CN114460446B - Quantum chip detection system and detection method - Google Patents
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- CN114460446B CN114460446B CN202210205677.3A CN202210205677A CN114460446B CN 114460446 B CN114460446 B CN 114460446B CN 202210205677 A CN202210205677 A CN 202210205677A CN 114460446 B CN114460446 B CN 114460446B
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- 238000001514 detection method Methods 0.000 title claims abstract description 195
- 238000000034 method Methods 0.000 claims abstract description 30
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- 238000012360 testing method Methods 0.000 claims description 30
- 238000006073 displacement reaction Methods 0.000 claims description 22
- 230000001360 synchronised effect Effects 0.000 claims description 2
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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Abstract
The application discloses a quantum chip detection system and a detection method, wherein a quantum circuit is formed on a quantum chip, the detection system comprises a first detection component, and in the detection process, the detection system is electrically connected with an input port of the quantum circuit; the second detection component is electrically connected with the output port of the quantum circuit in the detection process; a first observation assembly for observing whether the first detection assembly is in contact with the input port to form an electrical connection; a second observation assembly for observing whether a second probe assembly is in contact with the output port to form an electrical connection; the detection element is respectively electrically connected with the first detection component and the second detection component, and the first detection component and the second detection component can be independently observed through the first observation component and the second observation component, so that the contact condition of the first detection component and the second detection component with the input port and the output port of the quantum circuit can be clearly observed at the same time.
Description
Technical Field
The application belongs to the field of quantum computing, and particularly relates to a quantum chip detection system and a detection method.
Background
The quantum computer is a kind of physical device which performs high-speed mathematical and logical operation, stores and processes quantum information according to the law of quantum mechanics. The quantum computer has the characteristics of higher running speed, stronger information processing capability, wider application range and the like. The quantum chip is used as a core component of a quantum computer and is an important component of the quantum computer.
At present, research and development of a quantum chip are still in an exploration stage, in the prior art, after the preparation of the quantum chip is finished, in order to ensure the yield of the quantum chip, the quantum chip needs to be tested, and the conventional quantum chip detection system generally adopts a contact type test technology, and utilizes a detection component to be respectively contacted with each port of a quantum circuit on the quantum chip to form electric connection, so that the detection of the quantum circuit is realized.
However, the area of the port is smaller, in order to be able to see the contact condition of the detection component and the port clearly, the multiplying power of the observation component needs to be increased, however, as the multiplying power is increased, the field of view of the observation component is necessarily reduced, and as the distance between the ports on the quantum circuit is longer, the observation component of the existing quantum chip detection system is difficult to clearly observe the contact condition of the detection component and the ports on the quantum circuit at the same time, and is difficult to meet the use requirement of people.
It should be noted that the information disclosed in the background section of the present application is only for enhancement of understanding of the general background of the present application and should not be taken as an admission or any form of suggestion that this information forms the prior art already known to those skilled in the art.
Disclosure of Invention
The application aims to provide a quantum chip detection system for solving the defects in the prior art, and provides a quantum chip detection system and a quantum chip detection method.
One embodiment of the present application provides a quantum chip detection system having a quantum circuit formed thereon, the detection system comprising:
The first detection component is electrically connected with the input port of the quantum circuit in the detection process;
the second detection component is electrically connected with the output port of the quantum circuit in the detection process;
a first observation assembly for observing whether the first detection assembly is in contact with the input port to form an electrical connection;
A second observation assembly for observing whether the second detection assembly is in contact with the output port to form an electrical connection;
And the detection element is respectively electrically connected with the first detection component and the second detection component, and generates a test current to test whether the quantum circuit is a passage or not in the detection process.
The detection system comprises a first observation component and a second observation component, wherein the first observation component and the second observation component are microscopes, the first detection component and the second detection component are probes, and the view field of the microscope covers the tip of each probe in the detection process.
The detection system as described above, wherein the central axis of the microscope is not perpendicular to the plane in which the quantum chip is located.
