CN114584209A - Optical module - Google Patents

Abstract

The application provides an optical module, which comprises a circuit board, an MCU (microprogrammed control unit) arranged on the circuit board, a laser driving chip electrically connected with the MCU and a laser chip electrically connected with the laser driving chip, wherein the MCU comprises a temperature sensor and a first register, the temperature sensor is used for acquiring a temperature parameter, the first register stores a transmitting pre-emphasis setting value, and the MCU reads a corresponding transmitting pre-emphasis setting value from the first register according to the temperature parameter; the laser driving chip comprises an emission pre-emphasis regulator, a pre-emphasis controller and a pre-emphasis controller, wherein the emission pre-emphasis regulator is used for receiving an emission pre-emphasis set value and regulating the intensity of output modulation current according to the emission pre-emphasis set value; the laser chip is used for emitting optical signals with corresponding intensity according to the adjusted modulation current. Different emission pre-emphasis setting values are set at different temperatures, the intensity of an emission signal is adjusted according to the emission pre-emphasis setting values, the emission signal and a signal line inside a module form optimal matching, and the emission performance of an optical module is ensured to be in an optimal state.

Description

Optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology become increasingly important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.

For a high-speed optical module, a Pre-Emphasis (EM) and equalization (CTLE) regulator is usually integrated inside a transceiver driver chip, and the intensity of input and output signals is controlled by adjusting the EM and the CTLE to form an optimal match with a single board of an apparatus and a signal line inside the module, so as to ensure that the performance (such as a transmitting optical eye diagram, receiving sensitivity, signal transmission, and the like) of the optical module is in an optimal state. In order to protect the performance and the working state of the optical module, the pre-emphasis TXEM of a transmitting end and the debugging interface of the balance CTLE of a receiving end are not opened outwards, and are debugged in the optical module, namely, a determined value is already solidified when the optical module leaves a factory, and the value is not changed in the whole life cycle of the module.

However, with the continuous improvement of the speed of the optical module, the continuous increase of the transmission distance, and the diversification of the optical module scheme, it is found in experiments that if the transmitting pre-emphasis TXEM and the receiving pre-emphasis CTLE of the optical module are set to a fixed value, the transmitting performance or the receiving performance of the module in a certain temperature region is poor, and even the index requirement cannot be met, or the problem that the performance of the module is degraded and the index requirement cannot be met when the module transmits a service through an optical fiber with a certain length occurs.

Disclosure of Invention

The embodiment of the application provides an optical module to solve the problem that the transmitting performance or the receiving performance of the optical module is poor under a certain temperature region due to the fact that transmitting pre-emphasis TXEM and receiving CTLE of the optical module are fixed values.

In a first aspect, the present application provides an optical module, comprising:

a circuit board;

the MCU is arranged on the circuit board and comprises a temperature sensor and a first register, wherein the temperature sensor is used for acquiring temperature parameters, and the first register stores a transmitting pre-emphasis setting value; for reading a corresponding emission pre-emphasis setting value from the first register in accordance with the temperature parameter;

the laser driving chip is arranged on the circuit board, is electrically connected with the MCU, and comprises an emission pre-emphasis regulator which is used for receiving the emission pre-emphasis setting value and regulating the intensity of the output modulation current according to the emission pre-emphasis setting value;

and the laser chip is electrically connected with the laser driving chip and is used for emitting optical signals with corresponding intensity according to the adjusted modulation current.

In a second aspect, the present application provides a light module comprising:

a circuit board;

the MCU is arranged on the circuit board and comprises a temperature sensor and a second register, the temperature sensor is used for acquiring temperature parameters, and the second register stores receiving balance setting values; the receiving equalization setting value is used for reading a corresponding receiving equalization setting value from the second register according to the temperature parameter;

the receiving chip is arranged on the circuit board and used for converting the received optical signal into an electric signal;

and the receiving driving chip is arranged on the circuit board, is electrically connected with the MCU and the receiving chip, and comprises a receiving balance regulator which is used for receiving the receiving balance setting value and adjusting the high-frequency intensity of the converted electric signal according to the receiving balance setting value.

