CN114361363B - Display module, manufacturing method of display module and electronic equipment - Google Patents
Display module, manufacturing method of display module and electronic equipment Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 229910052751 metal Inorganic materials 0.000 claims description 129
- 239000002184 metal Substances 0.000 claims description 129
- 239000000463 material Substances 0.000 claims description 30
- 238000005530 etching Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 15
- 230000000149 penetrating effect Effects 0.000 claims description 11
- 238000005260 corrosion Methods 0.000 claims description 10
- 230000007797 corrosion Effects 0.000 claims description 10
- 238000001704 evaporation Methods 0.000 claims description 10
- 239000007772 electrode material Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 6
- 238000000059 patterning Methods 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 16
- 229920001621 AMOLED Polymers 0.000 description 7
- 230000008020 evaporation Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 229910001111 Fine metal Inorganic materials 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- HKBLLJHFVVWMTK-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti].[Ti] HKBLLJHFVVWMTK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
According to the display module and the manufacturing method of the display module, the auxiliary electrode is arranged in the array substrate, the evaporated second electrode layer can be connected with the auxiliary electrode through the first opening on the array substrate and the second opening on the pixel defining layer, and the auxiliary electrode and the second electrode layer are electrically connected with the same power supply end, so that the connection position of the second electrode layer and the auxiliary electrode and the edge of the second electrode layer have the same voltage. Therefore, when the auxiliary electrode is arranged at the middle position of the display module, the voltage difference between the middle position and the edge position of the second electrode layer can be reduced, and the problem of uneven brightness of the display module is further avoided.
Description
Technical Field
The application relates to the field of manufacturing of display equipment, in particular to a display module, a manufacturing method of the display module and electronic equipment.
Background
An Active-matrix Organic Light-Emitting Diode (AMOLED) display module is a display module with the advantages of low driving, low power consumption, self-luminescence, fast reaction speed, high contrast, wide viewing angle and the like. An AMOLED display module generally includes an anode layer, a cathode layer, and an organic electroluminescent device layer between the anode layer and the cathode layer. When the AMOLED display module is operated, proper voltages are respectively applied to the anode layer and the cathode layer so as to excite the organic electroluminescent layer to emit light automatically.
In a conventional AMOLED display module, a cathode layer is usually a thin film formed of metal, so that the cathode layer needs to be made thin in order to have high light transmittance, which results in a large overall resistance of the cathode layer. The cathode layer is usually connected with the peripheral driving circuit from the periphery thereof, so that the cathode voltage near the periphery of the display module and the cathode voltage in the middle area of the display module have large difference, and the brightness of the AMOLED display module is uneven. Particularly for large-size AMOLED display modules, the problem of uneven display brightness is more obvious.
Disclosure of Invention
In order to overcome the technical problems mentioned in the background, an embodiment of the present application provides a display module, which includes an array substrate and a device layer located on the array substrate;
An auxiliary electrode is arranged in the array substrate; a first opening exposing the auxiliary electrode is formed on one side of the array substrate, which is close to the device layer;
The device layer comprises a first electrode layer, a pixel defining layer, a luminescent material layer and a second electrode layer; the first electrode layer comprises a plurality of first electrodes which are positioned on the array substrate and are spaced from each other; the pixel defining layer comprises a plurality of pixel openings, the first electrodes are isolated from each other by the pixel defining layer, and each pixel opening exposes one first electrode; the luminescent material layer is positioned in the pixel opening and covers the first electrode; the second electrode layer covers one side of the luminescent material layer away from the first electrode layer;
the pixel defining layer also includes a second opening in communication with the first opening,
The second electrode layer is electrically connected with the auxiliary electrode through the first opening and the second opening, and the auxiliary electrode and the second electrode layer are respectively and electrically connected with the same power supply terminal.
In one possible implementation, the array substrate includes a planarization layer, the planarization layer being located on a side of the array substrate adjacent to the device layer; the auxiliary electrode is positioned in the planarization layer, and the first opening is positioned on one side of the planarization layer facing the device layer.
