CN114628358A - Contact structure and electronic device with same - Google Patents

Abstract

The invention provides a contact structure, comprising: a substrate; a copper layer disposed on the substrate; an adhesion promoting layer disposed on the copper layer, wherein the adhesion promoting layer forms a single layer on the surface of the copper layer Molecular adsorption layer; and a nano-silver layer, arranged on the adhesion promoting layer, and the adhesion between the copper layer and the nano-silver layer is above 3B. In the present invention, by disposing the adhesion promoting layer on the copper layer, in the stacked structure of the copper layer and the nano-silver layer, the adhesion of the copper layer and the nano-silver layer is improved, so as to prevent the copper from being in the subsequent The phenomenon of peeling occurs in the yellow light process.

Description

Contact structure and electronic device having the same

technical field

The present invention relates to a contact structure and a device thereof, and in particular to a contact structure having a stack of copper layers and nano-silver layers and an electronic device thereof.

Background technique

In the prior art, in some electronic devices (such as touch panels), at the contact area where the touch electrodes and the transmission lines intersect, the transmission line materials are mostly copper material layers, and the touch electrodes use nano-silver material layers. However, there is a problem of poor adhesion at the junction of the above-mentioned materials, and in the process of manufacturing the device including this contact area (such as the yellow light process, etc.), due to the stripping solution (for example, tetramethylammonium hydroxide (TMAH) solution), making the adhesion between copper and silver more difficult to control.

FIG. 1A is a schematic diagram of a conventional device 10 including a contact region 20 before being treated with a stripping solution of a yellow light process. Device 10 includes substrate 12 , copper layer 14 over substrate 12 , and nanosilver layer 16 over substrate 12 and partially covering copper layer 14 . FIG. 1B is a schematic diagram of the device of FIG. 1A after being treated with a stripping solution of a yellow light process, wherein peeling easily occurs between the copper layer 14 ′ and the nano-silver layer 16 in the contact area 20 , and the phenomenon of peeling occurs in one hundred grids. Test method The adhesion was measured and the result was 0B.

Since the adhesion between the copper layer 14 ′ and the nano-silver layer 16 will affect the reliability of the product, in view of this, the existing contact structure between the silver nano-layer and the copper layer needs to be improved.

SUMMARY OF THE INVENTION

The purpose of an embodiment of the present invention is to provide a contact structure. By disposing an adhesion promoting layer on the copper layer, in the stacked structure of the copper layer and the nano-silver layer, the adhesion of the copper layer and the nano-silver layer is improved. , in order to prevent the copper from peeling off in the subsequent yellow light process. The purpose of an embodiment of the present invention is to provide an adhesion promoting layer in a stacked structure of a copper layer and a nano-silver layer, so as to improve the adhesion between the copper layer and the nano-silver layer, so as to prevent the occurrence of copper in the subsequent yellow light process. peeling phenomenon.

The purpose of an embodiment of the present invention is to provide an adhesion promoting layer, which makes the contact surface between the nano-silver material layer and the copper layer have chemical resistance, so that the product can be maintained without being affected by chemicals during the production process The adhesion between the copper layer and the nano-silver layer.

An embodiment of the present invention provides a contact structure, including a substrate, a copper layer, an adhesion promoting layer, and a nano-silver layer. A copper layer is provided over the substrate. The adhesion promoting layer is disposed on the copper layer, wherein the adhesion promoting layer forms a monomolecular adsorption layer on the surface of the copper layer. The nanosilver layer is disposed on the adhesion promoting layer. The adhesion between the copper layer and the nano-silver layer is above 3B.

In one embodiment, the adhesion promoting layer is an organic layer formed by curing a composite formula organic coating, the composite formula organic coating comprising: 0.05wt%-10wt% of base liquid, 0.05wt%-10wt% of additives and 80wt% -99.8 wt% solvent.

In one embodiment, the base fluid is a first coupling agent, the additive is a second coupling agent, an organic ligand, an organic resin or a combination thereof, and the first coupling agent is different from the second coupling agent .

In one embodiment, the first coupling agent is an epoxy silane coupling agent, and the second coupling agent is an amino silane coupling agent.

In one embodiment, the content of the base liquid and the additive is 0.1 to 1.5 wt %, 0.1 to 1.0 wt %, 0.1 to 1.1 wt %, 0.1 to 1.33 wt % or 0.1 to 0.5 wt % of the entire compound formulation organic coating. percentage.