In a third aspect, the present application provides an optical module, comprising:

a circuit board;

the MCU is arranged on the circuit board and comprises a temperature sensor, a first register and a second register, wherein the temperature sensor is used for acquiring temperature parameters, the first register stores a transmitting pre-emphasis setting value, and the second register stores a receiving equalization setting value; the receiving equalization control module is used for reading a corresponding transmitting pre-emphasis setting value from the first register according to the temperature parameter and reading a corresponding receiving equalization setting value from the second register according to the temperature parameter;

the transmitting-receiving driving chip is arranged on the circuit board, is electrically connected with the MCU and comprises a transmitting pre-emphasis regulator and a receiving equalization regulator, wherein the transmitting pre-emphasis regulator is used for receiving the transmitting pre-emphasis setting value and regulating the output modulation current intensity according to the transmitting pre-emphasis setting value; the receiving balance regulator is used for receiving the receiving balance setting value and regulating the high-frequency intensity of the converted electric signal according to the receiving balance setting value;

the laser chip is electrically connected with the transceiving driving chip and used for transmitting an optical signal with corresponding intensity according to the adjusted modulation current;

and the receiving chip is electrically connected with the transceiving driving chip and is used for converting the received optical signal into an electric signal.

As can be seen from the foregoing embodiments, an optical module is provided in an embodiment of the present application, where the optical module includes a circuit board, an MCU, a laser driver chip, and a laser chip, the MCU is disposed on the circuit board, the MCU includes a temperature sensor and a first register, the temperature sensor is configured to acquire a temperature parameter, the first register stores a pre-emphasis emission setting value, that is, a register area is provided inside the MCU to store the pre-emphasis emission setting value corresponding to the temperature, and the MCU is configured to read the corresponding pre-emphasis emission setting value from the first register according to the temperature parameter, so as to acquire the corresponding pre-emphasis emission setting value at different temperatures; the laser driving chip is arranged on the circuit board, is electrically connected with the MCU, and comprises an emission pre-emphasis regulator, a control unit and a control unit, wherein the emission pre-emphasis regulator is used for receiving an emission pre-emphasis setting value at a corresponding temperature, regulating the intensity of output modulation current according to the emission pre-emphasis setting value, namely writing the emission pre-emphasis setting value corresponding to the temperature into the emission pre-emphasis regulator, and outputting modulation current with corresponding intensity by the emission pre-emphasis regulator according to the emission pre-emphasis setting value; the laser chip is electrically connected with the laser driving chip and used for emitting optical signals with corresponding intensity according to the adjusted modulation current, so that the emitted signals form optimal matching with the circuit board and signal lines inside the optical module at corresponding temperature, the emission performance (emission light eye pattern, signal transmission and the like) of the optical module is in an optimal state, and the optical module can normally and stably work in a full-temperature area.

Drawings

In order to more clearly illustrate the technical solutions in the present disclosure, the drawings needed to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art according to the drawings. Furthermore, the drawings in the following description may be regarded as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, the actual timing of signals, and the like, involved in the embodiments of the present disclosure.

FIG. 1 is a connection diagram of an optical communication system according to some embodiments;

FIG. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of a light module according to some embodiments;

FIG. 4 is an exploded view of a light module according to some embodiments;

FIG. 5 is a diagram illustrating adjustment of a transceiver signal of an optical module according to some embodiments;

fig. 6 is a schematic partial structure diagram of a circuit board in an optical module according to an embodiment of the present disclosure;

fig. 7 is a first partial structure block diagram of an optical module according to an embodiment of the present disclosure;

fig. 8 is a schematic diagram of a partial structure of a circuit board in an optical module according to an embodiment of the present application;

fig. 9 is a block diagram of a partial structure of an optical module according to an embodiment of the present application;

fig. 10 is a schematic diagram of a partial structure of a circuit board in an optical module according to an embodiment of the present application;

fig. 11 is a block diagram of a partial structure of an optical module according to an embodiment of the present application.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present disclosure belong to the protection scope of the present disclosure.

Unless the context requires otherwise, throughout the description and the claims, the term "comprise" and its other forms, such as the third person's singular form "comprising" and the present participle form "comprising" are to be interpreted in an open, inclusive sense, i.e. as "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the terms used above are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless otherwise specified.

In describing some embodiments, expressions of "coupled" and "connected," along with their derivatives, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, some embodiments may be described using the term "coupled" to indicate that two or more elements are in direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents herein.

