CN114649669A - Electronic device - Google Patents

Abstract

The application relates to an electronic device, including an NFC chip, including a first differential port and a second differential port; a metal casing, the metal casing includes a metal back cover and a metal frame connected to the metal back cover, and the metal back cover is provided with A hollow area, a first NFC radiator is arranged on the metal frame, and the first NFC radiator is insulated from other metal areas in the metal casing except the first NFC radiator; the second NFC radiator, the second NFC radiator The orthographic projection of the radiator on the metal back cover at least partially overlaps the hollow area; the third NFC radiator; wherein the first NFC radiator, the second NFC radiator and the third NFC radiator together form a differential current connecting the NFC chip loop, and the eddy current generated by the third NFC radiator on the metal back cover is at least partially blocked by the hollow area. The electronic device provided by the embodiments of the present application can improve the communication quality of the near field communication of the electronic device.

Description

Electronic equipment

technical field

The present application relates to the field of wireless communication technologies, and in particular, to an electronic device.

Background technique

With the rapid development of wireless communication technology, NFC (Near Field Communication, near field communication) has been deeply researched and widely used, and electronic devices using NFC technology can exchange data when they are close to each other.

Taking a mobile terminal as an example, after the NFC coil is installed in the mobile terminal, applications such as mobile payment, electronic ticketing, access control, mobile identity recognition, and anti-counterfeiting can be realized. At present, most mobile terminals will adopt the design of metal battery cover to improve the texture of the mobile terminal.

However, the above design of the metal battery cover may result in poor quality of near field communication of the mobile terminal.

SUMMARY OF THE INVENTION

The embodiment of the present application provides an electronic device, which can improve the communication quality of near field communication of the electronic device.

An electronic device comprising:

an NFC chip, including a first differential port and a second differential port;

A metal shell, the metal shell includes a metal back cover and a metal frame connected to the metal back cover, the metal back cover is provided with a hollow area, and the metal frame is provided with a first NFC radiator, so insulating arrangement between the first NFC radiator and other metal regions in the metal casing except the first NFC radiator;

A second NFC radiator, the orthographic projection of the second NFC radiator on the metal back cover at least partially overlaps with the hollow area, and one end of the second NFC radiator and one end of the first NFC radiator connection, the other end of the second NFC radiator is connected to the first differential port;

a third NFC radiator, one end of the third NFC radiator is connected to the other end of the first NFC radiator, and the other end of the third NFC radiator is connected to the second differential port;

Wherein, the first NFC radiator, the second NFC radiator and the third NFC radiator together form a differential current loop connecting the NFC chip, and the third NFC radiator is behind the metal Eddy currents generated on the cover are at least partially blocked by the hollowed-out regions.

The beneficial effects brought by the technical solutions provided in the embodiments of the present application include at least:

The electronic device in the embodiment of the present application includes an NFC chip, and the NFC chip includes a first differential port and a second differential port; a metal casing, the metal casing includes a metal back cover and a metal frame connected to the metal back cover, and the metal back cover is provided with A hollow area, a first NFC radiator is arranged on the metal frame, and the first NFC radiator is insulated from other metal areas in the metal casing except the first NFC radiator; the second NFC radiator, the second NFC radiator The orthographic projection of the radiator on the metal back cover at least partially overlaps the hollow area, one end of the second NFC radiator is connected to one end of the first NFC radiator, and the other end of the second NFC radiator is connected to the first differential port; the third NFC radiator, one end of the third NFC radiator is connected to the other end of the first NFC radiator, and the other end of the third NFC radiator is connected to the second differential port; wherein the first NFC radiator, the second NFC radiator and the The third NFC radiator together forms a differential current loop connecting the NFC chip, and the eddy current generated by the third NFC radiator on the metal back cover is at least partially blocked by the hollow area; in this way, during the near field communication process of the electronic device, first , because the first NFC radiator is arranged on the metal frame, and the NFC coil is not pressed under the metal back cover in the traditional technology, the metal back cover of the embodiment of the present application has no electromagnetic shielding effect on the first NFC radiator, and the metal back cover has no electromagnetic shielding effect on the first NFC radiator. The back cover will not be stimulated by the working current in the first NFC radiator to induce reverse eddy current to weaken the working current, so the quality of the near field communication of the electronic device can be improved; Insulation is provided between other metal areas except the first NFC radiator. Even if the other metal areas in the metal casing are grounded, the first NFC radiator will not be grounded, so that the first NFC radiation caused by grounding can be avoided. Therefore, the quality of the near field communication of the electronic device can be improved; in addition, since the orthographic projection of the second NFC radiator on the metal back cover at least partially overlaps with the hollow area, the magnetic field lines of the second NFC radiator It can radiate through the hollow area without being blocked by the metal back cover, which improves the radiation performance of the second NFC radiator, so the communication quality of the near field communication of the electronic device can be improved; The reverse eddy current is excited on the metal back cover, but since the metal back cover is provided with a hollow area, the eddy current generated by the third NFC radiator on the metal back cover is at least partially blocked by the hollow area, so that the reverse eddy current is behind the metal The reverse magnetic field generated on the cover will be greatly weakened, and the effective magnetic field of the third NFC radiator will be restored, so the communication quality of the near field communication of the electronic device can be improved; in this embodiment of the present application, the first NFC radiator and the second NFC The radiator and the third NFC radiator simultaneously improve the communication quality of the near field communication of the electronic device, and effectively ensure the smooth progress of the near field communication of the electronic device.