The detection system as described above, wherein the included angles between each of the central axes and the plane are equal.
The detection system as described above, wherein the included angle has a value ranging from 78 degrees to 89 degrees.
A detection system as described above, further comprising:
A camera mounted on the microscope eyepiece;
and a display connected with the camera.
The detection system as described above, further comprising a displacement adjustment assembly coupled to the microscope.
The detection system as described above, further comprising an angular displacement stage mounted between the microscope and the displacement adjustment assembly.
The detection system as described above, further comprising a robotic arm, wherein the microscope is mounted to a free end of the robotic arm.
Another embodiment of the present application also provides a method for detecting a quantum chip on which a quantum circuit is formed, the method comprising the steps of:
Under the observation of the first observation component, the first detection component is contacted with an input port of the quantum circuit to form an electrical connection;
Under the observation of a second observation component, contacting with an output port of the quantum circuit by using a second detection component to form an electrical connection;
a test current sequentially passing through the first detection component, the quantum circuit and the second detection component is generated by using a detection element so as to test whether the quantum circuit is a passage or not.
Compared with the prior art, the application provides a quantum chip detection system, wherein a quantum circuit is formed on a quantum chip, the detection system comprises a first detection component, and in the detection process, the detection component is electrically connected with an input port of the quantum circuit; the second detection component is electrically connected with the output port of the quantum circuit in the detection process; a first observation assembly for observing whether the first detection assembly is in contact with the input port to form an electrical connection; a second observation assembly for observing whether the second detection assembly is in contact with the output port to form an electrical connection; the application provides a detection element which is respectively and electrically connected with a first detection component and a second detection component, wherein in the detection process, the detection element generates a test current to test whether the quantum circuit is a passage, and in the application, the first detection component and the second detection component can be independently observed when the quantum circuit is tested by arranging the first observation component for observing the first detection component and the second observation component for observing the second detection component, so that the contact condition of the first detection component and the second detection component with an input port and an output port of the quantum circuit can be clearly observed at the same time, and the first detection component and the second detection component are more favorable for forming electrical connection with the input port and the output port, thereby facilitating the test operation of the quantum circuit.
Drawings
FIG. 1 is a schematic diagram of a quantum chip detection system according to the present application;
fig. 2 is a schematic diagram of another angle of the quantum chip detection system provided by the present application.
Reference numerals illustrate: 1-fixing frame, 2-displacement adjusting component, 3-microscope, 4-camera, 5-display, 6-probe seat and 7-bearing table;
21-height adjusting mechanism, 22-plane adjusting mechanism, 23-angular displacement table.
Detailed Description
The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the embodiments of the present application will be described in detail below with reference to the accompanying drawings. However, it will be understood by those of ordinary skill in the art that in various embodiments of the present application, numerous specific details are set forth in order to provide a thorough understanding of the present application. The claimed application may be practiced without these specific details and with various changes and modifications based on the following embodiments. The following embodiments are divided for convenience of description, and should not be construed as limiting the specific implementation of the present application, and the embodiments can be mutually combined and referred to without contradiction.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the application described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In addition, it will be understood that when a layer (or film), region, pattern, or structure is referred to as being "on" a substrate, layer (or film), region, and/or pattern, it can be directly on another layer or substrate, and/or intervening layers may also be present. In addition, it will be understood that when a layer is referred to as being "under" another layer, it can be directly under the other layer and/or one or more intervening layers may also be present. In addition, references to "upper" and "lower" on the respective layers may be made based on the drawings.
At present, after the preparation of the quantum chip is finished, in order to ensure the yield of the quantum chip, the quantum chip needs to be tested, in the prior art, a quantum chip detection system generally adopts a contact type test technology, and each port of a quantum circuit on the quantum chip is respectively contacted with a detection component to form electrical connection, so that the detection of the quantum circuit is realized. However, the area of the ports of the quantum circuit on the quantum chip is smaller, so that the contact condition of the detection assembly and the ports can be seen clearly, the multiplying power of the observation assembly is required to be increased, however, as the multiplying power is increased, the visual field range of the observation assembly is required to be reduced, and as the distance between the ports on the quantum circuit is longer, the observation assembly of the conventional quantum chip detection system is difficult to observe the contact condition of the detection assembly and the ports on the quantum circuit clearly at the same time.
