Hyperspectral system and spectrometer based on MEMS
Technical Field
The invention relates to a hyperspectral imaging technology, in particular to a hyperspectral system and a spectrometer based on MEMS.
Background
The hyperspectral imaging technology is formed by intersecting and fusing spectroscopy and image technology, and is a technology for qualitatively and quantitatively analyzing substances by utilizing spectral information while researching the shape, the size and the distribution of a target through image information. The method is widely applied to the fields of agriculture, food safety, medical diagnosis, environmental engineering, geological exploration, fishery, safety and the like.
The imaging data obtained by the hyperspectral imaging device are a spectrum image cube, and the spectrum image cube comprises two-dimensional image information and one-dimensional spectrum information.
At present, the two-dimensional image sensor detector applied to the hyperspectral imaging device is a two-dimensional detector, and only can acquire geometric images of a light sensing range and two-dimensional distribution information of light intensity information under a single wavelength in a transient state, so that spectrum information of a wider wavelength range cannot be obtained.
In the prior art, spectral information in a certain range can be obtained by adopting a mode of a light filter, however, the mode is only suitable for imaging a static scene or a static target due to a narrow wave band, but is not suitable for collecting and analyzing spectral data of a dynamic target or under complex conditions such as illumination change, atmosphere disturbance and the like, and the condition of multi-stage interference occurs in spectrometers with working principles such as acousto-optic adjustability and liquid crystal, and the like, and the wave band is relatively narrow due to the multi-stage interference although the light filter is not directly added. In addition, in the application of a hyperspectral imaging system, for example, the hyperspectral imaging system cannot perform multi-point imaging at one time, cannot collect spectrum information in a larger wavelength range (thousands or even thousands of nanometer wave bands) at one time (low efficiency), low resolution, low signal-to-noise ratio (low energy sensitivity), large volume and high cost, the prior art also obtains spectrum information in a wider wavelength range by a spectrum imaging mode of arranging slits (for example, adopting a prism and a grating light-splitting system), but the method is adopted to seek a wide wavelength range and sacrifice luminous flux, so that the detection sensitivity is reduced.
The current spectrum imaging device needs to perform spectrum analysis of N-N position resolution on a two-dimensional plane, and the same number of area array type light detectors are needed to acquire spectrum information, so that the cost of the spectrum imaging device is greatly increased.
For example, CN201710651230.8 utilizes a high-spectrum imaging system implemented by a scheme of dispersive light splitting and digital array scanning micro-mirror (DMD) +linear photodetector. The dispersion and light splitting scheme has narrow spectrum range, low signal to noise ratio and high cost.
Disclosure of Invention
The invention provides a hyperspectral system and a spectrometer based on MEMS (micro electro mechanical systems) aiming at the problems of incapability of performing multipoint imaging once, incapability of collecting spectrum information in a larger wavelength range (thousands or even thousands of nanometer wave bands) once (low efficiency), low resolution, low signal to noise ratio (low energy sensitivity), large volume and high cost in the application of the hyperspectral imaging system in the prior art.
In order to solve the technical problems, the invention is solved by the following technical scheme:
The hyperspectral system based on the MEMS comprises a light source and a light beam processing unit, wherein the light source and the light beam processing unit comprise MEMS scanning micro mirrors, the MEMS scanning micro mirrors are array scanning micro mirrors, light beams processed by the light source through the light beam processing unit enter the MEMS scanning micro mirrors, and the light beams are reflected by the MEMS scanning micro mirrors in sequence according to requirements.
In order to solve the problems, the application also provides a hyperspectral system based on MEMS, which comprises a light source, a light beam processing unit and an interference system, wherein the interference system comprises a MEMS translational micro-mirror, the light beam processed by the light source through the light beam processing unit enters the MEMS translational micro-mirror, and the MEMS translational micro-mirror modulates and reflects the light beam.
Preferably, the system also comprises an interference system, wherein the interference system comprises a MEMS translational micro-mirror, the light beam reflected by the MEMS scanning micro-mirror enters the MEMS translational micro-mirror, and the MEMS translational micro-mirror modulates and reflects the light beam.