In one possible implementation, the device layer further includes a common layer; at least part of the common layer covers one side of the auxiliary electrode, which is exposed through the first opening and the second opening, away from the array substrate, and the second electrode layer is positioned on one side of the common layer, which is away from the array substrate;
the display module further comprises a first through hole penetrating through at least the second electrode layer and the public layer;
and the second electrode layer is electrically connected with the auxiliary electrode through the conducting layer or extends to be electrically connected with the auxiliary electrode along the first through hole.
In one possible implementation manner, the auxiliary electrode includes a first metal layer, a second metal layer and a third metal layer which are sequentially stacked along the direction of the array substrate pointing to the device layer;
The auxiliary electrode further comprises a second through hole penetrating at least the second metal layer and the third metal layer, and the second metal layer is retracted relative to the third metal layer at the second through hole;
the common layer and the second electrode layer are provided with third through holes at positions corresponding to the second through holes, and the second through holes and the third through holes are communicated to form the first through holes;
The second electrode layer is electrically connected with the second metal layer through the conducting layer, and the second metal layer and the second electrode layer are respectively and electrically connected with the same power supply terminal.
In one possible implementation, the first metal layer and the third metal layer have a greater corrosion resistance to the etching solution than the second metal layer;
preferably, the second metal layer has a conductivity greater than the first metal layer and the third metal layer;
Preferably, the material of the first metal layer and the third metal layer is titanium, and the material of the second metal layer is aluminum.
Another object of the present application is to provide a method for manufacturing a display module, the method including:
Forming an array substrate with auxiliary electrodes, and forming a first opening exposing the auxiliary electrodes on the array substrate;
sequentially forming a first electrode layer, a pixel defining layer and a luminescent material layer based on the array substrate, and forming a second opening communicated with the first opening at a position of the pixel defining layer corresponding to the auxiliary electrode; the first electrode layer comprises a plurality of first electrodes which are formed on the array substrate and are mutually spaced; the pixel defining layer comprises a plurality of pixel openings, the first electrodes are isolated from each other by the pixel defining layer, and each pixel opening exposes one first electrode; the luminescent material layer is formed in the pixel opening;
forming a second electrode layer from one side of the pixel defining layer and the light emitting material layer away from the array substrate, the second electrode layer being electrically connected with the auxiliary electrode through the first opening and the second opening;
and electrically connecting the auxiliary electrode and the second electrode layer with the same power supply terminal respectively.
In one possible implementation manner, the step of forming the array substrate with the auxiliary electrode includes:
forming an array driving layer;
forming a first planarization layer based on the array driving layer;
forming an auxiliary electrode on the first planarization layer;
a second planarization layer is formed from the first planarization layer and a side of the auxiliary electrode remote from the array driving layer, and the first opening of the auxiliary electrode is exposed based on the second planarization layer.
In one possible implementation manner, the step of forming an auxiliary electrode on the first planarization layer includes:
Sequentially forming a first metal layer, a second metal layer and a third metal layer on the first planarization layer; the corrosion resistance of the first metal layer and the third metal layer to the etching liquid is greater than that of the second metal layer to the etching liquid;
forming a second through hole penetrating at least the third metal layer and the second metal layer;
the step of forming a first electrode layer based on the array substrate includes:
Evaporating a first electrode material based on the array substrate;
patterning and etching the first electrode layer, and laterally etching the second metal layer exposed from the second through hole to enable the second metal layer to shrink in the second through hole relative to the third metal layer;
The step of forming the second electrode layer includes:
Evaporating a common layer and a second electrode layer from one side of the pixel defining layer and the light-emitting material layer away from the array substrate, wherein a third through hole is formed in the common layer and the second electrode layer at a position corresponding to the second through hole, and the second through hole and the third through hole are communicated to form a first through hole;
after the step of forming the second electrode layer, the method further includes:
and forming a conducting layer at least partially filled in the first through hole, so that the second electrode layer is electrically connected with the second metal layer through the conducting layer.