"at least one of A, B and C" has the same meaning as "A, B or at least one of C", both including the following combination of A, B and C: a alone, B alone, C alone, a and B in combination, a and C in combination, B and C in combination, and A, B and C in combination.

"A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

The use of "adapted to" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted to or configured to perform additional tasks or steps.

As used herein, "about," "approximately," or "approximately" includes the stated values as well as average values that are within an acceptable range of deviation for the particular value, as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system).

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so as to complete information transmission. Because the optical signal has the passive transmission characteristic when being transmitted through the optical fiber or the optical waveguide, the information transmission with low cost and low loss can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform interconversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electrical signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electrical port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides and the like through the optical port, realizes electrical connection with an optical network terminal (such as an optical modem) through the electrical port, and the electrical connection is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to the computer and other information processing equipment through a network cable or a wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, for example, signal transmission of several kilometers (6 kilometers to 8 kilometers), on the basis of which if a repeater is used, ultra-long-distance transmission can be theoretically realized. Therefore, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may be several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following apparatuses: router, switch, computer, cell-phone, panel computer, TV set etc..

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. The optical module 200 converts an optical signal and an electrical signal to each other, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 includes a housing (housing) having a substantially rectangular parallelepiped shape, and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. The optical module 200 is connected to the network cable 103 via the optical network terminal 100. For example, the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103, and transmits a signal from the network cable 103 to the optical module 200, so that the optical network terminal 100 can monitor the operation of the optical module 200 as an upper computer of the optical module 200. The upper computer of the Optical module 200 may include an Optical Line Terminal (OLT) and the like in addition to the Optical network Terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100, and the network cable 103.

Fig. 2 is a structural diagram of an optical network terminal according to some embodiments, and fig. 2 only shows a structure of the optical module 200 of the optical network terminal 100 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into a cage 106 of the optical network terminal 100, the cage 106 holds the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by a heat sink 107. After the optical module 200 is inserted into the cage 106, an electrical port of the optical module 200 is connected to an electrical connector inside the cage 106, and thus the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. Further, the optical port of the optical module 200 is connected to the optical fiber 101, and the optical module 200 establishes bidirectional electrical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of a light module according to some embodiments, and fig. 4 is an exploded view of a light module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver;

the shell comprises an upper shell 201 and a lower shell 202, wherein the upper shell 201 is covered on the lower shell 202 to form the shell with two openings 204 and 205; the outer contour of the housing generally appears square.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate and two lower side plates located at both sides of the bottom plate and disposed perpendicular to the bottom plate; the upper housing 201 includes a cover plate, and two upper side plates disposed on two sides of the cover plate and perpendicular to the cover plate, and is combined with the two side plates by two side walls to cover the upper housing 201 on the lower housing 202.

The direction of the connecting line of the two openings 204 and 205 may be the same as the length direction of the optical module 200, or may not be the same as the length direction of the optical module 200. For example, the opening 204 is located at an end (right end in fig. 3) of the optical module 200, and the opening 205 is also located at an end (left end in fig. 3) of the optical module 200. Alternatively, the opening 204 is located at an end of the optical module 200, and the opening 205 is located at a side of the optical module 200. Wherein, the opening 204 is an electrical port, and the gold finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to receive the external optical fiber 101, so that the optical fiber 101 is connected to an optical transceiver inside the optical module 200.

The upper shell 201 and the lower shell 202 are combined in an assembly mode, so that devices such as the circuit board 300 and the optical transceiver can be conveniently installed in the shells, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In addition, when the devices such as the circuit board 300 are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of the devices are convenient to arrange, and the automatic implementation production is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking component 203 located on an outer wall of a housing thereof, and the unlocking component 203 is configured to realize a fixed connection between the optical module 200 and an upper computer or release the fixed connection between the optical module 200 and the upper computer.

Illustratively, the unlocking member 203 is located on the outer walls of the two lower side plates of the lower housing 202, and includes a snap-fit member that mates with a cage of an upper computer (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the engaging member of the unlocking member 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, and the connection relationship between the engaging member and the upper computer is changed, so that the engagement relationship between the optical module 200 and the upper computer is released, and the optical module 200 can be drawn out from the cage of the upper computer.

