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CN114613714A - But leveling pressure device and paster equipment thereof - Google Patents

But leveling pressure device and paster equipment thereof Download PDF

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Publication number
CN114613714A
CN114613714A CN202210082320.0A CN202210082320A CN114613714A CN 114613714 A CN114613714 A CN 114613714A CN 202210082320 A CN202210082320 A CN 202210082320A CN 114613714 A CN114613714 A CN 114613714A
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assembly
leveling
component
pressing
plate
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CN114613714B (en
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戚国强
邹贵生
杨友志
刘磊
刘元
王文淦
许建磊
王帅奇
潘兵
吴永超
黄辰潇
杜荣葆
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Quick Intelligent Equipment Co ltd
Tsinghua University
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Quick Intelligent Equipment Co ltd
Tsinghua University
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Press Drives And Press Lines (AREA)
  • Presses And Accessory Devices Thereof (AREA)

Abstract

本发明涉及贴片设备技术领域,尤其是一种可调平加压装置及其贴片设备,该可调平加压装置包括:导轨、第一加压组件、第二加压组件、第一滑块、驱动单元以及调平组件,本发明采用调平组件配合第一滑块的设计,实现在浮动连接状态时,第一加压组件能够以第二工作面为基准,通过下压的方式迫使第一工作面与第二工作面贴合,以此确立第一加压组件的位置,位置确立后,将调平组件切换为固定连接状态,完成调平操作,从而保证了第一工作面和第二工作面相互平行,具有操作方便及效果好的优点,尤其适用于桌面级小型设备,并且只需一次调平即可持续工作,不需要每次工作都调平,省时省力。

Figure 202210082320

The present invention relates to the technical field of patch equipment, in particular to a leveling and pressing device and a patching device thereof. The leveling and pressing device comprises: a guide rail, a first pressing component, a second pressing component, a first The sliding block, the driving unit and the leveling assembly, the present invention adopts the design that the leveling assembly cooperates with the first sliding block, so that in the floating connection state, the first pressing assembly can take the second working surface as the reference, and press down the method. The first working surface is forced to fit with the second working surface to establish the position of the first pressing component. After the position is established, the leveling component is switched to a fixed connection state to complete the leveling operation, thereby ensuring the first working surface. It is parallel to the second working surface, which has the advantages of convenient operation and good effect, especially suitable for small desktop-level equipment, and it can continue to work with only one leveling, and it does not need to be leveled every time, saving time and effort.

Figure 202210082320

Description

可调平加压装置及其贴片设备Adjustable leveling pressing device and its patch equipment

技术领域technical field

本发明涉及贴片设备技术领域,尤其是一种可调平加压装置,此外,本发明还涉及一种包括上述可调平加压装置的贴片设备。The present invention relates to the technical field of patch equipment, in particular to a leveling and pressing device. In addition, the present invention also relates to a patching device comprising the above-mentioned leveling and pressing device.

背景技术Background technique

随着电子产品的发展,电子零件越来越精细,封装技术的重要性也越来越大,目前,用于芯片键合及封装领域的贴片机主要由驱动单元及两个加压组件构成,工作时,芯片和基板放置在两个加压组件之间,而后驱动单元带动加压组件对芯片进行施压,以实现芯片和基板之间的烧结键合;With the development of electronic products, the electronic parts are becoming more and more refined, and the importance of packaging technology is also increasing. At present, the placement machine used in the field of chip bonding and packaging is mainly composed of a driving unit and two pressure components. , When working, the chip and the substrate are placed between the two pressure components, and then the drive unit drives the pressure component to press the chip to achieve sintering bonding between the chip and the substrate;

现有技术中的贴片机为了防止芯片键合时出现常见的压偏问题,通常会配备调平装置,然而现有的调平装置主要利用的是球面调平结构进行调平,但其仅能进行被动式调平,无法进行主动式调平操作,致使芯片键合时依旧容易出现压偏的问题。In order to prevent the common pressure bias problem during chip bonding, the placement machine in the prior art is usually equipped with a leveling device. However, the existing leveling device mainly uses a spherical leveling structure for leveling, but it only Passive leveling can be performed, but active leveling cannot be performed, so that the problem of voltage bias is still prone to occur during chip bonding.

发明内容SUMMARY OF THE INVENTION

本发明要解决的技术问题是:为了解决现有技术中的贴片机在芯片键合时容易出现压偏的问题,现提供一种可调平加压装置,此外,本发明还提供一种包括上述可调平加压装置的贴片设备。The technical problem to be solved by the present invention is: in order to solve the problem that the chip bonding machine in the prior art is prone to biasing, a leveling and pressing device is now provided. In addition, the present invention also provides a A patch device comprising the above-mentioned leveling and pressing device.

本发明解决其技术问题所采用的技术方案是:一种可调平加压装置,包括:The technical solution adopted by the present invention to solve the technical problem is: an adjustable leveling and pressurizing device, comprising:

导轨,安装在机架上;Rails, mounted on the rack;

第一加压组件,具有第一工作面;a first pressurizing component, having a first working surface;

第二加压组件,具有与第一工作面相对设置的第二工作面,所述第一加压组件安装在机架或/和导轨上;a second pressing component, having a second working surface disposed opposite to the first working surface, the first pressing component is mounted on the frame or/and the guide rail;

第一滑块,与导轨相匹配,并滑动安装在导轨上;The first sliding block is matched with the guide rail and is slidably installed on the guide rail;

驱动单元,用于带动第一加压组件相对第二加压组件靠拢或远离;a driving unit, used to drive the first pressing component to move closer to or away from the second pressing component;

以及第一调平组件,用于将第一加压组件连接在第一滑块上,并具有浮动连接状态和固定连接状态;and a first leveling assembly for connecting the first pressing assembly on the first sliding block, and having a floating connection state and a fixed connection state;

所述第一调平组件处于浮动连接状态及第一加压组件向第二加压组件靠拢时,第一加压组件通过第一调平组件带动第一滑块移动,且第一调平组件允许第一加压组件随第一工作面与第二工作面的接触而自适应的调整位置,实现第一工作面与第二工作面的贴合;When the first leveling component is in a floating connection state and the first pressing component moves closer to the second pressing component, the first pressing component drives the first slider to move through the first leveling component, and the first leveling component moves. Allowing the first pressing component to adjust the position adaptively with the contact between the first working surface and the second working surface, so as to realize the fit of the first working surface and the second working surface;

所述第一调平组件处于固定连接状态时,第一加压组件位置被固定在第一滑块上。When the first leveling assembly is in a fixed connection state, the position of the first pressing assembly is fixed on the first sliding block.

本方案中在调平时,第一调平组件处于浮动连接状态,第一加压组件位置不固定,第二加压组件位置固定,第一工作面和第二工作面之间具有一定的平行度偏差,然后对第一加压组件施加一定压力,第一加压组件随着与第二工作面的接触而自适应的调整位置,直至第一工作面和第二工作面紧密贴合,接着利用第一调平组件将第一加压组件的位置固定,从而保证了第一工作面和第二工作面相互平行,具有操作方便及效果好的优点,尤其适用于桌面级小型设备,并且只需一次调平即可持续工作,不需要每次工作都调平,省时省力。In this solution, during leveling, the first leveling component is in a floating connection state, the position of the first pressing component is not fixed, the position of the second pressing component is fixed, and there is a certain degree of parallelism between the first working surface and the second working surface Deviation, and then apply a certain pressure to the first pressing component, the first pressing component adjusts its position adaptively with the contact with the second working surface, until the first working surface and the second working surface are in close contact, and then use The first leveling component fixes the position of the first pressing component, thereby ensuring that the first working surface and the second working surface are parallel to each other, which has the advantages of convenient operation and good effect, especially suitable for small desktop equipment, and only needs One-time leveling can continue to work, no need to level each time, saving time and effort.

进一步地,所述第一调平组件包括第一连接件和第一紧固件;Further, the first leveling assembly includes a first connector and a first fastener;

所述第一连接件和第一加压组件固定连接,并开设有第一安装孔;the first connecting piece is fixedly connected with the first pressing component, and is provided with a first mounting hole;

所述第一紧固件穿过第一安装孔,并用于将第一连接件可拆卸的固定在第一滑块上;第一紧固件位于第一安装孔内的部位的外周壁与第一安装孔的内周壁之间留有第一间隙;The first fastener passes through the first installation hole and is used to detachably fix the first connecting piece on the first sliding block; the outer peripheral wall of the part of the first fastener located in the first installation hole and the first A first gap is left between the inner peripheral walls of the mounting hole;

由于第一间隙的存在,在第一紧固件未固定时,第一连接件及其上的第一加压组件能够在第一间隙所约束的范围内移动,使第一加压组件能够微调位置,在第一加压组件位置确立后,再拧紧第一紧固件,从而将第一加压组件的位置固定在第一滑块上,以保证第一工作面与第二工作面相互平行。Due to the existence of the first gap, when the first fastener is not fixed, the first connecting piece and the first pressing component on it can move within the range restricted by the first gap, so that the first pressing component can be fine-tuned After the position of the first pressing component is established, then tighten the first fastener to fix the position of the first pressing component on the first slider to ensure that the first working surface and the second working surface are parallel to each other .