In one embodiment, the ratio of the base liquid to the additive is 1:4-10:1.

In one embodiment, the adhesion promoting layer has a thickness of about 50 to about 100 nanometers.

In one embodiment, the measured adhesion after the contact structure is soaked in tetramethylammonium hydroxide is in the range of 3B to 5B. In one embodiment, the measured adhesion after the contact structure is soaked in tetramethylammonium hydroxide is in the range of 3B to 4B.

An embodiment of the present invention provides an electronic device including a contact structure formed by a copper layer and a nano-silver layer.

In one embodiment, the contact structure of the electronic device is located in a peripheral area of the electronic device.

Description of drawings

The various aspects of the present invention will be best understood when the following detailed description is read in conjunction with the accompanying drawings. It should be noted that in accordance with industry standard operating procedures, the various features may not be drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or decreased for clarity of discussion.

FIG. 1A is a schematic diagram of a conventional device including a contact structure before being treated with a stripping solution of a yellow light process.

FIG. 1B is a schematic diagram of a conventional device including a contact structure after being treated with a stripping solution in a yellow light process.

FIG. 2A is a schematic cross-sectional view of a contact structure according to an embodiment of the present invention.

2B is a schematic cross-sectional view of a contact structure according to another embodiment of the present invention.

FIG. 3 shows a schematic cross-sectional view of a device according to an embodiment of the present invention.

FIG. 4 is a top view of a touch panel according to an embodiment of the present invention.

FIG. 5A is a schematic top view of a touch panel according to an embodiment of the present invention.

FIG. 5B is a schematic cross-sectional view along line A-A of FIG. 5A .

FIG. 5C is a schematic cross-sectional view along line B-B of FIG. 5B .

6A-6C illustrate schematic cross-sectional views of different steps of a method of fabricating a contact structure according to an embodiment of the present invention.

Description of reference numbers:

10: component; 12: substrate; 14: copper layer; 14': copper layer; 16: nano-silver layer; 20: contact area; 100: contact structure; 102: substrate; 104: copper layer; 106: adhesion promoting layer ; 108: nano silver layer; 200: element; 210: contact structure; 212: substrate; 214: copper layer; 214 ": copper layer; 216: adhesion promoting layer; 218: nano silver layer; 300: touch panel; 310: display area; 312: touch sensing electrode; 320: peripheral area; 321: signal transmission line; 322: overlapping area; 500: touch panel; 510: substrate; 520: peripheral lead; : adhesion promoting layer; 602: substrate; 604: copper layer; 606: adhesion promoting layer; 608: nano silver layer; BA: bonding area; C1: first covering; C2: second covering; D1: the first One direction; D2: Second direction; PA: Peripheral area; TE: Touch sensing electrode; VA: Display area

Detailed ways

The following disclosure provides different implementations or examples to achieve different features of the presented objectives. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are only examples and are not intended to limit the invention. For example, in the ensuing description, the first feature is formed higher than the second feature, may include embodiments in which the first and second features are formed in direct contact, and may also include additional features disposed between the first and second features between, so the first and second features are not in direct contact. Furthermore, the present invention may repeat numbers and/or letters in various embodiments. Such repetition is not intended to imply a relationship between the various embodiments and/or configurations discussed.

Furthermore, to facilitate describing the relationship between one element or feature and another element or feature, as depicted in the figures, spatially relative terms such as "below", "below", "lower" may be used herein. "on", "above", "above", "above", and similar terms. In addition to the orientation depicted in the figures, spatially relative terms are intended to encompass different orientations of the device in use or operation. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatially relative terms used herein interpreted accordingly.

Referring to FIG. 2A, a contact structure 100 according to an embodiment of the present invention is shown. The contact structure includes a substrate 102 , a copper layer 104 , an adhesion promoting layer 106 , and a nano-silver layer 108 . The copper layer 104 is disposed on the substrate 102 , the adhesion promoting layer 106 is disposed on the copper layer 104 , and the nano-silver layer 108 is disposed on the adhesion promoting layer 106 . In other words, the adhesion promoting layer 106 is disposed between the copper layer 104 and the nano-silver layer 108 , does not affect the electrical connection between the copper layer 104 and the nano-silver layer 108 , and makes the copper layer 104 and the nano-silver layer 108 have better The adhesion/adhesion ability of the nano-silver layer 108 reduces the risk of peeling (peeling) of the nano-silver layer 108; and in the subsequent process, the adhesion promoting layer 106 has excellent anti-UV and/or chemical resistance (alkaline liquid) performance, Therefore, it can be applied to the yellow light process.

