CN114384841A - Signal modulation module for substrate processing equipment - Google Patents
Signal modulation module for substrate processing equipment Download PDFInfo
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- CN114384841A CN114384841A CN202111661136.3A CN202111661136A CN114384841A CN 114384841 A CN114384841 A CN 114384841A CN 202111661136 A CN202111661136 A CN 202111661136A CN 114384841 A CN114384841 A CN 114384841A
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- 238000012545 processing Methods 0.000 title claims abstract description 58
- 239000000758 substrate Substances 0.000 title claims abstract description 52
- 230000001105 regulatory effect Effects 0.000 claims abstract description 18
- 230000002093 peripheral effect Effects 0.000 claims abstract description 16
- 108010076504 Protein Sorting Signals Proteins 0.000 claims abstract description 9
- 238000004891 communication Methods 0.000 claims abstract description 5
- 230000003750 conditioning effect Effects 0.000 claims description 11
- 238000002955 isolation Methods 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000012163 sequencing technique Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 18
- 230000008569 process Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- -1 phenolic aldehyde Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Abstract
The invention discloses a signal modulation module for substrate processing equipment, which comprises: the substrate processing equipment comprises a shell, a plurality of interfaces and a plurality of communication interfaces, wherein the interfaces are arranged on the shell and are used for receiving signals generated by peripheral devices of the substrate processing equipment; the PCB bottom plate is provided with at least one signal input end and at least one signal output end, and the plurality of interfaces are respectively and electrically connected with the signal input ends one by one; the PCB bottom plate and the PCB vertical plates are arranged inside the shell, and the PCB vertical plates are arranged on the PCB bottom plate at intervals; the PCB vertical plate comprises a voltage-regulating sequence-regulating circuit which is used for regulating the voltage of signals and modulating the signals into standard signal sequences predefined by the substrate processing equipment. The invention realizes the purposes of reducing the size, being suitable for free replacement of various peripheral devices, free replacement of various signal sequences and reducing the operation amount.
Description
Technical Field
The present invention relates to the field of signal processing technologies, and in particular, to a signal modulation module for a substrate processing apparatus.
Background
Substrate processing equipment (such as epitaxial equipment) is an important equipment for manufacturing semiconductor devices, and peripheral devices of the substrate processing equipment are numerous and complicated, and are commonly used, for example: the vacuum pump, the heating lamp, the temperature sensor, the pressure sensor and the like are large in type and quantity, the quantity of peripheral devices exceeds 200, the quantity of devices exceeds 80, the quantity of signals exceeds 500, and the signal type covers all signal types such as switching value, analog quantity, communication type and the like. The substrate processing equipment has high requirements on signal stability and also needs to have certain resistance to space electromagnetic waves and power supply ripples. In addition, the electric control cabinet of the substrate processing equipment has high integration level, all the electric control cabinets have definite requirements on size, and the length and the width of the electric control cabinets are generally not more than 600 mm. And the peripheral parts are required to be highly replaceable, and one device is provided with 2-3 types and spare parts. Because the signal modulation module is arranged in the electric control cabinet, the size, the stability and the signal processing capability of the signal modulation module pose a serious challenge.
The interface board, the interface module or the signal module provided by the prior art mainly has two types, wherein the first type is a signal board, a left connector of the signal board is provided with a plurality of DB (D-type data interfaces), including DB9-DB37, a PCB board is arranged in the middle, and an internal circuit correspondingly releases signals to a plastic terminal on the right side of the signal board in a one-to-one manner. The signal sequencing of the signal board is fixed, and the port types are fixed.
However, this kind of signal plate has the following drawbacks: the circuit solidification, port (DB) are the one-to-one connection promptly, and in case the external device that is connected with this signal board changes, can only change the inside cable connected mode of signal board, and the design drawing of signal board need be redrawn, and a device is changed to the outside appearance, and the drawing just need be updated a version.
And the port is single, this technology now covers only DB37 pins (holes) and the following DB connectors, and cannot satisfy many connector types on substrate processing equipment, for example: aircraft joints, quick joints, and the like.
The mechanical strength is poor, because this kind of structure is DB joint welding on the PCB board, and the PCB board is (phenolic aldehyde paper laminated board, epoxy paper laminated board, polyester glass felt laminate, epoxy glass cloth laminated board) thickness scope (0.21mm-10mm) basically, after the plug was many times, the stitch desolder condition that leads to the circuit to destroy appears easily.
