CN114630496A - Electroless nickel-gold process capable of reducing chemical treatment steps and system thereof - Google Patents

Abstract

The invention provides an chemical nickel-gold process method that can reduce chemical treatment steps, including: horizontal conveying of circuit boards one by one: sandblasting, water washing, ultrasonic cleaning, water washing, acid cleaning, water washing, multi-stage micro-etching , water washing, pre-soaking, activation, water washing, post-acid leaching, ultrasonic cleaning, water washing, and then turn the circuit board into a vertical shape and move it continuously one by one. Then soak in the gushing micro-etching liquid: chemical deposition of nickel, water washing, chemical deposition of gold, recycling water washing, and then flip the circuit board piece by piece and adopt the horizontal conveying method to carry out: washing, drying, drying and other operations, whereby the present invention The method and system can complete the surface treatment of the circuit board through only a single system.

Description

Electroless nickel-gold process method and system with reduced chemical processing steps

technical field

The present invention relates to the technical field of circuit board manufacturing, and particularly relates to an electroless nickel-gold process method and system which can reduce chemical treatment steps.

Background technique

Electroless Nickel/Immersion Gold (abbreviated as ENIG, also known as electroless nickel gold, immersion nickel gold or electroless nickel gold) replaces palladium on the surface of copper through chemical reaction, and then chemically deposits a palladium core on the basis of chemical reaction. A layer of nickel-phosphorus alloy is formed, and then a layer of gold is replaced on the surface of nickel through a substitution reaction. Electroless nickel gold is mainly used for the surface treatment of the subsequent assembly process of the circuit board.

The processing flow of electroless nickel gold process in circuit board processing includes: pre-treatment, chemical deposition and post-treatment. The pretreatment steps include: brushing→water washing→sandblasting→water washing→ultrasonic cleaning→micro-etching→water washing→pickling→water washing→air drying→drying. The steps of chemical deposition include: cleaning→water washing→micro-etching→water washing→pre-acid leaching→water washing→pre-soaking→activation→water washing→post-acid leaching→water washing→electroless nickel deposition→water washing→chemical gold deposition→water washing→drying. The post-processing steps include: pickling → water washing → ultrasonic cleaning → water washing → drying → drying.

Therefore, the system used in the existing chemical nickel gold process must include three sets of equipment, namely pre-processing equipment (as shown in Figure 1A), chemical deposition equipment (as shown in Figure 1B) and post-processing equipment (as shown in Figure 1C) Show). The pretreatment equipment includes: brushing tank 101, washing tank 102, sandblasting tank 103, washing tank 104, ultrasonic cleaning tank 105, micro-etching tank 106, washing tank 107, pickling tank 108, washing tank 109, drying tank 110. Drying tank 111. After the circuit boards are cleaned, the circuit boards must be manually placed in the basket 200 one by one.

The chemical deposition equipment includes: cleaning tank 121, washing tank 122, micro-etching tank 123, washing tank 124, pre-acid dip tank 125, washing tank 126, pre-soaking tank 127, activation tank 128, washing tank 129, exchange tank 130, after Acid leaching tank 131 , water washing tank 132 , chemical deposition nickel tank 133 , water washing tank 134 , chemical deposition gold tank 135 , water washing tank 136 , drying tank 137 . The production operation method is to move the gondola 200 on which multiple (eg, 20 to 40) circuit boards have been placed, and use two traveling cranes, the first traveling crane 201 and the second traveling crane 202 to sequentially move between the aforementioned reaction chambers , to drive the gondola 200 to rise or fall vertically. After the gondola 200 is sequentially moved to the exchange tank 130 by the first traveling crane 201 , the second traveling crane 202 will take over and move it to the subsequent reaction tank for operation.

The post-processing equipment includes: pickling tank 141 , water washing tank 142 , ultrasonic cleaning tank 143 , water washing tank 144 , drying tank 145 , and drying tank 146 . In the post-processing process, it is still necessary to manually take out the circuit boards one by one from the hanging basket 200, and place them in the equipment to perform related operations in sequence.

Based on the above, in the above three processing processes, such as pre-treatment, chemical deposition and post-treatment, a large amount of cleaning water and chemical solution must be used, which is not only expensive, but also the recovery and reprocessing of waste water after use is another expense. . In addition, manpower must be used to move out or move the circuit board in the basket, which is time-consuming and labor-intensive.

