CN114466585A

CN114466585A - Ball mounting production line for BGA chip

Info

Publication number: CN114466585A
Application number: CN202210045273.2A
Authority: CN
Inventors: 闻权; 钟鹏
Original assignee: Shenzhen Zhuo Mao Technology Co ltd
Current assignee: Shenzhen Zhuo Mao Technology Co ltd
Priority date: 2022-01-15
Filing date: 2022-01-15
Publication date: 2022-05-10
Anticipated expiration: 2042-01-15
Also published as: CN114466585B

Abstract

The invention particularly discloses a Ball Grid Array (BGA) chip ball mounting production line which comprises a feeding device, a printing device, a ball mounting device and a laminating device which are sequentially arranged along the production line; the feeding device is used for placing the BGA into the jig and sending the jig loaded with the BGA to the printing device; the printing device is provided with a conveying flow channel, and the conveying flow channel can convey the printed BGA to the ball planting device; the ball planting device is used for carrying out ball planting operation on the printed BGA and sending the BGA subjected to ball planting to the attaching device; the laminating device is used for laminating the BGA to the corresponding position of the PCB. The invention can realize the purposes of automatic feeding, ball supply and mounting, and improves the automation degree; meanwhile, the invention forms a production line with reasonable layout, the whole production process has less manual interference, the production efficiency is greatly improved, and the produced product has better quality.

Description

Ball mounting production line for BGA chip

Technical Field

The invention relates to the technical field of BGA (ball grid array) ball mounting, in particular to a ball mounting production line of a BGA chip.

Background

With the advent of the information age, the electronic information industry has been rapidly developed globally, electronic information products have become necessities of human life, and the development of the electronic information industry brings great convenience to human life. Along with the rapid development of the electronic industry, the integration capability of electronic products is continuously improved, and the electronic products have increasingly powerful functions and increasingly miniaturized volumes. The overall arrangement of electron component is compacter and more compact, also promotes increasingly to BGA's technological requirement, template method and ball planting ware method based on current traditional ball planting technology, through artifical ball, artifical laminating and the artifical method of going up the tool, not only need add a large amount of manpower and materials in the in-process of planting the ball, still can lead to planting the ball yield and hang down and consume a large amount of time, because of artificial intervention too much at the in-process of operation simultaneously, also there is very big drawback to personnel's potential safety hazard. In addition, the traditional BGA chip ball-planting production line is unreasonable in layout and low in production efficiency, and the produced product is poor in quality and cannot be guaranteed. With the improvement of the technological requirements, the traditional ball planting production line is difficult to meet the automation performance of the existing ball planting equipment. Therefore, a novel BGA chip ball mounting production line is provided.

Disclosure of Invention

The invention aims to provide a ball mounting production line of a BGA chip, and aims to improve the automation degree and the product quality of ball mounting of the BGA chip.

In order to achieve the purpose, the application provides a ball mounting production line of a BGA chip, which comprises a feeding device, a printing device, a ball mounting device and a bonding device which are sequentially arranged along the production line;

the feeding device is used for placing the BGA into the jig and sending the jig loaded with the BGA to the printing device; the printing device is provided with a conveying flow channel, and the conveying flow channel can convey the printed BGA to the ball planting device; the ball planting device is used for carrying out ball planting operation on the printed BGA and sending the BGA subjected to ball planting to the attaching device; the attaching device is used for attaching the BGA to the corresponding position of the PCB.

Further, the loading attachment includes:

a feeding rack;

the lifting magazine assembly is used for storing a tooling plate loaded with BGA;

the feeding connection assembly is arranged on the feeding rack and comprises a connection table, the connection table is provided with a first position, and the feeding connection assembly is used for conveying a tool disc in the lifting material box assembly to the first position; after the material taking component grabs the BGA in the tool disc, the material loading connection component drives the no-load tool disc to move from the first position to the material lifting box component so as to recover the tool disc;

a pull hook assembly having a second position for carrying a jig, at least a portion of the pull hook assembly being configured to be movably disposed; and

and the material taking assembly is at least partially movably arranged on the feeding rack and is used for sucking the BGA in the tool disc and sending the BGA to the tool.

Further, the material loading connection assembly further comprises:

the first horizontal moving part is arranged on the connecting table and used for driving the clamping claw part to move along the length direction of the connecting table; and

and the clamping claw part is connected with the first horizontal moving part and is used for clamping a tool disc in the lifting magazine assembly and conveying the tool disc to a first position.

