
步骤6:将步骤5所得玻璃粉体经造粒,压制成型后在850~950℃烧结并保温0.5~1小时即得微晶玻璃陶瓷材料。Step 6: The glass powder obtained in Step 5 is granulated, and after being pressed and formed, the glass-ceramic material is obtained by sintering at 850-950° C. and keeping the temperature for 0.5-1 hour.
进一步的,所述步骤2的烘干温度为80℃~110℃。Further, the drying temperature in step 2 is 80°C to 110°C.
进一步的,所述步骤6的玻璃粉体在压制成型后,先排胶再烧结保温。Further, after the glass powder in the step 6 is pressed and formed, the glue is removed first and then sintered for heat preservation.
本发明通过对钙硼硅基微晶玻璃材料的原料组分以及比例的重大幅度调整,最终以钙、铝、硼和硅为基料,辅以BaCO3、P2O5,并微量添加CeO2、La2O3和Na2CO3作为微量元素,通过将原料熔融、水淬、造粒等工艺,即可在850~950℃的低温下烧结获得低介、低损的微晶玻璃陶瓷材料。适用于LTCC的工艺条件要求,且性能更佳,为高速电路的需求提供了更好的选择。In the present invention, the raw material components and proportions of the calcium borosilicate-based glass-ceramic material are greatly adjusted, and finally calcium, aluminum, boron and silicon are used as the base materials, BaCO 3 and P 2 O 5 are supplemented, and CeO is added in a small amount. 2. La 2 O 3 and Na 2 CO 3 are used as trace elements, and low dielectric and low loss glass-ceramics can be obtained by sintering at a low temperature of 850-950 ° C by melting raw materials, water quenching, granulation and other processes. Material. It is suitable for the process conditions of LTCC and has better performance, providing a better choice for the needs of high-speed circuits.
本发明所制备的微晶玻璃材料具有以下特点:The glass-ceramic material prepared by the present invention has the following characteristics:
1.介电常数低(εr=4~5),介质损耗低(Tanδ<0.0006),具有高信号传输速度,大大降低了功耗。1. Low dielectric constant (ε r =4~5), low dielectric loss (Tanδ<0.0006), high signal transmission speed, and greatly reduced power consumption.
2.烧结温度低(850℃~950℃),能很好的和低电阻率的银电极共烧,适用于制造低温共烧多层陶瓷基板。2. The sintering temperature is low (850℃~950℃), which can co-fire well with the low resistivity silver electrode, and is suitable for the manufacture of low-temperature co-fired multilayer ceramic substrates.
附图说明Description of drawings
图1为实施例1~4的样品XRD衍射图谱。FIG. 1 is the XRD diffraction pattern of the samples of Examples 1-4.
具体实施方式Detailed ways
下面结合附图和实施例对本发明做进一步的详细说明。The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.
实施例1Example 1
按摩尔比CaCO3(28mol%)、Al2O3(11mol%)、B2O3(28mol%)、SiO2(15mol%)、BaCO3(10mol%)、P2O5(5mol%)、CeO2(3mol%)折算得到粉料的用量,按照计算所得的用量准确称取CaCO3、Al2O3、B2O3、SiO2、BaCO3、P2O5、CeO2。以料球水比例1:5:1.5球磨,烘干后装入刚玉坩埚,熔制玻璃(1400℃,保温1h),将熔融玻璃水淬得到透明的碎玻璃体。碎玻璃体经过湿法球磨(以去离子水、锆球为介质,时间2小时)后烘干得到玻璃粉体。经造粒(玻璃粉末与40%丙烯酸)后,在20MPa压力下干压成型得生片。所得生片在450℃排胶后,升温到950℃烧结并保温30分钟,即得到微晶玻璃,性能如表1所示。In molar ratios CaCO 3 (28 mol %), Al 2 O 3 (11 mol %), B 2 O 3 (28 mol %), SiO 2 (15 mol %), BaCO 3 (10 mol %), P 2 O 5 (5 mol %) , CeO 2 (3mol%) is converted to obtain the amount of powder, and CaCO 3 , Al 2 O 3 , B 2 O 3 , SiO 2 , BaCO 3 , P 2 O 5 , CeO 2 are accurately weighed according to the calculated amount. Ball mill with the ratio of material ball to water 1:5:1.5, put into corundum crucible after drying, melt glass (1400 ℃, heat preservation for 1h), quench the molten glass with water to obtain transparent broken glass body. The broken glass body is subjected to wet ball milling (with deionized water and zirconium balls as the medium for 2 hours) and then dried to obtain glass powder. After granulation (glass powder and 40% acrylic acid), dry pressing under 20MPa pressure to form green sheets. After debinding at 450° C., the obtained green sheet was heated to 950° C. for sintering and kept for 30 minutes to obtain glass-ceramics. The properties are shown in Table 1.