In one possible implementation manner, the step of forming an auxiliary electrode on the first planarization layer includes:
Sequentially forming a first metal layer, a second metal layer and a third metal layer on the first planarization layer; the corrosion resistance of the first metal layer and the third metal layer to the etching liquid is greater than that of the second metal layer to the etching liquid;
forming a second through hole penetrating at least the third metal layer and the second metal layer;
the step of forming a first electrode layer based on the array substrate includes:
Evaporating a first electrode material based on the array substrate;
patterning and etching the first electrode layer, and laterally etching the second metal layer exposed from the second through hole to enable the second metal layer to shrink in the second through hole relative to the third metal layer;
The step of forming the second electrode layer includes:
And evaporating one side, far away from the array substrate, of the pixel defining layer and the luminescent material layer to form a common layer, wherein the common layer and the second electrode layer form a third through hole at a position corresponding to the second through hole, the second through hole and the third through hole are communicated to form a first through hole, and the second electrode layer extends along the first through hole to be electrically connected with the auxiliary electrode.
Another object of the present application is to provide an electronic device, which is characterized in that the electronic device includes the display module provided by the present application.
According to the display module, the display module manufacturing method and the electronic equipment provided by the embodiment of the application, the auxiliary electrode is arranged in the array substrate, the second electrode layer can be connected with the auxiliary electrode through the first opening on the array substrate and the second opening on the pixel defining layer, and the auxiliary electrode and the second electrode layer are electrically connected with the same power supply terminal. When the second electrode layer is electrified, a voltage signal can be input to the second electrode layer through the auxiliary electrode, so that a voltage value in a connection area between the second electrode layer and the auxiliary electrode is improved, a voltage drop of the second electrode layer is reduced, a voltage difference between the second electrode layer positioned at the middle position of the display module and the second electrode layer positioned at the edge position of the display module is reduced, and the problem of uneven brightness of the display module is further avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without invasive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a power connection of a prior art display module;
FIG. 2 is a schematic diagram of a display module according to an embodiment of the present application;
fig. 3 is a schematic diagram of power connection of a display module according to an embodiment of the present application;
FIG. 4 is a second schematic structural diagram of a display module according to an embodiment of the present application;
FIG. 5 is a third schematic diagram of a display module according to an embodiment of the application;
FIG. 6 is a schematic diagram of a display module according to an embodiment of the present application;
FIG. 7 is a schematic diagram of a display module according to an embodiment of the present application;
fig. 8 is a flowchart illustrating steps of a method for manufacturing a display module according to an embodiment of the application;
FIG. 9 is a schematic diagram of a manufacturing process of a display module according to an embodiment of the application;
FIG. 10 is a second schematic diagram of a manufacturing process of the display module according to the embodiment of the application;
FIG. 11 is a third schematic diagram illustrating a manufacturing process of a display module according to an embodiment of the application;
FIG. 12 is a schematic diagram of a manufacturing process of a display module according to an embodiment of the application;
FIG. 13 is a schematic diagram of a manufacturing process of a display module according to an embodiment of the application;
FIG. 14 is a schematic diagram illustrating a manufacturing process of a display module according to an embodiment of the application;
FIG. 15 is a schematic diagram of a manufacturing process of a display module according to an embodiment of the application;
Fig. 16 is a schematic diagram illustrating a manufacturing process of a display module according to an embodiment of the application.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be noted that: like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further definition or interpretation of that item is required in the following figures.
In the description of the present application, it should be noted that the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship conventionally laid out when the product of the application is used, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and therefore should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
It should be noted that, in the case of no conflict, different features in the embodiments of the present application may be combined with each other.
