CN114477068B - Micromechanical thin film structures of MEMS devices - Google Patents
Micromechanical thin film structures of MEMS devices Download PDFInfo
- Publication number
- CN114477068B CN114477068B CN202210061112.2A CN202210061112A CN114477068B CN 114477068 B CN114477068 B CN 114477068B CN 202210061112 A CN202210061112 A CN 202210061112A CN 114477068 B CN114477068 B CN 114477068B
- Authority
- CN
- China
- Prior art keywords
- hole
- set direction
- width
- widths
- film member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Micromachines (AREA)
Abstract
本发明公开了一种MEMS器件的微机械薄膜结构，微机械薄膜结构包括：衬底；锚点座，锚点座设在衬底上；薄膜件，薄膜件连接锚点座，薄膜件具有远离锚点座的设定方向和沿设定方向依次设置的多个有效宽度，有效宽度为薄膜件在垂直于设定方向的剖切面上的截面宽度或截面宽度之和，多个有效宽度沿设定方向逐渐减小。本发明通过使薄膜件的有效宽度沿设定方向逐渐减小，使薄膜件上的应力均匀分布，消除应力集中点，从而减弱疲劳、蠕变、塑性形变等现象，提高可靠性。
The present invention discloses a micromechanical film structure of a MEMS device, the micromechanical film structure comprising: a substrate; an anchor seat, the anchor seat is arranged on the substrate; a film member, the film member is connected to the anchor seat, the film member has a set direction away from the anchor seat and multiple effective widths arranged in sequence along the set direction, the effective width is the cross-sectional width of the film member on a cross-sectional plane perpendicular to the set direction or the sum of the cross-sectional widths, and the multiple effective widths gradually decrease along the set direction. The present invention makes the effective width of the film member gradually decrease along the set direction, so that the stress on the film member is evenly distributed, the stress concentration point is eliminated, and thus fatigue, creep, plastic deformation and other phenomena are weakened, and reliability is improved.
Description
Technical Field
The invention relates to the technical field of parts of MEMS devices, in particular to a micromechanical thin film structure of an MEMS device.
Background
Micromechanical thin-film structures are typical components in MEMS (micro-electromechanical systems) devices, which are typically suspended structures, with drive electrodes to enable movement and deformation of the micromechanical thin-film structure. Materials of the micromechanical thin film structure are generally classified into metal, nonmetal, mixed film layers and the like, for the materials, stress concentration points basically exist under the condition that mechanical stress is applied in the working process, for example, single-end clamped beams of the metal materials are bent and deformed under the static force action of a driving electrode, the stress concentration points are positioned at the root parts of the single-end clamped beams, and the stress concentration points are extremely easy to generate unrecoverable damages such as fatigue, creep, plastic deformation and the like, so that hidden danger is brought to the reliability and service life of MEMS devices.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides a micro-mechanical film structure of an MEMS device, which eliminates stress concentration points, improves reliability and prolongs service life.
The micro-mechanical film structure of the MEMS device comprises a substrate, an anchor point seat and a film piece, wherein the anchor point seat is arranged on the substrate, the film piece is connected with the anchor point seat, the film piece is provided with a set direction far away from the anchor point seat and a plurality of effective widths sequentially arranged along the set direction, the effective widths are the cross section widths or the sum of the cross section widths of the film piece on a cross section perpendicular to the set direction, and the effective widths are gradually reduced along the set direction.
According to the micromechanical thin film structure provided by the embodiment of the invention, the effective width of the thin film piece is gradually reduced along the set direction, so that the stress on the thin film piece is uniformly distributed, and the stress concentration points are eliminated, thereby weakening the phenomena of fatigue, creep, plastic deformation and the like, and improving the reliability.
In some embodiments, the film member is provided with a hole portion, the cross section passes through the hole portion so that at least two cross sections are formed on the film member, and the effective width is the sum of the widths of at least two cross sections.
Further, the hole portion includes a plurality of hole units, and the plurality of hole units are disposed at intervals along the set direction.
Still further, each of the hole units includes at least one through hole, and the distribution of the through holes of the plurality of hole units obeys the health care set.
In some embodiments, the width of the plurality of hole units disposed along the set direction is gradually increased.
In particular, the widths of a plurality of said hole units follow a sequence of numbers, the sequence of the sequences is any one of an arithmetic sequence, a differential sequence, and a power sequence.
In some embodiments, the hole portion extends in the set direction, and the width of the hole portion gradually increases in the set direction.
Specifically, the hole walls of the hole parts positioned at two sides of the set direction are in arc transition or step transition.