Fig. 1 is a schematic structural diagram of a quantum chip detection system provided by the application.
Fig. 2 is a schematic diagram of another angle of the quantum chip detection system provided by the present application.
Referring to fig. 1 and 2, an embodiment of the present application provides a quantum chip detection system, in which a quantum circuit is formed on a quantum chip, the quantum circuit has an input port for inputting an electrical signal and an output port for outputting the electrical signal, the detection system includes:
The quantum chip detection device comprises a fixing frame 1, wherein the fixing frame 1 is used for installing a bearing table 7, the bearing table 7 is used for bearing quantum chips, the quantum chips to be detected are placed on the bearing table 7, and the quantum chips are borne and fixed by the bearing table 7 so as to be convenient for detection of the quantum chips;
The first detection component is electrically connected with the input port of the quantum circuit in the detection process, and the second detection component is electrically connected with the output port of the quantum circuit in the detection process, in this embodiment, the first detection component and the second detection component are optional probes, and when the detection component is specifically implemented, a probe seat 6 for fixing the probes is installed on the fixing frame 1, the probe seat 6 is provided with a manual displacement adjusting mechanism, the manual displacement adjusting mechanism comprises three groups of mutually perpendicular adjusting screw rods, and the relative positions of the probes and the quantum chip can be manually adjusted by rotating the adjusting screw rods, so that the probe tip is in physical contact with the input port and the output port of the quantum circuit on the quantum chip respectively, and the first detection component is electrically connected with the input port of the quantum circuit, and the second detection component is electrically connected with the output port of the quantum circuit;
The first observing component is used for observing whether the first detecting component is in contact with the input port to form electric connection, and the second observing component is used for observing whether the second detecting component is in contact with the output port to form electric connection, and in an exemplary specific mode, the first observing component and the second observing component are both microscopes 3, the first observing component and the second observing component are respectively connected with the fixed frame 1 through the displacement adjusting component 2, the displacement adjusting component 2 comprises a height adjusting mechanism 21 arranged on the fixed frame 1, the height adjusting mechanism 21 comprises a stand column fixed on the fixed frame 1 and a sliding part sleeved on the stand column, the sliding part can slide up and down along the stand column, the sliding part is provided with an expansion joint along the direction of the stand column, the sliding part is provided with a locking bolt, when the sliding part is required to be fixed, the width of the expansion joint can be reduced by screwing the tightening bolt, so that the friction force between the sliding part and the upright post can be increased, and the sliding part and the upright post can be kept relatively fixed, the displacement adjusting assembly 2 further comprises a plane adjusting mechanism 22, the plane adjusting mechanism 22 is arranged on the sliding part, the plane adjusting mechanism 22 comprises a first linear module, a second linear module and a controller which are mutually perpendicular, wherein the first linear module is connected with the sliding part, the second linear module is used for being connected with the microscope 3, the controller is respectively and electrically connected with the first linear module and the second linear module and used for controlling the operation of the first linear module and the second linear module, thereby realizing the purpose of adjusting the relative positions of the microscope 3 and the quantum chip, when the quantum chip is detected, the position of the microscope 3 is adjusted by the controller so as to observe the contact condition of the first detection assembly and the second detection assembly with the input port and the output port of the quantum circuit respectively in real time;
The detection element is electrically connected with the first detection component and the second detection component respectively, and in the detection process, the detection element generates a test current to test whether the quantum circuit is a passage, and by way of example, one specific mode is that the detection element comprises a constant current source component capable of generating the test current and an instrument component for measuring current and voltage, and when the quantum circuit on the quantum chip is detected, the constant current source component is used for generating the test current sequentially passing through the first detection component, the quantum circuit and the second detection component so as to test whether the quantum circuit is a passage.
