CN114559453B - Manipulator and semiconductor device - Google Patents
Manipulator and semiconductor device Download PDFInfo
- Publication number
- CN114559453B CN114559453B CN202210187039.3A CN202210187039A CN114559453B CN 114559453 B CN114559453 B CN 114559453B CN 202210187039 A CN202210187039 A CN 202210187039A CN 114559453 B CN114559453 B CN 114559453B
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- bump
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- wafer
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 235000012431 wafers Nutrition 0.000 claims abstract description 82
- 238000001179 sorption measurement Methods 0.000 claims 1
- 238000012864 cross contamination Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- CJRQAPHWCGEATR-UHFFFAOYSA-N n-methyl-n-prop-2-ynylbutan-2-amine Chemical group CCC(C)N(C)CC#C CJRQAPHWCGEATR-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a manipulator and semiconductor equipment, which comprises a manipulator arm, a supporting plate and bumps, wherein the bumps are positioned on the supporting plate, the bump combinations with height differences form bump groups, the bump groups at least comprise 2 bumps, the bump groups are staggered, and the heights of the bumps positioned on the outer side are larger than the heights of the bumps positioned on the inner side so as to provide different inclined planes for bearing wafers. According to the invention, the plurality of sets of the lug groups are arranged on the same manipulator to provide different inclined planes for bearing the wafers, so that the wafers can be respectively transmitted through the different lug groups when the wafers are transmitted, cross contamination of the wafers is prevented, and a plurality of manipulators are not required to be adopted to finish the work, thereby reducing the equipment cost, saving the equipment space and reducing the equipment complexity.
Description
Technical Field
The invention belongs to the field of semiconductor equipment, and relates to a manipulator and semiconductor equipment.
Background
Yield is a key indicator pursued by wafer factories, which directly affects production efficiency and company benefits. In the wafer manufacturing process, wafers are generally transferred by a robot, such as transfer of wafers between cassettes, transfer of wafers between cassettes and boats, transfer of wafers between reaction chambers, and the like. In the wafer manufacturing process, the yield is determined by various factors, and besides the influence of hardware factors such as a process chamber and the like and factors such as process conditions and the like, the wafer transmission process also has influence on the yield of the wafer.
A more typical wafer transfer robot configuration is illustrated in fig. 1. The manipulator 10 is provided with a manipulator arm 11, the manipulator arm 11 is provided with a pallet 12, and the pallet 12 is provided with a bump 13. When the wafer 20 is transferred, the robot 10 lifts the wafer by the bumps 13 on the pallet 12, and then carries the wafer 20.
In the conventional semiconductor process, in order to prevent cross contamination of wafers, in some cases, the wafers before and after the process require the same contact points/surfaces, so under the requirement, in order to prevent cross contamination of wafers, many robots are configured with independently telescopic double robots, as shown in fig. 2, so as to respectively transmit the wafers before and after the process through the bearing support plates and the bumps independently installed on the robots.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a manipulator and a semiconductor device, which are used for solving the problem of complex structure of the manipulator in the prior art.
To achieve the above and other related objects, the present invention provides a robot comprising:
A mechanical arm;
The supporting plate is connected with the mechanical arm;
the bumps are located on the supporting plate, the bump combinations with the height difference form bump groups, the bump groups at least comprise 2 bumps, the bump groups are arranged in a staggered mode, and the heights of the bumps located on the outer side are larger than those of the bumps located on the inner side, so that different inclined planes for bearing wafers are provided.
Optionally, the bump groups are staggered on the supporting plate from one end far away from the mechanical arm to one end close to the mechanical arm.
Optionally, the inclined planes corresponding to different bump groups are axisymmetric patterns, and each symmetry axis is located on the same straight line.
Optionally, the inclined planes corresponding to the different bump groups have the same included angle with the horizontal plane.
Optionally, any one of the bump groups comprises 2-N bumps; and/or the cross-sectional profile of the bump comprises one or a combination of a circle and a polygon.