In some embodiments, the film member is configured such that the width of the film member gradually decreases in the set direction.
Specifically, the ends of the film piece, which are positioned at the two sides of the set direction, are in arc transition or step transition.
In some embodiments, the film member includes a mass member and at least two beam members, one end of each of the beam members is connected to the anchor point and the other end is connected to the mass member, and a width of each of the beam members is gradually reduced along the set direction.
In some embodiments, the membrane element is configured as a beam or membrane.
Specifically, the beam body is a single-end clamped beam or a double-end clamped beam, wherein when the beam body is a double-end clamped beam, the set direction comprises a first direction and a second direction opposite to each other, the effective widths comprise two groups, one group of the effective widths is arranged along the first direction, and the other group of the effective widths is arranged along the second direction.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic view of a micromechanical thin film structure according to a first embodiment of the present invention;
FIG. 2 is a schematic view of a micromechanical thin film structure according to a second embodiment of the present invention;
FIG. 3 is a schematic view of a micromechanical thin film structure according to a third embodiment of the present invention;
FIG. 4 is a schematic view of a micromechanical thin film structure according to a fourth embodiment of the present invention;
FIG. 5 is a schematic view of a micromechanical thin film structure according to a fifth embodiment of the present invention;
FIG. 6 is a schematic view of a micromechanical thin film structure according to a sixth embodiment of the present invention;
FIG. 7 is a schematic view of a micromechanical thin film structure according to a seventh embodiment of the present invention;
FIG. 8 is a schematic view of a micromechanical thin film structure according to an eighth embodiment of the present invention;
FIG. 9 is a schematic view of a micromechanical thin film structure according to a ninth embodiment of the present invention;
FIG. 10 is a schematic view of a micromechanical thin film structure according to a tenth embodiment of the present invention;
fig. 11 is a schematic view of a micromechanical thin film structure according to an eleventh embodiment of the present invention.
Reference numerals:
100. a micromechanical thin film structure;
10. 20, anchor point seats;
30. 31 parts of film, 311 parts of hole, 312 parts of hole unit, 32 parts of through hole, 33 parts of mass and 33 parts of beam body.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly, for distinguishing between the descriptive features, and not sequentially, and not lightly.
In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The micromechanical thin-film structure 100 according to an embodiment of the present invention is described below with reference to the accompanying drawings.
As shown in fig. 1, a micromechanical thin-film structure 100 according to an embodiment of the present invention, the micromechanical thin-film structure 100 comprises a substrate 10, an anchor mount 20, and a thin-film member 30.
An anchor mount 20 is provided on the substrate 10. Wherein the substrate 10 material includes, but is not limited to, silicon, glass, quartz, and the like.
The thin film piece 30 is connected with the anchor point 20, the thin film piece 30 is provided with a set direction far away from the anchor point 20 and a plurality of effective widths which are sequentially arranged along the set direction, the effective width is the cross-section width or the sum of the cross-section widths of the thin film piece 30 on the cross-section perpendicular to the set direction, and the effective widths are gradually reduced along the set direction. It should be noted that, the farther away from the anchor point 20, the longer the moment arm is, the easier the deformation occurs, and the effective width of the thin film member 30 is reduced by designing the effective width of the thin film member 30 away from the anchor point 20, so as to reduce the magnitude of the electrostatic force applied to the thin film member and realize the uniformity of the stress.
When the film member 30 has the hole 31, the film member 30 has a plurality of cross-sectional widths in a cross-sectional plane perpendicular to the set direction, and it is understood that the hole 31 divides the cross-section into a plurality of cross-sectional widths, and the effective width is the sum of the plurality of cross-sectional widths.
For example, the anchor point 20 is located at the left end of the film member 30, the set direction is the left-right direction, the width of the film member 30 refers to the dimension of the film member 30 in the front-back direction, the film member 30 has a plurality of effective widths in the left-right direction, the effective width close to the anchor point 20 is large, the effective width far away from the anchor point 20 is small, so that the electrostatic force applied to the part far away from the anchor point 20, away from the film member 30, is small, and the stress on the whole film member 30 is uniform.
According to the micromechanical thin film structure 100 of the embodiment of the present invention, the effective width of the thin film member 30 is gradually reduced along the set direction, so that the stress on the thin film member 30 is uniformly distributed, and the stress concentration point is eliminated, thereby weakening the phenomena of fatigue, creep, plastic deformation, and the like, and improving the reliability.