Preferably, the light beam processing unit comprises a first lens group and a first light splitting system, wherein the first lens group at least comprises 1 group of lenses, the light beam of the light source after passing through the sample is transmitted to the first lens group, the first lens group processes the light beam, the processed light beam is divided into 2 groups of light beams through the first light splitting system, one group of light beams enters the imaging system, the other group of light beams form light beams, and the light beams enter the MEMS scanning micro-mirror.
Preferably, the beam processing unit comprises a first lens group and a first beam splitting system, wherein the first lens group at least comprises 1 group of lenses, the light beam of the light source after passing through the sample is transmitted to the first lens group, the first lens group processes the light beam, the processed light beam is divided into 2 groups of light beams through the first beam splitting system, one group of light beams enters the imaging system, and the other group of light beams enter the MEMS translational micro-mirror.
Preferably, the light beam processing unit further comprises a second light splitting system, the first lens group comprises a first collimating lens and a second collimating lens, the light beam firstly passes through the first collimating lens and then passes through the second light splitting system, and the light beam enters the second collimating lens after being split.
Preferably, the light beam processing unit further comprises a second light splitting system, the first lens group comprises a first collimating lens and a second collimating lens, the light beam firstly passes through the first collimating lens and then passes through the second light splitting system, and the light beam enters the second collimating lens after being split.
Preferably, the MEMS scanning micro-mirror further comprises a second lens group, and the light beam is reflected to the second lens group through the MEMS scanning micro-mirror.
Preferably, the optical system further comprises a second lens group, and the light beam is reflected to the second lens group through the MEMS translational micro-mirror.
Preferably, the interference system further comprises a third light splitting system and a plane fixed mirror, wherein the light beam is split into two beams by the third light splitting system, one beam enters the plane fixed mirror and returns to the third light splitting system by the plane fixed mirror, and the other beam enters the MEMS translational micro mirror and returns to the third light splitting system by the MEMS translational micro mirror.
Preferably, the light source includes, but is not limited to, a broadband light source.
In order to solve the above problems, the present application also provides a MEMS-based spectrometer comprising a MEMS-based hyperspectral system.
The MEMS can further reduce the size of the hyperspectral instrument and the high power consumption, the array scanning micro-mirror can perform multi-point imaging at one time and reduce the cost, and the Michelson interferometer is arranged to improve the spectral wavelength range, the signal-to-noise ratio and the resolution.
The invention has the remarkable technical effects due to the adoption of the technical scheme:
1. The invention is based on a time modulation type FT spectrum system which only needs a single photoelectric detector, and realizes wide imaging spectrum analysis range, high resolution and high signal to noise ratio;
2. The MEMS translational micromirror is a MEMS micromirror with vertical large displacement, and adopts the electrothermal driving working principle, so that the designed spectrum system has the characteristics of small volume, high resolution and good stability;
3. The invention adopts a two-dimensional MEMS scanning micro-mirror to selectively and sequentially reflect the optical signals of each pixel point of a space 2D plane to a single photoelectric detector, and an MEMS two-axis rotating micro-mirror for realizing area array scanning is added in an FT spectrum system to reflect the light of each pixel point to the single photoelectric detector. Therefore, the photodetector array corresponding to N pixels one by one is not needed, and the cost of the system is greatly reduced.
4. The hyperspectral instrument designed by the invention can further reduce the size of the hyperspectral instrument and the high power consumption through MEMS, can perform multi-point imaging at one time and reduce the cost through arranging the array scanning micro-mirror, and improves the spectral wavelength range, the signal to noise ratio and the resolution through the arrangement of the Michelson interferometer.
Drawings
Fig. 1 is a schematic diagram of the overall structure of the hyperspectral system of the present invention.
Fig. 2 is a schematic diagram of the overall structure of the hyperspectral system of the present invention.
Fig. 3 is a schematic overall structure of embodiment 12 of the present invention.
Fig. 4 is a schematic overall structure of embodiment 12 of the present invention.
