CN114599201B - Micro-spray phase change liquid cooling soaking plate for server, cooling operation system and control method - Google Patents

Abstract

The invention discloses a micro-spraying phase change liquid cooling soaking plate for a server, a heat dissipation operation system and a control method, wherein the micro-spraying phase change liquid cooling soaking plate comprises a micro-spraying liquid cooling module and a soaking plate body; the micro-spray liquid cooling module comprises an upper cover plate, a spray plate, a condensing plate, a liquid inlet pipeline, an air inlet pipeline and a fluid outlet pipeline, wherein the upper cover plate, the spray plate and the condensing plate are sequentially stacked; the vapor chamber body comprises a condensing plate, a liquid absorption core, an evaporating plate and a liquid injection pipeline; the invention adopts the array spraying holes, reduces the spraying height and reduces the volume of the micro-spraying cooling module on the premise of ensuring the spraying efficiency so as to adapt to the heat dissipation requirements of a CPU or other chips with high heat flow density in a narrow space of a server.

Description

Micro-spray phase change liquid cooling soaking plate for server, cooling operation system and control method

technical field

The invention relates to the technical field of heat dissipation of server chips, in particular to a micro-spray phase-change liquid-cooled soaking plate for servers, a heat dissipation operation system and a control method.

Background technique

In recent years, the number and scale of data centers around the world have grown rapidly, and the high-density server equipment in the computer room has continued to increase. Its built-in CPU chips or other heat-generating chips are growing exponentially in the direction of miniaturization, high frequency, and high power density, and the heat generation is sharp. Increase.

Liquid-cooled heat dissipation has gradually become the mainstream heat dissipation method for server microchips with high heat flux density. However, direct liquid-cooled heat dissipation is prone to leakage of cooling capacity, resulting in the risk of short circuit in printed circuits. Therefore, liquid-cooled heat dissipation is often used in combination with other heat transfer components. . Vapor chamber is a heat transfer component with superior performance, which has the characteristics of small heat loss, high efficiency and fast response. It is a common way to combine heat dissipation with a heat dissipation module such as a composite liquid cold plate outside the vapor chamber condensing plate. In the environment of high heat flux density, the combination of micro-jet single-phase liquid cooling and soaking plate can often achieve superior heat dissipation performance, but this method still has the following shortcomings: Uneven injection produces hot spots of heat; on the other hand, coolant tends to accumulate in the injection cavity, resulting in a dead angle of circulation.

SUMMARY OF THE INVENTION

In order to overcome the shortcomings and deficiencies of the prior art, the present invention provides a micro-spray phase-change liquid-cooled soaking plate for servers, which combines the soaking plate and the spray impact to solve the problem of heat dissipation for high heat flux density servers.

The second object of the present invention is to provide a cooling operation system for a server.

A third object of the present invention is to provide a method for controlling the cooling operation of a server.

The first purpose of the present invention adopts following technical scheme:

A micro-spray phase-change liquid-cooled soaking plate for servers is arranged on the upper part of a server heating chip, and includes a micro-spray liquid-cooling module, a soaking plate body, an air inlet pipe, a liquid inlet pipe and a fluid outlet pipe;

The micro-spray liquid cooling module includes a sequentially stacked upper cover plate, a spray plate and a condensation plate;

The micro-spray liquid cooling module includes an upper cover plate, a spray plate and a condensation plate stacked in sequence; the upper cover plate is provided with a gas medium inlet and a fluid medium outlet; the gas medium inlet is communicated with the air inlet pipe, the The fluid medium outlet is communicated with the fluid outlet pipeline;

