CN114551368A - Packaging structure - Google Patents
Packaging structure Download PDFInfo
- Publication number
- CN114551368A CN114551368A CN202011334042.0A CN202011334042A CN114551368A CN 114551368 A CN114551368 A CN 114551368A CN 202011334042 A CN202011334042 A CN 202011334042A CN 114551368 A CN114551368 A CN 114551368A
- Authority
- CN
- China
- Prior art keywords
- substrate
- heat
- chip
- connection portion
- connecting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 230000017525 heat dissipation Effects 0.000 claims abstract description 16
- 239000003292 glue Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 8
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention creatively discloses a packaging structure. The packaging structure comprises: the chip is arranged on one side of the substrate; the heat dissipation piece covers the chip, and the chip is arranged in a space enclosed by the heat dissipation piece and the substrate; the heat sink includes a heat conduction portion, a first connection portion, and a second connection portion; the heat conducting part is bonded with the chip; the second connecting portion is connected with the heat conducting portion through the first connecting portion, one end, far away from the first connecting portion, of the second connecting portion is bonded to the substrate, and the thickness of the heat conducting portion is larger than that of the first connecting portion. Compared with the prior art, the rigidity of the first connecting part is reduced, when the heat radiating piece deforms under heat, the stress generated by deformation of the second connecting part and the substrate is reduced, layering of the second connecting part and the substrate is avoided, and the reliability of the packaging structure is improved.
Description
Technical Field
The present invention relates to semiconductor technologies, and in particular, to a package structure.
Background
The packaging structure of the semiconductor integrated chip plays roles in fixing, sealing, protecting and enhancing the electrothermal performance of the chip. For a chip with high power consumption, the heat dissipation performance of the package structure is particularly important. In the prior art, a package structure includes a chip, a substrate, and a heat sink, the substrate and the heat sink are hermetically connected to seal the chip therein. However, because the substrate has a certain rigidity, and after the substrate and the heat sink are heated, the warpage and stress of each part are different, so that the conventional package structure has a problem that the substrate and the heat sink are prone to layering, which results in the reliability of the package structure being reduced.
Disclosure of Invention
The invention provides a packaging structure, which is used for avoiding the layering phenomenon of a heat radiating piece and a substrate and improving the reliability of the packaging structure.
In a first aspect, an embodiment of the present invention provides a package structure, including:
a substrate;
a chip disposed on one side of the substrate;
the heat dissipation piece covers the chip, and the chip is arranged in a space enclosed by the heat dissipation piece and the substrate;
the heat sink includes a heat conduction portion, a first connection portion, and a second connection portion; the heat conducting part is bonded with the chip; the second connecting portion is connected with the heat conducting portion through the first connecting portion, one end, far away from the first connecting portion, of the second connecting portion is bonded to the substrate, and the thickness of the heat conducting portion is larger than that of the first connecting portion.
Optionally, the thickness of the second connection portion is greater than the thickness of the first connection portion.
Optionally, at least two circles of grooves surrounding the heat conducting portion are arranged on the first connecting portion, and the grooves of two adjacent circles are arranged in a staggered manner.
Optionally, a flexible support is provided within the recess.
Optionally, the flexible support is smaller in size than the recess.
Optionally, the first connection site is a flexible connection.
Optionally, the first connection portion and the second connection portion are connected through a glue layer.
Optionally, the thickness of the heat conduction portion is 1.5-2 times the thickness of the first connection portion.
The thickness of the heat conducting part is larger than that of the first connecting part, so that the rigidity of the first connecting part is reduced. Compared with the prior art, when the heat dissipation piece deforms under heat, the rigidity of the first connecting portion is smaller, so that on one hand, the deformation stress of the heat conduction portion is prevented from being transmitted to the second connecting portion through the first connecting portion, and on the other hand, the deformation stress of the second connecting portion is prevented from being transmitted to the heat conduction portion through the first connecting portion. Therefore, when the heat sink is deformed by heat, the embodiment of the invention reduces the stress generated by the deformation of the second connecting part and the substrate, avoids the layering of the second connecting part and the substrate, and improves the reliability of the packaging structure.
Drawings
Fig. 1 is a schematic structural diagram of a package structure according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another package structure according to an embodiment of the present invention;
FIG. 3 is a top view of FIG. 2;
fig. 4 is a schematic structural diagram of another package structure according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another package structure according to an embodiment of the present invention.