In the face of multiple weighted signals, screening cannot be achieved, and only all signals can be directly connected with logic devices, so that the burden is increased.
Logical simple devices can be used, but facing interfaces, signal properties, and a wide variety of complex devices, do not have the capability to produce highly integrated, logically complete devices.
The second is to mount the plug (aviation plug, DB plug) directly on the equipment panel mount, then back-soldered with a cable, and then connected to the terminal block.
However, the second interface module has the following disadvantages:
and (3) circuit solidification: the port signals are connected according to a certain sequence, once the device is changed, the equipment port (or the plug) needs to be changed, however, the equipment port is mostly arranged on the front side of the panel, the welding spots are all arranged on the back side of the panel, and the changing difficulty is high.
The structure comprises two parts of panel joint installation and guide rail terminal row decomposition, and the occupied space is extremely large.
The space distance between the panel joint and the guide rail terminal of the structure is large, the distance from the top surface of the electrical cabinet to the electrical board is often large, and the difficulty in searching signals is large.
In the face of multiple weighted signals, screening cannot be achieved, all signals can be directly connected to logic devices, and the burden is increased.
The prior art can be used for equipment with simple logic, but the prior art is hard to be sufficient for equipment with large logic and complex semiconductor field, such as substrate processing equipment (epitaxial equipment), and has many and complicated internal devices, and numerous interfaces, signal properties and varieties.
Disclosure of Invention
The invention aims to provide a signal modulation module for substrate processing equipment, which is used for realizing the purposes of reducing the size, being suitable for free replacement of various peripheral devices, free replacement of various signal sequences and reducing the operation amount.
In order to achieve the above purpose, the invention is realized by the following technical scheme:
a signal conditioning module for a substrate processing apparatus, comprising: the substrate processing equipment comprises a shell, a plurality of interfaces and a plurality of communication interfaces, wherein the interfaces are arranged on the shell and are used for receiving signals generated by peripheral devices of the substrate processing equipment; the PCB bottom plate is provided with at least one signal input end and at least one signal output end, and the plurality of interfaces are respectively and electrically connected with the signal input ends one by one; the PCB bottom plate and the PCB vertical plates are arranged inside the shell, and the PCB vertical plates are arranged on the PCB bottom plate at intervals; the PCB vertical plate comprises a voltage-regulating sequence-regulating circuit which is used for regulating the voltage of signals and modulating the signals into standard signal sequences predefined by the substrate processing equipment.
Optionally, the signal input terminal is disposed on one side of one long side of the PCB substrate, the signal output terminal is disposed on one side of the other long side of the PCB substrate, the at least one signal input terminal is arranged along the one long side, and the at least one signal output terminal is arranged along the other long side.
Optionally, the PCB risers extend along a short side direction of the PCB bottom plate, and the PCB risers are parallel to each other.
Optionally, the PCB riser further includes: and the voltage and sequence regulating circuit is arranged on the packaging plate.
Optionally, one side of the package board is provided with an insertion portion, two ends of the insertion portion are respectively provided with a positioning portion, and each positioning portion is provided with a copper sheet.
Optionally, an input signal panel wire and an output signal panel wire of the voltage-regulating sequence-regulating circuit are arranged on the insertion part, exposed outside the packaging plate and located between the two positioning parts, and the input signal panel wire of each vertical PCB plate is electrically connected with a signal input end closest to the input signal panel wire.
Optionally, a plurality of slots are arranged on the PCB bottom plate, and the slots are located between the signal input end and the signal output end, and the slots are parallel to the short edge of the PCB bottom plate; the inserting part of each PCB vertical plate is inserted into the clamping groove.
Optionally, the base plate further comprises: the micro-control unit and the power supply terminal; a signal inlet of the micro control unit is electrically connected with an output signal coil wire of each PCB vertical plate, and a signal outlet of the micro control unit is electrically connected with a signal output end; the power supply end is electrically connected with each positioning part of the PCB vertical plate respectively.
Optionally, the micro control unit is configured to perform weighting and chip selection processing on the voltage-regulated and sequence-regulated signals.
Optionally, the micro control unit includes a TTL gate circuit and a logic circuit, where the TTL gate circuit is used for signal weighting, and the logic circuit is used for signal chip selection.
