CN114513107A - power conversion module - Google Patents

Abstract

The present disclosure relates to a power conversion module including a multi-layer printed circuit board, a switching device, a capacitive device, a first, a second, a third, and a fourth via. The multilayer printed circuit board has a plurality of copper layers including a plurality of positive copper layers and a plurality of negative copper layers alternately arranged. The switch device has a switch positive terminal and a switch negative terminal. The capacitor device has a positive capacitor terminal and a negative capacitor terminal, and the capacitor device forms a capacitor area. The first, second, third and fourth via holes are respectively and electrically connected with the switch positive end, the switch negative end, the capacitor positive end and the capacitor negative end, wherein a plurality of positive copper layers are electrically connected with the first via hole and the third via hole, and a plurality of negative copper layers are electrically connected with the second via hole and the fourth via hole. The dielectric layer is arranged between any two adjacent copper layers. The projections of the adjacent positive copper layer and negative copper layer and the capacitor area on the first surface are at least partially overlapped.

Description

power conversion module

technical field

The present disclosure relates to a power conversion module, in particular to a power conversion module in which a positive electrode copper layer and a negative electrode copper layer are alternately arranged.

Background technique

With the rapid development of technologies such as mobile communication and cloud computing, high-power power conversion modules are widely used in electronic products. And due to the trend of high power and miniaturization of electronic products, how to improve the conversion efficiency of the power conversion module and reduce the size of the power conversion module is the primary consideration.

The output power of the existing power conversion module increases, so that the loss caused by the large current in the corresponding current loop and the flow path in the power conversion module is larger and larger, and the loss is a large part of the total loss of the power conversion module. The proportion has also increased. In order to reduce the loss on the transmission path, multiple copper layers in the multilayer printed circuit board are often wired in parallel to reduce the equivalent impedance on the flow path. However, due to the existence of parasitic parameters between multiple copper layers and the AC loop in the power conversion module, the AC loss of the AC current in the corresponding AC loop increases, thereby reducing the conversion efficiency of the power conversion module.

Therefore, how to develop a power conversion module that can improve the above-mentioned prior art is an urgent need at present.

SUMMARY OF THE INVENTION

The purpose of the present disclosure is to provide a power conversion module, which is electrically connected to the corresponding positive and negative terminals of the switch, the positive and negative terminals of the capacitor, and a plurality of via holes through a plurality of positive electrode copper layers and a plurality of negative electrode copper layers arranged alternately. The projections of the positive and negative copper layers and the capacitor region on the first surface are at least partially overlapped, thereby reducing the parasitic inductance of the wiring and reducing the parasitic loss, thereby improving the conversion efficiency of the power conversion module.

According to the concept of the present disclosure, the present disclosure provides a power conversion module including a multilayer printed circuit board, at least one switch device, at least one capacitor device, at least one first via hole, at least one second via hole, and at least one third via hole. vias and at least one fourth via. The multilayer printed circuit board has a first side and a second side, the first side is opposite to the second side, and the multilayer printed circuit board has a plurality of copper layers, the plurality of copper layers including a plurality of positive copper layers and a plurality of negative electrodes copper layers, the plurality of positive electrode copper layers and the plurality of negative electrode copper layers are alternately arranged. The switch device is arranged on the first surface of the multi-layer printed circuit board, and the switch device has a switch positive terminal and a switch negative terminal. The capacitor device is arranged on the first surface of the multilayer printed circuit board, and the capacitor device has a capacitor positive terminal and a capacitor negative terminal, and the capacitor device forms a capacitor region. The first via hole is electrically connected to the positive terminal of the switch, the second via hole is electrically connected to the negative terminal of the switch, the third via hole is electrically connected to the positive terminal of the capacitor, and the fourth via hole is electrically connected to the negative terminal of the capacitor. Wherein, the plurality of positive electrode copper layers are electrically connected to the first via hole and the third via hole, and the plurality of negative electrode copper layers are electrically connected to the second via hole and the fourth via hole. The dielectric layer is arranged between any two adjacent copper layers. The projections of the adjacent positive and negative copper layers and the capacitor region on the first surface are at least partially overlapped.

Description of drawings

FIG. 1 is a schematic three-dimensional structure diagram of a power conversion module according to a preferred embodiment of the disclosure.

FIG. 2 is a schematic diagram of an exploded structure of a power conversion module according to a preferred embodiment of the present disclosure.

FIG. 3 is a schematic side view of a power conversion module according to a preferred embodiment of the disclosure.

FIG. 4 is a schematic side view of a power conversion module according to a preferred embodiment of the disclosure.

FIG. 5 is a schematic structural diagram of a second side of a power conversion module according to a preferred embodiment of the present disclosure.

FIG. 6 is a schematic diagram of an equivalent circuit of the power conversion module of the present disclosure.

FIG. 7 is a schematic side view of a power conversion module according to another preferred embodiment of the disclosure.

Among them, the reference numerals are described as follows:

1: Power conversion module

10: Multilayer printed circuit board

101: Switchgear

101a: Switch positive terminal

101b: switch negative terminal

102: Capacitive device

102a: Positive terminal of capacitor

102b: Capacitor negative terminal

103: Magnetic core assembly

104: Holes

105: Winding Vias

106: first via

107: Second via

108: Third via

109: Fourth via

11: The first side

12: The second side

13: Pad

14: inner layer

PP: dielectric layer

L1～L8: Copper layer

Vin+: Input positive terminal

Vin-: Input negative terminal

SW: Contact

Cin: input capacitance

Co: output capacitance

Vin: input voltage

Vo: output voltage

Detailed ways

Some typical embodiments that embody the features and advantages of the present disclosure will be described in detail in the description that follows. It should be understood that the present disclosure is capable of various changes in different embodiments without departing from the scope of the present disclosure, and the descriptions and drawings therein are for illustrative purposes only and not for limitation. this disclosure.

FIG. 1 is a schematic three-dimensional structure diagram of a power conversion module according to a preferred embodiment of the disclosure. FIG. 2 is a schematic diagram of an exploded structure of a power conversion module according to a preferred embodiment of the present disclosure. FIG. 3 is a schematic side view of a power conversion module according to a preferred embodiment of the disclosure. FIG. 4 is a schematic side view of a power conversion module according to a preferred embodiment of the disclosure. As shown in FIGS. 1 to 4 , the power conversion module 1 includes a multilayer printed circuit board 10 , at least one switching device 101 , at least one capacitor device 102 , at least one magnetic core component 103 and at least one winding via 105 . The multilayer printed circuit board 10 has a first side 11 , a second side 12 and an inner layer 14 , the first side 11 and the second side 12 are opposite to each other, and the multilayer printed circuit board 10 has a plurality of copper layers L1 - L8 . The switch device 101 is disposed on the first surface 11 of the multilayer printed circuit board 10 . The magnetic core assembly 103 is disposed in the inner layer 14 of the multilayer printed circuit board 10 , wherein the magnetic core assembly 103 has a hole 104 . One end of the winding via 105 is electrically connected to the switch device 101 , the other end of the winding via 105 is electrically connected to the second surface 12 of the multilayer printed circuit board 10 , and the winding via 105 passes through the hole of the magnetic core assembly 103 104, and form a magnetic assembly with the magnetic core assembly 103. Vias 105 are electrically connected to all or part of the copper layer. The capacitor device 102 is disposed on the first surface 11 of the multilayer printed circuit board 10 . The capacitor device 102 includes at least one capacitor, and the capacitor is an input capacitor or an output capacitor. In some embodiments, the winding via hole 105 is a straight hole or a stepped hole. Specifically, the winding via hole 105 may have a straight structure or a partially bent structure. The number of copper layers on the side of the magnetic core assembly 103 close to the first side 11 of the multilayer printed circuit board 10 is at least two more than the number of copper layers on the other side of the magnetic core assembly 103 . In some embodiments, the number of copper layers on one side of the magnetic core assembly 103 close to the first side 11 of the multilayer printed circuit board 10 is greater than the number of copper layers on the other side of the magnetic core assembly 103 by at least three layers. . Taking FIG. 3 and FIG. 4 as an example, the multilayer printed circuit board 10 includes eight copper layers L1-L8 and eight dielectric layers PP. The dielectric layer PP is arranged between two adjacent copper layers, but the actual number of layers is not equal to This is limited. The magnetic core assembly 103 is disposed between the copper layers L7 and L8 in the multilayer printed circuit board 10 . Therefore, the number of copper layers L1-L7 located on one side of the magnetic core assembly 103 is greater than the number of copper layers L8 located on the other side of the magnetic core assembly 103, and the copper layers L1-L7 can have larger wiring areas and Copper area. It can be seen from this that the number of layers of the copper layer on one side of the magnetic core assembly 103 is more than the number of layers of the copper layer on the other side of the magnetic core assembly 103, for example, the number of layers of the copper layer on one side of the magnetic core assembly 103 is higher than that of the magnetic core assembly 103. The number of copper layers on the other side of the core assembly 103 is increased by two layers, so that a larger wiring area and a copper laying area can be obtained by using a large number of copper layers concentrated on one side of the magnetic core assembly 103 . This provides enough space for wiring to avoid the strong electromagnetic field interference caused by the power loop, and can increase the flexibility of the copper network and reduce the parasitic resistance and parasitic inductance of the multi-layer printed circuit board, thereby improving the power conversion module. conversion efficiency.

FIG. 5 is a schematic structural diagram of a second side of a power conversion module according to a preferred embodiment of the present disclosure. In some embodiments, as shown in FIG. 5 , the power conversion module 1 further includes a pad 13 , and the pad 13 is disposed on the second surface 12 of the multilayer printed circuit board 10 . Wherein, the pad 13 is a copper block pin or the surface layer copper of the multilayer printed circuit board 10 , and the pad 13 is fixed on the second surface 12 , and the other end of the winding via 105 is electrically connected to the pad 13 .

FIG. 6 is a schematic diagram of an equivalent circuit of the power conversion module of the present disclosure. As shown in FIG. 6 , the capacitor device 102 includes an input capacitor Cin and an output capacitor Co, the magnetic component is an inductor Lo, and the winding via 105 is used as a winding of the inductor Lo. The switch device 101 has an upper switch 1010 and a lower switch 1011, and the upper switch 1010 and the lower switch 1011 may be, for example, MOS (Metal Oxide Semiconductor), but not limited thereto. There is a contact SW between the upper switch 1010 and the lower switch 1011 , the contact SW is electrically connected to the inductor Lo, and the contact SW is electrically connected to one end of the winding via 105 . One end of the input capacitor Cin is electrically connected to the upper switch 1010 to form an input positive terminal Vin+, and the other end of the input capacitor Cin is electrically connected to the lower switch 1011 to form an input negative terminal Vin-. One end of the output capacitor Co is electrically connected to the inductor Lo, and the other end of the output capacitor Co is electrically connected to the lower switch 1011 . In some embodiments, the inductor Lo as the magnetic component in the above embodiments is located on the inner layer 14 of the multilayer printed circuit board 10 , the projection of the inductor Lo and the switching device 101 on the first surface 11 at least partially overlap, and the inductor Lo is electrically connected to the output positive terminal Vo+ of the power conversion module 1 , and the output positive terminal Vo+ is disposed on the second surface 12 of the multilayer printed circuit board 10 . It should be noted that only one-phase half-bridge branch is shown in FIG. 6 , and in an actual power conversion module, a multi-phase parallel-connected half-bridge branch may be included.

FIG. 7 is a schematic side view of a power conversion module according to another preferred embodiment of the disclosure. Components with similar structures and functions in FIG. 7 and FIG. 4 are denoted by the same reference numerals, which will not be repeated here. In the embodiment shown in FIG. 7 , the plurality of copper layers include a plurality of positive electrode copper layers and a plurality of negative electrode copper layers, and the plurality of positive electrode copper layers and the plurality of negative electrode copper layers are alternately arranged. It includes copper layers L3, L5 and L7, and the negative electrode copper layer includes copper layers L2, L4 and L6. The switch device 101 has a switch positive terminal 101a and a switch negative terminal 101b, the capacitor device 102 has a capacitor positive terminal 102a and a capacitor negative terminal 102b, the capacitor device 102 is disposed on the first surface 11 and is adjacent to the switch device 101, and the capacitor device 102 forms a capacitive region. The power conversion module 1 further includes a first via hole 106 , a second via hole 107 , a third via hole 108 and a fourth via hole 109 . The first via 106 is electrically connected to the positive terminal 101a of the switch, the second via 107 is electrically connected to the negative terminal 101b of the switch, the third via 108 is electrically connected to the positive terminal 102a of the capacitor, and the fourth via 109 is electrically connected to the negative terminal of the capacitor 102b. The first via hole 106 and the third via hole 108 are electrically connected to a part of the copper layer L1 (that is, the part of the copper layer L1 that is electrically connected to the switch positive terminal 101a and the capacitor positive terminal 102a), the copper layer L3, the copper layer L5, and the copper layer L1. Layer L7 and part of the copper layer L8 (ie, the part of the copper layer L8 that is electrically connected to the input positive terminal Vin+). The second via hole 107 and the fourth via hole 109 are electrically connected to part of the copper layer L1 (that is, the part of the copper layer L1 that is electrically connected to the switch negative terminal 101b and the capacitor negative terminal 102b ), the copper layer L2 , the copper layer L4 , and the copper layer L1 . Layer L6 and part of the copper layer L8 (ie, the part of the copper layer L8 that is electrically connected to the input negative terminal Vin-). Wherein, the positive electrode copper layer and the negative electrode copper layer are alternately arranged. The first via hole 106 and the third via hole 108 are electrically connected to the input positive terminal Vin+, the second via hole 107 and the fourth via hole 109 are electrically connected to the input negative terminal Vin-, wherein the input positive terminal Vin+ and the input negative terminal Vin- is disposed on the second side of the multilayer printed circuit board. The arrow line in FIG. 7 represents the direction of the alternating current in this embodiment. The following example illustrates the alternating current loop of this embodiment. Taking the positive terminal 102a of the capacitor 102 as the starting point, the alternating current passes through the third via hole 108 and flows in parallel. Through each positive copper layer, it flows into the switch positive terminal 101a of the switch device 101 through the first via hole 106 . Taking the switch negative terminal 101b of the switch device 101 as a starting point, the alternating current flows through the second via hole 107 and each negative copper layer, and then flows into the capacitor negative terminal 102b of the capacitor device 102 via the fourth via hole 109 . Wherein, the currents flowing through the adjacent positive electrode copper layers and the negative electrode copper layers are in opposite directions. The overlapping portions of the first via hole 106 and the third via hole 108 and the copper layers L2, L4 and L6 shown in FIG. 7 only represent the front-to-back relationship between the via hole and the copper layer under this viewing angle condition, not the actual phase. connect. Similarly, the overlapping portions of the second via hole 107 and the fourth via hole 109 and the copper layers L3 , L5 and L7 only represent the front-to-back relationship between the via holes and the copper layer under this viewing angle, rather than the actual connection. The alternating currents on the adjacent copper layers are in opposite directions, so that the alternating magnetic fluxes between the adjacent copper layers cancel each other, thereby reducing the parasitic inductance of the current loop, thereby improving the conversion efficiency of the power conversion module.

In addition, the power conversion module 1 further includes a dielectric layer PP, and the dielectric layer PP is located between any two adjacent copper layers. The projections of the adjacent positive and negative copper layers and the capacitor region on the first surface 11 are at least partially overlapped, thereby reducing the parasitic inductance of the wiring and reducing the parasitic loss, thereby improving the conversion of the power conversion module. efficiency. In some embodiments, the first via hole 106 , the second via hole 107 , the third via hole 108 and the fourth via hole 109 are straight holes or stepped holes.

In some embodiments, part of the copper layer L8 is electrically connected to the positive output terminal of the power conversion module 1 , and part of the copper layer L8 is electrically connected to the negative output terminal of the power conversion module 1 .

In another embodiment, when the positive copper layer of the copper layer on the side of the magnetic core assembly 103 is one layer, and the negative copper layer is also only one layer, the number of copper layers on the side of the magnetic core assembly 103 is higher than that of the magnetic layer. The number of copper layers on the other side of the core assembly 103 is two more.

It should be noted that the side view shown in Figure 4 focuses on showing the position and connection relationship between the copper layer, the magnetic core components and the corresponding winding vias, and the side view shown in Figure 7 focuses on showing the positive copper layer and the negative copper layer. The electrical connection relationship with the switch device and the capacitor device, in fact, the structures shown in FIG. 4 and FIG. 7 can be implemented in different power conversion modules, or in the same power conversion module.

In summary, the present disclosure provides a power conversion module, which can utilize more copper layers on one side of the magnetic core assembly than the other A larger number of copper layers on one side obtains a larger routing area and copper area. This provides enough space for wiring to avoid the strong electromagnetic field interference caused by the power loop, and can increase the flexibility of the copper network and reduce the parasitic resistance and parasitic inductance of the multi-layer printed circuit board, thereby improving the power conversion module. conversion efficiency. The present disclosure further provides a power conversion module, which is electrically connected to the corresponding positive and negative terminals of the switch, the positive and negative terminals of the capacitor, and a plurality of via holes through a plurality of positive electrode copper layers and a plurality of negative electrode copper layers arranged alternately, and the adjacent positive electrode The projection of the copper layer and the negative copper layer and the capacitor region on the first surface at least partially overlap, thereby reducing the parasitic inductance of the wiring and reducing the parasitic loss, thereby improving the conversion efficiency of the power conversion module.

It should be noted that the above are only preferred embodiments for illustrating the present disclosure, the present disclosure is not limited to the described embodiments, and the scope of the present disclosure is determined by the appended claims. And the present disclosure can be modified in various ways by those who are familiar with the technology, but all of them do not deviate from what is intended to be protected by the appended claims.

Claims (9)

1. A power conversion module, comprising:

the multilayer printed circuit board is provided with a first surface and a second surface which are opposite, and the multilayer printed circuit board is provided with a plurality of copper layers which comprise a plurality of anode copper layers and a plurality of cathode copper layers, and the anode copper layers and the cathode copper layers are arranged in a staggered manner;

at least one switch device disposed on the first surface of the multi-layer printed circuit board, wherein the switch device comprises a switch positive terminal and a switch negative terminal;

at least one capacitive device disposed on the first side of the multi-layer printed circuit board, wherein the capacitive device has a positive capacitance terminal and a negative capacitance terminal, and the at least one capacitive device forms a capacitive area;

the capacitor comprises at least one first via hole, at least one second via hole, at least one third via hole and at least one fourth via hole, wherein the first via hole is electrically connected to the positive end of the switch, the second via hole is electrically connected to the negative end of the switch, the third via hole is electrically connected to the positive end of the capacitor, and the fourth via hole is electrically connected to the negative end of the capacitor, wherein the positive copper layers are electrically connected with the first via hole and the third via hole, and the negative copper layers are electrically connected with the second via hole and the fourth via hole; and

a dielectric layer disposed between any two adjacent copper layers,

wherein, the projections of the adjacent positive electrode copper layer and the negative electrode copper layer and the capacitor area on the first surface are at least partially overlapped.

2. The power conversion module of claim 1, wherein current flow through adjacent positive and negative copper layers is in opposite directions.

3. The power conversion module of claim 1, wherein the switching device comprises at least one upper switch and at least one lower switch electrically connected to each other, the upper switch and the lower switch having a contact therebetween, and the at least one switching device and the at least one capacitive device are disposed adjacent to each other on the first face.

4. The power conversion module of claim 3, wherein the contact of the switching device is electrically connected to at least one inductor, the inductor and a projection of the switching device on the first side at least partially overlap, and the inductor is electrically connected to an output positive terminal of the power conversion module, the output positive terminal being disposed on the second side of the multi-layer printed circuit board.

5. The power conversion module of claim 4, wherein a core element of the inductor is located in an inner layer of the multi-layer printed circuit board, and the number of layers of the copper layer on one side of the core element near the first side is at least two more than the number of layers of the copper layer on the other side of the core element.

6. The power conversion module of claim 4, wherein a winding via is further provided in the multilayer printed circuit board, the winding via serves as a winding of the inductor, and the winding via is a straight hole.

7. The power conversion module of claim 1, wherein the first via and the third via are electrically connected to a positive input terminal of the power conversion module, and the second via and the fourth via are electrically connected to a negative input terminal of the power conversion module.

8. The power conversion module of claim 7, wherein the positive input terminal and the negative input terminal are disposed on the second side of the multilayer printed circuit board.

9. The power conversion module of claim 1, wherein the first via, the second via, the third via, and the fourth via are straight holes or stepped holes.

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