为了防止第一加压组件调平后再次出现歪斜,进一步地,所述第一加压组件的两侧均配置有第一调平组件,所述机架上位于第一加压组件的两侧均具有导轨,所述导轨上均滑动安装有所述第一滑块,所述第一调平组件和其所在侧的第一滑块连接;通过双侧第一调平组件及第一滑块的设计,促使第一加压组件两侧受力平衡,从而确保第一加压组件不会在工作过程中出现歪斜的情况。In order to prevent the first pressing component from being skewed again after leveling, further, both sides of the first pressing component are provided with first leveling components, and the frame is located on both sides of the first pressing component All have guide rails on which the first sliding block is slidably installed, and the first leveling component is connected with the first sliding block on the side where it is located; through the first leveling component on both sides and the first sliding block The design promotes the balance of forces on both sides of the first pressing component, thereby ensuring that the first pressing component will not be skewed during the working process.

为了提高压力传感器检测的准确性,进一步地,所述第二加压组件远离第二工作面的一端具有安装面,所述安装面与机架之间设置有压力传感器,压力传感器固定安装在机架上,导轨上滑动安装有与其相匹配的第二滑块;In order to improve the detection accuracy of the pressure sensor, further, one end of the second pressurizing assembly away from the second working surface has a mounting surface, a pressure sensor is arranged between the mounting surface and the frame, and the pressure sensor is fixedly installed on the machine On the rack, the guide rail is slidably installed with a second slider that matches it;

还包括第二调平组件,用于将第二加压组件连接在第二滑块上,并具有浮动连接状态和固定连接状态;Also includes a second leveling assembly for connecting the second pressing assembly on the second sliding block, and has a floating connection state and a fixed connection state;

所述第二调平组件处于浮动连接状态及第二加压组件向压力传感器靠拢时,第二加压组件通过第二调平组件带动第二滑块移动,且第二调平组件允许第二加压组件随安装面与压力传感器的受力面的接触而自适应的调整位置,实现安装面与受力面的贴合;When the second leveling component is in a floating connection state and the second pressing component is close to the pressure sensor, the second pressing component drives the second sliding block to move through the second leveling component, and the second leveling component allows the second leveling component to move. The pressure component adjusts its position adaptively according to the contact between the mounting surface and the force-bearing surface of the pressure sensor, so as to realize the fitting between the mounting surface and the force-bearing surface;

所述第二调平组件处于固定连接状态时,第二加压组件位置被固定在第二滑块上;When the second leveling assembly is in a fixed connection state, the position of the second pressing assembly is fixed on the second sliding block;

在调平时,第二调平组件处于浮动连接状态,第二加压组件位置不固定,压力传感器位置固定,安装面与压力传感器的受力面之间具有一定的平行度偏差,然后对第二加压组件施加一定压力,第二加压组件随着与受力面的接触而自适应的调整位置,直至安装面和受力面紧密贴合,接着利用第二调平组件将第二加压组件的位置固定,从而保证了安装面和受力面相互平行,以此提高压力传感器检测的准确性。During leveling, the second leveling component is in a floating connection state, the position of the second pressing component is not fixed, the position of the pressure sensor is fixed, and there is a certain parallelism deviation between the installation surface and the force-bearing surface of the pressure sensor, and then the second pressure sensor is in a fixed position. The pressure component exerts a certain pressure, and the second pressure component adjusts its position adaptively with the contact with the force-bearing surface until the mounting surface and the force-bearing surface are in close contact, and then the second leveling component is used to pressurize the second pressure component. The position of the components is fixed, thereby ensuring that the installation surface and the force-bearing surface are parallel to each other, thereby improving the detection accuracy of the pressure sensor.

进一步地,所述第二调平组件包括第二连接件和第一紧固件;Further, the second leveling assembly includes a second connector and a first fastener;

所述第二连接件和第二加压组件固定连接,并开设有第二安装孔;the second connecting piece is fixedly connected with the second pressing component, and is provided with a second mounting hole;

所述第二紧固件穿过第二安装孔,并用于将第二连接件可拆卸的固定在第二滑块上;第二紧固件位于第二安装孔内的部位的外周壁与第二安装孔的内周壁之间留有第二间隙;The second fastener passes through the second installation hole and is used to detachably fix the second connecting piece on the second slider; the outer peripheral wall of the part of the second fastener located in the second installation hole is connected to the first A second gap is left between the inner peripheral walls of the two mounting holes;

由于第二间隙的存在,在第二紧固件未固定时,第二连接件及其上的第一加压组件能够在第二间隙所约束的范围内移动,使第二加压组件能够微调位置,在第二加压组件位置确立后,再拧紧第二紧固件,从而将第二加压组件的位置固定在第二滑块上,以保证安装面和受力面相互平行。Due to the existence of the second gap, when the second fastener is not fixed, the second connecting piece and the first pressing component on it can move within the range restricted by the second gap, so that the second pressing component can be fine-tuned After the position of the second pressing component is established, the second fastener is tightened to fix the position of the second pressing component on the second sliding block to ensure that the installation surface and the force-bearing surface are parallel to each other.

为了防止第二加压组件调平后再次出现歪斜,进一步地,所述第二加压组件的两侧均配置有第二调平组件,所述机架上位于第二加压组件的两侧均具有导轨,所述导轨上均滑动安装有所述第二滑块,所述第二调平组件和其所在侧的第二滑块连接;通过双侧第二调平组件及第二滑块的设计,促使第二加压组件两侧受力平衡,从而确保第二加压组件不会在工作过程中出现歪斜的情况。In order to prevent the second pressing assembly from being skewed again after being leveled, further, both sides of the second pressing assembly are provided with second leveling assemblies, and the frame is located on both sides of the second pressing assembly Both have guide rails, and the second sliding blocks are slidably installed on the guide rails, and the second leveling components are connected with the second sliding blocks on the side thereof; the second leveling components and the second sliding blocks on both sides are connected by The design promotes the balance of the forces on both sides of the second pressing component, so as to ensure that the second pressing component will not be skewed during the working process.

为了提高对第一加压组件施力的均匀性,进一步地,所述驱动单元包括驱动机构和平衡施力机构;In order to improve the uniformity of applying force to the first pressing component, further, the driving unit includes a driving mechanism and a balanced force applying mechanism;

所述平衡施力机构包括球副组件及具有弹性的弹性缓冲组件,所述驱动机构的输出端通过弹性缓冲组件与球副组件传动连接,所述球副组件和第一加压组件传动连接;The balance force-applying mechanism includes a ball pair assembly and an elastic elastic buffer assembly, the output end of the driving mechanism is drive-connected with the ball pair assembly through the elastic buffer assembly, and the ball pair assembly is drive-connected with the first pressurizing assembly;

弹性缓冲组件利用自身的弹性可以起到缓冲作用,从而更精确地控制施加到芯片上的压力;驱动机构的压力传递到弹性缓冲组件后,由弹性缓冲组件将压力传递到球副组件上,球副组件可以将弹性缓冲组件分散的压力集中到中心一点处,保证了对第一加压组件施加压力的平衡,防止由于弹性缓冲组件制造、装配误差导致的压力偏载问题。The elastic buffer component can play a buffering role by using its own elasticity, so as to control the pressure applied to the chip more precisely; after the pressure of the driving mechanism is transmitted to the elastic buffer component, the elastic buffer component transmits the pressure to the ball sub-assembly, the ball The sub-assembly can concentrate the dispersed pressure of the elastic buffer assembly to a point in the center, which ensures the balance of the pressure applied to the first pressurizing assembly and prevents the pressure eccentric load problem caused by the manufacturing and assembly errors of the elastic buffer assembly.

为了便于制造及装配,进一步地,所述弹性缓冲组件包括固定板、活动板、导杆及弹性元件;In order to facilitate manufacture and assembly, further, the elastic buffer assembly includes a fixed plate, a movable plate, a guide rod and an elastic element;

所述驱动机构的输出端和固定板固定连接,所述活动板与球副组件固定连接,所述固定板和活动板中的一者与导杆固定连接,另一者沿第一滑块的移动方向与导杆滑动连接,所述弹性元件位于活动板与固定板之间。The output end of the driving mechanism is fixedly connected to the fixed plate, the movable plate is fixedly connected to the ball subassembly, one of the fixed plate and the movable plate is fixedly connected to the guide rod, and the other is along the first slider. The moving direction is slidably connected with the guide rod, and the elastic element is located between the movable plate and the fixed plate.

