CN114421978B - Ultra-wideband high-power high-efficiency multi-band transmitting subsystem - Google Patents
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/03—Constructional details, e.g. casings, housings
- H04B1/036—Cooling arrangements
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
- H04B1/0458—Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
- H04B2001/0408—Circuits with power amplifiers
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Abstract
The invention discloses an ultra-wideband high-power high-efficiency multi-band emission subsystem, which comprises: the power supply unit is used for supplying power to the front-stage push amplifying unit and the final-stage power amplifying unit; the final-stage power amplification unit comprises a power divider module, a combiner module and 2 N final-stage power amplification modules, wherein the power divider module is connected with the front-stage push amplification unit and is used for equally dividing the radio frequency signal amplified by the first stage of the front-stage push amplification unit into 2 paths of N paths of power signals which are respectively output to the final-stage power amplification modules, and the combiner module is used for combining and outputting the power signals. The invention has the advantages of high power synthesis efficiency, high system stability, integrated miniaturization and the like.
Description
Technical Field
The invention relates to the technical field of microwave sources, in particular to an ultra-wideband high-power high-efficiency multi-band emission subsystem.
Background
In recent years, the application of high-power microwaves has been varied: satellite and space platform energy supply, deep space probe measurement and control communication, orbital vehicle altitude change propulsion system and the like, and any application needs extremely high power support. With the continuous development of semiconductor materials and processes, the output power magnitude of a microwave device is larger and larger, and although the working frequency and the power which can be achieved by a high-power device are higher and higher, the output power of a single power amplifier is still limited by the physical characteristics and the technological level of the device, and the output power of a single power amplifier tube is only hundreds of watts in the prior art, so that the output power of a single power amplifier tube needs to be achieved by a power synthesis method in order to achieve the high-power output of a kilowatt level. However, in such a large synthesis scale, it is difficult to maintain high synthesis efficiency, and problems such as consistency of each path, mutual isolation of each path, and stability of a synthesis network during multiplexing are needed to be solved.
Disclosure of Invention
The invention aims to provide an ultra-wideband high-power high-efficiency multi-band emission subsystem which has the advantages of high consistency of all branches during synthesis, good isolation among all branches, improved power synthesis efficiency and high system stability.
The technical aim of the invention is realized by the following technical scheme:
An ultra-wideband high power high efficiency multi-band transmit subsystem comprising: the power supply unit is used for supplying power to the front-stage push amplifying unit and the final-stage power amplifying unit;
The final-stage power amplification unit comprises a power divider module, a combiner module and 2 N final-stage power amplification modules, the power divider module is connected with the front-stage push amplification unit and is used for equally dividing the radio frequency signals amplified by the front-stage push amplification unit by a first stage into 2 N paths of power signals and respectively outputting the 2 paths of power signals to the 2 N final-stage power amplification modules, the final-stage power amplification module is used for amplifying the power signals by a second stage and outputting the power signals to the combiner module, and the combiner module is used for synthesizing the power signals amplified by the second stage by the 2 N paths of power signals into one path of microwave source signals and outputting the one path of microwave source signals, wherein N is a positive integer greater than one;
The combiner module comprises a plurality of power combiners, the power combiners adopt a ridge waveguide magic T space synthesis structure, the ridge waveguide magic T space synthesis structure comprises four coaxial waveguide conversion structures, three waveguide magic T and three isolation loads, wherein the three waveguide magic T comprises two first waveguide magic T and one second waveguide magic T, the input end of the coaxial waveguide conversion structure is connected with the final-stage power amplification module and is used for coaxially converting a power signal amplified by the second stage into a waveguide guided wave system for propagation, the two input ends of the first waveguide magic T are respectively connected with the output ends of the two coaxial waveguide conversion structures, the two input ends of the second waveguide magic T are respectively connected with one output end of the two first waveguide magic T, and the output ends of the three waveguide magic T are respectively connected with the three isolation loads.
Further set up: the front-stage push amplifying unit comprises a front-stage attenuator, a power divider, a low-noise amplifier, a numerical control attenuator, an equalizer, an attenuator, an amplifier, a numerical control attenuator, an amplifier, an isolator, a final-stage amplifier, a final-stage isolator and a coupler which are sequentially connected, wherein the output end of the coupler is connected with the final-stage power amplifying unit, and the input end of the front-stage attenuator is connected with the signal source.
Further set up: the final stage power amplifier module adopts a GaN power tube, and the GaN power tube is realized by cascade synthesis of 64 power amplifier tubes.
Further set up: the power amplifier monitoring unit is used for collecting working state information, the working state information comprises the temperature and output power of a power amplifier tube and the voltages and currents of the grid electrode and the drain electrode of the power amplifier tube, the power amplifier monitoring unit comprises a microprocessor, a temperature sensor, a detector and a voltage and current sensor, the temperature sensor is connected with the microprocessor and used for monitoring the temperature of the power amplifier tube, and the detector is used for carrying out coupling detection on the output power of each power amplifier tube to obtain detection voltages and then transmitting the detection voltages to the microprocessor; the voltage and current sensor is connected with the microprocessor and used for detecting the voltage and current of the drain electrode and the grid electrode of the power amplifier tube.
Further set up: the power supply unit is a digital power supply and is electrically connected with the microprocessor.
Further set up: the remote monitoring unit comprises a remote host, the microprocessor comprises a communication module, the microprocessor is in communication connection with the remote host through the communication module, and the microprocessor transmits working state information to the remote host through the communication module and receives an operation instruction of the remote host.
Further set up: the power amplifier tube is characterized in that a heat radiation structure is further arranged at the power amplifier tube and comprises oxygen-free copper, a heat pipe array and a radiator, wherein the oxygen-free copper is arranged right below the power amplifier tube, and the heat pipe array is arranged between the radiator and the oxygen-free copper.
Further set up: and gap filling materials are filled between the heat pipe array and the oxygen-free copper.
Further set up: the gap filling material is a phase change material.
Further set up: the output end of the combiner module is also connected with a double directional coupler, and the microwave source signal is output after passing through the double directional coupler.
In summary, the invention has the following beneficial effects:
1. The ridge waveguide structure is integrated on the magic T, the power signals output by the 4-path final-stage power amplifier module are converted from the coaxial waveguide conversion structure to the waveguide guided wave system for propagation, and then the power signals are synthesized into power signals to be output through the 3 waveguide magic T in pairs, so that the index requirements of wide frequency band, small insertion loss and small flatness are realized. Meanwhile, 3 high-power isolation loads are adopted between the roads to provide enough road separation degree so as to prevent the damage of the combiner caused by the phenomenon of power backflow generated by inconsistent power synthesis amplitude and phase.
2. Because the output power exceeds 10KW for a long time, a heat dissipation structure is arranged, an efficient heat dissipation channel is established, heat generated during the work of the power amplification tube can be rapidly and efficiently dissipated, and the stability of the system is ensured. The gas-liquid phase of the medium in the heat pipe is changed, so that extremely high heat conductivity is achieved, and the efficiency of the radiator is greatly improved.
3. The power amplifier monitoring unit is used for monitoring the power amplifier tube in the system in real time, collecting the voltage and current, the temperature and the output power of the power amplifier tube, and timely finding out faults to process when each module fails, so that the running stability of the system is ensured. The microprocessor transmits the working state information to the remote host through the communication module and receives the operation instruction of the remote host, so that unmanned on duty can be realized in a remote position or in a place with a bad environment.
Drawings
FIG. 1 is an overall block diagram of an embodiment;
FIG. 2 is a schematic diagram of a power combiner in an embodiment;
fig. 3 is a schematic diagram of the structure of a front-stage push amplifying unit in the embodiment;
FIG. 4 is a block diagram of the final stage power amplifier unit in the embodiment;
fig. 5 is a schematic structural diagram of a heat dissipation structure in an embodiment.
In the figure, 1, a power amplifier tube; 2. oxygen-free copper; 3. a caulking material; 4. a heat pipe array; 5. a heat sink.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Examples:
As shown in fig. 1-5, an ultra-wideband high power high efficiency multi-band transmission subsystem comprising: the power supply unit is used for supplying power to the front-stage push amplifying unit and the final-stage power amplifying unit;
The final-stage power amplification unit comprises a power divider module, a combiner module and 2N final-stage power amplification modules, the power divider module is connected with the front-stage push amplification unit and is used for dividing the radio frequency signals amplified by the first stage of the front-stage push amplification unit into 2N paths of power signals to be respectively output to the 2N final-stage power amplification modules, the final-stage power amplification module is used for carrying out second-stage amplification on the power signals and then outputting the power signals to the combiner module, and the combiner module is used for synthesizing the 2N paths of power signals amplified by the second stage into one path of microwave source signals and outputting the one path of microwave source signals, wherein N is a positive integer greater than one, and in the embodiment, the radio frequency signals amplified by the first stage of the front-stage push amplification unit are divided into sixteen paths of power signals and output to sixteen final-stage power amplification modules.
The combiner module comprises a plurality of power combiners, the power combiners adopt a ridge waveguide magic T space synthesis structure, the ridge waveguide magic T space synthesis structure comprises four coaxial waveguide conversion structures, three waveguide magic T and three isolation loads, wherein the three waveguide magic T comprises two first waveguide magic T and one second waveguide magic T, the input end of the coaxial waveguide conversion structure is connected with the final-stage power amplification module and is used for coaxially converting a power signal amplified by the second stage into a waveguide guided wave system for propagation, the two input ends of the first waveguide magic T are respectively connected with the output ends of the two coaxial waveguide conversion structures, the two input ends of the second waveguide magic T are respectively connected with one output end of the two first waveguide magic T, and the output ends of the three waveguide magic T are respectively connected with the three isolation loads. In this embodiment, five power combiners are provided, where sixteen paths of power signals amplified by the second stage of the final stage power amplification module are respectively input into the four power combiners to be combined into four paths of power signals, and then combined into one path of microwave source signals by another power combiners.
The traditional planar power synthesis circuit is usually composed of Willkinson bridges or Lange couplers, and the like, and the scheme has simple structure and is easy to realize. However, the planar dielectric loss is large, and the synthesis efficiency is drastically reduced with the increase of the number of synthesis routes and the lengthening of the routes, and the planar dielectric loss is not suitable for large-scale efficient synthesis. In addition, the planar circuit has limited power capacity and cannot meet the requirement of high power output. The traditional cavity combiner can not solve the technical problems of broadband and high isolation; the synthesis efficiency can be improved by synthesizing the power in the waveguides such as slot waveguide power synthesis, ridge waveguide synthesis and the like, but the structure is complex in structure, large in appearance, high in processing technology requirement and high in cost. In the embodiment, the combiner module adopts a ridge waveguide magic T space synthesis structure form, and adopts a space synthesis technology to realize index requirements of wide frequency band, small insertion loss, small flatness, high isolation and the like. The inter-road adopts 3 high-power loads to provide enough inter-road isolation degree so as to prevent the damage of a combiner caused by the power backflow phenomenon generated by inconsistent power synthesis amplitude and phase, wherein sixteen paths of power signals are synthesized into four paths by four power synthesizers and then are input into another power synthesizer to be synthesized into microwave source signals, and the microwave source signals are output so that the power can reach 10KW at the minimum and reach 15KW at the maximum. The output end of the combiner module is also connected with a double directional coupler, and microwave source signals are output after passing through the double directional coupler, so that the forward and reverse power detection function is realized. Whether the amplitude, phase in the individual synthesis branches are identical will directly affect the synthesis efficiency, i.e. the final output power. Because of the short wavelength of the high frequency, the electrical length is long and minor deviations can result in severe amplitude phase inconsistencies. By strictly controlling the following links, the consistency control of each path in the whole power division/synthesis network is ensured, so that the synthesis efficiency is improved.
In design, symmetrical design circuits and structures are adopted in the same-stage synthesis circuit, so that the circuit line width and the line length of each synthesis branch are ensured to be consistent; when the materials are tested, the phase and amplitude of the power amplifier devices are strictly screened, each set of power amplifier uses the devices in the same batch, the phase difference of the power amplifier tubes 1 in each batch is controlled within +/-6 degrees, and the amplitude difference is controlled within +/-0.3 dB. During assembly, the key circuit part uses an alignment mark to strictly control the assembly precision; the gold-plated red copper plate with the thickness of 0.5mm is used as a circuit transmission line, so that the conductivity and the heat dissipation performance are improved. In addition, a phase adjusting screw is arranged on each synthesis branch to increase phase adjusting means of power amplifier debugging. The system is suitable for various wave bands, and specifically comprises a P wave band (the frequency range is covered by 500 MHz-1000 MHz), an L wave band (the frequency range is covered by 1 GHz-2 GHz), an S wave band (the frequency range is covered by 2 GHz-4 GHz), and a C wave band (the frequency range is covered by 4 GHz-8 GHz).
The front-stage push amplifying unit comprises a front-stage attenuator, a power divider, a low-noise amplifier, a numerical control attenuator, an equalizer, an attenuator, an amplifier, a numerical control attenuator, an amplifier, an isolator, a final-stage amplifier, a final-stage isolator and a coupler which are sequentially connected, wherein the output end of the coupler is connected with the final-stage power amplifying unit, and the input end of the front-stage attenuator is connected with a signal source. The method comprises the steps of firstly, performing signal isolation, amplitude reduction and equal division transmission through an attenuator and a power divider, secondly amplifying a signal through low-noise amplification, sequentially passing through a numerical control attenuator, an equalizer and an attenuator to control the amplitude consistency of the signal, further amplifying the signal through an amplifier, the numerical control attenuator, the amplifier and the isolator, controlling the link gain through the attenuator, improving the impedance characteristic through the isolator, placing an excitation phenomenon between the two amplifiers, driving the final-stage amplifier to achieve required power through the amplified signal, and finally outputting the amplified signal after passing through the final-stage isolator and a coupler. The front stage pushing amplifying unit improves the flatness and the phase of the waveform, avoids signal oscillation, and facilitates the power synthesis of the final stage power amplifying unit to improve the synthesis efficiency.
In this embodiment, the signal source outputs a radio frequency signal of 1mw to the front-stage push amplifying unit, and the radio frequency signal of 1047W is obtained after the first-stage amplification of the front-stage push amplifying unit as the driving signal of the final-stage power amplifying unit. The radio frequency signal is equally divided into sixteen paths of power signals through the power divider module, the sixteen paths of power signals are respectively amplified through the second stage of the final-stage power amplifier module and then synthesized into one path of microwave source signal through five four-in-one power synthesizers, the peak power of the microwave source signal is 10KW (minimum value), harmonic suppression is less than or equal to-20 dBc, and spurious suppression is carried out: less than or equal to-70 dBc, and the bottom noise: less than or equal to-80 dBm/Hz (open gate) and less than or equal to-138 dBm/Hz (close gate).
The final stage power amplifier module adopts GaN power tubes, the GaN power tubes are realized by cascading 64 power amplifier tubes 1, and the GaN power tubes have the characteristics of high power density, high efficiency, high working frequency and the like. The power supply unit is a digital power supply, the digital power supply is electrically connected with the microprocessor, and the digital power supply can sense line and load changes and intelligently adjust power level operation conditions so as to optimize efficiency in real time. The system also comprises a power amplifier monitoring unit, wherein the power amplifier monitoring unit is used for collecting working state information, the working state information comprises the temperature and output power of the power amplifier tube 1 and the voltage and current of the grid electrode and the drain electrode of the power amplifier tube 1, the power amplifier monitoring unit comprises a microprocessor, a temperature sensor, a detector and a voltage and current sensor, the temperature sensor is connected with the microprocessor and used for monitoring the temperature of the power amplifier tube 1, the detector is used for carrying out coupling detection on the output power of each power amplifier tube 1, microstrip lines are used for coupling, the detection is carried out through the detector after coupling, the detection voltage is processed through an operational amplifier and then sent to the microprocessor, and the microprocessor can monitor the output power of the power amplifier tube 1; the voltage and current sensor is connected with the microprocessor and used for detecting the voltage and current of the drain electrode and the grid electrode of the power amplification tube 1, and when abnormality is detected, the voltage of the grid electrode of the power amplification tube 1 is required to be adjusted or the power supply is turned off, the voltage and current sensor is realized by controlling a digital power supply through the microprocessor on a circuit.