Referring to fig. 1, a conventional OLED display module generally includes an anode layer 910, a cathode layer 920, and a light emitting material layer 930 between the anode layer 910 and the cathode layer 920. The anode layer 910 includes a plurality of relatively independent anode electrodes corresponding to different light emitting pixels, and the cathode layer 920 is a conductive film layer common to all the light emitting pixels. In view of the foregoing background art, the inventor has studied and analyzed a common OLED display module, and found that, because the OLED display module has a high requirement for light transmittance, the thickness of the cathode layer 920 is required to be very thin, which results in a high resistance of the cathode layer 920. For example, in fig. 1, the conduction distance of the current in the cathode layer 920 at the position a is greater than the conduction distance of the current in the cathode layer 920 at the position B, and since the thickness of the cathode layer 920 is very thin, the resistance per unit conduction distance is large, which results in a large voltage drop (IR drop) between the position a and the position B, and thus, uneven display brightness at the position a and the position B.
In view of this, the present embodiment provides a display module and a method for manufacturing the display module, which can reduce the voltage drop caused by the size of the electrode layer, and the scheme provided in the present embodiment is explained in detail below.
Referring to fig. 2, fig. 2 is a schematic diagram of a display module according to the present embodiment, where the display module includes an array substrate 100 and a device layer 200 disposed on the array substrate 100.
The array substrate 100 may include a plurality of film layers constituting a thin film transistor (Thin Film Transistor, TFT) array, for example, may include, but not limited to, a base layer, a buffer layer, a source electrode, a drain electrode, a semiconductor material layer, a gate insulating layer, a gate layer, an insulating layer, a planarization layer, and the like.
In this embodiment, the auxiliary electrode 130 is disposed in the array substrate 100, and a first opening 121 exposing the auxiliary electrode 130 is formed on a side of the array substrate 100 close to the device layer 200.
The device layer 200 includes a first electrode layer 210, a pixel defining layer 240, a light emitting material layer 220, and a second electrode layer 230. The first electrode layer 210 may include a plurality of first electrodes disposed on the array substrate 100 and spaced apart from each other, the pixel defining layer 240 includes a plurality of pixel openings, the first electrodes are isolated from each other by the pixel defining layer 240, and each of the pixel openings exposes one of the first electrodes. The luminescent material layer 220 is located within the pixel opening. The second electrode layer 230 covers a side of each of the light emitting material layers 220 away from the first electrode layer 210. In one example, the first electrode layer 210 may be an anode layer, and accordingly the first electrode may be an anode, and the second electrode layer 230 may be a cathode layer.
In this embodiment, the pixel defining layer 240 further includes a second opening 241, and the second opening 241 communicates with the first opening 121. The front projection of the second opening 241 on the array substrate 100 does not overlap with the front projection of the pixel opening on the array substrate 100. In a possible implementation, at least a portion of the auxiliary electrode 130 may be exposed through the first opening 121 and the second opening 241, i.e., at least a portion of the front projection of the auxiliary electrode 130 on the array substrate 100 does not coincide with the front projection of the pixel defining layer 240 on the array substrate 100. For example, due to the different layers of the auxiliary electrode 130 and the pixel defining layer 240, the front projection of the edge position of the auxiliary electrode 130 on the array substrate 100 may partially coincide with the front projection of the pixel defining layer 240 on the array substrate, but the middle position of the auxiliary electrode 130 may correspond to the positions of the first and second openings 121 and 241, so that the front projection of the middle position of the auxiliary electrode 130 on the array substrate 100 may not coincide with the front projection of the pixel defining layer 240 on the array substrate.
The second electrode layer 230 is electrically connected to the auxiliary electrode 130 through the first opening 121 and the second opening 241, and the auxiliary electrode 130 and the second electrode layer 230 are electrically connected to the same power terminal, respectively.
In this embodiment, since the auxiliary electrode 130 may be exposed from the first opening 121 and the second opening 241, the second electrode layer 230 may extend to the exposed auxiliary electrode 130 through the first opening 121 and the second opening 241 when the second electrode layer 230 is formed by vapor deposition, so as to be electrically connected to the auxiliary electrode 130.