为了实现球副组件传动连接在弹性缓冲组件与第一加压组件之间,进一步地,所述球副组件包括球副板一、中心球、球副板二及限位板,所述中心球位于球副板一和球副板二之间,所述限位板的一端开设有复位孔,另一端与球副板二固定连接;In order to realize the transmission connection of the ball sub-assembly between the elastic buffer assembly and the first pressurizing assembly, further, the ball sub-assembly includes a ball sub-board, a center ball, a second ball sub-board and a limit plate, the center ball It is located between the first ball sub-board and the second ball sub-board, one end of the limiting plate is provided with a reset hole, and the other end is fixedly connected with the second ball sub-board;

所述球副板一或活动板安装有复位杆,所述复位杆插入至复位孔中,复位杆位于复位孔内的部位的外周壁与复位孔的内周壁之间留有第三间隙;The first ball sub-plate or the movable plate is provided with a reset rod, the reset rod is inserted into the reset hole, and a third gap is left between the outer peripheral wall of the position where the reset rod is located in the reset hole and the inner peripheral wall of the reset hole;

所述球副板一和球副板二中的一者和活动板固定连接,另一者和第一加压组件固定连接;One of the first ball sub-board and the second ball sub-board is fixedly connected to the movable plate, and the other is fixedly connected to the first pressing component;

第三间隙的设置,一方面在第一加压组件加压时,可实现弹性缓冲组件施加给球副板一的压力,全部集中由中心球传递给球副板二,再由球副组件二传递给第一加压组件;另一方面,在第一加压组件复位时,球副板一通过复位杆拉动限位板,使球副板二及中心球随第一加压组件沿复位方向移动;同时限位板及复位杆的设置,亦限制了球副板一及球副板二的相对位置,实现能够将中心球约束在球副板一和球副板二之间。The setting of the third gap, on the one hand, when the first pressurizing assembly is pressurized, can realize the pressure exerted by the elastic buffer assembly on the ball sub-plate 1, and all the pressure is transferred from the center ball to the ball sub-plate 2, and then by the ball sub-assembly 2 On the other hand, when the first pressing assembly is reset, the first ball sub-plate pulls the limit plate through the reset rod, so that the second ball sub-plate and the center ball follow the first pressing assembly in the reset direction At the same time, the setting of the limit plate and the reset rod also limits the relative positions of the ball sub-board 1 and the ball sub-board 2, so that the center ball can be restrained between the ball sub-board 1 and the ball sub-board 2.

本发明还提供一种贴片设备,包括上述的可调平加压装置。The present invention also provides a patch device, comprising the above-mentioned leveling and pressing device.

本发明的有益效果是:本发明的可调平加压装置采用调平组件配合第一滑块的设计,实现在浮动连接状态时,第一加压组件能够以第二工作面为基准,通过下压的方式迫使第一工作面第二工作面贴合,以此确立第一加压组件的位置,位置确立后,将调平组件切换为固定连接状态,完成调平操作,从而保证了第一工作面和第二工作面相互平行,具有操作方便及效果好的优点,尤其适用于桌面级小型设备,并且只需一次调平即可持续工作,不需要每次工作都调平,省时省力。The beneficial effects of the present invention are: the leveling and pressing device of the present invention adopts the design of the leveling component to cooperate with the first sliding block, so that in the floating connection state, the first pressing component can be based on the second working surface, and The way of pressing down forces the first working surface and the second working surface to fit together, so as to establish the position of the first pressing component. The first working surface and the second working surface are parallel to each other, which has the advantages of convenient operation and good effect, especially suitable for small desktop-level equipment, and it can continue to work with only one leveling, and it does not need to be leveled every time, saving time Effortless.

附图说明Description of drawings

下面结合附图和实施例对本发明进一步说明。The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

图1是本发明可调平加压装置的示意图;Fig. 1 is the schematic diagram of the adjustable leveling pressing device of the present invention;

图2是图1中A-A向剖视示意图;Fig. 2 is A-A sectional schematic diagram in Fig. 1;

图3是图2中B的局部放大示意图;Fig. 3 is the partial enlarged schematic diagram of B in Fig. 2;

图4是图2中C-C向剖视示意图;Fig. 4 is the C-C cross-sectional schematic diagram in Fig. 2;

图5是本发明中第一加压组件通过调平组件与第一滑块连接时的爆炸示意图;Figure 5 is an exploded schematic diagram of the present invention when the first pressurizing assembly is connected to the first sliding block through the leveling assembly;

图6是本发明中第一加压组件通过调平组件与第一滑块连接时的三维示意图;6 is a three-dimensional schematic diagram of the present invention when the first pressing component is connected to the first sliding block through the leveling component;

图7是本发明中弹性缓冲组件和球副组件装配时的三维示意图;7 is a three-dimensional schematic diagram of the elastic buffer assembly and the ball subassembly in the present invention when assembled;

图8是本发明中弹性缓冲组件和球副组件装配时的二维示意图;8 is a two-dimensional schematic diagram of the elastic buffer assembly and the ball subassembly in the present invention when assembled;

图9是图8中D-D向剖视示意图;Fig. 9 is the D-D sectional schematic diagram in Fig. 8;

图10是图9中E-E向剖视示意图;Fig. 10 is a schematic cross-sectional view along E-E direction in Fig. 9;

图11是图10中F的局部放大示意图;Fig. 11 is a partial enlarged schematic view of F in Fig. 10;

图12是第二加压组件的安装示意图;Fig. 12 is the installation schematic diagram of the second pressurizing assembly;

图13是图12中G-G向剖视示意图;Fig. 13 is the G-G sectional schematic diagram in Fig. 12;

图14是图13中H的局部放大示意图;Fig. 14 is a partial enlarged schematic view of H in Fig. 13;

图15是图13中K-K向剖视示意图;Fig. 15 is a K-K sectional schematic diagram in Fig. 13;

图中:1、第一加压组件,1-1、第一工作面;In the figure: 1. The first pressing component, 1-1, the first working surface;

2、第二加压组件,2-1、第二工作面,2-2、安装面;2. The second pressure component, 2-1, the second working surface, 2-2, the installation surface;

3、第一调平组件,3-1、第一连接件,3-11、第一安装孔,3-2、第一紧固件,3-3、第一间隙;3. The first leveling assembly, 3-1, the first connecting piece, 3-11, the first mounting hole, 3-2, the first fastener, 3-3, the first gap;

4、弹性缓冲组件,4-1、固定板,4-2、活动板,4-21、第三螺纹孔,4-3、导杆,4-4、弹性元件,4-5、限位螺母;4. Elastic buffer assembly, 4-1, fixed plate, 4-2, movable plate, 4-21, third threaded hole, 4-3, guide rod, 4-4, elastic element, 4-5, limit nut ;

5、球副组件,5-1、球副板一,5-2、中心球,5-3、球副板二,5-4、限位板,5-41、复位孔,5-5、复位杆,5-6、第三间隙;5. Ball sub-assembly, 5-1, ball sub-plate one, 5-2, center ball, 5-3, ball sub-board two, 5-4, limit plate, 5-41, reset hole, 5-5, Reset lever, 5-6, the third gap;

6、驱动机构,6-1、电机,6-2、丝杆,6-3、传动螺母,6-4、螺母基板, 6-5、第三连接件,6-6、第三滑块;6. Drive mechanism, 6-1, motor, 6-2, lead screw, 6-3, drive nut, 6-4, nut base plate, 6-5, third connector, 6-6, third slider;

7,第二调平组件,7-1、第二连接件,7-11、第二安装孔,7-2、第二紧固件,7-3、第二间隙;7. The second leveling assembly, 7-1, the second connecting piece, 7-11, the second mounting hole, 7-2, the second fastener, 7-3, the second gap;

8、第二滑块,8-1、第二螺纹孔;8. The second slider, 8-1, the second threaded hole;

9、压力传感器,9-1、受力面;9. Pressure sensor, 9-1. Forced surface;

10、导轨,11、机架;10. Guide rail, 11. Rack;

12、第一滑块,12-1、第一螺纹孔。12. The first slider, 12-1, the first threaded hole.

具体实施方式Detailed ways

现在结合附图对本发明作进一步详细的说明。这些附图均为简化的示意图,仅以示意方式说明本发明的基本结构,因此其仅显示与本发明有关的构成,方向和参照(例如,上、下、左、右、等等)可以仅用于帮助对附图中的特征的描述。因此,并非在限制性意义上采用以下具体实施方式,并且仅仅由所附权利要求及其等同形式来限定所请求保温的主题的范围。The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are all simplified schematic diagrams, and only illustrate the basic structure of the present invention in a schematic way, so they only show the structures related to the present invention, and the directions and references (eg, up, down, left, right, etc.) may only be Used to aid in the description of features in the drawings. Therefore, the following detailed description is not to be taken in a limiting sense, and only by the appended claims and their equivalents to define the scope of the claimed subject matter.