In another embodiment, as shown in FIG. 2B , the nano-silver layer 108 partially covers the copper layer 104 . In other words, a portion of the copper layer 104 indirectly contacts the nano-silver layer 108 via the adhesion promoting layer 106, and the rest of the copper layer 104 has no overlying nano-silver layer.

In an embodiment of the present invention, the adhesion promoting layer 106 in the contact structure is a very thin organic layer formed by curing a composite formula organic coating, and the composite formula organic coating includes: a base liquid (0.05wt%-10wt%) , additive (0.05wt%-10wt%) and solvent (80wt%-99.8wt%), wherein the base fluid is the first coupling agent, the additive is the second coupling agent, organic ligand, organic resin or a combination thereof, The first coupling agent is different from the second coupling agent, and the first coupling agent and the second coupling agent can be amine-based silane coupling agent, epoxy-based silane coupling agent, respectively. agent or modified coupling agent, etc. Solvents can be water or organic solvents such as alcohols, ethers, esters and the like. Organic ligands such as chelating agents, wherein the coordinating atoms in the chelating agent are oxygen, nitrogen, sulfur, phosphorus, arsenic, etc. It can effectively react with the functional groups at both ends of the coupling agent to form bonds. In an embodiment of the present invention, the first coupling agent is an epoxy silane coupling agent, and the second coupling agent is an amino silane coupling agent.

Silane coupling agent is a widely used coupling agent, but in this application, a single-component coupling agent is used for the adhesion test, and it is found that a stable adhesion state cannot be formed between the copper layer 104 and the nano-silver layer 108, The peel strength is only between 0B-2B.

In one embodiment, the adhesion promoting layer 106 can form a monomolecular adsorption layer on the metal surface, so as to improve the adhesion effect between the metal and the silver nanowires.

In one embodiment, the thickness of the adhesion promoting layer 106 is about 50 to about 100 nanometers, such as 50, 60, 70, 80, 90, or 100 nanometers.

In one embodiment, the contact structure of the present invention can be widely used where the copper layer and the nano-silver layer are in contact with each other. For example, please refer to FIG. 3 , which illustrates an element 200 according to another embodiment of the present invention. Element 200 includes contact structures 210 . The contact structure 210 includes a substrate 212, a copper layer 214 (wherein the copper layer in indirect contact with the nano-silver layer is denoted as 214"), an adhesion promoting layer 216, and a nano-silver layer 218. The contact structure 210 may be a touch panel in a touch panel Where the electrodes and the signal transmission lines meet or overlap, the nano-silver layer 218 is the touch electrode, the copper layer 214 is the signal transmission line, and the contact structure 210 enables the signal of the touch electrode to be transmitted to the signal transmission line. Specifically, the contact structure 210 can be located at The peripheral area of the touch panel, or the boundary area adjacent to the peripheral area and the visible area. The adhesion promoting layer 216 is located between the copper layer 214" and the nano-silver layer 218, and does not affect the copper layer 214" and the nano-silver layer 218. The electrical connection between the two, and the adhesion promoting layer 216 can still provide good adhesion between the copper layer 214" and the nano-silver layer 218 after the stripping solution (for example, tetramethylammonium hydroxide) in the yellow light process. adhesion.

In addition, the upper surface or/and the side surface of some copper layers 214 are also covered with the adhesion promoting layer 216 , as shown in FIG. 3 .

The contact structure provided by the embodiments of the present invention can be applied to display devices, for example, electronic devices with panels, such as mobile phones, tablets, wearable electronic devices (such as smart bracelets, smart watches, virtual reality devices, etc.), TV, monitor, laptop, e-book, digital photo frame, navigator, or similar. The element 10/200 and the touch panel 300 (as shown in FIG. 4 ) of the embodiment of the present invention can be assembled with other electronic elements to form a device/product, such as a display with touch function, for example, the element 10/200, the touch panel can be assembled The panel 300 is attached to a display element (not shown in the figure), such as a liquid crystal display element or an organic light emitting diode (OLED) display element, and an optical glue or other similar adhesive can be used to attach the two; or attached to an optical film , such as polarizers (stretched polarizers or liquid crystal coated polarizers), optical retardation films, and the like. The elements 10/200, the touch panel 300, etc. of the embodiments of the present invention can be applied to electronic devices such as portable phones, tablet computers, notebook computers, etc., and can also be applied to flexible products. The components 10/200 and the touch panel 300 of the embodiments of the present invention can also be fabricated in wearable devices (such as watches, glasses, smart clothes, smart shoes, etc.), automotive devices (such as dashboards, driving recorders, and rear view vehicles for vehicles) mirrors, windows, etc.).