Optionally, the signal weighting mainly classifies the signals into 5 types: hardware interlocks, software interlocks, safety signals, signal link detection, and sensors return true values, and the signal weighting is such that 5 types are given different weights depending on the urgency of the signal.
Optionally, the signal slice is selected to select the signal for processing according to the urgency of the signal, so as to remove the meaningless signal.
Optionally, the voltage regulation of the signal is signal step-down isolation performed by an optical coupling isolation and voltage modulation circuit.
Optionally, the ordering of the signals is achieved by keeping the ordering of the lines of the output signal pad lines of the respective PCB boards the same.
Optionally, the interface comprises an aircraft plug, an M12 threaded plug, a DB style fitting.
The invention has at least one of the following advantages:
according to the invention, the plurality of PCB vertical plates are arranged and are parallel to each other, so that the space is saved, and the input signal panel wire 3023 of the PCB vertical plate 302 is electrically connected with the signal input end 501 closest to the PCB vertical plate, so that the arrangement of a circuit is optimized, and the circuit is simpler. According to different external signal sequences, PCB risers with different models can be selected, and finally, external signals with different sequences are all modulated into standard signal sequences defined in the equipment.
The invention makes the voltage-regulating sequence-regulating circuit three-dimensional, greatly reduces the area of the PCB bottom plate, reduces the size of the whole signal modulation module by 50 percent, simplifies the structure and realizes integration.
The invention modularizes the voltage-regulating sequence-regulating circuit, and can select the corresponding PCB vertical plate according to the difference of the input external signals. Different types of PCB vertical plate parts can be selected for welding according to the logic definition (the sequence of the required input external signals) of the peripheral device port, and the engineering quantity is simplified by 90%.
All types of interface boards in the existing design are only connected one-to-one with the interface cables, and none of the interface boards has weighting and chip selection functions. The invention realizes the shunting output of the input signal by arranging logic chip selection and weighting processing.
Drawings
Fig. 1 is a schematic structural diagram of a housing of a signal modulation module according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a three-dimensional wiring structure of a PCB inside a signal modulation module according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a PCB backplane of a signal modulation module according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a vertical plate of a signal modulation module PCB according to an embodiment of the present invention;
FIG. 5 is a logic diagram of a signal modulation module according to an embodiment of the present invention;
FIG. 6 is a logic truth table according to an embodiment of the present invention;
Detailed Description
The signal modulation module for a substrate processing apparatus according to the present invention will be described in further detail with reference to the accompanying drawings and the detailed description. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are all used in a non-precise scale for the purpose of facilitating and distinctly aiding in the description of the embodiments of the present invention. To make the objects, features and advantages of the present invention comprehensible, reference is made to the accompanying drawings. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the implementation conditions of the present invention, so that the present invention has no technical significance, and any structural modification, ratio relationship change or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention.
As described in conjunction with fig. 1-3, the present embodiment provides a signal modulation module for a substrate processing apparatus, including: the PCB comprises a shell 100, a PCB bottom plate 301 and a plurality of PCB vertical plates 302.
The housing 100 comprises a plurality of interfaces disposed on the housing 100; in the present embodiment, the interfaces include an aircraft plug 201, an M12 threaded plug 202, a DB style connector 203, and the like. The housing 100 is an aluminum alloy housing. The interface may cover 90% of the interface types of peripheral devices of the substrate processing apparatus for receiving signals generated by the peripheral devices of the substrate processing apparatus.
The PCB bottom plate 301 and the PCB risers 302 are disposed inside the housing 100.
The PCB base plate 301 is provided with at least one signal input terminal 501, at least one signal output terminal 502, a Micro Control Unit (MCU) and a power supply terminal 400.
Optionally, as shown in fig. 2 to 3, the signal input terminal 501 is disposed on one side of one long side of the PCB substrate 301, the signal output terminal 502 is disposed on one side of the other long side of the PCB substrate 301, the at least one signal input terminal 501 is arranged along the one long side, and the at least one signal output terminal 502 is arranged along the other long side; an MCU (not shown) and a power supply terminal 400 are provided at one end of one short side of the PCB substrate 301. The plurality of interfaces are electrically connected to the signal input terminals 501 one by one, for example: a first airborne connector 201 is electrically connected to a first signal input 501, a second airborne connector 201 is electrically connected to a second signal input 501, and so on.