Description of drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that are used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

FIG. 1 is a schematic diagram of a hollow arrangement of a metal battery cover of a mobile terminal in a conventional technology;

2 is a schematic diagram of a metal battery cover and an NFC coil of a mobile terminal connected in series in a conventional technology;

3 is a schematic diagram of the internal structure of an electronic device in an embodiment of the application;

4 is a schematic diagram of an exemplary arrangement position of the first NFC radiator in the upper metal frame in another embodiment of the present application;

5 is a schematic diagram of an exemplary arrangement position of the first NFC radiator in the upper metal frame according to another embodiment of the present application;

6 is a schematic diagram of an exemplary arrangement position of the first NFC radiator in the upper metal frame according to another embodiment of the present application;

FIG. 7 is a schematic diagram of an exemplary arrangement position of the first NFC radiator in the upper metal frame according to another embodiment of the present application;

8 is a schematic diagram of the internal structure of an electronic device in another embodiment of the present application;

FIG. 9 is a schematic diagram of the arrangement position of the flexible circuit board in another embodiment of the present application.

Description of reference numbers:

NFC chip: 100; metal back cover: 200; metal frame: 300; first NFC radiator: 400; first feeding point: 410; second feeding point: 420; second NFC radiator: 500; third NFC radiator: 600.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present application more clearly understood, the present application will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.

Unless otherwise defined, all technical and scientific terms used in the embodiments of the present application have the same meaning as commonly understood by those skilled in the technical field belonging to the embodiments of the present application. In the embodiments of the present application, the terms used in the description of the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the embodiments of the present application.

It can be understood that the terms "first", "second", etc. used in the embodiments of the present application may be used to describe various elements in the embodiments of the present application, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, a first resistance may be referred to as a second resistance, and similarly, a second resistance may be referred to as a first resistance, without departing from the scope of the embodiments of the present application. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

It can be understood that the "connection" in the following embodiments should be understood as "electrical connection", "communication connection", etc. if the connected circuits, modules, units, etc. have electrical signals or data transmission between them.

As used herein, the singular forms "a," "an," and "/the" can include the plural forms as well, unless the context clearly dictates otherwise. It should also be understood that the terms "comprising/comprising" or "having" etc. designate the presence of stated features, integers, steps, operations, components, parts or combinations thereof, but do not preclude the presence or addition of one or more Possibilities of other features, integers, steps, operations, components, parts or combinations thereof.

With the rapid development of wireless communication technology, NFC (Near Field Communication, near field communication) has been deeply researched and widely used, and electronic devices using NFC technology can exchange data when they are close to each other.

Taking a mobile terminal as an example, after the NFC coil is installed in the mobile terminal, applications such as mobile payment, electronic ticketing, access control, mobile identity recognition, and anti-counterfeiting can be realized. In the related art, the NFC coil is usually pressed under the battery cover of the mobile terminal, the non-metallic battery cover has little effect on the magnetic field of the NFC coil, and the NFC coil has sufficient magnetic field strength to ensure the communication quality of the near field communication of the mobile terminal.