The circuit board 300 includes circuit traces, electronic components, and chips, and the electronic components and the chips are connected together by the circuit traces according to a circuit design to implement functions of power supply, electrical signal transmission, grounding, and the like. The electronic components may include, for example, capacitors, resistors, transistors, Metal-Oxide-Semiconductor Field-Effect transistors (MOSFETs). The chip may include, for example, a Micro Controller Unit (MCU), a Transimpedance Amplifier (TIA), a Clock and Data Recovery (CDR), a power management chip, and a Digital Signal Processing (DSP) chip.

The circuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear a chip; the rigid circuit board can also be inserted into an electric connector in the cage of the upper computer.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector in the cage 106 by gold fingers. The gold fingers may be disposed on only one side surface (e.g., the upper surface shown in fig. 4) of the circuit board 300, or may be disposed on both upper and lower surfaces of the circuit board 300, so as to adapt to the situation with a large demand for the number of pins. The golden finger is configured to establish an electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like. Of course, a flexible circuit board is also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement the rigid circuit boards.

The optical transceiver includes an optical transmitter module 400 and an optical receiver module 500, which are respectively used for transmitting and receiving optical signals. The light emitting assembly 400 generally includes a light emitter, a lens and a light detector, wherein the lens and the light detector are respectively located at different sides of the light emitter, the front side and the back side of the light emitter respectively emit light beams, and the lens is used for converging the light beams emitted from the front side of the light emitter, so that the light beams emitted from the light emitter are converged light to be conveniently coupled to an external optical fiber. In order to drive the light emitter in the light emitting assembly 400 to generate a laser beam, the circuit board 300 is provided with a transmitting driving chip, and the transmitting driving chip can be electrically connected with the light emitter through a routing, so that the golden finger transmits an electric signal transmitted by the upper computer to the transmitting driving chip, the transmitting driving chip transmits power supply parameters to the light emitter, and the light emitter generates a laser signal according to the power supply parameters.

The light receiving assembly 500 generally includes a receiving chip and a transimpedance amplifier, the receiving chip is configured to convert a received external light signal into an electrical signal, the electrical signal is amplified by the transimpedance amplifier and then transmitted to the gold finger on the circuit board 300, and the electrical signal is transmitted to the host computer by the gold finger. In order to adjust the electrical signal transmitted to the upper computer, the circuit board 300 is provided with a receiving driving chip, the receiving driving chip is electrically connected with the receiving chip or the transimpedance amplifier, the electrical signal output by the receiving chip is transmitted to the receiving driving chip, the electrical signal is adjusted by the receiving driving chip, and the adjusted electrical signal is transmitted to the upper computer.

Fig. 5 is a diagram illustrating adjustment of a transmission/reception signal of an optical module according to some embodiments. As shown in fig. 5, in an optical module with a speed of 10G or above, a pre-Emphasis (EM) and equalization (CTLE) adjuster is usually integrated inside a driving chip on a circuit board 300, and the intensity of input and output signals is controlled by adjusting the EM and CTLE, so that the input and output signals are optimally matched with signal lines inside the circuit board and the optical module, and the performance (emission eye diagram, receiving sensitivity, signal transmission, etc.) of the optical module is ensured to be in an optimal state.

Taking a 25G optical module as an example, at a transmitting end, a transmitting electrical signal on the circuit board 300 firstly enters a transmitting equalization regulator of a transmitting driving chip, then enters a clock shaping (CDR), then enters a transmitting pre-emphasis (0TXEM) regulator, and finally enters a laser to be converted into an optical signal for output; at a receiving end, a received optical signal is converted into an electrical signal through the optical detector PD, and the electrical signal enters a receiving equalization (CTLE) regulator of a receiving driving chip, then enters a clock shaping (CDR), then enters a receiving pre-emphasis (RXEM) regulator, and finally is output to the circuit board 300.

