CN114460431B - Automatic pin inserting method, device, computer and storage medium for semiconductor probe card - Google Patents
Automatic pin inserting method, device, computer and storage medium for semiconductor probe card Download PDFInfo
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- CN114460431B CN114460431B CN202210114180.0A CN202210114180A CN114460431B CN 114460431 B CN114460431 B CN 114460431B CN 202210114180 A CN202210114180 A CN 202210114180A CN 114460431 B CN114460431 B CN 114460431B
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- 239000000523 sample Substances 0.000 title claims abstract description 964
- 238000000034 method Methods 0.000 title claims abstract description 49
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000003860 storage Methods 0.000 title claims abstract description 11
- 238000006073 displacement reaction Methods 0.000 claims abstract description 22
- 238000003780 insertion Methods 0.000 claims abstract description 19
- 230000037431 insertion Effects 0.000 claims abstract description 19
- 238000004590 computer program Methods 0.000 claims description 12
- 238000012545 processing Methods 0.000 claims description 4
- 238000004364 calculation method Methods 0.000 claims description 3
- 210000000078 claw Anatomy 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 3
- 238000004458 analytical method Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 99
- 238000010586 diagram Methods 0.000 description 8
- 230000003068 static effect Effects 0.000 description 7
- 230000005611 electricity Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 238000010191 image analysis Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000012549 training Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
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- 238000004891 communication Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a method, a device, a computer device and a storage medium for automatically inserting pins of a semiconductor probe card, wherein the method comprises the steps of matching probes with probe card hole sites, inserting probes, adjusting the positions of the probe card and executing pins, and in the step of adjusting the positions of the probe card, the probes can fall down after the positions of the probes and the probe card are adjusted by controlling the displacement and shaking of the probe card; the device comprises a feeding module, a probe card placing module, a probe card shaking module, a first position information acquisition module, a probe grabbing module, a second position information acquisition module and a PC control module. The invention uses the probe card pin inserting device to automatically identify the probe, controls the mechanical arm to grasp the probe and automatically adjusts the position of the probe to be placed in the probe card hole site, and controls the probe card to slightly shift and shake up and down, left and right and back and forth so as to vibrate the probe which does not completely enter the probe card hole site into the probe card, thereby replacing manual card insertion, saving manpower, improving efficiency and ensuring product quality.
Description
Technical Field
The present invention relates to the field of semiconductor chip testing technology, and in particular, to a method, an apparatus, a computer device, and a storage medium for automatically inserting pins in a semiconductor probe card for high-end probe card production.
Background
In the process of producing semiconductor chips, probe cards are used for electrically measuring chips on a wafer, and the probe cards are used as connectors of chip electrodes and a tester. The probes on the probe card are contacted with the electrodes of the chip, and the performance of the chip is judged by performing an electrical test, so that whether the chip passes or fails is judged.
The reliability of the probe card is highly dependent in the testing of the wafer, and as the chip process is continuously shortened, the demand for advanced probe cards is also increasing. The advanced probe card is characterized by small spacing (30-50 μm), high positioning precision and high frequency.
In the current high-end probe card production, the inventor finds that at least the following problems exist in the prior art in the process of realizing the invention, wherein the probe card is mainly inserted by a person: 1. the manual probe card insertion has the defects of slow hand, long training period, non-uniform standard, non-constant state, uncontrollable quality and the like; 2. probes may not be able to enter the second layer probe card holes due to adsorption, surface stains, etc.
In view of this, how to solve the problems of slow hand, long training period, non-uniform standard, non-constant state, uncontrollable quality and the like of manually performing probe card insertion in the prior art becomes the subject to be studied and solved by the invention.
Disclosure of Invention
The invention provides an automatic pin inserting method, device, computer equipment and storage medium for a semiconductor probe card, which are used for solving the problems of slow upper hand, long training period, non-uniform standard, non-constant state, uncontrollable quality and the like in the prior art when the probe card is manually inserted.
In order to achieve the above-mentioned objective, a first aspect of the present invention provides an automatic pin inserting method for a semiconductor probe card, which is used for automatic pins of a probe card, wherein the probe card comprises a first layer of probe card and a second layer of probe card which are arranged in parallel up and down, and probe card hole sites corresponding to each other up and down are arranged on the first layer of probe card and the second layer of probe card; the innovation point is that the method comprises the following steps:
(1) Matching probe and probe card hole site
Respectively acquiring probe position information on a feeding probe disc and probe card hole position information of a probe card; analyzing the corresponding position coordinates of the matched probes and the probe card hole sites according to the probe position information of the feeding probe disc and the probe card hole site information;
(2) Insertion probe
The grabbing probe moves to the position above the corresponding position coordinate of the probe card hole site, horizontal relative position information of the projection of the probe and the probe card hole site in the horizontal direction is obtained, and whether the horizontal relative position of the probe and the probe card hole site has deviation is judged;
If the deviation does not exist, the probe is loosened after the probe is controlled to be inserted into the probe hole position of the first layer of probe card to a set depth; if the deviation exists, the position of the probe is adjusted according to the deviation value, then the probe is controlled to be inserted into the probe card hole site of the first layer of probe card to a set depth, and then the probe is loosened; after loosening the probes, the probes fall towards the probe card hole site direction of the second layer of probe card;
(3) Probe card position adjustment
Acquiring vertical relative position information projected in the vertical direction after the probe falls, and judging whether the probe passes through a probe card hole site of the second layer of probe card according to the vertical relative position information;
when the probe is judged to pass through the probe card hole site of the second layer of probe card, the next probe insertion operation is carried out;
When the probe does not pass through the probe card hole site of the second layer of probe card, the probe and the second layer of probe card are controlled to do relative motion in the depth direction, so that the probe and the second layer of probe card are separated, the probe is released, and then the probe can penetrate into the probe card hole site of the second layer of probe card by controlling the displacement and shaking of the probe card; then, continuously judging whether the probe passes through the probe card hole site of the second layer of probe card according to the re-acquired vertical relative position information, and repeating the steps until the probe passes through the probe card hole site of the second layer of probe card;
(4) Pin execution
And (3) repeating the steps (2) and (3) until the probe card is fully inserted with probes, and ending the insertion of the probes.