But at present, most mobile terminals use the design of metal battery cover to improve the texture of the mobile terminal. The design of metal battery cover will lead to a significant decrease in the inductance of the NFC coil, and the Q value (Quality-value, quality factor) ) is reduced, and when the NFC coil is working, the working current in the NFC coil will excite an eddy current on the metal battery cover, and the direction of the eddy current is opposite to the working current of the NFC coil, thereby forming a reverse magnetic field, which affects the operation of the NFC coil. The current is weakened, which causes the communication quality of the near field communication of the mobile terminal to be greatly degraded, or even impossible to communicate.

In the related art, when the mobile terminal adopts the design of the metal battery cover, in order to improve the communication quality of the near field communication of the mobile terminal, there are the following two solutions:

1) Please refer to Figure 1. Partially or completely hollow out the NFC coil in the projection area of the metal battery cover (the hollowed area is the part indicated by the reference mark "3" in Figure 1), so that the reference mark "3" in Figure 1 The eddy current on the metal battery cover shown in 2" is blocked, the direction of the eddy current changes, and the magnetic field lines generated by the NFC coil can radiate outward through the hollow area, thereby improving the communication quality of the near field communication of the mobile terminal.

2) Referring to Figure 2, the NFC coil is connected in series with the metal battery cover, so that the metal battery cover can be used as a part of the NFC coil, thereby reducing the generation of eddy currents and improving the communication quality of the near field communication of the mobile terminal.

However, the disadvantages of the first solution above are: the opening on the metal battery cover affects the integrity of the metal battery cover, and the appearance is poor; the second solution has the disadvantage that the NFC coil is connected in series with the metal battery cover. The assembly process is very complicated, and the NFC coil has a weak current passing through the metal battery cover when it is working, which has safety problems. In addition, if the metal battery cover is grounded, the working current in the NFC coil will flow to the ground, and the performance of the NFC coil will be greatly lost. , unable to meet the quality requirements of near field communication.

In view of this, embodiments of the present application provide an electronic device, the electronic device includes an NFC chip, including a first differential port and a second differential port; a metal casing, the metal casing includes a metal back cover and a metal back cover connected to the metal back cover a frame, a hollow area is set on the metal back cover, a first NFC radiator is set on the metal frame, and the first NFC radiator is insulated from other metal areas in the metal casing except the first NFC radiator; Two NFC radiators, the orthographic projection of the second NFC radiator on the metal back cover at least partially overlaps the hollow area, one end of the second NFC radiator is connected to one end of the first NFC radiator, and the other end of the second NFC radiator is connected to the first differential port; a third NFC radiator, one end of the third NFC radiator is connected to the other end of the first NFC radiator, and the other end of the third NFC radiator is connected to the second differential port; wherein the first NFC radiator The body, the second NFC radiator and the third NFC radiator together form a differential current loop connecting the NFC chip, and the eddy current generated by the third NFC radiator on the metal back cover is at least partially blocked by the hollow area; In the process of near field communication, firstly, since the first NFC radiator is arranged on the metal frame, instead of the NFC coil being pressed under the metal back cover in the traditional technology, the metal back cover of the embodiment of the present application is not suitable for the first NFC radiator. The radiator has no electromagnetic shielding effect, and the metal back cover will not be stimulated by the working current in the first NFC radiator to induce a reverse eddy current to weaken the working current, so the quality of the near field communication of the electronic device can be improved; The NFC radiator is insulated from other metal areas in the metal casing except the first NFC radiator. Even if the other metal areas in the metal casing are grounded, the first NFC radiator will not be grounded, which can avoid Due to the loss of the working current in the first NFC radiator caused by grounding, the quality of the near field communication of the electronic device can be improved; furthermore, since the orthographic projection of the second NFC radiator on the metal back cover at least partially overlaps with the hollow area, In this way, the magnetic field lines of the second NFC radiator can radiate through the hollow area without being blocked by the metal back cover, which improves the radiation performance of the second NFC radiator, thus improving the communication quality of the near field communication of the electronic device; The three NFC radiators will excite a reverse eddy current on the metal back cover during operation, but since the metal back cover is provided with a hollow area, the eddy current generated by the third NFC radiator on the metal back cover is at least partially blocked by the hollow area. In this way, the reverse magnetic field generated by the reverse eddy current on the metal back cover will be greatly weakened, and the effective magnetic field of the third NFC radiator will be restored, so the communication quality of the near-field communication of the electronic device can be improved; An NFC radiator, a second NFC radiator and a third NFC radiator simultaneously improve the communication quality of the near field communication of the electronic device, and effectively ensure the smooth progress of the near field communication of the electronic device.