Referring to fig. 3, since the auxiliary electrode 130 and the second electrode layer 230 are electrically connected to the same power terminal (e.g., are electrically connected to the reference power terminal Vss), when the auxiliary electrode 130 is located at the central position of the display module, the second electrode layer 230 corresponding to the central position of the display module and the second electrode layer 230 corresponding to the edge position of the display module are electrically connected to the same power terminal. Thus, the second electrode layer 230 at the center of the display module and the second electrode layer 230 at the edge of the display module have the same voltage, so that uneven display brightness caused by the size problem of the second electrode layer 230 can be reduced.
Alternatively, in this embodiment, a plurality of the auxiliary electrodes 130 may be disposed in the array substrate 100, and the plurality of auxiliary electrodes 130 may be disposed in a dispersed manner, where the positions of the auxiliary electrodes may correspond to different regions of the second electrode layer 230, so that voltage uniformity at different positions of the second electrode layer 230 may be improved, so as to ensure that display brightness at different positions of the display module is uniform as much as possible.
In one possible implementation, the array substrate 100 may include a planarization layer on a side of the array substrate 100 adjacent to the device layer 200. The auxiliary electrode 130 is located in the planarization layer, and the first opening 121 is located at a side of the planarization layer facing the light emitting material layer 220. For example, referring to fig. 4, the array substrate 100 may include a first planarization layer 110 and a second planarization layer 120, the auxiliary electrode 130 may be formed on the first planarization layer 110, the second planarization layer 120 is located on the first planarization layer 110, and the second planarization layer 120 has a first opening 121 exposing the auxiliary electrode 130.
In one possible implementation, the device layer 200 may further include a common layer 250 (as shown in fig. 5), and the common layer 250 may include a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, and the like. In the process of forming the device layer 200, the common layer 250 may at least partially cover the exposed auxiliary electrode 130 through the first opening 121 and the second opening 241 before the second electrode layer 230 is formed, and then the second electrode layer 230 is formed on the side of the common layer 250 away from the array substrate 100, which may cause the common layer 250 to block the electrical contact between the second electrode layer 230 and the auxiliary electrode 130.
Based on the above-mentioned problems, referring to fig. 5, the display module further includes a first via hole penetrating at least the second electrode layer 230 and the common layer 250, and a conductive layer 300 at least partially filled in the first via hole, and the second electrode layer 230 is electrically connected to the auxiliary electrode 130 through the conductive layer 300.
Further, referring to fig. 6, in the present embodiment, the auxiliary electrode 130 includes a first metal layer 131, a second metal layer 132, and a third metal layer 133 stacked in order along the direction of the array substrate 100 toward the device layer 200. The auxiliary electrode 130 further includes a second via hole penetrating at least the second metal layer 132 and the third metal layer 133, and the second metal layer 132 is recessed with respect to the third metal layer 133 at the second via hole. For example, at the second via hole, the second metal layer 132 forms an undercut structure with respect to the third metal layer 133, such that an orthographic projection area of the second metal layer 132 on the device layer 200 is smaller than orthographic projection areas of the first metal layer 131 and the third metal layer 133 on the device layer 200, and orthographic projections of the second metal layer 132 on the device layer 200 are located within orthographic projections of the first metal layer 131 and the third metal layer 133 on the device layer 200.
Specifically, in the present embodiment, the second through hole having the tapered structure may be formed on the auxiliary electrode 130 first, so that the common layer 250 and the second electrode layer 230 are not stacked on the sidewall of the second through hole when the common layer 250 and the second electrode layer 230 are formed by evaporation, so that the common layer 250 and the second electrode layer 230 formed by evaporation are disconnected at the position corresponding to the second through hole to form a third through hole, and the second through hole and the third through hole are communicated and commonly form the first through hole.
In one example, the second electrode layer 230 may be electrically connected to the auxiliary electrode 130 through the conductive layer 300 after the conductive material is filled in the first via hole to form the conductive layer 300. In another example, referring to fig. 7, since the conductive layer 300 is disconnected at the first through hole, the second electrode layer 230 formed by vapor deposition may extend along the first through hole to be electrically connected to the auxiliary electrode 130.
