CN114375117A - A heat dissipation module applied to deep-sea high-power electronic devices - Google Patents

Abstract

The invention discloses a heat radiation module applied to a deep sea high-power electronic device, which comprises a support protection part, resin glue, a high-power electronic device, a heat conduction material and a heat radiation substrate, wherein the support protection part is arranged on the support protection part; the supporting and protecting part is columnar, the upper end of the supporting and protecting part is opened, a cavity is formed in the supporting and protecting part, the radiating substrate is located at the center of the supporting and protecting part, and a vertical through hole is formed in the radiating substrate to form a seawater flow channel; the high-power electronic device is fixed on the side wall surface of the radiating substrate, and a heat conduction material is filled between the high-power electronic device and the radiating substrate; the cavity between the support protective part and the heat dissipation substrate is filled with resin glue to cover and support the high-power electronic device.

Description

A heat dissipation module applied to deep-sea high-power electronic devices

technical field

The invention relates to the field of electronic heat dissipation equipment, in particular to a heat dissipation module applied to deep-sea high-power electronic devices.

Background technique

Generally, electronic modules such as deep-sea detectors have a thick steel casing, which is costly and economical to manufacture. In addition, deep-sea electronic modules face major water sealing problems, and electronic devices face the risk of short circuit or damage. Furthermore, with the application of high-power devices, overheating protection will be caused due to high thermal power, and system functions will be damaged. Therefore, the existing deep-sea detectors usually have the problems of heavy weight and poor heat dissipation of the electronic modules.

SUMMARY OF THE INVENTION

In view of the deficiencies of the prior art, the present invention proposes a heat dissipation module applied to deep-sea high-power electronic devices. The present invention selects resin glue to transmit deep-sea pressure, avoids stress damage to the internal parts of the detector, and forms self-circulation through seawater to dissipate heat. It can simultaneously meet the requirements of high-power deep-sea electronic devices with pressure resistance, water tightness and high heat dissipation.

The object of the present invention is achieved through the following technical solutions:

A heat dissipation module applied to deep-sea high-power electronic devices, the heat dissipation module includes a support guard, a resin glue, a high-power electronic device, a heat-conducting material, and a heat dissipation substrate; the support guard is cylindrical in shape, and its upper end is open and There is a cavity inside, the heat dissipation base plate is located at the center of the support guard, and the heat dissipation base plate is provided with a vertical through hole to form a seawater flow channel; the high-power electronic device is fixed on the heat dissipation base plate. The sidewall surface is filled with thermally conductive material between the high-power electronic device and the heat-dissipating substrate; the cavity between the support guard and the heat-dissipating substrate is filled with resin glue to cover and support the high-power electronic device.

Further, a reinforcing rib is provided inside the support guard.

Further, the thermally conductive material is thermally conductive grease, which is vertically distributed near the high-power electronic device to ensure that the thermal conduction distance is vertically minimized and thermal resistance is reduced.

Further, when the heat-dissipating substrate is made of metal, the outer peripheral surface of the heat-dissipating substrate near the end is roughened, so that the resin glue and the heat-dissipating substrate form a dense connection interface, preventing the resin glue The heat dissipation substrate peels off or plays a waterproof role.

Further, the heat dissipation module further includes filter screens fixed on the upper and lower ends of the heat dissipation base plate to filter impurities in the seawater channel and prevent clogging; a seawater flow channel is formed between the vertical through holes and the filter screen.

Further, when the high-power electronic device has a circuit board, the thermally conductive material is filled between the circuit board and the heat dissipation substrate.

The beneficial effects of the present invention are as follows:

(1) The heat dissipation module of the deep-sea high-power electronic device designed by the present invention selects resin glue to transmit the deep-sea pressure, avoids the use of thick steel containers, and saves costs;

(2) The heat dissipation module of the present invention enables the high-power heating device to discharge heat well, work in a suitable temperature environment, and efficiently solve the problem of overheating protection.

(3) The heat dissipating module of the present invention has good sealing performance to avoid contact between electronic devices and seawater and loss of function.

Description of drawings

FIG. 1 is a schematic structural diagram of one embodiment of a heat dissipation module of the present invention;

FIG. 2 is a schematic structural diagram of another embodiment of the heat dissipation module of the present invention.

Detailed ways

The present invention will be described in detail below according to the accompanying drawings and preferred embodiments, and the purpose and effects of the present invention will become clearer.

In the drawings of specific embodiments of the present invention, in order to describe the heat dissipation module of the deep-sea high-power electronic device more clearly, it does not constitute a limitation on the size, size and shape of each component inside the structure.