Please refer to FIG. 4 , which is a top view of a touch panel 300 in a display device. The touch panel 300 includes a display area 310 and a peripheral area 320 . In the display area 310, the touch sensing electrodes 312 are formed of conductive materials including nano-silver. In the peripheral region 320, the signal transmission line 321 is formed of a copper layer. The peripheral area 320 includes a plurality of overlapping areas 322, where the touch sensing electrodes are electrically connected to the signal transmission lines for signal transmission. The lands 322 may include the contact structures 210 as shown in FIG. 3 .

In one embodiment, in the overlapping area 322, the nano-silver wire layer covers one side surface and part or all of the upper surface of the copper layer of the signal transmission line, wherein the adhesion promoting layer is located between the copper layer and the nano-silver wire layer. between.

In one embodiment, a copper layer is formed on the peripheral region 320 of the substrate of the touch panel 300 , and then an adhesion promoting layer is disposed over the copper layer. After that, a nano-silver wire layer is formed on the display area 310 and the peripheral area 320 on the substrate, and the nano-silver wire layer is also formed over the copper layer and the adhesion promoting layer in the peripheral area 320 . After that, the patterning process is carried out, including coating photoresist layer, exposure, development, etching (dry and wet) and other processes. Therefore, a touch sensing electrode pattern is formed in the display area 310 , and a plurality of separated signal transmission lines 321 are formed in the peripheral area 320 . In the etched overlap region, the silver nanowire layer is located above the copper layer and the adhesion promoting layer is located between the copper layer and the silver nanowire layer. In one embodiment, in the peripheral region 320, the nanosilver wire layer, the adhesion promoting layer, and the copper layer have mutually aligned sides (ie, a common etch surface). Then, the spaces between the electrode patterns and the signal transmission lines are filled with an insulating material.

In an alternative embodiment, the nanosilver wire layer is not only formed in the overlap region, but extends to the entire peripheral region 320 for one time etch with the copper layer; or can be etched first The process of nano silver wire layer and adhesion promotion layer, and then etching copper layer. Accordingly, the signal transmission line in the peripheral region 320 is a composite structure of the nano-silver wire layer/adhesion promoting layer/copper layer. 5A to 5C, and refer to the description of the following disclosure.

5A is a schematic top view of a touch panel 500 according to some embodiments of the present invention, and FIGS. 5B and 5C are cross-sectional views taken along lines A-A and B-B of FIG. 5A , respectively. The touch panel 500 includes a substrate 510 , peripheral leads 520 , marks 540 , a first cover C1 , a second cover C2 , an adhesion promoting layer 550 (see FIGS. 5B and 5C ), and touch sensing electrodes TE. The number of the above-mentioned peripheral leads 520 , markers 540 , the first cover C1 , the second cover C2 , and the touch sensing electrodes TE can be one or more, and the numbers are drawn in the following specific embodiments and drawings It is for illustrative purposes only, and does not limit the present invention.

Referring to FIG. 5A , the substrate 510 has a display area VA and a peripheral area PA. The peripheral area PA is disposed on the side of the display area VA. For example, the peripheral area PA can be a frame-shaped area disposed around the display area VA (ie, covering the right side, the left side, the upper side and the lower side), but in other implementations In an example, the peripheral area PA may be an L-shaped area disposed on the left side and the lower side of the display area VA. As also shown in FIG. 5A , in this embodiment, there are eight sets of peripheral leads 520 and the first cover C1 corresponding to the peripheral leads 520 are disposed in the peripheral area PA of the substrate 510 ; the touch sensing electrodes TE are disposed in the display area of the substrate 510 VA. In this embodiment, there are further two sets of marks 540 and a second cover C2 corresponding to the marks 540 , which are disposed in the peripheral area PA of the substrate 510 . An adhesion promoting layer 550 is disposed between the first cover C1 and the peripheral lead 520 to avoid redox reaction between the peripheral lead 520 and the first cover C1 in a specific environment (eg, in the aforementioned stripping solution). The adhesion promoting layer 550 is also arranged between the second cover C2 and the mark 540; in addition, by disposing the first cover C1 and the second cover C2 on the peripheral lead 520 and the mark 540, respectively, the upper and lower layers of material It can be formed at a predetermined position without alignment, so it can reduce or avoid the requirement of setting an alignment error area in the manufacturing process, thereby reducing the width of the peripheral area PA, thereby meeting the requirement of a narrow frame of the display.

