CN114552299A - Surface Mount RJ Connectors - Google Patents
Surface Mount RJ Connectors Download PDFInfo
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- CN114552299A CN114552299A CN202011256839.3A CN202011256839A CN114552299A CN 114552299 A CN114552299 A CN 114552299A CN 202011256839 A CN202011256839 A CN 202011256839A CN 114552299 A CN114552299 A CN 114552299A
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- terminal group
- group
- circuit board
- terminal
- transfer terminal
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000010931 gold Substances 0.000 claims abstract description 20
- 229910052737 gold Inorganic materials 0.000 claims abstract description 20
- 238000012546 transfer Methods 0.000 claims description 44
- 239000000853 adhesive Substances 0.000 claims 1
- 230000008054 signal transmission Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
- H01R25/006—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits the coupling part being secured to apparatus or structure, e.g. duplex wall receptacle
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
技术领域technical field
本发明有关一种表面黏着型RJ连接器,尤指一种利用表面黏着手段与外部电路板形成电性连接关系的设计。The present invention relates to a surface-attached RJ connector, in particular to a design that utilizes surface-attaching means to form an electrical connection relationship with an external circuit board.
背景技术Background technique
按,如〔图1〕~〔图3〕所示,现有技术的RJ连接器10与外部电性连接的方式,使用插针式接脚11穿过外部电路板20的插孔,再利用焊固手段予以电性连接;然而,RJ连接器10与外部电路板20之间利用焊固手段形成的电性连接关系,容易造成传输的信号损耗衰减程度过大的问题,而无法达到信号高速传输的应用。As shown in [FIG. 1] to [FIG. 3], the
发明内容SUMMARY OF THE INVENTION
本发明的主要目的,欲解决先前技术信号传输损耗衰减程度过大的问题,而具有降低信号传输损耗衰减程度的功效。The main purpose of the present invention is to solve the problem of excessive attenuation of signal transmission loss in the prior art, and to have the effect of reducing the attenuation of signal transmission loss.
本发明的另一目的,则具有组装制造模块化的功效。Another object of the present invention is to have the effect of assembling and manufacturing modules.
为达上述功效,本发明的技术手段,包括有:一壳体,前侧设有层叠的至少一第一端子孔与至少一第二端子孔;一基座,设置于该壳体后侧,该基座具有一水平插口部与一直立支撑部,而于该基座内部设有至少一第一转接端子组与至少一第二转接端子组,该第一转接端子组与该第二转接端子组的第一端以具有高度差的姿态伸入该水平插口部,而令该第一转接端子组与该第二转接端子组的第一端具有凸点相向的弯弧段,该第一转接端子组与该第二转接端子组的第二端伸出该直立支撑部的底缘,且令该第一转接端子组与该第二转接端子组第二端的伸出段弯成水平状;以及一连接电路板,内端顶面相对该第一转接端子组的弯弧段设有至少一第一金手指组,内端底面相对该第二转接端子组的弯弧段设有至少一第二金手指组,外端顶面相对该第一金手指组设有至少一第一连接端子组,而令该第一连接端子组伸入该第一端子孔,外端底面相对该第二金手指组设有至少一第二连接端子组,且令该第二连接端子组伸入该第二端子孔,并把该连接电路板外端定位于壳体,而让该连接电路板内端插置于该基座的水平插口。In order to achieve the above-mentioned effects, the technical means of the present invention include: a casing with at least one first terminal hole and at least one second terminal hole stacked on the front side; a base disposed on the rear side of the casing, The base has a horizontal socket portion and an upright support portion, and at least one first transfer terminal group and at least one second transfer terminal group are arranged inside the base, the first transfer terminal group and the first transfer terminal group The first ends of the two transfer terminal sets extend into the horizontal socket portion with a height difference, so that the first ends of the first transfer terminal set and the first ends of the second transfer terminal set have curved arcs with convex points facing each other segment, the second ends of the first transfer terminal group and the second transfer terminal group protrude from the bottom edge of the upright support portion, and the first transfer terminal group and the second transfer terminal group are second The protruding section of the end is bent into a horizontal shape; and a connecting circuit board, the top surface of the inner end is provided with at least a first gold finger group relative to the curved arc section of the first transfer terminal group, and the bottom surface of the inner end is opposite to the second transfer terminal group. The curved segment of the terminal group is provided with at least one second gold finger group, and the top surface of the outer end is opposite to the first gold finger group with at least one first connection terminal group, so that the first connection terminal group extends into the first gold finger group. A terminal hole, the bottom surface of the outer end is provided with at least one second connection terminal group opposite to the second gold finger group, and the second connection terminal group is extended into the second terminal hole, and the outer end of the connection circuit board is positioned on the shell body, and the inner end of the connecting circuit board is inserted into the horizontal socket of the base.