In addition, in the technical solutions provided by the embodiments of the present application, since the first NFC radiator is insulated from other metal regions in the metal casing except the first NFC radiator, when the first NFC radiator is working, the There is no current on the metal back cover of the electronic device, which improves the use safety of the electronic device.

In order to facilitate the understanding of the embodiments of the present application, the embodiments of the present application will be described more fully below with reference to the related drawings. Examples of embodiments of the present application are presented in the accompanying drawings. However, the embodiments of the present application may be implemented in many different forms, and are not limited to the embodiments described in the embodiments of the present application. Rather, these embodiments are provided so that the disclosure of the embodiments of the present application will be thorough and complete.

Referring to FIG. 3 , an embodiment of the present application provides an electronic device including an NFC chip 100 , a metal casing, a first NFC radiator 400 , a second NFC radiator 500 and a third NFC radiator 600 .

The NFC chip 100 includes a first differential port and a second differential port.

The metal casing includes a metal back cover 200 and a metal frame 300 connected to the metal back cover 200. The electronic device may be a mobile terminal such as a mobile phone or a tablet computer. The metal frame 300 may refer to the middle frame of the electronic device. The back cover 200 and the metal frame 300 may be integrally formed, or of course, may be assembled and connected.

A first NFC radiator 400 is disposed on the metal frame 300, and the first NFC radiator 400 is insulated from other metal areas in the metal casing except the first NFC radiator 400. The first NFC radiator 400 is used for for transmitting NFC signals.

The metal frame 300 may include an upper metal frame 300 on the top of the electronic device, a lower metal frame 300 on the bottom of the electronic device, and two side metal frames 300 on both sides of the electronic device. In this embodiment of the present application, the first NFC radiator 400 may be disposed in the upper metal frame 300. Several exemplary ways of setting the first NFC radiator 400 in the upper metal frame 300 will be described in detail in the following embodiments. .

In this way, since there will be a working current in the first NFC radiator 400 during the near field communication of the electronic device, by arranging the first NFC radiator 400 in the upper metal frame 300 of the electronic device, when the user holds the electronic device, touch the The probability of hitting the first NFC radiator 400 is small, which ensures the use safety of the electronic device.

Of course, in other optional embodiments, the first NFC radiator 400 may also be located in the lower metal frame 300 or the side metal frame 300 of the electronic device, which is not specifically limited herein.

The material of the first NFC radiator 400 may be the same as that of the metal frame 300 , that is, both are made of metal. The first NFC radiator 400 may be rectangular, or may have other regular or irregular shapes.

In the embodiment of the present application, the length of the first NFC radiator 400 may be greater than or equal to 30 mm, because the inventor of the present application found through a large number of experiments during the research and development process that the length of the first NFC radiator 400 is greater than or equal to 30 mm It can meet the quality requirements of near field communication of electronic equipment and ensure the reliability of near field communication of electronic equipment.

One end of the second NFC radiator 500 is connected to one end of the first NFC radiator 400 , the other end of the second NFC radiator 500 is connected to the first differential port, and the second NFC radiator 500 is used for transmitting NFC signals.

The second NFC radiator 500 may be a rectangle, or other regular or irregular shapes. Taking the second NFC radiator 500 as a rectangle as an example, one end of the first NFC radiator 400 may be connected to the second NFC radiator 500 One short side is connected, and the first differential port can be connected with the other short side of the second NFC radiator 500 .

The metal back cover 200 is provided with a hollow area. The orthographic projection of the second NFC radiator 500 on the metal back cover 200 at least partially overlaps with the hollow area. For example, the second NFC radiator 500 may be at least partially pressed under the camera assembly, for example, at least partially pressed between the camera assembly and the device body of the electronic device. Since the camera assembly is exposed to the metal casing, specifically the metal back cover 200 is exposed, that is, the camera assembly is not covered by the metal back cover 200 , therefore, during the near field communication of the electronic device, the magnetic field lines of the second NFC radiator 500 It can radiate through the camera assembly without being blocked by the metal back cover 200, so that the radiation performance can be improved, and the communication quality of the near field communication of the electronic device can be improved.

In addition, since the hollow area is the opening area where the camera assembly of the electronic device is exposed to the metal casing, that is, in the embodiment of the present application, it is not necessary to make a slit on the metal back cover 200 of the electronic device, and the metal back cover 200 is improved. Aesthetics.