As shown in fig. 1 to 4, in some embodiments, the film member 30 is provided with a hole portion 31, and the cross section passes through the hole portion 31 so that at least two cross sections are formed on the film member 30, and the effective width is the sum of the widths of the at least two cross sections, so that the effective width can fully represent the width of the film member 30 on the cross section, and the stress on the film member 30 is conveniently set. For example, the film member 30 is formed with two cross sections arranged front and back, the effective width is the width of the front cross section plus the width of the rear cross section, or the film member 30 is formed with three cross sections arranged front and back, the effective width is the width of the front cross section plus the width of the middle cross section plus the width of the rear cross section. Of course, there may be more cross sections, for example, four, five, etc., and the effect is the same as that of two cross sections and three cross sections, and will not be described here again.
As shown in fig. 1 to 2, further, the hole portion 31 includes a plurality of hole units 311, the plurality of hole units 311 are disposed at intervals in the set direction, and processing of the hole portion 31 is facilitated by disposing the plurality of hole units 311 at intervals in the set direction. For example, the setting direction is the left-right direction, and the hole portion 31 includes five hole units 311, and the five hole units 311 are arranged at intervals in order from left to right. Of course, the hole portion 31 may also include two hole units 311, three hole units 311, four hole units 311, or even more hole units 311, which are all possible, and the specific effects are the same as those described above, and are not described here again.
As shown in fig. 1, each hole unit 311 further includes at least one through hole 312, the distribution of the through holes 312 of the plurality of hole units 311 is compliant with the contuo set, and by setting the distribution of the through holes 312 of the plurality of hole units 311 to be compliant with the contuo set, the effect of stress uniformity is further improved, and the manufacturing is facilitated.
The contutor set may be a contutor tri-diversity set, a generalized contutor set, and the through holes 312 of the hole units 311 may be the first several items obeying the contutor set, or may be the middle item obeying the contutor set. For example, five hole units 311 are disposed on the film member 30 from left to right, and counted from left to right, the first hole unit 311 includes sixteen through holes 312, the second hole unit 311 includes eight through holes 312, the third hole unit 311 includes four through holes 312, the fourth hole unit 311 includes two through holes 312, and the fifth hole unit 311 includes one through hole 312, and the through holes 312 obey the first five items of the convalescence set. Of course, four hole units 311 may be further disposed on the film member 30 from left to right, and counted from left to right, the first hole unit 311 includes sixteen through holes 312, the second hole unit 311 includes eight through holes 312, the third hole unit 311 includes four through holes 312, the fourth hole unit 311 includes two through holes 312, and the through holes 312 obey the middle four items of the convalescence set. The film member 30 may be further provided with through holes 312 in other manners similar to those described above, and will not be described herein.
As shown in fig. 2, in some embodiments, the width of the plurality of hole units 311 disposed in the set direction is gradually increased, and uniformity of stress is achieved by gradually increasing the width of the plurality of hole units 311 in the set direction. For example, the setting direction is a left-right direction, five hole units 311 are provided on the film member 30 from left to right, and the widths of the five hole units 311 gradually increase from left to right.
As shown in fig. 2, in particular, the widths of the plurality of hole units 311 follow a sequence of numbers, achieving an effect of uniform stress on the film member 30.
Alternatively, the process may be carried out in a single-stage, the series of series is any one of an equal ratio series, an equal difference series, a difference ratio series, and a power series. For example, the number sequence may be an equal ratio number sequence, or the number sequence may be an equal difference number sequence, or the number sequence may be a difference ratio number sequence, or the number sequence may be a power number sequence, or the number sequence may be another number sequence, which is not described herein.
As shown in fig. 3 and 4, in some embodiments, the hole portion 31 extends along the set direction, and the width of the hole portion 31 gradually increases along the set direction, and the effect of uniform stress on the film member 30 is achieved by providing the width of the hole portion 31 to gradually increase along the set direction. For example, the setting direction is the left-right direction, the hole 31 extends rightward, and the width of the hole 31 gradually increases from left to right.
As shown in fig. 3 and 4, specifically, the hole walls of the hole portion 31 located at two sides of the set direction are in arc transition or step transition, and the arc transition or step transition is provided to facilitate the processing of the hole portion 31. For example, the setting direction is the left-right direction, the hole walls of the hole portion 31 on both sides in the left-right direction are front-rear hole walls, the front-rear hole walls are arc-shaped transitions, the width of the hole portion 31 gradually changes in the left-right direction, or the front-rear hole walls are step transitions, the width of the hole portion 31 changes one step in the left-right direction.