In addition, the previous process of the chemical nickel gold process is the green paint (Solder Mask) process. The circuit board will have a baking process at the end of the green paint process. The temperature is 180 degrees Celsius and the baking time is 50 minutes. After the baking process, the surface of the circuit board has been seriously oxidized. The board will be temporarily placed aside for several hours to a day, and the surface of the circuit board will be oxidized and polluted by the environment. Procedures such as washing to remove the oxide layer on the surface of the circuit board. Furthermore, the existing electroless nickel-gold manufacturing process is divided into three processing processes: pre-treatment, electroless nickel-gold deposition, and post-processing. Between each processing process, there will be a waiting period of time and the problem of manual handling and contact will cause the surface of the circuit board to oxidize. Therefore, in the process of electroless nickel-gold deposition and post-treatment, micro-etching or pickling or ultrasonic cleaning will be added in the front part of the process, the purpose is to remove the oxide layer and pollutants on the surface of the circuit board.

For this reason, the inventors have considered an improved method to integrate the entire electroless nickel-gold process system into a single system, which not only reduces the multiple processes for removing oxide layers and contaminants, but also further reduces some of the processes, thereby producing larger benefit.

SUMMARY OF THE INVENTION

The main purpose of the present invention is to provide an electroless nickel-gold process method and system that can reduce chemical treatment and cleaning and drying steps. The use of chemical agents, saving the amount of use and reducing the cost of expenditure, and reducing the number of processes, the cost of electricity, labor, chemical waste liquid and wastewater treatment has also been significantly reduced.

To achieve the foregoing purpose, the present invention has adopted the following technical solutions:

The invention provides an electroless nickel-gold process method which can reduce chemical treatment steps. Etching, water washing, pre-soaking, activation, water washing, post-acid leaching, ultrasonic cleaning, water washing, among which multi-stage micro-etching includes spraying micro-etching liquid first, then soaking in the gushing micro-etching liquid; then flip the circuit board into a vertical shape And it is carried out in a continuous moving method one by one: chemical deposition of nickel, water washing, chemical deposition of gold, recycling water washing, and then flipping the circuit board one by one using horizontal conveying method: washing, drying, drying and other operations.

As one of the preferred embodiments, the spraying method is to spray the micro-etching liquid on the circuit board in a high-pressure manner, and then the circuit board is immersed in the gushing micro-etching liquid. This method is to use the micro-etching liquid sprayed from another tank. The liquid produces a gushing water flow in the tank, so that the water flow evenly flows to the surface or hole of the circuit board for micro-etching.

As one of the preferred embodiments, a set of pre-acid leaching and water washing steps can be added after the multi-stage micro-etching and water washing steps.

Furthermore, the present invention provides an electroless nickel-gold process system that can reduce chemical treatment steps, including a sandblasting tank, a first water washing tank, an ultrasonic cleaning tank, a second water washing tank, an acid cleaning tank, a second Three washing tank, multi-stage micro-etching tank, fourth washing tank, pre-soak tank, activation tank, fifth washing tank, post-acid leaching tank, ultrasonic cleaning tank, sixth washing tank, chemical deposition nickel tank, seventh washing tank , chemical deposition gold tank, recovery washing tank, eighth washing tank, drying tank, drying tank.

As one of the preferred embodiments, the electroless nickel deposition tank and the electroless gold deposition tank use an electroless deposition equipment that is continuously produced one by one.

As one of the preferred embodiments, after the third water washing tank, a group of pre-acid leaching tanks and water washing tanks for pre-acid leaching are added.

Compared with the prior art, the present invention has the following specific effects:

1. The design of the present invention can save the operations and processes such as brushing, washing, micro-etching, washing, pickling, washing, drying, drying and manual collection of circuit boards in the existing pretreatment, and the relative savings include: Costs of chemical solution, cleaning water, electricity, labor, chemical waste liquid and waste water treatment.

2. The design of the present invention can also save processes such as pickling and ultrasonic cleaning in the existing post-treatment, and relatively save costs including chemical liquid, cleaning water, electricity, labor, chemical waste liquid and waste water treatment.

3. The present invention integrates the original pre-processing equipment, chemical deposition equipment and post-processing equipment into a single system and replaces it, which reduces the cost of a number of equipment, and the length of the equipment is shortened due to the integration into a single system. The required plant area is reduced, and the space of the plant can be used more effectively.