实施例2Example 2
按摩尔比CaCO3(28mol%)、Al2O3(11mol%)、B2O3(28mol%)、SiO2(15mol%)、BaCO3(10mol%)、P2O5(5mol%)、CeO2(3mol%)折算得到粉料的用量,按照计算所得的用量准确称取CaCO3、Al2O3、B2O3、SiO2、BaCO3、P2O5、CeO2。以料球水比例1:5:1.5球磨,烘干后装入刚玉坩埚,熔制玻璃(1400℃,保温2h),将熔融玻璃水淬得到透明的碎玻璃体。碎玻璃体经过湿法球磨(以去离子水、锆球为介质,时间2小时)后烘干得到玻璃粉体。经造粒(玻璃粉末与40%丙烯酸)后,在20MPa压力下干压成型得生片。所得生片在450℃排胶后,升温到850℃烧结并保温30分钟,即得到微晶玻璃,性能如表1所示。In molar ratios CaCO 3 (28 mol %), Al 2 O 3 (11 mol %), B 2 O 3 (28 mol %), SiO 2 (15 mol %), BaCO 3 (10 mol %), P 2 O 5 (5 mol %) , CeO 2 (3mol%) is converted to obtain the amount of powder, and CaCO 3 , Al 2 O 3 , B 2 O 3 , SiO 2 , BaCO 3 , P 2 O 5 , CeO 2 are accurately weighed according to the calculated amount. Ball milled at a ratio of 1:5:1.5 of material-to-ball to water, dried and put into a corundum crucible, melted into glass (1400 ° C, heat preservation for 2 h), and water-quenched the molten glass to obtain a transparent broken glass body. The broken glass body is subjected to wet ball milling (with deionized water and zirconium balls as the medium for 2 hours) and then dried to obtain glass powder. After granulation (glass powder and 40% acrylic acid), dry pressing under 20MPa pressure to form green sheets. The obtained green sheet was degummed at 450°C, then heated to 850°C for sintering and kept for 30 minutes to obtain glass-ceramics. The properties are shown in Table 1.
实施例3Example 3
按摩尔比CaCO3(20mol%)、Al2O3(17mol%)、B2O3(23mol%)、SiO2(17mol%)、BaCO3(12mol%)、P2O5(5mol%)、CeO2(3mol%)、Na2CO3(3mol%)折算得到粉料的用量,按照计算所得的用量准确称取CaCO3、Al2O3、B2O3、SiO2、BaCO3、P2O5、CeO2、Na2CO3。以料球水比例1:5:2球磨,烘干后装入刚玉坩埚,熔制玻璃(1400℃,保温2h),将熔融玻璃水淬得到透明的碎玻璃体。碎玻璃体经过湿法球磨(以去离子水、锆球为介质,时间2小时)后烘干得到玻璃粉体。经造粒(玻璃粉末与40%丙烯酸)后,在20MPa压力下干压成型得生片。所得生片在450℃排胶后,升温到900℃烧结并保温60分钟,即得到微晶玻璃,性能如表1所示。In molar ratios CaCO 3 (20 mol %), Al 2 O 3 (17 mol %), B 2 O 3 (23 mol %), SiO 2 (17 mol %), BaCO 3 (12 mol %), P 2 O 5 (5 mol %) , CeO 2 (3 mol%), Na 2 CO 3 (3 mol %) are converted to obtain the amount of powder, and according to the calculated amount, accurately weigh CaCO 3 , Al 2 O 3 , B 2 O 3 , SiO 2 , BaCO 3 , P 2 O 5 , CeO 2 , Na 2 CO 3 . Ball mill with the ratio of material ball to water 1:5:2, put into corundum crucible after drying, melt glass (1400 ℃, heat preservation 2h), quench the molten glass with water to obtain transparent broken glass body. The broken glass body is subjected to wet ball milling (with deionized water and zirconium balls as the medium for 2 hours) and then dried to obtain glass powder. After granulation (glass powder and 40% acrylic acid), dry pressing under 20MPa pressure to form green sheets. After debinding at 450°C, the obtained green sheet was heated to 900°C for sintering and kept for 60 minutes to obtain glass-ceramics. The properties are shown in Table 1.