The CTLE of the transmitting terminal and the pre-emphasis RXEM of the receiving terminal are matched with the equipment single board and are opened, and a uniform fixed value is usually debugged by the equipment terminal when the equipment terminal is on line. In order to protect the performance and the working state of the optical module, debugging interfaces of the transmitted pre-emphasis TXEM and the receiving end CTLE are not opened outwards, and are debugged in the optical module, namely, the optical module is solidified into a determined value when leaving a factory, and the determined value is not changed in the whole life cycle of the module. Generally, the transmitting pre-emphasis TXEM and the receiving pre-emphasis CTLE inside the optical module are also adjusted to a value that enables the transmitting and receiving performance of the optical module to be in an optimal state, which is usually expressed as an optimal transmitting eye diagram and optimal receiving sensitivity of the optical module. This value is a fixed value, i.e. the transmit pre-emphasis TXEM is a fixed value and the receive CTLE is a fixed value at all temperature zones (technical-40 ℃ to 85 ℃).

However, tests show that if the transmitting pre-emphasis TXEM and the receiving pre-emphasis CTLE of the optical module are set to a fixed value, the transmitting performance or the receiving performance of the optical module is poor in a certain temperature region (usually a high-temperature region or a low-temperature region), and even the index requirement cannot be met, or the problem that the performance of the optical module is poor and the index requirement cannot be met when the optical module transmits a service through an optical fiber with a certain length although the index requirement can be met occurs.

Through experiments and theoretical analysis, at the moment, under severe temperature conditions such as high temperature or low temperature and the like, the loss and impedance matching of the whole signal link inside the optical module change, and particularly for the optical module with high speed and long transmission distance, the loss and impedance matching change caused by the temperature change finally cause the overall performance degradation of the module.

In order to solve the above problem, embodiments of the present application provide an optical module, where the strength of input and output signals is controlled by adjusting pre-emphasis EM and equalization CTLE, so that the input and output signals are optimally matched with a device board and a signal line inside the module, and the performance (emission light eye diagram, reception sensitivity, signal transmission, and the like) of the optical module is ensured to be in an optimal state.

Fig. 6 is a first partial structure schematic diagram of a circuit board in an optical module according to an embodiment of the present disclosure, and fig. 7 is a first partial structure block diagram of an optical module according to an embodiment of the present disclosure. As shown in fig. 6 and 7, the MCU320 on the circuit board 300 includes a temperature sensor and a first register, the temperature sensor is used for acquiring a temperature parameter, the first register stores a pre-emphasis emission setting value, and the pre-emphasis emission setting value is set corresponding to the temperature parameter. In the working process of the optical module, the MCU320 reads the pre-emphasis setting value corresponding to the temperature parameter from the first register according to the temperature parameter acquired by the temperature sensor in real time.

The laser driving chip 330 is disposed on the circuit board 300, electrically connected to the MCU320, and includes a pre-emphasis emission regulator, wherein the MCU320 obtains a pre-emphasis emission setting corresponding to the temperature parameter, and then transmits the pre-emphasis emission setting to the pre-emphasis emission regulator, and the pre-emphasis emission regulator adjusts the intensity of the output modulation current according to the pre-emphasis emission setting to adjust the intensity of the high-frequency component of the current signal input to the laser chip 340.

The laser chip 340 is electrically connected to the laser driving chip 330, and the laser chip 340 emits an optical signal with a corresponding intensity according to the adjusted modulation current to change the intensity of the emitted optical signal.

Therefore, the upper computer transmits the electric signal to the golden finger 310 on the circuit board 300, the golden finger 310 is electrically connected with the MCU320 through a signal line, the MCU320 reads the emission pre-emphasis setting value at the corresponding temperature from the first register according to the working temperature acquired by the temperature sensor, and writes the emission pre-emphasis setting value into the emission pre-emphasis regulator of the laser driving chip 330 to enable the emission pre-emphasis setting value to take effect, so that different emission pre-emphasis setting values are adjusted at different temperatures, and finally the normal and stable work of the optical module in the full temperature zone is realized.

In some embodiments, the emission pre-emphasis setting value stored in the first register within the MCU320 may be set in a one-to-one correspondence with the temperature parameter obtained by the temperature sensor, enabling reading of different emission pre-emphasis settings at different temperatures, thereby enabling three-temperature compensation of the emitted optical signal.