Of course, the hollow area can also be an opening on the metal back cover 200 specially opened for exposing the magnetic field lines of the second NFC radiator 500 , and the specific arrangement of the hollow area is not limited herein.

In the embodiment of the present application, the width of the second NFC radiator 500 may be greater than or equal to 6 mm, and the length of the second NFC radiator 500 may be greater than or equal to 30 mm. This is because the inventor of the present application has passed a large number of experiments during the research and development process It is found that the size of the second NFC radiator 500 can meet the quality requirements of the near field communication of the electronic device and ensure the reliability of the near field communication of the electronic device.

One end of the third NFC radiator 600 is connected to the other end of the first NFC radiator 400 , the other end of the third NFC radiator 600 is connected to the second differential port, and the third NFC radiator 600 is used for transmitting NFC signals.

In this embodiment of the present application, the orthographic projection area of the third NFC radiator 600 in the metal back cover 200 is a metal area. For example, the third NFC radiator 600 may be disposed between the metal back cover 200 and the device body of the electronic device. between.

In a possible embodiment, the second NFC radiator 500 and the third NFC radiator 600 are both NFC coils; in another possible embodiment, the second NFC radiator 500 and the third NFC radiator 600 Both are wires. By setting both the second NFC radiator 500 and the third NFC radiator 600 as wires, the cost of the electronic device can be reduced, which is beneficial to cost control.

The shape of the third NFC radiator 600 is not specifically limited herein, for example, the third NFC radiator 600 may be a rectangle, or may be other regular or irregular shapes.

The first NFC radiator 400 , the second NFC radiator 500 and the third NFC radiator 600 together form a differential current loop connecting the NFC chip 100 , and the eddy current generated by the third NFC radiator 600 on the metal back cover 200 is at least Partially blocked by the cutout area.

In this way, although the third NFC radiator 600 is pressed under the metal back cover 200 , the third NFC radiator 600 will excite a reverse eddy current on the metal back cover 200 during operation, however, due to the setting of the metal back cover 200 There is a hollow area, and the third NFC radiator 600 excites a reverse eddy current on the metal back cover 200. Due to the blocking of the hollow area, the direction of the eddy current changes. Therefore, the reverse eddy current generates a reverse magnetic field on the metal back cover 200. will be greatly weakened, and then the effective magnetic field of the third NFC radiator 600 is restored, which ensures the communication quality of the near field communication of the electronic device.

In the process of near field communication of the electronic device provided by the above embodiment, first, since the first NFC radiator 400 is arranged on the metal frame 300, instead of the NFC coil being pressed under the metal back cover 200 in the traditional technology, the The metal back cover 200 of the application embodiment has no electromagnetic shielding effect on the first NFC radiator 400, and the metal back cover 200 will not be stimulated by the working current in the first NFC radiator 400 to induce a reverse eddy current to weaken the working current. Therefore, The quality of the near field communication of the electronic device can be improved; secondly, due to the insulating arrangement between the first NFC radiator 400 and other metal areas in the metal casing except the first NFC radiator 400, even if the other metal areas in the metal casing are insulated The metal area is grounded, and the first NFC radiator 400 will not be grounded, so that the loss of the working current in the first NFC radiator 400 due to grounding can be avoided, so the quality of the near field communication of the electronic device can be improved; The orthographic projections of the two NFC radiators 500 on the metal back cover 200 at least partially overlap with the hollow area, so that the magnetic field lines of the second NFC radiator 500 can radiate through the hollow area without being blocked by the metal back cover 200 , which improves the The radiation performance of the second NFC radiator 500 can improve the communication quality of the near field communication of the electronic device; in addition, the third NFC radiator 600 will excite a reverse eddy current on the metal back cover 200 during operation, but due to the metal back cover A hollow area is provided on the metal back cover 200, and the eddy current generated by the third NFC radiator 600 on the metal back cover 200 is at least partially blocked by the hollow area, so that the reverse magnetic field generated by the reverse eddy current on the metal back cover 200 will be greatly weakened, The effective magnetic field of the third NFC radiator 600 is restored, so the communication quality of the near field communication of the electronic device can be improved; in this embodiment of the present application, the first NFC radiator 400 , the second NFC radiator 500 and the third NFC radiator 600 are arranged At the same time, the communication quality of the electronic device near field communication is improved, and the smooth progress of the electronic device near field communication is effectively ensured.