In this embodiment, a quantum chip detection system is provided, a quantum circuit is formed on the quantum chip, when the quantum circuit on the quantum chip needs to be detected, the displacement adjustment assembly 2 is adjusted firstly, the first observation assembly and the second observation assembly are adjusted to appropriate heights by using the height adjustment mechanism 21, the first observation assembly and the second observation assembly are adjusted to appropriate positions by using the plane adjustment mechanism 22, so that the first observation assembly and the second observation assembly can respectively observe an input port and an output port of the quantum circuit to be detected, then a manual adjustment mechanism positioned on the probe stand 6 is adjusted, the first detection assembly and the second detection assembly are respectively moved to the visual fields of the first observation assembly and the second observation assembly, then the relative positions of the first detection assembly and the second detection assembly and the quantum chip are continuously adjusted, so that the first detection component is in physical contact with the input port of the quantum circuit to form an electrical connection, the second detection component is in physical contact with the output port of the quantum circuit to form an electrical connection, then a test current sequentially passing through the first detection component, the quantum circuit and the second detection component is generated by using a detection element to test whether the quantum circuit is a passage or not so as to finish detection of the quantum circuit on the quantum chip, in the application, by arranging the first observation component for observing the first detection component and the second observation component for observing the second detection component, the first detection component and the second detection component can be independently observed when the quantum circuit is tested, thereby clearly observing the input ports of the first detection component, the second detection component and the quantum circuit simultaneously, the contact condition of the output port is more favorable for the physical contact between the first detection assembly and the second detection assembly and the input port and the output port respectively so as to form electrical connection, and the quantum circuit test operation is convenient to carry out.
In the application, the first observation component and the second observation component are used for respectively observing the input port and the output port of the quantum circuit, so that the line numbers of the input port and the output port of the quantum circuit can be observed at the same time, thereby facilitating the experimenter to find the quantum circuit to be tested and facilitating the quantum circuit test operation.
In some embodiments of the present application, the central axis of the microscope 3 is not perpendicular to the plane in which the quantum chip is located, and because the volume of the quantum chip is relatively small, when the two microscopes 3 observe the input port and the output port of the quantum circuit respectively, the two microscopes 3 may interfere with each other due to too close distance, which affects the observation field of view, and by obliquely arranging the microscopes 3 with respect to the quantum chip, the two microscopes 3 are arranged in a V-shape, and when the two microscopes 3 observe the input port and the output port of the quantum circuit respectively, the possibility of the two microscopes 3 interfering with each other is greatly reduced.
In this embodiment, the microscopes 3 are obliquely disposed relative to the quantum chip, so that the two microscopes 3 are arranged in a V-shape, and illustratively, the central axes of the microscopes 3 and the plane where the quantum chip is located have equal included angles, specifically, the included angles have a value range of 78-89 degrees, and in this angle range, the visual field ranges of the two microscopes 3 can be ensured to cover the input port and the output port of the quantum circuit respectively, and the possibility of mutual interference of the two microscopes 3 can be greatly reduced when the positions of the two microscopes 3 are respectively adjusted in the process of detecting the quantum circuit.
In some embodiments of the present application, the device further includes an angular displacement stage 23 mounted between the microscope 3 and the displacement adjustment assembly 2, and illustratively, in a specific manner, the microscope 3 is mounted on the angular displacement stage 23, the inclination angle of the microscope 3 can be adjusted by adjusting the angular displacement stage 23, the angular displacement stage 23 is mounted on the plane adjustment mechanism 22, and when the plane adjustment mechanism 22 operates, the angular displacement stage 23 can be driven to displace, so as to drive the microscope 3 to synchronously move, so as to adjust the relative position of the microscope 3 and the quantum chip.