如图1-11所示,一种可调平加压装置,包括:As shown in Figure 1-11, an adjustable leveling compression device includes:

导轨10,固定安装在机架11上;The guide rail 10 is fixedly installed on the rack 11;

第一加压组件1,具有第一工作面1-1;The first pressing assembly 1 has a first working surface 1-1;

第二加压组件2,具有与第一工作面1-1相对设置的第二工作面2-1,第一加压组件1安装在机架11或/和导轨10上;The second pressing component 2 has a second working surface 2-1 opposite to the first working surface 1-1, and the first pressing component 1 is installed on the frame 11 or/and the guide rail 10;

第一滑块12,与导轨10相匹配,并滑动安装在导轨10上;The first sliding block 12 is matched with the guide rail 10 and is slidably installed on the guide rail 10;

驱动单元,用于带动第一加压组件1沿直线方向相对第二加压组件2靠拢或远离;a driving unit for driving the first pressing component 1 to move closer to or away from the second pressing component 2 in a linear direction;

以及第一调平组件3,用于将第一加压组件1连接在第一滑块12上,并具有浮动连接状态和固定连接状态;第一调平组件3处于浮动连接状态及第一加压组件1向第二加压组件2靠拢时,第一加压组件1通过第一调平组件3带动第一滑块12移动,且第一调平组件3允许第一加压组件1随第一工作面1-1与第二工作面2-1的接触而自适应的调整位置,实现第一工作面1-1与第二工作面2-1的贴合;第一调平组件3处于固定连接状态时,第一加压组件1位置被固定在第一滑块12上。and the first leveling assembly 3, which is used to connect the first pressing assembly 1 to the first sliding block 12, and has a floating connection state and a fixed connection state; the first leveling assembly 3 is in a floating connection state and a first plus When the pressing assembly 1 moves closer to the second pressing assembly 2, the first pressing assembly 1 drives the first sliding block 12 to move through the first leveling assembly 3, and the first leveling assembly 3 allows the first pressing assembly 1 to follow the A working surface 1-1 is in contact with the second working surface 2-1 to adjust the position adaptively, so as to realize the bonding between the first working surface 1-1 and the second working surface 2-1; the first leveling component 3 is in In the fixed connection state, the position of the first pressing component 1 is fixed on the first sliding block 12 .

如图5和6所示,本实施例中第一调平组件3包括第一连接件3-1和第一紧固件3-2;第一连接件3-1和第一加压组件1固定连接,并开设有第一安装孔 3-11;第一紧固件3-2穿过第一安装孔3-11,并用于将第一连接件3-1可拆卸的固定在第一滑块12上;如图3所示,第一紧固件3-2位于第一安装孔3-11 内的部位的外周壁与第一安装孔3-11的内周壁之间留有第一间隙3-3;第一安装孔3-11的横截面可为椭圆形、圆形、长圆形或方形等,本实施中具体采用横截面为圆形的第一安装孔3-11;As shown in FIGS. 5 and 6 , in this embodiment, the first leveling assembly 3 includes a first connecting member 3-1 and a first fastener 3-2; a first connecting member 3-1 and a first pressing assembly 1 fixed connection, and a first installation hole 3-11 is opened; the first fastener 3-2 passes through the first installation hole 3-11, and is used to detachably fix the first connector 3-1 on the first sliding block 12; as shown in FIG. 3, a first gap is left between the outer peripheral wall of the part of the first fastener 3-2 located in the first installation hole 3-11 and the inner peripheral wall of the first installation hole 3-11 3-3; the cross-section of the first installation hole 3-11 can be oval, circular, oval or square, etc. In this implementation, the first installation hole 3-11 with a circular cross-section is specifically adopted;

本实施例中第一连接件3-1可与第一滑块12一体成型,亦或者,第一连接件3-1通过机械连接的方式与第一滑块12固定连接;In this embodiment, the first connecting piece 3-1 can be integrally formed with the first sliding block 12, or, the first connecting piece 3-1 can be fixedly connected with the first sliding block 12 by means of mechanical connection;

第一紧固件3-2将第一连接件3-1可拆卸的固定的具体实现方式包含但不仅限于以下形式:The specific implementation of the detachable fixing of the first connecting piece 3-1 by the first fastener 3-2 includes but is not limited to the following forms:

其一为,第一紧固件3-2采用螺钉,第一滑块12上开设有与第一紧固件3-2 相匹配的第一螺纹孔12-1,第一紧固件3-2穿过第一安装孔3-11后螺纹连接在第一螺纹孔12-1内,第一安装孔3-11的孔径大于第一螺纹孔12-1的孔径;在第一紧固件3-2未拧紧时,第一加压组件1能够在第一间隙3-3所约束的范围内移动,以便于进行位置微调,在第一加压组件1位置确立后,再拧紧第一紧固件3-2,使第一紧固件3-2的螺帽抵住第一连接件3-1,从而将第一加压组件 1的位置固定在第一滑块12上;One is that the first fastener 3-2 uses screws, the first slider 12 is provided with a first threaded hole 12-1 that matches the first fastener 3-2, and the first fastener 3- 2. After passing through the first installation hole 3-11, it is threaded in the first threaded hole 12-1, and the diameter of the first installation hole 3-11 is larger than that of the first threaded hole 12-1; in the first fastener 3 -2 When it is not tightened, the first pressing component 1 can move within the range restricted by the first gap 3-3, so as to facilitate fine adjustment of the position. After the position of the first pressing component 1 is established, tighten the first tightening component 3-2, so that the nut of the first fastener 3-2 is pressed against the first connecting component 3-1, thereby fixing the position of the first pressing component 1 on the first sliding block 12;

其二为,第一紧固件3-2包括螺柱和螺母,螺柱通过焊接、卡接、螺纹连接及一体成型等方式固定在第一滑块12上,并穿过第一安装孔3-11后与螺母螺纹连接;在螺母未拧紧时,第一加压组件1能够在第一间隙3-3所约束的范围内移动,以便于进行位置微调;螺母拧紧时抵住第一连接件3-1,从而将第一加压组件1的位置固定在第一滑块12上。The second is that the first fastener 3-2 includes a stud and a nut, and the stud is fixed on the first slider 12 by welding, clamping, screw connection and integral molding, and passes through the first mounting hole 3. After -11, it is threadedly connected with the nut; when the nut is not tightened, the first pressing component 1 can move within the range constrained by the first gap 3-3, so as to facilitate position fine-tuning; when the nut is tightened against the first connector 3-1, so that the position of the first pressing assembly 1 is fixed on the first sliding block 12 .

第一加压组件1的两侧均配置有第一调平组件3,机架11上位于第一加压组件1的两侧均具有导轨10,导轨10上均滑动安装有第一滑块12,第一调平组件3和其所在侧的第一滑块12连接;通过双侧第一调平组件3及第一滑块12 的设计,促使第一加压组件1两侧受力平衡,从而确保第一加压组件1不会在工作过程中因侧向载荷而引起第一加压组件1歪斜的情况发生;Both sides of the first pressing assembly 1 are provided with a first leveling assembly 3 , the rack 11 is provided with guide rails 10 on both sides of the first pressing assembly 1 , and a first slider 12 is slidably installed on the guide rails 10 . , the first leveling component 3 is connected with the first sliding block 12 on the side where it is located; through the design of the first leveling component 3 and the first sliding block 12 on both sides, the forces on both sides of the first pressing component 1 are balanced, Therefore, it is ensured that the first pressing assembly 1 will not be skewed due to side loads during the working process;

如图7-11所示,本实施例中驱动单元包括驱动机构6和平衡施力机构;As shown in Figures 7-11, the drive unit in this embodiment includes a drive mechanism 6 and a balance force application mechanism;

平衡施力机构包括球副组件5及具有弹性的弹性缓冲组件4,驱动机构6的输出端通过弹性缓冲组件4与球副组件5传动连接,球副组件5和第一加压组件1传动连接。The balance force-applying mechanism includes a ball assembly 5 and an elastic elastic buffer assembly 4. The output end of the driving mechanism 6 is connected to the ball assembly 5 through the elastic buffer assembly 4, and the ball assembly 5 is connected to the first pressing assembly 1. .

