CN114406896A - Retaining ring capable of rapidly detecting service life and use method thereof - Google Patents
Retaining ring capable of rapidly detecting service life and use method thereof Download PDFInfo
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- CN114406896A CN114406896A CN202210088140.3A CN202210088140A CN114406896A CN 114406896 A CN114406896 A CN 114406896A CN 202210088140 A CN202210088140 A CN 202210088140A CN 114406896 A CN114406896 A CN 114406896A
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- retaining ring
- ring
- service life
- grinding
- rapid
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- 238000000034 method Methods 0.000 title abstract description 15
- 239000007767 bonding agent Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 8
- 229910001105 martensitic stainless steel Inorganic materials 0.000 claims description 6
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 5
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims description 5
- 229920002530 polyetherether ketone Polymers 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 14
- 230000000052 comparative effect Effects 0.000 description 10
- 238000005488 sandblasting Methods 0.000 description 10
- 238000005498 polishing Methods 0.000 description 9
- 238000012031 short term test Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention provides a retaining ring for rapidly detecting service life and a using method thereof, wherein the retaining ring for rapidly detecting service life comprises a rigid ring and an elastic ring; the elastic ring comprises a first bonding surface and a grinding surface; the rigid ring comprises a second bonding surface and a fixing surface; the first bonding surface and the second bonding surface are tightly adhered and fixed through a bonding agent; and a scale is arranged on the outer wall of the grinding surface. The service life of the retaining ring capable of rapidly detecting the service life can be rapidly and accurately judged through the graduated scale, so that the defect or damage of a treated part caused by exceeding the service life is reduced.
Description
Technical Field
The invention belongs to the technical field of semiconductor processing, relates to a retaining ring, and particularly relates to a retaining ring capable of rapidly detecting service life and a using method thereof.
Background
Integrated circuits are typically formed on a silicon substrate by sequentially depositing conductive, semiconductive or insulative layers on the substrate, with one process step involving depositing a fill layer on a non-planar surface and planarizing the fill layer until the non-planar surface is exposed. For example, a conductive fill layer may be deposited over the patterned insulating layer to fill the trenches or holes in the insulating layer, and then polished until the raised pattern of the insulating layer is exposed. After planarization, the portions of the conductive layer remaining between the raised patterns of the insulating layer form vias, plugs, and lines to provide conductive paths between thin film circuits on the substrate. In addition, planarization can also be used to lithographically planarize the substrate surface.
Chemical mechanical polishing is a commonly used planarization method in which a polishing head holds a wafer and presses the wafer against a polishing pad. The wafer is received in a retaining ring on the polishing head during polishing, the retaining ring serving to receive and position the wafer. During polishing, the polishing liquid and deionized water are continuously in contact with the retainer ring, and therefore the retainer ring needs to have certain corrosion resistance.
The existing retaining ring is formed by bonding a rigid material ring and an elastic material ring together through a specific adhesive, and the structure has the advantages that the bonding area is small, the degumming phenomenon is easy to occur in the use process, and the adhesive on the bonding surface is easy to directly contact with external chemical substances such as deionized water, polishing solution and the like in the polishing process, so that after a plurality of polishing cycles, due to the corrosion effect of the chemical solution, the adhesive on the bonding surface is damaged, the upper layer material and the lower layer material are separated, and the service life of the retaining ring is shortened.
CN 214322993U discloses a retaining ring comprising a rigid ring and an elastic ring; the rigid ring comprises a first bonding surface, and at least 2 annular grooves are radially distributed on the first bonding surface; the elastic ring comprises a second bonding surface, and annular bulges matched with the annular grooves are radially distributed on the second bonding surface; the first bonding surface is provided with a first sand blasting layer, the second bonding surface is provided with a second sand blasting layer, the roughness Ra of the first sand blasting layer and the roughness of the second sand blasting layer are both 4-8 mu m, and the first bonding surface and the second bonding surface are tightly adhered and fixed through a bonding agent.
CN 111571427a discloses a retaining ring comprising a first ring and a second ring; the first ring is formed by performing sand blasting treatment on a bonding part; the second ring is formed by sand blasting treatment on the bonding part; the roughness Ra of the bonded part of the first ring subjected to sand blasting treatment is 4-8 μm; the roughness Ra of the bonded part of the second ring subjected to sand blasting treatment is 4-8 mu m; the first ring comprises a first annular concave step and a second annular concave step which are arranged in sequence; the step surface and the side surface of the first annular concave step and the side surface of the second annular concave step are bonding parts of the first ring. The retaining ring strictly limits the roughness of the bonded part after sand blasting through sand blasting treatment of the bonded part in the retaining ring, and improves the service life of the retaining ring.
