CN114521066B - Double-sided welding rigid-flex printed circuit board integrated SMT tool and use method thereof - Google Patents
Double-sided welding rigid-flex printed circuit board integrated SMT tool and use method thereof Download PDFInfo
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- CN114521066B CN114521066B CN202210210653.7A CN202210210653A CN114521066B CN 114521066 B CN114521066 B CN 114521066B CN 202210210653 A CN202210210653 A CN 202210210653A CN 114521066 B CN114521066 B CN 114521066B
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- 238000003466 welding Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000003754 machining Methods 0.000 claims description 10
- 239000010935 stainless steel Substances 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 239000002969 artificial stone Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000012797 qualification Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000011449 brick Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910001094 6061 aluminium alloy Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention relates to the technical field of manufacturing SMT (surface mounting technology) of radar electronic functional components, in particular to a double-sided welding rigid-flex combined board integrated SMT tool and a use method thereof.
Description
Technical Field
The invention relates to the technical field of manufacturing SMT (surface mounted technology) of radar electronic functional components, in particular to an integrated SMT tool for a double-sided welding rigid-flex printed circuit board and a use method thereof.
Background
In order to meet the demands of miniaturization, high integration, high frequency and wide frequency band development of airborne and airborne platforms and loads, antenna systems are also gradually developed in the direction of miniaturization, broadband and conformal as indispensable components. Conformal antennas are one of the key trends in future antenna development, and are one of the research hotspots and difficulties in the current antenna field.
The conformal antenna is mostly designed and implemented by integrating passive antennas and aircraft body structures, namely, the conformal antenna is integrated on the structural forms of a curved plane body, wings and the like, but the active transceiver system is still in an original brick structure and is arranged on the inner side of a framework structure, and interconnection with the antennas is completed through multiple bundles of cables. The method is unfavorable for the overall requirements of miniaturization and light weight, and the conformal antenna cannot ensure the reliable installation and signal transmission of the fixed-length cable.
Through the active transceiver system that adopts the rigid-flex board of adaptation curved surface skeleton texture as the carrier, through changing brick type TR subassembly into SIP type TR subassembly chip, can replace cable connection, realized conformal through the flexible characteristic of flexible board simultaneously. However, the SIP type TR module chip is a high-integration and large-sized chip with fine pitch pins, and has extremely high requirements on the mounting precision of the board-level SMT, while the flex-rigid board is difficult to control the flatness, so that the SMT difficulty is greatly increased.
In addition, because the cable connection is canceled, microwave signals between the antenna array and the TR chip are interconnected through the connector, and a large number of surface-mounted connectors are used on the back of the rigid-flex board, the rigid-flex board is required to be welded on the two sides with high precision.
The SMT welding of the traditional double-sided rigid PCB is firstly welding the A surface and then welding the B surface, and for the double-sided welding rigid-flex printed circuit board, the problems of difficult control of the patch precision, difficult accurate control of the secondary reflow temperature curve, difficult maintenance of the position precision of the connector in the secondary reflow process and the like exist.
In view of the above drawbacks, the present inventors have finally achieved the present invention through long-time studies and practices.
Disclosure of Invention
The invention aims to solve the problem that a double-sided welding rigid-flex printed circuit board cannot use the twice SMT process flow of a conventional rigid PCB to prepare a component with high precision, high reliability and high yield, and provides an integrated welding tool for the double-sided welding rigid-flex printed circuit board and a using method thereof.
In order to achieve the above purpose, the invention discloses a double-sided welding rigid-flex board integrated welding tool, which comprises a tray for positioning the rigid-flex board and a limiting surrounding frame of an SIP type TR component chip.
The tray comprises a clamping groove for placing a rigid area of the flexible printed circuit board, a convex grid is arranged at the bottom of the clamping groove and used for limiting the connector, a positioning pin hole is formed in the clamping groove, and a threaded hole connected with the limiting surrounding frame is formed in the periphery of the tray.
The utility model discloses a solar panel, including spacing frame, mounting column, spacing frame, the center of spacing frame is unanimous with the center of SIP type TR subassembly chip on the rigid-flex board, the mounting column is located spacing frame around, the unthreaded hole has been seted up on the mounting column, unthreaded hole passes through screw thread and screw connection, the screw passes unthreaded hole pass through the screw thread with the tray interlock is fixed.
The tray is made of any one of graphite, synthetic stone, aluminum alloy and stainless steel, the total thickness of the tray is less than or equal to 35mm, the machining precision is better than +/-0.03 mm, and the flatness is better than 0.03mm.
The thickness of the grid is 2.5 mm-3.5 mm, the size of the grid is 0.05mm larger than the outer diameter of the connector, and the height of the grid is 5.0-15 mm higher than the connector.
