CN114406497A

CN114406497A - Laser processing system

Info

Publication number: CN114406497A
Application number: CN202210161481.9A
Authority: CN
Inventors: 孙盛芝; 程忠辉; 许贝贝; 郑烨; 邱建荣
Original assignee: Ningbo Feina Laser Technology Co ltd
Current assignee: Ningbo Feina Laser Technology Co ltd
Priority date: 2022-02-22
Filing date: 2022-02-22
Publication date: 2022-04-29
Anticipated expiration: 2042-02-22
Also published as: CN114406497B

Abstract

The invention relates to a laser processing system, which comprises a laser, a laser processing unit and a control unit, wherein the laser outputs a light beam; the processing platform is used for bearing a sample to be processed; the focusing lens is arranged between the laser and the processing platform and used for focusing the light beam so as to process a sample to be processed; the method is characterized in that: the focusing lens comprises a long-focus focusing lens and a short-focus focusing lens which are sequentially distributed along the direction of a light path, so that the power density of a laser spot is higher, and the processing precision and the processing efficiency are higher.

Description

Laser processing system

Technical Field

The invention relates to the technical field of laser processing, in particular to a laser processing system.

Background

Photovoltaic silicon materials, semiconductor silicon materials, sapphire materials, magnetic materials, optical glass, ceramic materials and the like all have the common characteristics of abrasion resistance, high hardness, large brittleness and the like, and are collectively called as hard and brittle materials, and the hard and brittle materials are widely applied in industry. The hard and brittle materials and brittle composite materials are difficult to process because of high hardness and high brittleness, and fracture is easy to occur.

In the traditional cutting process of the hard and brittle materials, the materials with lower hardness are ground by the materials with higher hardness, and the ground parts are lost and the non-ground parts are separated, so that the cutting effect is achieved. Because diamond is the highest hardness of the current naturally occurring materials, early brittle composite materials were generally cut using an internal saw coated with diamond micropowder. The material processed by the method has large kerf, more material loss and limitation on the cutting size of the brittle composite material.

Two major cutting modes, free abrasive and fixed abrasive cutting, were later developed. The machining mode has the disadvantages that the abrasion of the cutter is large, the cutter needs to be replaced frequently, the machining cost is increased sharply, and the cutter is easy to damage the material due to the complex property of the brittle composite material, the machining quality is poor, and the defective rate is high.

Laser machining processes materials using a high power density laser beam. Laser processing does not need tools, has high processing speed and small surface deformation, can process various materials, particularly can process materials with high hardness, high brittleness and high melting point, and therefore, the laser processing is widely applied to modern manufacturing, particularly in the fields of precision processing and micro processing, such as cutting, marking, jet printing, drilling, carving, scanning and the like.

Chinese utility model patent with patent number ZL201320507612.0 (No. CN203509353U) discloses a laser cutting equipment, including cooling water device, laser gas bottle, auxiliary gas bottle, air dryer, numerical control device, operation panel, servo motor, cutting table, cutting torch, focusing lens, lead screw, speculum a, speculum b, laser oscillator, laser power supply, cutting torch drive arrangement, main power supply, speculum c, its characterized in that: the lower end of the cooling water device is provided with a laser gas cylinder and an auxiliary gas cylinder, the lower end of the laser gas cylinder is provided with an air dryer, the left end of the air dryer is provided with a numerical control device, the lower end of the numerical control device is provided with an operating panel, the upper end of the numerical control device is provided with a laser power supply, the left end of the laser power supply is provided with a laser oscillator, and the upper end of the laser power supply is provided with a main power supply. The cutting torch is fixedly connected with the lead screw, the top end of the cutting torch is connected with a cutting torch driving device, and the cutting torch is provided with a focusing lens.

Above-mentioned laser cutting equipment passes through focusing lens and focuses on laser to improve the energy density of laser spot, however, the power density of laser spot is still lower, leads to laser machining precision and machining efficiency not enough, and moreover, the long-time processing of laser can lead to ambient temperature to rise, causes the change of laser spot focus, thereby leads to the change of quality of laser spot, also can influence the machining precision of laser.

Disclosure of Invention

A first technical problem to be solved by the present invention is to provide a laser processing system that can improve processing accuracy and processing efficiency by increasing the power density of a laser spot.