4. The present invention adopts multi-stage micro-etching, which uses the mixed micro-etching method of spraying and soaking (including gushing) to achieve the purpose of removing the oxide layer on the copper surface and between the lines, and in the nickel-gold process of chemical deposition, also It can reduce one micro-etching, water washing, pre-acid leaching and water washing procedures, and greatly reduce the cost of chemical solution, cleaning water, electricity, labor, chemical waste liquid and waste water treatment.

5. The existing gantry cage process requires two micro-etching processes. Each micro-etching will bite (thin) the copper circuit. Therefore, in the previous "copper electroplating" process, the thickness of the electroplated copper will be deliberately increased. In order to prevent insufficient copper thickness after micro-etching. In the present invention, only one multi-stage micro-etching process is required, and the amount of bite-etching is about 0.4 to 0.6 micrometers (μm). Therefore, in the previous "electroplating copper" process, the thickness of electroplating copper can be reduced, that is, copper consumption can be reduced and power saving.

6. The present invention adopts an ultrasonic cleaning step after the post-acid leaching, which can thoroughly clean the residual palladium ions between the thin lines below 50 microns, and avoid the occurrence of "jump plating" during subsequent electroless nickel deposition and electroless gold deposition, causing short circuits. For quality problems, especially for fine lines below 35 microns, the method of the present invention can solve the problem of very high quality defect rate in the traditional manufacturing process, and improve the yield rate of product production.

Description of drawings

FIG. 1A is a side view of a pretreatment equipment used in a conventional electroless nickel-gold process.

FIG. 1B is a side view of an electroless deposition apparatus used in a conventional electroless nickel-gold process.

FIG. 1C is a side view of the post-processing equipment used in the conventional electroless nickel-gold process.

FIG. 2 is one of the flow charts of the electroless nickel-gold process which can reduce the chemical treatment steps of the present invention.

FIG. 3 is one of the side views of the electroless nickel-gold process system with reduced chemical processing steps of the present invention.

FIG. 4 is one of the top views of the electroless nickel-gold process system capable of reducing chemical processing steps according to the present invention.

FIG. 5 is the second flow chart of the electroless nickel-gold process which can reduce the chemical treatment steps of the present invention.

FIG. 6 is a second side view of the electroless nickel-gold process system capable of reducing chemical processing steps according to the present invention.

FIG. 7 is the second top view of the electroless nickel-gold process system capable of reducing chemical treatment steps according to the present invention.

Description of reference numbers:

101-brushing tank; 102-washing tank; 103-sandblasting tank; 104-washing tank; 105-ultrasonic cleaning tank; 106-micro-etching tank; ; 110 - drying tank; 111 - drying tank; 121 - cleaning tank; 122 - washing tank; 123 - micro-etching tank; 124 - washing tank; tank; 128-activation tank; 129-water washing tank; 130-exchange tank; 131-post-acid leaching tank; 132-water washing tank; 133-chemical deposition nickel tank; 134-water washing tank; 135-chemical deposition gold tank; 136- Washing tank; 137-drying tank; 141-pickling tank; 142-water washing tank; 143-ultrasonic cleaning tank; 144-water washing tank; 145-drying tank; 146-drying tank; The first moving crane; 202 - the second moving crane; 301 - sandblasting; 302 - water washing; 303 - ultrasonic cleaning; 304 - water washing; 305 - acid cleaning; 306 - water washing; 309-pre-soak; 310-activation; 311-water washing; 312-post-acid leaching; 313-ultrasonic cleaning; 314-water washing; 315-chemically deposited nickel; 319-washing; 320-drying; 321-drying; 322-pre-pickling; 323-washing; 401-sandblasting tank; 402-first washing tank; 403-ultrasonic washing tank; 404-second washing tank 405-acid cleaning tank; 406-third washing tank; 407-micro-etching tank; 408-fourth washing tank; 409-presoak tank; 410-activation tank; 411-fifth washing tank; tank; 413-ultrasonic cleaning tank; 414-sixth washing tank; 415-chemical deposition nickel tank; 416-seventh washing tank; 417-chemical deposition gold tank; 418-recycling washing tank; 419-eighth washing tank; 420- drying tank; 421- drying tank; 422- pre-acid dip tank; 423- water washing tank for pre-acid dip.