The positioning pin hole is a blind hole, the diameter is 2.0-4.0 mm, and the machining precision is better than +/-0.03 mm.
And the limiting surrounding frame is provided with radiating holes, and the aperture of each radiating hole is 2.0-4.0 mm.
The invention also discloses a use method of the double-sided welding rigid-flex printed circuit board integrated SMT tool, which comprises the following steps:
s1: placing the rigid area of the rigid-flex board of the double-sided patch into a tray clamping groove, and clamping the connector into a grid in the clamping groove;
s2: knocking in positioning pins on the rigid-flex printed circuit board and the tray;
s3: clamping the limiting surrounding frame on the outer side of the SIP type TR component chip, and adjusting the position;
s4: the limiting surrounding frame is fixed on the tray through screws penetrating through the mounting columns;
s5: welding the rigid-flex printed circuit board of the double-sided patch and the integrated SMT tool;
s6: and removing the screws after cooling, removing the limiting surrounding frame, removing the positioning pins, and removing the welded rigid-flex printed circuit board.
The integrated SMT tool is used for welding rigid-flex boards of 16 SIP type TR component chips and 64 SMP surface-mounted connectors, so that the assembly precision is better than +/-0.05 mm, the qualification rate is more than or equal to 80%, no short circuit or open circuit is detected after 100 cycles of a high-low temperature cycle environment test (-45-75 ℃), and the welding spots are free from cracks or breaks.
Compared with the prior art, the invention has the beneficial effects that:
1. the integrated SMT tool provides a one-time SMT welding end scheme of the double-sided device of the rigid-flex printed circuit board, solves the problems that the position of the surface-mounted connector is easy to deviate and the reliability of welding spots is reduced in the secondary welding process, and improves the welding qualification rate of the rigid-flex printed circuit board;
2. the integrated SMT fixture ensures high assembly precision of fine-pitch pins of the SIP type TR component chip, and provides a technical basis for high transmission quality of microwave signals of the TR chip and the antenna array;
3. the SMT tool is made of conventional materials, adopts the conventional machining means, has no special requirements on equipment and technological parameters, is short in technological process, convenient to operate, convenient to design, quick to realize and iterate, and can be quickly popularized in other similar use scenes.
Drawings
FIG. 1 is a schematic structural diagram of a double-sided welded rigid-flex board according to embodiment 1 of the present invention;
FIG. 2 is a schematic diagram of a tray structure of an integrated SMT tool;
FIG. 3 is a schematic diagram of a limiting enclosure frame structure of an integrated SMT tool;
fig. 4 is a schematic diagram of a process flow used in the tool of embodiment 1 of the present invention.
The figures represent the numbers:
1. a TR component; 2-a microwave rigid plate; 3-an outer conductor; 4-an inner conductor; 5-a tray; 6-a connector heat dissipation hole; 7-screw mounting holes; 8-locating pin mounting holes; 9-locating pins; 10-clamping grooves; 11-separating ribs; 12-a limit groove; 13-a limit bracket; 14-limiting screen plates; 15-device heat dissipation holes; 16-a limit frame; 17-screws; 18-screw mounting holes; 19-finger foot.
Detailed Description
The above and further technical features and advantages of the present invention are described in more detail below with reference to the accompanying drawings.
The rigid board area for the rigid-flex board in fig. 1 contains a chip TR assembly 1, a microwave rigid board 2, and an SMP connector (outer conductor 3 and inner conductor 4). The rigid-flex printed circuit board comprises 4 groups of rigid areas which are horizontally arranged, and the rigid areas are connected through a flexible board.
Comparative example
For the rigid-flex board of fig. 1, an SMT process was performed without the aid of tools. Firstly, printing a B-side soldering paste, and then welding the B-side soldering paste by an eight-temperature-zone reflow oven, wherein the temperature is set as follows: the temperatures of 150 ℃, 160 ℃, 170 ℃, 220 ℃, 240 ℃, 245 ℃, 240 ℃ and the top temperature zone and the bottom temperature zone are set to be consistent. The conveyor speed was 80cm/min. And then printing the A-side solder paste, wherein the reflux temperature of the A-side is set as follows: 150 ℃, 160 ℃, 180 ℃, 240 ℃, 260 ℃, 270 ℃, 260 ℃. The conveyor speed was 78cm/min. After the welding is completed, a microscope with a magnification of not less than 40 times is used for inspection, and then electrical measurement is performed.