A second aspect of the present invention provides an automatic pin inserting apparatus for a semiconductor probe card, the apparatus comprising:
the feeding module is used for placing a feeding probe disc;
the probe card placing module is used for placing a probe card to be inserted with a pin, and the probe card is provided with a first layer of probe card and a second layer of probe card;
The probe card shaking module is used for driving the probe card to move up and down, left and right and front and back so as to perform displacement shaking;
The first position information acquisition module is used for acquiring the probe position information of the feeding probe disc and the probe card hole position information, and selectively acquiring the horizontal relative position information of the probe and the probe card hole position;
the probe grabbing module is used for grabbing probes on the feeding probe disc and inserting the probes into the probe card;
the second position information acquisition module is used for acquiring vertical relative position information of the probe inserted into the probe hole and selectively acquiring horizontal relative position information of the probe and the probe card hole site;
the PC control module is used for analyzing the corresponding position coordinates of the matched probe and the probe card hole site according to the probe position information of the feeding probe disc and the probe card hole site information; the probe card is used for judging whether the relative positions of the probe and the probe card hole position have deviation according to the horizontal relative position information of the probe and the probe card hole position; the probe grabbing module is used for controlling the probe grabbing module to adjust the probe inserting position according to the deviation value; the probe card is used for judging whether the probe falls into the second layer of probe card according to the vertical relative position information of the probe inserted into the probe hole; and the probe card shaking module is used for controlling the probe card shaking module to perform displacement shaking when judging that the probes do not fall into the second layer of probe card.
A third aspect of the present invention proposes a computer device based on an automatic pin inserting method for a semiconductor probe card, said computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, said processor implementing the steps of the method according to the first aspect of the present invention as described above when said computer program is executed.
A fourth aspect of the present invention provides a computer readable storage medium based on an automatic pin inserting method of a semiconductor probe card, where the computer readable storage medium stores a computer program, and the computer program when executed by a processor causes the processor to execute the steps of the method according to the first aspect of the present invention.
The content of the present invention is explained as follows:
1. By implementing the technical scheme of the invention, the following technical problems are solved: the probe card pin inserting device is used for replacing manual card inserting, so that the labor is saved, the efficiency is improved, and the product quality is ensured; using an image recognition method, firstly shooting a pinhole position coordinate on a probe card substrate, and inputting the pinhole position coordinate into a system; automatically identifying the probe by using an image identification method, controlling a mechanical arm to grasp the probe and automatically adjusting the position of the probe to be placed in a probe card hole site; by controlling the probe card to move and shake, the probes which do not completely enter the hole sites of the probe card vibrate into the board card, so that all probes can be completely inserted into the probe card, and the yield is hundred percent.
2. In the technical scheme of the first aspect, before the step (1) is performed to match the probes with the probe card holes, the feeding probe disc is manually fed, specifically, the probes are manually inserted into the probe holes of the feeding probe disc, and the feeding probe disc is manually placed into the feeding station;
When the step (1) is executed to match the probe with the probe card hole site, the probe position information on the feeding probe disc and the probe card hole site information of the probe card are respectively obtained, the method comprises the following steps:
shooting by a camera to obtain the position information of the probe on the feeding probe disc;
The manipulator moves the camera to the upper part of the probe card;
photographing to obtain hole site information of the probe card;
And distributing each probe to a corresponding probe hole, calculating the gesture coordinates of the probe, and calculating the position coordinates of the probe to the corresponding probe hole.
3. In the technical solution of the first aspect, when performing the analyzing the corresponding position coordinates of the matching probe and the probe card hole site in the step (1), the method includes the following steps:
Transmitting the acquired probe position information of the feeding probe disc, probe card hole position information and coordinate information of the movement of the manipulator to a PC control module;
the PC control module performs image processing and position calculation, calculates the positions of the probe card and the probe disc, marks the probes and coordinates of the feeding probe disc and marks the holes and coordinates of the probe card;
Distributing each probe to a corresponding probe card hole site, calculating the corresponding position coordinates of the probe to the corresponding probe card hole site, and calculating the probe attitude coordinates;
And the manipulator grabs the probe and adjusts the three-degree-of-freedom coordinates to the corresponding probe card hole sites according to the distribution information of the PC control module.
4. In the foregoing technical solution of the first aspect, in the step of performing the step (2) of inserting the probe to obtain horizontal relative position information of the probe and the probe card hole site, the horizontal relative position information is position deviation information of the probe and the probe card hole site projected on a horizontal position, the step includes:
the horizontal camera is aligned to the probe from the horizontal direction, and the position deviation of the probe and the probe card hole site in the horizontal X direction is obtained by photographing;
Camera shaft movement;
Photographing by a horizontal camera to obtain the Y-direction position deviation of the probe and the probe card hole site;
and transmitting the X-direction deviation information of the probe and the probe card hole site and the Y-direction deviation information of the probe and the probe hole site to the PC control module so as to obtain the horizontal relative position information of the probe and the probe card hole site.
5. In the technical solution of the first aspect, in the process of obtaining the horizontal relative position information as the position deviation information of the probe and the probe card hole site on the horizontal position, the horizontal camera may take a photograph of the probe from the horizontal direction to determine the coordinates thereof, thereby obtaining the horizontal X-direction position deviation and the Y-direction deviation, or may use the vertical camera to obtain the probe information and the probe hole information projected on the X-Y plane, thereby obtaining the horizontal X-direction position deviation and the Y-direction deviation of the probe.
6. In the foregoing technical solution of the first aspect, in the step of acquiring the horizontal relative position information of the probe and the probe card hole site with the horizontal camera, an image recognition method is adopted.
7. In the technical solution of the first aspect, in the step of performing the position adjustment of the probe card in the step (3) to obtain vertical relative position information of the probe projected in the vertical direction after the probe falls, the vertical relative position information is position deviation information of the probe and the probe card hole site and the upper and lower two layers of probe cards in a vertical position, and the step includes:
Photographing to obtain position deviation information of the probe and the probe hole in the Z direction;
And transmitting the Z-direction position deviation information of the probe and the probe hole to a PC control module so as to obtain the vertical relative position information of the probe and the probe card hole site, and judging whether the probe passes through the probe card hole site of the second layer of probe card according to whether the position deviation value exists between the probe and the probe card.