The system also comprises a remote monitoring unit, wherein the remote monitoring unit comprises a remote host, the microprocessor comprises a communication module, the microprocessor is in communication connection with the remote host through the communication module, and the microprocessor transmits working state information to the remote host through the communication module and receives an operation instruction of the remote host. The microprocessor issues control requirements (grid voltage, leakage voltage setting and the like) from a remote host to the digital power supply, and the digital power supply configures corresponding grid voltage or leakage voltage values of the power amplifier tube 1 according to the requirements or performs power-off and other operations on the corresponding power amplifier tube 1. After the configuration is completed, the microprocessor reads the working state information and reports the working state information to the remote host in time, so that the remote host can judge the effectiveness and rationality of remote control, and unmanned on duty can be realized at a remote position or in a place with a bad environment.
The power amplifier tube 1 is also provided with a heat radiation structure, the heat radiation structure comprises oxygen-free copper 2, a heat pipe array 4 and a radiator 5, the oxygen-free copper 2 is arranged under the power amplifier tube 1, the heat pipe array 4 is arranged between the radiator 5 and the oxygen-free copper 2, the heat pipe array 4 can achieve extremely high heat conductivity through gas-liquid phase change of internal media, and the axial heat conductivity coefficient of the heat pipe array is about 50 times that of aluminum alloy. The heat pipe array 4 is formed in the radiator 5 through a pressing process, so that the effect of uniform temperature of the bottom plate of the radiator 5 can be achieved, and the heat exchange efficiency of the radiator 5 can be greatly improved. The gap filling material 3 is filled between the heat pipe array 4 and the oxygen-free copper 2. The gap filling material 3 is a phase change material, which has the high heat conduction property of grease, and has the characteristics of easy handling and tear and adhesion of gaskets. When the phase-change gap filling material 3 reaches the phase-change temperature (usually 45-55 ℃), the phase-change gap filling material has excellent 'wetting' capability, and the actual measured heat conduction effect is 5-10 times that of a common heat conduction pad. The oxygen-free copper 2 is inlaid in an aluminum alloy cavity for placing the final-stage power amplifier module and is positioned under the power amplifier tube 1, and the heat conductivity of the oxygen-free copper 2 is about 2 times that of the aluminum alloy, so that a rapid heat dissipation channel can be provided for the power amplifier tube 1. Without adding too much weight by means of partial inlaying.
The above-described embodiments do not limit the scope of the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the above embodiments should be included in the scope of the present invention.
Claims (8)
1. An ultra-wideband high-power high-efficiency multi-band transmission subsystem, comprising: the power supply unit is used for supplying power to the front-stage push amplifying unit and the final-stage power amplifying unit;
The final-stage power amplification unit comprises a power divider module, a combiner module and 2 N final-stage power amplification modules, the power divider module is connected with the front-stage push amplification unit and is used for equally dividing the radio frequency signals amplified by the front-stage push amplification unit by a first stage into 2 N paths of power signals and respectively outputting the 2 paths of power signals to the 2 N final-stage power amplification modules, the final-stage power amplification module is used for amplifying the power signals by a second stage and outputting the power signals to the combiner module, and the combiner module is used for synthesizing the power signals amplified by the second stage by the 2 N paths of power signals into one path of microwave source signals and outputting the one path of microwave source signals, wherein N is a positive integer greater than one;
The combiner module comprises a plurality of power combiners, the power combiners adopt a ridge waveguide magic T space synthesis structure, the ridge waveguide magic T space synthesis structure comprises four coaxial waveguide conversion structures, three waveguide magic T and three isolation loads, wherein the three waveguide magic T comprises two first waveguide magic T and one second waveguide magic T, the input end of the coaxial waveguide conversion structure is connected with the final-stage power amplification module and is used for coaxially converting a power signal amplified by the second stage into a waveguide guided wave system for propagation, the two input ends of the first waveguide magic T are respectively connected with the output ends of the two coaxial waveguide conversion structures, the two input ends of the second waveguide magic T are respectively connected with one of the output ends of the two first waveguide magic T, the output ends of the three waveguide magic T are respectively connected with three isolation loads, the front-stage push amplifying unit comprises a front-stage attenuator, a power divider, a low-noise amplifier, a numerical control attenuator, an equalizer, an attenuator, an amplifier, a numerical control attenuator, an amplifier, an isolator, a final-stage amplifier, a final-stage isolator and a coupler which are sequentially connected, the output end of the coupler is connected with the final-stage power amplifying unit, the input end of the front-stage attenuator is connected with the signal source, the final-stage power amplifying module adopts a GaN power tube, and the GaN power tube is formed by cascading and synthesizing 64 power amplifying tubes.
2. The ultra-wideband high-power high-efficiency multi-band emission subsystem according to claim 1, further comprising a power amplifier monitoring unit, wherein the power amplifier monitoring unit is used for collecting working state information, the working state information comprises the temperature and output power of a power amplifier tube and the voltages and currents of the grid electrode and the drain electrode of the power amplifier tube, the power amplifier monitoring unit comprises a microprocessor, a temperature sensor, a detector and a voltage and current sensor, the temperature sensor is connected with the microprocessor and used for monitoring the temperature of the power amplifier tube, and the detector is used for carrying out coupling detection on the output power of each power amplifier tube to obtain detection voltage and then transmitting the detection voltage to the microprocessor; the voltage and current sensor is connected with the microprocessor and used for detecting the voltage and current of the drain electrode and the grid electrode of the power amplifier tube.
3. The ultra-wideband high-power high-efficiency multi-band transmission subsystem of claim 2, wherein said power supply unit is a digital power supply, and wherein said digital power supply is electrically connected to said microprocessor.
4. The ultra-wideband high-power high-efficiency multi-band transmitting subsystem according to claim 3, further comprising a remote monitoring unit, wherein the remote monitoring unit comprises a remote host, the microprocessor comprises a communication module, the microprocessor is in communication connection with the remote host through the communication module, and the microprocessor transmits working state information to the remote host through the communication module and receives an operation instruction of the remote host.
5. The ultra-wideband high-power high-efficiency multi-band emission subsystem according to claim 1, wherein a heat radiation structure is further arranged at the power amplification tube, the heat radiation structure comprises oxygen-free copper, a heat pipe array and a radiator, the oxygen-free copper is arranged right below the power amplification tube, and the heat pipe array is arranged between the radiator and the oxygen-free copper.
6. The ultra-wideband high power high efficiency multi-band transmission subsystem of claim 5, wherein interstitial material is filled between said array of heat pipes and said oxygen-free copper.
7. The ultra-wideband high power high efficiency multi-band transmission subsystem of claim 6, wherein said interstitial material is a phase change material.
8. The ultra-wideband high-power high-efficiency multi-band transmitting subsystem according to claim 1, wherein the output end of the combiner module is further connected with a double directional coupler, and the microwave source signal is output after passing through the double directional coupler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111435562.5A CN114421978B (en) | 2021-11-29 | 2021-11-29 | Ultra-wideband high-power high-efficiency multi-band transmitting subsystem |
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| CN115242200B (en) * | 2022-09-15 | 2023-01-06 | 成都国盛军通科技有限公司 | C-band radio frequency signal power amplification device and method |
| CN117135132B (en) * | 2023-10-26 | 2024-01-23 | 南京纳特通信电子有限公司 | Signal control method of multi-port radio frequency matrix |
| CN119766256A (en) * | 2025-03-07 | 2025-04-04 | 北京澳丰源科技股份有限公司 | Radio communication system adopting Ku-band continuous wave power amplifier |
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