实施例4Example 4
按摩尔比CaCO3(20mol%)、Al2O3(17mol%)、B2O3(23mol%)、SiO2(17mol%)、BaCO3(12mol%)、P2O5(5mol%)、La2O3(3mol%)、Na2CO3(3mol%)折算得到粉料的用量,按照计算所得的用量准确称取CaCO3、Al2O3、B2O3、SiO2、BaCO3、P2O5、La2O3、Na2CO3。以料球水比例1:5:2球磨,烘干后装入刚玉坩埚,熔制玻璃(1450℃,保温2h),将熔融玻璃水淬得到透明的碎玻璃体。碎玻璃体经过湿法球磨(以去离子水、锆球为介质,时间2小时)后烘干得到玻璃粉体。经造粒(玻璃粉末与40%丙烯酸)后,在20MPa压力下干压成型。生片在450℃排胶后,升温到900℃烧结并保温60分钟,即得到微晶玻璃,性能如表1所示。In molar ratios CaCO 3 (20 mol %), Al 2 O 3 (17 mol %), B 2 O 3 (23 mol %), SiO 2 (17 mol %), BaCO 3 (12 mol %), P 2 O 5 (5 mol %) , La 2 O 3 (3mol%), Na 2 CO 3 (3mol%) are converted to obtain the amount of powder, and accurately weigh CaCO 3 , Al 2 O 3 , B 2 O 3 , SiO 2 , BaCO according to the calculated amount 3. P 2 O 5 , La 2 O 3 , Na 2 CO 3 . Ball mill with the ratio of material ball to water 1:5:2, put into corundum crucible after drying, melt glass (1450 ℃, heat preservation 2h), quench the molten glass with water to obtain transparent broken glass body. The broken glass body is subjected to wet ball milling (with deionized water and zirconium balls as the medium for 2 hours) and then dried to obtain glass powder. After granulation (glass powder and 40% acrylic acid), it is dry-pressed under 20MPa pressure. After debinding at 450°C, the green sheet was heated to 900°C for sintering and kept for 60 minutes to obtain glass-ceramics. The properties are shown in Table 1.
实施例5Example 5
按摩尔比CaCO3(18mol%)、Al2O3(25mol%)、B2O3(18mol%)、SiO2(18mol%)、BaCO3(10mol%)、P2O5(8mol%)、La2O3(3mol%)折算得到粉料的用量,按照计算所得的用量准确称取CaCO3、Al2O3、B2O3、SiO2、BaCO3、P2O5、La2O3。以料球水比例1:5:2.5球磨,烘干后装入刚玉坩埚,熔制玻璃(1450℃,保温2h),将熔融玻璃水淬得到透明的碎玻璃体。碎玻璃体经过湿法球磨(以去离子水、锆球为介质,时间2小时)后烘干得到玻璃粉体。经造粒(玻璃粉末与40%丙烯酸)后,在20MPa压力下干压成型得生片。所得生片在450℃排胶后,升温到900℃烧结并保温60分钟,即得到微晶玻璃,性能如表1所示。In molar ratios CaCO 3 (18 mol %), Al 2 O 3 (25 mol %), B 2 O 3 (18 mol %), SiO 2 (18 mol %), BaCO 3 (10 mol %), P 2 O 5 (8 mol %) , La 2 O 3 (3mol%) is converted to obtain the amount of powder, and accurately weigh CaCO 3 , Al 2 O 3 , B 2 O 3 , SiO 2 , BaCO 3 , P 2 O 5 , La 2 according to the calculated amount O 3 . Ball mill with the ratio of material ball to water 1:5:2.5, put into corundum crucible after drying, melt glass (1450 ℃, heat preservation 2h), quench the molten glass with water to obtain transparent broken glass body. The broken glass body is subjected to wet ball milling (with deionized water and zirconium balls as the medium for 2 hours) and then dried to obtain glass powder. After granulation (glass powder and 40% acrylic acid), dry pressing under 20MPa pressure to form green sheets. After debinding at 450°C, the obtained green sheet was heated to 900°C for sintering and kept for 60 minutes to obtain glass-ceramics. The properties are shown in Table 1.