8. In the technical scheme of the first aspect, in executing the position adjustment of the probe card in the step (3), when judging that the probe does not fall into the second layer of probe card, outputting an instruction by the PC control module to enable the manipulator to grasp the probe and move and separate in the Z direction to enable the bottom end of the probe to be separated from the hole of the lower layer of probe card, loosening the probe to fall, and then controlling the probe card to move in the X direction, the Y direction and the Z direction to perform displacement shake to enable the probe to slide into the probe hole of the second layer of probe card; after the probes slide down into the probe holes of the second layer of probe card, the probe card stops shaking and resumes the initial state.
9. In the foregoing technical solution of the first aspect, in the process of controlling the probe card to be separated from the probe in the depth direction and then releasing the probe, the relative separation of the probe card and the probe may include separating the first layer probe card from the second layer probe card to separate the second layer probe card from the probe, or pulling up the probe in the Z direction, or fixing the probe by a manipulator and then moving the probe card in the Z axis to complete the separation operation.
10. In the foregoing technical solution of the first aspect, at least the probes are dropped into the probe card holes of the first layer of probe card before the probe card performs displacement and shake.
11. In the technical solution of the first aspect, the depth of the probe inserted into the probe hole is controlled so that the tip of the probe passes through the probe hole position of the first layer of probe card and is located at a depth distance between cavities formed between the upper and lower layers of probe cards.
12. In the technical solution of the second aspect, the specific is:
The probe card placing module comprises a placing platform;
The first position information acquisition module comprises a vertical photographing system, wherein the vertical photographing system mainly comprises a vertical camera, a first high-power objective lens, a first X-axis servo shaft and a first Y-axis servo shaft;
the probe grabbing module comprises a manipulator with at least four degrees of freedom, wherein the tail end of the manipulator is provided with a claw hand which is used for grabbing and loosening a probe;
The second position information acquisition module comprises a horizontal photographing system which mainly comprises a horizontal camera, a second high-power objective lens, a second X-axis servo and a second Y-axis servo;
The probe card shaking module comprises a third X-axis servo, a third Y-axis servo and a Z-axis servo which are used for being connected with the placement platform in a matched mode;
The automatic pin inserting device further comprises an electrostatic grounding module, wherein the electrostatic grounding module is electrically connected with the probe card placing module, the feeding module, the probe card shaking module and the probe grabbing module, the electrostatic grounding module comprises an electrostatic eliminating device and an equipotential wiring, and the electrostatic grounding module is used for ensuring that no potential difference exists between the probe card and the probe during insertion.
13. In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically linked, may be directly linked, may be indirectly linked through an intervening medium, and may be in communication between two elements or in an interactive relationship therebetween, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
14. In the present application, the terms "center," "upper," "lower," "axial," "bottom," "inner," "outer," and the like refer to an azimuth or positional relationship based on the azimuth or positional assembly relationship shown in the drawings, for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and therefore should not be construed as limiting the application.
15. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
Due to the application of the scheme, compared with the prior art, the invention has the following advantages and effects:
(1) Through implementation of the technical scheme, the probe holes on the manual pin board are arranged in a sparse mode (the distance is 2 mm) through design, so that a worker can easily insert probes on the manual pin board, then a manipulator grabs the probes of the manual pin board, and the probes are moved to a probe card to conduct precise pin insertion.
(2) Through implementation of the technical scheme of the invention, the camera photographs and acquires the hole site coordinates of the finished probe card, then the camera is moved to the position above the artificial pin pad, the photograph is taken and acquires the hole site and the probe coordinates of the artificial pin pad, the finished probe card hole site is matched with the probes on the artificial pin pad through feedback to the PC control module, and meanwhile, the displacement value (X direction, Y direction and theta direction) of each probe which needs to be moved to the corresponding probe hole is analyzed and calculated.
(3) Through implementation of the technical scheme of the invention, the probe card consists of two layers, and when the manipulator for grabbing the probe places the probe deep into one layer of thickness, the manipulator is controlled to release the probe, and under normal conditions, the probe can slide into a hole site of the second layer of probe card due to gravity. When no probe is inserted, the upper and lower layers of probe cards are controlled to be separated from the probes by a certain height, and then the probes are moved back and forth up and down and left and right in a small amplitude, so that the probes are shaken into the holes of the second layer of probe cards.
(4) By implementing the technical scheme of the invention, when the manipulator grabs the probe to vertically descend for inserting the pin, the camera shoots and analyzes the image. Firstly, the probe size is small, the horizontal and vertical positions of all probes cannot be guaranteed to be consistent by the grabbing of a mechanical arm, the accurate positions are required to be determined by photographing and fed back to the mechanical arm for accurate adjustment, and the mechanical arm is ensured to control the probes to be inserted into the probe card hole sites; secondly, the probes may not enter the second layer of probe card holes due to adsorption, surface stains and other reasons, whether the probes slide down into the next layer of probe card holes or not needs to be judged, and whether the probe cards are separated to move back and forth to enable the probes to enter the probe card holes or not is controlled.
Drawings
FIG. 1A is a schematic perspective view of a probe with a desired pin in an embodiment of the present invention;
FIG. 1B is a front view of a probe according to an embodiment of the present invention;
FIG. 1C is a top view of a probe according to an embodiment of the present invention;
FIG. 2A is a schematic perspective view of a finished probe card according to an embodiment of the present invention;
FIG. 2B is a schematic diagram showing a finished probe card in a partially enlarged view according to an embodiment of the present invention;
FIG. 2C is a front view of a finished probe card in an embodiment of the invention;
FIG. 3 is a schematic diagram of a dual layer finished probe card insert probe in an embodiment of the invention;
FIG. 4 is a schematic diagram of an artificial pin pad according to an embodiment of the present invention;
FIG. 5 is a system block diagram of a probe card probe hole and manual pin pad probe position matching system in an embodiment of the invention;
FIG. 6 is a schematic diagram of the definition of the hole site name of the finished probe disc in the embodiment of the invention;
FIG. 7 is a schematic diagram of the definition of the hole site names of the manual pin plates according to the embodiment of the invention;
FIG. 8 is a flow chart of a horizontal camera fine alignment system in an embodiment of the invention;
FIG. 9 is a flow chart of probe card jitter displacement in an embodiment of the present invention;
FIG. 10 is a schematic diagram of an apparatus according to an embodiment of the present invention;
FIG. 11 is a schematic block diagram of the whole set of the method in the embodiment of the invention.