In addition, in the technical solutions provided by the embodiments of the present application, in the case where the hollow area is the opening area where the camera assembly of the electronic device is exposed to the metal casing, it is not necessary to make a slit on the metal back cover 200 of the electronic device, but a combination of The structure of the metal casing itself, without affecting the appearance of the metal back cover 200, significantly improves the performance of the near field communication of the electronic device, and ensures the communication quality of the near field communication of the electronic device; the structure of the technical solution provided by the embodiment of the present application And the process is simple, only the area of the NFC coil is adjusted and a section of the radiator is shared (the first NFC radiator 400 can also be used as a WiFi radiator or a cellular antenna in actual application scenarios), which can reduce costs; due to the first NFC radiation Due to the insulating arrangement of the body 400, when the first NFC radiator 400 is working, there will be no current on the metal back cover 200 of the electronic device, which improves the security of the electronic device.

Hereinafter, several exemplary arrangements of the first NFC radiator 400 in the upper metal frame 300 will be described.

In the embodiment of the present application, an insulating gap exists between the first NFC radiator 400 and other metal regions in the metal casing except the first NFC radiator 400 .

As mentioned above, the first NFC radiator 400 may be disposed in the upper metal frame 300, or may be disposed in the lower metal frame 300 or the side metal frame 300 of the electronic device. The first NFC radiator 400 may be rectangular, or may be Take other regular or irregular shapes.

In the following, the shape of the first NFC radiator 400 is a rectangle and the first NFC radiator 400 is located in the upper metal frame 300 of the electronic device as an example. The setting method in the frame 300 will be introduced.

In a possible implementation manner, the first NFC radiator 400 is completely suspended in the upper metal frame 300 , that is, the above-mentioned insulating gap surrounds the first NFC radiator 400 , and the first NFC radiator 400 is connected to the metal shell. Other metal regions in the body except the first NFC radiator 400 are completely isolated.

Optionally, please refer to FIG. 4 , FIG. 4 is a schematic diagram of an exemplary arrangement position of the first NFC radiator 400 in the upper metal frame 300 . The length of the first NFC radiator 400 is smaller than the length of the upper metal frame 300 , and the width of the first NFC radiator 400 is smaller than the width of the upper metal frame 300 ; the first NFC radiator 400 is arranged in the middle of the upper metal frame 300 , exemplarily, the center line of the first NFC radiator 400 coincides with the center line of the upper metal frame 300 .

In the embodiment shown in FIG. 4 , the insulating gap surrounding the first NFC radiator 400 is in contact with the four sides of the first NFC radiator 400 , and all the insulating gaps are located in the upper metal frame 300 .

Optionally, please refer to FIG. 5 , which is another exemplary schematic diagram of the arrangement position of the first NFC radiator 400 in the upper metal frame 300 . The length of the first NFC radiator 400 is smaller than the length of the upper metal frame 300, and the width of the first NFC radiator 400 is smaller than the width of the upper metal frame 300; the first NFC radiator 400 is disposed on the upper metal frame 300 close to the electronic The position of the screen of the device, for example, as shown in FIG. 5 , one long side of the first NFC radiator 400 may coincide with the side a of the upper metal frame 300 (side a is the side connecting the upper metal frame 300 and the screen) , because there is an inherent insulating layer between the edge a of the upper metal frame 300 and the screen, that is, the first NFC radiator 400 will not be grounded through the screen, and the screen will not block the first NFC radiator 400, so it will not affect the first NFC radiator 400. The NFC radiator 400 radiates magnetic lines of force outward, so the connection between the first NFC radiator 400 and the screen will not affect the performance of the first NFC radiator 400 .

In the embodiment shown in FIG. 5 , the insulating gap surrounding the first NFC radiator 400 is connected to the three sides of the first NFC radiator 400 (that is, excluding the long side where the first NFC radiator 400 is connected to the screen) ) are connected, and the insulating gaps are all located in the upper metal frame 300 .

Optionally, please refer to FIG. 6 , FIG. 6 is a schematic diagram of another exemplary arrangement position of the first NFC radiator 400 in the upper metal frame 300 . The length of the first NFC radiator 400 is smaller than the length of the upper metal frame 300, and the width of the first NFC radiator 400 is equal to the width of the upper metal frame 300, so that a long side of the first NFC radiator 400 can be Screen connection of electronic devices.