A plurality of the PCB vertical plates 302 are disposed on the PCB bottom plate 301 at intervals, optionally, the PCB vertical plates 302 extend along a short side direction of the PCB bottom plate 301, and the PCB vertical plates 302 are parallel to each other.
From fig. 4, each of the PCB risers 302 includes: a package board 3020 and a voltage-regulating sequence-regulating circuit (not shown in fig. 4) disposed on the package board 3020; one side of the package board 3020 is provided with a plugging portion, two ends of the plugging portion are respectively provided with a positioning portion (marked as a first positioning portion 3021 and a second positioning portion 3022), each positioning portion is provided with a copper sheet so as to be welded by using soldering tin in the subsequent process, and the power supply end 400 is electrically connected with each positioning portion of the PCB vertical plate 302, so as to supply power to the PCB vertical plate 302.
An input signal pad line 3023 and an output signal pad line 3024 of the voltage-regulating sequence-adjusting circuit are provided on the insertion portion, are exposed outside the package board 3020, and are located between the two positioning portions (the first positioning portion 3021 and the second positioning portion 3022). An input signal pad line 3023 of each PCB vertical plate 302 is electrically connected to a nearest signal input terminal 501, an output signal pad line 3024 of each PCB vertical plate 302 is electrically connected to a signal inlet of the MCU, and a signal outlet of the MCU is electrically connected to a signal output terminal 502. The MCU is used for weighting and chip selection of signals.
The PCB vertical plate 302 firstly realizes a voltage regulating function and secondly realizes a sequence regulating function through a voltage regulating and sequence regulating circuit, specifically, the voltage regulating is to convert voltage from 24V to 5V, and the sequence regulating is to modulate different signals to be processed received by an interface into standard signal sequences predefined by the substrate processing equipment; the signal ordering is achieved by keeping the ordering of the lines of the output signal pad line 3024 of the various PCB risers 302 the same.
A plurality of clamping grooves 3010 are arranged on the PCB bottom plate 301, the clamping grooves 3010 are positioned between the signal input end 501 and the signal output end 502, and the clamping grooves 3010 are parallel to the short edges of the PCB bottom plate 301; the plugging portion of each PCB vertical plate 302 is inserted into the slot 3010 to electrically connect the input signal pad line 3023 of the voltage-regulating sequence-regulating circuit with the corresponding signal input terminal 501.
The two positioning portions (a first positioning portion 3021 and a second positioning portion 3022) of the PCB upright plate 302 are also located in the slot 3010, and are welded to the edge of the slot 3010 to fix the PCB upright plate 302.
In this embodiment, the signal output terminal 502 includes a real valid signal output terminal and an abnormal alarm signal output terminal.
Requirements facing substrate processing equipment: peripheral devices of the substrate processing apparatus are numerous and complicated, and are commonly found, for example: the vacuum pump, the heating lamp, the temperature sensor, the pressure sensor and the like are large in type and quantity, the quantity of peripheral devices exceeds 200, the quantity of devices exceeds 80, the quantity of signals exceeds 500, and the signal type covers all signal types such as switching value, analog quantity, communication type and the like. The substrate processing equipment has high requirements on signal stability and also needs to have certain resistance to space electromagnetic waves and power supply ripples. In addition, the electric control cabinet of the substrate processing equipment has high integration level, all the electric control cabinets have definite requirements on size, and the length and the width of the electric control cabinets are generally not more than 600 mm. And the peripheral parts are required to be highly replaceable, and one device is provided with 2-3 types and spare parts. Because the signal modulation module is arranged in the electric control cabinet, the size, the stability and the signal processing capability of the signal modulation module pose a serious challenge.
The signal processing flow comprises the following steps:
the signal to be processed enters the signal input end 501 through an interface, and is transmitted to the voltage-regulating and sequence-regulating circuit through the input signal panel wire 3023, so that the signal is subjected to voltage reduction and signal sequencing standardization processing, and is output to the MCU through the output signal panel wire 3024, and the MCU performs weighting and chip selection on the signal, and is finally output by the signal output end 502.
The voltage regulating and sequence regulating circuit in the embodiment performs signal voltage reduction and isolation with the voltage modulation circuit through optical coupling isolation.