The parts of the above figures are shown as follows:
1. Feeding module
11. Feeding probe disc
2. Probe card placement module
21. Placement platform
3. Probe card shaking module
31. Third X-axis servo
32. Third Y-axis servo
33 Z-axis servo
4. First position information acquisition module
41. Vertical camera
42. First high power objective lens
43. First X-axis servo shaft
44. First Y-axis servo
5. Probe grabbing module
51. Mechanical arm
6. Second position information acquisition module
61. Horizontal camera
62. Second high power objective lens
63. Second X-axis servo
64. Second Y-axis servo
7. Electrostatic grounding module
71. Static eliminator
72. Equipotential wiring
8. Probe with a probe tip
9. Probe card
90. Probe card hole site
91. First layer probe card
92. Second layer probe card
10 PC control module
101. An image acquisition card.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
As shown in fig. 2 to 11, the embodiments of the present invention provide an automatic pin inserting method, an automatic pin inserting device, a computer device and a storage medium for a semiconductor probe card, so as to solve the following technical problems:
(1) The probe card pin inserting device is used for replacing manual card inserting, so that the labor is saved, the efficiency is improved, and the product quality is ensured;
(2) Using an image recognition method, firstly shooting a pinhole position coordinate on a probe card substrate, and inputting the pinhole position coordinate into a system;
(3) Automatically recognizing the probe by using an image recognition method, controlling the manipulator 51 to grasp the probe and automatically adjusting the probe position to be placed in the probe card hole site 90;
(4) By controlling the probe card displacement shake, the micro-displacement shake up and down, left and right, front and back, the probe which does not completely enter the probe card hole site 90 is vibrated into the board card.
In the embodiment of the present invention, the pins are performed for the probes of fig. 1A, fig. 1B and fig. 1C, and the finished probe card 9 is shown in fig. 2A, fig. 2B and fig. 2C, where the finished probe card 9 has two layers, i.e. an upper layer and a lower layer, and has a first layer of probe card 91 and a second layer of probe card 92, and the probe card has probe card holes 90.
Example 1
The embodiment of the invention provides an automatic pin inserting method of a semiconductor probe card, which is used for automatically inserting pins of the probe card, wherein the probe card comprises a first layer of probe card and a second layer of probe card which are arranged up and down, and probe card hole sites which correspond to each other up and down are arranged on the first layer of probe card and the second layer of probe card; the method comprises the following steps:
(1) Matching probe and probe card hole site
Respectively acquiring probe position information on a feeding probe disc and probe card hole position information of a probe card; analyzing the corresponding position coordinates of the matched probes and the probe card hole sites according to the probe position information of the feeding probe disc and the probe card hole site information;
(2) Insertion probe
The grabbing probe moves to the position above the corresponding position coordinate of the probe card hole site, horizontal relative position information of the projection of the probe and the probe card hole site in the horizontal direction is obtained, and whether the horizontal relative position of the probe and the probe card hole site has deviation is judged;
If the deviation does not exist, the probe is loosened after the probe is controlled to be inserted into the probe hole position of the first layer of probe card to a set depth; if the deviation exists, the position of the probe is adjusted according to the deviation value, then the probe is controlled to be inserted into the probe card hole site of the first layer of probe card to a set depth, and then the probe is loosened; after loosening the probes, the probes fall towards the probe card hole site direction of the second layer of probe card;
(3) Probe card position adjustment
Acquiring vertical relative position information projected in the vertical direction after the probe falls, and judging whether the probe passes through a probe card hole site of the second layer of probe card according to the vertical relative position information;
when the probe is judged to pass through the probe card hole site of the second layer of probe card, the next probe insertion operation is carried out;
When the probe does not pass through the probe card hole site of the second layer of probe card, the probe and the second layer of probe card are controlled to do relative motion in the depth direction, so that the probe and the second layer of probe card are separated, the probe is released, and then the probe can penetrate into the probe card hole site of the second layer of probe card by controlling the displacement and shaking of the probe card; then, continuously judging whether the probe passes through the probe card hole site of the second layer of probe card according to the re-acquired vertical relative position information, and repeating the steps until the probe passes through the probe card hole site of the second layer of probe card;
(4) Pin execution
And (3) repeating the steps (2) and (3) until the probe card is fully inserted with probes, and ending the insertion of the probes.
In the first embodiment of the present invention, before the step (1) is performed to match the probe with the probe card hole site, the feeding probe disc is manually fed, specifically, the probe is manually inserted into each probe hole site of the feeding probe disc, and the feeding probe disc is manually placed into the feeding station;
When the step (1) is executed to match the probe with the probe card hole site, the probe position information on the feeding probe disc and the probe card hole site information of the probe card are respectively obtained, the method comprises the following steps:
shooting by a camera to obtain the position information of the probe on the feeding probe disc;
The manipulator moves the camera to the upper part of the probe card;
photographing to obtain hole site information of the probe card;
And distributing each probe to a corresponding probe hole, calculating the gesture coordinates of the probe, and calculating the position coordinates of the probe to the corresponding probe hole.
Specifically, the PC control module 10 defines the hole site names of the finished probe disc and the manual probe disc, the finished probe card starts to be ordered by uppercase letters, the manual probe disc starts to be ordered by lowercase letters, and the manual probe disc is followed by numbers, for example, the finished probe card is named as a01/B01/C01/D01 … … anticlockwise; the manual pin board is named as a01/b01/c01/d01 … …; the manual pin plate is matched with the finished product probe card hole site 90 as follows: a→a, b→b, c→c … ….
In a first embodiment of the present invention, when the step (1) is performed to match the corresponding position coordinates of the probe and the probe card hole site in the analysis matching probe and the probe card hole site, the method includes the following steps:
Transmitting the acquired probe position information of the feeding probe disc 11, probe card hole site 90 information and coordinate information of the movement of the manipulator 51 to the PC control module 10;
the PC control module 10 performs image processing and position calculation, calculates the positions of the probe card and the probe disc, marks the probes and coordinates of the feeding probe disc 11 and marks the hole positions 90 and coordinates of the probe card;
distributing each probe to a corresponding probe hole, calculating the corresponding position coordinates of the probe to the corresponding probe hole, and calculating the probe attitude coordinates;
the manipulator 51 grabs the probe and adjusts the three degree of freedom coordinates to the corresponding probe hole according to the information distributed by the PC control module 10.