此外,该壳体、该基座以及该连接电路板的数量比例为1:1X:1X,而X为自然数;In addition, the quantity ratio of the housing, the base and the connecting circuit board is 1:1X:1X, and X is a natural number;
再者,该连接电路板、该第一/第二连接端子组、该第一/第二端子孔、该第一/第二金手指组以及该第一/第二转接端子组的数量比例为1:1Y:1Y:1Y:1Y,而Y为自然数。Furthermore, the number ratio of the connection circuit board, the first/second connection terminal group, the first/second terminal hole, the first/second gold finger group, and the first/second transfer terminal group is 1:1Y:1Y:1Y:1Y, and Y is a natural number.
由此,用以解决现有技术中信号传输损耗衰减程度过大之问题,而具有降低信号传输损耗衰减程度之功效。Therefore, it is used to solve the problem of excessive attenuation of signal transmission loss in the prior art, and has the effect of reducing the attenuation of signal transmission loss.
附图说明Description of drawings
[图1〕是现有技术的RJ连接器的结构外观图。[FIG. 1] is a structural external view of a conventional RJ connector.
[图2〕是现有技术的RJ连接器的结构侧视图。[ Fig. 2 ] is a side view of the structure of a conventional RJ connector.
[图3〕是[图2〕中标注3处的放大图。[Fig. 3] is an enlarged view of the place marked 3 in [Fig. 2].
[图4〕是本发明第一实施例的结构外观图。[FIG. 4] is an external view of the structure of the first embodiment of the present invention.
[图5〕是本发明第一实施例的结构侧视图。[ Fig. 5 ] is a side view of the structure of the first embodiment of the present invention.
[图6〕是本发明第一实施例的基座与连接电路板的结构外观图。[FIG. 6] is an external view of the structure of the base and the connecting circuit board according to the first embodiment of the present invention.
[图7〕是本发明第一实施例的结构剖示图。[ Fig. 7 ] is a cross-sectional view of the structure of the first embodiment of the present invention.
[图8〕是本发明第二实施例的结构外观图。[ Fig. 8 ] is an external view of the structure of the second embodiment of the present invention.
附图标记列表:10RJ连接器;11插针式接脚;20外部电路板;30a、30b壳体;31第一端子孔;32第二端子孔;40基座;41水平插口部;42直立支撑部;43第一转接端子组;44第二转接端子组;431、441弯弧段;432、442伸出段;50连接电路板;51第一金手指组;52第二金手指组;53第一连接端子组;54第二连接端子组;60外部电路板;61电性连接垫;62处理芯片。LIST OF REFERENCE NUMERALS: 10RJ connector; 11 pin pin; 20 external circuit board; 30a, 30b housing; 31 first terminal hole; 32 second terminal hole; 40 base; 41 horizontal socket part; 42 upright Support part; 43 The first transfer terminal group; 44 The second transfer terminal group; group; 53 first connection terminal group; 54 second connection terminal group; 60 external circuit board; 61 electrical connection pad; 62 processing chip.
具体实施方式Detailed ways
首先,请参阅[图4〕~[图7〕所示,本发明第一实施例包括有:一壳体30a,前侧设有层叠的两个第一端子孔31与两个第二端子孔32;一基座40,设置于该壳体30a后侧,该基座40具有一水平插口部41与一直立支撑部42,而于该基座40内部设有两个第一转接端子组43与两个第二转接端子组44,该第一转接端子组43与该第二转接端子组44的第一端以具有高度差的姿态伸入该水平插口部41,而令该第一转接端子组43与该第二转接端子组44的第一端具有凸点相向的弯弧段431、441,该第一转接端子组43与该第二转接端子组44的第二端伸出该直立支撑部42的底缘,且令该第一转接端子组与该第二转接端子组第二端的伸出段432、442弯成水平状;以及一连接电路板50,内端顶面相对两个该第一转接端子组43的弯弧段431设有两个第一金手指组51,内端底面相对两个该第二转接端子组44的弯弧段441设有两个第二金手指组52,外端顶面相对两个该第一金手指组51设有两个第一连接端子组53,而令两个该第一连接端子组53伸入两个该第一端子孔31,外端底面相对两个该第二金手指组52设有两个第二连接端子组54,且令两个该第二连接端子组54伸入两个该第二端子孔32,并把该连接电路板50外端定位于壳体30a,而让该连接电路板50内端插置于该基座40的水平插口41。First of all, please refer to [FIG. 4] to [FIG. 7], the first embodiment of the present invention includes: a
接着,请参阅[图8〕所示,本发明第二实施例与第一实施例的差异在于:第二实施例的壳体30b前侧设有层叠的四个第一端子孔31与四个第二端子孔32,而第二实施例与第一实施例的基座40与连接电路板50结构相同,只是数量各增加为两个。Next, please refer to FIG. 8 , the difference between the second embodiment of the present invention and the first embodiment is that the front side of the