The spray plate includes a liquid medium inlet, a liquid cavity, an array of spray holes, a gas cavity and a fluid medium outlet; the liquid medium inlet is communicated with the liquid inlet pipe and the liquid cavity respectively, forming a channel for conveying liquid cooling medium; the liquid medium The cavity is used to temporarily store the liquid cooling medium, and is also the place where the liquid cooling medium and the high-pressure air are initially mixed; the array of spray holes communicates with the liquid cavity, and is a channel for fully mixing the gas-liquid two-phase medium, and the gas cavity and the gas medium are fully mixed. The inlet is connected to accommodate high-pressure air; the fluid medium outlet of the spray plate is communicated with the upper and lower positions of the fluid medium outlet of the upper cover plate correspondingly;

The condensation plate includes a spray cavity and a collecting cavity, the spray cavity is used to provide sufficient space for the atomization of fine droplets, the bottom of the spray cavity is used to receive spray impact, the collecting cavity and the fluid medium on the spray plate are The exit is connected up and down.

Further, the distance between the array spray holes and the spray chamber is calculated as follows:

In the array of spray holes, the relationship between the theoretical spray height H of a single spray hole, the theoretical spray circle diameter D and the spray cone angle θ is: H=0.5D/tan(θ/2);

When the area of the spray cavity covers the heating surface of the spray cavity, the spray cooling efficiency is the best, so the length L and width W of the spray cavity are used as the boundary of the array spray area;

Using a single spray circle to calculate the spray area of the entire array, under the condition of the same nozzle inlet pressure, the diameter of the spray circle generated on the ground of the spray cavity by the 7×6 array spray hole layout should satisfy both D>L/6 and D> W/7, obtain the minimum critical spray height value of the spray space, thus determine the structure of the condensation plate, the vertical distance from the bottom end of the array spray hole outlet to the bottom surface of the spray cavity is greater than the obtained minimum critical spray height value, to ensure that the liquid cooling medium mist of sufficient space.

Further, the cross-sectional area of the array of spray holes first decreases and then increases from top to bottom.

Further, the closer the distance between the spray plate and the condensation plate is, the larger the number of holes in the array of spray holes or the smaller the hole diameter.

Further, a three-dimensional complex surface structure is provided on the inner surfaces of the spray cavity and the current collecting cavity, and the three-dimensional complex surface structure includes a micro-channel array or a micro-turbulence column array.

further,

The body of the soaking plate includes a condensation plate, a liquid absorption core, an evaporation plate and a liquid inlet and gas removal pipeline; the liquid absorption core is provided with a Y-shaped groove, and the liquid absorption core is sintered on the bottom surface of the vacuum cavity of the evaporation plate and the corresponding position on the lower surface of the condenser plate.

The evaporation plate is provided with a Y-shaped support column, a vacuum cavity and a liquid inlet and degassing hole for injecting a liquid phase change working medium and pumping the vacuum cavity into a low pressure or vacuum state, and the Y-shaped support column is integrally formed with the evaporation plate. During processing, the liquid inlet and degassing holes are communicated with the liquid inlet and degassing pipelines.

The second purpose of the present invention adopts following technical scheme:

A heat dissipation operation system composed of a micro-spray phase-change liquid-cooled soaking plate for servers, comprising a micro-spray phase-change liquid-cooled soaking plate, a gas flow loop and a liquid cooling circulation loop,

Further, the liquid cooling circulation system includes a liquid heat exchange circulation loop through which the liquid cooling medium flows, and the liquid heat exchange circulation loop includes a liquid storage tank, a gear pump, a filter, a plate heat exchanger, a control needle valve, a liquid flow rate gauges, pressure transmitters and temperature sensors;

And the liquid cooling medium flows out from the filter and then flows back to the liquid storage tank through the bypass valve.

Further, the gas medium in the gas flow circuit is non-condensable air, which is used to assist the atomization of the liquid cooling medium entering the micro-spray phase change liquid cooling soaking plate.