Detailed Description
The invention is described in further detail below with reference to the figures and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Fig. 1 is a schematic structural diagram of a package structure according to an embodiment of the present invention. Referring to fig. 1, the package structure includes: substrate 100, chip 200, and heat spreader 300. The chip 200 is disposed on one side of the substrate 100. The heat sink 300 covers the chip 200, and the chip 200 is disposed in a space enclosed by the heat sink 300 and the substrate 100. The heat sink 300 includes a heat conduction portion 310, a first connection portion 320, and a second connection portion 330. The thermal conductor 310 is bonded to the chip 200. The second connecting portion 330 is connected to the heat conducting portion 310 through the first connecting portion 320, one end of the second connecting portion 330 away from the first connecting portion 320 is bonded to the substrate 100, and a thickness d1 of the heat conducting portion 310 is greater than a thickness d2 of the first connecting portion 320.
The substrate 100 may be, for example, a metal substrate, a ceramic substrate, or a PCB, the chip 200 may be disposed on one side of the substrate 100, and other electronic components may also be disposed on one side of the substrate 100 away from the chip 200. Pads, solder balls, etc. may also be disposed on the substrate 100 to allow the chip 200 to be connected to other circuit boards through the substrate 100.
The heat sink 300 may be, for example, a metal heat sink having a good heat dissipation performance. The heat dissipation member 300 covers the chip 200, and on one hand, can fix, seal and protect the chip 200, and is equivalent to a package cover; on the other hand, since the heat sink 300 covers the chip 200, the area of the heat sink 300 is larger than that of the chip 200, thereby contributing to an increase in heat dissipation area.
The space enclosed by the heat sink 300 and the substrate 100 means a receiving space formed in the middle of the second connection portion 330 of the heat sink 300 and the edge of the substrate 100, which are hermetically connected. The chip 200 is disposed in the space, and one side of the chip 200 is electrically connected to the substrate 100. The other side of the chip 200 is bonded to the heat sink 300, so that the contact area between the heat conduction portion 310 and the chip 200 is increased, which is beneficial to heat dissipation of the chip 200.
The second connection portion 330 of the heat sink 300 is connected to the heat conduction portion 310 through the first connection portion 320, that is, the first connection portion 320 is disposed between the heat conduction portion 310 and the second connection portion 330. The thermal conductive portion 310 is bonded to the chip 200, the second connecting portion 330 is bonded to the substrate 100, and the first connecting portion 320 connected therebetween has a large degree of freedom of warpage. The thickness d1 of the heat conduction part 310 refers to a thickness in a direction perpendicular to the substrate 100, and the thickness d2 of the first connection part 320 refers to a thickness perpendicular to an extending direction of the first connection part 320. The thicker the thickness d1 of the heat conduction part 310 is, the stronger the rigidity of the heat conduction part 310 is, and similarly, the thicker the thickness d2 of the first connection part 320 is, the stronger the rigidity of the first connection part 320 is.
The inventive embodiment reduces the rigidity of the first connection part 320 by setting the thickness of the heat conduction part 310 to be greater than that of the first connection part 320. Compared with the prior art, when the heat sink 300 is deformed by heat, the rigidity of the first connection portion 320 is smaller in the inventive embodiment of the present invention, on one hand, the deformation stress of the heat conduction portion 310 is prevented from being transmitted to the second connection portion 330 through the first connection portion 320, and on the other hand, the deformation stress of the second connection portion 330 is prevented from being transmitted to the heat conduction portion 310 through the first connection portion 320. Therefore, when the heat spreader 300 is deformed by heat, the embodiments of the present invention reduce the stress generated by the deformation of the second connection portion 330 and the substrate 100, thereby avoiding the delamination between the second connection portion 330 and the substrate 100 and improving the reliability of the package structure.
With continued reference to fig. 1, on the basis of the above embodiments, optionally, the thickness d3 of the second connection portion 330 is greater than the thickness d1 of the first connection portion 320. The inventive embodiment of the present invention is configured such that the rigidity of the first connection portion 320 is also lower than that of the second connection portion 330, that is, the rigidity of the first connection portion 320 is the portion of the heat sink 300 where the rigidity is the smallest, thereby further reducing the stress generated by the deformation of the second connection portion 330 and the substrate 100.
With continued reference to fig. 1, based on the above embodiments, the thickness d1 of the heat conduction portion 310 is optionally 1.5-2 times the thickness d2 of the first connection portion 320. The embodiment of the invention is configured in such a way, and the rigidity and the stability of the first connection portion 320 are both considered, so that the heat dissipation performance of the package structure is better and the package structure is more durable.