Further, the ball mounting device includes:

the device comprises a first base, a second base and a third base, wherein the first base is provided with a ball planting station and a detection station;

the ball-planting connection assembly is in butt joint with a conveying flow channel of the printing device and comprises a first connection assembly and a second connection assembly which are all capable of conveying jigs, the first connection assembly is used for receiving jigs loaded with BGA (ball grid array), the second connection assembly is used for receiving empty jigs or jigs finished by ball planting, the ball-planting connection assembly can be switched between a first state and a second state, when the ball-planting connection assembly is in the first state, the first connection assembly is in butt joint with the conveying flow channel, and when the ball-planting connection assembly is in the second state, the second connection assembly is in butt joint with the conveying flow channel;

the jig platform assembly is arranged on the ball planting station;

the clamping jaw assembly is used for clamping a jig on the first connection assembly and conveying the jig to the jig platform assembly;

the ball planting assembly is used for carrying out ball planting operation on the BGA on the ball planting station;

the first detection assembly is arranged on the detection station and used for detecting the BGA and outputting NG and OK results of ball planting; or

And the ball supply assembly is arranged on the base and used for supplying balls to the ball planting assembly.

Further, the jig platform assembly is provided with a linear motor platform and a bearing assembly arranged on the linear motor platform and used for bearing a jig, and the linear motor platform is used for driving the bearing assembly to move.

Further, the bearing assembly comprises:

the first mounting seat is arranged on the linear motor platform;

the fixture is fixed on the bearing plate, and a vacuum adsorption unit is arranged on the bearing plate;

the first rotating unit is arranged on the first mounting seat and is used for driving the bearing plate to rotate; and

and the positioning unit is arranged on the bearing plate and is used for positioning the jig.

Further, the ball supply assembly includes:

a third support frame;

the second rotating unit is arranged on the third supporting frame and is used for driving the storage bin to rotate;

the bin is provided with a ball inlet and a ball outlet, and the ball outlet is arranged towards the ball planting station;

the weighing piece is used for acquiring weight information of the solder balls provided to the ball planting station, acquiring weight information of the solder balls in the storage bin and feeding the weight information back to the prompt piece;

a prompt;

the control part is arranged on the supporting frame, the control part is respectively connected with the weighing part and the prompting part, and the control part controls the prompting part to perform ball adding prompting according to the weight information of the solder balls in the storage bin.

Further, the attaching device includes:

a second base;

the laminating platform assembly is arranged on the second base;

the conveying assembly is arranged on the second base and used for conveying the PCB to the fitting platform assembly;

the second detection assembly is used for photographing and height measuring the PCB on the laminating platform assembly;

the third detection assembly is arranged on the second base and used for photographing and height measuring the BGA product subjected to ball planting;

and the material conveying assembly is used for conveying the BGA product to the position above the third detection assembly and the fitting platform assembly.

Further, the fit platform assembly includes:

the second supporting seat is arranged on the second base;

the PCB is fixed on the laminating platform;

the first lifting unit is arranged on the second supporting seat and is used for driving the laminating platform to move up and down;

the blocking unit is used for blocking the PCB positioned on the attaching platform;

and the clamping unit is used for clamping the PCB.

Further, still include the reinspection device, the reinspection device is used for fixing a position the detection of shooing to the product that the laminating is accomplished.

Compared with the prior art, the invention has the beneficial effects that:

according to the invention, the feeding device, the printing device, the ball planting device and the attaching device are matched with each other, so that no jig is required to be manually loaded, balls are manually supplied and the balls are manually attached, the purposes of automatic feeding, ball supplying and attaching in the production process are realized, the automation degree and the working efficiency are improved, and manpower and material resources are reduced; meanwhile, the invention forms a production line with reasonable layout, the whole production process has less manual interference, the production efficiency is greatly improved, and the produced product has better quality.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic view of a BGA chip bumping production line, according to some embodiments of the present invention;

FIG. 2 is a schematic view of a feeding device for a BGA chip ball mounting production line according to some embodiments of the present invention;

FIG. 3 is a schematic view of an elevating magazine assembly according to some embodiments of the invention;

fig. 4 is a schematic view of a loading interface assembly according to some embodiments of the invention;

FIG. 5 is a schematic view of a take-off assembly according to some embodiments of the invention;

FIG. 6 is a schematic view of a pull hook assembly according to some embodiments of the present invention;

FIG. 7 is a schematic view of a ball placement device according to some embodiments of the invention;

fig. 8 is a schematic view of a ball-mounted docking assembly according to some embodiments of the present invention;

FIG. 9 is a schematic view of a first detection assembly according to some embodiments of the invention;

fig. 10 is a schematic view of a jig platform assembly according to some embodiments of the invention;

FIG. 11 is a schematic view of a load bearing assembly according to some embodiments of the present invention;

FIG. 12 is a schematic view of a ball placement assembly and a ball supply assembly according to some embodiments of the invention;

FIG. 13 is a schematic view of a ball supply assembly according to some embodiments of the present invention;

FIG. 14 is a block schematic diagram of a ball supply assembly according to some embodiments of the invention;

FIG. 15 is a schematic view of a doubler according to some embodiments of the present invention;

FIG. 16 is a schematic view of a transport assembly and a conformable platform assembly, according to some embodiments of the present disclosure;

FIG. 17 is a schematic view of a conformable platform assembly according to some embodiments of the present disclosure;

FIG. 18 is a schematic view of a material handling assembly and a second detection assembly according to some embodiments of the invention;