The 3rd object of the present invention adopts following technical scheme:

A control method for a cooling operation system, comprising:

When the server is running, after the evaporation plate of the micro-spray phase-change liquid-cooled soaking plate in contact with the heating chip is heated, the liquid working medium in the vacuum chamber of the soaking plate is heated and evaporated, filling the entire vacuum chamber, and the vaporized gas encounters a lower temperature. The condensing plate condenses into a liquid state and releases heat energy; at this moment, the air in the environment is continuously compressed by the air compressor and then enters the gas storage tank to form high-pressure gas. Provide high-pressure gas conditions for atomization of liquid cooling medium;

At the same time, the liquid cooling medium participating in the heat exchange cycle is transported by the gear pump to the micro-spray phase change liquid-cooled soaking plate. After encountering high-pressure air in the array spray holes, the liquid cooling medium is broken into small pieces under the action of high pressure. The droplet group is rapidly sprayed from the end of the array spray holes into the spray chamber filled with low-speed flow or still air. Under the interaction of liquid surface tension, viscosity and air resistance, it gradually changes from dripping, smooth flow, and wavy flow to The mist-like fine groups impact on the inner surface of the spray chamber, and rely on the spray impact and droplet phase change to take away the heat of the server chip transmitted by the vapor chamber; the gas-liquid two-phase medium after heat exchange enters the gas-liquid separation device, and separates After the high-pressure air is directly discharged to the environment to be cooled, the liquid cooling medium enters the heat exchanger to be cooled and then flows back to the liquid storage tank, and circulates accordingly.

Beneficial effects of the present invention:

(1) The present invention uses air as a non-condensable high-pressure gas, which has the advantages of being easy to obtain, and no additional device is required for collection after separation. The high-pressure air is used to assist the liquid-cooled cooling medium to achieve atomization, and the generated spray is more uniform, and the spray impact is aggravated. , the cooling effect is better;

(2) The present invention adopts an array of spray holes, and under the premise of ensuring the spray efficiency, the spray height is reduced, and the volume of the micro-spray cooling module is reduced, so as to meet the heat dissipation requirements of the CPU or other high heat flux density chips in the narrow space of the server;

(3) The present invention combines the vapor chamber technology capable of rapid and uniform heat conduction with the spray impingement cooling with high heat transfer coefficient, which not only effectively solves the problem of local hot spots caused by uneven heating on the surface of the server chip, but also greatly improves the Heat dissipation efficiency and performance of spray phase-change liquid-cooled vapor chambers.

Description of drawings

Figure 1 is a schematic structural diagram of a micro-spray phase-change liquid-cooled soaking plate heat dissipation operation system for servers;

Fig. 2 is the structural representation of the micro-spray phase change liquid-cooled soaking plate of the present invention;

3 is a schematic cross-sectional structure diagram of a micro-spray phase-change liquid-cooled soaking plate of the present invention;

Fig. 4 is the theoretical spray pattern schematic diagram of the single spray hole of the present invention;

FIG. 5 is a schematic diagram of a critical situation in which the array spray circle of the present invention is tangent to the bottom surface of the spray cavity.

Detailed ways

The present invention will be described in further detail below with reference to the embodiments and the accompanying drawings, but the embodiments of the present invention are not limited thereto.

Example

As shown in FIG. 1, a heat dissipation operation system for a micro-spray phase-change liquid-cooled vapor chamber for a server includes a micro-spray phase-change liquid-cooled vapor chamber 1, a gas flow circuit 2 and a liquid cooling circulation circuit 3; The spray phase change liquid cooling soaking plate 1 is installed on the upper part of the server heating chip, and the contact surface is evenly coated with thermal conductive silicone grease, including the micro-spray liquid cooling module 11, the soaking plate body 12, the air inlet pipe 13, the liquid inlet pipe 14 and the fluid The outlet pipe 15; the air inlet pipe 13, the liquid inlet pipe 14 and the fluid outlet pipe 15 can be arranged on the same side or different sides of the micro-spray phase change liquid cooling soaking plate 1 as required, and can be arranged in parallel or vertically.

As shown in FIG. 2 and FIG. 3 , the micro-spray liquid cooling module 11 includes an upper cover plate 111 , a spray plate 112 and a condensation plate 113 that are stacked in sequence.