In this embodiment, the inclination degree of the microscope 3 can be conveniently adjusted by using the angular displacement table 23, so that the included angle between the microscope 3 and the plane of the quantum chip can be adjusted according to the actual use requirement.
In some embodiments of the present application, the camera 4 mounted on the eyepiece of the microscope 3 and the display 5 connected to the camera 4 are further included, and with the camera 4 and the display 5, the view field picture in the microscope 3 can be photographed in real time, and the photographed view field picture can be synchronized to the display 5.
In this embodiment, when the quantum chip is detected, the contact conditions of the first detection component and the second detection component with the input port and the output port of the quantum circuit are observed in real time by using the microscope 3, and under the real-time observation of the microscope 3, the relative positions of the first detection component and the input port are adjusted, so that the first detection component and the input port form physical contact to realize electrical connection, and the relative positions of the second detection component and the output port are adjusted, so that the second detection component and the output port form physical contact to realize electrical connection, and the camera 4 is used for shooting a view field picture in the microscope 3 in real time, and synchronizing the shot view field picture with the display 5, so that an experimenter can conveniently observe the contact conditions of the first detection component and the second detection component with the input port and the output port of the quantum circuit in real time, and ensure that the first detection component and the input port and the second detection component and the output port can form good electrical connection.
In other embodiments of the present application, the microscope further includes a mechanical arm, the mechanical arm is mounted on the fixing frame 1, the microscope 3 is mounted at a free end of the mechanical arm, and the movement of the mechanical arm is controlled to enable the microscope 3 to displace relative to the quantum chip, so that the relative position of the microscope 3 and the quantum chip can be adjusted, the mechanical arm is further provided with a matched upper computer, the upper computer is electrically connected with the mechanical arm, and an experimenter controls the mechanical arm to operate by using the upper computer, so that the displacement and the inclination angle of the microscope 3 can be controlled more accurately.
In some embodiments of the present application, the light source assembly is further included in the fixing frame 1, and the light source assembly is mounted on the fixing frame 1, so that when the first observation assembly and the second observation assembly work, better lighting conditions can be provided by using the light source assembly, and the first observation assembly and the second observation assembly are more beneficial to respectively observing the input port and the output port of the quantum circuit.
Another embodiment of the present application also provides a method of detecting a quantum chip on which a quantum circuit having an input port for inputting an electric signal and an output port for outputting the electric signal is formed, the method comprising the steps of:
Under the observation of a first observation component, the first detection component is in contact with an input port of the quantum circuit to form electrical connection, and in an exemplary manner, the first detection component comprises a probe, in order to test the quantum circuit on the quantum chip, the first detection component is required to be in physical contact with the input port of the quantum circuit to form electrical connection, in particular, the first detection component is moved to enable a probe tip of the first detection component to be in physical contact with the input port of the quantum circuit, and the contact condition of the probe tip of the first detection component and the input port is observed in real time by the first observation component, so that the first detection component is beneficial to form physical contact with the input port to realize electrical connection;
Under the observation of a second observation component, the second detection component is in contact with the output port of the quantum circuit to form electrical connection, and in a specific manner, the second detection component comprises a probe, in order to test the quantum circuit on the quantum chip, the second detection component is required to be in physical contact with the output port of the quantum circuit to form electrical connection, in particular, the second detection component is moved to enable the probe tip of the second detection component to be in physical contact with the output port of the quantum circuit, and the contact condition of the probe tip of the second detection component and the output port is observed in real time by the second observation component, so that the second detection component is beneficial to form physical contact with the output port to realize electrical connection;
The detection element is used for generating the test current sequentially passing through the first detection component, the quantum circuit and the second detection component so as to test whether the quantum circuit is a passage, and in a specific way, the detection element comprises a constant current source component capable of generating the test current and an instrument component for measuring current and voltage.
In this embodiment, when testing the quantum circuit on the quantum chip, the first observation component and the second observation component are used to observe the first detection component and the second detection component independently, so that the contact condition between the first detection component and the second detection component and the input port and the output port of the quantum circuit can be observed clearly at the same time, and the first detection component and the second detection component are more favorable to be in physical contact with the input port and the output port to form electrical connection, so that the quantum circuit test operation is convenient.