In a first embodiment of the present invention, in the step of performing the step (2) of obtaining horizontal relative position information of the probe and the probe card hole site in the probe, the horizontal relative position information is positional deviation information of the probe and the probe card hole site in a horizontal position, the step includes:
The horizontal camera 61 shoots and acquires the position deviation of the probe and the probe hole in the X direction;
Camera shaft movement;
The horizontal camera 61 shoots and acquires the position deviation of the probe and the probe hole in the Y direction;
The probe-to-probe well X-direction deviation information and the probe-to-probe well Y-direction deviation information are transmitted to the PC control module 10 to obtain horizontal relative position information of the probe and the probe card well 90.
In the process of acquiring the horizontal relative position information as the position deviation information of the probe and the probe card hole site on the horizontal position, the horizontal camera can be used for photographing the probe from the horizontal direction to determine the coordinates of the probe so as to acquire the horizontal X-direction position deviation and the Y-direction deviation, or a vertical camera can be used for acquiring the probe information projected on the X-Y plane and the probe hole information so as to acquire the horizontal X-direction position deviation and the Y-direction deviation of the probe, and in the step of acquiring the horizontal relative position information of the probe and the probe card hole site by the horizontal camera, an image recognition mode is adopted for processing and analyzing.
In a first embodiment of the present invention, in the step of performing the position adjustment of the probe card in the step (3) to obtain vertical relative position information of the probe projected in the vertical direction after the probe falls, the vertical relative position information is position deviation information of the probe and the probe card hole site on the vertical position and the upper and lower layers of probe cards, and the step includes:
Photographing to obtain position deviation information of the probe and the probe hole in the Z direction;
And transmitting the Z-direction position deviation information of the probe and the probe hole to a PC control module so as to obtain the vertical relative position information of the probe and the probe card hole site, and judging whether the probe passes through the probe card hole site of the second layer of probe card according to whether the position deviation value exists between the probe and the probe card.
In the first embodiment of the present invention, in the step (3) of adjusting the probe card position, when it is determined that the probe does not fall into the second layer of probe card 92, the PC control module 10 outputs an instruction to enable the manipulator 51 to grasp the probe card and move in the Z direction to separate the upper and lower layers of probes, the card releases the probes, and then controls the probe card to move in the X direction, the Y direction, and the Z direction to perform displacement shake, so that the probes slide into the probe holes of the second layer of probe card 92; after the probes slide down into the probe holes of the second layer of probe card 92, the probe card stops shaking and resumes its original state. When the probe card is controlled to perform displacement shake, the probe card performs reciprocating displacement shake at least in the direction X, Y, preferably simultaneously in the direction X, Y, Z.
And controlling the depth of the probe inserted into the probe hole, wherein the tip of the probe penetrates through the probe hole position of the first layer of probe card and is positioned at the depth distance between cavities formed between the upper layer of probe card and the lower layer of probe card.
In the process of controlling the probe card to be separated from the probe in the depth direction and then releasing the probe, the relative separation of the probe card and the probe may include separating the first layer of probe card from the second layer of probe card to separate the second layer of probe card from the probe, or pulling the probe upward in the Z direction, or fixing the probe by a manipulator and then moving the probe card downward in the Z axis to complete the separation operation. Before the probe card is subjected to displacement and shaking, at least the probes are dropped into the probe card hole sites of the first layer of probe card.
Example two
The second embodiment of the invention provides an automatic pin inserting device of a semiconductor probe card, which comprises:
the feeding module 1 is used for placing a feeding probe disc 11;
a probe card placing module 2 for placing a probe card to be inserted with a first layer of probe cards 91 and a second layer of probe cards 92;
The probe card shaking module 3 is used for driving the probe card to move up and down, left and right and front and back so as to perform displacement shaking;
The first position information obtaining module 4 is used for obtaining the probe position information of the feeding probe disc 11, the probe card hole site 90 information and the horizontal relative position information of the probe and the probe card hole site 90;
the probe grabbing module 5 is used for grabbing probes on the feeding probe disc 11 and inserting the probes into the probe card;
the second position information acquisition module 6 is used for acquiring the vertical relative position information of the probe inserted into the probe hole;
The PC control module 10 is used for analyzing and matching the corresponding position coordinates of the probe and the probe card hole site 90 according to the probe position information of the feeding probe disc 11 and the probe card hole site 90 information; for judging whether the relative positions of the probes and the probe card holes 90 deviate or not according to the horizontal relative position information of the probes and the probe card holes 90; the probe grabbing module 5 is used for controlling the probe grabbing module 5 to adjust the probe inserting position according to the deviation value; for judging whether the probe falls into the second layer probe card 92 based on the vertical relative position information of the probe inserted into the probe hole; for controlling the probe card shaking module 3 to perform displacement shaking when it is judged that the probes do not fall into the second layer of probe card 92.
In the second embodiment of the present invention, the device further includes an electrostatic grounding module 7, the electrostatic grounding module 7 is electrically connected with the probe card placement module 2, the feeding module 1, the probe card shaking module 3, and the probe grabbing module 5, the electrostatic grounding module 7 includes an electrostatic eliminating device 71 and an equipotential connection 72, and the electrostatic grounding module 7 is used for ensuring that no potential difference exists between the probe card and the probe during plugging.
The following describes each part of the second embodiment of the present invention in detail.
(1) The feeding module 1 is used for placing the feeding probe disc 11, the feeding probe disc 11 is used for manual contact pins, the distance between the probe holes is increased (the distance is 2 mm) due to design, and the manual contact pins are convenient to use. Wherein the feeding probe disc 11 is composed of a row of sparse probe holes, the probes are manually inserted into the feeding probe disc 11, and hooks at the bottom of the probes are exposed to hook the feeding probe disc 11, so that the probes can be conveniently grasped by the mechanical arm 51. The structure of the loading probe plate 11 is as follows as shown in fig. 4.
(2) The probe grabbing module 5 comprises a manipulator 51 with at least four degrees of freedom, and a claw hand is arranged at the tail end of the manipulator 51 and used for grabbing and loosening a probe; the robot arm 51 has four degrees of freedom, and can move in an X direction, a Y direction, a Z direction, and a θ direction, respectively, wherein the X direction and the Y direction control horizontal movement, the Z direction control vertical movement, and the θ direction control a probe rotation angle. The robot arm 51 has a jaw at its extreme end for grasping and releasing the probe.