FIG. 19 is a schematic view of a third detection assembly according to some embodiments of the invention;

fig. 20 is a schematic diagram of a ball placement device and a review device according to some embodiments of the invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

The following describes a ball mounting production line of a BGA chip according to an embodiment of the present invention with reference to the accompanying drawings. As shown in fig. 1 and 3, the BGA chip ball mounting production line according to the embodiment of the present invention includes a feeding device 1, a printing device 2, a ball mounting device 3, and a bonding device sequentially arranged along the production line, wherein the feeding device 1 is configured to place a BGA into a fixture and send the fixture loaded with the BGA onto the printing device 2; the printing device 2 is provided with a conveying flow channel which can convey the printed BGA to the ball planting device 3; the ball planting device 3 is used for carrying out ball planting operation on the printed BGA and sending the BGA subjected to ball planting to the attaching device; the attaching device is used for attaching the BGA to the corresponding position of the PCB.

Therefore, the BGA chip ball-planting production line provided by the embodiment has the advantages that the feeding device, the printing device, the ball-planting device and the attaching device are matched with one another, no jig is needed to be manually fed, balls are manually supplied and the balls are manually attached, the purposes of automatic feeding, ball supplying and attaching in the production process are achieved, the automation degree and the working efficiency are improved, and manpower and material resources are reduced; meanwhile, the invention forms a production line with reasonable layout, the whole production process has less manual interference, the production efficiency is greatly improved, and the produced product has better quality.

First, the loading apparatus 1 will be explained in detail:

as shown in fig. 2, the feeding device 1 includes a feeding rack 10, at least one material lifting and receiving box assembly 11, a feeding and connecting assembly 12, a pulling hook assembly 13, and a material taking assembly 14; the lifting magazine assembly 11 is used for storing a tool tray loaded with BGA; the feeding connection assembly 12 is arranged on the feeding rack 10, the feeding connection assembly 12 comprises a connection table 120, the connection table 120 is provided with a first position, and the feeding connection assembly 12 is used for conveying a tooling plate in the lifting magazine assembly 11 to the first position; after the material taking component 14 has grabbed the BGA in the tooling plate, the material loading and connecting component 12 drives the empty tooling plate to move from the first position to the material lifting box component 11 so as to recover the tooling plate; the pulling hook component 13 has a second position for carrying the jig, and at least part of the pulling hook component 13 is configured to be movably arranged; the material taking assembly 14 is at least partially movably arranged on the material loading rack 10, and the material taking assembly 14 is used for sucking the BGA in the tool tray and sending the BGA to the tool. Wherein, the tool disc is a tray disc.

Therefore, the feeding device provided by the embodiment has the advantages that the feeding connection assembly 12 is used for movably arranging the tool disc on the connection table 120, the feeding and returning of the tool disc are facilitated, the material taking assembly 14 is used for grabbing the BGA in the tool disc for feeding, the whole structure of the feeding device is simple, the automatic feeding of the BGA is realized, the working efficiency is greatly improved, and the cost is saved.

As shown in fig. 3, specifically, the elevating magazine assembly 11 includes a first support frame 110, a first elevating portion 111, a material frame 112, and a material frame sensor 113; the first support frame 110 is arranged on the feeding frame 10; the first lifting part 111 is arranged on the first support frame 110; the material frame 112 is connected with the first lifting part 111; the material frame sensor 113 is disposed on the material frame 112.

Furthermore, in order to prevent the tray inside the material frame from accidentally falling during the manual transportation process, the material frame 112 has a material frame blocking strip portion capable of being set in a poking manner, and the material frame 112 is provided with a blocking strip sensor 114, and the blocking strip sensor 114 is used for detecting whether the material frame blocking strip portion is poked in place. The material frame blocking strip part can be manually pressed to shift the material frame blocking strip part to another clamping groove position, and it should be understood that the material frame blocking strip part does not obstruct the in and out of a tray disc in the material frame when the clamping groove position is reached, and if the material frame blocking strip part is not shifted in place, the blocking strip sensor 114 does not sense the situation, an alarm prompt is given.

Therefore, the material frame stop strip part, the stop strip sensor 114 and the material frame sensor 113 are arranged, so that the material frame 112 is ensured not to fall off and can normally operate in the process of artificial transportation.

As shown in fig. 4, the loading and docking assembly 12 further includes a first horizontal moving portion 121 and a clamping jaw portion 122; the first horizontal moving part 121 is disposed on the docking station 120, and the first horizontal moving part 121 is configured to drive the clamping claw part 122 to move along the length direction of the docking station 120; the clamping jaw portion 122 is connected to the first horizontal moving portion 121, and the clamping jaw portion 32 is used for clamping a tooling plate in the elevating magazine assembly 11 and transporting the tooling plate to a first position. The tray in the material frame is pulled out and sent to the first position by the claw part 122 matching with the first lifting part 111 in the lifting material box assembly 11.