As shown in fig. 5 and 6, in some embodiments, the membrane 30 is configured such that the width of the membrane 30 decreases gradually in the set direction, and by configuring the membrane 30 such that the width thereof decreases gradually in the set direction, the effect of the membrane 30 receiving less electrostatic force is achieved in the portion thereof away from the anchor point 20.
As shown in fig. 5 and 6, specifically, the ends of the thin film member 30 located on both sides in the set direction are arc-shaped transition or step transition. For example, the setting direction is the left-right direction, the ends of the film member 30 on both sides in the left-right direction are front-rear ends, the front-rear ends are arc-shaped transitions, the width of the film member 30 is gradually changed in the left-right direction, or the front-rear ends are step-shaped transitions, the width of the film member 30 is changed in one step in the left-right direction.
As shown in fig. 7, in some embodiments, the membrane element 30 includes a mass element 32 and at least two beam elements 33, one end of each beam element 33 is connected to the anchor 20 and the other end is connected to the mass element 32, and the width of each beam element 33 gradually decreases along the set direction, so that the weight is borne by at least two beam elements 33 together, and the pressure applied to the single beam element 33 is reduced. For example, the set direction is a left-right direction, the number of beam members 33 is two, the two beam members 33 are distributed back and forth, the left end of each beam member 33 is connected with the anchor point 20, and the right end of each beam member 33 is connected with the same mass block. Or the number of the beam body pieces 33 is three, the three beam body pieces 33 are distributed in the front-back direction, the left end of each beam body piece 33 is connected with the anchor point seat 20, and the right end of each connected piece is connected with the same mass block. Of course, the beam 33 may be more, for example, four, five, etc., and will not be described here.
As shown in fig. 1-8, in some embodiments, the membrane element 30 is configured as a beam or membrane, and by configuring the membrane element 30 as a beam or membrane for structural actuation and signal sensing, the effect of the micromechanical membrane structure 100 is fully exerted. For example, the membrane element 30 is configured as a beam, and it is understood that the beam of the MEMS device is thin and small, and can be regarded as an elongated membrane element 30, with the set direction being the length direction of the beam, or the membrane element 30 is configured as a membrane, with the set direction being the radial direction. The film may be a circular film or a polygonal film, which is not described herein.
As shown in fig. 9 to 11, specifically, the beam body is a single-end clamped beam or a double-end clamped beam, where when the beam body is a double-end clamped beam, the set direction includes a first direction and a second direction opposite to the first direction, the plurality of effective widths includes two groups, one of the two groups of effective widths is set along the first direction, and the other group is set along the second direction, and by setting the first direction and the second direction, an effect of uniform stress on the double-end clamped beam is achieved, and the application range is enlarged. For example, the setting direction is a left-right direction, the first direction is a left-right direction, the second direction is a right-left direction, one of the two groups of effective widths gradually decreases from left to right, and the other group of effective widths gradually decreases from right to left. Of course, the beam body may be a three-terminal clamped beam, a four-terminal clamped beam or more terminal clamped beams, which will not be described herein.
One embodiment of a micromechanical thin-film structure 100 according to the present invention is described below in connection with fig. 1-11.
A micromechanical membrane structure 100 comprises a substrate 10, an anchor 20 and a membrane 30.
The material of the substrate 10 is silicon. An anchor mount 20 is provided on the substrate 10. The film piece 30 is a single-ended clamped beam, the left end of the film piece 30 is connected to the anchor point 20, the film piece 30 is provided with a hole part 31, the hole part 31 comprises five hole units 311, the five hole units 311 are arranged from left to right, the first hole unit 311 comprises sixteen through holes 312, the second hole unit 311 comprises eight through holes 312, the third hole unit 311 comprises four through holes 312, the fourth hole unit 311 comprises two through holes 312, the fifth hole unit 311 comprises one through hole 312, and the number and the width of the through holes 312 meet the first five items of the health care set.
Other constructions and operations of the micromechanical thin-film structure 100 according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.
In the description herein, reference to the term "embodiment," "example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.
Claims (3)
1. A micromechanical thin film structure of a MEMS device, comprising:
A substrate;
The anchor point seat is arranged on the substrate;
The film piece is connected with the anchor point seat, the film piece is provided with a setting direction far away from the anchor point seat and a plurality of effective widths which are sequentially arranged along the setting direction, the effective widths are the cross section widths or the sum of the cross section widths of the film piece on a section perpendicular to the setting direction, and the effective widths are gradually reduced along the setting direction;
The hole part comprises a plurality of hole units, and the hole units are arranged at intervals along the set direction; the hole part comprises a plurality of hole units, wherein the width of the hole units arranged along the set direction gradually increases, and the width of the hole units obeys a sequence of sequences of numbers, which are any one of an equal ratio sequence, an arithmetic sequence, a difference ratio sequence and a power sequence;
The hole part extends along the set direction, the width of the hole part gradually increases along the set direction, and the hole walls of the hole part positioned at two sides of the set direction are in arc transition or step transition.