实施例6Example 6
按摩尔比CaCO3(18mol%)、Al2O3(25mol%)、B2O3(18mol%)、SiO2(20mol%)、BaCO3(8mol%)、P2O5(8mol%)、La2O3(3mol%)折算得到粉料的用量,按照计算所得的用量准确称取CaCO3、Al2O3、B2O3、SiO2、BaCO3、P2O5、La2O3。以料球水比例1:5:2.5球磨,烘干后装入刚玉坩埚,熔制玻璃(1500℃,保温3h),将熔融玻璃水淬得到透明的碎玻璃体。碎玻璃体经过湿法球磨(以去离子水、锆球为介质,时间2小时)后烘干得到玻璃粉体。经造粒(玻璃粉末与40%丙烯酸)后,在20MPa压力下干压成型得生片。所得生片在450℃排胶后,升温到950℃烧结并保温30分钟,即得到微晶玻璃,性能如表1所示。In molar ratios CaCO 3 (18 mol %), Al 2 O 3 (25 mol %), B 2 O 3 (18 mol %), SiO 2 (20 mol %), BaCO 3 (8 mol %), P 2 O 5 (8 mol %) , La 2 O 3 (3mol%) is converted to obtain the amount of powder, and accurately weigh CaCO 3 , Al 2 O 3 , B 2 O 3 , SiO 2 , BaCO 3 , P 2 O 5 , La 2 according to the calculated amount O 3 . Ball mill with the ratio of material ball to water 1:5:2.5, put into corundum crucible after drying, melt glass (1500 ℃, heat preservation 3h), quench the molten glass with water to obtain transparent broken glass body. The broken glass body is subjected to wet ball milling (with deionized water and zirconium balls as the medium for 2 hours) and then dried to obtain glass powder. After granulation (glass powder and 40% acrylic acid), dry pressing under 20MPa pressure to form green sheets. After debinding at 450° C., the obtained green sheet was heated to 950° C. for sintering and kept for 30 minutes to obtain glass-ceramics. The properties are shown in Table 1.
表1 各例中烧结样品的性能Table 1 Properties of sintered samples in each case
图1展示了本发明陶瓷材料在最佳烧结温度下保温4小时后的XRD衍射图谱,分别对应实施例样品1~4号。从图1可以看出,实施例1、2主晶相为CaAl2B2O7(ICSD 00-019-0205)。实施例3、4的主晶相为CaAl2(BO3)2O(ICSD 01-089-5563)。CaAl2B2O7晶粒呈长条状且致密,结晶越多,材料的介电性能越好。Figure 1 shows the XRD diffraction patterns of the ceramic material of the present invention after being kept at the optimum sintering temperature for 4 hours, corresponding to samples Nos. 1 to 4 of the embodiment respectively. It can be seen from FIG. 1 that the main crystal phase of Examples 1 and 2 is CaAl 2 B 2 O 7 (ICSD 00-019-0205). The main crystal phase of Examples 3 and 4 was CaAl 2 (BO 3 ) 2 O (ICSD 01-089-5563). The grains of CaAl 2 B 2 O 7 are elongated and dense, and the more crystals there are, the better the dielectric properties of the material.
通过以上实施例可见,本发明通过对钙硼硅基微晶玻璃材料的原料组分进行大幅度调整,最终以钙、铝、硼和硅为基料,辅以BaCO3、P2O5,并微量添加CeO2、La2O3和Na2CO3作为微量元素,通过传统的将原料熔融、水淬、造粒等工艺,即可在850~950℃的低温下烧结获得低介(εr=4~5)、低损(Tanδ<0.0006)的微晶玻璃陶瓷材料。不仅大大降低了功耗;且能很好的和低电阻率的银电极共烧,适用于LTCC的工艺条件要求,性能更佳,为高速电路的需求提供了更好的选择。It can be seen from the above examples that the present invention greatly adjusts the raw material components of the calcium borosilicate-based glass-ceramic material, and finally uses calcium, aluminum, boron and silicon as the base materials, supplemented by BaCO 3 and P 2 O 5 , And trace addition of CeO 2 , La 2 O 3 and Na 2 CO 3 as trace elements, through the traditional process of melting raw materials, water quenching, granulation, etc., can be sintered at a low temperature of 850 ~ 950 ℃ to obtain low dielectric (ε) r =4~5), low loss (Tanδ<0.0006) glass-ceramic material. Not only the power consumption is greatly reduced, but also it can co-fire well with the low-resistivity silver electrode, which is suitable for the process conditions of LTCC and has better performance, providing a better choice for the needs of high-speed circuits.
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