Therefore, when all BGA products in one tray are taken away, the tray is returned to the initial position by the clamping jaw part 3, the material frame 112 is lifted by one layer, the clamping jaw part 122 carries the next tray filled with BGA products to the first position, and the circulation operation is performed, when all the materials in the material frame in the lifting material box component 11 are lifted, the equipment stops operating and alarms, the material frame blocking part is manually pressed, and the frame blocking part is shifted to the tray blocking position (the tray blocking position can prevent the tray in the material frame 112 from falling after the material frame 112 is taken away).

Further, a first material sensor 123 is disposed on the docking station 120.

As shown in fig. 5, the material taking assembly 14 includes a material sucking part 140, a detecting part, a mounting seat 142 and a second horizontal moving part 143, wherein the material sucking part 140 is used for sucking the BGA in the tool tray at the first position to the tool at the second position; the detection part is used for detecting whether the BGA is put into the jig or not; the mounting seat 142 is arranged on the feeder frame 10; the second horizontal moving portion 143 is disposed on the mounting base 142, and the second horizontal moving portion 143 is used for driving the material sucking portion 140 to move along the length and width directions of the mounting base 142.

It should be appreciated that to allow for more precise operation of the take-off assembly 14, the take-off assembly 14 may be equipped with a splined shaft as well as a speed reducer standard.

According to some embodiments of the present invention, the suction part 140 includes a second lifting part 1400, a rotating part 1401, and a suction cup part 1402; the second lifting unit 1400 is connected to the second horizontal moving unit 143; the rotating unit 1401 is connected to the second lifting unit 1400; the suction cup portion 1402 is connected to the rotation portion 1401. In order to be able to effectively protect the product in the process of taking the material and placing the material, the suction cup portion 1402 is a suction cup with a buffering and anti-static function.

According to some embodiments of the present invention, the detection section includes a positioning vision CCD section 141 and a laser sensor 144; the positioning vision CCD part 141 is arranged on the feeding rack 10; the laser sensor 144 is provided on the chuck section 1402, and the laser sensor 144 detects the height of the four corners of the BGA.

Inhale dish portion 1402 and absorb the BGA product from the tray dish, then utilize location vision CCD portion 141 to carry out the CCD location, drive the BGA product through rotating part 1401 and rotate in order to carry out the correction of angle and the correction of position, put into the acupuncture point that the tool on the second position corresponds after the correction, laser sensor 144 carries out the height finding to four angles of BGA product, if the measuring height wherein surpasss the high certain scope of demarcation height (explanation BGA product perk more), can indicate to report to the police, manual intervention puts the BGA product right, thereby ensure that the BGA product is accurately put into in the tool acupuncture point that corresponds.

As shown in fig. 6, the hook assembly 13 includes a first supporting seat 130, a third horizontal moving portion 131, a third elevating portion 132, a hook portion 133 and a blocking portion 134; the first supporting seat 50 is arranged on the feeding rack 1; the third horizontal moving part 131 is disposed on the first supporting base 130; the third lifting unit 132 is connected to the third horizontal moving unit 131; the hook pulling part 133 is connected to the third lifting part 132; the blocking portion 134 is disposed on the first supporting seat 130, and the blocking portion 134 is a blocking cylinder. In addition, a second material sensor 135 and a positioning cylinder 136 are provided on the first supporting base 130.

Therefore, after the BGA product is fed to the jig, the pulling hook assembly 13 is used for transporting the jig at the second position, and the jig enters the conveying device 5 through a flow channel mode. Meanwhile, it should be understood that after the conveying device 5 returns to the empty jig, the empty jig is moved to the jig blocking position by the pull hook assembly 13, and the blocking cylinder is used for positioning the jig.

The pachinko device 3 is described in detail below:

as shown in fig. 7 and 8, the ball-mounting device 3 includes a first base 30, a first detecting component 31, a ball-mounting connecting component 35, a clamping jaw component, a jig platform component 32, a ball-mounting component 33, or a ball-supplying component 34; the first base 30 is provided with a ball planting station and a detection station; the first detection component 31 is arranged at the detection station, and the first detection component 31 is used for detecting BGA and outputting NG and OK results of ball planting; the ball-planting connection assembly 35 is in butt joint with a conveying flow channel of the printing device 2, the ball-planting connection assembly 35 comprises a first connection assembly 350 and a second connection assembly 351 which are both conveyable jigs, the first connection assembly 350 is used for receiving jigs loaded with BGA, the second connection assembly 351 is used for receiving empty jigs or jigs completed with ball planting, the ball-planting connection assembly 35 can be switched between a first state and a second state, when the ball-planting connection assembly is in the first state, the first connection assembly 350 is in butt joint with the conveying flow channel, and when the ball-planting connection assembly is in the second state, the second connection assembly 351 is in butt joint with the conveying flow channel; the clamping jaw assembly is used for clamping a jig on the first connection assembly 350 and sending the jig to the jig platform assembly 32, the jig platform assembly 32 is arranged on a ball planting station, the jig platform assembly 32 is provided with a linear motor platform 320 and a bearing assembly 321 which is arranged on the linear motor platform 320 and used for bearing the jig, and the linear motor platform 320 is used for driving the bearing assembly 321 to transfer between the ball planting station and a detection station; the ball mounting component 33 is used for carrying out ball mounting operation on the BGA on the ball mounting station; the ball supply assembly 34 is disposed on the first base 30, and the ball supply assembly 34 is used for supplying balls to the ball mounting assembly 33.

It should be understood that, after the BGA is loaded to the jig, the jig enters the printing device in a flow channel manner to perform Mark point positioning and then print the flux paste, after printing, the jig carrying the BGA is transported to the first docking assembly 350 in a flow channel manner, and the printing device 2 performs steel mesh cleaning; then, the clamping jaw assembly conveys the jig carrying the BGA on the first plugging assembly 350 to the linear motor platform 320, clamping and positioning are carried out, the ball planting assembly is used for planting the BGA, the jig with the planted balls is conveyed to the second plugging assembly 351 through the clamping jaw assembly, the first detection assembly is used for detecting the BGA with the planted balls, the BGA with the planted balls OK enters the laminating device, the jig on the second plugging assembly 351 is in an idle-load state at the moment, and the empty jig on the second plugging assembly 351 flows back to the feeding device through a conveying flow channel of the printing device 2. In addition, in an initial state, an empty jig is placed on the second connection assembly 351, after the jig is conveyed to the linear motor platform by the clamping jaw assembly, meanwhile, the conveying flow channel of the printing device 2 is switched to be in butt joint with the second connection assembly 351, the empty jig on the second connection assembly 351 flows back to the feeding device through the conveying flow channel of the printing device 2, and then feeding is waited, so that circulation of the two jigs in the device is achieved, and efficient operation of the device is achieved.

Therefore, the ball planting device 3 that this embodiment provided, through setting up tool platform subassembly 32, the 320 platforms of linear electric motor in the tool platform subassembly 32 drive the tool and transport between ball planting station and detection station, need not the manual work and go up the tool, are provided with simultaneously and supply ball subassembly 34, realize planting the automatic purpose that supplies the ball of ball in-process, have improved degree of automation and work efficiency, reduce manpower and materials.

The linear motor platform 320 can drive the bearing component 321 to move left and right and back and forth, and the linear motor platform 320 has the advantages of high speed, high precision and high response speed.

As shown in fig. 9, the first detecting assembly 31 includes a second supporting frame 310 disposed on the first base 31, a first lifting unit 311, and an AOI detecting unit 312; the first lifting unit 311 is disposed on the second support frame 310; the AOI detection unit 312 is connected with the first lifting unit 311, the first lifting unit 311 drives the AOI detection unit 312 to move up and down, the AOI detection unit 312 can adopt a high-pixel high-resolution CCD, the CCD is used for photographing, the position information of each welding pad point in the BGA before and after ball planting is picked up, and the quality and the yield of output products are ensured.

As shown in fig. 10 and 11, the bearing assembly 321 includes a first mounting seat 3210 disposed on the linear motor platform 320, a bearing plate 3211, a first rotating unit 3212, and a positioning unit 3213, wherein the bearing plate 3211 is provided with a vacuum absorbing unit 3214; the bearing plate 3211 is disposed on the first mounting seat 3210; the jig is fixed on the bearing plate 3211 in an adsorption manner; the first rotating unit 3212 is disposed on the first mounting seat 3210, and the first rotating unit 3212 is configured to drive the supporting plate 3211 to rotate; the positioning unit 3213 is disposed on the carrier plate 3211, the positioning unit 3213 is configured to position the fixture, and the positioning unit 3213 is a positioning cylinder.

Therefore, after the jig to be provided with the BGA is operated to the bearing plate 3211, the positioning is automatically completed through the positioning cylinder, the vacuum on the bearing plate 3211 is started, the jig is adsorbed on the bearing plate 3211, the BGA positioning on the jig and the jig is completed and fixed, and the relative position is prevented from changing. Because the tool is fixed in on the loading board 3211 through the adsorption mode, consequently can compatible multiple size product to can realize changing the tool.

According to some embodiments of the present invention, the first rotating unit 3212 includes a servo motor 32120 and a harmonic reducer 32121 disposed on the first mounting seat 3210, and the servo motor 32120, the harmonic reducer 312121 and the bearing assembly 321 are sequentially connected. The bearing component 321 is driven by the combination of the servo motor and the harmonic reducer, and can swing left and right within a certain angle range.

As shown in fig. 12, the ball-mounting assembly 33 includes a second mounting seat 330, a clamping unit 331 and a brush unit 332; the clamping unit 331 is arranged on the second mounting seat 330, and the clamping unit 331 is used for clamping a steel mesh; the brush unit 332 is disposed on the second mounting base 330 to move up and down, left and right, and the brush unit 332 is used for removing the excess solder balls on the steel mesh.

According to some embodiments of the present invention, the brush unit 332 includes a left and right moving unit 3320, a second lifting unit 3321, a brush 3322, and an adjusting unit; the left-right moving unit 3320 drives the second lifting unit 3321 and the brush 3322 to move left and right, the second lifting unit 3321 is used for driving the brush 442 to move up and down, and the brush 3322 can be an anti-static brush; the adjusting unit includes a first differential adjusting head 3323 and a second differential adjusting head 3324 respectively connected to a brush 3322, and the first differential adjusting head 3323 and the second differential adjusting head 3324 are used to adjust the position of the brush 3322 in the horizontal direction. The position of the brush 3322 can be adjusted for products with different sizes by the mutual matching of the left-right moving unit 3320 and the second lifting unit 441; meanwhile, the position of the brush 3322 is accurately adjusted through the first adjusting differential head 3323 and the second adjusting differential head 3324.

Further, the clamping unit 331 is connected with a protection unit, the protection unit comprises a middle sealing electromagnetic valve and a pilot type one-way valve, and the clamping unit 331 can be always in a clamping state under the action of the middle sealing electromagnetic valve and the pilot type one-way valve, so that the steel mesh is prevented from falling.

As shown in fig. 13 and 14, the ball supply assembly 34 includes a third support frame 340, a second rotating unit 341, a bin 342, a weighing member 343, a prompting member 344, and a control member 345.

Wherein, second rotary unit 341 sets up on third support frame 340, and feed bin 342 and second rotary unit 341 are connected, and second rotary unit 341 can drive feed bin 3420 and rotate, is provided with spacing sensor 349 on the support frame 340, and spacing sensor 349 is used for detecting the turned angle of feed bin 342 and feeds back it to second rotary unit 341, can accurate control feed bin 342's pivoted position to control the solder ball better and flow out. The bin 342 is provided with a ball inlet and a ball outlet, and the ball outlet is arranged towards the ball planting station; the weighing part 343 is used for acquiring weight information of the solder balls provided to the ball mounting station, acquiring weight information of the solder balls in the bin 342 and feeding the weight information back to the prompting part 344; the control element 345 is arranged on the third supporting frame 340, the control element 345 is respectively connected with the weighing element 343 and the prompting element 344, and the control element 345 controls the prompting element 344 to prompt the ball adding according to the weight information of the solder balls in the bin 342.

In the ball supply assembly 34 provided by this embodiment, the second rotating unit 341 is arranged, the second rotating unit 341 drives the bin 342 to rotate, and after the bin 342 rotates by a certain angle, the solder balls cached in the bin are poured out to a certain amount and flow from the ball outlet to the ball mounting station, so that automatic ball supply is realized, and manual intervention is reduced; meanwhile, a weighing member 343 is arranged, weight change before and after the solder balls flow out in the bin 342 is obtained by the weighing member 343, weight information of the solder balls provided to the ball-mounting station is further obtained, and the purpose of quantitatively supplying the balls to the ball-mounting station is achieved.

The weighing part 343 calculates the weight of the solder ball supplied to the ball-mounting station by the bin according to the weighed weight when the solder ball is not discharged and the weighed weight after the solder ball flows out to the ball-mounting station. The weighing member 343 can obtain the weight information of the solder balls in the bin 342 in real time, and the prompting member 344 will respond when the bin 342 is empty or the bin 342 has too few balls, thereby realizing stable and quantitative supply of the solder balls.

The weighing member 343 may be a weighing sensor, such as a photoelectric weighing sensor, an electromagnetic weighing sensor, a capacitive weighing sensor, a resistance strain weighing sensor, and the like, and the specific category may be selected according to actual needs.

As shown in fig. 13, the control element 345 is disposed on the third supporting frame 340, and the control element 345 is connected to the prompting element 344 and the weighing element 343, respectively, and the control element 345 controls the prompting element 344 to prompt for adding balls according to the weight information of the solder balls in the bin.

In one embodiment of the present invention, the cues 344 may comprise an audible cue component and/or a displayed cue. For example, the voice prompt message may be sent out through a voice prompt, or the prompt message may be displayed through a light display or a screen display, or both the voice prompt message and the prompt message may be sent out through any of the above display prompt members.

In one embodiment of the present invention, as shown in fig. 13, a first guide member 347 is detachably mounted on the ball inlet, and the first guide member 347 is used for guiding solder balls from the ball inlet into the bin 342; the discharge port is detachably provided with a second guide member 348, the second guide member 348 is used for guiding the solder balls to the ball-placement station, and the first guide member 347 and the second guide member 348 shown in fig. 13 are both funnels. By providing the first guide 347 and the second guide 348, the solder balls can be guided into and out better.

Further, the ball outlet is configured as an adjustable opening to better control the flow of balls from the bin 342.

In an embodiment of the present invention, the third supporting frame 340 is provided with a display member 346, and the display member 346 is used for displaying the weight information of the solder balls in the bin 342 and providing the weight information and the prompt information of the solder balls to the ball mounting station.

Finally, the attaching device is described in detail:

as shown in fig. 15, the attaching device includes a second base 40, an attaching platform assembly 41, a conveying assembly 42, a second detecting assembly 43, a third detecting assembly 44 and a material conveying assembly 45; wherein, the fitting platform assembly 41 and the conveying assembly 42 are both arranged on the second base 40; the conveying assembly 42 is used for conveying the PCB to the attaching platform assembly 41; the second detection assembly 43 is used for photographing and height measuring the PCB on the bonding platform assembly 41; the third detection component 44 is arranged on the second base 40, and the third detection component 44 is used for photographing and height measuring the BGA product which is completed by the plant ball; the material handling assembly 45 is used to deliver the OK BGA products to the position above the third inspection assembly 44 and onto the bonding platform assembly 41.

Therefore, the laminating device that this embodiment provided, in operation, utilize conveying component 3 earlier to carry the PCB board to laminating platform subassembly 41 on, utilize the second determine module to detect the PCB board after that, utilize fortune material subassembly 45 to send the BGA of planting the ball OK to third determine module top position simultaneously, detect the BGA product through the third determine module, then continue to utilize fortune material subassembly 45 will detect the BGA product of accomplishing back OK and send to laminating platform subassembly top, laminate the BGA product in the PCB board at last. The whole laminating process of the PCB and the BGA product is automated, the laminating precision between the PCB and the BGA product is improved, and the production efficiency is improved; simultaneously through setting up second determine module and third determine module, the BGA product that will plant the ball that can be accurate laminates the position that the PCB board that has printed the tin cream corresponds.

In another embodiment of the present invention, as shown in fig. 16, the conveying assembly 42 includes a first runner 420 and a second runner 421, both of the first runner 420 and the second runner 421 extend in a conveying direction of the conveying assembly 42, the first runner 420 and the second runner 421 are configured for conveying the PCB board together; the bonding stage assembly 41 is disposed between the first flow channel 420 and the second flow channel 421, and the bonding stage assembly 41 is configured as a liftable stage.

As shown in fig. 17, the above-mentioned bonding platform assembly 41 includes a second supporting base 410 disposed on the second base, a bonding platform 411, a third lifting unit 412, a blocking unit 414 and a clamping unit 413; the PCB is fixed on the attaching platform 411 in an absorption manner. For example, laminating platform 411 upper end is provided with vacuum adsorption unit 415, adsorbs the PCB board on laminating platform 411 through vacuum adsorption unit 415, and compatible multiple PCB board, and switch different PCB boards comparatively swiftly convenient. The third lifting unit 412 is disposed on the second supporting base 410, and the first lifting unit 412 is used for driving the attaching platform 411 to move up and down; the blocking unit 414 is used for blocking the PCB positioned on the attaching platform 411; the clamping unit 413 is used for clamping the PCB, the blocking unit 414 shown in fig. 2 is a blocking cylinder, and the clamping unit 413 is a clamping cylinder.

Further, as shown in fig. 16, a material sensor 422 is disposed on the conveying assembly 42, the material sensor 422 is used for sensing position information of the PCB and feeding the position information back to the blocking unit 414, and after the material sensor 422 senses the PCB running from the upstream (the PCB is printed with solder paste), the blocking cylinder (which is in an ascending state before the PCB enters the bonding platform) blocks the flow of the PCB.

Above-mentioned conveying assembly 42 and laminating platform subassembly 41 that provide, in operation, when the PCB board was carried to laminating platform 41 through first runner 420 and second runner 421, it blocks the flow of PCB board to block the cylinder, laminate platform 411 rises and rises the PCB board to the up end that is higher than conveying assembly 42 under the drive of third elevating unit 412 after that, block simultaneously that the cylinder descends to the same high back of die clamping cylinder, die clamping cylinder presss from both sides tight PCB board, the vacuum adsorption unit on the platform 411 of laminating afterwards opens, suck and fix good PCB board.

In another embodiment of the present invention, as shown in fig. 18, the material transporting assembly 45 includes a third supporting seat 450, a gripping unit 451, a third rotating unit 452, a second horizontal driving unit, and a second lifting unit 453; the clamping unit 45 is used for clamping the BGA product; the third rotating unit 62 is used for driving the gripping unit 451 to rotate; the second horizontal driving unit 453 includes a left-right moving unit 454 and a front-back moving unit 455 for driving the gripping unit 451 to move left and right and front-back, respectively, and the BGA product can be transferred to a position above the third inspection assembly and onto the bonding platform assembly 41 by the second horizontal driving unit 453; the second lifting unit 453 is used for driving the gripping unit 451 to move up and down.

More specifically, the clamping unit 451 is an electric clamping jaw, and the clamping surface of the electric clamping jaw can be subjected to anti-static mold opening and encapsulation process, so that the product can be effectively protected in the product grabbing process, the friction force is increased, and the product loosening can be prevented. The second horizontal driving unit 453 is provided with a linear motor and a grating ruler, and can realize the functions of high speed, high precision and high response speed by matching the linear motor and the grating ruler, and can realize the calibration of the clamping unit 451 angle by matching the rotating unit 452, thereby ensuring the stability of the material transporting assembly 45.