Optionally, the height difference formed by the bumps in the bump group is in a range of 0.1mm to 2mm.
Optionally, the bumps in any one of the bump groups form 1 level difference.
Optionally, the supporting plate comprises M protruding block groups, wherein M is more than or equal to 2 and less than or equal to 8.
Optionally, the robot comprises a vacuum suction robot; and/or, the lug is an adjusting lug.
The invention also provides a semiconductor device comprising any one of the above manipulators.
As described above, the manipulator and the semiconductor device of the present invention include the manipulator, the supporting plate and the bumps, the bumps are located on the supporting plate, the bump combination with the height difference forms a bump group, the bump group includes at least 2 bumps, where the bump groups are staggered, and the height of the bumps located on the outer side is greater than the height of the bumps located on the inner side, so as to provide different inclined planes for carrying the wafer.
According to the invention, the plurality of sets of the lug groups are arranged on the same manipulator to provide different inclined planes for bearing the wafers, so that the wafers can be respectively transmitted through the different lug groups when the wafers are transmitted, cross contamination of the wafers is prevented, and a plurality of manipulators are not required to be adopted to finish the work, thereby reducing the equipment cost, saving the equipment space and reducing the equipment complexity.
Drawings
Fig. 1 is a schematic top view of a prior art manipulator.
Fig. 2 shows a side view of two different transport paths of the manipulator of fig. 1.
Fig. 3 is a schematic top view of a manipulator with 2 sets of bumps according to an embodiment of the invention.
Fig. 4a and 4b show side views of two different transport paths of the manipulator of fig. 3.
Fig. 5 a-5 c show side views of three different transport paths for a manipulator with 3 sets of bumps in an embodiment of the invention.
Description of element reference numerals
10. 100 Mechanical arm
11. 101 Mechanical arm
12. 102 Supporting plate
13. 103 Bump
113. First bump
123. Second bump
133. Third bump
14. 104 Base
20. 201, 202, 203 Wafers
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
As described in detail in the embodiments of the present invention, the cross-sectional view of the device structure is not partially enlarged to a general scale for convenience of explanation, and the schematic drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
For ease of description, spatially relative terms such as "under", "below", "beneath", "above", "upper" and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Furthermore, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or one or more intervening layers may also be present. In this regard, when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Such as "between … …" may be used herein, the expression including both end values, and such as "a plurality" may be used, the expression indicating two or more, unless explicitly defined otherwise. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.
It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of each component in actual implementation may be changed at will, and the layout of the components may be more complex.
As shown in fig. 3 to 4b, the present embodiment provides a manipulator, the manipulator 100 includes a manipulator arm 101, a supporting plate 102 and bumps 103, the bumps 103 are located on the supporting plate 102, the bumps 103 with a height difference are combined to form a bump set, the bump set includes at least 2 bumps, wherein the bump sets are staggered, and the height of the bumps 103 located at the outer side is greater than the height of the bumps 103 located at the inner side, so as to provide different inclined planes for carrying the wafer 201 and the wafer 202.
As shown in fig. 3, in this embodiment, 2 sets of the bump sets, that is, a first bump set formed by combining 3 first bumps 113 with a height difference and a second bump set formed by combining 3 second bumps 123 with a height difference, are disposed on the same manipulator 100, so as to respectively provide different inclined planes for carrying the wafer 201 and the wafer 202, and since the heights of the bumps 103 distributed on the supporting plate 102, which are located on the outer side, are greater than the heights of the bumps 103 located on the inner side, the bump sets are staggered, that is, the inclined planes formed by the first bumps 113 and the inclined planes formed by the second bumps 123 are staggered, and when the wafer 201 and the wafer 202 are placed on the bump sets corresponding to each other, the bottom surfaces of the wafer 201 and the wafer 202 are only in contact with the bumps in the bump sets corresponding to each other, for example, the wafer 201 is only in contact with the first bumps 202 with the inclined planes, and the wafer 202 is only in contact with the inclined planes, so that the wafer 201 is not in contact with the inclined planes, and the equipment is not in contact with the wafer 202, so that the equipment is not required to be crossed, and the equipment is not required to be polluted, and the equipment is not required to be transported, and the equipment is reduced.