弹性缓冲组件4包括固定板4-1、活动板4-2、导杆4-3及弹性元件4-4;驱动机构6的输出端和固定板4-1固定连接,活动板4-2与球副组件5固定连接,弹性元件4-4的一端抵住活动板4-2,另一端抵住固定板4-1,本实施例中固定板4-1与导杆4-3固定连接,导杆4-3穿过活动板4-2,并沿第一滑块12 的移动方向与活动板4-2滑动连接,导杆4-3上螺纹连接有限位螺母4-5,限位螺母4-5抵住活动板4-2远离固定板4-1的一端端面,以此使固定板4-1、导杆 4-3及活动板4-2构成一个整体,防止活动板4-2从导杆4-3上脱落,同时通过拧动限位螺母4-5还能够改变固定板4-1与活动板4-2之间的距离,以调节弹性元件4-4的弹力大小;或者,本实施例中活动板4-2与导杆4-3固定连接,导杆4-3穿过固定板4-1,并沿第一滑块12的移动方向与固定板4-1滑动连接,导杆4-3上螺纹连接有限位螺母4-5,限位螺母4-5抵住固定板4-1远离活动板 4-2的一端端面。The elastic buffer assembly 4 includes a fixed plate 4-1, a movable plate 4-2, a guide rod 4-3 and an elastic element 4-4; the output end of the driving mechanism 6 is fixedly connected to the fixed plate 4-1, and the movable plate 4-2 is connected to the fixed plate 4-1. The ball sub-assembly 5 is fixedly connected, one end of the elastic element 4-4 is pressed against the movable plate 4-2, and the other end is pressed against the fixed plate 4-1. In this embodiment, the fixed plate 4-1 is fixedly connected with the guide rod 4-3. The guide rod 4-3 passes through the movable plate 4-2, and is slidably connected with the movable plate 4-2 along the moving direction of the first slider 12. The guide rod 4-3 is threadedly connected with a limit nut 4-5, and the limit nut 4-5 Press the end face of the movable plate 4-2 away from the fixed plate 4-1, so that the fixed plate 4-1, the guide rod 4-3 and the movable plate 4-2 form a whole, preventing the movable plate 4-2 The distance between the fixed plate 4-1 and the movable plate 4-2 can also be changed by turning the limit nut 4-5, so as to adjust the elastic force of the elastic element 4-4; or In this embodiment, the movable plate 4-2 is fixedly connected with the guide rod 4-3, and the guide rod 4-3 passes through the fixed plate 4-1 and is slidably connected with the fixed plate 4-1 along the moving direction of the first slider 12 , the guide rod 4-3 is threadedly connected with a limit nut 4-5, and the limit nut 4-5 is pressed against the end face of the fixed plate 4-1 away from the movable plate 4-2.

为了提高缓冲性能,弹性元件4-4采用弹簧,弹簧及导杆4-3均具有多个,且一一对应,弹簧套设在与其对应的导杆4-3外,可防止弹簧出现歪斜,固定板4-1和活动板4-2之间的弹簧围绕球副组件5的中心呈周向间隔分布,以提高压力分布的均匀性;本实施例中弹簧具体采用四个,四个弹簧分布在方形的四个拐角处,该方形所在的外接圆的圆心与中心球5-2的球心在均与第一加压组件1的中心线重合;In order to improve the cushioning performance, the elastic element 4-4 adopts a spring, and there are multiple springs and guide rods 4-3, which are in one-to-one correspondence. The spring is sleeved outside the corresponding guide rod 4-3, which can prevent the spring from skewing. The springs between the fixed plate 4-1 and the movable plate 4-2 are distributed at circumferential intervals around the center of the ball sub-assembly 5 to improve the uniformity of the pressure distribution; in this embodiment, four springs are used, and the four springs are distributed At the four corners of the square, the center of the circumscribed circle where the square is located and the center of the center ball 5-2 coincide with the center line of the first compression assembly 1;

本实施例中驱动机构6的压力传递到弹簧后,弹簧可以起到缓冲作用,随后,弹簧将压力传递到球副组件5上,球副组件5可以将各弹簧分散的压力集中到中心一点处,保证了对第一加压组件1施加压力的平衡,防止由于弹簧制造、装配误差导致的压力偏载问题;从而由第一调平组件3及平衡施力机构共同保证键合时芯片受力的均匀性,无偏载的施加压力亦可防止调平后的第一加压组件1发生歪斜。In this embodiment, after the pressure of the driving mechanism 6 is transmitted to the spring, the spring can play a buffering role, and then the spring transmits the pressure to the ball subassembly 5, and the ball subassembly 5 can concentrate the pressure dispersed by each spring to the center point , to ensure the balance of the pressure applied to the first pressing component 1, and prevent the pressure bias load problem caused by spring manufacturing and assembly errors; thus, the first leveling component 3 and the balance force application mechanism jointly ensure that the chip is stressed during bonding The uniformity of the applied pressure without eccentric load can also prevent the leveled first pressure component 1 from being skewed.

本实施例中球副组件5包括球副板一5-1、中心球5-2、球副板二5-3及限位板5-4,中心球5-2位于球副板一5-1和球副板二5-3之间,为了防止中心球 5-2发生脱落,球副板一5-1和球副板二5-3上均开设有凹陷部,中心球5-2的两端分别位于球副板一5-1和球副板二5-3的凹陷部内;In this embodiment, the ball sub-assembly 5 includes a ball sub-board 1 5-1, a center ball 5-2, a ball sub-board 2 5-3 and a limit plate 5-4, and the center ball 5-2 is located on the ball sub-board 1 5- Between 1 and the second ball sub-board 5-3, in order to prevent the center ball 5-2 from falling off, the ball sub-board 1 5-1 and the second ball sub-board 5-3 are provided with depressions, and the center ball 5-2 is provided with a depression. The two ends are respectively located in the depressions of the first ball sub-board 5-1 and the second ball sub-board 5-3;

球副板一5-1和球副板二5-3中的一者和活动板4-2固定连接,另一者和第一加压组件1固定连接;以球副板一5-1与或活动板4-2固定连接为例,球副板二5-3和第一加压组件1固定连接,为了有利于提高第一加压组件1施力的均匀性,球副板一5-1优选为固定在活动板4-2的中间位置;One of the ball sub-board 5-1 and the second ball sub-board 5-3 is fixedly connected with the movable plate 4-2, and the other is fixedly connected with the first pressing component 1; the ball sub-board 1 5-1 is fixedly connected with Or the movable plate 4-2 is fixedly connected as an example, the second ball sub-board 5-3 is fixedly connected with the first pressing component 1, in order to improve the uniformity of the force applied by the first pressing component 1, the ball sub-board 1 is preferably fixed at the middle position of the movable plate 4-2;

限位板5-4的一端开设有复位孔5-41,另一端与球副板二5-3固定连接;球副板一5-1或活动板4-2固定有复位杆5-5,复位杆5-5插入至复位孔5-41 中,如图11所示,复位杆5-5位于复位孔5-41内的部位的外周壁与复位孔5-41 的内周壁之间留有第三间隙5-6;One end of the limit plate 5-4 is provided with a reset hole 5-41, and the other end is fixedly connected with the second ball sub-board 5-3; the ball sub-board 1 5-1 or the movable plate 4-2 is fixed with a reset rod 5-5, The reset rod 5-5 is inserted into the reset hole 5-41. As shown in FIG. 11, a space is left between the outer peripheral wall of the position where the reset rod 5-5 is located in the reset hole 5-41 and the inner peripheral wall of the reset hole 5-41. The third gap 5-6;

复位杆5-5具体采用螺纹连接、卡接、焊接或一体成型等方式固定在球副板一5-1或活动板4-2上;复位杆5-5亦可采用紧固件替代,以采用螺钉为例,球副板一5-1或活动板4-2上开设有与复位杆5-5相匹配的第三螺纹孔4-21,复位杆5-5穿过复位孔5-41后螺纹连接在第三螺纹孔4-21内。The reset rod 5-5 is fixed on the ball sub-plate 1 5-1 or the movable board 4-2 by means of screw connection, clamping, welding or integral molding; the reset rod 5-5 can also be replaced by a fastener to Taking screws as an example, a third threaded hole 4-21 matching the reset rod 5-5 is provided on the ball sub-plate 5-1 or the movable plate 4-2, and the reset rod 5-5 passes through the reset hole 5-41 The rear screw is connected in the third threaded hole 4-21.

第三间隙5-6的设置,一方面在第一加压组件1加压时,可实现弹性缓冲组件4施加给球副板一5-1的压力,全部集中由中心球5-2传递给球副板二5-3,再由球副板二5-3传递给第一加压组件1;另一方面,在第一加压组件1复位时,球副板一5-1通过复位杆5-5拉动限位板5-4,使球副板二5-3及中心球5-2随第一加压组件1沿复位方向移动;同时限位板5-4及复位杆5-5的设置,亦限制了球副板一5-1及球副板二5-3的相对位置,起到约束了中心球5-2的作用;此外,第三间隙5-6的设置也使得平衡施力机构与第一加压组件1之间为非刚性连接,不会对第一加压组件1的调平造成影响。The setting of the third gap 5-6, on the one hand, when the first pressing component 1 is pressurized, can realize the pressure applied by the elastic buffer component 4 to the ball sub-plate 1 5-1, and all the pressures are transferred from the center ball 5-2 to the ball sub-plate 5-1. The second ball sub-board 5-3 is then transmitted to the first pressurizing assembly 1 by the second ball sub-board 5-3; on the other hand, when the first pressurizing assembly 1 is reset, the ball sub-board 1 5-1 passes through the reset lever 5-5 Pull the limit plate 5-4, so that the second ball sub-board 5-3 and the center ball 5-2 move along the reset direction with the first pressing component 1; at the same time, the limit plate 5-4 and the reset rod 5-5 The setting of the ball sub-plate also limits the relative positions of the ball sub-plate 1 5-1 and the ball sub-plate 2 5-3, and plays a role in constraining the center ball 5-2; in addition, the setting of the third gap 5-6 also makes the balance The force-applying mechanism and the first pressing component 1 are non-rigidly connected, which will not affect the leveling of the first pressing component 1 .

