CN114596778B - display device - Google Patents

Abstract

A display device includes a cover plate, a display panel, a first conductive pattern, a second conductive pattern, a flexible circuit board, a first conductive structure and a second conductive structure. The display panel overlaps the cover and includes a first substrate. The first conductive pattern and the second conductive pattern are separated from each other, and each extends from a first side of the cover plate to a second side of the cover plate opposite to the first side. The second side of the cover faces the first substrate. The flexible circuit board is electrically connected to a plurality of pads on the first substrate. The first conductive pattern and the second conductive pattern are electrically connected to the flexible circuit board.

Description

display device

Technical field

The present invention relates to a display device, and in particular to a display device with a conductive pattern provided on the surface of a cover plate.

Background technique

A wearable device is an electronic product that can be worn by the user. For example, common wearable devices include watches, bracelets, glasses, etc. At present, wearable devices often include the function of collecting health information, such as detecting sleep status, calculating calories burned by exercise, and calculating the distance walked or run. In addition, since the heart is an important organ for the human body to maintain functioning, in order to monitor heart function, many people purchase wearable devices with functions such as detecting heartbeat and blood oxygen concentration.

Contents of the invention

An object of the present invention is to provide a display device that can transmit signals from the first conductive pattern and the second conductive pattern on the cover to a flexible circuit board.

At least one embodiment of the present invention provides a display device, including a cover plate, a display panel, a first conductive pattern, a second conductive pattern, a flexible circuit board, a first conductive structure and a second conductive structure. The display panel overlaps the cover and includes a first substrate. The first conductive pattern and the second conductive pattern are located on the cover plate and separated from each other, wherein the first conductive pattern and the second conductive pattern each extend from the first side of the cover plate to the second side of the cover plate opposite to the first side. The second side of the cover faces the first substrate. The flexible circuit board is electrically connected to a plurality of pads on the first substrate. The first conductive structure and the second conductive structure are respectively located between the first conductive pattern and the display panel and between the second conductive pattern and the display panel, and the first conductive pattern and the second conductive pattern are electrically connected to the flexible circuit board.

The beneficial effect of the present invention is that through the arrangement of the first conductive structure and the second conductive structure, the signals of the first conductive pattern and the second conductive pattern on the cover plate can be transmitted to the flexible circuit board.

Description of the drawings

FIG. 1A is a schematic top view of a display device according to an embodiment of the present invention.

FIG. 1B is a schematic bottom view of a display device according to an embodiment of the present invention.

Figure 2 is a schematic cross-sectional view along line a-a' in Figure 1B.

Figure 3 is a schematic cross-sectional view of line b-b' in Figure 1B.

4A and 4B are partial enlarged schematic diagrams of a display device according to an embodiment of the present invention.

FIG. 5A is a schematic top view of a flexible circuit board according to an embodiment of the present invention.

FIG. 5B is a schematic bottom view of a flexible circuit board according to an embodiment of the present invention.

Figure 5C is a schematic cross-sectional view along line c-c' in Figure 5A.

Figure 5D is a schematic cross-sectional view along line d-d' in Figure 5A.

FIG. 6 is a schematic cross-sectional view of a display device according to an embodiment of the present invention.

FIG. 7A is a schematic top view of a flexible circuit board according to an embodiment of the present invention.

Figure 7B is a schematic cross-sectional view along line c-c' in Figure 7A.

Figure 8 is a schematic cross-sectional view of a flexible circuit board according to an embodiment of the present invention.

9 and 10 are partial enlarged schematic diagrams of a display device according to an embodiment of the present invention.

The reference numbers are as follows:

1,2:Display device

100:Cover

102: Side 1

104:Second side

110: First conductive pattern

112,122:end

120: Second conductive pattern

130: First conductive structure

140: Second conductive structure

200,200a:Display panel

210, 210a: first substrate

212a, 212b, 212c: pads

220,220a: Second substrate

300, 300a, 300b: Flexible circuit board

310:Soft substrate

312: Side 1

314:Second side

316:Conductive hole

320: First circuit layer

322,332: Circuit board pads

322a,332a: first layer

322b, 332b: second layer

324,334: Routing

330: Second circuit layer

340: Ink layer

350: First protective layer

360:Second layer of protection

370:Electronic components

380:Connection terminal

390:Buffer structure

392:Adhesive layer

394:Add higher level

400: Thin film flip chip packaging structure

500:Printed circuit board

510: Connector

a-a’, b-b’, c-c’, d-d’: lines

AA: display area

BA:surrounding area

BD: bend area

BN: junction area

CG1: The first conductive glue

CG2: Second conductive glue

H: light hole

GP:Gap

PC: elastic conductive structure

POL: polarized structure

OCA: optical adhesive layer

t1,X1,X2: thickness

Detailed ways

FIG. 1A is a schematic top view of a display device according to an embodiment of the present invention. FIG. 1B is a schematic bottom view of a display device according to an embodiment of the present invention. Figure 2 is a schematic cross-sectional view along line a-a' in Figure 1B. Figure 3 is a schematic cross-sectional view of line b-b' in Figure 1B.

Referring to FIGS. 1A to 3 , the display device 1 includes a cover 100 , a display panel 200 , a first conductive pattern 110 , a second conductive pattern 120 , a flexible circuit board 300 , a first conductive structure 130 and a second conductive structure 140 . In this embodiment, the display device 1 further includes a thin film flip chip packaging structure 400 , a printed circuit board 500 and a connector 510 .

The cover 100 is, for example, glass, quartz, organic polymer, or other applicable materials. In this embodiment, the cover 100 includes a first surface 102 and a second surface 104 opposite to the first surface 102 . In some embodiments, the first side 102 of the cover 100 is the outer surface of the display device 1 . For example, the display device 1 is suitable for use as part of a watch, and the first side 102 of the cover 100 is the surface of the watch. In this embodiment, the first surface 102 of the cover 100 is a curved surface, but the invention is not limited thereto. In other embodiments, the first side 102 of the cover 100 is flat.

The first conductive pattern 110 and the second conductive pattern 120 are located on the cover 100 and separated from each other. In some embodiments, the first conductive pattern 110 and the second conductive pattern 120 are directly formed on the cover 100 by physical vapor deposition, chemical vapor deposition, atomic layer deposition, chemical plating or other suitable methods. In some embodiments, the materials of the first conductive pattern 110 and the second conductive pattern 120 include metal, metal oxide, metal nitride or other suitable materials. In some embodiments, the thickness t1 of the first conductive pattern 110 and the second conductive pattern 120 is, for example, 200 nanometers to 600 nanometers, but the invention is not limited thereto.

In this embodiment, the first conductive pattern 110 and the second conductive pattern 120 are disposed close to the edge of the first surface 102 of the cover 100 , and each extend from the first surface 102 of the cover 100 to the end of the cover 100 relative to the first surface 102 of the cover 100 . Second side 104 of side 102 . In some embodiments, one end 112 of the first conductive pattern 110 extending to the second surface 104 is adjacent to one end 122 of the second conductive pattern 120 extending to the second surface 104 , thereby electrically connecting the first conductive pattern 110 to the display panel 200 . The location of the electrical connection is adjacent to the location of the electrical connection between the second conductive pattern 120 and the display panel 200 , further saving circuit layout space.

The display panel 200 overlaps the cover 100 . In this embodiment, the display panel 200 includes a first substrate 210 and a second substrate 220 . The first substrate 210 is located between the cover plate 100 and the second substrate 220 . The second side 104 of the cover 100 faces the first substrate 210 . In some embodiments, the optical adhesive layer OCA and the polarizing structure POL are located between the first substrate 210 and the cover plate 100 .

In some embodiments, the first substrate 210 is a touch device substrate. For example, the first substrate 210 includes a carrier (glass, quartz, organic polymer, or other applicable materials) and pads, signal lines, active components, passive components, and/or formed on the carrier. or touch electrodes. For convenience of explanation, FIGS. 2 and 3 show the pads 212a and 212b in the first substrate 210, and other components are omitted.

In some embodiments, the second substrate 220 is an active device substrate. For example, the second substrate 220 includes a carrier plate (glass, quartz, organic polymer, or opaque/reflective material (such as conductive material, metal, wafer, ceramic or other applicable materials) or other applicable materials). Applicable materials) as well as the pads, signal lines, active components, passive components and/or light-emitting components formed on the aforementioned carrier board. For convenience of explanation, FIGS. 2 and 3 omit specific components of the second substrate 220 . The second substrate 220 may be a micro-LED substrate, an organic light-emitting diode substrate, or a pixel array substrate suitable for a liquid crystal display panel. In some embodiments, the second substrate 220 is electrically connected to the thin film flip chip packaging structure 400 . The thin film flip chip packaging structure 400 includes, for example, a driver chip or other components.