In this embodiment, the wafer 201 and the wafer 202 represent a wafer before processing and a wafer after processing, respectively, that is, the wafer 201 and the wafer 202 represent the same wafer before and after processing, but the present invention is not limited thereto, and the wafer 201 and the wafer 202 may represent different wafers, which is not limited thereto.
Specifically, as shown in fig. 3, in the embodiment, the manipulator 100 further includes a base 104, where the manipulator arm 101 is connected to the base 104, and the base 104 may be rotated circumferentially, and the manipulator arm 101 may be rotated circumferentially or retracted back and forth, so as to flexibly carry the wafer 201 and the wafer 202 respectively through different bump sets located on the supporting plate 102.
As an example, the bump groups are staggered on the supporting plate 102 from one end far away from the mechanical arm 101 to one end close to the mechanical arm 101.
Specifically, as shown in fig. 3, in this embodiment, the first bump group formed by combining 3 first bumps 113 with a height difference and the second bump group formed by combining 3 second bumps 123 with a height difference are arranged on the pallet 102 in a staggered manner from one end far away from the robot arm 101 to one end close to the robot arm 101, that is, the first bump group and the second bump group may be arranged on the pallet 102 in a staggered manner, and the first bump group and the second bump group may be arranged on the pallet 102 in a staggered manner, which is not limited herein.
As an example, the inclined surfaces corresponding to the different bump groups are all axisymmetric patterns, and the symmetry axes are all located on the same straight line.
Specifically, when the inclined surfaces corresponding to the bump groups are axisymmetric patterns, the stability of the bump groups for carrying the wafer 201 and the wafer 202 may be improved, but the shape of the bump groups is not limited to this, and further, if the symmetry axes of the bump groups are all located on the same straight line, the equipment space may be further saved, and when the transfer operation is performed on the wafer 201 and the wafer 202, the wafer 201 and the wafer 202 may be carried by different bump groups only by moving in one direction.
As an example, the inclined surfaces corresponding to the different bump groups all have the same included angle with the horizontal plane.
Specifically, as shown in fig. 4a and fig. 4b, in the present embodiment, in the different bump sets, the inclined plane formed by the first bump 113 and the inclined plane formed by the second bump 123 have the same included angle with respect to the horizontal plane, so as to facilitate the handling of the manipulator 100, but not limited thereto, different included angles may be set between the inclined plane and the horizontal plane corresponding to the different bump sets as required.
As an example, 2N or less of the bumps 103 are included in any one of the bump groups; and/or the cross-sectional profile of the bump 103 includes one or a combination of a circle and a polygon.
Specifically, as shown in fig. 3, each of the 2 bump groups includes 3 bumps 103 having a height difference, that is, the bump group carrying the wafer 201 includes 3 first bumps 113, and the 3 first bumps 113 are distributed in a triangle shape to carry the wafer 201 in combination with the stability of the triangle, and the bump group carrying the wafer 202 also includes 3 second bumps 123, and the 3 second bumps 123 are distributed in a triangle shape to carry the wafer 202 in combination with the stability of the triangle, but the number of corresponding bumps 103 in any one bump group is not limited thereto, and as the bump group may also be formed by the bump 103 combination with N of 2, 4,5, 6, etc., which is not limited thereto.
In this embodiment, the cross-sectional shape of the first bump 113 is circular, and the cross-sectional shape of the second bump 123 is regular hexagon, but the present invention is not limited thereto, and may be specifically set according to the need, for example, triangle, square, etc. may be selected.
As an example, the height difference constituted by the bumps 103 in the bump group is in the range of 0.1mm to 2mm.