Example 1
The fixture comprises a tray 5 made of 5A06 aluminum alloy and a limiting surrounding frame 14 made of 6061 aluminum alloy. The tray comprises a clamping groove 10 for mounting a rigid plate, a separation rib 11, a limit groove 12 and a limit support 13 of an SMP connector, a connector radiating hole 6, a screw mounting hole 7 for mounting a limit surrounding frame, a positioning pin 9 and a positioning pin mounting hole 8. The limiting surrounding frame comprises a limiting screen 14, a limiting frame 16 of the TR component chip, finger pins 19, device heat dissipation holes 15, screws 17 and screw mounting holes 18.
The total thickness of the tray is 30mm, the machining precision is +/-0.03 mm, and the flatness is 0.03mm. The grid thickness was 2.5mmmm, the size was connector outside diameter +0.05mm, and the height was connector height +7.0mm. The diameter of the through hole at the bottom of the clamping groove is 1.5mm. The locating pin is stainless steel, the diameter is 2.0mm, and the machining precision is-0.03 mm. The diameter of the positioning pin hole is 2.05mm, and the machining precision is +/-0.03 mm. The total thickness of the limiting surrounding frame is 15mm, and the machining precision is +/-0.02 mm. The diameter of the stainless steel threaded hole is 4.0mm, and the machining precision is +/-0.03 mm.
The method comprises the steps of spraying soldering paste, mounting a surface mount device (comprising a TR chip) and a rigid-flex board of an SMP connector, placing a tray clamping groove in a rigid area, clamping the connector into a grid in the clamping groove, mounting positioning pins on the rigid board and the tray, clamping a limiting enclosure frame on the outer side of the SIP type TR component chip, adjusting the position, and fixing the limiting enclosure frame on the tray through screws penetrating through mounting columns.
Welding a rigid-flex printed circuit board of the double-sided patch and an integrated SMT tool, and then welding through an eight-temperature-zone reflow oven, wherein the temperature is set as follows: 150 ℃, 160 ℃, 180 ℃, 240 ℃, 260 ℃, 270 ℃, 265 ℃. The conveyor speed was 60cm/min.
After the welding is completed, a microscope with a magnification of not less than 40 times is used for inspection, and then electrical measurement is performed.
Example 2
The tool comprises a stainless steel tray and a stainless steel limiting surrounding frame. The remaining identical components are identical to those of the first embodiment.
Welding a rigid-flex printed circuit board of the double-sided patch and an integrated SMT tool, and then welding through vacuum vapor phase welding, wherein welding parameters are set as follows: prevacuum:200mBar, 0s,Injection 1:520ml, 125s,Injection 2:320ml, 30s,Injection 3:320ml, 30s,Injection 4:420ml, 25, vaccum: 15mBar, 1s.
After the welding is completed, a microscope with a magnification of not less than 40 times is used for inspection, and then electrical measurement is performed.
Through the rigid-flex board of 16 SIP type TR component chips, 64 SMP surface mount connectors of this integration SMT frock welding, embodiment 1 has realized that assembly precision is better than + -0.05 mm, qualification rate 83%, and embodiment 2 has realized that assembly precision is better than + -0.04 mm, qualification rate 87%. The rigid-flex printed circuit board assemblies obtained in the embodiment 1 and the embodiment 2 are electrically tested to have no short circuit, no open circuit and no crack and no fracture after 100 cycles of a high-low temperature cycle environment test (45-75 ℃).
The foregoing description of the preferred embodiment of the invention is merely illustrative of the invention and is not intended to be limiting. It will be appreciated by persons skilled in the art that many variations, modifications, and even equivalents may be made thereto without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (5)
1. The application method of the double-sided welding rigid-flex printed circuit board integrated SMT tool is characterized by comprising the following steps of:
s1: placing a rigid area of a rigid-flex board on which soldering paste is sprayed and which is provided with a surface-mounted device and an SMP connector into a tray clamping groove, and clamping the connector into a grid in the clamping groove, wherein the surface-mounted device comprises a TR chip;
s2: knocking in positioning pins on the rigid-flex printed circuit board and the tray;
s3: the method comprises the steps that a limiting enclosing frame is clamped on the outer side of an SIP type TR component chip, the position is adjusted, the limiting enclosing frame is integrated, a mounting column and a limiting frame are arranged on the limiting enclosing frame, the center of the limiting frame is consistent with the center of the SIP type TR component chip on a rigid-flex board, the mounting column is arranged on the periphery of the limiting enclosing frame, a unthreaded hole is formed in the mounting column, the unthreaded hole is connected with a screw through a thread, and the screw penetrates through the unthreaded hole and is meshed and fixed with the tray through the thread;
s4: the limiting enclosing frame is fixed on the tray through screws penetrating through the mounting columns, the tray comprises a clamping groove for placing a rigid area of the flexible printed circuit board, a convex grid is arranged at the bottom of the clamping groove and used for limiting the connector, a positioning pin hole is formed in the clamping groove, and a threaded hole connected with the limiting enclosing frame is formed in the periphery of the tray;
s5: welding the rigid-flex printed circuit board of the double-sided patch and the integrated SMT tool;
s6: and removing the screws after cooling, removing the limiting surrounding frame, removing the positioning pins, and removing the welded rigid-flex printed circuit board.
