CN114518787A - Liquid-cooled virtual currency mining machine and liquid-cooled heat dissipation device - Google Patents

Abstract

The invention relates to a liquid-cooled virtual currency mining machine and a liquid-cooled heat dissipation device. The liquid-cooled heat dissipation device is used to dissipate heat for electronic equipment, and the electronic equipment includes a first electronic unit and a second electronic unit; the liquid-cooled heat dissipation device includes: a liquid cooling structure, including a first liquid cooling plate, a second liquid cooling plate A cold plate and a third liquid cold plate, the second and third liquid cold plates are symmetrically arranged on both sides of the first liquid cold plate, and the first electronic unit is arranged on the first between the liquid cooling plate and the second liquid cooling plate, the second electronic unit is arranged between the first liquid cooling plate and the third liquid cooling plate; and a pipe structure connecting the first liquid cooling plate The cold plate, the second liquid cold plate, the third liquid cold plate and the external cold source are used for inputting and outputting cooling liquid. In order to ensure the heat dissipation effect, avoid the temperature difference, and ensure the performance of the liquid-cooled virtual currency mining machine.

Description

Liquid-cooled virtual currency mining machine and liquid-cooled cooling device

technical field

The invention relates to the technical field of virtual mining equipment, in particular to a liquid-cooled virtual currency mining machine and a liquid-cooled heat dissipation device.

Background technique

The mining machine needs to perform high-density computing to obtain virtual currency. Therefore, the computing components on the mining machine will generate a lot of heat. If the heat cannot be discharged in time, the mining machine will run in a high temperature environment, which may cause the mining machine to stop. protection, the internal circuit is short-circuited, or even burns out important components.

As the difficulty of obtaining virtual currency continues to increase, the computing power required by the mining machine continues to increase, and the heat generation also continues to increase. At present, most virtual currency mining machines use traditional air-cooled heat dissipation systems for heat dissipation. However, air-cooled heat dissipation systems have the disadvantages of high noise, low heat dissipation efficiency, and high environmental requirements. The cold cooling system is also difficult to solve. In recent years, some new water-cooled heat dissipation technologies have gradually emerged. Compared with traditional air-cooled technologies, water-cooled technologies have inherent advantages such as low noise, low power consumption, and low environmental requirements. For electronic equipment with high power density layout, it is suitable to adopt the corresponding water cooling solution.

In the current water-cooled mining machine solution, the water-cooling board corresponding to each hash board is designed with a single process and a single flow direction, so the process of the cooling liquid flowing through the water-cooling board is short, and the temperature difference between the cooling liquid and the chip is large, and the cooling liquid The chip cannot be effectively dissipated, the heat dissipation efficiency of the chip is low, and there is a temperature difference between the chips, which affects the performance of the hash board, which in turn affects the normal use of the virtual currency mining machine.

SUMMARY OF THE INVENTION

Based on this, it is necessary to provide a liquid-cooled virtual currency mining machine and a liquid-cooled heat dissipation device that can ensure heat dissipation efficiency and temperature balance in order to solve the problem that the current chip heat dissipation efficiency is low and the temperature difference between the chips affects the performance of the hash board.

A liquid-cooled heat dissipation device is used to dissipate heat for electronic equipment, the electronic equipment includes a first electronic unit and a second electronic unit; the liquid-cooled heat dissipation device includes:

The liquid cooling structure includes a first liquid cooling plate, a second liquid cooling plate and a third liquid cooling plate, the second liquid cooling plate and the third liquid cooling plate are symmetrically arranged on two sides of the first liquid cooling plate. side, the first electronic unit is arranged between the first liquid cooling plate and the second liquid cooling plate, and the second electronic unit is arranged between the first liquid cooling plate and the third liquid cooling plate between the boards; and

The pipeline structure connects the first liquid cooling plate, the second liquid cooling plate, the third liquid cooling plate and the external cooling source, and is used for inputting and outputting cooling liquid.

In one of the embodiments, the first liquid cooling plate has a first accommodating cavity, the second liquid cooling plate has a second accommodating cavity, and the third liquid cooling plate has a third accommodating cavity;

The heat dissipation area of the first accommodating cavity is larger than that of the second accommodating cavity, and the heat dissipation area of the first accommodating cavity is larger than that of the third accommodating cavity.

In one embodiment, the first liquid cooling plate has a first cooling surface and a second cooling surface, the second liquid cooling plate has a third cooling surface, and the third liquid cooling plate has a fourth cooling surface ;

the first cooling surface and the third cooling surface are disposed opposite to each other and respectively abut the first electronic unit for cooling the first electronic unit;

The second cooling surface is disposed opposite to the fourth cooling surface and abuts against the second electronic unit respectively, and is used for cooling the second electronic unit.

In one of the embodiments, the surface of the second liquid cooling plate has a first fixing protrusion arranged protrudingly, the first fixing protrusion abuts the first electronic unit, and the second liquid cooling plate The surface of the board and the first electronic unit are surrounded by a first heat dissipation channel for the heat dissipation of the first electronic unit;

The surface of the third liquid cooling plate has a protruding second fixing protrusion, the second fixing protrusion is in contact with the second electronic unit, and the surface of the third liquid cooling plate is in contact with the second fixing protrusion. The two electronic units are surrounded by a second heat dissipation channel for heat dissipation of the second electronic unit.

In one of the embodiments, the electronic device further includes a power supply, the liquid cooling structure further includes a fourth liquid cooling plate connected to the piping structure, the fourth liquid cooling plate has a fifth cooling surface, the The fifth cooling surface is attached to the power supply for cooling the power supply.

In one embodiment, the first liquid cooling plate has a first liquid inlet and outlet and a second liquid inlet and outlet; the second liquid cooling plate has a third liquid inlet and a fourth liquid inlet and outlet; the first liquid inlet and outlet The three liquid cooling plate has a fifth liquid inlet and outlet and a sixth liquid inlet and outlet, and the fourth liquid cooling plate has a seventh liquid inlet and an eighth liquid inlet and outlet;

The pipeline structures are connected in series and/or in parallel with each liquid inlet and outlet.

In one of the embodiments, the fourth liquid cooling plate is connected in series or in parallel with the first liquid cooling plate, the second liquid cooling plate and the third liquid cooling plate.

In one embodiment, the first liquid cooling plate, the second liquid cooling plate and the third liquid cooling plate are connected in series or in parallel;

Alternatively, the first liquid cooling plate is connected in series with the second liquid cooling plate and the third liquid cooling plate respectively, and the second liquid cooling plate and the third liquid cooling plate are connected in parallel.

In one embodiment, the flow direction of the cooling liquid in the first liquid cooling plate is the same as the flow direction of the second liquid cooling plate and the third liquid cooling plate;

Or, the flow direction of the cooling liquid in the first liquid cooling plate is opposite to the flow direction of the second liquid cooling plate and the third liquid cooling plate;

Or, the flow direction of the cooling liquid in the first liquid cooling plate is the same as the flow direction of one of the second liquid cooling plate and the third liquid cooling plate, and the second liquid cooling plate is the same as the flow direction of the third liquid cooling plate. The flow direction of the other of the third liquid cooling plates is opposite.

In one of the embodiments, the pipeline structure includes an inlet joint, an outlet joint, a liquid cooling pipeline group, a first sub-collector and a second sub-collector;

The liquid cooling pipeline group may connect the first liquid cooling plate, the second liquid cooling plate, the third liquid cooling plate and the second liquid cooling plate through the first sub-collector and the second sub-collector The fourth liquid cold plate;

The liquid cooling pipe group is also connected to the external cold source through the inlet joint and the outlet joint.

In one embodiment, the inlet joint is connected to the seventh liquid inlet and outlet of the fourth liquid cooling plate, and the eighth liquid inlet and outlet of the fourth liquid cooling plate is connected to the first liquid cooling plate. The first liquid inlet and outlet and the second liquid inlet and outlet of the first liquid cooling plate are respectively connected to the fourth liquid inlet and outlet of the second liquid cooling plate and the first liquid collector through the first manifold. The sixth liquid inlet and outlet of the three liquid cooling plates, the third liquid inlet and outlet of the second liquid cooling plate and the fifth liquid inlet and outlet of the third liquid cooling plate are connected through the second manifold. the outlet connector.

A liquid-cooled virtual currency mining machine, comprising electronic equipment and a liquid-cooled heat sink according to any of the above technical features;

The electronic device includes a first electronic unit, a second electronic unit and a power supply, and the liquid cooling device cools the first electronic unit, the second electronic unit and the power supply.

In one of the embodiments, the liquid-cooled virtual currency mining machine further includes a connection component, and the connection component respectively connects the first electronic unit and the second electronic unit to the power supply.