A second technical problem to be solved by the present invention is to provide a laser processing system capable of monitoring a laser beam in view of the above-mentioned technical state.

The technical scheme adopted by the invention for solving the first technical problem is as follows: a laser processing system comprising a laser outputting a beam;

the processing platform is used for bearing a sample to be processed;

the focusing lens is arranged between the laser and the processing platform and used for focusing the light beam so as to process a sample to be processed;

the method is characterized in that: the focusing lens comprises a long-focus focusing lens and a short-focus focusing lens which are sequentially distributed along the direction of the light path.

In order to enable the laser spot to meet the cutting requirement of most hard and brittle materials, the focal length of the long-focus focusing lens is 780-890 mm, and the focal length of the short-focus focusing lens is 70-110 mm.

In order to facilitate the movement of materials and simultaneously ensure the quality of laser spots, the laser processing device also comprises an installation platform and a driving mechanism, wherein the installation platform is fixedly arranged above the processing platform, and the short-focus focusing lens is arranged on the installation platform; the driving mechanism comprises a first driving mechanism, a second driving mechanism and a third driving mechanism, the first driving mechanism can drive the machining platform to move up and down, the second driving mechanism can drive the machining platform to move left and right, and the third driving mechanism can drive the machining platform to move in the front and back directions. The first driving mechanism, the second driving mechanism and the third driving mechanism are matched structures of a motor, a screw rod and a nut, and the first driving mechanism, the second driving mechanism and the third driving mechanism are controlled by a control system.

The technical solution adopted by the present invention to solve the second technical problem is as follows: also comprises a monitoring device which sequentially comprises along the direction of the light path

The dichroic mirror is arranged between the long-focus focusing lens and the short-focus focusing lens, the light beam from the long-focus focusing lens passes through the dichroic mirror to form a first light beam and a second light beam, and the first light beam enters the short-focus focusing lens;

the first reflector reflects the second light beam to an imaging lens;

the imaging lens is used for imaging the second light beam;

and the camera shoots the image on the imaging lens and can upload the imaging signal to the terminal equipment.

The terminal equipment can be a computer, a mobile phone, a tablet personal computer, a projector, a television and the like, is in electric signal connection with the control system and can transmit imaging information to the control system, so that the control system can perform data processing on the imaging information and control the corresponding action of the driving mechanism according to a processing result. The monitoring device can monitor the light spots in real time in focusing and processing processes and observe the light spots through the terminal equipment, so that the positions of samples to be processed can be adjusted according to imaging signals, the samples can be matched with the focus of the laser light spots, and the processing precision is improved.

In order to facilitate the selection of a suitable laser light according to the processing material, the laser comprises at least two sub-lasers, and a beam shaper is arranged between the laser and the long-focus focusing lens. Multiple lasers can be combined and overlapped through a beam shaper to adjust the spot shape and energy distribution, and then a laser beam with a required wavelength is selected according to the properties of materials and processing requirements: the single laser or the laser beams after the overlapping of the combined laser can achieve the best cutting effect, and the laser spot is more suitable for cutting the composite brittle material.

The beam shaper and the sub-lasers may be reasonably distributed according to the actual size of the beam shaper and the sub-lasers, such as by aligning all the sub-lasers with the beam shaper, or by aligning some of the sub-lasers with the beam shaper, deviating some of the sub-lasers from the beam shaper, or deviating all of the sub-lasers from the beam shaper, and arranging a second mirror between the deviated sub-lasers and the beam shaper, which mirrors the beam output by the corresponding sub-laser to be incident into the beam shaper. More preferably, the light-emitting direction of one of the sub-lasers faces the beam shaper, the other sub-lasers are all deviated from the beam shaper, and a second mirror for leading the light beam output by the corresponding sub-laser to be incident into the beam shaper is arranged between the deviated sub-laser and the beam shaper.

In order to adjust the divergence angle and the diameter of the light beam, a beam expander is arranged between the beam shaper and the long-focus focusing lens. The beam expander can calibrate the collimation of the light beam, so that the size of the light spot can be more uniform, and the laser is firstly shaped, then expanded and finally focused to enable the obtained laser light spot to be more excellent.

Compared with the prior art, the invention has the advantages that: the beam distribution of the laser is adjusted through the long-focus focusing lens, so that longer focal depth distribution is realized, the cutting of a brittle material is facilitated, and the laser is focused again through the short-focus focusing lens, so that the Rayleigh length of a light spot obtained after twice focusing is longer, the size is smaller, the energy is more concentrated, the power density is higher, the laser processing depth can be improved, the processing efficiency is improved, and the processing precision can be improved; the short-focus focusing lens is fixedly arranged, and the driving mechanism drives the processing platform to move in the three-dimensional plane, so that the material is accurately processed, the phenomenon that the distribution and the size of laser spots are influenced by moving the spots in the processing process can be avoided, the quality of the laser spots can be more stable, the laser cutting plane is smoother, and the damage to the processed material is less; adopt monitoring devices monitoring laser beam, can be according to the position of monitoring condition adjustment sample of treating to with the focus adaptation of laser facula, thereby further improve the machining precision.

Drawings

FIG. 1 is a schematic structural diagram in an embodiment of the present invention;

fig. 2 is a front view in an embodiment of the present invention.

Detailed Description

The following examples further describe the present invention in detail.

As shown in fig. 1 and 2, the preferred embodiment of the present invention is shown.

As shown in fig. 1 and fig. 2, the laser processing system in this embodiment includes, in order along the optical path direction, a laser 1, a second reflecting mirror 2, a beam shaper 3, a beam expander 4, a long-focus focusing lens 51, a short-focus focusing lens 52, and a processing platform 9.

As shown in fig. 1 and 2, the laser 1 is used to output a light beam. The laser 1 comprises two sub-lasers 10, wherein the light-emitting direction of one sub-laser 10 is opposite to the beam shaper 3, the light-emitting direction of the other sub-laser 10 is deviated from the beam shaper 3, and two second reflecting mirrors 2 are arranged between the beam shaper 3 and the light-emitting direction of the other sub-laser 10, so that the light beams output by the other sub-laser 10 are incident into the beam shaper 3. Multiple lasers can be combined and overlapped by a beam shaper 3 to adjust the spot shape and energy distribution, and then a laser beam of a desired wavelength is selected according to the properties of the material and the processing requirements: the single laser or the laser beams after the overlapping of the combined laser can achieve the best cutting effect, and the laser spot is more suitable for cutting the composite brittle material. The beam expander 4 can adjust the divergence angle and diameter of the light beam, thereby collimating the light beam and making the size of the light spot more uniform.

As shown in fig. 1, in this embodiment, the long-focus focusing lens 51 can adjust the beam distribution of the laser light to realize longer focal depth distribution, which is more favorable for cutting the brittle material, and then the short-focus focusing lens 52 focuses the laser light again, so that the rayleigh length of the light spot obtained after twice focusing is longer, the size is smaller, the energy is more concentrated, the power density is larger, the laser processing depth can be improved, the processing efficiency is improved, and the processing precision can also be improved. The focal length of the long-focus focusing lens 51 is 780-890 mm, and the focal length of the short-focus focusing lens 52 is 70-110 mm, so that the laser spots can meet the cutting requirements of most hard and brittle materials. In addition, laser is firstly shaped, then expanded and finally focused, so that the obtained laser spot is more excellent.

As shown in fig. 1 and 2, the laser processing device further comprises a mounting platform 7 and a driving mechanism, wherein the mounting platform 7 is fixedly arranged above the processing platform 9, and the short-focus focusing lens 52 is fixed on the mounting platform 7 to fix the laser spot. The mounting platform 7 may be a part of the frame or may be mounted on a column. The driving mechanism comprises a first driving mechanism 81, a second driving mechanism 82 and a third driving mechanism 83, the first driving mechanism 81 can drive the processing platform 91 to move up and down, the second driving mechanism 82 can drive the processing platform 9 to move left and right, and the third driving mechanism 83 can drive the processing platform 9 to move in the front and back directions, so that the sample 91 to be processed placed on the processing platform 9 can be driven to move in a three-dimensional space. The first driving mechanism 81, the second driving mechanism 82, and the third driving mechanism 83 are all matching structures of a motor, a lead screw, and a nut, and refer to the prior art. The first driving mechanism 81, the second driving mechanism 82 and the third driving mechanism 83 are controlled by a control system to act, such as how many turns each motor rotates in a certain direction. The laser processing system in this embodiment is through fixed laser spot to remove the processing material in the course of working, with to the accurate processing of material, and can avoid removing the facula and influence the distribution and the size of laser spot in the course of working, can make laser spot quality more stable, thereby make laser cutting's plane level more, the processing material damage is littleer.

As shown in fig. 1 and 2, the optical imaging apparatus further includes a monitoring device including a dichroic mirror 61, a first reflecting mirror 62, an imaging lens 63, and a camera 64 in this order along the optical path direction. The dichroic mirror 61 is disposed between the long focus lens 51 and the short focus lens 52, and the light beam from the long focus lens 51 passes through the dichroic mirror 61 to form a first light beam and a second light beam, the first light beam enters the short focus lens 52, and the second light beam is reflected by the first reflecting mirror 62 to the imaging lens 63 and forms an image on the imaging lens 63. The camera 64 captures an image on the imaging lens 63 and can upload an imaging signal to the terminal device. The terminal equipment can be a computer, a mobile phone, a tablet personal computer, a projector, a television and the like, is in electric signal connection with the control system and can transmit imaging information to the control system, so that the control system can perform data processing on the imaging information and control the corresponding action of the driving mechanism according to a processing result. The monitoring device can monitor the light spots in real time in focusing and processing processes and observe the light spots through the terminal equipment, so that the positions of samples to be processed can be adjusted according to imaging signals, the positions of the samples to be processed are matched with the focus of the laser light spots, and the processing precision is improved.

Claims

1. A laser machining system includes

A laser (1) outputting a light beam;

a processing platform (9) for bearing a sample (91) to be processed;

the focusing lens is arranged between the laser and the processing platform (9), and focuses the light beam to process a sample (91) to be processed;

the method is characterized in that: the focusing lens comprises a long-focus focusing lens (51) and a short-focus focusing lens (52) which are sequentially distributed along the direction of an optical path.

2. The laser machining system of claim 1, wherein: the focal length of the long-focus focusing lens (51) is 780-890 mm, and the focal length of the short-focus focusing lens (52) is 70-110 mm.

3. The laser machining system of claim 1, wherein: the device is characterized by further comprising an installation platform (7) and a driving mechanism, wherein the installation platform (7) is fixedly arranged above the processing platform (9), and the short-focus focusing lens (52) is installed on the installation platform (7); the driving mechanism comprises a first driving mechanism (81), a second driving mechanism (82) and a third driving mechanism (83), the first driving mechanism (81) can drive the machining platform (9) to move up and down, the second driving mechanism (82) can drive the machining platform (9) to move left and right, and the third driving mechanism (83) can drive the machining platform (9) to move in the front-back direction.

4. The laser machining system of claim 3, wherein: also comprises a monitoring device which sequentially comprises along the direction of the light path

A dichroic mirror (61) provided between the long focus lens (51) and the short focus lens (52), wherein the light beam from the long focus lens (51) passes through the dichroic mirror (61) to form a first light beam and a second light beam, and the first light beam enters the short focus lens (52);

a first mirror (62) that reflects the second light beam to an imaging lens (63);

the imaging lens (63) is used for imaging the second light beam;

and the camera (64) is used for shooting the imaging on the imaging lens (63) and uploading the imaging signal to the terminal equipment.

5. The laser processing system according to any one of claims 1 to 4, wherein:

the laser (1) comprises at least two sub-lasers (10), and a beam shaper (3) is further arranged between the laser (1) and the long-focus focusing lens (51).

6. The laser machining system of claim 5, wherein: the light emitting direction of one sub-laser (10) is opposite to the beam shaper (3), the other sub-lasers (10) are deviated from the beam shaper (3), and a second reflecting mirror (2) for enabling the light beams output by the corresponding sub-lasers (10) to be incident into the beam shaper (3) is arranged between the deviated sub-lasers (10) and the beam shaper (3).

7. The laser machining system of claim 5, wherein: and a beam expander (4) is also arranged between the beam shaper (3) and the long-focus focusing lens (51).