本实施例中驱动机构6包括电机6-1、丝杆6-2、传动螺母6-3及螺母基板 6-4,螺母基板6-4上固定有第三连接件6-5,导轨10上滑动安装有与其相匹配的第三滑块6-6,第三连接件6-5与第三滑块6-6通过螺钉固定连接,具体地,本实施例中第三滑块6-6与第三连接件6-5之间的连接结构和第一滑块12与第一连接件3-1之间的连接结构相同;电机6-1的输出端和丝杆6-2传动连接,丝杆6-2与传动螺母6-3螺纹传动连接,丝杆6-2的轴线方向与第一滑块12的滑动方向平行,传动螺母6-3与螺母基板6-4固定连接,螺母基板6-4与固定板4-1固定连接;电机6-1带动丝杆6-2转动,传动螺母6-3进给,由传动螺母6-3带动螺母基板6-4及固定板4-1位移,再由固定板4-1通过弹性元件4-4 传递至活动板4-2,最终活动板4-2通过球副组件5带动第一加压组件1往复移动;值得注意的是,本实施例中驱动机构6亦可采用气缸及电动推杆等。In this embodiment, the driving mechanism 6 includes a motor 6-1, a screw rod 6-2, a transmission nut 6-3 and a nut base plate 6-4. A third connecting piece 6-5 is fixed on the nut base plate 6-4. A third sliding block 6-6 is slidably mounted thereon, and the third connecting piece 6-5 is fixedly connected with the third sliding block 6-6 by screws. Specifically, in this embodiment, the third sliding block 6-6 is connected to The connection structure between the third connecting piece 6-5 is the same as the connecting structure between the first sliding block 12 and the first connecting piece 3-1; the output end of the motor 6-1 is connected to the screw rod 6-2 in a driving manner, and the screw The rod 6-2 is threadedly connected with the transmission nut 6-3, the axis direction of the screw 6-2 is parallel to the sliding direction of the first slider 12, the transmission nut 6-3 is fixedly connected with the nut base plate 6-4, and the nut base plate 6 -4 is fixedly connected with the fixed plate 4-1; the motor 6-1 drives the screw 6-2 to rotate, the transmission nut 6-3 feeds, and the transmission nut 6-3 drives the nut base plate 6-4 and the fixed plate 4-1 to displace , and then transmitted from the fixed plate 4-1 to the movable plate 4-2 through the elastic element 4-4, and finally the movable plate 4-2 drives the first pressing component 1 to reciprocate through the ball subassembly 5; it is worth noting that this implementation In the example, the driving mechanism 6 can also use an air cylinder and an electric push rod.

本实施例中可调平加压装置的工作原理为:The working principle of the leveling and pressing device in this embodiment is:

第一加压组件1的第一工作面1-1和第二加压组件2的第二工作面2-1,在调平前已通过机加工的方法保证了第一工作面1-1和第二工作面2-1的平整度;The first working surface 1-1 of the first pressing component 1 and the second working surface 2-1 of the second pressing component 2 have been machined to ensure that the first working surface 1-1 and the second working surface 2-1 are machined before leveling. The flatness of the second working face 2-1;

调平时,第一紧固件3-2松开,第一调平组件3处于浮动连接状态,第一加压组件1位置不固定,压力传感器9支撑住第二加压组件2,第二加压组件2 位置固定,第一工作面1-1和第二工作面2-1之间具有一定的平行度偏差,然后电机6-1带动丝杆6-2,使传动螺母6-3向下进给,对第一加压组件1施加一定压力,第一加压组件1随着与第二工作面2-1的接触而自适应的调整位置,直至第一工作面1-1和第二工作面2-1紧密贴合,接着利用拧紧第一紧固件3-2,将第一加压组件1的位置固定,从而保证了第一工作面1-1和第二工作面2-1 相互平行,具有操作方便及效果好的优点,尤其适用于桌面级小型设备,并且只需一次调平即可持续工作,不需要每次工作都调平,省时省力。When leveling, the first fastener 3-2 is released, the first leveling component 3 is in a floating connection state, the position of the first pressing component 1 is not fixed, the pressure sensor 9 supports the second pressing component 2, and the second pressing component 2 is supported. The position of the pressing component 2 is fixed, and there is a certain parallelism deviation between the first working surface 1-1 and the second working surface 2-1, and then the motor 6-1 drives the screw 6-2, so that the transmission nut 6-3 goes down Feed, apply a certain pressure to the first pressing component 1, and the first pressing component 1 adjusts its position adaptively with the contact with the second working surface 2-1 until the first working surface 1-1 and the second working surface 1-1 The working surface 2-1 is tightly fitted, and then the first pressing component 1 is fixed in position by tightening the first fastener 3-2, thereby ensuring the first working surface 1-1 and the second working surface 2-1 Parallel to each other, it has the advantages of convenient operation and good effect, especially suitable for small desktop-level equipment, and it can continue to work with only one leveling, and it does not need to be leveled every time, saving time and effort.

工作时,电机6-1带动丝杆6-2,使传动螺母6-3向下进给,压力传递到弹簧后,弹簧可以起到缓冲作用,随后,弹簧将压力传递到球副组件5上,球副组件5可以将各弹簧分散的压力集中到中心一点处,保证了对第一加压组件1 施加压力的平衡,从而由第一调平组件3及平衡施力机构共同保证键合时芯片受力的均匀性;When working, the motor 6-1 drives the screw 6-2 to feed the drive nut 6-3 downward. After the pressure is transmitted to the spring, the spring can play a buffering role, and then the spring transmits the pressure to the ball assembly 5. , the ball sub-assembly 5 can concentrate the distributed pressure of each spring to a point in the center, which ensures the balance of the pressure applied to the first pressurizing assembly 1, so that the first leveling assembly 3 and the balance force application mechanism jointly guarantee the bonding time. Uniformity of chip force;

因此,第一调平组件3保证了第一工作面1-1和第二工作面2-1始终保持平行状态,平衡施力机构保证了对第一加压组件1施加压力的平衡,二者协同工作实现了芯片键合时受力的均匀性,防止了芯片键合时常见的压偏问题的出现。Therefore, the first leveling component 3 ensures that the first working surface 1-1 and the second working surface 2-1 are always kept in a parallel state, and the balance force applying mechanism ensures the balance of the pressure applied to the first pressing component 1, and the two The cooperative work realizes the uniformity of the force during chip bonding, and prevents the occurrence of the common voltage bias problem during chip bonding.

实施例2Example 2

如图12-15所示,实施例2与实施例1的区别在于:为了提高压力传感器9 检测的准确性,第二加压组件2远离第二工作面2-1的一端具有安装面2-2,安装面2-2与机架11之间设置有压力传感器9,压力传感器9固定安装在机架11 上,导轨10上滑动安装有与其相匹配的第二滑块8;还包括第二调平组件7,用于将第二加压组件2连接在第二滑块8上,并具有浮动连接状态和固定连接状态;As shown in Figures 12-15, the difference between Embodiment 2 and Embodiment 1 is that in order to improve the detection accuracy of the pressure sensor 9, the end of the second pressing component 2 away from the second working surface 2-1 has a mounting surface 2- 2. A pressure sensor 9 is arranged between the installation surface 2-2 and the frame 11, the pressure sensor 9 is fixedly installed on the frame 11, and the guide rail 10 is slidably installed with a second slider 8 that matches it; The leveling assembly 7 is used to connect the second pressing assembly 2 to the second sliding block 8, and has a floating connection state and a fixed connection state;

第二调平组件7处于浮动连接状态及第二加压组件2向压力传感器9靠拢时,第二加压组件2通过第二调平组件7带动第二滑块8移动,且第二调平组件7允许第二加压组件2随安装面2-2与压力传感器9的受力面9-1的接触而自适应的调整位置,实现安装面2-2与受力面9-1的贴合;When the second leveling component 7 is in the floating connection state and the second pressing component 2 is close to the pressure sensor 9, the second pressing component 2 drives the second sliding block 8 to move through the second leveling component 7, and the second leveling component 7 moves. The component 7 allows the second pressure component 2 to adjust the position adaptively with the contact between the mounting surface 2-2 and the force-bearing surface 9-1 of the pressure sensor 9, so as to realize the sticking of the mounting surface 2-2 and the force-bearing surface 9-1. combine;