In the embodiment shown in FIG. 6 , the insulating gap surrounding the first NFC radiator 400 is connected to the three sides of the first NFC radiator 400 (that is, excluding the long side where the first NFC radiator 400 is connected to the screen) ), wherein the insulating gaps connected to the two short sides of the first NFC radiator 400 are located in the upper metal frame 300 (ie, the insulating gaps shown in FIG. An insulating gap whose long sides meet is located in the metal back cover 200 (the insulating gap is not shown in FIG. 6 ).

It should be noted that the manner in which the first NFC radiator 400 is completely suspended in the upper metal frame 300 is not limited to the above exemplary embodiment. For example, the entire upper metal frame 300 may also be used as the first NFC radiator 400 . Insulation gaps are located in the two side metal frames 300 and the metal back cover 200 of the electronic device to isolate the upper metal frame 300 from the two side metal frames 300 and the metal back cover 200, and so on.

In the case where the first NFC radiator 400 is completely suspended in the upper metal frame 300, the first NFC radiator 400 is completely ungrounded, which can ensure a good clearance environment for radiation, which greatly improves the efficiency of near field communication of electronic devices. quality.

In another possible implementation, the first NFC radiator 400 is partially suspended in the metal frame 300 , that is, the first NFC radiator 400 is partially grounded. For example, one edge of the first NFC radiator 400 is connected to other metal areas in the metal casing except the first NFC radiator 400 , and the remaining edge of the first NFC radiator 400 is connected to other metal areas around the first NFC radiator 400 . There are insulating gaps between metal regions, etc.

Exemplarily, please refer to FIG. 7 , FIG. 7 is another exemplary schematic diagram of the arrangement position of the first NFC radiator 400 in the upper metal frame 300 . A part of one side of the first NFC radiator 400 is connected to other metal regions in the upper metal frame 300 except for the first NFC radiator 400 through the connector shown in FIG. 7 , and the connector may be a metal connector, An insulating gap exists between the rest of the periphery of the first NFC radiator 400 and other metal regions around the first NFC radiator 400 .

It should be noted that the manner in which the first NFC radiator 400 is partially suspended in the metal frame 300 is not limited to the above exemplary embodiment, for example, only two or three sides of the first NFC radiator 400 may be Connect with other metal areas in the metal housing except the first NFC radiator 400, and so on.

In the case where the first NFC radiator 400 is partially suspended in the metal frame 300, the first NFC radiator 400 is partially grounded, although compared with the embodiment in which the first NFC radiator 400 is not grounded at all, a certain communication quality may be affected. However, compared with the embodiment in which the entire metal back cover 200 is completely grounded when the entire metal back cover 200 is used as the NFC coil, the partial grounding of the first NFC radiator 400 can still improve the quality of the near field communication of the electronic device.

As an embodiment, the insulating gap mentioned above is filled with an insulating medium, for example, the insulating medium may be plastic, which can improve the insulation reliability between the first NFC radiator 400 and other surrounding metal regions.

In this way, due to the insulating arrangement between the first NFC radiator 400 and other metal areas in the metal casing except the first NFC radiator 400, even if the other metal areas in the metal casing are grounded, the first NFC radiator 400 It is also not grounded, so that the loss of the working current in the first NFC radiator 400 due to grounding can be avoided, so the quality of the near field communication of the electronic device can be improved.

In one embodiment, based on the electronic device described in any of the above embodiments, referring to FIG. 8 , the first NFC radiator 400 in this embodiment of the present application is provided with a first feeding point 410 and a second feeding point 420 , and the first One end of the two NFC radiators 500 is connected to one end of the first NFC radiator 400 through the first feeding point 410 , and one end of the third NFC radiator 600 is connected to the other end of the first NFC radiator 400 through the second feeding point 420 .

In this way, the first NFC radiator 400 , the second NFC radiator 500 and the third NFC radiator 600 together form a differential current loop connecting the NFC chip 100 . The three NFC radiators 600 simultaneously improve the communication quality of the near field communication of the electronic device, and effectively ensure the smooth progress of the near field communication of the electronic device.

In the embodiment of the present application, the second NFC radiator 500 and the third NFC radiator 600 may be printed on a flexible circuit board (FPC) together, and the orthographic projection of the flexible circuit board on the metal back cover 200 At least partially overlaps the cutout area.

Exemplarily, referring to FIG. 9 , the second NFC radiator 500 may be printed on the portion where the orthographic projection of the flexible circuit board on the metal back cover 200 overlaps the hollow area, and the third NFC radiator 600 may be printed on the flexible circuit board. on the other part except the overlapping part.