Specifically, in the different bump groups, the height difference between the bumps 103 may be the same or different, and may be specifically set according to needs, where, to reduce the risk of sliding sheets or fragments of the wafer 201 and the wafer 202, it is preferable that the height difference between the bumps 103 in the same bump group is in a range of 0.1mm to 2mm, such as 0.1mm, 0.5mm, 1mm, 1.5mm, 2mm, etc., so as to satisfy that the slope of the inclined plane is reduced as much as possible while the wafer does not contact the bumps 103 in other bump groups when being transported on the different bump groups, so as to ensure the transportation security of the wafer 201 and the wafer 202.
As an example, the bumps 103 in any one of the bump groups constitute 1 level difference.
Specifically, in the same bump set, the height difference formed by the bumps 103 may include, for example, 1, 2, 3, etc., and may be specifically set as needed to implement a step-like transition, so as to form an inclined plane for carrying the wafer. In this embodiment, in order to simplify the complexity of the apparatus, it is preferable that the bumps 103 in any one of the bump groups constitute 1 height difference, and the height difference ranges from 0.1mm to 2mm, such as 0.1mm, 0.5mm, 1mm, 1.5mm, 2mm, and the like.
As an example, the pallet 102 includes M sets of the bumps, 2.ltoreq.M.ltoreq.8.
Specifically, as required, a plurality of sets of the bump sets may be disposed on the supporting plate 102, for example, M may take values of 2,3, 4, 5, 6, 8, etc. in this embodiment, fig. 3 to 4b illustrate a case where M is 2, and fig. 5a, 5b and 5c illustrate a case where M is 3, that is, 3 sets of bump sets, that is, a first bump set formed by a plurality of first bumps 113, a second bump set formed by a plurality of second bumps 123, and a third bump set formed by a plurality of third bumps 133, are disposed on the supporting plate 102, so as to respectively carry the wafer 201, the wafer 202, and the wafer 203. The above description of the manipulator 100 having 2 sets of the bump sets may be referred to for the setting that M is 2-M, which is not described herein.
As an example, the robot 100 includes a vacuum suction type robot; and/or, the bump 103 is an adjustable bump.
Specifically, in the present embodiment, in order to reduce the complexity of the operation and the complexity of the apparatus, the robot 100 is used to transfer the wafer by the friction force between the bump 103 and the wafer 201 and the wafer 202, but the present invention is not limited thereto, and the robot 100 may be a vacuum suction type robot, etc., as required, and is not limited thereto.
The bump 103 may be an adjustable bump or a fixed bump, that is, the bump 103 may be configured as an adjustable bump that can be displaced up and down, left and right, or both up and down and left and right, so as to provide flexibility of application, or to reduce complexity of operation and complexity of equipment, or the bump 103 may be configured as a fixed bump directly, which is not excessively limited herein.
The present embodiment further provides a semiconductor device, where the manipulator 100 is used in the semiconductor device, and detailed structures of the manipulator 100 are not described herein.
In summary, the manipulator and the semiconductor device of the present invention include a manipulator, a supporting plate, and bumps, wherein the bumps are located on the supporting plate, the bump assemblies with height differences form bump groups, the bump groups include at least 2 bumps, the bump groups are staggered, and the heights of the bumps located on the outer sides are greater than the heights of the bumps located on the inner sides, so as to provide different inclined planes for carrying wafers.
According to the invention, the plurality of sets of the lug groups are arranged on the same manipulator to provide different inclined planes for bearing the wafers, so that the wafers can be respectively transmitted through the different lug groups when the wafers are transmitted, cross contamination of the wafers is prevented, and a plurality of manipulators are not required to be adopted to finish the work, thereby reducing the equipment cost, saving the equipment space and reducing the equipment complexity.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (10)
1. A manipulator, the manipulator comprising:
A mechanical arm;
The supporting plate is connected with the mechanical arm;
The bumps are located on the supporting plate, the bump combinations with the height difference form bump groups, the bump groups at least comprise 2 bumps, the bump groups are arranged in a staggered mode, the heights of the bumps located on the outer side are larger than those of the bumps located on the inner side, different inclined planes for bearing wafers are provided, and the purpose that the wafers do not contact with the bumps in other bump groups when being transmitted on different bump groups is achieved.