基于如是的构成,本发明将用以与外部电路板60电性连接的基座40设置于壳体30a、30b后侧,且令端子伸出段432、442被弯成水平状,致使本发明与外部电路板60之间可利用表面黏着手段形成电性连接关系,而外部电路板60相对端子伸出段432、442的电性连接垫61,则以靠近处理芯片62的姿态整齐排列,整齐排列的电性连接垫61可让外部电路板60的线路布局更容易,靠近处理芯片62的电性连接垫61则让信号的传输距离短,而具有降低信号传输损耗衰减程度的功效。Based on such a configuration, the present invention disposes the
再者,该连接电路板50、该第一/第二连接端子组53/54、该第一/第二端子孔31/32、该第一/第二金手指组51/52以及该第一/第二转接端子组43/44的数量比例为1:1Y:1Y:1Y:1Y(Y为自然数),而本发明第一/第二实施例的Y采用2,使得该连接电路板50、该第一/第二连接端子组53/54、该第一/第二端子孔31/32、该第一/第二金手指组51/52以及该第一/第二转接端子组43/44的数量比例为1:2:2:2:2,该连接电路板50具有两个第一连接端子组53与两个第二连接端子组54。Furthermore, the
又,该壳体30a/30b、该基座40以及该连接电路板50的数量比例为1:1X:1X(X为自然数),而本发明第一实施例的X采用1,该壳体30a、该基座40以及该连接电路板50的数量比例为1:1:1,该壳体30a相对该连接电路板50具有两个第一端子孔31与两个第二端子孔32;而本发明第二实施例的X采用2,该壳体30b、该基座40以及该连接电路板50的数量比例为1:2:2,该壳体30b相对该连接电路板50具有四个第一端子孔31与四个第二端子孔32;是以,本发明将壳体30a/30b、基座40以及连接电路板50予以模块化,可轻松组装制造出不同数量端子孔的RJ连接器,则具有组装制造模块化的功效。In addition, the ratio of the numbers of the
惟,上述所揭露的图式、说明,仅为本发明的较佳实施例,大凡熟悉此项技术人士,依本案精神范畴所作的修饰或等效变化,仍应包括在本案申请专利范围内。However, the drawings and descriptions disclosed above are only preferred embodiments of the present invention, and modifications or equivalent changes made by those skilled in the art within the scope of the spirit of this case should still be included in the scope of the patent application of this case.
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CN202011256839.3A CN114552299A (en) | 2020-11-11 | 2020-11-11 | Surface Mount RJ Connectors |
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CN202011256839.3A CN114552299A (en) | 2020-11-11 | 2020-11-11 | Surface Mount RJ Connectors |
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Citations (8)
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US6206725B1 (en) * | 1999-08-13 | 2001-03-27 | Hon Hai Precision Ind. Co., Ltd. | Connector assembly |
CN2596612Y (en) * | 2002-09-18 | 2003-12-31 | 富士康(昆山)电脑接插件有限公司 | Stacking type electric connector module |
TWM335076U (en) * | 2007-12-20 | 2008-06-21 | Ud Electronic Corp | Signal connector |
CN102195173A (en) * | 2010-02-15 | 2011-09-21 | 莫列斯公司 | Differentially coupled connector |
CN204088814U (en) * | 2014-08-09 | 2015-01-07 | 乐清市华信电子有限公司 | Electric connector |
TW201509038A (en) * | 2013-08-30 | 2015-03-01 | Ajoho Entpr Co Ltd | Electrical module and forming method for RJ type electric connector |
CN204424561U (en) * | 2015-02-13 | 2015-06-24 | 东莞建冠塑胶电子有限公司 | RJ45 modularization separate type package assembly |
TW201644121A (en) * | 2015-06-15 | 2016-12-16 | 鴻騰精密科技股份有限公司 | Network connector |
-
2020
- 2020-11-11 CN CN202011256839.3A patent/CN114552299A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6206725B1 (en) * | 1999-08-13 | 2001-03-27 | Hon Hai Precision Ind. Co., Ltd. | Connector assembly |
CN2596612Y (en) * | 2002-09-18 | 2003-12-31 | 富士康(昆山)电脑接插件有限公司 | Stacking type electric connector module |
TWM335076U (en) * | 2007-12-20 | 2008-06-21 | Ud Electronic Corp | Signal connector |
CN102195173A (en) * | 2010-02-15 | 2011-09-21 | 莫列斯公司 | Differentially coupled connector |
TW201509038A (en) * | 2013-08-30 | 2015-03-01 | Ajoho Entpr Co Ltd | Electrical module and forming method for RJ type electric connector |
CN204088814U (en) * | 2014-08-09 | 2015-01-07 | 乐清市华信电子有限公司 | Electric connector |
CN204424561U (en) * | 2015-02-13 | 2015-06-24 | 东莞建冠塑胶电子有限公司 | RJ45 modularization separate type package assembly |
TW201644121A (en) * | 2015-06-15 | 2016-12-16 | 鴻騰精密科技股份有限公司 | Network connector |
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