The touch sensing electrodes TE in this embodiment are disposed in the display area VA, and the touch sensing electrodes TE can be electrically connected to the peripheral leads 520 . Specifically, the touch sensing electrode TE can also be a metal nanowires layer including at least metal nanowires. That is, the metal nanowires form the touch sensing electrode TE in the display area VA, and form the touch sensing electrode TE in the peripheral area PA. The first cover C1, and the thickness/characteristics of the monomolecular layer formed by the adhesion promoting layer 550 does not affect the electrical conduction between the metal layer and the metal nanowire layer, so the touch sensing electrode TE can pass through the first cover C1 , The adhesion promotion layer 550 is in contact with the peripheral lead 520 to achieve electrical connection for signal transmission. The metal nanowires also form a second cover C2 in the peripheral area PA, which is disposed on the mark 540, and the mark 540 can be widely interpreted as a non-electrical function pattern, but not limited thereto. In some embodiments of the present invention, the peripheral lead 520 and the mark 540 can be made of the same metal layer (that is, the two are made of the same metal material); the touch sensing electrode TE, the first cover C1 and the second cover The material C2 can be made of the same metal nanowire layer.

In this embodiment, the mark 540 is a bonding area BA disposed in the peripheral area PA, which is a docking alignment mark, that is, an external circuit board, such as a flexible circuit board (not shown), is connected to the contact area. A mark used to align the flexible circuit board (not shown) and the touch panel 500 in the step of the control panel 500 (ie, the bonding step). However, the present invention does not limit the placement position or function of the marker 540. For example, the marker 540 may be any check mark, pattern or label required in the manufacturing process, which is within the scope of the present invention. The indicia 540 may have any possible shape, such as a circle, quadrilateral, cross, L-shape, T-shape, etc., while the adhesion promoting layer 550 has substantially the same shape as the indicia 540 .

As shown in FIG. 5B and FIG. 5C , in the peripheral area PA, a non-conductive area 536 is formed between adjacent peripheral leads 520 to electrically block the adjacent peripheral leads 520 to avoid short circuits. In this embodiment, the non-conductive region 536 is a gap to isolate the adjacent peripheral leads 520 . In the patterning step, the above-mentioned gap can be formed by etching, so the sidewalls of the peripheral leads 520, the sidewalls of the adhesion promoting layer 550 and the sidewalls of the first cover C1 are a common etching surface and are aligned with each other , that is to say, the three are formed in the same etching step; similarly, the sidewall of the marking 540, the sidewall of the adhesion promoting layer 550 and the sidewall of the second cover C2 are a common etching surface, and are mutually Align. Furthermore, the peripheral leads 520 , the adhesion promoting layer 550 and the first cover C1 have the same or similar patterns and dimensions, such as long and straight patterns, and the same or similar widths.

As shown in FIG. 5C , in the display area VA, there is a non-conductive region 536 between adjacent touch sensing electrodes TE, so as to electrically block the adjacent touch sensing electrodes TE and avoid short circuits. In this embodiment, the non-conductive region 536 is a gap to isolate adjacent touch sensing electrodes TE; in an embodiment, the above-mentioned etching method can be used to form the gap between adjacent touch sensing electrodes TE. In this embodiment, the touch sensing electrodes TE and the first cover C1 can be made of the same metal nanowire layer (such as a nanosilver wire layer), so at the junction of the display area VA and the peripheral area PA, the metal The nanowire layer will form a climbing structure to form the first cover C1.

In one embodiment, the touch sensing electrode TE adopts a double-layer configuration. In other words, the upper and lower surfaces of the substrate are provided with the touch sensing electrode TE. Therefore, the aforementioned peripheral leads 520 , the first cover C1 , and the adhesion promoting layer 550 Both are formed on the upper and lower surfaces of the substrate.