(3) The first position information obtaining module 4 comprises a vertical photographing system, wherein the vertical photographing system mainly comprises a vertical camera 41, a first high-power objective lens 42, a first X-axis servo axis and a first Y-axis servo axis;
the probe and the probe hole have small size, and a pixel with micron-level resolution is required, 2400 ten-thousand cameras can be selected to be matched with an objective lens of 10 times, the resolution can be 0.6 micron, and accurate probe and probe card position information can be obtained;
the first X-axis servo shaft and the first Y-axis servo shaft form a horizontal movement system for controlling the vertical camera 41 to move in the horizontal direction, so that the probe card image can be shot, and the probe image of the feeding probe disc 11 can be shot. Meanwhile, by moving the size information, the position of the probe card corresponding to the probe can be calculated for controlling the movement of the manipulator 51.
(4) The second position information obtaining module 6 comprises a horizontal photographing system, wherein the horizontal photographing system mainly comprises a horizontal camera 61, a second high power objective lens 62, a second X-axis servo and a second Y-axis servo;
Due to errors such as mechanical and axial gaps, the manipulator 51 has a certain position error when grabbing the probe, and the consistency of the grabbing positions of the probe cannot be ensured. Since the probe and probe card dimensions are small, small errors can cause pin failure, requiring an additional fine positioning feedback. The horizontal camera 61 is used to obtain the position deviation of the probe and the probe hole in the X direction by moving the moving axis in the X direction, and the position deviation of the probe and the probe hole in the Y direction by moving the moving axis in the Y direction is fed back to the PC control module 10, and the PC control module 10 controls the manipulator 51 to perform fine positioning adjustment.
(5) The probe card shaking module 3 comprises a probe card shaking system which mainly comprises a third X-axis servo, a third Y-axis servo and a Z-axis servo which are used for being in matched connection with the placing platform 21; the probe card placement module 2 comprises a placement platform 21;
The probe card shake system has three degrees of freedom, and can move in the X direction, the Y direction and the Z direction respectively, wherein the X direction and the Y direction control horizontal movement, and the Z direction controls vertical movement, and the structure is shown in figure 10.
When the manipulator 51 inserts the probe into the probe card, the manipulator 51 releases the probe after lowering by a certain height, and the probe generally slides freely into the probe hole of the second layer probe card 92. But the probes cannot freely fall into the probe holes of the second layer probe card 92 due to dirt, surface suction, etc. At this time, the horizontal photographing system determines whether the probe falls into the second layer probe hole, if the probe does not fall into the second layer probe hole, the PC control module 10 controls the probe card shaking system to move in the Z direction to separate the upper layer probe card from the lower layer probe card, and then the probe card shaking system moves in the X direction, the Y direction and the Z direction to slightly shift and shake, so that the probe slides into the second layer probe card 92 probe hole.
The second position information acquiring module 6 (horizontal photographing system) photographs at a certain frequency to determine whether the probe card falls into the probe hole of the second layer probe card 92, and feeds back the PC control module 10 until the probe card falls, and the PC control module 10 controls the probe card shake system to stop shaking and restore the initial state.
(6) PC control module 10
The PC control module 10 is a computer control system, and is composed of a motion control card, a CPU, etc., wherein the motion control card controls the motion of the motion axis, the CPU is used for distributing the probe to match with the probe hole, analyzing the image, calculating the offset, etc., and before the image information is collected, the image collecting card 101 also collects the images captured by the horizontal camera 61 and the vertical camera 41.
The control flow of the probe card jitter PC is as follows: the PC control module 10 achieves X, Y, Z three directions of micro-jitter by controlling the third X-axis servo to move slightly around at a speed of 5 μm/s, by controlling the third Y-axis servo to move slightly back and forth at a speed of 5 μm/s, and by controlling the Z-axis servo to move slightly up and down at a speed of 5 μm/s.
(7) Electrostatic system
The electrostatic system is composed of an electrostatic eliminator 71, and an equipotential connection 72. Since the probe card is made of ceramic non-conductive material, the static electricity eliminating device 71 is used for eliminating static electricity at the probe card position, corona discharge is formed around the electrode needle by releasing high voltage, air is changed into ions, and the formed ions strike the probe and the probe card to eliminate static electricity. The probe is made of metal conductive materials, the contact materials of the probe and the probe are made of metal conductive materials except the probe card, and the probe and the contact parts thereof are guaranteed to be zero potential through metal equipotential design and external grounding. Through the electrostatic system, no potential difference is ensured between the probe card and the probe during the insertion, thereby ensuring the smoothness of the contact pin.
Example III
In a third aspect, an embodiment of the present invention provides a computer device based on an automatic pin inserting method of a semiconductor probe card, where the computer device includes a memory, a processor, and a computer program stored on the memory and capable of running on the processor, where the processor executes the computer program to implement the steps of the method according to the first aspect of the present invention.
Example IV
A fourth embodiment of the present invention provides a computer readable storage medium based on an automatic pin inserting method of a semiconductor probe card, where the computer readable storage medium stores a computer program, and when the computer program is executed by a processor, the computer program causes the processor to execute the steps of the method according to the first aspect of the present invention.
Through implementation of the embodiments of the present invention, the main method steps and apparatus of the present invention include the following bright points:
(1) Sparse arrangement of manual pin pad probes
One of the bright spots of the present invention: the probe holes on the manual pin pad are arranged in a sparse mode (the distance is 2 mm) through design, so that a worker can easily insert probes on the manual pin pad, and then the manipulator 51 grabs the probes of the manual pin pad and moves to the probe card to conduct precise pin insertion.
(2) Static electricity eliminating method
The second bright point of the invention: because the probe card is made of ceramic non-conductive materials and has small size, the probe card is extremely easy to cause position deviation and hole failure when static electricity is not eliminated during grabbing and inserting the pins. And releasing high voltage around the electrode needle to form corona discharge to change air into ions, and the formed ions strike the probe and the probe card to eliminate static electricity.
(3) Image recognition finished probe card hole site 90, artificial pin disc hole site and probe
Third point of the present invention: the vertical camera 41 shoots and obtains the coordinates of the hole site 90 of the finished probe card, then the vertical camera 41 is moved to the upper part of the manual pin board, the shooting and obtains the hole site of the feeding probe board 11 and the coordinates of the probe, the finished probe card hole site 90 is matched with the probes on the feeding probe board 11 through feedback to the PC control module 10, and meanwhile, the displacement value (X direction, Y direction and theta direction) of each probe which needs to be moved to the corresponding probe hole is analyzed and calculated.