In some embodiments, the emission pre-emphasis setting value stored in the first register of the MCU320 may also be set corresponding to a range of temperature parameters obtained by the temperature sensor, i.e., a preset range of temperatures corresponding to one emission pre-emphasis setting value, as exemplified in the following table:

in the optical module provided in the embodiment of the application, a first register is provided inside an MCU to store a pre-emphasis setting value corresponding to a temperature, during the operation of the optical module, according to a working temperature collected by a temperature sensor in the MCU, the MCU reads the pre-emphasis setting value from the first register according to the collected working temperature and writes the pre-emphasis setting value into a pre-emphasis regulator of a laser driver chip, the pre-emphasis regulator adjusts the intensity of an output modulation current according to the pre-emphasis setting value, the laser chip emits an optical signal with a corresponding intensity according to the adjusted modulation current, so that the emission signal forms an optimal match with a signal line inside a circuit board and the optical module, the emission performance (emission eye diagram, signal transmission, etc.) of the optical module is ensured to be in an optimal state, and a three-temperature compensation function of the emission optical signal is realized, therefore, the normal and stable work of the optical module in the full temperature area is realized.

Similarly, different transmitting pre-emphasis setting values can be set at different temperatures, so that the transmitting optical signals and the signal lines in the optical module form the optimal matching, and different receiving equalization setting values can be set at different temperatures, so that the electrical signals converted from the receiving optical signals and the signal lines in the optical module form the optimal matching.

Fig. 8 is a schematic diagram of a partial structure of a circuit board in an optical module according to an embodiment of the present application, and fig. 9 is a block diagram of a partial structure of an optical module according to an embodiment of the present application. As shown in fig. 8 and 9, the MCU320 on the circuit board 300 includes a temperature sensor and a second register, the temperature sensor is used for acquiring a temperature parameter, the second register stores a receiving equalization setting value, and the receiving equalization setting value is set corresponding to the temperature parameter. And in the working process of the optical module, the MCU reads a receiving balance setting value corresponding to the temperature parameter from the second register according to the temperature parameter acquired by the temperature sensor in real time.

The receiving chip (PD)360 is disposed on the circuit board 300, and is configured to convert a received optical signal into an electrical signal, that is, an external optical signal is transmitted to the receiving chip 360, convert the optical signal into the electrical signal through the receiving chip 360, transmit the electrical signal to the receiving driving chip 350 on the circuit board 300, and perform electrical signal adjustment through the receiving driving chip 350.

The receiving driving chip 350 is disposed on the circuit board 300, electrically connected to the MCU320 and the receiving chip 360, and includes a receiving equalization regulator, the MCU320 obtains a receiving equalization setting value corresponding to the temperature parameter, and then sends the receiving equalization setting value to the receiving equalization regulator, and the receiving equalization regulator adjusts the strength of the high frequency component of the converted electrical signal according to the receiving equalization setting value, so that the strength of the high frequency component and the low frequency component of the electrical signal are at a balanced level, and the high frequency component of the electrical signal is directly gained by the internal circuit.

Therefore, the receiving chip 360 converts the received optical signal into an electrical signal, the electrical signal is transmitted to the receiving driving chip 350, the MCU320 reads the receiving equalization setting value at the corresponding temperature from the second register according to the working temperature collected by the temperature sensor, and writes the receiving equalization setting value into the receiving equalization regulator of the receiving driving chip 350 to enable the receiving equalization regulator to take effect, the receiving driving chip 350 after taking effect performs high-frequency intensity adjustment on the converted electrical signal, the adjusted electrical signal is transmitted to the golden finger 310 through a signal line, and the adjusted electrical signal is transmitted to the upper computer through the golden finger 310.

In some embodiments, the optical module provided in the embodiment of the present application further includes a transimpedance amplifier, the transimpedance amplifier is disposed on the circuit board 300 and electrically connected to the receiving chip 360 and the receiving driving chip 350, the receiving chip 360 converts a received optical signal into an electrical signal, and then the electrical signal is transmitted to the transimpedance amplifier, the transimpedance amplifier amplifies the electrical signal, the amplified electrical signal is transmitted to the receiving driving chip 350, the receiving equalization regulator in the receiving driving chip 350 receives the receiving equalization setting value from the MCU320, and performs high-frequency intensity adjustment on the amplified electrical signal according to the receiving equalization setting value.

In some embodiments, the receiving equalization setting value stored in the second register in the MCU320 may be set in a one-to-one correspondence with the temperature parameter obtained by the temperature sensor, so as to read different receiving equalization setting values at different temperatures, thereby realizing three-temperature compensation of the received optical signal.