Please refer to FIG. 6A to FIG. 6C , which illustrate a flow chart of manufacturing a contact structure according to an embodiment of the present invention.

In Figure 6A, a copper layer disposed on the substrate is provided.

In one embodiment, the substrate 602 may be rigid or flexible. Substrate 602 may be transparent or opaque. Suitable rigid substrates include, for example, polycarbonates, acrylics, and the like. Suitable flexible substrates include, but are not limited to: polyesters (eg, polyethylene terephthalate (PET), polyethylene naphthalate, and polycarbonate), polyolefins (eg, linear, branched and cyclic polyolefins), polyethylene (eg, polyvinyl chloride, polyvinylidene chloride, polyvinyl acetal, polystyrene, polyacrylates, and the like), cellulose ester substrates (eg, cellulose triacetate) , cellulose acetate), polysulfone (eg, polyethersulfone), polyimide, polysiloxane, or other polymeric membranes.

The copper layer 604 is disposed on the substrate 602 . The copper layer 604 may be disposed on the substrate 602 by electroplating, electroless plating, or other deposition methods.

In Figure 6B, an adhesion promoting layer is provided on the copper layer. In some embodiments, the composite formulation solution may be coated on the copper layer 604 . In another embodiment, the structure comprising the copper layer 604 may be immersed in the aforementioned compound formulation organic coating. The compound formula organic coating contains base liquid (0.05wt%-10wt%), additives (0.05wt%-10wt%) and solvent (80wt%-99.8wt%). In one embodiment, in the compound formulation organic coating, the content of the base liquid and the additive is 0.1 to 1.5 weight percent, 0.1 to 1.0 weight percent, 0.1 to 1.1 weight percent, 0.1 to 1.33 weight percent, or 0.1 weight percent of the overall compound formulation solution. to 0.5 weight percent. In one embodiment, in the compound formulation organic coating, the content of the base liquid and the additive is 1 to 1.5 weight percent, 1.0 weight percent, 1 to 1.1 weight percent, 1 to 1.33 weight percent, or 0.5 to 1.0 weight percent of the overall compound formulation solution. weight percent. In one embodiment, the ratio of base fluid to additive is 1:4-10:1.

In another embodiment, the compound formulation organic coating comprises a silane coupling agent compound fluid (ie base fluid) and a chelating agent (ie additive). Wherein the silane coupling agent composite liquid can be epoxy silane coupling agent (general formula: (R1-O)2-Si-R2-Y). Wherein R1 is a functional group that can undergo hydrolysis and generate Si-OH, including Cl, OMe (Me is a methyl group), OEt (Et is an ethyl group), OC2H4OCH3, OSiMe, etc., R2 is a hydrogen atom, methyl group base, ethyl, propyl, butyl, phenyl, cyclohexyl, vinyl, propenyl, fluoropropyl, fluoroethylaminopropyl, mercaptopropyl or aniline methyl, etc.; Y is non-hydrolyzable Functional groups, including chain alkene functional groups (mainly vinyl functional groups), and hydrocarbon groups with functional groups such as Cl, NH2, SH, N3, epoxy, (meth)acryloyloxy, isocyanate groups at the end, namely Carbon functional group; X1 can be a carboxyl group, an alkoxy group, a sulfonic acid group, a phosphorus group, and the like.

Epoxysilane coupling agents may include, for example, hexamethyldisiloxane, tetrakis(trimethylsiloxy)silane, 3-glycidoxypropyltrimethoxysilane, or combinations thereof. Amine-based silane coupling agent can include mono-amino, bis-amino, tri-amino, and polyamino groups, depending on the degree of coupling, for example: anilinomethyltriethoxysilane, anilinomethyltrimethoxysilane or ammonia Propyltrimethoxysilane or its derivative compound and its combination.

The organic resin may be a polyurethane (PU)-based resin, such as polyurethane, 4'-diphenylmethane diisocyanate, or a combination thereof.

The stinging agent is an organic stinging agent, a metallic stinging agent, or a combination thereof. The stinging agent may be a mixture of one or more of ethylenediaminetetraacetic acid (EDTA), ethylenediamine, potassium sodium tartrate and the like.