Detailed ways

The technical solutions of the present invention will be clearly and completely described below with reference to specific embodiments and accompanying drawings. All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein is for the purpose of describing specific embodiments only and is not intended to limit the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

First of all, a brief description of the terms used in the process: acid cleaning is to use organic or inorganic acids to slightly clean and thoroughly wet the holes of the circuit board. Micro-etching: Micro-etching is used to remove the oxide layer on the copper surface on the circuit board or in the hole. Acid dip: soaking in dilute sulfuric acid to remove hydrolyzed crystals generated after micro-etching. Pre-dip: Immerse in the reaction solution so that there is no oxide on the copper surface. Activation: Substitute a layer of palladium on the copper surface to act as a catalyst for electroless nickel reaction. Electroless nickel deposition: A layer of nickel-containing alloy is plated on the copper surface as a barrier layer to prevent migration or diffusion between gold and copper. Electroless gold deposition: A gold layer is deposited by displacement on the nickel surface on the copper surface.

As shown in FIG. 2 , it is one of the flow charts of the electroless nickel-gold process which can reduce the chemical treatment steps of the present invention. The steps include sandblasting 301 , water washing 302 , ultrasonic cleaning 303 , water washing 304 , acid cleaning 305 , water washing 306 , multi-stage micro-etching 307 , water washing 308 , pre-soaking 309 , activation 310 , water washing 311 , and after Acid leaching 312, ultrasonic cleaning 313, water washing 314, chemical deposition of nickel 315, water washing 316, chemical deposition of gold 317, recycling water washing 318, water washing 319, drying 320, drying 321 and other operations. The multi-stage micro-etching process 307 includes spraying the micro-etching liquid first, and then soaking in the gushing micro-etching liquid.

The design of the present invention is to make the initial circuit board go through a series of continuous electroless nickel-gold process steps to complete the surface treatment of the circuit board through the above process. To this end, the circuit board must be sandblasted 301, washed with water 302, ultrasonically cleaned 303, washed with water 304, acid cleaned 305, washed with water 306, multi-channel micro-etching 307, washed with water 308, pre-soaked 309, activated 310 , washing 311, post-pickling 312, ultrasonic cleaning 313, washing 314 and other steps. Sandblasting 301 is to preliminarily remove the oxide layer or impurities on the surface of the circuit board. The ultrasonic cleaning 303 uses ultrasonic vibration to clean the residual sand remaining between the lines.

In addition, the multi-stage micro-etching 307 used in the present invention means that 2/3 of the section is sprayed with micro-etching liquid first, and then 1/3 of the section is immersed in the gushing micro-etching liquid. The spraying method is to spray micro-etching liquid on the circuit board in a high-pressure manner, in order to effectively remove the oxides between the lines and the copper surface. This oxide is mainly due to the last baking process in the green paint process. The baking time is about 50 minutes, which will seriously oxidize the surface of the circuit board after the baking treatment. This spraying micro-etching method can effectively remove the serious oxides. After that, the circuit board is immersed in the gushing micro-etching liquid. This method is to use the micro-etching liquid sprayed from another tank to generate a gushing water flow in the tank. The dead space between the lines can effectively remove oxides, and the overall multi-stage micro-etching has a bite-etching amount of about 0.4 to 0.6 micrometers (μm).

The multi-stage micro-etching 307 is also an innovative design improved by the present invention for this process. There is no such method in the existing process. Generally, two separate micro-etching processes are used, one for pretreatment and one for chemical deposition of nickel and gold. The micro-etching will bite (thin) the copper circuit, and the total amount of the two micro-etchings reaches 0.8 to 1.2 microns. Therefore, in the previous "copper electroplating" process, the thickness of the electroplated copper must be deliberately increased to prevent micro-etching. The copper thickness after that is insufficient. On the other hand, because the present invention adopts a continuous process, only one multi-stage micro-etching process needs to be performed, and the total amount of bite-etching is only about 0.4 to 0.6 micrometers (μm). Reduce copper consumption and save electricity. In addition, only one multi-stage micro-etching 307 is used, which can save the previous micro-etching process of conventional chemical deposition of nickel and gold, as well as the subsequent pickling and water washing steps, and can also reduce chemical liquid, cleaning water, electricity, labor, chemical waste liquid and Wastewater treatment costs, etc.

In the present invention, an ultrasonic cleaning step 313 is added to the post-acid leaching 312, and the purpose is to thoroughly clean the residual palladium ions between the thin lines below 50 microns, and avoid the occurrence of "jump plating" during the deposition of chemical nickel and chemical gold. For quality problems, especially for fine lines below 35 microns, the quality defect rate in the traditional process is very high. The present invention adds an ultrasonic cleaning 313 in a horizontal manner after the post-acid leaching 312, which can effectively remove the residual Palladium ions, and then solve the quality problem that the thin lines of the traditional process are prone to jump plating.