(4) Double-layer probe card shaking type pin inserting method
The invention has four bright spots: the probe card is composed of two layers, when the manipulator 51 for grabbing the probe places the probe deep into one layer of thickness, the manipulator 51 is controlled to release the probe, and the probe normally slides back into the hole site 90 of the second layer of probe card 92 due to gravity. When no probe is inserted, the upper and lower layers of probe cards are controlled to be separated by a certain height, and then the upper and lower layers of probe cards are moved back and forth in a small amplitude to shake the probe into the hole site 90 of the second layer of probe card 92.
(5) Camera shooting confirmation probe pin
Fifth, the invention has bright spots: when the robot arm 51 grips the probe vertically down for the pin, the horizontal camera 61 performs photographing for image analysis. Firstly, the probe size is small, the horizontal and vertical positions of all probes cannot be guaranteed to be consistent by grabbing by the manipulator 51, and the accurate positions are required to be determined by photographing and fed back to the manipulator 51 for accurate adjustment, so that the manipulator 51 is ensured to control the probes to be inserted into the probe card hole sites 90; secondly, the probes may not enter the hole sites 90 of the second layer of probe card 92 due to adsorption, surface stains and other reasons, whether the probes slide down into the hole sites 90 of the next layer of probe card needs to be judged, and whether the probe card is separated to move back and forth to enable the probes to enter the hole sites 90 of the probe card is controlled.
As shown in FIG. 11, the embodiment of the invention comprises the following steps:
(1) A probe is manually inserted into the feeding probe disc 11, and the probe is delivered to a machine for control after the probe is inserted;
(2) Photographing by a camera to obtain the coordinates of the hole site 90 of the finished probe card;
(3) The camera moves through the shaft to reach the position above the feeding probe disc 11, and the position of the hole of the feeding probe disc 11 and the coordinates of the probe are obtained by photographing;
(4) The PC computer analyzes and gathers the information of the hole site 90 of the finished probe card and the information of the probe position of the feeding probe disc 11, distributes the probes of the feeding probe disc 11 to the positions of the probe holes of the finished probe card, and calculates the positions (X direction, Y direction and theta direction) of three degrees of freedom which need to be adjusted of the corresponding probe holes of each needle;
(5) The manipulator 51 grabs the probe and adjusts the three-degree-of-freedom coordinates to the corresponding probe hole according to the PC distribution information;
(6) The accurate position of the probe is determined to be fed back to the manipulator 51 by image analysis of photographing of the accurate position camera, and the manipulator 51 carries out accurate adjustment according to the position feedback;
(7) The manipulator 51 controls the probe to be inserted into the upper layer probe card hole site 90, and after the probe descends to a certain height, the probe is released, so that the probe freely slides into the second layer probe card 92 hole site 90;
(8) And (3) performing image analysis by a camera, if the probe card does not enter the hole site 90 of the second layer of probe card 92, controlling the probe card to be separated, and moving up and down, left and right, and back and forth, and enabling the probe to enter the hole site 90 of the second layer of probe card 92 by a shaking and vibrating method.
(9) And (5) finishing the pin insertion of one pin, and repeating the steps 5-8 until the probe card is fully inserted, and finishing the pin insertion.
The above embodiments are provided to illustrate the technical concept and features of the present invention and are intended to enable those skilled in the art to understand the content of the present invention and implement the same, and are not intended to limit the scope of the present invention. All equivalent changes or modifications made in accordance with the spirit of the present invention should be construed to be included in the scope of the present invention.
Claims (8)
1. The automatic pin inserting method for the semiconductor probe card is used for automatically inserting pins of the probe card, the probe card comprises a first layer of probe card and a second layer of probe card which are arranged in parallel up and down, and probe card hole sites which correspond up and down one by one are arranged on the first layer of probe card and the second layer of probe card;
Characterized in that the method comprises the steps of:
(1) Matching probe and probe card hole site
Respectively acquiring probe position information on a feeding probe disc and probe card hole position information of a probe card; analyzing the corresponding position coordinates of the matched probes and the probe card hole sites according to the probe position information of the feeding probe disc and the probe card hole site information;
(2) Insertion probe
The grabbing probe moves to the position above the corresponding position coordinate of the probe card hole site, and horizontal relative position information of the probe and the probe card hole site projected in the horizontal direction is obtained, wherein the horizontal relative position information is position deviation information of the probe and the probe card hole site projected on the horizontal position;
the horizontal camera is aligned to the probe from the horizontal direction, and the position deviation of the probe and the probe card hole site in the horizontal X direction is obtained by photographing;
Camera shaft movement;
Photographing by a horizontal camera to obtain the Y-direction position deviation of the probe and the probe card hole site;
Transmitting the X-direction deviation information of the probe and the probe card hole site and the Y-direction deviation information of the probe and the probe hole site to a PC control module so as to obtain the horizontal relative position information of the probe and the probe card hole site;
Judging whether the horizontal relative positions of the probes and the probe card hole sites have deviation or not;
If the deviation does not exist, the probe is loosened after the probe is controlled to be inserted into the probe hole position of the first layer of probe card to a set depth; if the deviation exists, the position of the probe is adjusted according to the deviation value, then the probe is controlled to be inserted into the probe card hole site of the first layer of probe card to a set depth, and then the probe is loosened; after loosening the probes, the probes fall towards the probe card hole site direction of the second layer of probe card;
(3) Probe card position adjustment
Acquiring vertical relative position information projected in the vertical direction after the probe falls, wherein the vertical relative position information is position deviation information of the probe and the probe card holes on the vertical position and the upper and lower layers of probe cards;
Photographing to obtain position deviation information of the probe and the probe hole in the Z direction;
transmitting the Z-direction position deviation information of the probe and the probe hole to a PC control module so as to obtain the vertical relative position information of the probe and the probe card hole site, and judging whether the probe passes through the probe card hole site of the second layer of probe card according to whether the position deviation value exists between the probe and the probe card;
when the probe is judged to pass through the probe card hole site of the second layer of probe card, the next probe insertion operation is carried out;
When the probe does not pass through the probe card hole site of the second layer of probe card, the probe and the second layer of probe card are controlled to do relative motion in the depth direction, so that the probe and the second layer of probe card are separated, the probe is released, and then the probe can penetrate into the probe card hole site of the second layer of probe card by controlling the displacement and shaking of the probe card; then, continuously judging whether the probe passes through the probe card hole site of the second layer of probe card according to the re-acquired vertical relative position information, and repeating the steps until the probe passes through the probe card hole site of the second layer of probe card;
(4) Pin execution
And (3) repeating the steps (2) and (3) until the probe card is fully inserted with probes, and ending the insertion of the probes.