2. The application method of the double-sided welding rigid-flex board integrated SMT tool according to claim 1, wherein the tray is made of any one of graphite, synthetic stone, aluminum alloy and stainless steel, the total thickness of the tray is less than or equal to 35mm, the machining precision is better than +/-0.03 mm, and the flatness is better than 0.03mm.
3. The method for using the double-sided welding rigid-flex board integrated SMT tool according to claim 1, wherein the thickness of the grid is 2.5 mm-3.5 mm, the size is 0.05mm larger than the outer diameter of the connector, and the height is 5.0-15 mm higher than the connector.
4. The application method of the integrated SMT tool for the double-sided welding rigid-flex printed circuit board, as claimed in claim 1, is characterized in that the locating pin hole is a blind hole, the diameter is 2.0 mm-4.0 mm, and the machining precision is better than +/-0.03 mm.
5. The method for using the double-sided welding rigid-flex board integrated SMT tool according to claim 1, wherein the limiting surrounding frame is provided with radiating holes, and the aperture of the radiating holes is 2.0-4.0 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210210653.7A CN114521066B (en) | 2022-03-04 | 2022-03-04 | Double-sided welding rigid-flex printed circuit board integrated SMT tool and use method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210210653.7A CN114521066B (en) | 2022-03-04 | 2022-03-04 | Double-sided welding rigid-flex printed circuit board integrated SMT tool and use method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN114521066A CN114521066A (en) | 2022-05-20 |
| CN114521066B true CN114521066B (en) | 2023-06-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210210653.7A Active CN114521066B (en) | 2022-03-04 | 2022-03-04 | Double-sided welding rigid-flex printed circuit board integrated SMT tool and use method thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5281166A (en) * | 1991-10-28 | 1994-01-25 | Foxconn International, Inc. | Electrical connector with improved connector pin support and improved mounting to a PCB |
| JPH0794850A (en) * | 1991-12-11 | 1995-04-07 | Hitachi Chem Co Ltd | Manufacture of flexible wiring board for surface mount |
| US6267288B1 (en) * | 1999-10-18 | 2001-07-31 | Henry Chung | Pallet for combined surface mount and wave solder manufacture of printed ciruits |
| JP2004006123A (en) * | 2002-05-31 | 2004-01-08 | Japan Aviation Electronics Industry Ltd | Electrical connection members |
| JP2010287606A (en) * | 2009-06-09 | 2010-12-24 | Hitachi Cable Ltd | Flexible printed wiring board and flexible printed wiring board integrated connector structure |
| CN210202353U (en) * | 2019-05-28 | 2020-03-27 | 杭州水表有限公司 | Thin printed circuit board paster frock |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015058565A1 (en) * | 2013-10-24 | 2015-04-30 | He Shan Lide Electronic Enterprise Company Ltd. | Flexible circuit board and method for manufacturing the same, and led flexible strip light |
| US10455719B2 (en) * | 2017-11-27 | 2019-10-22 | Western Digital Technologies, Inc. | Systems and methods for attaching printed circuit board to pallet |
-
2022
- 2022-03-04 CN CN202210210653.7A patent/CN114521066B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5281166A (en) * | 1991-10-28 | 1994-01-25 | Foxconn International, Inc. | Electrical connector with improved connector pin support and improved mounting to a PCB |
| JPH0794850A (en) * | 1991-12-11 | 1995-04-07 | Hitachi Chem Co Ltd | Manufacture of flexible wiring board for surface mount |
| US6267288B1 (en) * | 1999-10-18 | 2001-07-31 | Henry Chung | Pallet for combined surface mount and wave solder manufacture of printed ciruits |
| JP2004006123A (en) * | 2002-05-31 | 2004-01-08 | Japan Aviation Electronics Industry Ltd | Electrical connection members |
| JP2010287606A (en) * | 2009-06-09 | 2010-12-24 | Hitachi Cable Ltd | Flexible printed wiring board and flexible printed wiring board integrated connector structure |
| CN210202353U (en) * | 2019-05-28 | 2020-03-27 | 杭州水表有限公司 | Thin printed circuit board paster frock |
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| Publication number | Publication date |
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| CN114521066A (en) | 2022-05-20 |
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