The upper cover plate 111 is provided with a gas medium inlet 1111 and a fluid medium outlet 1112 , the gas medium inlet 1111 communicates with the intake pipe 13 , and the fluid medium outlet 1112 communicates with the fluid outlet pipe 15 .

The spray plate 112 includes a liquid medium inlet 1121, a liquid cavity 1122, an array of spray holes 1123, a gas cavity 1124 and a fluid medium outlet 1125; the liquid medium inlet 1121 is communicated with the liquid inlet pipe 14 and the liquid cavity 1122 respectively to form a transport The channel of the liquid cooling medium; the liquid cavity 1122 is used to temporarily store the liquid cooling medium, and is also the place where the liquid cooling medium and the high-pressure air are initially mixed; the array of spray holes 1123 is communicated with the liquid cavity 1122, and its cross-sectional area is from top to bottom. The bottom first decreases and then increases, which is a channel for the gas-liquid two-phase medium to be fully mixed, and is also a necessary condition for the liquid cooling medium to be atomized in advance to form a fine droplet group; the gas cavity 1124 is connected with the gas medium inlet 1111, used for Accommodates high-pressure air; the continuous high-pressure air enters the gas cavity 1124 from the air inlet duct 13 and the gas medium inlet 1111 and is quickly pressed into the array spray holes 1123. As the cross-sectional area of the array spray holes 1123 gradually decreases, the gas velocity increases. The pressure is reduced to form a low pressure area. At this time, the liquid cooling medium entering the liquid chamber 1122 through the liquid inlet pipe 14 and the liquid medium inlet 1121 is sucked into the array of spray holes 1123 in the low pressure area that has been formed, and the gas and liquid will The upper part of the array spray holes 1123 realizes mixing, and in the lower part of the array spray holes 1123, since its cross-sectional area gradually increases along the velocity direction of the gas-liquid mixed medium, the gas flow rate gradually decreases and the pressure gradually increases. Under the action, the liquid cooling medium is broken into small groups of droplets and quickly ejected from the end of the array spray holes 1123 ;

The condensation plate 113 includes a spray chamber 1131 and a collecting chamber 1132; the spray chamber 1131 provides sufficient space for the atomization of fine droplets, and the bottom of the spray chamber 1131 is the main position for receiving the impact of the spray; the collecting chamber 1132 Connected with the fluid medium outlet 1125 on the spray plate 112 up and down, the manifold 1132 is the location where the gas-liquid mixed fluid medium is merged, and the fluid medium is discharged through the fluid medium outlets 1125, 1112 and the fluid medium outlet 15 after the confluence of the manifold 1132. .

Further, when the spray area covers the entire heated surface of the spray chamber 1131, the spray cooling efficiency is the best. The spray coverage area is related to the spray cone angle and spray height, and the spray cone angle generated by the same series of spray holes 1123 with the same structure is affected by the inlet flow rate and system pressure, so the optimal spray height is also changed. The theoretical spray pattern of a single spray hole 1123 is shown in FIG. 4 , and the relationship between the theoretical spray height H, the theoretical spray circle diameter D and the spray cone angle θ is: H=0.5D/tan(θ/2). The calculation of the spray height H is illustrated by the 7×6 array layout used in this case. The bottom surface of the spray chamber 1131 is rectangular, and it is connected with the collecting chamber 1132 without borders. The area of the spray chamber 1131 covers an even Therefore, when designing the height of the spray chamber 1131, the length L and width W of the spray chamber 1131 are used as the boundaries of the spray area of the array, and a single The theoretical area of the spray circle is used to calculate the spray area of the entire array, so that it covers the bottom surface of the entire spray cavity 1131 as much as possible. The critical situation where the array spray circles are tangent to the bottom surface of the spray cavity 1131 is shown in Figure 5, and the minimum spray height must be greater than the theoretical spray height H calculated at this time to ensure that the array spray circles intersect and overlap, so as to cover as much as possible The area of the bottom surface of the spray cavity 1131 is the same as that of the spray holes 1123 in the array. Under the same nozzle inlet pressure, the diameter D of the spray circle should satisfy both: D>L/6 and D>W/7. Substitute into the formula: H=0.5D/tan(θ/2), the minimum critical spray height value of the spray space can be calculated. Therefore, the vertical distance from the bottom end of the outlet of the array spray holes 1123 to the bottom surface of the spray cavity 1131 must be greater than the calculated theoretical height H and the minimum critical spray height value, thereby ensuring sufficient space for the liquid cooling medium to be atomized.