CN 211661824U discloses a retaining ring, which is provided with an annular groove on an elastic ring and a dovetail groove inward along the center of the annular groove, wherein the annular groove and an annular protrusion on a rigid ring are bonded by an adhesive, so that the bonding area is increased; the dovetail groove can allow the adhesive to enter the dovetail groove, transverse tension can be strengthened after the adhesive is solidified, degumming is not easy, the elastic ring and the rigid ring are bonded more firmly, and therefore the service life of the retaining ring is prolonged.
CN 212947226U discloses a retaining ring comprising an elastic ring and a rigid ring: the central position on the rigid ring is provided with an annular groove: the elastic ring is provided with an annular boss matched with the annular groove of the rigid ring, the annular boss is provided with a first groove and a second groove, the bonding area of the rigid ring and the elastic ring is increased, and the service life of the retaining ring is prolonged.
The above-mentioned patent documents all disclose different configurations of the retaining ring, the main purpose of which is to increase the service life of the retaining ring. However, none of them can specifically and accurately determine the degree of wear of the retainer ring to determine its life. Therefore, it is an urgent problem to be solved in the art to provide a retaining ring capable of accurately determining the lifetime, so as to reduce the occurrence of wafer defects and fragments due to exceeding the lifetime.
Disclosure of Invention
The invention aims to provide a retaining ring capable of rapidly detecting service life and a using method thereof. The service life of the retaining ring can be judged quickly and accurately through the graduated scale, and therefore defects or damages of the treated part caused by exceeding of the service life are reduced.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides a life-rapid detecting retaining ring, comprising a rigid ring and an elastic ring;
the elastic ring comprises a first bonding surface and a grinding surface;
the rigid ring comprises a second bonding surface and a fixing surface;
the first bonding surface and the second bonding surface are tightly adhered and fixed through a bonding agent;
and a scale is arranged on the outer wall of the grinding surface.
The retaining ring for rapidly detecting the service life can be used for fixing the wafer, grinding a certain film thickness on the surface of the wafer and achieving the purpose of flattening the surface of the wafer. In the mechanical grinding process, the grinding surface of the retaining ring is pressed on the grinding pad and can move back and forth in the grinding process, if the depth of the strip-shaped groove arranged on the grinding surface is too small, grinding fluid can not flow smoothly, so that wafer defects or poor flatness of the edge of the wafer are caused, and the wafer can be broken in the grinding process more seriously.
The service life of the retaining ring can be judged quickly and accurately through the scale, and the defects and fragments of the wafer caused by exceeding the service life are reduced.
Preferably, the grinding surface is provided with at least three obliquely arranged strip-shaped grooves at equal intervals, for example, 3, 4, 5, 6, 7, 8 or 9, but not limited to the enumerated values, and other unrecited values in the numerical range are also applicable.
Preferably, the connection between the strip-shaped groove and the upper surface of the grinding surface is rounded.
Preferably, the axial depth of the strip-like grooves is 2.3-3.5mm, and may be, for example, 2.3mm, 2.4mm, 2.5mm, 2.6mm, 2.7mm, 2.8mm, 2.9mm, 3.0mm, 3.1mm, 3.2mm, 3.3mm, 3.4mm or 3.5mm, but is not limited to the values listed, and other values not listed in the numerical range are equally applicable.
Preferably, the radial width of the strip-like groove is 2.8-3.5mm, and may be, for example, 2.8mm, 2.9mm, 3.0mm, 3.1mm, 3.2mm, 3.3mm, 3.4mm or 3.5mm, but is not limited to the values recited, and other values not recited in the range of values are equally applicable.
Preferably, the roughness of the polished surface is 3 to 10 μm, and may be, for example, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm or 10 μm, but is not limited to the values recited, and other values not recited in the numerical range are also applicable.
Preferably, the material of the elastic ring comprises PPS plastic or PEEK plastic.
Preferably, at least three fixing grooves are arranged on the fixing surface at equal intervals, for example, 3, 4, 5, 6, 7, 8 or 9 are provided, but the number is not limited to the recited values, and other values not recited in the numerical range are also applicable.
Preferably, the rigid ring is made of a material including martensitic stainless steel or a PEEK material.
Preferably, the roughness of the fixing surface is 3 to 10 μm, and may be, for example, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm or 10 μm, but is not limited to the values listed, and other values not listed in the numerical range are also applicable.
Preferably, the rigid ring has a thickness of 11-15mm, for example 11mm, 11.5mm, 12mm, 12.5mm, 13mm, 13.5mm, 14mm, 14.5mm or 15mm, but is not limited to the values recited, and other values not recited within the range of values are equally applicable.
Preferably, the elastic ring has a thickness of 5.1 to 6.5mm, and may be, for example, 5.1mm, 5.2mm, 5.3mm, 5.4mm, 5.5mm, 5.6mm, 5.7mm, 5.8mm, 5.9mm, 6.0mm, 6.1mm, 6.2mm, 6.3mm, 6.4mm or 6.5mm, but is not limited to the values recited, and other values not recited within the range of values are equally applicable.
In a second aspect, the present invention provides a method for using a retaining ring for rapidly detecting a lifetime as described in the first aspect, the method comprising the steps of:
and placing the retaining ring with the wafer fixed thereon for rapidly detecting the service life on a grinding pad, applying pressure and grinding, and observing the graduated scale to judge the service life of the retaining ring for rapidly detecting the service life.
The retaining ring for rapidly detecting the service life can be used for fixing the wafer, grinding a certain film thickness on the surface of the wafer and achieving the purpose of flattening the surface of the wafer. In the mechanical grinding process, there are the mechanical force of interaction between retaining ring, wafer and the grinding pad, the grinding face of retaining ring can consume along with grinding gradually, along with consuming bigger and bigger, the recess depth of grinding face can be more and more shallow, even grind flat, the consumption of different lapping liquids to the grinding face is also different, the requirement (can bring the defect, the influence of silicon chip edge roughness) of the recess depth of the grinding face of retaining ring is different to different processes (because the lapping liquid flows to the inside of the grinding head through the recess of retaining ring and participates in grinding).
The service life of the retaining ring can be judged quickly and accurately through the graduated scale.
The recitation of numerical ranges herein includes not only the above-recited numerical values, but also any numerical values between non-recited numerical ranges, and is not intended to be exhaustive or to limit the invention to the precise numerical values encompassed within the range for brevity and clarity.
Compared with the prior art, the invention has the following beneficial effects:
the retaining ring capable of rapidly detecting the service life can rapidly and accurately judge the service life of the retaining ring through the graduated scale, and further, the defect or damage of a treated part caused by exceeding the service life is reduced.
Drawings
FIG. 1 is a top view of a retaining ring for rapid life detection provided by the present invention.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Example 1
The present embodiment provides a retaining ring for rapid life detection as shown in fig. 1, the retaining ring comprising a rigid ring and an elastic ring;
the elastic ring comprises a first bonding surface and a grinding surface; the rigid ring comprises a second bonding surface and a fixing surface; the first bonding surface and the second bonding surface are tightly adhered and fixed through a bonding agent; and a scale is arranged on the outer wall of the grinding surface.
18 obliquely arranged strip-shaped grooves are formed in the grinding surface at equal intervals; and the joint of the strip-shaped groove and the upper surface of the grinding surface is rounded.
The axial depth of the strip-shaped groove is 3.0mm, and the radial width of the strip-shaped groove is 3.2 mm.
The roughness of the grinding surface is 4 μm.
The elastic ring is made of PPS plastic.
The fixed surface is provided with 18 fixed slots at equal intervals.
The rigid ring is made of martensitic stainless steel;
the roughness of the fixing surface was 4 μm.
The thickness of the rigid ring is 12.5 mm; the thickness of the elastic ring is 4.5 mm.
Adopt the retaining ring fixed wafer of short-term test life-span that this embodiment provided, then place it on the grinding pad, exert pressure and grind the back, observe the scale and judge the life of short-term test life-span's retaining ring.
The retaining ring capable of rapidly detecting the service life provided by the embodiment can rapidly and accurately judge the service life of the retaining ring through the graduated scale, and further, the defect or damage of a processed part caused by exceeding the service life is reduced.