The system comprises a sample 200, a first light source 121, a first lens group 110, a second light splitting system 111, a first collimating lens 112, a second collimating lens 113, an imaging system 141, a light beam 142, a first light splitting system 130, a sample 200, a micro mirror unit 150, a MEMS scanning micro mirror 151, a first lens 152, a second lens 153, an interference system 160, a second lens group 170, a light receiving unit 180, a third light splitting system 161, a plane fixed mirror 162, a MEMS translational micro mirror 163, a third collimating lens 172, a fourth collimating lens 171, a second light source 122 and a circuit system 190, wherein the first light source 121, the second light source 110, the first collimating system 112, the first collimating lens 113, the second collimating lens 112, the second light source 122 and the circuit system;
MEMS Micro Electro MECHANICAL SYSTEM Micro Electro mechanical systems.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Example 1
The spectrum imaging device is used for acquiring a large number of ground object target narrow-band continuous spectrum images and simultaneously acquiring almost continuous spectrum data of each pixel. The spectrum imaging device is divided into a multispectral imaging device, a hyperspectral imaging device and a hyperspectral imaging device according to different spectrum resolutions of the sensors. The spectral resolution of a multispectral imaging device is on the order of delta lambda/lambda=0.1, with typically only a few bands in the visible and near infrared regions. The spectral resolution of the hyperspectral imaging device is on the order of delta lambda/lambda=0.01, and can reach the nm level in tens to hundreds of wave bands in the visible light and near infrared regions. The spectral resolution of the hyperspectral imaging device is on the order of delta lambda/lambda=0.001, up to thousands of bands in the visible and near infrared region.
The fourier transform spectrometer is gradually becoming a research hotspot in the technical field of spectrum, especially near infrared and infrared spectrum, due to the advantages of high spectral resolution, high luminous flux, high signal to noise ratio and the like. The Fourier Transform (FT) spectrometer splits the beam 142 into two or more components, which are recombined after a certain phase difference to obtain higher resolution spectral information. Fourier transform spectrometers are based on michael interferometers and consist of a fixed mirror and a moving mirror. The working principle of the Michelson interferometer is that one beam of incident light is divided into two beams by the beam splitting prism and then reflected by the corresponding plane mirrors, and the two beams of incident light have the same frequency, the same vibration direction and constant phase difference (namely, meet the interference condition), so that interference can occur. Further, the incident light beam (carrying the information of the sample 200) is changed into interference light by a Michelson interferometer driving a mirror to scan, the interference light with the information of the sample 200 is received by a light receiver, and then the spectrum image cube of the sample 200 can be obtained by computer software through Fourier transformation. Fixed and moving mirrors in fourier transform spectrometers are often implemented using MEMS (Micro Electro MECHANICAL SYSTEM) Micro mirrors. MEMS micromirrors are one type of micromirror that can be rotated or moved vertically based on MEMS actuators.
The MEMS-based hyperspectral system comprises a light source, a light beam processing unit and an MEMS scanning micro-mirror 151, wherein the MEMS scanning micro-mirror 151 is an array scanning micro-mirror, a light beam 142 processed by the light source through the light beam processing unit enters the MEMS scanning micro-mirror 151, and the light beam 142 is sequentially reflected by the MEMS scanning micro-mirror 151 according to requirements.
Example 2
In order to solve the above problems, the present application further provides a hyperspectral system based on MEMS, which includes a light source and a beam processing unit, and further includes an interference system 160, where the interference system 160 includes a MEMS translational micro mirror 163, a light beam 142 processed by the light source through the beam processing unit enters the MEMS translational micro mirror 163, and the MEMS translational micro mirror 163 modulates and reflects the light beam 142.
Example 3
Based on embodiment 2, the interference system 160 of the present embodiment further includes a third beam splitting system 161 and a plane mirror 162, and the light beam 142 is split into two beams by the third beam splitting system 161, one beam enters the plane mirror 162 and returns to the third beam splitting system 161 by the plane mirror 162, and the other beam enters the MEMS translational micro-mirror 163 and returns to the third beam splitting system 161 by the MEMS translational micro-mirror 163.