While the foregoing is directed to embodiments of the present application, other and further embodiments of the application may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (8)
1. A quantum chip detection system, wherein a quantum circuit is formed on the quantum chip, the detection system comprising:
The first detection component is electrically connected with the input port of the quantum circuit in the detection process;
the second detection component is electrically connected with the output port of the quantum circuit in the detection process;
the first observation component is used for observing the serial numbers of the input port and the circuit thereof and observing whether the first detection component is in contact with the input port or not so as to form electrical connection;
The second observation assembly is used for observing the serial numbers of the input port and the circuit thereof and observing whether the second detection assembly is in contact with the output port or not so as to form electrical connection;
the detection element is respectively electrically connected with the first detection component and the second detection component, and generates a test current to test whether the quantum circuit is a passage or not in the detection process;
the first observation assembly and the second observation assembly are microscopes, the first detection assembly and the second detection assembly are probes, and in the detection process, the view field of the microscope covers the needle tip of the probes;
the detection system further comprises: the camera is arranged on the ocular of the microscope and connected with the camera, and is used for shooting the view field picture in the microscope in real time and synchronizing the shot view field picture to the display.
2. The detection system according to claim 1, characterized in that the central axis of the microscope (3) is not perpendicular to the plane in which the quantum chip is located.
3. The inspection system of claim 2 wherein the angles between each of said central axes and said plane are equal.
4. A test system according to claim 3, wherein the included angle is in the range 78-89 degrees.
5. The detection system according to claim 1, further comprising a displacement adjustment assembly (2) connected to the microscope (3).
6. The detection system according to claim 5, further comprising an angular displacement stage mounted between the microscope (3) and the displacement adjustment assembly (2).
7. The detection system according to claim 1, further comprising a robotic arm, the microscope (3) being mounted to a free end of the robotic arm.
8. A method of detecting a quantum chip, wherein a quantum circuit is formed on the quantum chip, the method comprising the steps of:
Under the observation of the first observation component, the first detection component is contacted with an input port of the quantum circuit to form an electrical connection;
Under the observation of a second observation component, contacting with an output port of the quantum circuit by using a second detection component to form an electrical connection;
The first observation assembly and the second observation assembly are microscopes, the first detection assembly and the second detection assembly are probes, a camera is mounted on an eyepiece of the microscope, the camera is connected with a display, and in the detection process, the view field of the microscope covers the tip of the probes;
In the observation process, the first observation assembly and the second observation assembly are used for respectively observing the input port and the output port of the quantum circuit, meanwhile, the circuit numbers of the input port and the output port of the quantum circuit are observed, a camera is used for shooting a view field picture in a microscope in real time, and the shot view field picture is synchronized to a display; a test current sequentially passing through the first detection component, the quantum circuit and the second detection component is generated by using a detection element so as to test whether the quantum circuit is a passage or not.
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| US6744268B2 (en) * | 1998-08-27 | 2004-06-01 | The Micromanipulator Company, Inc. | High resolution analytical probe station |
| JP4130798B2 (en) * | 2003-12-05 | 2008-08-06 | 株式会社日立ハイテクノロジーズ | Compound microscope with probe and probe driving method |
| CN201477600U (en) * | 2009-07-29 | 2010-05-19 | 深圳国微技术有限公司 | Tampered detecting circuit for protecting chip |
| WO2015030202A1 (en) * | 2013-08-30 | 2015-03-05 | 国立大学法人電気通信大学 | Optical measurement device, optical measurement method, and microscopic imaging system |
| GB2545496B (en) * | 2015-12-18 | 2020-06-03 | Teraview Ltd | A Test System |
| KR102038354B1 (en) * | 2018-02-14 | 2019-10-30 | 주식회사 리암솔루션 | Probe station for measuring L-I-V |
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