2. The micromechanical thin-film structure of a MEMS device according to claim 1, characterized in that the thin-film piece is configured as a beam or a thin-film.
3. The MEMS device micro-mechanical membrane structure of claim 2, wherein the beam body is a single-ended clamped beam or a double-ended clamped beam, wherein the set direction includes a first direction and a second direction opposite to each other when the beam body is a double-ended clamped beam, the plurality of effective widths includes two groups, one of the two groups being arranged along the first direction, and the other group being arranged along the second direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210061112.2A CN114477068B (en) | 2022-01-19 | 2022-01-19 | Micromechanical thin film structures of MEMS devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210061112.2A CN114477068B (en) | 2022-01-19 | 2022-01-19 | Micromechanical thin film structures of MEMS devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114477068A CN114477068A (en) | 2022-05-13 |
| CN114477068B true CN114477068B (en) | 2025-02-07 |
Family
ID=81473283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210061112.2A Active CN114477068B (en) | 2022-01-19 | 2022-01-19 | Micromechanical thin film structures of MEMS devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114477068B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021242443A1 (en) * | 2020-05-26 | 2021-12-02 | Microsoft Technology Licensing, Llc | Thin film actuator having transversely oriented structural stiffeners to increase actuator stroke |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0605576D0 (en) * | 2006-03-20 | 2006-04-26 | Oligon Ltd | MEMS device |
| CN101559913A (en) * | 2009-05-15 | 2009-10-21 | 中国科学院上海微系统与信息技术研究所 | Structure for increasing strength and service life of deformable beam and application thereof |
| US9679856B2 (en) * | 2014-03-07 | 2017-06-13 | Infineon Technologies Ag | System and method for a microfabricated fracture test structure |
| CN105321821B (en) * | 2014-07-11 | 2018-09-25 | 中国科学院上海微系统与信息技术研究所 | Adjustable suspension strain film structure of stress and preparation method thereof |
-
2022
- 2022-01-19 CN CN202210061112.2A patent/CN114477068B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021242443A1 (en) * | 2020-05-26 | 2021-12-02 | Microsoft Technology Licensing, Llc | Thin film actuator having transversely oriented structural stiffeners to increase actuator stroke |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114477068A (en) | 2022-05-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8146424B2 (en) | Systems and methods for an inertial sensor suspension that minimizes proof mass rotation | |
| WO2021223886A1 (en) | Mems for interacting with a volumetric flow in a highly efficient manner | |
| JPWO2004017119A1 (en) | Micro oscillating device with torsion bar | |
| EP3657231B1 (en) | Actuator device | |
| KR20040021690A (en) | A microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in mems | |
| JP6125514B2 (en) | Variable capacitance accelerometer with meandering flexure | |
| CN114477068B (en) | Micromechanical thin film structures of MEMS devices | |
| EP3979487A1 (en) | Stacked electrostatic actuator | |
| JP2011100103A (en) | Light deflection element, light deflector including the same, and method for producing the same | |
| EP1338553B1 (en) | Torsion spring for mems structure | |
| JP6948604B2 (en) | MEMS resonator with suppressed spurious mode | |
| JPH05172843A (en) | Semiconductor acceleration sensor | |
| US20080197752A1 (en) | Stress sensitive element | |
| EP4167461A1 (en) | Laminated-type electrostatic actuator | |
| CN107976557B (en) | Micromechanical z-acceleration sensor | |
| EP2433106B1 (en) | Resonant sensor | |
| CN114477069B (en) | Micromechanical thin film structure of MEMS device and MEMS device | |
| KR100710791B1 (en) | Micro rocking element and micro mirror element with torsion bar | |
| JPS6157825A (en) | Multiaxial force sensor | |
| CN103335892A (en) | Off-chip bending test microstructure for multiple testing beams | |
| CN113348348B (en) | Pressure Sensor | |
| CN218217326U (en) | MEMS resonator and vibrating arm assembly thereof | |
| CN116062678A (en) | MEMS micro-mirror anti-fatigue electric interconnection device | |
| US20050205949A1 (en) | Semiconductor device having moving part | |
| WO2011024449A1 (en) | Acceleration sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |