CN114447178A - An LED bracket - Google Patents

Abstract

The invention provides an LED bracket which comprises a bowl-shaped main body, wherein the side wall of the bowl-shaped main body is an insulating retaining wall; the bottom of the bowl-shaped main body is provided with at least three metal areas, wherein the metal areas comprise a first metal area for fixedly arranging an LED chip, a second metal area for providing a bonding wire landing point from the LED chip, a Zener diode or a third metal area, and a third metal area for fixedly arranging the Zener diode; the metal areas are mutually independent and insulated; the metal area is wholly or partially exposed on the inner side face of the bottom of the bowl-shaped main body.

Description

an LED bracket

technical field

The invention belongs to the technical field of LED display, and particularly relates to an LED bracket.

Background technique

The LED bracket of the prior art (hereinafter referred to as the bracket) generally forms an open bowl structure surrounded by four sides and sealed at the bottom, and the bottom is provided with two positive and negative metal areas, and two metal areas are separated. Insulating plastic area; the positive and negative metal areas extend to the outside of the bowl to form external pins for SMT placement.

When a Zener diode (hereinafter referred to as Zener) needs to be used, the structure of the Zener (horizontal structure NPN, PNP, vertical structure PN), polarity (upper positive and lower negative, lower positive and upper negative) and Determine the metal area where the Zener is installed and the corresponding gold wire bonding direction. Once an error occurs, it will not be able to correct the error, resulting in product scrap.

For example, the zener with positive and negative polarity, vertical PN structure must be fixed in the negative metal area (because the Zener is a reverse working element). The resistance is very low, once the power is turned on, the current is too large, and it will burn quickly. The principle is the same in other cases.

In addition, when using the LED light-emitting diode chip (hereinafter referred to as the LED chip), if the installation direction is wrong, the distance between the P/N electrode of the LED chip and the positive and negative poles of the bracket to be connected is wrong, and the gold wires cross, which will not be corrected. Wrong, will also lead to product scrap.

SUMMARY OF THE INVENTION

In order to overcome the above technical defects, the present invention provides an LED bracket, which has an ingenious structure and is convenient to use.

In order to achieve the above purpose, the following technical solutions are adopted:

An LED bracket includes a bowl body, and the side wall of the bowl body is an insulating retaining wall; the bottom of the bowl body is provided with at least three metal areas, including a first place for fixing LED light-emitting diode chips. A metal area, a second metal area for providing a bonding wire landing point from an LED chip, a Zener diode or a third metal area, a third metal area for fixing the Zener diode; the metal areas are independent of each other and Insulation; all or part of the metal area is exposed on the inner side of the bottom of the bowl body.

Preferably, the bottom of the bowl body is provided with three metal areas, which are respectively a first metal area for fixing the LED chip, and a first metal area for providing bonding from the LED chip, the Zener diode or the third metal area. The second metal area of the wire landing point and the third metal area for fixing the Zener diode; the first metal area and the third metal area are all exposed on the inner side surface of the bottom of the bowl body.

Preferably, the metal region is a metal layer region, the metal layer region includes a copper alloy layer, and one or more metal layers such as silver, copper, nickel, gold, etc. are provided on the surface of the copper alloy layer;

Or the metal area is a ceramic metal layer area, and the ceramic metal urban area includes a ceramic substrate on which one or more metal layers such as silver, copper, nickel, palladium, and gold are arranged.

Preferably, when the metal region is a metal layer, an insulating region is provided between the metal regions;

When the metal region layer is a ceramic metal layer, no insulating region is provided between the metal regions.

Preferably, the insulating retaining wall and the insulating area are made of the same insulating material, and the insulating material is PCT or PPA or EMC or SM.

Preferably, a positive polarity mark or a negative polarity mark for indicating the positive and negative arrangement directions of the chips is provided on the insulating baffle wall.

Preferably, the area of the first metal region is larger than that of the second metal region, and the area of the second metal region is larger than the area of the third metal region.

Preferably, the area of the first metal region accounts for 55% to 65% of the exposed area of the bottom, the second metal region accounts for 10% to 15% of the exposed area of the bottom, and the third metal region accounts for 5% of the exposed area of the bottom. ~10%.

Preferably, the first metal area and the second metal area are exposed on the outer side surface of the bottom of the bowl body at the bottom of the main body.

Preferably, the second metal region includes a main body region and an extension region, the main body region and the extension region form an L-type metal region; the extension region is located on the long side of "L"; the extension region and the extension region One end of the main body area is connected with a hidden part, and the other end is an exposed part; the extension area is embedded in the insulating sidewall, and the insulating sidewall is provided with a window corresponding to the exposed part so that the exposed part can be opened. exposed to the outside world.

Compared with the prior art, the beneficial effects of the present invention are:

Through the above structure, on the one hand, due to the electrical independence of the third metal region, the structure type and polarity of the Zener can be arbitrarily selected by matching and connecting with different gold wires. On the other hand, in the case of inadvertently misusing zeners of different structure types or polarity types, through the correct wiring method, the production materials can be corrected and the losses can be recovered. In addition, in the case of temporary material shortages that require the use of different types of Zener diodes, with the correct wiring method, the production activities can be carried out smoothly, ensuring the production efficiency and product function unchanged.

Description of drawings

The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

FIG. 1 is a metal area arrangement of the LED bracket according to Embodiment 1 of the present invention (the front side of the LED bracket);

FIG. 2 is another metal area arrangement of the LED bracket according to Embodiment 1 of the present invention (the front side of the LED bracket);

FIG. 3 is another metal area arrangement of the LED bracket according to Embodiment 2 of the present invention (the front side of the LED bracket);

FIG. 4 is another arrangement of metal areas of the LED bracket according to Embodiment 2 of the present invention (the back of the LED bracket);

5 is a schematic diagram of a metal area structure of an application example of the LED bracket according to Embodiment 3 of the present invention (the front side of the LED bracket);

6 is a schematic diagram of another metal area structure of an application example of the LED bracket according to Embodiment 3 of the present invention (the front side of the LED bracket);

7 is a schematic diagram of a metal area structure of another application example of the LED bracket according to Embodiment 4 of the present invention (the front side of the LED bracket);

FIG. 8 is a schematic diagram of another metal area structure of another application example of the LED bracket according to Embodiment 4 of the present invention (the front side of the LED bracket).

in:

100-LED bracket; 101-first metal area; 102-second metal area; 103-third metal area; 104-plastic insulating wall; 105-insulating plastic area; 107-LED chip; 106-zener diode ;109- Polarity flag;

200-LED bracket; 201-first metal area; 202-second metal area; 202a-hidden part; 202b-exposed part; 209-polarity flag.

Detailed ways

The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, but not to limit the present invention.

The LED bracket of the present invention comprises a bowl body, the side wall of the bowl body is an insulating retaining wall; the bottom of the bowl body is provided with at least three metal areas, including a third metal area for fixing the LED light-emitting diode chip. a metal area, a second metal area for providing a bonding wire landing point from the LED chip, the Zener diode or the third metal area, a third metal area for fixing the Zener diode; the metal areas are independent of each other and insulation; all or part of the metal area is exposed on the inner side of the bottom of the bowl body.

Specifically, it is taken as an example that the bottom of the bowl body is provided with three metal areas, which are the first metal area for fixing the LED chip and the key for providing the key from the LED chip, the Zener diode or the third metal area. The second metal area of the bonding wire landing point, and the third metal area for fixing the Zener diode.

For the setting of the metal area on the inner side of the bottom of the bowl body, the details can be as follows:

The first metal area and the third metal area are all exposed on the inner side of the bottom of the bowl body; and the second metal area can be in the following two forms:

Form 1: The second metal area is completely exposed on the inner side of the bottom of the bowl body.

Form 2: The second metal area includes a main body area and an extension area. The main body area and the extension area form an L-shaped metal area; the extension area is located on the long side of the "L"; It is an exposed part; the extension area is embedded in the insulating sidewall, and the insulating sidewall is provided with a window corresponding to the exposed part so that the exposed part can be exposed to the outside world.

For the setting of the metal area on the outer side of the bottom of the bowl body, the details can be as follows:

Form 1: The metal area is not exposed on the outer side of the bottom of the bowl body at the bottom of the body

Form 2: The first metal area and the second metal area are exposed on the outer side surface of the bottom of the bowl body at the bottom of the main body.

In addition, the area of the first metal region is larger than that of the second metal region, and the area of the second metal region is larger than that of the third metal region. The area of the first metal region accounts for 55% to 65% of the area of the exposed part of the bottom, the second metal region accounts for 10% to 15% of the area of the exposed part of the bottom, and the third metal region accounts for 5% of the area of the exposed part of the bottom. %～10%.

The metal region is a metal layer region, the metal layer region includes a copper alloy layer, and one or more metal layers such as silver, copper, nickel, gold, etc. are arranged on the surface of the copper alloy layer. Or the metal area is a ceramic metal layer area, and the ceramic metal urban area includes a ceramic substrate on which one or more metal layers such as silver, copper, nickel, palladium, and gold are arranged.

Based on the structural form of the metal regions, the structural arrangements between the metal regions are also different. When the metal region is a metal layer, an insulating region is arranged between the metal regions; when the metal region layer is a ceramic metal layer, no insulating region is arranged between the metal regions.

Among them, the material of the insulating retaining wall and the insulating area is the same insulating material, and the insulating material is PCT or PPA or EMC or SM, etc., through injection molding.

A positive polarity sign or a negative polarity sign for indicating the positive and negative arrangement directions of the chips is arranged on the insulating retaining wall. According to actual needs, the LED chips can be arranged according to the polarity direction of the bracket defined by the polarity sign, which is consistent with its direction; of course, if there is no demand at some time, the LED chips can also be guided in this direction.

For the LED bracket of the present invention, the following two embodiments are now used to further illustrate:

Example 1

As shown in FIG. 1 , the LED bracket 100 includes: a bottom and a plastic insulating barrier wall 104 surrounded by a side surface, and the two form a bowl-cup structure with a certain volume. The bottom is composed of a first metal region 101, a second metal region 102, a third metal region 103, and an insulating plastic region 105 (the insulating region is made of plastic material) between the three metal regions. A polarity mark 109 is provided at one corner of the plastic insulating barrier wall 104 . Among the three metal regions, the first metal region 101 has the largest area, accounting for 55% to 65% of the bottom exposed area, the second metal region 102 accounts for 10% to 15% of the bottom exposed area, and the third metal region 103 accounts for 5%. ~10%, the remaining area is the insulating plastic area 105, and the three metal areas are exposed on the inner side of the bottom.

As shown in FIG. 2 , only the first metal area 101 and the second metal area 102 are also exposed on the outer side of the bottom of the bowl body of the LED holder 100 , and are used as surface mount pads of the LED. It can be fully compatible with the circuit pattern design of traditional LED mount PCB. The third metal region 103 is not exposed on the outer back surface of the LED holder 100.

Example 2

As shown in FIG. 3 , the LED bracket 200 is different from the LED bracket 100 in that the second metal area 202 has an extension area, the main body area and the extension area form an L-shape; the extension area is composed of a hidden part 202 a and an exposed part 202 b , the hidden portion 202a extends in parallel from the second metal region 202 to the first metal region 201 and is insulated from it, and is covered and hidden by a plastic insulating barrier wall, and the exposed portion 202b is at the end of the extension region, roughly aligned with the end of the first metal region , revealed in an open window in the plastic retaining wall.

As shown in FIG. 4 , which is the outer side of the bottom of the bowl-mounted body of the LED bracket 200 , the extended area including the hidden part 202 a and the exposed part 202 b are not exposed on the back of the LED bracket. Only the first metal area 201 and the second metal area 202 are exposed on the back side, which are used as surface mount pads of the LED, and the pads of this shape can be fully compatible with the circuit pattern design of the traditional LED mount PCB.

For the application of the LED bracket of the present invention, the following two embodiments are now used to further illustrate:

Example 3

This embodiment is an application example of Embodiment 1. As shown in FIG. 5 , when the polarity mark 109 is a negative polarity mark, a light-emitting diode chip 107 is mounted on the first metal region 101 ; the positive electrode of the light-emitting diode 107 faces the second In the metal region 102, the negative electrode faces the first metal region 101; the bonding alloy wire can be connected to the first and second metal regions 101/102 nearby. A P-up Zener diode 106-P is installed on the third metal region 103, and its top P pole is directly connected to the first metal region 101 when bonding wires, and the third metal region 103 and the second metal region are connected by bonding wires. When the regions 102 are connected to become the positive pole, the Zener and the LED chip work normally and conform to the positive and negative pole directions defined by the polarity mark 109 .

As shown in FIG. 6 , when the polarity mark 109 is defined as the positive polarity mark, the direction of the chip 107 is rotated by 180° compared with the situation in FIG. 5 , and the bonding wire can be connected to the first metal area 101 nearby , the second metal region 101/102, an N-up Zener diode 106-N is installed on the third metal region 103, the top N pole of which is directly connected to the second metal region 102, and the third metal region is connected by a bonding alloy wire. 103 is connected to the first metal region 101 as a positive electrode, then the Zener and the LED chip work normally, and conform to the direction of the positive and negative electrodes defined by the polarity mark 109 .

In fact, no matter whether the polarity mark 109 is a positive polarity mark or a negative polarity mark, the Zener diode 106 can be arbitrarily selected with different polarities, and there is a suitable bonding connection way to make it work normally. In other words, even if the Zener diode 106 is misused as a model with different polarities, it can still work normally by adopting a matching bonding connection method.