Next, the circuit board will be turned upside down and continuously moved one by one: chemical deposition of nickel 315 , water washing 316 , chemical deposition of gold 317 , recovery of water washing 318 and other steps.

Afterwards, the circuit board is turned into a horizontal state and carried out in a horizontal conveying mode: washing 319, drying 320, drying 321 and other steps.

As shown in FIG. 3 and FIG. 4 , it is one of a side view and a top view of an electroless nickel-gold process system capable of reducing chemical treatment steps according to the present invention. The system includes a sandblasting tank 401, a first washing tank 402, an ultrasonic washing tank 403, a second washing tank 404, an acid cleaning tank 405, a third washing tank 406, a multi-stage micro-etching tank 407, a fourth Water washing tank 408, pre-soaking tank 409, activation tank 409, fifth washing tank 411, post-acid leaching tank 412, ultrasonic cleaning tank 413, sixth washing tank 414, chemical deposition nickel tank 415, seventh washing tank 416, chemical A gold deposition tank 417 , a recovery water washing tank 418 , an eighth water washing tank 419 , a drying tank 420 , and a drying tank 421 . Each slot is provided with a relevant conveying mechanism to deliver the circuit board horizontally or vertically into each slot for processing. In addition, the washing tanks listed above are not limited to a single tank body, and 1 to 5 tanks may be connected in series depending on the cleaning to achieve the required cleanliness.

Furthermore, the sandblasting tank 401, the first washing tank 402, the ultrasonic washing tank 403, the second washing tank 404, the acid cleaning tank 405, the third washing tank 406, the multi-stage micro-etching tank 407, the fourth washing tank 408, the The immersion tank 409, the activation tank 410, the fifth washing tank 411, the post-acid soaking tank 412, the ultrasonic cleaning tank 413, and the sixth washing tank 414 are themselves provided with a horizontal conveying mechanism in the tank, so that the circuit board is horizontally aligned. Sequentially enter into each tank one by one to carry out relevant procedures such as cleaning and activating the surface of the circuit board. Afterwards, the circuit board is turned from horizontal to vertical, and is moved one by one in each slot to perform deposition, cleaning and other operations. Among them, the electroless nickel deposition tank 415 , the seventh water washing tank 416 , the electroless gold deposition tank 417 and the recovery water washing tank 418 may adopt the electroless deposition equipment previously designed by the inventors for continuous production one by one. After that, the circuit board is turned into a horizontal shape, and the horizontal conveying mechanism provided in the eighth washing tank 419, the drying tank 420, and the drying tank 421 is used for washing, drying, drying and other operations in a horizontal order.

In the traditional electroless nickel-gold deposition process in the PCB industry, due to equipment capabilities and chemical properties, three separate processes cannot be integrated and separated, and automation cannot be connected between the three processes. The present invention utilizes the continuous processing flow to clean the chemical potion on the surface of the circuit board by washing with water immediately after each chemical treatment, so as to prevent the potion from being brought into the back potion tank and contaminating the potion. Therefore, whenever When the new process saves a certain chemical treatment process, the subsequent water washing can also be saved. Therefore, the present invention has greatly reduced the costs of chemical solution, cleaning water, electricity, labor, chemical waste liquid and waste water treatment, and thus enables the production of more market-competitive products.

As shown in FIG. 5 , it is the second flow chart of the electroless nickel-gold process in which the chemical treatment steps can be reduced according to the present invention. The main steps are still the same as the above process, for example, the steps include sandblasting 301, water washing 302, ultrasonic cleaning 303, water washing 304, acid cleaning 305, water washing 306, multi-stage micro-etching 307, water washing 308, pre-soaking 309, activation 310, water washing 311, post-pickling 312, ultrasonic cleaning 313, water washing 314, chemical deposition of nickel 315, water washing 316, chemical deposition of gold 317, recycling water washing 318, water washing 319, drying 320, drying 321 and other operations . However, in this embodiment, after the multi-stage micro-etching 307 and water washing 308 steps, a set of pre-acid leaching 322 and water washing 323 steps may be added. Combined with pre-dip 309, activation 310, water washing 311, post-acid leaching 312, ultrasonic cleaning 313, and water washing 314, it is more effective to remove the chemical micro-etching on the hole wall or dead angle between lines when soaking and washing after micro-etching. The hydrolyzed crystals of the medicine.