Signal weighting and chip selection in this embodiment. Signal weighting mainly classifies signals into 5 types: hardware Interlock (Hard Interlock), software Interlock (Soft Interlock), Safety Signal (Safety Signal), Signal link detection, and sensor return true.
Of the 5 types, the first three are weight signals, and the last two are signal entities:
first, hardware interlock, which is important device feedback of peripheral devices in the substrate processing apparatus, is related to key technology nodes in the epitaxial process, and the trend and process of determining technology process steps must be limited in a hardware interlock manner, such as a threshold value reached by a core vacuum degree and a threshold value reached by a process temperature value.
And secondly, software interlocking, wherein the weight is the feedback point type with the largest quantity in the epitaxial process, and is only a system display or industrial reference parameter, and the feedback point type with the largest quantity finally enters the MCU due to the large quantity.
Thirdly, the safety signal, the weight of which is of a safety type, does not participate in the process, but once the safety signal appears, equipment accidents or personnel safety can occur, the EMO is directly sent, and audible and visual alarm is given.
Fourthly, signal link detection is carried out, effective return is carried out for connection, when the cable is normally connected, the external sensor is normally electrified, and the NO point of the relay is closed.
Fifthly, the sensor returns a true value, the device switching value returns, the signal type is a digital value (BOOL), the physical structure is a triode or a relay, and part of the active signal is self-powered for the device.
The MCU comprises a TTL gate circuit and a logic circuit, wherein the TTL gate circuit is used for signal weighting, and the logic circuit is mainly used for chip selection. Referring to fig. 5-6, signals are weighted by TTL gate circuits, the former three signals are weighted for example, fig. 6 is a logic truth table, where input 1 is hardware interlock, input 2 is software interlock, input 3 is safety signal, and the signals are weighted to obtain 8 weighting modes of output 0-7. Referring to fig. 5, the weighted signal is input to a logic circuit for chip selection, optionally, the logic circuit is a nand gate logic circuit and an nor gate logic circuit, the selection of the logic circuit is selected according to the requirement of chip selection, and other combinations can be selected, for example, input 1 is a hardware interlock, which is important information, once a trigger indicates that an epitaxial process has progressed to a node or has exceeded the node, for example, the temperature of a cavity suddenly increases, which is fatal to the attack of the epitaxial process, so that the weight of the signal of input 2 needs to be set to be the highest, and therefore, the signal can be directly selected through the chip selection circuit. For the input 3, it belongs to a safety signal, and once triggered, it indicates that there is a safety hazard, such as air leakage, fire, etc., so it may even directly enter the signal output terminal 502 without passing through the chip select circuit for output. The chip selection circuit can conveniently screen out meaningless signals, only the signals with practical significance are logically processed and simplified, and the rest signals are respectively input into the alarm logic circuit and the chip selection circuit for shunting according to abnormal alarm and reality and effectiveness, and are finally connected to centralized output and centralized alarm.
The embodiment of the invention does not need to process meaningless signals, thus greatly saving the total amount of processed signals and processing time, and further increasing the efficiency of signal processing for extremely important safety signals even directly outputting the signals to the EMO without chip selection.
In this embodiment, by providing a plurality of PCB vertical plates, the vertical plates are parallel to each other, so that the space is saved, and the input signal pad line 3023 of the PCB vertical plate 302 is electrically connected to the nearest signal input terminal 501, so that the arrangement of the circuit is optimized, and the circuit is simpler.
This embodiment is three-dimensional with the pressure regulating and the preface circuit of transferring for the area of PCB bottom plate can reduce greatly, makes whole signal modulation module, and size reduces 50%, and it is structurally simplified, realizes integrating.
According to the embodiment, PCB vertical plate components of different types can be selected for welding according to the logic definition (the sequence of the required input external signals) of the peripheral device port, so that the standardization of signal sequence is realized, and the engineering quantity is simplified by 90%.
All types of interface boards in the existing design are only connected one-to-one with the interface cables, and none of the interface boards has weighting and chip selection functions. The invention realizes the shunting output of the input signal by arranging logic chip selection and weighting processing.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
It should be noted that the apparatuses and methods disclosed in the embodiments herein can be implemented in other ways. The apparatus embodiments described above are merely illustrative, and for example, the flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods and computer program products according to various embodiments herein. In this regard, each block in the flowchart or block diagrams may represent a module, a program, or a portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
In addition, the functional modules in the embodiments herein may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.