Example 4

This embodiment is an application example of Embodiment 2. As shown in FIGS. 7 and 8 , the LED bracket of Embodiment 2 can still be arbitrarily compatible with Zener diodes of different polarities, regardless of whether the polarity mark 109 is a positive polarity mark or a Negative polarity sign.

Compared with the first embodiment, the difference is that the second metal region 202 of the LED bracket 200 has an extension region.

When the polarity defined by the polarity mark 209 is negative, if the fixed polarity direction of the LED chip 107 is the same as the polarity mark, the electrode of the LED chip 107 is directly connected to the first metal area 201 and the second metal area. Zones 202 are connected (as shown in Figure 7);

If the fixed polarity direction of the LED chip 107 is opposite to the polarity mark, the right electrode of the LED chip 107 can be directly connected to the extension region 202b, and the other electrode can be connected to the first metal region 201 (as shown in FIG. 8).

In fact, no matter how the polarity mark 209 is defined, the LED chip can be placed in any direction, and the correct wiring method can be realized to make it work normally.

Through the above structure, the LED bracket of the present invention is provided with a third metal area for installing the Zener diode. On the one hand, due to the electrical independence of the third metal region, the structure type and polarity of the Zener can be arbitrarily selected by matching and connecting with different gold wires. On the other hand, in the case of inadvertently misusing zeners of different structure types or polarity types, through the correct wiring method, the production materials can be corrected and the losses can be recovered. In addition, in the case of temporary material shortage that requires the use of different types of Zener diodes, the correct wiring method can make the production activities run smoothly, ensuring the production efficiency and product function unchanged.

The above are only preferred embodiments of the present invention, and do not limit the present invention in any form. Therefore, any modification, Equivalent changes and modifications still fall within the scope of the technical solutions of the present invention.

Claims (10)

1. An LED support is characterized by comprising a bowl-shaped main body, wherein the side wall of the bowl-shaped main body is an insulating retaining wall; the bottom of the bowl-shaped main body is provided with at least three metal areas, wherein the metal areas comprise a first metal area for fixedly arranging an LED chip, a second metal area for providing a bonding wire landing point from the LED chip, a Zener diode or a third metal area, and a third metal area for fixedly arranging the Zener diode; the metal areas are mutually independent and insulated; the metal area is wholly or partially exposed on the inner side face of the bottom of the bowl-shaped main body.

2. The LED support according to claim 1, wherein the bottom of the bowl-shaped body is provided with three metal areas, namely a first metal area for fixing an LED chip, a second metal area for providing a bonding wire landing point from the LED chip, the Zener diode or a third metal area, and a third metal area for fixing the Zener diode; the first metal area and the third metal area are all exposed on the inner side face of the bottom of the bowl-shaped main body.

3. The LED support according to claim 1 or 2,

the metal area is a metal layer area, the metal layer area comprises a copper alloy layer, and one or more metal layers of silver, copper, nickel, gold and the like are arranged on the surface of the copper alloy layer;

or the metal area is a ceramic metal layer area, the ceramic metal urban area comprises a ceramic substrate, and one or more metal layers of silver, copper, nickel, palladium, gold and the like are arranged on the ceramic substrate.

4. The LED support according to claim 1 or 2,

when the metal areas are metal layers, insulating areas are arranged among the metal areas;

when the metal area layer is a ceramic metal layer, no insulating area is arranged between the metal areas.

5. The LED support according to claim 4, wherein the insulating wall and the insulating region are made of the same insulating material, and the insulating material is PCT, PPA, EMC or SM.

6. The LED support according to claim 1 or 2, wherein the insulating barrier is provided with a positive polarity mark or a negative polarity mark for indicating the positive and negative arrangement directions of the chip.

7. The LED holder according to claim 1 or 2, wherein the area of the first metal region is larger than the area of the second metal region, and the area of the second metal region is larger than the area of the third metal region.

8. The LED support according to claim 6, wherein the area of the first metal region is 55% to 65% of the area of the exposed area of the bottom, the area of the second metal region is 10% to 15% of the area of the exposed area of the bottom, and the area of the third metal region is 5% to 10% of the area of the exposed area of the bottom.

9. The LED support according to claim 1 or 2, wherein the first metal area and the second metal area are exposed at the outer side surface of the bottom of the bowl-shaped body at the bottom of the body.

10. The LED support of claim 2, wherein the second metal region comprises a body region and an extension region, the body region and the extension region forming an L-shaped metal region; the extension region is located on the long side of the L; one end of the extension area, which is connected with the main body area, is provided with a hidden part, and the other end of the extension area is an exposed part; the extension area is embedded in the insulating side wall, and the insulating side wall is provided with a window corresponding to the exposed part so that the exposed part can be exposed to the outside.

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