第二调平组件7处于固定连接状态时,第二加压组件2位置被固定在第二滑块8上;When the second leveling assembly 7 is in a fixed connection state, the position of the second pressing assembly 2 is fixed on the second sliding block 8;

本实施例中第二调平组件7包括第二连接件7-1和第一紧固件3-2;第二连接件7-1和第二加压组件2固定连接,并开设有第二安装孔7-11;第二紧固件 7-2穿过第二安装孔7-11,并用于将第二连接件7-1可拆卸的固定在第二滑块8 上;如图14所示,第二紧固件7-2位于第二安装孔7-11内的部位的外周壁与第二安装孔7-11的内周壁之间留有第二间隙7-3;第二安装孔7-11的横截面可为椭圆形、圆形、长圆形或方形等,本实施中具体采用横截面为圆形的第二安装孔7-11;In this embodiment, the second leveling assembly 7 includes a second connecting member 7-1 and a first fastener 3-2; the second connecting member 7-1 is fixedly connected with the second pressing assembly 2, and a second connecting member 7-1 is provided. Mounting hole 7-11; the second fastener 7-2 passes through the second mounting hole 7-11, and is used to detachably fix the second connecting piece 7-1 on the second sliding block 8; as shown in FIG. 14 As shown, a second gap 7-3 is left between the outer peripheral wall of the part of the second fastener 7-2 located in the second installation hole 7-11 and the inner peripheral wall of the second installation hole 7-11; the second installation hole The cross-section of 7-11 can be oval, circular, oval or square, etc. In this implementation, the second mounting hole 7-11 with a circular cross-section is specifically adopted;

本实施例中第二连接件7-1可与第二滑块8一体成型,亦或者,第二连接件7-1通过机械连接的方式与第二滑块8固定连接;In this embodiment, the second connecting piece 7-1 can be integrally formed with the second sliding block 8, or, the second connecting piece 7-1 can be fixedly connected with the second sliding block 8 by means of mechanical connection;

第二紧固件7-2将第二连接件7-1可拆卸的固定的具体实现方式包含但不仅限于以下形式:The specific implementation of the detachable fixing of the second connector 7-1 by the second fastener 7-2 includes but is not limited to the following forms:

其一为,第二紧固件7-2采用螺钉,第二滑块8上开设有与螺钉相匹配的第二螺纹孔8-1,第二紧固件7-2穿过第二安装孔7-11后螺纹连接在第二螺纹孔8-1内,第二安装孔7-11的孔径大于第二螺纹孔8-1的孔径;在第二紧固件 7-2未拧紧时,第二加压组件2能够在第一间隙3-3所约束的范围内移动,以便于进行位置微调,在第二加压组件2位置确立后,再拧紧第二紧固件7-2,使第二紧固件7-2的螺帽抵住第二连接件7-1,从而将第二加压组件2的位置固定在第二滑块8上;One is that the second fastener 7-2 is a screw, the second slider 8 is provided with a second threaded hole 8-1 that matches the screw, and the second fastener 7-2 passes through the second mounting hole. 7-11 is threadedly connected in the second threaded hole 8-1, and the diameter of the second installation hole 7-11 is larger than that of the second threaded hole 8-1; when the second fastener 7-2 is not tightened, the first The second pressing component 2 can move within the range constrained by the first gap 3-3, so as to facilitate the fine adjustment of the position. The nuts of the two fasteners 7-2 abut against the second connecting piece 7-1, thereby fixing the position of the second pressing component 2 on the second sliding block 8;

其二为,第二紧固件7-2包括螺柱和螺母,螺柱通过焊接、卡接、螺纹连接及一体成型等方式固定在第二滑块8上,并穿过第二安装孔7-11后与螺母螺纹连接;在螺母未拧紧时,第二加压组件2能够在第二间隙7-3所约束的范围内移动,以便于进行位置微调;螺母拧紧时抵住第二连接件7-1,从而将第二加压组件2的位置固定在第二滑块8上;The second is that the second fastener 7-2 includes a stud and a nut, and the stud is fixed on the second slider 8 by welding, clamping, screw connection and integral molding, and passes through the second mounting hole 7. After -11, it is threadedly connected with the nut; when the nut is not tightened, the second pressing component 2 can move within the range constrained by the second gap 7-3 to facilitate position fine-tuning; when the nut is tightened against the second connecting piece 7-1, so as to fix the position of the second pressing assembly 2 on the second sliding block 8;

为了防止第二加压组件2调平后再次出现歪斜,本实施例中第二加压组件2 的两侧均配置有第二调平组件7和第二滑块8,第二滑块8和其所在侧的导轨 10滑动连接,第二调平组件7和其所在侧的第二滑块8连接;通过双侧第二调平组件7及第二滑块8的设计,促使第二加压组件2两侧受力平衡,从而确保第二加压组件2不会在工作过程中出现歪斜的情况。In order to prevent the second pressing component 2 from being skewed again after leveling, in this embodiment, both sides of the second pressing component 2 are provided with a second leveling component 7 and a second sliding block 8. The second sliding block 8 and The guide rail 10 on its side is slidably connected, and the second leveling assembly 7 is connected with the second sliding block 8 on its side; through the design of the double-sided second leveling assembly 7 and the second sliding block 8, the second pressure is promoted The force on both sides of the assembly 2 is balanced, so as to ensure that the second pressing assembly 2 will not be skewed during the working process.

本实施例中同一侧的第一滑块12、第二滑块8及第三滑块6-6均为设置在同一导轨10上,可降低结构的复杂程度,其次可以避免安装误差等可能导致的卡顿问题。In this embodiment, the first sliding block 12 , the second sliding block 8 and the third sliding block 6 - 6 on the same side are all arranged on the same guide rail 10 , which can reduce the complexity of the structure, and can avoid installation errors that may cause Caton problem.

本实施例中第一加压组件1和第二加压组件2采用上下布局,即第一加压组件1位于第二加压组件2的上方,第二加压组件2位于压力传感器9的上方,第二加压组件2调平后,第二加压组件2的安装面2-2可直接抵住压力传感器9 的受力面9-1。In this embodiment, the first pressing assembly 1 and the second pressing assembly 2 are arranged up and down, that is, the first pressing assembly 1 is located above the second pressing assembly 2 , and the second pressing assembly 2 is located above the pressure sensor 9 , after the second pressing component 2 is leveled, the mounting surface 2 - 2 of the second pressing component 2 can directly abut against the force bearing surface 9 - 1 of the pressure sensor 9 .

本实施例中第二加压组件2的调平原理为:The leveling principle of the second pressurizing assembly 2 in this embodiment is:

在调平前已通过机加工的方法保证了第二加压组件2的安装面2-2的平整度;The flatness of the mounting surface 2-2 of the second pressing component 2 has been ensured by machining before leveling;

在调平时,第二紧固件7-2拧松,第二调平组件7处于浮动连接状态,第二加压组件2位置不固定,压力传感器9位置固定,安装面2-2与压力传感器9 的受力面9-1之间具有一定的平行度偏差,然后驱动机构6或者手动或者其他方式对第二加压组件2施加一定向下的压力,第二加压组件2随着与受力面9-1 的接触而自适应的调整位置,直至安装面2-2和受力面9-1紧密贴合,接着利用拧紧第二紧固件7-2,将第二加压组件2的位置固定,从而保证了安装面2-2 和受力面9-1相互平行,以此提高压力传感器9检测的准确性。During leveling, the second fastener 7-2 is loosened, the second leveling assembly 7 is in a floating connection state, the position of the second pressing assembly 2 is not fixed, the position of the pressure sensor 9 is fixed, the installation surface 2-2 is connected to the pressure sensor There is a certain degree of parallelism deviation between the force-bearing surfaces 9-1 of 9, and then the driving mechanism 6 applies a certain downward pressure to the second pressure component 2 either manually or in other ways, and the second pressure component 2 follows with the receiving force. The contact of the force surface 9-1 adjusts the position adaptively until the installation surface 2-2 and the force bearing surface 9-1 are in close contact. The position of the pressure sensor 9 is fixed, thereby ensuring that the installation surface 2-2 and the force bearing surface 9-1 are parallel to each other, thereby improving the detection accuracy of the pressure sensor 9.

芯片键合时,芯片为放置在第一加压组件1和第二加压组件2之间,驱动单元带动第一加压组件1向下对芯片进行施压,以实现芯片和基板之间的烧结键合,压力传感器9则在此过程中进行压力检测。When the chip is bonded, the chip is placed between the first pressing component 1 and the second pressing component 2, and the driving unit drives the first pressing component 1 to press the chip downward, so as to realize the bonding between the chip and the substrate. Sinter bonding, and the pressure sensor 9 performs pressure detection during this process.

实施例3Example 3

一种贴片设备,包括上述实施例1或实施例2中的可调平加压装置。A patch device includes the leveling and pressing device in the above-mentioned Embodiment 1 or Embodiment 2.