The embodiment further includes a micro mirror unit 150 including a first lens 152 and a second lens 153, and the light beam 142 is transmitted as an input to the micro mirror unit 150 by the first lens 152 to the MEMS scanning micro mirror 151, and then reflected as an output via the second lens 153. The light beams 142 transmitted by the first lens 152 are read one by rotating the mirror surface of the MEMS scanning micromirror 151, and the light beams 142 read each time are output via the second lens 153. The MEMS scanning micro-mirror 151 is a biaxial MEMS deflection mirror, and the mirror surface angle of the MEMS scanning micro-mirror 151 can deflect through the driving of the micro-mirror, so that the coordinate position of the current reading light beam 142 is positioned based on the deflection amount of the biaxial of the MEMS scanning micro-mirror 151.
The operation of reading the light beam at different positions is achieved by varying the amount of deflection of at least one axis. Such as the amount of deflection of one axis of the MEMS scanning micro-mirror 151 for locating the row position of the beam 142 to be read and the amount of deflection of the other axis of the MEMS scanning micro-mirror 151 for locating the column position of the beam 142 to be read. Reading of the entire beam 142 can be achieved by MEMS scanning micromirror 151 deflection. The MEMS scanning micromirror 151 deflects the read beam once and outputs the beam once, and the MEMS scanning micromirror 151 deflection is calculated, for example, according to a change in the deflection amount of one of the axes of the MEMS scanning micromirror 151.
Example 4
Based on embodiment 1, the present embodiment further includes an interference system 160, where the interference system 160 includes a MEMS translational micro-mirror 163, the light beam 142 reflected by the MEMS scanning micro-mirror 151 enters the MEMS translational micro-mirror 163, and the MEMS translational micro-mirror 163 modulates and reflects the light beam 142.
Example 5
Based on embodiment 1, the beam processing unit of this embodiment includes a first lens 152 group 110 and a first beam splitting system 130, where the first lens 152 group 110 is at least composed of 1 group of lenses, the light beam 142 of the light source after passing through the sample 200 is transmitted to the first lens 152 group 110, the first lens 152 group 110 processes the light beam 142, the processed light beam 142 is split into 2 groups of light beams 142 by the first beam splitting system 130, one group of light beams 142 enters the imaging system, and the other group of light beams 142 forms a light beam 142, and enters the MEMS scanning micromirror 151.
Example 6
Based on embodiment 3, the beam processing unit of this embodiment includes a first lens 152 group 110 and a first beam splitting system 130, where the first lens 152 group 110 is at least composed of 1 group of lenses, the light beam 142 of the light source after passing through the sample 200 is transmitted to the first lens 152 group 110, the first lens 152 group 110 processes the light beam 142, the processed light beam 142 is split into 2 groups of light beams 142 by the first beam splitting system 130, one group of light beams 142 enters the imaging system, and the other group of light beams 142 enters the MEMS translational micro-mirror 163.
Example 7
Based on embodiment 3, the beam processing unit of this embodiment includes a first lens 152 group 110 and a first beam splitting system 130, where the first lens 152 group 110 is at least composed of 1 group of lenses, the light beam 142 of the light source after passing through the sample 200 is transmitted to the first lens 152 group 110, the first lens 152 group 110 processes the light beam 142, the processed light beam 142 is split into 2 groups of light beams 142 by the first beam splitting system 130, one group of light beams 142 enters the imaging system, and the other group of light beams 142 forms a light beam 142, and enters the MEMS scanning micromirror 151.
Example 8
Based on the above embodiment, the beam processing unit further includes a second beam splitting system 111, the first lens 152 set 110 includes a first collimating lens 112 and a second collimating lens 113, the beam 142 passes through the first collimating lens 112 and then passes through the second beam splitting system 111, and the beam 142 splits light and then enters the second collimating lens 113.
Example 9
Based on the above embodiment, the present embodiment further includes the second lens group 170, and the light beam 142 is reflected to the second lens group 170 by the MEMS scanning micromirror 151.