In one embodiment, the content of the epoxy silane coupling agent is about 0.05 to about 10 weight percent in the compound formula organic coating, and the content of the chelating agent is about 0.05 to about 10 weight percent in the compound formula organic coating. The ratio of epoxy silane coupling agent to chelating agent is 1:100 to 100:1, for example 1:1 to 10:1 or 1:1 to 6:1 or 3:1 to 10:1 or 3:1 to 6:1 and so on.

In FIG. 6B , it further includes forming the protective layer solution into an adhesion promoting layer 606 . In one embodiment, it is dried by means of air gun drying, for example, and subjected to a pre-baking treatment.

In Figure 6C, a nanosilver layer is placed on the adhesion promoting layer.

As used herein, "metal nanowires" is a collective term that refers to a collection of metal wires comprising a plurality of elemental metals, metal alloys or metal compounds (including metal oxides), wherein the number of metal nanowires contained therein , does not affect the protection scope claimed by the present invention; and at least one cross-sectional dimension (ie, the diameter of the cross-section) of a single metal nanowire is less than about 500 nm, preferably less than about 100 nm, and more preferably less than about 50 nm; The metal nanostructures are "wires", mainly with high aspect ratios, for example, between about 10 and 100,000. About 10, preferably greater than about 50, and more preferably greater than about 100; the metallic nanowires can be any metal, including but not limited to silver, gold, copper, nickel, and gold-plated silver. Other terms, such as silk, fiber, tube, etc., which also have the above-mentioned dimensions and high aspect ratio, are also covered by the present application. In one embodiment, the nanosilver layer 608 is prepared by coating a coating composition containing nanosilver structures. To form the coating composition, silver nanowires are typically dispersed to form a nanosilver wire ink/dispersion to aid in the coating process. It should be understood that any suitable liquid that forms a stable dispersion of silver nanowires can be used as described herein. Preferably, the silver nanowires are dispersed in water, alcohol, ketone, ether, hydrocarbon or aromatic solvent (benzene, toluene, xylene, etc.). More preferably, the liquid is volatile and its boiling point is no greater than 200°C, no greater than 150°C or no greater than 100°C. After the curing/drying step, the solvent and other substances in the slurry are volatilized, and the metal nanowires are randomly distributed on the surface of the substrate, and the metal nanowires can contact each other to provide a continuous current path, thereby forming a conductive network (conductive network).

In addition, a film layer can be coated with metal nanowires to form a composite structure with certain specific chemical, mechanical and optical properties, such as providing adhesion between the metal nanowires and the substrate, or better physical mechanical strength. Therefore, the film layer Also known as a matrix. On the other hand, some specific polymers are used to make the film layer, so that the metal nanowires have additional surface protection against scratches and abrasions, in this case, the film layer can also be called a hard coat (hard coat) Or overcoats, such as polyacrylates, epoxy resins, polyurethanes, polysilanes, polysiloxanes, poly(silicon-acrylic), etc., can provide metal nanowires with high surface strength to improve scratch resistance. Furthermore, UV stabilizers can be added to the film layer to improve the UV resistance of the metal nanowires. However, the above is only to illustrate the possibility of other additional functions/names of the film layer, and is not intended to limit the present application.

Afterwards, the device can be subjected to a patterning process, including pattern exposure, development, and etching, to form circuit patterns on the copper layer 604 , the nano-silver layer 608 , or both. The adhesion promoting layer 606 may be etched in the steps of etching the copper layer 604 or the nano-silver layer 608; or the copper layer 604, the nano-silver layer 608 and the adhesion promoting layer 606 may be etched in the same etching step.

In another embodiment, the process sequence can be adjusted, for example, the nano-silver layer 608 is formed first, and then the adhesion promotion layer 606 and the copper layer 604 are formed successively.

The embodiments of the present invention are verified below with reference to comparative examples and experimental examples. After forming a laminated structure comprising a copper layer and a nano-silver layer, the adhesion test results (ie peel strength) of the laminated structure are carried out. The specific experimental example The results are shown in Table 1. The ratios listed in Tables 1 to 3 are the percentage by weight of the base liquid and additives in the overall organic coating of the compound formulation. Scheme 1 is a combination of 3-glycidoxypropyltrimethoxysilane (ie base fluid) and EDTA (ie additive); Scheme 2 is 3-glycidoxypropyltrimethoxysilane (ie base fluid) ) and anilinomethyltriethoxysilane (ie additive); Scheme 3 is the combination of tetrakis(trimethylsiloxy) silane (ie base liquid) and 4'-diphenylmethane diisocyanate (ie additive) combination.