The condensation plate 113 is not only one of the components of the micro-spray liquid cooling module 11, but also one of the components of the vapor chamber body 12, and has the function of accommodating the spray cooling medium and liquefying the gas working medium in the vapor chamber.

The vapor chamber body 12 is used as a phase change element to transfer the heat of the server heating chip to the micro-spray liquid cooling module 11, and can achieve rapid and uniform heat conduction, including the condensation plate 113, the liquid wick 121, the evaporation plate 122 and the liquid inlet. Degassing pipeline 123 .

The liquid absorbent core 121 is provided with a Y-shaped groove for accommodating the Y-shaped support column 1221 to provide capillary force for the vaporization of the liquid phase change working medium in the vacuum chamber 1222 and the liquid cooling backflow; the liquid absorbent core 121 is sintered respectively On the bottom surface of the vacuum chamber 1222 of the evaporation plate 122 and the lower surface of the condensing plate 113 at the corresponding position.

The evaporation plate 122 is provided with a Y-shaped support column 1221, a vacuum chamber 1222 and a liquid inlet and degassing hole 1223 for injecting liquid phase change working medium and pumping the vacuum chamber 1222 into a low pressure or vacuum state; the liquid inlet and degassing hole 1223 It is connected with the liquid inlet and degassing pipeline 123; the Y-shaped support column 1221 is integrally formed with the evaporation plate 122 and is located in the vacuum chamber 1221 to support the vapor chamber body assembly 12 and prevent the vacuum chamber 1221 from collapsing when cold. , and can also be used as an auxiliary flow channel for the backflow of the liquid phase change working medium inside the vapor chamber body 12 .

As shown in FIG. 1 , the gas flow circuit 2 includes an air compressor 21 , a gas storage tank 22 , a control needle valve 23 , a gas flow meter 24 , a pressure transmitter 25 and a pressure transmitter 28 , a temperature sensor 26 and a temperature sensor 26 . Sensor 27, gas-liquid separation device 29; the gas medium in the gas flow circuit 2 is non-condensable air, which has the advantages of being easy to obtain and can be directly discharged into the atmosphere without collecting after separation, and its main function is to assist entry The liquid cooling medium of the micro-spray phase-change liquid-cooled soaking plate 1 is atomized; the air compressor 21 is used to compress the air in the environment, increase the air pressure, and the compressed air enters the air storage tank 22; the control The valve 23 and the gas flow meter 24 are used to adjust and measure the volume flow of the air in the gas flow loop, thereby controlling the gas pressure in the loop; the pressure transmitter 25 and the temperature sensor 26 are respectively used to monitor the intake pipe 13 The gas pressure value and temperature value; the pressure transmitter 28 and the temperature sensor 27 are used to monitor the pressure value and temperature value of the gas-liquid mixed medium at the fluid outlet pipe 15 respectively; the gas-liquid separation device 29 is used to separate the The gas-liquid two-phase medium after heat exchange is separated, the separated air can be directly discharged into the atmosphere, and the separated liquid is returned to the liquid circulation circuit 3 again.