The first substrate 210 overlaps the second substrate 220 and is fixed together through optical glue, frame glue or other suitable materials (not shown in FIGS. 2 and 3 ).

The first conductive structure 130 is located between the first conductive pattern 110 and the display panel 200 , and the second conductive structure 140 is located between the second conductive pattern 120 and the display panel 200 . In this embodiment, the first conductive structure 130 is electrically connected to the first conductive pattern 110 and the pad 212a of the first substrate 210, and the second conductive structure 140 is electrically connected to the second conductive pattern 120 and the pad 212a of the first substrate 210. Pad 212b. The first conductive pattern 110 is electrically connected to the flexible circuit board 300 through the first conductive structure 130 and the pad 212a, and the second conductive pattern 120 is electrically connected to the flexible circuit through the second conductive structure 140 and the pad 212b. Plate 300.

In this embodiment, the first conductive structure 130 and the second conductive structure 140 each include a first conductive glue CG1, a second conductive glue CG2, and an elastic conductive structure PC located between the first conductive glue CG1 and the second conductive glue CG2. . In this embodiment, the first conductive structure 130 and the second conductive structure 140 can conduct electricity in the three directions of x-axis, y-axis, and z-axis, or can only conduct electricity in the z-axis direction. In other words, the first conductive structure 130 and the second conductive structure 140 may be general conductive materials or anisotropic conductive materials. In some embodiments, the elastic conductive structure PC is a compressible material, such as conductive foam. The thickness of the elastic conductive structure PC is greater than the thickness of the first conductive glue CG1 and the thickness of the second conductive glue CG2.

4A and 4B are partially enlarged schematic diagrams of a display device according to an embodiment of the present invention, wherein FIGS. 4A and 4B show the flexible circuit board 300 and the display panel of the display device 1 of FIGS. 1A and 1B 200 is a top view schematic diagram of the electrical connection, and the cover 100 and the portion of the first conductive structure 110 and the second conductive structure 120 located on the first surface 102 of the cover 100 are omitted.

Please refer to FIG. 4A and FIG. 4B. In this embodiment, the display panel 200 includes a display area AA and a peripheral area BA located outside the display area AA. In the peripheral area BA, the first substrate 210 has a plurality of contact pads 212a, 212b, and 212c. In some embodiments, pad 212c is located between pad 212a and pad 212b.

The flexible circuit board 300 is electrically connected to the plurality of pads 212a, 212b, and 212c of the first substrate 210. For example, the flexible circuit board 300 is bonded to the pads 212a, 212b, and 212c using solder, conductive glue, or other methods. The material of the pads 212a, 212b, 212c may include metal, metal oxide, metal nitride or other suitable materials.

The pads 212 a and 212 b extend from the bottom of the flexible circuit board 300 in a direction away from the flexible circuit board 300 . In this embodiment, the pads 212a and 212b extend in different directions from the bottom of the flexible circuit board 300 respectively. For example, the pad 212a extends toward the left, and the pad 212b extends toward the right. The first conductive structure 130 is disposed on the pad 212a and electrically connects the pad 212a to one end 112 of the first conductive pattern 110. The second conductive structure 140 is disposed on the pad 212b and electrically connects the pad 212b to one end 122 of the second conductive pattern 120. The pad 212c is adapted to be electrically connected to the signal line SL in the first substrate 210. It should be noted that FIG. 4A and FIG. 4B omit the part where the signal line SL extends into the display area AA, and the layout of the signal line SL can be adjusted according to actual needs. For example, in some embodiments, the first substrate 210 is a touch device substrate, and the contact pads 212c are suitable for transmitting touch signals on the touch device substrate, and the signal line SL extends into the display area AA and serves as a touch signal. control signal line, but the present invention is not limited to this. In other embodiments, the first substrate 210 is an active device substrate, and the pads 212c are suitable for transmitting signals from the light emitting diodes or pixel arrays, and the signal lines SL extend into the display area AA and serve as scan lines or data lines.

Based on the above, in this embodiment, the signals (such as electrocardiogram (ECG) signals) received by the first conductive pattern 110 and the second conductive pattern 120 are transmitted to the flexible circuit board 300 . In addition, in some embodiments, the first conductive pattern 110 and the second conductive pattern 120 do not contact a conductive outer frame, such as a watch case, thereby preventing signals from the first conductive pattern 110 and the second conductive pattern 120 from passing through. frame and grounded. In some embodiments, the display device 1 is a frameless product, which means that no other outer frame is used to cover the first conductive pattern 110 and the second conductive pattern 120 .