The second lens group 170 includes a third collimating lens 172 and a fourth collimating lens 171, and the light beam 142 is reflected to the third collimating lens 172 and the fourth collimating lens 171 by the MEMS scanning micromirror 151.
Example 10
Based on the above embodiment, the present embodiment further includes a second lens group 170, and the light beam 142 is reflected to the second lens group 170 by the MEMS translational micro-mirror 163. The second lens group 170 includes a third collimating lens 172 and a fourth collimating lens 171, and the light beam 142 is reflected to the third collimating lens 172 and the fourth collimating lens 171 by the MEMS scanning micromirror 151.
Example 11
Based on the above embodiments, the present embodiments provide a MEMS-based spectrometer that includes a MEMS-based hyperspectral system.
The interference system 160 is a michelson interference system 160, which includes a third spectroscopic system 161, a MEMS translational micromirror 163, and a planar fixed mirror 162. The third beam-splitting system 161 receives the light beam read by the micromirror unit 150 and splits it into two paths, one path of light beam is transmitted to the MEMS translational micro-mirror 163, the other path of light beam is transmitted to the plane-fixed mirror 162, and the light paths received by the plane-fixed mirror 162 and the MEMS translational micro-mirror 163 are respectively reflected by the mirror surfaces of the two paths to the third beam-splitting system 161 to form interference light. Wherein the MEMS translational micro-mirror 163 is driven by itself to move. The specific michelson interference principle is well known to those skilled in the art and will not be described in detail herein.
The MEMS spectrometer further includes a light receiving unit 180, and the light receiving unit 180 receives the interference light corresponding to the light beam 142 through the second lens group 170 and obtains a spectral image cube of the sample 200 according to the interference light. The light receiving unit 180 includes a photodetector and a signal processor.
The light receiving unit 180 includes a photodetector and a signal processor. The photodetector receives the interference light generated by the interference system 160 through the second lens group 170 and converts the interference light into an electrical signal.
The signal processor is connected with the optical detector to receive the electric signal, and then a spectrum image cube of the sample 200 is obtained. The spectral image cube contains the ground two-dimensional spatial image information of the sample 200 and one-dimensional spectral information corresponding to the two-dimensional spatial image information, and the acquired data form a three-dimensional data set.
The spectral image cube enables image analysis and identification of the ground object according to image characteristics in a space tangential plane, and spectral characteristic analysis of the ground object according to spectral characteristics in a spectral dimension, so that the types, components and contents of the ground object (sample 200) can be identified.
The spectral image cube of the sample 200 can be obtained without moving the test position of the sample 200, and the imaging difficulty is reduced. And only one light detector is arranged, so that spectral imaging can be completed, and the imaging cost is reduced. The use of the michelson interferometer system 160 allows for a broader spectral range, higher resolution, and smaller device size spectral imaging device.
The light beams 142 are read individually in a spectral imaging device in rows or columns or in other rules. The offset or movement of the MEMS scanning micromirror 151 and the MEMS translational micromirror 163 adopts the electrothermal driving working principle, so that the linear movement distance of the MEMS actuator is larger. Therefore, the spectrum imaging device has small volume and good stability
Example 12
On the basis of the above embodiment, the light sources include the first light source 121 and the second light source 122, and the second light source 122 of this embodiment is a single-wavelength light source having a specific wavelength, such as a laser. After the sunlight irradiates the surface of the sample 200, the reflected beam 142 with the measured object information is directed to a subsequent system. The laser light emitted from the second light source 122 is also guided to the subsequent system to calibrate the position information for the MEMS translational micro-mirror 163.
In this embodiment, the combination of the second beam splitter 111 and the second light source 122 is not necessarily located between the sample 200 and the first beam splitter 130, but may be located between the second lens 153 and the michelson interference system 160.
Example 13
Based on the above embodiment, the present embodiment further includes the circuitry 190, and the circuitry 190 is used for performing the related processing of imaging, and the imaging systems of the circuitry 190 and 141 are similar and are not within the scope of the patent.