上述依据本发明的理想实施例为启示,通过上述的说明内容,相关工作人员完全可以在不偏离本项发明技术思想的范围内,进行多样的变更以及修改。本项发明的技术性范围并不局限于说明书上的内容,必须要根据权利要求范围来确定其技术性范围。The above ideal embodiment according to the present invention is enlightenment, and through the above description, relevant personnel can make various changes and modifications without departing from the technical idea of the present invention. The technical scope of the present invention is not limited to the contents in the specification, and the technical scope must be determined according to the scope of the claims.

Claims (10)

1. The flattening pressurizing device is characterized in that: the method comprises the following steps:
the guide rail (10) is arranged on the frame (11);
a first pressing assembly (1) having a first working surface (1-1);
a second pressing assembly (2) which is provided with a second working surface (2-1) opposite to the first working surface (1-1), wherein the first pressing assembly (1) is arranged on the frame (11) or/and the guide rail (10);
the first sliding block (12) is matched with the guide rail (10) and is arranged on the guide rail (10) in a sliding mode;
the driving unit is used for driving the first pressurizing assembly (1) to move close to or away from the second pressurizing assembly (2);
and a first leveling assembly (3) for connecting the first pressing assembly (1) to the first slider (12) and having a floating connection state and a fixed connection state;
when the first leveling component (3) is in a floating connection state and the first pressurizing component (1) is close to the second pressurizing component (2), the first pressurizing component (1) drives the first sliding block (12) to move through the first leveling component (3), and the first leveling component (3) allows the first pressurizing component (1) to be self-adaptively adjusted along with the contact of the first working surface (1-1) and the second working surface (2-1), so that the first working surface (1-1) and the second working surface (2-1) are attached;
when the first leveling component (3) is in a fixed connection state, the position of the first pressing component (1) is fixed on the first sliding block (12).
2. The levelable pressure device of claim 1, wherein: the first leveling component (3) comprises a first connecting piece (3-1) and a first fastening piece (3-2);
the first connecting piece (3-1) is fixedly connected with the first pressurizing assembly (1) and is provided with a first mounting hole (3-11);
the first fastening piece (3-2) penetrates through the first mounting hole (3-11) and is used for detachably fixing the first connecting piece (3-1) on the first sliding block (12); a first gap (3-3) is reserved between the outer peripheral wall of the part of the first fastening piece (3-2) located in the first mounting hole (3-11) and the inner peripheral wall of the first mounting hole (3-11).
3. The levelable pressure device of claim 2, wherein: the both sides of first pressurization subassembly (1) all dispose first leveling subassembly (3), the both sides that lie in first pressurization subassembly (1) on frame (11) all have guide rail (10), equal slidable mounting has on guide rail (10) first slider (12), first leveling subassembly (3) are connected with first slider (12) of its place side.
4. The levelable pressure device of claim 1, wherein: one end, far away from the second working surface (2-1), of the second pressurizing assembly (2) is provided with a mounting surface (2-2), a pressure sensor (9) is arranged between the mounting surface (2-2) and the rack (11), the pressure sensor (9) is fixedly mounted on the rack (11), and a second sliding block (8) matched with the guide rail (10) is slidably mounted on the guide rail (10);
the second leveling component (7) is used for connecting the second pressurizing component (2) to the second sliding block (8) and has a floating connection state and a fixed connection state;
when the second leveling component (7) is in a floating connection state and the second pressurizing component (2) is close to the pressure sensor (9), the second pressurizing component (2) drives the second slider (8) to move through the second leveling component (7), and the second leveling component (7) allows the second pressurizing component (2) to be self-adaptively adjusted along with the contact of the mounting surface (2-2) and the stress surface (9-1) of the pressure sensor (9), so that the mounting surface (2-2) is attached to the stress surface (9-1);
when the second leveling component (7) is in a fixed connection state, the position of the second pressing component (2) is fixed on the second sliding block (8).
5. The levelable pressure device of claim 4, wherein: the second leveling component (7) comprises a second connecting piece (7-1) and a first fastening piece (3-2);
the second connecting piece (7-1) is fixedly connected with the second pressurizing assembly (2) and is provided with a second mounting hole (7-11);
the second fastening piece (7-2) penetrates through the second mounting hole (7-11) and is used for detachably fixing the second connecting piece (7-1) on the second sliding block (8); a second gap (7-3) is reserved between the outer peripheral wall of the part, located in the second mounting hole (7-11), of the second fastening piece (7-2) and the inner peripheral wall of the second mounting hole (7-11).
6. The levelable pressure device of claim 4, wherein: the both sides of second pressurization subassembly (2) all are configured with second leveling subassembly (7), the both sides that lie in second pressurization subassembly (2) on frame (11) all have guide rail (10), equal slidable mounting is on guide rail (10) second slider (8), second leveling subassembly (7) are connected with second slider (8) of its place side.
7. The levelable pressure device of claim 1, wherein: the driving unit comprises a driving mechanism (6) and a balance force application mechanism;
the balance force application mechanism comprises a ball pair assembly (5) and an elastic buffering assembly (4), the output end of the driving mechanism (6) is in transmission connection with the ball pair assembly (5) through the elastic buffering assembly (4), and the ball pair assembly (5) is in transmission connection with the first pressurizing assembly (1).
8. The levelable pressure device of claim 7, wherein: the elastic buffer assembly (4) comprises a fixed plate (4-1), a movable plate (4-2), a guide rod (4-3) and an elastic element (4-4);
the output end of the driving mechanism (6) is fixedly connected with the fixed plate (4-1), the movable plate (4-2) is fixedly connected with the ball pair assembly (5), one of the fixed plate (4-1) and the movable plate (4-2) is fixedly connected with the guide rod (4-3), the other one of the fixed plate (4-1) and the movable plate (4-2) is in sliding connection with the guide rod (4-3) along the moving direction of the first sliding block (12), and the elastic element (4-4) is located between the movable plate (4-2) and the fixed plate (4-1).
9. The levelable pressure device of claim 7, wherein: the ball pair assembly (5) comprises a first ball pair plate (5-1), a central ball (5-2), a second ball pair plate (5-3) and a limiting plate (5-4), wherein the central ball (5-2) is positioned between the first ball pair plate (5-1) and the second ball pair plate (5-3), one end of the limiting plate (5-4) is provided with a reset hole (5-41), and the other end of the limiting plate is fixedly connected with the second ball pair plate (5-3);
a first ball auxiliary plate (5-1) or a movable plate (4-2) is provided with a reset rod (5-5), the reset rod (5-5) is inserted into the reset hole (5-41), and a third gap (5-6) is reserved between the outer peripheral wall of the reset rod (5-5) positioned in the reset hole (5-41) and the inner peripheral wall of the reset hole (5-41);
one of the first ball auxiliary plate (5-1) and the second ball auxiliary plate (5-3) is fixedly connected with the movable plate (4-2), and the other one is fixedly connected with the first pressurizing assembly (1).
10. A patch device, characterized by: comprising a trimmable pressing device as claimed in any of claims 1 to 9.
CN202210082320.0A 2022-01-24 2022-01-24 Leveling pressurizing device and patch equipment thereof Active CN114613714B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117182841A (en) * 2023-09-08 2023-12-08 深圳市镭恩特自动化技术有限公司 Pressurizing mechanical device for pasting piezoelectric ceramic plate

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JPH01216814A (en) * 1988-02-25 1989-08-30 Kobe Steel Ltd Method of controlling position of slide of compression press
JPH042609U (en) * 1990-04-24 1992-01-10
KR101597589B1 (en) * 2015-12-16 2016-02-25 대산지오텍 주식회사 Fixing jig for table flattening
CN107665848A (en) * 2016-07-29 2018-02-06 上海微电子装备(集团)股份有限公司 One kind solution bonding levelling device and solution bonding method
CN215596109U (en) * 2021-07-02 2022-01-21 昆山联滔电子有限公司 Floating pressure maintaining mechanism and pressure maintaining machine

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01216814A (en) * 1988-02-25 1989-08-30 Kobe Steel Ltd Method of controlling position of slide of compression press
JPH042609U (en) * 1990-04-24 1992-01-10
KR101597589B1 (en) * 2015-12-16 2016-02-25 대산지오텍 주식회사 Fixing jig for table flattening
CN107665848A (en) * 2016-07-29 2018-02-06 上海微电子装备(集团)股份有限公司 One kind solution bonding levelling device and solution bonding method
CN215596109U (en) * 2021-07-02 2022-01-21 昆山联滔电子有限公司 Floating pressure maintaining mechanism and pressure maintaining machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117182841A (en) * 2023-09-08 2023-12-08 深圳市镭恩特自动化技术有限公司 Pressurizing mechanical device for pasting piezoelectric ceramic plate
CN117182841B (en) * 2023-09-08 2024-05-10 深圳市镭恩特自动化技术有限公司 Pressurizing mechanical device for pasting piezoelectric ceramic plate

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