As shown in FIG. 6 and FIG. 7 , it is the second side view and the top view of the electroless nickel-gold process system which can reduce the chemical treatment steps of the present invention. The system includes a sandblasting tank 401, a first washing tank 402, an ultrasonic washing tank 403, a second washing tank 404, an acid cleaning tank 405, a third washing tank 406, a multi-stage micro-etching tank 407, a fourth Water washing tank 408, pre-soaking tank 409, activation tank 409, fifth washing tank 411, post-acid leaching tank 412, ultrasonic cleaning tank 413, sixth washing tank 414, chemical deposition nickel tank 415, seventh washing tank 416, chemical A gold deposition tank 417 , a recovery water washing tank 418 , an eighth water washing tank 419 , a drying tank 420 , and a drying tank 421 . Each slot is provided with a relevant conveying mechanism to deliver the circuit board horizontally or vertically into each slot for processing. In this embodiment, after the multi-stage micro-etching 407 and the third water washing tank 408, a group of pre-acid leaching tanks 422 and a water washing tank 423 for pre-acid leaching are added.

It can be seen from the above description that using the chemical nickel-gold process of the present invention does not need to separate several different processes and perform them in different equipment. A single circuit board is fed into the system of the present invention. According to the process steps of the present invention, the surface treatment of the circuit board can be completed by the electroless nickel-gold process. Compared with the prior art, multiple processes and equipment are greatly reduced. Brush grinding, water washing, micro-etching, water washing, pickling, water washing, drying, drying in the treatment, pickling, ultrasonic cleaning in the existing post-treatment, etc. Manufacturers reduce the cost of production, which includes the cost of chemical solution, cleaning water, electricity, labor, chemical waste liquid and waste water treatment, so as to produce more market-competitive products. It can save the cost of pickling and water washing, and can reduce the thickness of the front-end copper plating process, reduce the consumption of copper and save electricity.

The above are the preferred embodiments of the present invention, and it should be pointed out that for those skilled in the art, several improvements and modifications can be made without departing from the principles described in the present invention, and these improvements and modifications are also included in the present invention. within the scope of protection of the invention.

Claims (6)

1. a chemical nickel-gold process method that can reduce chemical treatment steps, is characterized in that, step comprises: adopt the horizontal conveying mode to carry out one by one circuit board in sequence: sandblasting, washing, ultrasonic cleaning, washing, acid cleaning, Water washing, multi-stage micro-etching, water washing, pre-soaking, activation, water washing, post-acid leaching, ultrasonic cleaning, water washing, among which multi-stage micro-etching includes spraying micro-etching liquid first, then soaking in the gushing micro-etching liquid; then flipping The circuit board is vertical and is continuously moved piece by piece: chemical deposition of nickel, water washing, chemical deposition of gold, recycling water washing, and then flipping the circuit board piece by piece and using horizontal conveying method: washing, drying, drying Do the work. 2. The chemical nickel-gold process method according to claim 1, wherein the spray method is to spray micro-etching liquid on the circuit board in a high-pressure manner, and then the circuit board is immersed in the surge In the micro-etching liquid, this method is to use the micro-etching liquid sprayed from another tank to generate a gushing water flow in the tank, so that the water flow evenly flows to the surface or the hole of the circuit board for micro-etching. 3 . The electroless nickel-gold manufacturing method according to claim 1 , wherein after the multi-stage micro-etching and the water washing steps, a set of pre-acid leaching and water washing steps are added. 4 . 4. An electroless nickel-gold process system capable of reducing chemical treatment steps, characterized in that it comprises: a sandblasting tank, a first washing tank, an ultrasonic cleaning tank, a second washing tank, an acid cleaning tank, The third washing tank, the multi-stage micro-etching tank, the fourth washing tank, the pre-soak tank, the activation tank, the fifth washing tank, the post-pickling tank, the ultrasonic cleaning tank, the sixth washing tank, the chemical deposition nickel tank, the seventh washing tank tank, chemical deposition gold tank, recovery washing tank, eighth washing tank, drying tank, drying tank. 5 . The electroless nickel-gold process system according to claim 4 , wherein the electroless nickel-gold deposition tank and the electroless-gold deposition tank are made of a continuous production of chemical deposition equipment one by one. 6 . . 6 . The chemical nickel-gold process system according to claim 4 , wherein after the third water washing tank, a group of pre-acid leaching tanks and pre-acid leaching water washing tanks are added. 7 . .

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