As shown in FIG. 1 , one embodiment of the heat dissipation module applied to deep-sea high-power electronic devices of the present invention includes a support guard 1, a resin glue 2, a high-power electronic device 3, a circuit board 4, thermal grease 5, Heat dissipation substrate 6 and filter screen 7 .

The shape of the support guard 1 is cylindrical or cubic, and the resin glue 2 fills the cavity of the support guard 1 and covers the high-power electronic device 3 and the circuit board 4 to withstand the high pressure of seawater; the high-power electronic device 3 is distributed On the circuit board 4, the other side of the circuit board 4 is connected to the heat dissipation substrate 6 through the thermal grease 5. The thermal grease 5 should be closely distributed near the high-power device 3 on the circuit board to ensure that the heat conduction distance is minimized vertically and reduce heat. resistance. A through hole 601 is opened in the center of the heat dissipation base plate 6, and the installation direction of the through hole 601 must be perpendicular to the sea level. The filter screen 7 and the through holes 601 form a seawater flow channel. After the seawater is heated, the density decreases and flows upwards, forming a natural circulation and taking away heat efficiently.

The support guard 1 is used to carry the resin glue 2 , so that the resin glue 2 can fill the cavity of the support guard 1 so as not to overflow. In order to improve the strength of the entire supporting guard 1 , load-bearing reinforcing ribs 101 are also distributed inside the supporting guard 1 .

When the heat-dissipating substrate 6 is made of metal material, its surface should be processed to improve the roughness, so that the resin glue and the metal form a dense connection interface, prevent peeling between the heat-dissipating substrate 6 and the resin glue, and have good waterproof performance.

2 is another embodiment of the heat dissipation module applied to deep-sea high-power electronic devices of the present invention. When the high-power electronic device 3 has no circuit board 4, the high-power device (3) directly passes through the thermal grease (5). ) is connected to the heat dissipation substrate (6) to transfer the heat of the electronic device to the seawater through heat transfer, and other parts are the same as in FIG. 1 .

Those of ordinary skill in the art can understand that the above are only preferred examples of the invention and are not intended to limit the invention. Although the invention has been described in detail with reference to the foregoing examples, those skilled in the art can still Modifications are made to the technical solutions described in the foregoing examples, or equivalent replacements are made to some of the technical features. All modifications, equivalent replacements, etc. made within the spirit and principle of the invention shall be included within the protection scope of the invention.

Claims (6)

1. A heat dissipation module applied to a deep-sea high-power electronic device, characterized in that the heat dissipation module comprises a support guard (1), a resin glue (2), a high-power electronic device (3), a thermally conductive material (5). ), a heat dissipation base plate (6); the support guard (1) has a cylindrical shape with an open upper end and a cavity inside, and the heat dissipation base plate (6) is located at the center of the support guard (1), And the heat dissipation substrate (6) is provided with vertical through holes to form seawater flow channels; the high-power electronic device (3) is fixed on the side wall surface of the heat dissipation substrate (6), and the high-power electronic device ( 3) A thermally conductive material (5) is filled between the heat dissipation substrate (6); the cavity between the support guard (1) and the heat dissipation substrate (6) is filled with resin glue (2) to cover and support the The high-power electronic device (3) is described. 2. The heat dissipation module applied to deep-sea high-power electronic devices according to claim 1, characterized in that, a reinforcing rib is provided inside the support guard (1). 3. The heat dissipation module applied to deep-sea high-power electronic devices according to claim 1, wherein the thermally conductive material (5) is thermally conductive grease, which is vertically distributed near the high-power electronic device (3), Ensure that the thermal conduction distance is minimized vertically, reducing thermal resistance. 4. The heat dissipation module applied to deep-sea high-power electronic devices according to claim 1, wherein when the heat dissipation substrate (6) is metal, the outer peripheral surface of the heat dissipation substrate (6) is close to the end Roughing treatment is performed on the position of the heat sink, so that the resin glue (2) and the heat dissipation substrate (6) form a dense connection interface, so as to prevent the resin glue (2) from peeling off the heat dissipation substrate (6) or play a waterproof role. 5. The heat dissipation module applied to deep-sea high-power electronic devices according to claim 1, wherein the heat dissipation module further comprises a filter screen (7) fixed on the upper and lower ends of the heat dissipation substrate (6), The impurities inside the seawater channel are filtered to prevent clogging; a seawater flow channel is formed between the vertical through hole and the filter screen (7). 6. The heat dissipation module applied to deep-sea high-power electronic devices according to claim 1, characterized in that, when the high-power electronic device (3) has a circuit board, the thermally conductive material (5) is filled in the between the circuit board and the heat dissipation substrate (6).

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