While the present invention has been described in detail with reference to the preferred embodiments, it should be understood that the above description should not be taken as limiting the invention. Various modifications and alterations to this invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be determined from the following claims.
Claims (15)
1. A signal conditioning module for a substrate processing apparatus, comprising:
the substrate processing equipment comprises a shell, a plurality of interfaces and a plurality of communication interfaces, wherein the interfaces are arranged on the shell and are used for receiving signals generated by peripheral devices of the substrate processing equipment;
the PCB bottom plate is provided with at least one signal input end and at least one signal output end, and the plurality of interfaces are respectively and electrically connected with the signal input ends one by one;
the PCB bottom plate and the PCB vertical plates are arranged inside the shell, and the PCB vertical plates are arranged on the PCB bottom plate at intervals; the PCB vertical plate comprises a voltage-regulating sequence-regulating circuit which is used for regulating the voltage of signals and modulating the signals into standard signal sequences predefined by the substrate processing equipment.
2. The signal conditioning module for a substrate processing apparatus of claim 1, wherein the signal input terminal is disposed on one side of one long side of the PCB substrate and the signal output terminal is disposed on one side of the other long side of the PCB substrate, the at least one signal input terminal being arranged along the one long side and the at least one signal output terminal being arranged along the other long side.
3. The signal conditioning module for a substrate processing apparatus as recited in claim 2, wherein the PCB risers extend along a short side of the PCB bottom plate and are parallel to each other.
4. The signal modulation module for a substrate processing apparatus of claim 1, wherein the PCB riser further comprises: and the voltage and sequence regulating circuit is arranged on the packaging plate.
5. The signal modulation module for a substrate processing apparatus according to claim 4, wherein a plugging portion is provided at one side of the package board, positioning portions are provided at two ends of the plugging portion, respectively, and a copper sheet is provided on each of the positioning portions.
6. The signal modulation module for a substrate processing apparatus according to claim 5, wherein an input signal pad line and an output signal pad line of the voltage-regulating sequence-regulating circuit are disposed on the insertion portion, exposed outside the package board, and located between the two positioning portions, and the input signal pad line of each vertical PCB board is electrically connected to a nearest signal input terminal.
7. The signal conditioning module for a substrate processing apparatus of claim 6, wherein the PCB backplane has a plurality of slots disposed therein, the slots being disposed between the signal input and the signal output, the slots being parallel to short sides of the PCB backplane; the inserting part of each PCB vertical plate is inserted into the clamping groove.
8. The signal conditioning module for a substrate processing apparatus of claim 6, wherein the base plate further comprises: the micro-control unit and the power supply terminal; a signal inlet of the micro control unit is electrically connected with an output signal coil wire of each PCB vertical plate, and a signal outlet of the micro control unit is electrically connected with a signal output end; the power supply end is electrically connected with each positioning part of the PCB vertical plate respectively.
9. The signal modulation module according to claim 8, wherein the micro control unit is configured to perform weighting and chip selection processing on the voltage-regulated and sequence-regulated signals.
10. The signal conditioning module for a substrate processing apparatus of claim 9, wherein the micro control unit comprises a TTL gate and a logic circuit, wherein the TTL gate is used for signal weighting and the logic circuit is used for signal chip selection.
11. The signal conditioning module for a substrate processing apparatus as recited in claim 10, wherein the signal weighting substantially classifies the signals into 5 types: hardware interlocks, software interlocks, safety signals, signal link detection, and sensors return true values, and the signal weighting is such that 5 types are given different weights depending on the urgency of the signal.
12. The signal conditioning module for a substrate processing apparatus of claim 11, wherein the signal pads are selected to select the signal for processing based on the urgency of the signal to remove the insignificant signal.
13. The signal modulation module for a substrate processing apparatus of claim 1, wherein the voltage regulation of the signal is signal buck isolation from the voltage modulation circuit by optical coupling isolation.
14. The signal conditioning module for a substrate processing apparatus of claim 6, wherein the sequencing of the signals is accomplished by keeping the ordering of the lines of the output signal pad lines of the respective PCB risers the same.
15. The signal conditioning module for a substrate processing apparatus of claim 1, wherein the interface comprises an aircraft plug, an M12 threaded plug, a DB style connector.
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