In some embodiments, the receiving equalization setting value stored in the second register in the MCU320 may also be set corresponding to a range of temperature parameters obtained by the temperature sensor, that is, a preset range of temperatures corresponds to one receiving equalization setting value, and the following table is listed as an example:

temperature/. degree.C	Receiving equalization setting values
		-40	α
-39	α
		-38	β
-37	β
		-36	β
-35	γ
		-34	γ
-33	γ
		-32	γ
-31	γ
		-30	δ
-29	δ
		.	.
.	.
		.	.
80	σ
		81	σ
82	σ
		83	τ
84	τ
		85	τ

In the optical module provided by the embodiment of the application, a second register is provided in the MCU to store a receiving balance setting value corresponding to a temperature, and in the working process of the optical module, according to a working temperature collected by a temperature sensor in the MCU, the MCU reads the corresponding receiving balance setting value from the second register according to the collected working temperature, and writes the receiving balance setting value into a receiving balance adjuster of a receiving driving chip to enable the receiving balance adjuster to take effect; the receiving chip converts an external optical signal into an electric signal, the electric signal is transmitted to the receiving driving chip, and the receiving driving chip adjusts the intensity of the converted electric signal according to the effective receiving balance adjuster, so that the received electric signal is optimally matched with a circuit board and a signal line in the optical module, the receiving performance (receiving sensitivity, signal transmission and the like) of the optical module is ensured to be in an optimal state, a three-temperature compensation function of receiving the optical signal is realized, and the normal and stable work of the optical module in a full-temperature area is realized.

The different transmitting pre-emphasis setting values or receiving equalization setting values are set at different temperatures, so that the method is not only limited to be applied to a single light emitting component or a light receiving component, but also can be applied to a light receiving and transmitting component, and the receiving and transmitting performance of the light module is ensured to be in the best state.

Fig. 10 is a schematic diagram of a partial structure of a circuit board in an optical module according to an embodiment of the present application, and fig. 11 is a block diagram of a partial structure of an optical module according to an embodiment of the present application. As shown in fig. 10 and 11, the MCU320 on the circuit board 300 includes a temperature sensor, a first register and a second register, the temperature sensor is used to obtain a temperature parameter, the first register stores a transmission pre-emphasis setting value, the second register stores a reception equalization setting value, and the transmission pre-emphasis setting value, the reception equalization setting value and the temperature parameter are set correspondingly. In the working process of the optical module, the MCU320 reads the pre-emphasis setting value corresponding to the temperature parameter from the first register and reads the equalization setting value corresponding to the temperature parameter from the second register according to the temperature parameter acquired by the temperature sensor in real time.

The transceiving driving chip 370 is disposed on the circuit board 300, electrically connected to the MCU320, and includes a transmitting pre-emphasis regulator and a receiving equalization regulator, wherein the transmitting pre-emphasis regulator is configured to receive a transmitting pre-emphasis setting value from the MCU320, and adjust the output modulation current intensity according to the transmitting pre-emphasis setting value; the receive equalization regulator is configured to receive a receive equalization setting value from the MCU320, and adjust the high frequency intensity of the converted electrical signal according to the receive equalization setting value.

The laser chip 340 is electrically connected to the transceiver driving chip 370, and is configured to emit an optical signal with a corresponding intensity according to the adjusted modulation current.

The receiving chip 360 is electrically connected to the transceiving driving chip 370, and is configured to convert the received optical signal into an electrical signal.

Thus, the upper computer transmits the electrical signal to the golden finger 310 on the circuit board 300, the golden finger 310 is electrically connected with the MCU320 through a signal line, the MCU320 reads the pre-emphasis setting value at the corresponding temperature from the first register according to the working temperature collected by the temperature sensor, and writes the pre-emphasis setting value into the pre-emphasis adjuster of the transceiver driver chip 370 to make it effective, the transceiver driver chip 370 outputs the adjusted adjustment current to the laser chip 340 after the pre-emphasis setting value is effective, and the laser chip 340 emits the optical signal with the corresponding intensity according to the adjusted adjustment current; the receiving chip 360 converts the received optical signal into an electrical signal, the electrical signal is transmitted to the transceiving driving chip 370, the MCU320 reads the receiving equalization setting value at the corresponding temperature from the second register according to the working temperature collected by the temperature sensor, and writes the receiving equalization setting value into the receiving equalization regulator of the transceiving driving chip 370 to enable the receiving equalization setting value to take effect, the transceiving driving chip 370 after taking effect performs high-frequency intensity adjustment on the converted electrical signal, and the adjusted electrical signal is transmitted to the gold finger 310 via a signal line and is transmitted to the upper computer via the gold finger 310.