In one possible implementation, the first metal layer 131 and the third metal layer 133 have a greater corrosion resistance to an etching solution than the second metal layer 132, and after the second through holes are formed in the auxiliary electrode 130, the second through holes may be laterally etched by a metal etching solution. Since the corrosion resistance of the first metal layer 131 and the third metal layer 133 to the etching solution is greater than the corrosion resistance of the second metal layer 132 to the etching solution, the etching solution is difficult to etch the first metal layer 131 and the second metal layer 132, and only the second metal layer 132 is mainly etched away, so that the second metal layer 132 forms a retracted structure with respect to the first metal layer 131 and the third metal layer 133.
Optionally, the second metal layer 132 has a conductivity greater than the first metal layer 131 and the third metal layer 133. For example, the first metal layer 131 and the third metal layer 133 are made of titanium, the second metal layer 132 is made of aluminum, and the first metal layer 131, the second metal layer 132, and the third metal layer 133 are sequentially stacked to form a titanium aluminum titanium (TiAlTi) stacked metal structure.
Based on the same inventive concept, please refer to fig. 8, the present embodiment also provides a method for manufacturing a display module, and each step of the method is explained in detail below.
In step S110, an array substrate 100 having an auxiliary electrode 130 is formed, and a first opening 121 exposing the auxiliary electrode 130 is formed on the array substrate 100.
Alternatively, referring to fig. 9, in the present embodiment, the array driving layer 140 may be formed first, and the array driving layer 140 may include a base layer, a buffer layer, a source electrode, a drain electrode, a semiconductor material layer, a gate insulating layer, a gate electrode layer, an insulating layer, etc. for forming the TFT array. After forming the array driving layer 140, the first planarization layer 110 may be formed based on the array driving layer 140.
Then, referring to fig. 10, after the first planarization layer 110 is formed, an auxiliary electrode 130 may be formed on the first planarization layer 110. In this embodiment, the positions where the light emitting pixels need to be formed later may be planned in advance, and the positions of the auxiliary electrodes 130 may be set so as to correspond to the gaps between the two light emitting pixels accordingly.
Next, referring to fig. 11, after the auxiliary electrode 130 is formed, a second planarization layer 120 may be formed from a side of the first planarization layer 110 and the auxiliary electrode 130 away from the array driving layer 140, and a first opening 121 exposing the auxiliary electrode 130 may be formed based on the second planarization layer 120.
In step S120, a first electrode layer 210, a pixel defining layer 240, and a light emitting material layer 220 are sequentially formed based on the array substrate 100, and a second opening 241 is formed at a position of the pixel defining layer 240 corresponding to the auxiliary electrode 130, which communicates with the first opening 121 and exposes the auxiliary electrode 130.
In this embodiment, a first electrode material may be evaporated on a side of the second planarization layer 120 away from the first planarization layer 110, and then the first electrode material may be subjected to patterning corrosion to form the first electrode layer 210 composed of a plurality of first electrodes. A pixel defining layer 240 is then formed based on the first electrode layer 210, the pixel defining layer 240 including a plurality of pixel openings, each of the first electrodes being isolated from each other by the pixel defining layer 240, each pixel opening corresponding to one of the first electrode locations. A luminescent material is then evaporated in the pixel openings to form the luminescent material layer 220.
In step S130, a second electrode layer 230 is formed from a side of the pixel defining layer 240 and the light emitting material layer 220 away from the array substrate 100, and the second electrode layer 230 is electrically connected to the auxiliary electrode 130 through the first opening 121 and the second opening 241.
In this embodiment, the second electrode layer 230 may be formed by evaporating a second electrode material from the side of the pixel defining layer 240 and the light emitting material layer 220 away from the array substrate 100. Since the auxiliary electrode 130 is exposed from the first and second openings 121 and 241, the second electrode layer 230 may be evaporated onto the auxiliary electrode 130 to be in contact with the auxiliary electrode 130, forming a structure as shown in fig. 4.