2. The manipulator of claim 1, wherein: the bump groups are staggered on the supporting plate from one end far away from the mechanical arm to one end close to the mechanical arm.
3. The manipulator of claim 1, wherein: the inclined surfaces corresponding to different bump groups are axisymmetric patterns, and the symmetry axes are all positioned on the same straight line.
4. The manipulator of claim 1, wherein: the inclined planes corresponding to different bump groups and the horizontal plane have the same included angle.
5. The manipulator of claim 1, wherein: any lug group comprises 2-N lugs; and/or the cross-sectional profile of the bump comprises one or a combination of a circle and a polygon.
6. The manipulator of claim 1, wherein: the height difference formed by the bumps in the bump group ranges from 0.1mm to 2mm.
7. The manipulator of claim 1, wherein: the bumps in any bump group form 1 height difference.
8. The manipulator of claim 1, wherein: m lug groups are arranged on the supporting plate, and M is more than or equal to 2 and less than or equal to 8.
9. The manipulator of claim 1, wherein: the manipulator comprises a vacuum adsorption manipulator; and/or, the lug is an adjusting lug.
10. A semiconductor device characterized in that: the semiconductor device comprises the manipulator of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210187039.3A CN114559453B (en) | 2022-02-28 | 2022-02-28 | Manipulator and semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210187039.3A CN114559453B (en) | 2022-02-28 | 2022-02-28 | Manipulator and semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114559453A CN114559453A (en) | 2022-05-31 |
| CN114559453B true CN114559453B (en) | 2024-06-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210187039.3A Active CN114559453B (en) | 2022-02-28 | 2022-02-28 | Manipulator and semiconductor device |
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| CN (1) | CN114559453B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117260792B (en) * | 2023-11-17 | 2024-02-27 | 上海普达特半导体设备有限公司 | Manipulator and equipment with clamp splice |
| CN118571827B (en) * | 2023-11-21 | 2025-07-18 | 拓荆创益(沈阳)半导体设备有限公司 | A film transfer method between a transmission chamber and a reaction chamber |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000014056A (en) * | 1998-08-17 | 2000-03-06 | 윤종용 | Robot blade for transferring a wafer |
| KR20030008619A (en) * | 2001-07-19 | 2003-01-29 | 삼성전자 주식회사 | A load/unload station |
| CN2582167Y (en) * | 2002-10-10 | 2003-10-22 | 全球联合通信股份有限公司 | Wafer bearing tool |
| KR20090051521A (en) * | 2007-11-19 | 2009-05-22 | 주식회사 테스 | Substrate conveying blade and substrate conveying apparatus having same |
| KR20100046808A (en) * | 2008-10-28 | 2010-05-07 | 세메스 주식회사 | Apparatus for treating substrate |
| JP2016219464A (en) * | 2015-05-14 | 2016-12-22 | 株式会社日立ハイテクノロジーズ | Vacuum processing apparatus and transfer robot |
| CN107393860A (en) * | 2017-07-20 | 2017-11-24 | 京东方科技集团股份有限公司 | A kind of base plate transfer device and method, evaporated device |
| CN107492516A (en) * | 2016-06-13 | 2017-12-19 | 东京毅力科创株式会社 | Base board delivery device and substrate carrying method |
| CN110091340A (en) * | 2019-05-07 | 2019-08-06 | 芯导精密(北京)设备有限公司 | A kind of wafer pick-and-place manipulator |
| WO2020078190A1 (en) * | 2018-10-15 | 2020-04-23 | 杭州众硅电子科技有限公司 | Cmp wafer cleaning apparatus, and wafer transfer manipulator and wafer overturn method for same |
| TW202119541A (en) * | 2019-09-20 | 2021-05-16 | 日商斯庫林集團股份有限公司 | Substrate treating apparatus and substrate transporting method |
| CN113113340A (en) * | 2021-03-30 | 2021-07-13 | 北京北方华创微电子装备有限公司 | Manipulator of semiconductor equipment |
| CN113140483A (en) * | 2021-03-03 | 2021-07-20 | 上海璞芯科技有限公司 | Wafer conveying method and wafer conveying platform |
| CN113241322A (en) * | 2021-07-08 | 2021-08-10 | 杭州众硅电子科技有限公司 | Multi-station clamping device |
| CN113650045A (en) * | 2021-09-17 | 2021-11-16 | 长江存储科技有限责任公司 | Manipulator for picking up wafer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060216137A1 (en) * | 2004-07-02 | 2006-09-28 | Katsunori Sakata | Carrying apparatus and carrying control method for sheet-like substrate |
-
2022
- 2022-02-28 CN CN202210187039.3A patent/CN114559453B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000014056A (en) * | 1998-08-17 | 2000-03-06 | 윤종용 | Robot blade for transferring a wafer |
| KR20030008619A (en) * | 2001-07-19 | 2003-01-29 | 삼성전자 주식회사 | A load/unload station |
| CN2582167Y (en) * | 2002-10-10 | 2003-10-22 | 全球联合通信股份有限公司 | Wafer bearing tool |
| KR20090051521A (en) * | 2007-11-19 | 2009-05-22 | 주식회사 테스 | Substrate conveying blade and substrate conveying apparatus having same |
| KR20100046808A (en) * | 2008-10-28 | 2010-05-07 | 세메스 주식회사 | Apparatus for treating substrate |
| JP2016219464A (en) * | 2015-05-14 | 2016-12-22 | 株式会社日立ハイテクノロジーズ | Vacuum processing apparatus and transfer robot |
| CN107492516A (en) * | 2016-06-13 | 2017-12-19 | 东京毅力科创株式会社 | Base board delivery device and substrate carrying method |
| CN107393860A (en) * | 2017-07-20 | 2017-11-24 | 京东方科技集团股份有限公司 | A kind of base plate transfer device and method, evaporated device |
| WO2020078190A1 (en) * | 2018-10-15 | 2020-04-23 | 杭州众硅电子科技有限公司 | Cmp wafer cleaning apparatus, and wafer transfer manipulator and wafer overturn method for same |
| CN110091340A (en) * | 2019-05-07 | 2019-08-06 | 芯导精密(北京)设备有限公司 | A kind of wafer pick-and-place manipulator |
| TW202119541A (en) * | 2019-09-20 | 2021-05-16 | 日商斯庫林集團股份有限公司 | Substrate treating apparatus and substrate transporting method |
| CN113140483A (en) * | 2021-03-03 | 2021-07-20 | 上海璞芯科技有限公司 | Wafer conveying method and wafer conveying platform |
| CN113113340A (en) * | 2021-03-30 | 2021-07-13 | 北京北方华创微电子装备有限公司 | Manipulator of semiconductor equipment |
| CN113241322A (en) * | 2021-07-08 | 2021-08-10 | 杭州众硅电子科技有限公司 | Multi-station clamping device |
| CN113650045A (en) * | 2021-09-17 | 2021-11-16 | 长江存储科技有限责任公司 | Manipulator for picking up wafer |
Non-Patent Citations (2)
| Title |
|---|
| IMAC400在双臂晶圆传输机械手控制系统中的应用;王刚等;伺服控制;20141231(第12期);第52-54、59页 * |
| 晶圆传输机器人末端执行器的结构设计;高强;宋芳;;轻工机械;20181231(第06期);第20-24页 * |
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