Table I

*This article adopts the test standard of ASTM D3359. The specific test tools/methods/steps can be introduced into the content of ASTMD3359 in the content of this article

The embodiments of the present invention are verified below with reference to comparative examples and experimental examples. After forming a superimposed structure comprising a copper layer and a nano-silver layer, the superimposed structure is immersed in a commonly used film stripping solution "hydroxide tetraoxide" in the development process. Methylammonium (TMAH)” or Na ₂ CO ₃ , and test the adhesion test (ie peel strength) between the nano-silver layer and the copper layer.

Table II

Table 3

Table 4 shows the test results of the adhesion between the copper layer and the silver nanowire layer using the aforementioned adhesion promoting layer. In Schemes 4 and 5, the epoxy silane coupling agent (ie base fluid) is selected from the following chemicals.

The aminosilane coupling agent (ie additive) in Scheme 4 is N-2 aminoethyl-3-aminopropyltrimethoxysilane. The organic resin (ie the additive) in Scheme 5 is polyurethane. The ratio (AP ratio) listed in Table 4 is the percentage by weight of the content of the base liquid and the additive in the overall organic coating of the compound formula.

Table 4

It can be seen from the above that in the superimposed structure of the copper layer and the nano-silver layer, when treated with the stripper solution, the adhesion promoting layer can provide a significant effect of improving the adhesion, so that the nano-silver layer and the copper layer are under normal conditions. The adhesion of 3B or above (for example, the test results of 3B, 4B, and 5B) can be maintained in the case of (without immersion in stripping liquid) and in the case of soaking in stripping liquid.

By using the base fluid as the first coupling agent, the additive is a second coupling agent, an organic ligand, an organic resin or a combination thereof, and the first coupling agent is different from the second coupling agent, and By combining the coating components through chemical reactions, the affinity is improved, and the effect of the composite material is improved.

Moreover, since the difference in functional groups will lead to great differences in the coupling effect, the functional groups at both ends of the structure of the epoxy silane coupling agent and the amino silane coupling agent in the organic coating of the composite formulation of the present invention can be respectively associated with the dispersed phase and the filler of the filler. The matrix polymer reacts.

Embodiments of the present invention can solve the peeling problem of the contact structure, so that the device including the contact structure can be produced with a yellow light process with high reliability. Using the yellow light process to manufacture the electronic device including the conductive film layer can provide better time efficiency and reduce the production cost.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection shall be as defined in the appended claims.

Claims (10)

1. A contact structure, comprising:

a substrate;

a copper layer disposed on the substrate;

an adhesion promoting layer disposed on the copper layer, wherein the adhesion promoting layer forms a monomolecular adsorption layer on a surface of the copper layer; and

and the nano silver layer is arranged on the adhesion promoting layer, and the adhesion between the copper layer and the nano silver layer is more than 3B.

2. The contact structure of claim 1, wherein the adhesion promoting layer is an organic layer formed by curing a composite formulated organic coating comprising: 0.05 wt% -10 wt% of base liquid, 0.05 wt% -10 wt% of additive and 80 wt% -99.8 wt% of solvent.

3. The contact structure of claim 2, wherein the base fluid is a first coupling agent, the additive is a second coupling agent, an organic ligand, an organic resin, or a combination thereof, and the first coupling agent is different from the second coupling agent.

4. The contact structure of claim 3, wherein the first coupling agent is an epoxy silane coupling agent and the second coupling agent is an amino silane coupling agent.

5. The contact structure of claim 3, wherein the base fluid and the additive are present in an amount of 0.1 to 1.5 weight percent, 0.1 to 1.0 weight percent, 0.1 to 1.1 weight percent, 0.1 to 1.33 weight percent, or 0.1 to 0.5 weight percent of the composite formulated organic coating as a whole.

6. The contact structure of claim 3, wherein the ratio of the base fluid to the additive is 1:4 to 10: 1.

7. The contact structure of claim 1, wherein the adhesion promoting layer has a thickness of about 50 to about 100 nm.

8. The contact structure of claim 1, wherein the contact structure has an adhesion force of 3B to 4B as measured after soaking in tetramethylammonium hydroxide.

9. An electronic device comprising the contact structure of any one of claims 1 to 8.

10. An electronic device according to claim 9, wherein the contact structure is located in a peripheral region of the electronic device.

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