The second NFC radiator 500 and the third NFC radiator 600 printed on the flexible circuit board can be connected to the first NFC radiator 400 through PCB traces (specifically, through the first feeding point 410 and the second feeding point 420 ). connected to the first NFC radiator 400 ), and can be connected to the NFC chip 100 through PCB traces, thereby forming a differential current loop for near field communication of electronic devices.

In this way, in this embodiment of the present application, the first NFC radiator 400 , the second NFC radiator 500 and the third NFC radiator 600 are connected to the NFC radiator as an electronic device. Based on the eddy current generation mechanism and the direction of the eddy current, by changing the metal back cover 200, and introduce a section of radiators (the first NFC radiator 400 and the second NFC radiator 500) to ensure communication quality.

As an embodiment, an inductor component is connected in series between one end of the third NFC radiator 600 and the other end of the first NFC radiator 400 .

As mentioned above, most mobile terminals use the design of the metal battery cover to improve the texture of the mobile terminal, but the design of the metal battery cover will greatly reduce the inductance of the NFC coil and reduce the Q value. In view of this, in the embodiment of the present application, an inductance component is connected in series between one end of the third NFC radiator 600 and the other end of the first NFC radiator 400, so as to improve the inductance of the third NFC radiator 600, thereby further improving the electronic device communication quality of near field communication.

As an embodiment, an inductance component is also connected in series between the second NFC radiator 500 and one end of the first NFC radiator 400, so as to increase the inductance of the second NFC radiator 500, thereby further improving the near field of the electronic device The communication quality of the communication.

The technical features of the above embodiments can be combined arbitrarily. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features It is considered to be the range described in this specification.

The above-mentioned embodiments only represent several embodiments of the present application, and the descriptions thereof are relatively specific and detailed, but should not be construed as a limitation on the scope of the patent of the present application. It should be pointed out that for those skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the scope of protection of the present application should be determined by the appended claims.

Claims (10)

1. An electronic device, comprising:

an NFC chip comprising a first differential port and a second differential port;

the NFC antenna comprises a metal shell, a first NFC radiator and a second NFC radiator, wherein the metal shell comprises a metal rear cover and a metal frame connected with the metal rear cover, a hollow area is arranged on the metal rear cover, the metal frame is provided with the first NFC radiator, and the first NFC radiator and other metal areas except the first NFC radiator in the metal shell are arranged in an insulating mode;

a second NFC radiator, wherein at least part of an orthographic projection of the second NFC radiator on the metal rear cover is overlapped with the hollowed-out area, one end of the second NFC radiator is connected with one end of the first NFC radiator, and the other end of the second NFC radiator is connected to the first differential port;

one end of the third NFC radiator is connected with the other end of the first NFC radiator, and the other end of the third NFC radiator is connected to the second differential port;

wherein the first NFC radiator, the second NFC radiator, and the third NFC radiator form a differential current loop that connects the NFC chip together, and an eddy current generated by the third NFC radiator on the metal rear cover is at least partially blocked by the hollowed-out region.

2. The electronic device of claim 1, wherein an insulating gap exists between the first NFC radiator and other metal regions of the metal housing except for the first NFC radiator, and the insulating gap surrounds the first NFC radiator.

3. The electronic device of claim 2, wherein the insulating gap is filled with an insulating medium.

4. The electronic device of claim 1, wherein the first NFC radiator has a first feed point and a second feed point disposed therein, wherein the second NFC radiator has one end connected to one end of the first NFC radiator via the first feed point, and wherein the third NFC radiator has one end connected to the other end of the first NFC radiator via the second feed point.

5. The electronic device of claim 1, wherein the hollowed-out area is an open area for exposing the metal shell for a camera component of the electronic device.

6. The electronic device of claim 1, wherein a projected area of the third NFC radiator in the metal back cover is a metal area.

7. The electronic device of claim 1, wherein the second NFC radiator and the third NFC radiator are both NFC coils.

8. The electronic device of claim 1, wherein the second NFC radiator and the third NFC radiator are both conductive wires.

9. The electronic device of claim 1, wherein the metal bezel comprises an upper metal bezel, and wherein the first NFC radiator is disposed in the upper metal bezel.

10. The electronic device of claim 1, wherein an inductive element is connected in series between one end of the third NFC radiator and the other end of the first NFC radiator.

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