In one embodiment, the connection assembly includes a copper bar and a connection cable, and the first electronic unit is connected to the power supply through the copper bar and the connection cable.

In one embodiment, the connection component includes a positive copper bar, a negative copper bar, a positive cable and a negative cable; the positive electrode of the first electronic unit is provided with the positive copper bar, and the negative electrode of the first electronic unit is provided with the positive copper bar the negative electrode copper bar; the positive electrode copper bar has a positive electrode fixing hole connected with the positive electrode cable, and the positive electrode fixing hole is located in the inner position of the positive electrode copper bar; the negative electrode copper bar has a positive electrode fixing hole connected to the negative electrode A negative electrode fixing hole connected to the cable, the negative electrode fixing hole is located outside the negative electrode copper row;

The length of the positive cable is greater than the length of the negative cable.

After adopting the above-mentioned technical scheme, the present invention at least has the following technical effects:

In the liquid-cooled virtual currency mining machine and the liquid-cooled heat dissipation device of the present invention, the first liquid-cooling plate, the second liquid-cooling plate and the third liquid-cooling plate of the liquid-cooling structure are connected by a pipe structure, and the first liquid-cooling plate is A first electronic unit and a second electronic unit are respectively arranged on both sides, and a second liquid cooling plate and a third liquid cooling plate are also arranged outside the first electronic unit and the second electronic unit. The pipeline assembly transports the cooling liquid of the external cooling source to the first liquid cooling plate, the second liquid cooling plate and the third liquid cooling plate, and the first liquid cooling plate, the second liquid cooling plate and the third liquid cooling plate are connected to the first liquid cooling plate. An electronic unit and a second electronic unit are cooled, and the pipe assembly transports the cooled cooling liquid to an external cooling source. Effectively solve the problem that the current chip heat dissipation efficiency is low and the temperature difference between the chips affects the performance of the hash board, improve the cooling efficiency of the first electronic unit and the second electronic unit, ensure the heat dissipation effect, and make the first electronic unit and the second electronic unit. The temperature between them is balanced to avoid temperature differences and ensure the performance of the liquid-cooled virtual currency mining machine.

Description of drawings

1 is a perspective view of a liquid-cooled heat dissipation device disassembling a chassis cover according to an embodiment of the present invention;

FIG. 2 is a top view of the liquid cooling device shown in FIG. 1 with the chassis cover removed;

3 is an exploded schematic view of the liquid cooling structure clamping the first electronic unit and the second electronic unit in the liquid cooling heat dissipation device shown in FIG. 1;

FIG. 4 is a perspective view of an embodiment of the liquid-cooled heat sink shown in FIG. 1 with the case shell removed;

FIG. 5 is a perspective view of another embodiment of the liquid-cooled heat dissipation device shown in FIG. 4 with the case shell removed;

FIG. 6 is a perspective view of the liquid-cooled heat sink shown in FIG. 4 with the case shell removed from another angle.

in:

10. Liquid-cooled virtual currency mining machine; 100. Liquid-cooled heat sink; 110. Liquid-cooled structure; 111. The first liquid-cooling plate; A1, the first liquid inlet and outlet; A2, the second liquid inlet and outlet; 112, the first Second liquid cold plate; A3, third liquid inlet and outlet; A4, fourth liquid inlet and outlet; 113, third liquid cooling plate; A5, fifth liquid inlet and outlet; A6, sixth liquid inlet and outlet; 114, fourth liquid Cold plate; A7, seventh liquid inlet and outlet; A8, eighth liquid inlet and outlet; 120, pipeline structure; 121, liquid cooling pipeline group; 122, first sub-collector; 123, second sub-collector; 124, inlet Connector; 125, outlet connector; 200, electronic equipment; 210, first electronic unit; 211, positive electrode; 212, negative electrode; 220, second electronic unit; 230, power supply; 231, input terminal; 240, connection assembly; 241 , Positive copper bar; 2411, Positive fixing hole; 242, Positive cable; 243, Negative copper bar; 2441, Negative fixing hole; 244, Negative cable; 400, Chassis shell; 410, Bearing shell; 420, No. One side panel; 430, the second side panel; 440, the chassis cover.

Detailed ways

In order to make the above objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " Back, Left, Right, Vertical, Horizontal, Top, Bottom, Inner, Outer, Clockwise, Counterclockwise, Axial , "radial", "circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the indicated device or Elements must have a particular orientation, be constructed and operate in a particular orientation and are therefore not to be construed as limitations of the invention.

In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined.

In the present invention, unless otherwise expressly specified and limited, the terms "installed", "connected", "connected", "fixed" and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection , or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between the two elements, unless otherwise specified limit. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

In the present invention, unless otherwise expressly specified and limited, a first feature "on" or "under" a second feature may be in direct contact between the first and second features, or the first and second features indirectly through an intermediary touch. Also, the first feature being "above", "over" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or an intervening element may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for the purpose of illustration only and do not represent the only embodiment.

Referring to FIG. 1 to FIG. 5 , the present invention provides a liquid-cooled heat dissipation device 100 . The liquid-cooled heat sink 100 is used in the liquid-cooled virtual currency mining machine 10 to cool the electronic equipment 200 of the liquid-cooled virtual currency mining machine 10 to ensure the performance of the liquid-cooled virtual currency mining machine 10 . It can be understood that the liquid-cooled virtual currency mining machine 10 here can also be other types of data processing equipment and the like. Of course, in other embodiments of the present invention, the liquid-cooled heat dissipation device 100 can also be applied to other electrical equipment that needs to be cooled. In the present invention, only the application of the liquid-cooled heat dissipation device 100 to the liquid-cooled virtual currency mining machine 10 is taken as an example for description.

At present, the cooling device in the liquid-cooled virtual currency mining machine 10 usually uses a water-cooled radiator. The water-cooled plate corresponding to each hash board is designed with a single process and a single flow direction. The cooling liquid cannot effectively dissipate heat to the chip. The heat dissipation efficiency is low and there is a temperature difference between the chips, which affects the performance of the hash board, which in turn affects the normal use of the virtual currency mining machine. To this end, the present invention provides a new type of liquid-cooled heat dissipation device 100, which can ensure the heat dissipation efficiency of the electronic device 200, make the temperature of the electronic device 200 balanced, and ensure the use of the liquid-cooled virtual currency mining machine 10. performance. The specific structure of the liquid-cooled heat dissipation device 100 will be described in detail below.

Referring to FIGS. 1 to 5 , in one embodiment, the liquid-cooled heat dissipation device 100 is used to dissipate heat to the electronic device 200 , and the electronic device 200 includes a first electronic unit 210 and a second electronic unit 220 ; the liquid-cooled heat dissipation device 100 includes a liquid-cooled heat dissipation device 100 . Cold structure 110 and duct structure 120 . The liquid cooling structure 110 includes a first liquid cooling plate 111 , a second liquid cooling plate 112 and a third liquid cooling plate 113 . The second liquid cooling plate 112 and the third liquid cooling plate 113 are symmetrically arranged on two sides of the first liquid cooling plate 111 . On the other hand, the first electronic unit 210 is disposed between the first liquid cooling plate 111 and the second liquid cooling plate 112 , and the second electronic unit 220 is disposed between the first liquid cooling plate 111 and the third liquid cooling plate 113 . The pipeline structure 120 connects the first liquid cooling plate 111 , the second liquid cooling plate 112 , the third liquid cooling plate 113 and the external cooling source, and is used for inputting and outputting cooling liquid.

The first liquid cooling plate 111 is the main cooling structure of the liquid cooling heat dissipation device 100 . The first liquid cooling plate 111 has a first accommodating cavity for accommodating the cooling liquid, and the cooling liquid flows in the first accommodating cavity. Optionally, the first accommodating cavity of the first liquid cooling plate 111 may be a multi-flow channel in series and parallel, such as an S-shape, etc., or a complete cavity, or other structures capable of flowing cooling liquid. After the cooling liquid enters the first accommodating cavity of the first liquid cooling plate 111 , the cooling liquid will exchange heat with the electronic device 200 through the first liquid cooling plate 111 , so as to exchange heat between the first electronic unit 210 and the second electronic unit of the electronic device 200 . 220 for cooling.

The first liquid cooling plate 111 has a structure for dissipating heat on both sides, and the first electronic unit 210 and the second electronic unit 220 are respectively attached to both sides of the first liquid cooling plate 111 . The cooling liquid in the first accommodating cavity will conduct heat exchange with the first electronic unit 210 through one surface, thereby reducing the temperature of the first electronic unit 210, and at the same time, it will also conduct heat exchange with the second electronic unit 220 through the other surface, reducing the temperature of the first electronic unit 210. The temperature of the second electronic unit 220 . Optionally, the two sides of the first liquid cooling plate 111 are arranged symmetrically; of course, in other embodiments of the present invention, the structures of the two sides of the first liquid cooling plate 111 may also be different, as long as the heat dissipation effect is ensured.

In this embodiment, the first electronic unit 210 and the second electronic unit 220 of the electronic device 200 can be, for example, the computing power board of a virtual currency mining machine, or, according to actual needs, the first electronic unit 210 and the second electronic unit 220 The electronic unit 220 may also be other heating devices that require liquid cooling to dissipate heat.

It can be understood that the first electronic unit 210 and the second electronic unit 220 both include a substrate and a heating element located on one side of the substrate. For example, the substrate is an aluminum substrate, and the heating element is arranged on one side of the aluminum substrate. Due to packaging, patch and other reasons, the thermal resistance of the heating element in the upper and lower directions is different in most cases. 80% to 90% of the heat generated when the first electronic unit 210 and the second electronic unit 220 work is concentrated on the aluminum substrate. Therefore, the surface of the aluminum substrate of the first electronic unit 210 abuts one surface of the first liquid cooling plate 111 , and the surface of the aluminum substrate of the second electronic unit 220 abuts the other surface of the first liquid cooling plate 111 . In this way, the heat of the first electronic unit 210 and the second electronic unit 220 can be transferred to the first liquid cooling plate 111 through the aluminum substrate to ensure the cooling effect of the first electronic unit 210 and the second electronic unit 220 .

The surfaces of the first electronic unit 210 and the second electronic unit 220 facing away from the first liquid cooling plate 111 also generate corresponding heat. In order to ensure the heat dissipation performance of the electronic device 200 , the liquid-cooled heat dissipation device 100 of the present invention is further provided with a second liquid-cooling plate 112 and a third liquid-cooling plate 113 on both sides of the first liquid-cooling plate 111 , and the second liquid-cooling plate 112 is provided with On the surface of the first electronic unit 210 facing away from the first liquid cooling plate 111, the second liquid cooling plate 112 dissipates heat from the heating elements of the first electronic unit 210, and the third liquid cooling plate 113 is disposed on the second electronic unit 220 facing away from the first liquid cooling plate 113. On the other surface of the liquid cooling plate 111 , the third liquid cooling plate 113 dissipates heat from the heating elements of the second electronic unit 220 . That is to say, the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 form a sandwich structure with the first electronic unit 210 and the second electronic unit 220 , and the first liquid cooling plate 111 is located in the most middle position , the second liquid cooling plate 112 and the third liquid cooling plate 113 are symmetrically arranged on both sides of the first liquid cooling plate 111 , and the first electronic unit 210 is arranged between the first liquid cooling plate 111 and the second liquid cooling plate 112 , the second electronic unit 220 is disposed between the first liquid cooling plate 111 and the third liquid cooling plate 113 .

In this way, the aluminum substrate of the first electronic unit 210 is in contact with one surface of the first liquid cooling plate 111 , the heating element of the first electronic unit 210 is in contact with the second liquid cooling plate 112 , and the first liquid cooling plate 111 and the second liquid cooling plate 112 are in contact with each other. The combination of the two liquid cold plates 112 can cool both surfaces of the first electronic unit 210 . The aluminum substrate of the second electronic unit 220 is in contact with the other surface of the first liquid cooling plate 111 , and the heating element of the second electronic unit 220 is in contact with the third liquid cooling plate 113 . The combination of the liquid cooling plates 113 cools both surfaces of the second electronic unit 220 .

Of course, in other embodiments of the present invention, the aluminum substrate of the first electronic unit 210 may be in contact with the second liquid cooling plate 112, and the heating element of the first electronic unit 210 may be in contact with a surface of the first liquid cooling plate 111. Abutting; the aluminum substrate of the second electronic unit 220 is in contact with the third liquid cooling plate 113 , and the heating element of the second electronic unit 220 is in contact with the other surface of the first liquid cooling plate 111 . In this way, cooling of the first electronic unit 210 and the second electronic unit 220 can also be achieved.

The second liquid cooling plate 112 and the third liquid cooling plate 113 are cooling structures assisted by the liquid cooling heat dissipation device 100 . When the heat dissipation requirement is high, the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 are used in combination. When the heat dissipation requirement is not high, only the first liquid cooling plate 111 may be retained, and the second liquid cooling plate 112 and the third liquid cooling plate 113 may be omitted. In this way, the production cost can be reduced while ensuring the heat dissipation requirement.

The second liquid cooling plate 112 has a second accommodating cavity in which the cooling liquid flows. Optionally, the second accommodating cavity of the second liquid-cooling plate 112 may be multi-channel in series and parallel, such as an S-shape, etc., or may be a complete cavity, or may be other structures capable of flowing cooling liquid. After the cooling liquid enters the second accommodating cavity of the second liquid cooling plate 112 , the cooling liquid exchanges heat with the electronic device 200 through the second liquid cooling plate 112 to cool the first electronic unit 210 of the electronic device 200 .

The third liquid cooling plate 113 has a third accommodating cavity in which the cooling liquid flows. Optionally, the third accommodating cavity of the third liquid-cooling plate 113 may be multi-channel in series and parallel, such as S-shape, etc., may also be a complete cavity, and may also be other structures capable of flowing cooling liquid. After the cooling liquid enters the third accommodating cavity of the third liquid cooling plate 113 , the cooling liquid exchanges heat with the electronic device 200 through the third liquid cooling plate 113 to cool the second electronic unit 220 of the electronic device 200 .

In one embodiment, when the liquid cooling device 100 of the present invention is assembled, the aluminum substrates of the first electronic unit 210 and the second electronic unit 220 are attached to both surfaces of the first liquid cooling plate 111 . The heat of the heating element during operation can be transferred to the first liquid cooling plate 111 through the aluminum substrate to realize liquid cooling and heat dissipation. Moreover, the second liquid-cooling plate 112 can be in contact with the heating element of the first electronic unit 210, and the heat on the side of the heating element can be transferred to the second liquid-cooling plate 112 to ensure the protection of the first electronic unit 210. Cooling effect to achieve liquid cooling heat dissipation. The third liquid cooling plate 113 can be in contact with the heating element of the second electronic unit 220 , and the heat from the heating element side can be transferred to the third liquid cooling plate 113 to ensure the cooling effect on the second electronic unit 220 , to achieve liquid cooling.

The pipe structure 120 connects the first liquid cooling plate 111 , the second liquid cooling plate 112 , the third liquid cooling plate 113 and the external cooling source. The external cold source has a liquid inlet end and a liquid outlet end, and the pipeline structure 120 is connected to the liquid inlet end and the liquid outlet end. The cooling liquid of the external cooling source is transported to the pipeline structure 120 through the liquid outlet end, and is respectively transported to the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 through the pipeline structure 120 . The cooling liquid after cooling the first electronic unit 210 and the second electronic unit 220 by the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 is returned to the pipeline structure 120 and returned to the liquid inlet end. to an external cooling source. The external cooling source can cool the recovered cooling liquid, and then deliver the cooling liquid to the pipeline structure 120 . In this way, the circulation of the cooling liquid is realized and the cooling cost is reduced. Optionally, the cooling liquid of the external cooling source may be cooling water, cooling oil or liquid helium, or the like.

In the liquid-cooled heat dissipation device 100 of the above-mentioned embodiment, the pipeline assembly transports the cooling liquid from the external cooling source to the first liquid-cooling plate 111 , the second liquid-cooling plate 112 and the third liquid-cooling plate 113 , and passes through the first liquid-cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 to cool the first electronic unit 210 and the second electronic unit 220 , and the pipe assembly transports the cooled cooling liquid to an external cooling source. Effectively solve the problem that the current chip heat dissipation efficiency is low and the temperature difference between the chips affects the performance of the hash board, improve the cooling efficiency of the first electronic unit 210 and the second electronic unit 220, and ensure the heat dissipation effect, so that the first electronic unit 210 and the second electronic unit 220. The temperature between the two electronic units 220 is balanced to avoid temperature difference and ensure the use performance of the liquid-cooled virtual currency mining machine 10 .

In one embodiment, the first liquid cooling plate 111 has a first cooling surface and a second cooling surface, the second liquid cooling plate 112 has a third cooling surface, and the third liquid cooling plate 113 has a fourth cooling surface. The first cooling surface and the third cooling surface are disposed opposite to each other and respectively abut against the first electronic unit 210 for cooling the first electronic unit 210 . The second cooling surface and the fourth cooling surface are disposed opposite to each other and respectively abut against the second electronic unit 220 for cooling the second electronic unit 220 .

The first liquid cooling plate 111 has two cooling surfaces, which are a first cooling surface and a second cooling surface, respectively. A surface of the first electronic unit 210 is attached to the first cooling surface, and a surface of the second electronic unit 220 is attached to the second cooling surface. Specifically, in one embodiment, the surface of the aluminum substrate of the first electronic unit 210 is in contact with the first cooling surface of the first liquid cooling plate 111 , and the surface of the aluminum substrate of the second electronic unit 220 is in contact with the first cooling surface of the liquid cooling plate 111 . The second cooling surface of 111 abuts. The cooling liquid in the first accommodating cavity will conduct heat exchange with the first electronic unit 210 through the first cooling surface, thereby reducing the temperature of the first electronic unit 210; The temperature of the second electronic unit 220 . In this way, the heat of the first electronic unit 210 and the second electronic unit 220 can be transferred to the first liquid cooling plate 111 through the aluminum substrate to ensure the cooling effect of the first electronic unit 210 and the second electronic unit 220 .

The second liquid cooling plate 112 has one cooling surface, which is the third cooling surface. The third cooling surface faces the surface of the first electronic unit 210 that faces away from the first liquid cooling plate 111 . That is, the third cooling surface is in contact with the heating element of the first electronic unit 210 for cooling the heating element of the first electronic unit 210 . The cooling liquid in the second accommodating cavity will exchange heat with the first electronic unit 210 through the third cooling surface, thereby reducing the temperature of the first electronic unit 210 .

The third liquid cooling plate 113 has one cooling surface, which is the fourth cooling surface. The fourth cooling surface faces the other surface of the second electronic unit 220 that faces away from the first liquid cooling plate 111 . That is, the fourth cooling surface is in contact with the heating element of the second electronic unit 220 for cooling the heating element of the second electronic unit 220 . The cooling liquid in the third accommodating cavity will exchange heat with the second electronic unit 220 through the fourth cooling surface, thereby reducing the temperature of the second electronic unit 220 .

The first cooling surface and the third cooling surface are disposed opposite to each other. In one embodiment, the first cooling surface is attached to the aluminum substrate of the first electronic unit 210 , and the third cooling surface is in contact with the heating element of the first electronic unit 210 . This achieves cooling of the first electronic unit 210 and ensures the heat dissipation effect of the first electronic unit 210 . The second cooling surface is disposed opposite to the fourth cooling surface. In one embodiment, the second cooling surface is attached to the aluminum substrate of the second electronic unit 220 , and the fourth cooling surface is in contact with the heating element of the second electronic unit 220 . This achieves cooling of the second electronic unit 220 and ensures the cooling effect of the second electronic unit 220 .

In one embodiment, the cooling capacity of the first liquid cooling plate 111 is greater than the cooling capacity of the second liquid cooling plate 112 and the third liquid cooling plate 113 . Due to the structural limitations of the first electronic unit 210 and the second electronic unit 220 , the heat dissipation of the aluminum substrate toward the first liquid cooling plate 111 is relatively large, and the heat dissipation of the heating elements toward the second liquid cooling plate 112 and the third liquid cooling plate 113 is relatively large. Heat dissipation is small. In order to ensure the heat dissipation effect, the cooling capacity of the first liquid cold plate 111 is improved to improve the heat dissipation capacity of the first liquid cold plate 111 to the aluminum substrate. Correspondingly, the cooling capacity of the second liquid cold plate 112 and the third liquid cold plate 113 The capacity can be appropriately reduced, as long as it is ensured that the heat dissipation element can be dissipated. In this way, the heat dissipation effect of the first electronic unit 210 and the second electronic unit 220 can be ensured, and the complexity of the structure and the cost can also be reduced.

In one embodiment, the first liquid cooling plate 111 has a first accommodating cavity, the second liquid cooling plate 112 has a second accommodating cavity, and the third liquid cooling plate 113 has a third accommodating cavity. The heat dissipation area of the first accommodating cavity is larger than that of the second accommodating cavity, and the heat dissipation area of the first accommodating cavity is larger than that of the third accommodating cavity. It can be understood that the heat dissipation area here refers to the area that can be effectively cooled. That is to say, the flow channel area inside the first liquid cooling plate 111 is larger than the flow channel area inside the second liquid cooling plate 112 and the third liquid cooling plate 113 . The flow channel area inside the first liquid cooling plate 111 may be larger, and the flow channel area inside the second liquid cooling plate 112 and the third liquid cooling plate 113 may be smaller. In this way, the manufacturing cost can be reduced while ensuring the heat dissipation effect.

Further, heat dissipation protrusions or heat dissipation fins may be provided in the first accommodating cavity, and the heat dissipation capability of the first liquid cooling plate 111 can be increased through the heat dissipation protrusions or heat dissipation fins, thereby improving the cooling effect of the first liquid cooling plate 111 .

In one embodiment, the surface of the second liquid cooling plate 112 has a protruding first fixing protrusion, the first fixing protrusion is in contact with the first electronic unit 210 , and the surface of the second liquid cooling plate 112 is in contact with the first The electronic unit 210 is surrounded by a first heat dissipation channel for the first electronic unit 210 to dissipate heat. That is to say, the third cooling surface has a protruding first fixing protrusion, and the first fixing protrusion is in contact with the heating element of the first electronic unit 210 to realize the fixing and heat dissipation of the first electronic unit 210 . The heat generated by the heating element of the first electronic unit 210 is transferred to the second liquid cooling plate 112 through the first fixing protrusion for cooling. Moreover, a first heat dissipation channel is formed between the third cooling surface of the second liquid cooling plate 112 and the base plate of the first electronic unit 210, and the heat dissipated when the first electronic unit 210 works exists in the first heat dissipation channel. The second liquid cold plate 112 can exchange heat with the heat in the first heat dissipation channel through the third cooling surface, so as to cool the first electronic unit 210 .

Optionally, the first fixing protrusion is a protruding structure such as a boss or a boss. That is to say, the third cooling surface of the second liquid cooling plate 112 is a flat surface, and the first fixing protrusions protrude from the third cooling surface. Moreover, the third cooling surface is concave relative to the first fixing protrusion, so that devices with a higher height can be arranged on the substrate of the first electronic unit 210, and sufficient installation space can be ensured.

In one embodiment, the surface of the third liquid-cooling plate 113 has a second fixing protrusion arranged protrudingly, the second fixing protrusion is in contact with the second electronic unit 220 , and the surface of the third liquid-cooling plate 113 is connected to the second fixing protrusion. The electronic unit 220 is surrounded by a second heat dissipation channel for heat dissipation of the second electronic unit 220 . That is to say, the fourth cooling surface has a protruding second fixing protrusion, and the second fixing protrusion is in contact with the heating element of the second electronic unit 220 to realize the fixing and heat dissipation of the second electronic unit 220 . The heat generated by the heating element of the second electronic unit 220 is transferred to the third liquid cooling plate 113 through the second fixing protrusion for cooling. Moreover, a second heat dissipation channel is formed between the fourth cooling surface of the third liquid cooling plate 113 and the base plate of the second electronic unit 220, and the heat dissipated when the second electronic unit 220 works exists in the second heat dissipation channel. The three-liquid cold plate 113 can exchange heat with the heat in the second heat dissipation channel through the fourth cooling surface, so as to cool the second electronic unit 220 .

Optionally, the second fixing protrusion is a protruding structure such as a boss or a boss. That is to say, the fourth cooling surface of the third liquid cooling plate 113 is a flat surface, and the second fixing protrusions are disposed protruding from the fourth cooling surface. Moreover, the fourth cooling surface is concave relative to the second fixing protrusion, so that devices with a higher height can be arranged on the substrate of the second electronic unit 220, and sufficient installation space can be ensured.

In one embodiment, the electronic device 200 further includes a power supply 230, the liquid cooling structure 110 further includes a fourth liquid cooling plate 114 connected to the pipe structure 120, the fourth liquid cooling plate 114 has a fifth cooling surface, and the fifth cooling surface is The power supply 230 is attached for cooling the power supply 230 . The power supply 230 supplies power to the first electronic unit 210 and the second electronic unit 220 to ensure that the first electronic device 200 and the second electronic device 200 can work normally. Meanwhile, the power supply 230 has an input terminal 231 for connecting to an external power source.

Optionally, the power supply 230 is arranged side by side with the stacked first electronic unit 210 and the second electronic unit 220 . The fourth liquid cooling plate 114 covers the surface of the power supply 230 and is in contact with the power supply 230 . The power supply 230 generates heat during operation, and the fourth liquid cooling plate 114 can dissipate and cool the power supply 230 to ensure the reliability of the operation of the power supply 230 .

The fourth liquid cooling plate 114 has a fourth accommodating cavity in which the cooling liquid flows. Optionally, the fourth accommodating cavity of the fourth liquid cooling plate 114 may be a channel with multiple channels in series and parallel, such as an S-shape, etc., or may be a complete cavity, or may be other structures capable of flowing cooling liquid. After the cooling liquid enters the fourth accommodating cavity of the fourth liquid cooling plate 114 , the cooling liquid exchanges heat with the electronic device 200 through the fourth liquid cooling plate 114 to cool the power supply 230 of the electronic device 200 . The fourth liquid cooling plate 114 has one cooling surface, which is the fifth cooling surface. The fifth cooling surface is positioned towards the power supply 230 . That is, the fifth cooling surface is in contact with the surface of the power supply source 230 . The cooling liquid in the fourth accommodating cavity will exchange heat with the power supply 230 through the fifth cooling surface, thereby reducing the temperature of the power supply 230 .

In one embodiment, the first liquid cooling plate 111 has a first liquid inlet and outlet A1 and a second liquid inlet and outlet A2; the second liquid cooling plate 112 has a third liquid inlet and outlet A3 and a fourth liquid inlet and outlet A4; The liquid cooling plate 113 has a fifth liquid inlet and outlet A5 and a sixth liquid inlet and outlet A6, and the fourth liquid cooling plate 114 has a seventh liquid inlet and outlet A7 and an eighth liquid inlet and outlet A8. The pipeline structure 120 connects each liquid inlet and outlet in series and/or in parallel.

The first liquid cooling plate 111 has a first liquid inlet and outlet port A1 and a second liquid inlet and outlet port A2 that communicate with the first accommodating cavity. The first liquid inlet and outlet A1 and the second liquid inlet and outlet A2 are the liquid inlet and the liquid outlet of the first liquid cooling plate 111 . When the first liquid inlet and outlet A1 is the liquid inlet, the second liquid inlet and outlet A2 is the liquid outlet. When the first liquid inlet and outlet A1 is the liquid outlet, the second liquid inlet and outlet A2 is the liquid inlet. The second liquid cooling plate 112 has a third liquid inlet and outlet port A3 and a fourth liquid inlet and outlet port A4 that communicate with the second accommodating cavity. The third liquid inlet and outlet A3 and the fourth liquid inlet and outlet A4 are the liquid inlet and the liquid outlet of the second liquid cooling plate 112 . When the third liquid inlet and outlet A3 is the liquid inlet, the fourth liquid inlet and outlet A4 is the liquid outlet. When the third liquid inlet and outlet A3 is the liquid outlet, the fourth liquid inlet and outlet A4 is the liquid inlet.

The third liquid cooling plate 113 has a fifth liquid inlet and outlet port A5 and a sixth liquid inlet and outlet port A6 that communicate with the third accommodating cavity. The fifth liquid inlet and outlet A5 and the sixth liquid inlet and outlet A6 are the liquid inlet and the liquid outlet of the third liquid cooling plate 113 . When the fifth liquid inlet and outlet A5 is the liquid inlet, the sixth liquid inlet and outlet A6 is the liquid outlet. When the fifth liquid inlet and outlet A5 is the liquid outlet, the sixth liquid inlet and outlet A6 is the liquid inlet. The fourth liquid cooling plate 114 has a seventh liquid inlet and outlet port A7 and an eighth liquid inlet and outlet port A8 that communicate with the fourth accommodating cavity. The seventh liquid inlet and outlet A7 and the eighth liquid inlet and outlet A8 are the liquid inlet and the liquid outlet of the fourth liquid cooling plate 114 . When the seventh liquid inlet and outlet A7 is the liquid inlet, the eighth liquid inlet and outlet A8 is the liquid outlet. When the seventh liquid inlet and outlet A7 is the liquid outlet, the eighth liquid inlet and outlet A8 is the liquid inlet.

The input and output of cooling liquid are realized by connecting the liquid inlet and outlet of each liquid cooling plate through the pipeline structure 120 . In principle, the connection manner between the various liquid cooling plates is not limited in principle, as long as the electronic device 200 can be cooled. Optionally, the two liquid inlet and outlet ports of each liquid cooling plate can be independently connected to the external cooling source. In this case, the first liquid cooling plate 111 , the second liquid cooling plate 112 , the third liquid cooling plate 113 and the fourth The liquid cooling plates 114 are connected in parallel. At this time, the external cooling source delivers the cooling liquid to each liquid cooling plate respectively. Of course, the first liquid cooling plate 111 , the second liquid cooling plate 112 , the third liquid cooling plate 113 and the fourth liquid cooling plate 114 can also be connected in series through the pipeline structure 120 , and the cooling liquid delivered by the external cooling source flows to each in the liquid cooling plate. In other embodiments of the present invention, one or more of the liquid cooling plates may be connected in series, and the remaining liquid cooling plates may be connected in parallel.

In one embodiment, the first liquid inlet and outlet A1 and the second liquid inlet and outlet A2 can be arranged on the same side or different sides. The third liquid inlet and outlet A3 and the fourth liquid inlet and outlet A4 can be arranged on the same side or different sides. The fifth liquid inlet and outlet A5 and the sixth liquid inlet and outlet A6 can be arranged on the same side or different sides. The seventh liquid inlet and outlet A7 and the eighth liquid inlet and outlet A8 can be arranged on the same side or different sides.

It is worth noting that the arrangement positions of the first liquid inlet and outlet A1 and the second liquid inlet and outlet A2 are not limited in principle, and may be arranged on the same side or on different sides. Exemplarily, the first liquid inlet and outlet A1 and the second liquid inlet and outlet A2 may be arranged on both sides of the first liquid cooling plate 111 respectively; of course, the first liquid inlet and outlet A1 and the second liquid inlet and outlet A2 may also be arranged at The same side of the first liquid cooling plate 111 as shown in FIG. 3 .

The arrangement positions of the third liquid inlet and outlet A3 and the fourth liquid inlet and outlet A4 are not limited in principle, and can be arranged on the same side or on different sides. Exemplarily, the third liquid inlet and outlet A3 and the fourth liquid inlet and outlet A4 may be respectively disposed on both sides of the second liquid cooling plate 112; of course, the third liquid inlet and outlet A3 and the fourth liquid inlet and outlet A4 may also be disposed at The same side of the second liquid cooling plate 112 as shown in FIG. 3 .

The arrangement positions of the fifth liquid inlet and outlet A5 and the sixth liquid inlet and outlet A6 are not limited in principle, and may be arranged on the same side or on different sides. Exemplarily, the fifth liquid inlet and outlet A5 and the sixth liquid inlet and outlet A6 may be respectively disposed on both sides of the third liquid cooling plate 113; of course, the fifth liquid inlet and outlet A5 and the sixth liquid inlet and outlet A6 may also be disposed at The same side of the third liquid cooling plate 113 as shown in FIG. 3 .

The arrangement positions of the seventh liquid inlet and outlet A7 and the eighth liquid inlet and outlet A8 are not limited in principle, and may be arranged on the same side or on different sides. Exemplarily, the seventh liquid inlet and outlet A7 and the eighth liquid inlet and outlet A8 may be respectively disposed on both sides of the fourth liquid cooling plate 114; of course, the seventh liquid inlet and outlet A7 and the eighth liquid inlet and outlet A8 may also be disposed at The same side of the fourth liquid cooling plate 114 as shown in FIG. 4 .

Referring to FIGS. 1 to 5 , in one embodiment, the fourth liquid cooling plate 114 is connected in series or in parallel with the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 . That is to say, the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 are a whole, and the fourth liquid cooling plate 114 can be connected in parallel or in series.

Optionally, the pipeline structure 120 connects the fourth liquid cooling plate 114 with the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 in series. That is, the cooling liquid may enter the fourth liquid cooling plate 114 first, and then enter the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 . Because the power supply 230 has low heat generation and poor heat resistance, it can be used as the inlet of the cooling liquid to participate in heat exchange first, and then be connected in series with the first liquid cooling plate 111, the second liquid cooling plate 112 and the third liquid cooling plate 113, Deliver coolant. In this way, the temperature rise of the cooling liquid after cooling the power supply 230 will not be too high, and the heat dissipation requirements of the first electronic unit 210 and the second electronic unit 220 can still be guaranteed. In other embodiments, the cooling liquid may also enter the fourth liquid cooling plate 114 last.

Of course, in other embodiments of the present invention, the pipeline structure 120 connects the fourth liquid cooling plate 114 with the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 in parallel. That is, the cooling liquid flows into the whole composed of the first liquid cooling plate 111 , the second liquid cooling plate 112 , and the third liquid cooling plate 113 and the fourth liquid cooling plate 114 through the pipe structure 120 , respectively.

In one embodiment, the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 are connected in series or in parallel; or, the first liquid cooling plate 111 is connected in series with the second liquid cooling plate 112 and the third liquid cooling plate 112 respectively The liquid cooling plate 113, and the second liquid cooling plate 112 and the third liquid cooling plate 113 are connected in parallel. In this embodiment, the fourth liquid cooling plate 114 and the first liquid cooling plate 111 , the second liquid cooling plate 112 , and the third liquid cooling plate 113 which are integrally formed in series are used as an example for description.

Optionally, the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 are connected in parallel. At this time, the cooling liquid output by the fourth liquid cooling plate 114 is sent to the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 respectively, so as to cool the first electronic unit 210 and the second electronic unit 220 for cooling.

Optionally, the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 may be connected in series. At this time, the cooling liquid enters the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 in sequence to cool the first electronic unit 210 and the second electronic unit 220 . Moreover, the sequence of the series connection of the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 can be adjusted, which will not be repeated here.

Optionally, the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 may be connected in series and parallel. That is to say, the first liquid cooling plate 111 may be connected in series with the second liquid cooling plate 112 and the third liquid cooling plate 113 respectively, and the second liquid cooling plate 112 and the third liquid cooling plate 113 may be connected in parallel. The cooling liquid in the first liquid cooling plate 111 flows into the second liquid cooling plate 112 and the third liquid cooling plate 113 respectively to cool the first electronic unit 210 and the second electronic unit 220 . Of course, the cooling liquid in the second liquid cooling plate 112 and the third liquid cooling plate 113 may also flow into the first liquid cooling plate 111 .

It can be understood that one of the two liquid inlet and outlet ports of the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 is a liquid inlet port and the other is a liquid outlet port, and each liquid inlet and outlet port can be flexible. Switching, as long as it can realize the input and output of cooling liquid for each liquid cooling plate.

The first electronic unit 210 and the second electronic unit 220 are combined in series and in parallel through the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 , so that the cooling liquid flows between the first electronic unit 210 and the second The reciprocating flow between the electronic units 220 improves the heat dissipation efficiency of the first electronic unit 210 and the second electronic unit 220, and reduces the temperature difference between the cooling liquid and the maximum temperature of the first electronic unit 210 or the second electronic unit 220, thereby Increase the coolant temperature to meet the requirements of waste heat recovery.

In one embodiment, the flow direction of the cooling liquid in the first liquid cooling plate 111 is the same as the flow direction of the second liquid cooling plate 112 and the third liquid cooling plate 113 . Optionally, the first liquid inlet and outlet A1, the third liquid inlet and outlet A3 and the fifth liquid inlet and outlet A5 are liquid inlets, the second liquid inlet and outlet A2, the fourth liquid inlet and outlet A4 and the sixth liquid inlet and outlet A6 Both are liquid outlets. The cooling liquid flows in the same direction in the first liquid cooling plate 111 , the second liquid cooling plate 112 , and the third liquid cooling plate 113 . Of course, it can also be that the first liquid inlet and outlet A1, the third liquid inlet and outlet A3, and the fifth liquid inlet and outlet A5 are all liquid outlets, and the second liquid inlet and outlet A2, the fourth liquid inlet and outlet A4, and the sixth liquid inlet and outlet Port A6 is the liquid inlet.

In one embodiment, the flow direction of the cooling liquid in the first liquid cooling plate 111 is opposite to the flow direction of the second liquid cooling plate 112 and the third liquid cooling plate 113 . That is, the cooling liquid in the first liquid cooling plate 111 flows in one direction, and the cooling liquid in the second liquid cooling plate 112 and the third liquid cooling plate 113 flows in the other direction. Optionally, the first liquid inlet and outlet A1, the fourth liquid inlet and outlet A4 and the sixth liquid inlet and outlet A6 are liquid inlets, the second liquid inlet and outlet A2, the third liquid inlet and outlet A3 and the fifth liquid inlet and outlet A5 Both are liquid outlets. Of course, it can also be that the first liquid inlet and outlet A1, the fourth liquid inlet and outlet A4, and the sixth liquid inlet and outlet A6 are all liquid outlets, and the second liquid inlet and outlet A2, the third liquid inlet and outlet A3, and the fifth liquid inlet and outlet Port A5 is the liquid inlet.

In one embodiment, the flow direction of the cooling liquid in the first liquid cooling plate 111 is the same as the flow direction of one of the second liquid cooling plate 112 and the third liquid cooling plate 113 , and the second liquid cooling plate 112 and the third The flow direction of the other of the liquid cooling plates 113 is opposite. That is to say, the cooling liquid in the first liquid cooling plate 111 flows in one direction, the cooling liquid in one of the second liquid cooling plate 112 and the third liquid cooling plate 113 flows in one direction, and the cooling liquid in the other one flows in the other direction. flow in one direction. Exemplarily, the flow direction of the cooling liquid in the first liquid cooling plate 111 is the same as the flow direction of the cooling liquid in the second liquid cooling plate 112 , but is different from the flow direction of the cooling liquid in the third liquid cooling plate 113 . . Of course, the flow direction of the cooling liquid in the first liquid cooling plate 111 can also be different from the flow direction of the cooling liquid in the second liquid cooling plate 112 , but it is the same as the flow direction of the cooling liquid in the third liquid cooling plate 113 . At this time, the connection mode of the liquid inlet and outlet of each liquid cooling plate is substantially the same as the connection mode of the liquid inlet and outlet in the above-mentioned embodiments, and will not be repeated here.

Referring to FIGS. 1 to 5 , in one embodiment, the pipe structure 120 includes an inlet joint 124 , an outlet joint 125 , a liquid cooling pipe group 121 , a first manifold 122 and a second manifold 123 . The liquid cooling pipe group 121 can be connected to the first liquid cooling plate 111 , the second liquid cooling plate 112 , the third liquid cooling plate 113 and the fourth liquid cooling plate 114 through the first liquid cooling plate 122 and the second liquid cooling plate 123 . The liquid cooling pipe group 121 is also connected to an external cooling source through an inlet joint 124 and an outlet joint 125 .

The inlet joint 124 and the outlet joint 125 are used to realize the connection between the liquid cooling pipe group 121 and the external cooling source. The inlet connector 124 is connected to the liquid outlet end of the external cooling source, and the outlet connector 125 is connected to the liquid inlet end of the external cooling source. The cooling liquid in the external cooling source enters the liquid cooling pipe group 121 through the liquid outlet and the inlet joint 124, and the cooling liquid in the liquid cooling pipe group 121 returns to the external cooling source through the outlet joint 125 and the liquid inlet.

The liquid cooling pipe group 121 includes a plurality of cooling pipes, and the cooling pipes are respectively connected to the respective liquid inlet and outlet ports of the first liquid cooling plate 111 , the second liquid cooling plate 112 , the third liquid cooling plate 113 and the fourth liquid cooling plate 114 , and pass through The first sub-collector 122 and the second sub-collector 123 realize the series-parallel connection of each liquid cooling plate to meet different cooling requirements. Optionally, each cooling pipe is a hard pipe or a customized special-shaped pipe fitting, etc.

The first manifold 122 has a first connection, a second connection and a third connection. The first sub-collector 122 realizes the series-parallel connection of the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 through the first joint, the second joint and the third joint. Exemplarily, the first joint is connected to the second liquid inlet and outlet A2 of the first liquid cooling plate 111 , the second joint is connected to the fourth liquid inlet and outlet A4 of the second liquid cooling plate 112 , and the third joint is connected to the third liquid cooling plate 113 The sixth liquid inlet and outlet A6. Each liquid inlet and outlet and the joint are connected by cooling pipes. Optionally, the first joint, the second joint and the third joint may be arranged on the same side or on different sides.

The second manifold 123 has a fourth joint, a fifth joint, and a sixth joint. The second manifold 123 realizes the output of the cooling liquid after the first liquid cooling plate 111 , the second liquid cooling plate 112 and the third liquid cooling plate 113 are connected in series and parallel through the fourth joint, the fifth joint and the sixth joint. Exemplarily, the fourth joint is connected to the third liquid inlet and outlet A3 of the second liquid cooling plate 112 , the fifth joint is connected to the fifth liquid inlet and outlet A5 of the third liquid cooling plate 113 , and the sixth joint is connected to the outlet joint 125 . Each liquid inlet and outlet and the joint are connected by cooling pipes. Optionally, the fourth joint, the fifth joint and the sixth joint may be arranged on the same side or on different sides.