As shown in FIG. 1 , the liquid cooling circulation system 3 includes a liquid storage tank 31 , a gear pump 32 , a filter 33 , a plate heat exchanger 34 , a control needle valve 35 , and a liquid flow meter through which the liquid cooling medium flows in sequence. 36. The liquid heat exchange circulation loop composed of the pressure transmitter 37, the temperature sensor 38, and the liquid cooling medium pass through the liquid storage tank 31, the gear pump 32, and the filter 33, and then flow back to the liquid storage tank 31 through the bypass valve. Circulation circuit; the liquid storage tank 31 is used to store and recycle the liquid cooling medium; the gear pump 32 is used to pump the liquid cooling medium in the liquid storage tank 31; the filter 33 is used to filter the liquid after repeated circulation The impurities mixed in the cooling medium; the plate heat exchanger 34 is used to cool the heated liquid after participating in the heat exchange, and can also preheat the liquid cooling medium entering the micro-spray phase change liquid cooling soaking plate 1; the control needle The valve 35 and the liquid flow meter 36 are used to adjust and monitor the liquid flow; the pressure transmitter 37 and the temperature sensor 38 are used to monitor the pressure value and the temperature value of the liquid inlet pipe 112 respectively.

The working process of this embodiment is:

When the server is running, after the evaporation plate 122 of the micro-spray phase-change liquid-cooled vaporizing plate 1 in contact with the heating chip is heated, the liquid phase-change working medium in the vacuum chamber 1222 of the vaporizing plate is heated and evaporated, and quickly fills the entire vacuum chamber 1222 and vaporizes. The latter gas is condensed into a liquid state and releases thermal energy after encountering the lower temperature condensing plate 113; at this moment, the air in the environment is continuously compressed by the air compressor 21 and then enters the gas storage tank 22 to form high-pressure gas. At this time, by adjusting the gas The flow meter 23 adjusts the gas volume flow in the loop to the predetermined value of the volume flow obtained by the reading of the gas flow meter 24. The high-pressure gas is transported through the pipeline and enters the micro-spray phase change liquid-cooled soaking plate 1 through the intake pipeline 13. The gas pressure value and temperature value at the pipeline 13 are read by the pressure transmitter 25 and the temperature sensor 26; at the same time, the liquid cooling medium in the liquid storage tank 31 is transported by the gear pump 32, and after passing through the filter 33, a part of the liquid The cooling medium is sent to the liquid circulation loop that participates in heat exchange, and the liquid flows through the plate heat exchanger 34 before entering the micro-spray phase change liquid-cooled soaking plate 1, where the liquid is preheated; the liquid is adjusted by controlling the needle valve 35 The liquid flow rate in the circulation loop, after the flow rate in the liquid circulation loop reaches a predetermined value, flows into the micro-spray phase change liquid cooling soaking plate 1 through the liquid inlet pipe 14. The liquid flow rate, pressure and temperature value at the liquid inlet pipe 14 can be respectively The readings are obtained through the liquid flow meter 36, the pressure transmitter 37 and the temperature sensor 38; the other part is sent to the liquid pressure relief circulation loop, and flows back to the liquid storage tank 31 through the bypass valve 39 to prevent the liquid cooling circulation system 3 The gear pump 32 burns out when the liquid flow is small.