In addition, above-mentioned second determine module and third rotary unit 452 are integrated on same connecting plate, and the connecting plate is connected with second horizontal drive unit, is favorable to simultaneously can realizing through second horizontal drive unit that the second determine module removes the position to laminating platform subassembly 41 top, need not additionally set up drive unit and drives the second determine module and remove, has guaranteed the compactness and the rationality of structure, has reduced the occupation space of this BGA product laminating device simultaneously.

In another embodiment of the present invention, as shown in fig. 19, the third detecting unit 44 includes a first horizontal driving unit 441, a first visual detecting unit 442 and a first height measuring unit 443; the first horizontal driving unit 441 is used for driving the first visual inspection unit 442 and the first height measuring unit 443 to move horizontally; the first vision detection unit 442 is used for photographing the BGA product; the first height measuring unit 443 is used for performing height measuring processing on the BGA product. For example, the first vision inspection unit 442 employs a CCD camera, the first height measurement unit 443 employs a laser displacement sensor, the CCD camera is used to photograph the BGA product with the ball OK to obtain the diagonal coordinates of the BGA product and obtain the position information of the center point of the BGA product, so as to obtain the BGA downward-photographed vision data, and the laser displacement sensor is used to perform height measurement processing on the BGA product, so as to ensure the precision of the attachment.

The structure of the second detection assembly 43 is completely the same as that of the third detection assembly 44, the second detection assembly 43 includes a second visual detection unit 430 and a second height measurement unit 431, the second visual detection unit 430 adopts a CCD camera, the second height measurement unit 431 adopts a laser displacement sensor, the CCD camera in the second detection assembly 43 takes pictures of 3 MARK points in the fixed PCB to obtain visual data of the attaching position of the PCB, then the laser displacement sensor is used to measure the height of each single board in the PCB connecting plate one by one, the material transportation assembly is moved to a material taking position after the processing, and the material taking position refers to a position where a ball-planting OK BGA product is placed. Accomplish when the BGA product and shoot, the height finding is handled the back, electronic clamping jaw operates the BGA product to PCB board one of them laminating position top after, the visual data who shoots visual data and PCB board laminating position under the BGA that gives through the system compares, carry out the compensation of angle and position through rotary unit 62 and second horizontal drive unit, laser displacement sensor carries out the height finding to the PCB board simultaneously and handles, accomplish the laminating of BGA and PCB board afterwards, laminating height and precision have been guaranteed, great reduction is because of the excessive risk of gluing of pushing down the high problem solder paste.

In some examples, as shown in fig. 20, the BGA chip ball mounting production line further includes a review device 7, where the review device 7 is configured to perform positioning shooting detection on the attached product, send the attached product to the review device 7 to perform positioning shooting detection after the attachment is completed, remove NG products and transport the NG products to the operation surface for recycling, and flow OK products into downstream equipment for the next process.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A BGA chip ball-planting production line is characterized by comprising a feeding device, a printing device, a ball-planting device and a fitting device which are sequentially arranged along the production line;

2. The BGA chip ball mounting production line of claim 1, wherein the loading device comprises:

a feeding rack;

the feeding connection assembly is arranged on the feeding rack and comprises a connection table, the connection table is provided with a first position, and the connection assembly is used for conveying a tool disc in the lifting material box assembly to the first position; after the material taking component grabs the BGA in the tool disc, the material loading connection component drives the no-load tool disc to move from the first position to the material lifting box component so as to recover the tool disc;

3. The BGA chip ball mounting production line of claim 2, wherein said loading and docking assembly further comprises:

4. The BGA chip ball mounting production line of claim 1, wherein the ball mounting device comprises:

the jig platform assembly is arranged on the ball planting station;

5. The BGA chip ball mounting production line of claim 4, wherein the jig platform assembly comprises a linear motor platform and a carrying assembly disposed on the linear motor platform and used for carrying a jig, and the linear motor platform is used for driving the carrying assembly to move.

6. The BGA chip ball mounting production line of claim 5, wherein the carrier assembly comprises:

the first mounting seat is arranged on the linear motor platform;

7. The BGA chip ball mounting production line of claim 4, wherein the ball supply assembly comprises:

a third support frame;

a prompt;

and the control part is arranged on the third support frame, is respectively connected with the weighing part and the prompting part, and controls the prompting part to perform ball adding prompting according to the weight information of the solder balls in the storage bin.

8. The BGA chip ball mounting production line of claim 1, wherein the attaching device comprises:

a second base;

the laminating platform assembly is arranged on the second base;

9. The BGA chip ball mounting line of claim 8, wherein the mounting platform assembly includes:

the second supporting seat is arranged on the second base;

the PCB is fixed on the laminating platform;

and the clamping unit is used for clamping the PCB.

10. The BGA chip ball mounting production line of claim 1, further comprising a rechecking device for positioning, photographing and detecting the attached product.