It should be noted that the joints of the first sub-collector 122 and the second sub-collector 123 may have different functions due to different connected cooling pipes. For example, in the foregoing embodiments, the first sub-collector 122 is a liquid separator, and the second sub-collector 123 is a liquid collector. Of course, in other embodiments of the present invention, by changing the connection mode of the cooling pipes, the functions of the first sub-collector 122 and the second sub-collector 123 can be changed. When the second liquid cooling plate 112 and the third liquid cooling plate 113 are used, the first sub-collector 122 is a liquid collector, and the second sub-collector 123 is a liquid separator. In this embodiment, the second sub-collector 123 and the first sub-collector 122 are arranged separately, as shown in FIG. 4; shown in Figure 5. In other embodiments of the present invention, the first sub-collector 123 and the second sub-collector 122 may also be three-way valves or the like.

Referring to FIGS. 3 to 5 , in one embodiment, the inlet connector 124 is connected to the seventh liquid inlet and outlet port A7 of the fourth liquid cooling plate 114 , and the eighth liquid inlet and outlet port A8 of the fourth liquid cooling plate 114 is connected to the first liquid cooling plate. The first liquid inlet and outlet A1 of 111 and the second liquid inlet and outlet A2 of the first liquid cooling plate 111 are respectively connected to the fourth liquid inlet and outlet A4 of the second liquid cooling plate 112 and the third liquid cooling plate through the first manifold 122 The sixth liquid inlet and outlet A6 of 113 , the third liquid inlet and outlet A3 of the second liquid cooling plate 112 and the fifth liquid inlet and outlet A5 of the third liquid cooling plate 113 are connected to the outlet joint 125 through the second manifold 123 .

In the present invention, after the fourth liquid cooling plate 114 is connected in series with the first liquid cooling plate 111, the second liquid cooling plate 112 and the third liquid cooling plate 113 and the second liquid cooling plate 112 and the third liquid cooling plate are respectively connected in series. Take 113 in parallel as an example to illustrate the connection of the inlet and outlet ports and the flow of coolant.

The liquid outlet end of the external cooling source is connected to the seventh liquid inlet and outlet A7 of the fourth liquid cooling plate 114 through the inlet joint 124 , and the eighth liquid inlet and outlet A8 of the fourth liquid cooling plate 114 is connected to the first inlet and outlet of the first liquid cooling plate 111 . The liquid port A1 and the second liquid inlet and outlet A2 of the first liquid cooling plate 111 are connected to the fourth liquid inlet and outlet A4 of the second liquid cooling plate 112 and the sixth liquid inlet and outlet of the third liquid cooling plate 113 through the first manifold 122 Port A6. The third liquid inlet and outlet A3 of the second liquid cooling plate 112 and the fifth liquid inlet and outlet A5 of the third liquid cooling plate 113 are connected to the liquid inlet end of the external cooling source through the second manifold 123 and the outlet joint 125 .

The cooling liquid output from the external cooling source first enters the fourth liquid cooling plate 114 through the inlet joint 124 and the liquid cooling pipe group 121 , and cools the power supply 230 through the fourth liquid cooling plate 114 . The cooling liquid after heat exchange with the power supply 230 flows into the first liquid cooling plate 111 through the liquid cooling pipe group 121, and passes through the first liquid cooling plate 111 to a surface of the first electronic unit 210 and a surface of the second electronic unit 220 respectively. The surface is cooled. Subsequently, the cooling liquid flows out of the first liquid cooling plate 111 and is divided into the second liquid cooling plate 112 and the third liquid cooling plate 113 respectively through the first liquid collector 122, and then the other surface of the first electronic unit 210 and the second liquid cooling plate 113 are separated. The other surface of the electronic unit 220 is cooled. The cooled cooling liquid flows out of the second liquid cooling plate 112 and the third liquid cooling plate 113, and is collected by the second liquid collector 123 to the outlet joint 125, and then returns to the external cooling source.

Moreover, when the cooling liquid flows between the first liquid cooling plate 111, the second liquid cooling plate 112, and the third liquid cooling plate 113, the flow direction of the cooling liquid in the first liquid cooling plate 111 is different from that of the second liquid cooling plate 112, The flow direction of the cooling liquid in the third liquid cooling plate 113 is opposite. In this way, it can be ensured that the flow directions of the cooling liquid on both sides of the first electronic unit 210 are different, and a relative flow is formed on both sides of the first electronic unit 210, so that the temperature of the first electronic unit 210 can be balanced, and the cooling liquid can be reduced. and the temperature difference between the first electronic unit 210 . Optionally, the sum of the flow channel resistances of the second liquid cooling plate 112 and the third liquid cooling plate 113 is substantially the same as the sum of the flow channel resistances of the first liquid cooling plate 111 , to ensure that the flow velocity in the entire liquid cooling structure 110 is consistent.

Of course, in other embodiments of the present invention, the connection mode of the liquid inlet and outlet of each liquid cooling plate and the flow direction of the cooling liquid can be appropriately adjusted, and the connection mode and principle are substantially the same, and will not be repeated here.

The present invention also provides a liquid-cooled virtual currency mining machine 10, including an electronic device 200 and the liquid-cooled heat dissipation device 100 in the above embodiment. The electronic device 200 includes a first electronic unit 210 , a second electronic unit 220 and a power supply 230 , and the liquid cooling device cools the first electronic unit 210 , the second electronic unit 220 and the power supply 230 . After the liquid-cooled virtual currency mining machine 10 of the present invention adopts the liquid-cooled heat dissipation device 100 of the above-mentioned embodiment, the heat dissipation effect of the electronic device 200 can be ensured, thereby ensuring the working reliability of the liquid-cooled virtual currency mining machine 10 . Of course, the liquid-cooled virtual currency mining machine 10 may also be other types of processing equipment.

In one embodiment, the liquid-cooled virtual currency mining machine 10 further includes a case casing 400 , and the electronic equipment 200 and the liquid cooling structure 110 and the pipe structure 120 of the liquid-cooled heat dissipation device 100 are all disposed in the case casing 400 . The chassis casing 400 is the casing of the liquid-cooled heat dissipation device 100 . The case housing 400 has an installation space for installing the electronic unit, the liquid cooling structure 110 and the piping structure 120 of the electronic device 200 of the virtual currency mining machine. The case shell 400 also plays a protective role to prevent external sundries from entering, and at the same time, it can also prevent external objects from touching the electronic device 200 to ensure that the electronic device 200 can work normally. In addition, the case shell 400 can also make the various components of the liquid cooling device 100 form a whole, which is convenient for use.

In one embodiment, the chassis case 400 includes a carrier case 410 , a first side panel 420 , a second side panel 430 and a case cover 440 disposed on the carrier case 410 , the first side panel 420 and the second side panel 440 . 430 are arranged opposite to each other, the chassis cover 440 is covered on the top of the carrying case 410, the input terminal 231 of the electronic device 200 is arranged on the first side plate 420, and the inlet joint 124 and the outlet joint 125 of the pipe structure 120 are arranged on the second side plate 430. The carrying case 410 is arranged in a U shape. The first side plate 420 and the second side plate 430 are arranged on two opposite sides of the bearing bottom case, and the chassis cover plate 440 is covered on the bearing shell 410. In this way, the first side plate 420, the second side plate 430, the bearing The casing 410 and the case cover 440 may form a case with an installation space.

Moreover, the inlet joint 124 and the outlet joint 125 protrude through the second side plate 430 for connecting to an external cooling source. The input terminal of the power supply 230 protrudes through the first side plate 420 to facilitate connection with an external power source. Furthermore, a fixing member is provided inside the first side plate 420 , and the fixing member fixes the first manifold 122 and the second manifold 123 .

Referring to FIG. 1 to FIG. 6 , in one embodiment, the liquid-cooled virtual currency mining machine 10 further includes a connection component 240 , and the connection component 240 respectively connects the first electronic unit 210 and the second electronic unit 220 to the power supply 230 . The connection component 240 electrically connects the first electronic unit 210 and the power supply 230 , and electrically connects the second electronic unit 220 and the power supply 230 . In this way, the power supply 230 supplies power to the first electronic unit 210 and the second electronic unit 220, so that the first electronic unit 210 and the second electronic unit 220 work normally.

In one embodiment, the connection assembly 240 includes a copper bar and a connection cable, and the first electronic unit 210 is connected to the power supply 230 through the copper bar and the connection cable. One end of the copper bar is electrically connected to the first electronic unit 210, and the other end of the copper bar is electrically connected to the power supply 230 through a connecting cable. Of course, one end of the copper bar is electrically connected to the second electronic unit 220, and the other end of the copper bar is electrically connected to the power supply 230 through a connecting cable.

Referring to FIG. 6 , in one embodiment, the connection assembly 240 includes a positive electrode copper bar 241 , a negative electrode copper bar 243 , a positive electrode cable 242 and a negative electrode cable 244 ; The negative electrode 212 of the electronic unit 210 is provided with a negative electrode copper bar 243; the positive electrode copper bar 241 has a positive electrode fixing hole 2411 connected with the positive electrode cable 242, and the positive electrode fixing hole 2411 is located in the inner position of the positive electrode copper bar 241; The negative electrode fixing hole 2441 connected to the cable 244 is located outside the negative electrode copper row 243 . It can be understood that the inner position here refers to the position between the connection between the positive electrode copper bar 241 and the first electronic unit 210 and the connection between the negative electrode copper bar 243 and the second electronic unit 220; the outer position here The position refers to a position other than the connection between the positive electrode copper bar 241 and the first electronic unit 210 and the connection between the negative electrode copper bar 243 and the second electronic unit 220 .

In one embodiment, the length of the positive cable 242 is greater than the length of the negative cable 244 . In this way, the components of the positive electrode and the negative electrode can be prevented from being reversely connected, and the first electronic unit 210 and the second electronic unit 220 can be prevented from being burned out, thereby ensuring safe use. Of course, in other embodiments of the present invention, the connection structure of the positive electrode and the negative electrode can also be different, so as to achieve the purpose of preventing the reverse connection of the positive electrode and the negative electrode.

The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity, all possible combinations of the technical features in the above-described embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be regarded as the scope described in this specification.

The above-mentioned embodiments only represent several embodiments of the present invention, and the descriptions thereof are specific and detailed, but should not be construed as a limitation on the scope of the invention patent. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can also be made, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the appended claims.

Claims (15)

1. A liquid cooling heat dissipation device is used for dissipating heat of electronic equipment, wherein the electronic equipment comprises a first electronic unit and a second electronic unit; the liquid cooling heat abstractor includes:

the liquid cooling structure comprises a first liquid cooling plate, a second liquid cooling plate and a third liquid cooling plate, wherein the second liquid cooling plate and the third liquid cooling plate are symmetrically arranged at two sides of the first liquid cooling plate, the first electronic unit is arranged between the first liquid cooling plate and the second liquid cooling plate, and the second electronic unit is arranged between the first liquid cooling plate and the third liquid cooling plate; and

and the pipeline structure is connected with the first liquid cooling plate, the second liquid cooling plate, the third liquid cooling plate and an external cold source and used for inputting and outputting cooling liquid.

2. The liquid-cooled heat sink of claim 1, wherein the first liquid-cooled plate has a cooling capacity greater than the second and third liquid-cooled plates;

the first liquid cooling plate is provided with a first accommodating cavity, the second liquid cooling plate is provided with a second accommodating cavity, and the third liquid cooling plate is provided with a third accommodating cavity; the heat dissipation area of the first accommodating cavity is larger than that of the second accommodating cavity, and the heat dissipation area of the first accommodating cavity is larger than that of the third accommodating cavity.

3. The liquid-cooled heat sink of claim 1, wherein the first liquid-cooled plate has a first cooling surface and a second cooling surface, the second liquid-cooled plate has a third cooling surface, and the third liquid-cooled plate has a fourth cooling surface;

the first cooling surface and the third cooling surface are arranged oppositely, are respectively abutted against the first electronic unit and are used for cooling the first electronic unit;

the second cooling surface and the fourth cooling surface are arranged opposite to each other, and are respectively abutted against the second electronic unit for cooling the second electronic unit.

4. The liquid-cooled heat dissipating device of claim 1, wherein the surface of the second liquid-cooled plate has a first protrusion, the first protrusion abuts against the first electronic unit, and the surface of the second liquid-cooled plate and the first electronic unit enclose a first heat dissipating channel for dissipating heat of the first electronic unit;

the surface of the third liquid cooling plate is provided with a second fixing protrusion which is convexly arranged, the second fixing protrusion is abutted to the second electronic unit, and the surface of the third liquid cooling plate and the second electronic unit are enclosed to form a second heat dissipation channel for dissipating heat of the second electronic unit.

5. The liquid-cooled heat dissipation device of claim 1, wherein the electronic device further comprises a power supply, the liquid-cooled structure further comprises a fourth liquid-cooled plate connected to the conduit structure, the fourth liquid-cooled plate having a fifth cooling surface, the fifth cooling surface being attached to the power supply for cooling the power supply.

6. The liquid-cooled heat sink of claim 5, wherein the first liquid-cooled plate has a first fluid inlet and a second fluid outlet; the second liquid cooling plate is provided with a third liquid inlet and outlet and a fourth liquid inlet and outlet; the third liquid cooling plate is provided with a fifth liquid inlet and outlet and a sixth liquid inlet and outlet, and the fourth liquid cooling plate is provided with a seventh liquid inlet and outlet and an eighth liquid inlet and outlet;

the pipeline structures are connected in series and/or in parallel with each liquid inlet and outlet.

7. The liquid-cooled heat sink of claim 6, wherein the fourth liquid-cooled plate is connected in series or in parallel with the first, second, and third liquid-cooled plates.

8. The liquid-cooled heat sink of claim 6, wherein the first, second, and third liquid-cooled plates are connected in series or in parallel;

or the first liquid cooling plate is respectively connected with the second liquid cooling plate and the third liquid cooling plate in series, and the second liquid cooling plate is connected with the third liquid cooling plate in parallel.

9. The liquid-cooled heat sink of claim 7 or 8, wherein the flow direction of the cooling liquid in the first liquid-cooled plate is the same as the flow direction of the second liquid-cooled plate and the third liquid-cooled plate;

or the flow direction of the cooling liquid in the first liquid cooling plate is opposite to the flow direction of the second liquid cooling plate and the third liquid cooling plate;

or the flowing direction of the cooling liquid in the first liquid cooling plate is the same as the flowing direction of one of the second liquid cooling plate and the third liquid cooling plate, and the flowing direction of the other of the second liquid cooling plate and the third liquid cooling plate is opposite to the flowing direction of the other of the second liquid cooling plate and the third liquid cooling plate.

10. The liquid cooled heat sink of any of claims 6 to 8, wherein the piping structure comprises an inlet connection, an outlet connection, a set of liquid cooled pipes, a first liquid trap and a second liquid trap;

the liquid cooling pipeline group can be connected with the first liquid cooling plate, the second liquid cooling plate, the third liquid cooling plate and the fourth liquid cooling plate through the first liquid distribution and collection device and the second liquid distribution and collection device;

the liquid cooling pipeline set is further connected to the external cold source through the inlet connector and the outlet connector.

11. The liquid-cooled heat dissipation device of claim 10, wherein the inlet connector is connected to a seventh liquid inlet and outlet of the fourth liquid-cooled plate, the eighth liquid inlet and outlet of the fourth liquid-cooled plate is connected to the first liquid inlet and outlet of the first liquid-cooled plate, the second liquid inlet and outlet of the first liquid-cooled plate are respectively connected to a fourth liquid inlet and outlet of the second liquid-cooled plate and a sixth liquid inlet and outlet of the third liquid-cooled plate through the first liquid distributor, and the third liquid inlet and outlet of the second liquid-cooled plate and the fifth liquid inlet and outlet of the third liquid-cooled plate are connected to the outlet connector through the second liquid distributor.

12. A liquid-cooled virtual currency miner comprising electronic equipment and a liquid-cooled heat sink as claimed in any one of claims 1 to 11;

the electronic equipment comprises a first electronic unit, a second electronic unit and a power supply, and the first electronic unit, the second electronic unit and the power supply are cooled by the liquid cooling device.

13. The liquid-cooled virtual currency miner as recited in claim 12, further comprising a connection assembly connecting the first and second electronic units to the power supply, respectively.

14. The liquid-cooled virtual currency miner as recited in claim 13, wherein said connection assembly includes copper bars and a connection cable, said first electronic unit being connected to said power supply through said copper bars and said connection cable.

15. The liquid-cooled virtual currency miner according to claim 14, wherein said connection assembly includes positive copper bars, negative copper bars, positive cables and negative cables; the anode of the first electronic unit is provided with the anode copper bar, and the cathode of the first electronic unit is provided with the cathode copper bar; the positive copper bar is provided with a positive fixing hole connected with the positive cable, and the positive fixing hole is positioned in the inner side of the positive copper bar; the negative electrode copper bar is provided with a negative electrode fixing hole connected with the negative electrode cable, and the negative electrode fixing hole is positioned at a position close to the outside of the negative electrode copper bar;

the length of the positive cable is greater than that of the negative cable.

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