The high-pressure gas entering from the gas medium inlet 13 quickly fills the gas cavity 1124. The gas medium is high-pressure and continuous, and will flow into the array spray holes 1123 whose cross-sectional area first decreases and then increases from top to bottom at a high speed. Therefore, the gas pressure gradually decreases and then increases, and a low-pressure area will be formed at the minimum cross-sectional area of the spray holes 1123 of the array. Inhaled into the array spray holes 1123 in the low pressure area that has been formed, the gas and liquid will be mixed in the upper part of the array spray holes 1123. Therefore, under the high pressure of the gas, the liquid cooling medium is broken into small groups of droplets and quickly sprayed from the end of the array spray holes 1123 into the spray chamber 1131 filled with low-speed flow or still air. Under the interaction of viscosity and air resistance, it gradually changes from dripping, smooth flow, and wavy flow to mist-like fine groups and impacts the inner surface of the spray chamber 1131, that is, the heat exchange surface between the liquid cooling medium and the condensing plate 113. The spray impact and the phase change of the droplet take away the heat of the condensation plate 113. At this moment, the liquid working medium condensed in the vacuum chamber of the soaking plate is cooled by the capillary force of the liquid absorbing core 121, the gravity of the droplet itself and the auxiliary flow of the Y-shaped support column. The road returns to the evaporation plate 122 to complete a heat exchange process. After being heated, the liquid working medium will be vaporized again, and the cycle is repeated. The gas-liquid mixed medium after heat exchange in the micro-spray phase change liquid-cooled soaking plate 1 is collected in the manifold 1132 and then discharged to the gas-liquid separation device 29 through the fluid medium outlets 1125 and 1112 and the fluid outlet pipe 15 for separation. , the separated high-pressure air is directly discharged to the environment to be cooled, and the liquid cooling medium enters the plate heat exchanger 34 to be cooled and then flows back to the liquid storage tank 31 to participate in the next heat exchange. During the continuous repetition of the phase change heat transfer of the vapor chamber body 12 and the continuous circulation of gas and liquid outside the server, the heat dissipation of the server heating chip is completed.

The above-mentioned embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited by the described embodiments, and any other changes, modifications, substitutions, and combinations made without departing from the spirit and principle of the present invention , simplification, all should be equivalent replacement modes, and are all included in the protection scope of the present invention.

Claims (9)

1. A micro-spray phase change liquid cooling vapor chamber for a server is arranged on the upper part of a heating chip of the server and is characterized by comprising a micro-spray liquid cooling module, a vapor chamber body, an air inlet pipeline, a liquid inlet pipeline and a fluid outlet pipeline;

the micro-spray liquid cooling module comprises an upper cover plate, a spray plate and a condensing plate which are sequentially stacked; the upper cover plate is provided with a gas medium inlet and a fluid medium outlet; the gaseous medium inlet is communicated with the gas inlet pipeline, and the fluid medium outlet is communicated with the fluid outlet pipeline;

the spray plate comprises a liquid medium inlet, a liquid cavity, an array of spray holes, a gas cavity and a fluid medium outlet; the liquid medium inlet is respectively communicated with the liquid inlet pipeline and the liquid cavity, the array spraying holes are communicated with the liquid cavity, and the gas cavity is communicated with the gas medium inlet; the fluid medium outlet of the spraying plate is correspondingly communicated with the upper and lower positions of the fluid medium outlet of the upper cover plate;

the condensation plate comprises a spray cavity and a flow collecting cavity, the spray cavity is used for providing a space for atomizing fine liquid drop groups, the bottom of the spray cavity is used for receiving spray impact, and the flow collecting cavity is communicated with a fluid medium outlet on the spray plate up and down;

the distance between the array spray holes and the spray chamber is calculated as follows:

in the array of spray holes, the relation between the theoretical spray height H of a single spray hole and the theoretical spray circle diameter D and the spray cone angle theta is as follows: h =0.5D/tan (θ/2);

when the area of the spraying cavity covers the heated surface of the spraying cavity, the spraying cooling efficiency is optimal, and therefore the length L and the width W of the spraying cavity are used as the boundaries of the array spraying area;

the spray area of the whole array is calculated by using a single spray circle, under the condition of the same nozzle inlet pressure, the diameter of the spray circle generated on the ground of the spray cavity by adopting the 7 multiplied by 6 array spray hole layout needs to simultaneously meet the requirement that D is larger than L/6 and D is larger than W/7 to obtain the minimum critical spray height value of the spray space, so that the structure of the condensation plate is determined, the vertical distance from the bottom end of the outlet of the array spray hole to the bottom surface of the spray cavity is larger than the obtained minimum critical spray height value, and the sufficient space for atomizing the liquid cooling medium is ensured.