2. The method for automatically inserting pins of a semiconductor probe card according to claim 1, wherein: before the step (1) is executed to match probes with probe card hole sites, the feeding probe disc is fed manually, specifically, the probes are inserted into the probe hole sites of the feeding probe disc manually, and the feeding probe disc is put into a feeding station manually;
When the step (1) is executed to match the probe with the probe card hole site, the probe position information on the feeding probe disc and the probe card hole site information of the probe card are respectively obtained, the method comprises the following steps:
shooting by a camera to obtain the position information of the probe on the feeding probe disc;
The manipulator moves the camera to the upper part of the probe card;
photographing to obtain hole site information of the probe card;
And distributing each probe to a corresponding probe hole, calculating the gesture coordinates of the probe, and calculating the position coordinates of the probe to the corresponding probe hole.
3. The method for automatically inserting pins of a semiconductor probe card according to claim 2, wherein: when the corresponding position coordinates of the analysis matching probe and the probe card hole site in the step (1) are executed, the method comprises the following steps:
Transmitting the acquired probe position information of the feeding probe disc, probe card hole position information and coordinate information of the movement of the manipulator to a PC control module;
the PC control module performs image processing and position calculation, calculates the positions of the probe card and the probe disc, marks the probes and coordinates of the feeding probe disc and marks the holes and coordinates of the probe card;
Distributing each probe to a corresponding probe card hole site, calculating the corresponding position coordinates of the probe to the corresponding probe card hole site, and calculating the probe attitude coordinates;
And the manipulator grabs the probe and adjusts the three-degree-of-freedom coordinates to the corresponding probe card hole sites according to the distribution information of the PC control module.
4. The method for automatically inserting pins of a semiconductor probe card according to claim 1, wherein: in the step (3), when the probe does not fall into the second layer of probe card, outputting an instruction by the PC control module to enable the manipulator to grasp the probe and move and separate in the Z direction so as to enable the bottom end of the probe to be separated from an orifice of the lower layer of probe card, loosening the probe to fall off, and then controlling the probe card to move in the X direction, the Y direction and the Z direction to perform displacement shake so as to enable the probe to slide into a probe hole of the second layer of probe card; after the probes slide down into the probe holes of the second layer of probe card, the probe card stops shaking and resumes the initial state.
5. An automatic pin inserting device for a semiconductor probe card, the device comprising:
the feeding module is used for placing a feeding probe disc;
the probe card placing module is used for placing a probe card to be inserted with a pin, and the probe card is provided with a first layer of probe card and a second layer of probe card;
The probe card shaking module is used for driving the probe card to move up and down, left and right and front and back so as to perform displacement shaking;
The first position information acquisition module is used for acquiring the probe position information of the feeding probe disc and the probe card hole position information, and selectively acquiring the horizontal relative position information of the probe and the probe card hole position;
the probe grabbing module is used for grabbing probes on the feeding probe disc and inserting the probes into the probe card;
the second position information acquisition module is used for acquiring vertical relative position information of the probe inserted into the probe hole and selectively acquiring horizontal relative position information of the probe and the probe card hole site;
the PC control module is used for analyzing the corresponding position coordinates of the matched probe and the probe card hole site according to the probe position information of the feeding probe disc and the probe card hole site information; the probe card is used for judging whether the relative positions of the probe and the probe card hole position have deviation according to the horizontal relative position information of the probe and the probe card hole position; the probe grabbing module is used for controlling the probe grabbing module to adjust the probe inserting position according to the deviation value; the probe card is used for judging whether the probe falls into the second layer of probe card according to the vertical relative position information of the probe inserted into the probe hole; and the probe card shaking module is used for controlling the probe card shaking module to perform displacement shaking when judging that the probes do not fall into the second layer of probe card.
6. The automatic pin inserting device for semiconductor probe card according to claim 5, wherein:
The probe card placing module comprises a placing platform;
The first position information acquisition module comprises a vertical photographing system, wherein the vertical photographing system mainly comprises a vertical camera, a first high-power objective lens, a first X-axis servo shaft and a first Y-axis servo shaft;
the probe grabbing module comprises a manipulator with at least four degrees of freedom, wherein the tail end of the manipulator is provided with a claw hand which is used for grabbing and loosening a probe;
The second position information acquisition module comprises a horizontal photographing system which mainly comprises a horizontal camera, a second high-power objective lens, a second X-axis servo and a second Y-axis servo;
The probe card shaking module comprises a third X-axis servo, a third Y-axis servo and a Z-axis servo which are used for being connected with the placement platform in a matched mode;
The automatic pin inserting device further comprises an electrostatic grounding module, wherein the electrostatic grounding module is electrically connected with the probe card placing module, the feeding module, the probe card shaking module and the probe grabbing module, the electrostatic grounding module comprises an electrostatic eliminating device and an equipotential wiring, and the electrostatic grounding module is used for ensuring that no potential difference exists between the probe card and the probe during insertion.
7. A computer device comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized by: the processor, when executing the computer program, implements the steps of the method of any one of claims 1 to 4.
8. A computer readable storage medium having stored thereon a computer program which, when executed by a processor, causes the processor to perform the steps of the method according to any of claims 1 to 4.
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| US5644245A (en) * | 1993-11-24 | 1997-07-01 | Tokyo Electron Limited | Probe apparatus for inspecting electrical characteristics of a microelectronic element |
| CN105445643A (en) * | 2015-11-12 | 2016-03-30 | 杭州长川科技股份有限公司 | Full-automatic prober image positioning system |
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| US6114869A (en) * | 1998-05-21 | 2000-09-05 | Cerprobe Corporation | Method and apparatus for interfacing between automatic wafer probe machines, automatic testers, and probe cards |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5644245A (en) * | 1993-11-24 | 1997-07-01 | Tokyo Electron Limited | Probe apparatus for inspecting electrical characteristics of a microelectronic element |
| CN105445643A (en) * | 2015-11-12 | 2016-03-30 | 杭州长川科技股份有限公司 | Full-automatic prober image positioning system |
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