In the optical module provided by the embodiment of the application, the intensity of the input and output signals of the optical module is controlled by adjusting the transmission pre-emphasis setting value and the reception equalization setting value, so that the signals are optimally matched with a single board of equipment and a signal line in the module, the performance (such as a transmission optical eye diagram, reception sensitivity and signal transmission) of the module is ensured to be in an optimal state, and the optical module is ensured to normally and stably work in a full-temperature area.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims (9)

1. A light module, comprising:

a circuit board;

the MCU is arranged on the circuit board and comprises a temperature sensor and a first register, wherein the temperature sensor is used for acquiring temperature parameters, and the first register stores a transmitting pre-emphasis setting value; for reading a corresponding transmit pre-emphasis setting from the first register in accordance with the temperature parameter;

the laser driving chip is arranged on the circuit board, is electrically connected with the MCU, and comprises an emission pre-emphasis regulator which is used for receiving the emission pre-emphasis setting value and regulating the intensity of the output modulation current according to the emission pre-emphasis setting value;

and the laser chip is electrically connected with the laser driving chip and is used for emitting optical signals with corresponding intensity according to the adjusted modulation current.

2. The optical module of claim 1, wherein the transmit pre-emphasis setting values are set in a one-to-one correspondence with the temperature parameters.

3. The optical module of claim 1, wherein the transmit pre-emphasis setting value is set corresponding to a preset range of the temperature parameter.

4. The optical module according to claim 1, wherein the temperature parameter obtained by the temperature sensor is-40 ℃ to 85 ℃.

5. A light module, comprising:

a circuit board;

the MCU is arranged on the circuit board and comprises a temperature sensor and a second register, the temperature sensor is used for acquiring temperature parameters, and the second register stores receiving balance setting values; the receiving equalization setting value is used for reading a corresponding receiving equalization setting value from the second register according to the temperature parameter;

the receiving chip is arranged on the circuit board and used for converting the received optical signal into an electric signal;

and the receiving driving chip is arranged on the circuit board, is electrically connected with the MCU and the receiving chip, and comprises a receiving balance regulator which is used for receiving the receiving balance setting value and adjusting the high-frequency intensity of the converted electric signal according to the receiving balance setting value.

6. The light module of claim 5, further comprising:

the transimpedance amplifier is arranged on the circuit board, is electrically connected with the receiving chip and the receiving driving chip and is used for amplifying the electric signal from the receiving chip and transmitting the amplified electric signal to the receiving driving chip for adjustment.

7. The optical module of claim 5, wherein the receive equalization setting value is set in one-to-one correspondence with the temperature parameter.

8. The optical module of claim 5, wherein the receive equalization setting value is set corresponding to a preset range of the temperature parameter.

9. A light module, comprising:

a circuit board;

the MCU is arranged on the circuit board and comprises a temperature sensor, a first register and a second register, wherein the temperature sensor is used for acquiring temperature parameters, the first register stores a transmitting pre-emphasis setting value, and the second register stores a receiving equalization setting value; the receiving equalization control module is used for reading a corresponding transmitting pre-emphasis setting value from the first register according to the temperature parameter and reading a corresponding receiving equalization setting value from the second register according to the temperature parameter;

the transmitting-receiving driving chip is arranged on the circuit board, is electrically connected with the MCU and comprises a transmitting pre-emphasis regulator and a receiving equalization regulator, wherein the transmitting pre-emphasis regulator is used for receiving the transmitting pre-emphasis setting value and regulating the output modulation current intensity according to the transmitting pre-emphasis setting value; the receiving balance regulator is used for receiving the receiving balance setting value and regulating the high-frequency intensity of the converted electric signal according to the receiving balance setting value;

the laser chip is electrically connected with the transceiving driving chip and used for transmitting an optical signal with corresponding intensity according to the adjusted modulation current;

and the receiving chip is electrically connected with the transceiving driving chip and is used for converting the received optical signal into an electric signal.

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