Please refer to FIG. 1B , FIG. 4A and FIG. 4B at the same time. In this embodiment, the flexible circuit board 300 is bent from the side of the first substrate 210 toward the cover 100 to the side of the first substrate 210 facing away from the cover 100 , and is electrically connected to the printed circuit board 500 through the connector 510 . In other embodiments, the flexible circuit board 300 is disposed on a side of the first substrate 210 facing away from the cover 100 and is electrically connected to the pads 212a, 212b, and 212c through conductive holes penetrating the first substrate 210.

In this embodiment, the printed circuit board 500 can be bent to the back of the cover 100 , for example. For example, when the display device 1 is combined with a watch strap and/or other watch components, the printed circuit board 500 can be bent to prevent the printed circuit board 500 from being exposed to the front of the watch.

FIG. 5A is a schematic top view of a flexible circuit board according to an embodiment of the present invention. FIG. 5B is a schematic bottom view of a flexible circuit board according to an embodiment of the present invention. Figure 5C is a schematic cross-sectional view along line c-c' in Figure 5A. Figure 5D is a schematic cross-sectional view along line d-d' in Figure 5A. It must be noted here that the embodiment of FIGS. 5A to 5D follows the component numbers and part of the content of the embodiment of FIGS. 1A to 4B , where the same or similar numbers are used to represent the same or similar elements, and the same or similar elements are omitted. Description of technical content. For descriptions of omitted parts, reference may be made to the foregoing embodiments and will not be described again here.

Please refer to FIGS. 5A to 5D . The flexible circuit board 300 includes a flexible substrate 310 , a first circuit layer 320 , a second circuit layer 330 , an ink layer 340 , a first protective layer 350 , a second protective layer 360 and a plurality of electronic components. Element 370. The flexible substrate 310 is, for example, polyamide (PA), polyimide (PI), poly(methylmethacrylate) (PMMA), polyethylene naphthalate (Polyethylene naphthalate) , PEN), polyethylene terephthalate (PET), fiberglass reinforced plastics (Fiber reinforced plastics, FRP), polyetheretherketone (PEEK), epoxy resin or other suitable materials or the aforementioned At least two combinations, but not limited to this.

The first circuit layer 320 is located on the first side 312 of the flexible substrate 310 . The first circuit layer 320 includes circuit board pads 322 and traces 324 . In this embodiment, the circuit board pad 322 includes a double-layer structure, for example, a first layer 322a and a second layer 322b. The first layer 322a and the traces 324 include, for example, copper or other conductive materials. The second layer 322b includes, for example, gold, nickel, or other materials or a combination of the above materials. The ink layer 340 and the first protective layer 350 are located on the first circuit layer 320. In this embodiment, the flexible substrate 310 has a bending area BD corresponding to the side of the display panel 200 (please refer to FIGS. 2 and 3 ), and the ink layer 340 is disposed in the bending area BD.

In this embodiment, the pads 212a, 212b, and 212c (please refer to FIGS. 2 and 3) of the display panel 200 (please refer to FIGS. 2 and 3) are located on the first surface 312 of the flexible substrate 310 and are electrically connected. to the circuit board pads 322 of the first circuit layer 320 . The circuit board pads 322 and the pads 212a, 212b, and 212c of the flexible circuit board 300 are located in the bonding area BN of the first surface 312 of the flexible substrate 310. The circuit board pads 322 of the flexible circuit board 300 and the pads 212a, 212b, and 212c of the display panel 200 are connected by, for example, anisotropic conductive glue or other conductive structures.

The second circuit layer 330 is located on the second side 314 of the flexible substrate 310 opposite to the first side 312 . Second circuit layer 330 includes traces 334 . The second protective layer 360 is located on the second circuit layer 330. In this embodiment, the first circuit layer at least partially overlaps the bending area BD, and the second circuit layer 330 does not overlap the bending area BD of the flexible substrate 310, so that the bending area BD of the flexible substrate 310 can be smaller. Easy to bend.

The electronic component 370 is located on the second side 314 of the flexible substrate 310 . For example, the electronic component 370 is disposed on the second protective layer 360 and is electrically connected to the second circuit layer 330 . In some embodiments, the electronic component 370 includes a photosensitive component, a chip, a resistor, a capacitor, a diode or other suitable components. In some embodiments, the flexible circuit board 300 is provided with a light-transmitting hole H. The light-transmitting hole H is suitable for allowing light to pass through the flexible substrate 310 so that the photosensitive element in the electronic component 370 can receive the light.

In some embodiments, the flexible circuit board 300 further includes a connection terminal 380, and the connection terminal 380 is, for example, a gold finger. In some embodiments, the connection terminals 380 are provided on the first surface 312 and/or the second surface 314 of the flexible substrate 310 . The connection terminal 380 is adapted to be inserted into the connector 510 (please refer to FIGS. 1A and 1B ). In some embodiments, the signal received by the first conductive pattern 110 can pass through the first conductive structure 130, the pad 212a of the display panel 200, the first circuit layer 320, optionally the second circuit layer 330, and the connection terminal 380. and the connector 510 to be electrically connected to the printed circuit board 500 (please refer to FIG. 1A and FIG. 1B ). The signal received by the second conductive pattern 120 (please refer to FIG. 1A and FIG. 1B ) can pass through the second conductive structure 140 , the pad 212 b of the display panel 200 , the first circuit layer 320 , and optionally the second circuit layer 330 . The connection terminals 380 and the connector 510 are electrically connected to the printed circuit board 500 (please refer to FIGS. 1A and 1B ).

FIG. 6 is a schematic cross-sectional view of a display device according to an embodiment of the present invention. FIG. 7A is a schematic top view of a flexible circuit board according to an embodiment of the present invention. Figure 7B is a schematic cross-sectional view along line c-c' in Figure 7A. For example, FIG. 7A and FIG. 7B are schematic diagrams of the flexible circuit board 300a of FIG. 6 . For convenience of explanation, FIG. 6 omits showing specific components in the flexible circuit board 300a, and FIG. 7B shows the positions of the first conductive structure 130 and the second conductive structure 140 in dashed boxes.

It must be noted here that the embodiment of FIG. 6 follows the component numbers and part of the content of the embodiment of FIGS. 1A to 4B , where the same or similar numbers are used to represent the same or similar elements, and references with the same technical content are omitted. illustrate. For descriptions of omitted parts, reference may be made to the foregoing embodiments and will not be described again here.

Please refer to FIG. 6 , FIG. 7A and FIG. 7B . In this embodiment, the first conductive structure 130 and the second conductive structure 140 are respectively located between the flexible substrate 300 a and the cover 100 .

In this embodiment, the second circuit layer 330 further includes a bonding area BN where the circuit board pad 332 is located on the second surface 314 . In this embodiment, the circuit board pad 332 includes a double-layer structure, for example, a first layer 332a and a second layer 332b. The first layer 332a includes, for example, copper or other conductive material. The second layer 332b includes, for example, gold, nickel, or other materials or combinations of the above materials.

In this embodiment, the first conductive structure 130 and the second conductive structure 140 are located on the second surface 314 of the flexible substrate 310, and the contact pads of the display panel 200 (such as the contact pads 212c, as shown in FIGS. 4A and 4B) Located on the first surface 312 of the flexible substrate 310 . The two circuit board pads 332 are electrically connected to the first conductive structure 130 and the second conductive structure 140 respectively. In this embodiment, the first conductive structure 130 and the second conductive structure 140 are bonded to the corresponding circuit board pads 332, and then are electrically connected to the first circuit layer 320 by passing through the conductive holes 316 of the flexible substrate 310. Route 324. The circuit board pads 322 of the first circuit layer 320 are electrically connected to the pads of the display panel 200 (eg, pads 212c, as shown in FIGS. 4A and 4B ).

In some embodiments, some of the traces 324 of the first circuit layer 320 also include a double-layer structure similar to the circuit board pads 322, but the invention is not limited thereto.

In some embodiments, the signal received by the first conductive pattern 110 can be electrically connected to the printed circuit through the first conductive structure 130, the second circuit layer 330, the first circuit layer 320, the connection terminal 380 and the connector 510. Board 500 (please refer to Figure 1A and Figure 1B). The signal received by the second conductive pattern 120 (please refer to FIG. 1A and FIG. 1B ) can be electrically connected through the second conductive structure 140 , the second circuit layer 330 , the first circuit layer 320 , the connection terminal 380 and the connector 510 to the printed circuit board 500 (please refer to Figure 1A and Figure 1B). In this embodiment, the signals received by the first conductive pattern 110 and the second conductive pattern 120 (please refer to FIG. 1A and FIG. 1B ) will not be transmitted through the pads of the display panel 200 , which can avoid the problem of the pads of the display panel being Damage caused by electrostatic discharge.

In this embodiment, the flexible circuit board 300a further includes a buffer structure 390. The buffer structure 390 is located on the second surface 314 of the flexible substrate 310 , and the buffer structure 390 is located between the circuit board pads 332 . The buffer structure 390 is, for example, a single-layer or multi-layer structure. For example, in this embodiment, the buffer structure 390 includes an adhesive layer 392 and an increasing layer 394 located on the adhesive layer 392 . The reinforcing layer 394 includes insulating materials, such as polyamide (PA), polyimide (PI), polymethyl methacrylate (PMMA), polyethylene naphthalate (Polyethylene naphthalate, PEN), polyethylene terephthalate (PET), fiberglass reinforced plastics (Fiber reinforced plastics, FRP), polyetheretherketone (PEEK), epoxy resin or other suitable materials or a combination of at least two of the foregoing, but not limited to this.

In some embodiments, the thickness X1 of the buffer structure 390 is greater than or equal to the thickness X2 of the circuit board pad 332 . The buffer structure 390 helps reduce the impact of the gap between the circuit board pad 332 and the flexible substrate 310 on the manufacturing yield of the first conductive structure 130 and the second conductive structure 140 . In some embodiments, part of the first conductive structure 130 and part of the second conductive structure 140 are formed on the buffer structure 390 .

Figure 8 is a schematic cross-sectional view of a flexible circuit board according to an embodiment of the present invention. For convenience of explanation, FIG. 8 shows the positions of the first conductive structure 130 and the second conductive structure 140 in dashed boxes.

It must be noted here that the embodiment of Figure 8 follows the component numbers and part of the content of the embodiment of Figures 6 to 7B, where the same or similar numbers are used to represent the same or similar elements, and references to the same technical content are omitted. illustrate. For descriptions of omitted parts, reference may be made to the foregoing embodiments and will not be described again here.

Please refer to FIG. 8 . In this embodiment, the buffer structure 390 of the flexible circuit board 300 b is laterally separated from the circuit board pads 332 . By providing a gap GP between the circuit board pad 332 and the buffer structure 390, the buffer structure 380 can be prevented from covering the circuit board pad 332 due to process errors, thereby improving the bonding of the first conductive structure 130 and the second conductive structure 140 to the circuit. Process yield of board bonding pad 332 .

9 and 10 are partial enlarged schematic diagrams of a display device according to an embodiment of the present invention. It must be noted here that the embodiments of Figures 9 and 10 follow the component numbers and part of the content of the embodiments of Figures 1 to 4B, where the same or similar numbers are used to represent the same or similar elements, and the same or similar elements are omitted. Description of technical content. For descriptions of omitted parts, reference may be made to the foregoing embodiments and will not be described again here.

Please refer to FIGS. 9 and 10 . In this embodiment, the display device 2 includes a cover 100 , a display panel 200 a , a first conductive pattern 110 , a second conductive pattern 120 , a flexible circuit board 300 , a first conductive structure 130 and Second conductive structure 140.

The display panel 200a overlaps the cover 100 and includes a first substrate 210a and a second substrate 220a. The second substrate 220a is located between the cover plate 100 and the first substrate 210a.

In some embodiments, the first substrate 210a is an active component substrate. For example, the first substrate 210a includes a carrier plate (glass, quartz, organic polymer, or opaque/reflective material (such as conductive material, metal, wafer, ceramic or other applicable materials) or other applicable materials). Applicable materials) as well as the pads, signal lines, active components, passive components and/or light-emitting components formed on the aforementioned carrier board. For convenience of explanation, Figures 9 and 10 omit specific components in the first substrate 210a. The first substrate 210a can be a micro-LED substrate, an organic light-emitting diode substrate, or a pixel array substrate suitable for a liquid crystal display panel. In some embodiments, some pads (not shown in FIGS. 9 and 10 ) of the first substrate 210a are electrically connected to the light-emitting elements or pixel arrays, and are packaged with the flexible circuit board 300 or thin film flip-chip (FIG. 9 and not shown in Figure 10).

In some embodiments, the second substrate 220a is a touch device substrate. For example, the second substrate 220a includes a carrier (glass, quartz, organic polymer or other applicable materials) and pads, signal lines, active components, passive components and/or formed on the carrier. or touch electrodes. For convenience of explanation, specific components in the second substrate 220a are omitted from FIG. 9 and FIG. 10 .

The first substrate 210a overlaps the second substrate 220a and is fixed together through optical glue, frame glue or other suitable materials (not shown in FIGS. 9 and 10 ).

The first conductive pattern 110 and the second conductive pattern 120 are located on the cover plate 100 and separated from each other, wherein the first conductive pattern 110 and the second conductive pattern 120 each extend from the first side 102 of the cover plate 100 to the cover plate relative to the first surface. Second side 104 of side 102 . The second surface 104 of the cover 100 faces the first substrate 210a. The flexible circuit board 300 is electrically connected to the plurality of pads 212a and 212b of the first substrate 210a. The first conductive structure 130 is located between the first conductive pattern 110 and the display panel 210a, the second conductive structure 140 is located between the second conductive pattern 120 and the display panel 210a, and the first conductive pattern 110 and the second conductive pattern 120 are electrically Connected to the flexible circuit board 300.

To sum up, the present invention can transmit the signals of the first conductive pattern and the second conductive pattern on the cover plate to the flexible circuit board through the arrangement of the first conductive structure and the second conductive structure.

Claims (11)

1. A display device, comprising: a cover plate; A display panel overlaps the cover and includes a first substrate; A first conductive pattern and a second conductive pattern are located on the cover plate and separated from each other, wherein the first conductive pattern and the second conductive pattern each extend from a first side of the cover plate to the cover plate relative to a second side of the first side, wherein the second side of the cover faces the first substrate; a flexible circuit board electrically connected to a plurality of pads of the first substrate; and A first conductive structure and a second conductive structure are respectively located between the first conductive pattern and the display panel and between the second conductive pattern and the display panel, and the first conductive pattern and the second conductive pattern electrically connected to the flexible circuit board. 2. The display device of claim 1, wherein the display panel further comprises: A second substrate, wherein the first substrate is located between the cover plate and the second substrate, wherein the second substrate is an active component substrate, and the first substrate is a touch device substrate. 3. The display device of claim 1, wherein the display panel further comprises: A second substrate, wherein the second substrate is located between the cover plate and the first substrate, wherein the first substrate is an active component substrate, and the second substrate is a touch device substrate. 4. The display device of claim 1, wherein the flexible circuit board includes: a flexible substrate; A first circuit layer and a second circuit layer are respectively located on an opposite first side and a second side of the flexible substrate, wherein the first conductive structure and the second conductive structure are located on the flexible substrate. a second side, and a plurality of the contact pads are located on the first side of the flexible substrate. 5. The display device as claimed in claim 4, wherein the flexible circuit board further comprises: A buffer structure is located on the second side of the flexible substrate, wherein the second circuit layer includes a plurality of circuit board pads, and the plurality of circuit board pads are electrically connected to the first conductive structure and the third Two conductive structures, and the buffer structure is located between a plurality of circuit board pads. 6. The display device of claim 5, wherein a thickness of the buffer structure is greater than or equal to a thickness of a plurality of circuit board pads. 7. The display device of claim 5, wherein the buffer structure is laterally separated from a plurality of circuit board pads. 8. The display device of claim 1, wherein the flexible circuit board includes: A flexible substrate has a joint area and a bending area; A first circuit layer and a second circuit layer are respectively located on an opposite first side and a second side of the flexible substrate. The first circuit layer at least partially overlaps the bending area, and the second circuit layer Not overlapping the bending area of the flexible substrate, wherein a plurality of the contact pads are located in the bonding area of the first side of the flexible substrate. 9. The display device of claim 8, wherein the second circuit layer includes a plurality of circuit board pads located in the bonding area, wherein the plurality of circuit board pads are electrically connected to the first conductive structure respectively. The second conductive structure, and the plurality of circuit board pads are electrically connected to the first circuit layer through a plurality of conductive holes passing through the flexible substrate. 10. The display device of claim 1, wherein the first conductive structure and the second conductive structure each comprise a first conductive glue, a second conductive glue, and a conductive glue located between the first conductive glue and the second conductive glue. elastic conductive structure between. 11. The display device of claim 1, further comprising: An optical adhesive layer and a polarizing structure are located between the first substrate and the cover plate.