2. The micro-spray phase-change liquid-cooled soaking plate for servers according to claim 1, wherein the cross-sectional area of the array of spray holes is reduced from top to bottom and then increased.

3. A micro-spray phase change liquid cold soaking plate for server according to any one of claims 1-2, wherein the closer the distance between the spraying plate and the condensing plate, the larger the number of holes of the array spraying holes or the smaller the hole diameter.

4. The micro-spray phase-change liquid cooling vapor chamber for the server as claimed in claim 1, wherein the inner surfaces of the spray chamber and the current collecting chamber are provided with a three-dimensional complex surface structure, and the three-dimensional complex surface structure comprises a micro-channel array or a micro-turbulence column array.

5. The micro-spray phase change liquid cold soaking plate for server in claim 1,

the vapor chamber body comprises a condensing plate, a liquid absorption core, an evaporation plate and a liquid inlet degassing pipeline; the liquid absorption cores are provided with Y-shaped grooves and are respectively sintered on the bottom surfaces of the vacuum cavities of the evaporation plates and the lower surfaces of the condensation plates at corresponding positions;

the evaporating plate is equipped with Y shape support column, vacuum cavity and is used for injecting into liquid phase transition working medium and taking out the feed liquor degasification hole of becoming low pressure or vacuum state with the vacuum cavity, Y shape support column is processed with evaporating plate integrated into one piece, the feed liquor degasification hole is linked together with feed liquor degasification pipeline.

6. A heat sink operating system comprising the micro-spray phase change liquid thermal spreader of any of claims 1-5, a gas flow loop, and a liquid cooling circulation loop.

7. The heat dissipation operation system according to claim 6, wherein the liquid cooling circulation system comprises a liquid heat exchange circulation loop through which a liquid cooling medium flows, and the liquid heat exchange circulation loop comprises a liquid storage tank, a gear pump, a filter, a plate heat exchanger, a control needle valve, a liquid flow meter, a pressure transmitter and a temperature sensor;

and the liquid cooling medium flows out of the filter and then flows back to the liquid storage tank through the bypass valve in the liquid pressure relief circulation loop.

8. The heat dissipation operation system of claim 6, wherein the gas medium in the gas flow loop is non-condensable air, and is used for assisting in atomizing the liquid cooling medium entering the micro-spray phase-change liquid cooling soaking plate.

9. A control method of the cooling operation system according to any one of claims 6 to 8, comprising:

when the server operates, after an evaporation plate of the micro-spray phase-change liquid cooling vapor chamber which is in contact with the heating chip is heated, a liquid working medium in a vacuum chamber of the vapor chamber is heated and evaporated to fill the whole vacuum chamber, and the evaporated gas is condensed into a liquid state when meeting a condensing plate with a lower temperature and releases heat energy; at the moment, air in the environment is continuously compressed by an air compressor and then enters an air storage tank to form high-pressure gas, and the high-pressure gas is conveyed into a micro-spray phase change liquid cooling soaking plate through a pipeline to provide high-pressure gas conditions for atomizing a liquid cooling medium;

meanwhile, liquid cooling media participating in heat exchange circulation are conveyed into the micro-spray phase-change liquid cooling soaking plate through a gear pump, after high-pressure air is met in the array spray holes, the liquid cooling media are crushed into fine liquid drop groups under the action of high pressure and are quickly sprayed into the spray cavities filled with low-speed flowing or static air from the tail ends of the array spray holes, the fine liquid drop groups are gradually converted into fog-shaped fine groups through dropping, smooth flow and wave-shaped flow under the mutual action of liquid surface tension, viscosity and air resistance and impact on the inner surface of the spray cavities, and heat of the server chip is taken away through the soaking plate through spray impact and liquid drop phase change; and the gas-liquid two-phase medium after heat exchange enters a gas-liquid separation device, the separated high-pressure air is directly discharged to the environment to be cooled, and the liquid cooling medium flows back to the liquid storage tank after entering the heat exchanger to be cooled, so that the circulation is carried out.

Images