Example 2
The embodiment provides a retaining ring for rapidly detecting the service life, which comprises a rigid ring and an elastic ring;
the elastic ring comprises a first bonding surface and a grinding surface; the rigid ring comprises a second bonding surface and a fixing surface; the first bonding surface and the second bonding surface are tightly adhered and fixed through a bonding agent; and a scale is arranged on the outer wall of the grinding surface.
3 obliquely arranged strip-shaped grooves are formed in the grinding surface at equal intervals; and the joint of the strip-shaped groove and the upper surface of the grinding surface is rounded.
The axial depth of the strip-shaped groove is 2.3mm, and the radial width of the strip-shaped groove is 2.8 mm.
The roughness of the grinding surface is 3 μm.
The elastic ring is made of PEEK plastic.
The fixed surface is equidistantly provided with 3 fixed slots.
The rigid ring is made of martensitic stainless steel;
the roughness of the fixing surface was 3 μm.
The thickness of the rigid ring is 11 mm; the thickness of the elastic ring is 4 mm.
Adopt the retaining ring fixed wafer of short-term test life-span that this embodiment provided, then place it on the grinding pad, exert pressure and grind the back, observe the scale and judge the life of short-term test life-span's retaining ring.
The retaining ring capable of rapidly detecting the service life provided by the embodiment can rapidly and accurately judge the service life of the retaining ring through the graduated scale, and further, the defect or damage of a processed part caused by exceeding the service life is reduced.
Example 3
The embodiment provides a retaining ring for rapidly detecting the service life, which comprises a rigid ring and an elastic ring;
the elastic ring comprises a first bonding surface and a grinding surface; the rigid ring comprises a second bonding surface and a fixing surface; the first bonding surface and the second bonding surface are tightly adhered and fixed through a bonding agent; and a scale is arranged on the outer wall of the grinding surface.
12 obliquely arranged strip-shaped grooves are formed in the grinding surface at equal intervals; and the joint of the strip-shaped groove and the upper surface of the grinding surface is rounded.
The axial depth of the strip-shaped groove is 3.5mm, and the radial width of the strip-shaped groove is 3.5 mm.
The roughness of the grinding surface is 10 μm.
The elastic ring is made of PPS plastic.
12 fixing grooves are arranged on the fixing surface at equal intervals.
The rigid ring is made of martensitic stainless steel;
the roughness of the fixing surface is 10 μm.
The thickness of the rigid ring is 15 mm; the thickness of the elastic ring is 7 mm.
Adopt the retaining ring fixed wafer of short-term test life-span that this embodiment provided, then place it on the grinding pad, exert pressure and grind the back, observe the scale and judge the life of short-term test life-span's retaining ring.
The retaining ring capable of rapidly detecting the service life provided by the embodiment can rapidly and accurately judge the service life of the retaining ring through the graduated scale, and further, the defect or damage of a processed part caused by exceeding the service life is reduced.
Example 4
The embodiment provides a retaining ring for rapidly detecting the service life, which comprises a rigid ring and an elastic ring;
the elastic ring comprises a first bonding surface and a grinding surface; the rigid ring comprises a second bonding surface and a fixing surface; the first bonding surface and the second bonding surface are tightly adhered and fixed through a bonding agent; and a scale is arranged on the outer wall of the grinding surface.
12 obliquely arranged strip-shaped grooves are formed in the grinding surface at equal intervals; and the joint of the strip-shaped groove and the upper surface of the grinding surface is rounded.
The axial depth of the strip-shaped groove is 2.8mm, and the radial width of the strip-shaped groove is 3.1 mm.
The roughness of the grinding surface is 8 μm.
The elastic ring is made of PPS plastic.
The fixed surface is provided with 18 fixed slots at equal intervals.
The rigid ring is made of martensitic stainless steel;
the roughness of the fixing surface is 8 μm.
The thickness of the rigid ring is 13.5 mm; the thickness of the elastic ring is 4.2 mm.
Adopt the retaining ring fixed wafer of short-term test life-span that this embodiment provided, then place it on the grinding pad, exert pressure and grind the back, observe the scale and judge the life of short-term test life-span's retaining ring.
The retaining ring capable of rapidly detecting the service life provided by the embodiment can rapidly and accurately judge the service life of the retaining ring through the graduated scale, and further, the defect or damage of a processed part caused by exceeding the service life is reduced.
Comparative example 1
This comparative example provides a retaining ring which differs from example 1 only in that: this comparative example omits the graduated scale.
The wafer is fixed by the retaining ring provided by the comparative example, then the wafer is placed on the grinding pad, pressure is applied, grinding is carried out, and then the abrasion condition of the retaining ring cannot be accurately judged by visual inspection, so that the service life of the retaining ring can be judged.
The retaining ring provided by the comparative example cannot rapidly and accurately judge the service life of the retaining ring, and further causes defects or damages to the wafer.
Comparative example 2
This comparative example provides a retaining ring which differs from example 1 only in that: this comparative example changes the scale retention to a color marking.
The wafer is fixed by the retaining ring provided by the comparative example, then the wafer is placed on the grinding pad, pressure is applied, grinding is carried out, and then the abrasion condition of the retaining ring cannot be accurately judged by visual inspection, so that the service life of the retaining ring can be judged.
The retaining ring provided by the comparative example cannot rapidly and accurately judge the service life of the retaining ring, and further causes defects or damages to the wafer.
In conclusion, the retaining ring structure for rapidly detecting the service life is simple and can be prepared on a large scale; in addition, the service life of the retaining ring can be judged quickly and accurately through the graduated scale, and the defects or damages of the processed piece caused by exceeding the service life are reduced.
The applicant declares that the above description is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and it should be understood by those skilled in the art that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are within the scope and disclosure of the present invention.
Claims (10)
1. A retaining ring for rapid life detection, the retaining ring comprising a rigid ring and an elastic ring;
the elastic ring comprises a first bonding surface and a grinding surface;
the rigid ring comprises a second bonding surface and a fixing surface;
the first bonding surface and the second bonding surface are tightly adhered and fixed through a bonding agent;
and a scale is arranged on the outer wall of the grinding surface.
2. The life span rapid-checking retaining ring according to claim 1, wherein the grinding surface is provided with at least three obliquely arranged strip-shaped grooves at equal intervals.
3. The life span rapid retaining ring according to claim 2, wherein the connection between the strip-shaped groove and the upper surface of the grinding surface is rounded.
4. The life expectancy rapid retaining ring according to claim 2 or 3, wherein the axial depth of the strip-shaped groove is 2.3-3.5 mm;
preferably, the radial width of the strip-shaped groove is 2.8-3.5 mm.
5. The life span rapid check retaining ring according to any one of claims 1 to 4, wherein the roughness of the abrasive surface is 3 to 10 μm;
preferably, the material of the elastic ring comprises PPS plastic or PEEK plastic.
6. The life span rapid-checking retainer ring according to any one of claims 2 to 4, wherein the fixing surface is provided with at least three fixing grooves at equal intervals.
7. The life expectancy rapid retaining ring according to any one of claims 1-6, wherein the rigid ring is made of a material including a martensitic stainless steel or a PEEK material;
preferably, the roughness of the fixing surface is 3 to 10 μm.
8. The ring according to any of claims 1 to 7, wherein the rigid ring has a thickness of 11 to 15 mm.
9. The life expectancy rapid retaining ring according to any one of claims 1-8, wherein the thickness of the elastic ring is 5.1-6.5 mm.
10. Use of a retaining ring for rapid lifetime detection according to any of claims 1 to 9, comprising the steps of:
and placing the retaining ring with the wafer fixed thereon for rapidly detecting the service life on a grinding pad, applying pressure and grinding, and observing the graduated scale to judge the service life of the retaining ring for rapidly detecting the service life.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210088140.3A CN114406896A (en) | 2022-01-25 | 2022-01-25 | Retaining ring capable of rapidly detecting service life and use method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210088140.3A CN114406896A (en) | 2022-01-25 | 2022-01-25 | Retaining ring capable of rapidly detecting service life and use method thereof |
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| CN114406896A true CN114406896A (en) | 2022-04-29 |
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| CN202210088140.3A Pending CN114406896A (en) | 2022-01-25 | 2022-01-25 | Retaining ring capable of rapidly detecting service life and use method thereof |
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| CN111816580A (en) * | 2020-07-16 | 2020-10-23 | 宁波江丰电子材料股份有限公司 | A kind of measuring method and measuring system of wafer holding ring pattern boss width |
| CN212947226U (en) * | 2020-08-31 | 2021-04-13 | 宁波江丰电子材料股份有限公司 | Retaining ring |
| CN214322993U (en) * | 2020-11-30 | 2021-10-01 | 宁波江丰电子材料股份有限公司 | Retaining ring |
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Application publication date: 20220429 |