Fig. 2 is a schematic structural diagram of another package structure according to an embodiment of the present invention, and fig. 3 is a top view of fig. 2. Referring to fig. 2 and 3, on the basis of the above embodiments, at least two circles of grooves 321 surrounding the heat conducting portion 310 are optionally disposed on the first connecting portion 320, and two adjacent circles of grooves 321 are alternately disposed. On the one hand, the rigidity of the first connection portion 320 is further reduced, which is beneficial to avoiding the delamination of the second connection portion 330 and the substrate 100; on the other hand, the groove 321 increases the surface area of the first connection portion 320, so as to increase the heat dissipation area of the heat sink 300, which is beneficial to heat dissipation of the package structure.
It should be noted that, in the above embodiments, the shape of the groove 321 is exemplarily shown to be rectangular, and is not a limitation of the invention. In other embodiments, the shape of the groove 321 may be trapezoidal or arc, and may be set as required in practical applications.
Fig. 4 is a schematic structural diagram of another package structure according to an embodiment of the present invention. Referring to fig. 4, on the basis of the above embodiments, a flexible supporting portion 322 is optionally disposed in the groove 321. The arrangement of the embodiment of the present invention avoids the situation that the rigidity of the first connection portion 320 is too small, so that the heat sink 300 is easily damaged, and therefore, the embodiment of the present invention improves the protection effect of the package structure on the basis of improving the heat dissipation performance of the package structure and avoiding delamination.
With continued reference to fig. 4, based on the above embodiments, the flexible support 322 may optionally have a size smaller than the size of the recess 321. The inventive embodiment of the present invention is configured such that when the first connection portion 320 is thermally expanded, there is enough warpage space, and the strain stress between the flexible support portion 322 and the first connection portion 320 is reduced.
On the basis of the above embodiments, the first connection portion 320 is optionally a flexible connection portion. Wherein, the rigidity of flexible connection portion is less strong, and when heat conduction portion 310 was heated and takes place deformation, flexible connection portion's deformation stress was less, and the deformation stress of conduction to second connecting portion 330 is less, and on the one hand, the deformation stress of having avoided heat conduction portion 310 conducts to second connecting portion 330 through first connecting portion 320, and on the other hand, the deformation stress of having avoided second connecting portion 330 conducts to heat conduction portion 310 through first connecting portion 320. Therefore, when the heat spreader 300 is deformed by heat, the inventive embodiment reduces the stress of the second connection portion 330 and the substrate 100 due to deformation, and prevents the second connection portion 330 and the substrate 100 from being delaminated.
Fig. 5 is a schematic structural diagram of another package structure according to an embodiment of the present invention. Referring to fig. 5, on the basis of the above embodiments, optionally, the first connection portion 320 and the second connection portion 330 are connected by a glue layer 340. The glue layer 340 has certain flexibility, and can bear large deformation stress of the first connecting portion 320, so that stress generated by deformation of the second connecting portion 330 and the substrate 100 is further reduced, layering of the second connecting portion 330 and the substrate 100 is avoided, and reliability of the packaging structure is further improved.
It is noted that the above-mentioned embodiments are only preferred embodiments of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in some detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (8)
1. A package structure, comprising:
a substrate;
a chip disposed on one side of the substrate;
the heat dissipation piece covers the chip, and the chip is arranged in a space enclosed by the heat dissipation piece and the substrate;
the heat sink includes a heat conduction portion, a first connection portion, and a second connection portion; the heat conducting part is bonded with the chip; the second connecting portion is connected with the heat conducting portion through the first connecting portion, one end, far away from the first connecting portion, of the second connecting portion is bonded to the substrate, and the thickness of the heat conducting portion is larger than that of the first connecting portion.
2. The package structure according to claim 1, wherein a thickness of the second connection portion is greater than a thickness of the first connection portion.
3. The package structure according to claim 1, wherein the first connecting portion has at least two circles of grooves surrounding the heat conducting portion, and two adjacent circles of grooves are staggered.
4. The package structure of claim 3, wherein a flexible support is disposed within the recess.
5. The package structure of claim 4, wherein the flexible support has a size smaller than a size of the recess.
6. The package structure of claim 1, wherein the first connection site is a flexible connection.
7. The package structure according to claim 1, wherein the first connection portion and the second connection portion are connected by a glue layer.
8. The package structure of claim 1, wherein the thickness of the thermal conduction portion is 1.5-2 times the thickness of the first connection portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011334042.0A CN114551368A (en) | 2020-11-25 | 2020-11-25 | Packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011334042.0A CN114551368A (en) | 2020-11-25 | 2020-11-25 | Packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114551368A true CN114551368A (en) | 2022-05-27 |
Family
ID=81660386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011334042.0A Pending CN114551368A (en) | 2020-11-25 | 2020-11-25 | Packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114551368A (en) |
-
2020
- 2020-11-25 CN CN202011334042.0A patent/CN114551368A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20220527 |