In step S140, the auxiliary electrode 130 and the second electrode layer 230 are electrically connected to the same power terminal.
In this embodiment, the auxiliary electrode 130 may be connected to a reference power (Vss) through an internal wiring in the array substrate 100, and the second electrode layer 230 may also be connected to the reference power (Vss) after the fabrication is completed.
In one possible implementation, referring to fig. 12, when the auxiliary electrode 130 is formed on the first planarization layer 110, a first metal layer 131, a second metal layer 132, and a third metal layer 133 may be sequentially formed on the first planarization layer 110. Wherein the first metal layer 131 and the third metal layer 133 have a corrosion resistance greater than that of the second metal layer 132.
Referring to fig. 13, in forming the second planarization layer 120 from the side of the first planarization layer 110 and the auxiliary electrode 130 away from the array driving layer 140, a second via hole penetrating at least the third metal layer 133 and the second metal layer 132 may be formed while patterning the second planarization layer 120.
Referring to fig. 14, in the process of forming the first electrode layer 210 based on the array substrate 100, a first electrode material may be first evaporated based on the array substrate 100. Then, while the first electrode layer 210 is etched in a patterned manner, the second metal layer 132 exposed from the via hole may be etched laterally, so that the second metal layer 132 is shrunk relative to the third metal layer 133 at the second via hole.
Referring to fig. 15, in the process of forming the second electrode layer 230, the common layer 250 and the second electrode layer 230 may be formed by vapor deposition from a side of the pixel defining layer 240 and the light emitting material layer 220 away from the array substrate 100, and the common layer 250 and the second electrode layer 230 may not be stacked on a sidewall of the second via hole to be disconnected due to the second via hole having a retracted structure, so that a third via hole corresponding to the second via hole is formed at a corresponding position, and the third via hole and the second via hole are connected together to form the first via hole.
In one example, referring to fig. 16, after the step of forming the second electrode layer 230, a conductive layer 300 at least partially filled in the first via hole may be formed, so that the second electrode layer 230 is electrically connected to the second metal layer 132 through the conductive layer 300.
In another example, since the conductive layer 300 is disconnected at the first via, the second electrode layer 230 formed by evaporation may extend along the first via to be electrically connected to the auxiliary electrode 130, as shown in fig. 7.
In one possible implementation, when forming the conductive layer 300 at least partially filled in the first via hole, a fine metal mask (FINE METAL MASK, FMM) may be used to evaporate a conductive metal into the first via hole, so as to ensure that the formation position of the conductive layer 300 is accurate.
In addition, the embodiment also provides an electronic device, which includes the display module provided in the embodiment, and the electronic device may be a mobile phone, a tablet computer, a notebook computer, etc.
In summary, in the display module, the manufacturing method of the display module and the electronic device provided by the embodiments of the present application, the auxiliary electrode is disposed in the array substrate, and the evaporated second electrode layer can be connected to the auxiliary electrode through the first opening on the array substrate and the second opening on the pixel defining layer, and the auxiliary electrode and the second electrode layer are electrically connected to the same power terminal. When the second electrode layer is electrified, a voltage signal can be input to the second electrode layer through the auxiliary electrode, so that the voltage value in the area connected with the auxiliary electrode in the second electrode layer is improved, the voltage drop of the second electrode layer is reduced, the voltage difference between the second electrode layer positioned at the middle position of the display module and the second electrode layer positioned at the edge position of the display module is reduced, and the problem of uneven brightness of the display module is further avoided.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that modifications and improvements can be made by those skilled in the art without departing from the spirit of the invention, which falls within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (9)
1. The display module is characterized by comprising an array substrate and a device layer positioned on the array substrate;
an auxiliary electrode is arranged in the array substrate; a first opening exposing the auxiliary electrode is formed on one side of the array substrate, which is close to the device layer;
The device layer comprises a first electrode layer, a pixel defining layer, a luminescent material layer and a second electrode layer; the first electrode layer comprises a plurality of first electrodes which are positioned on the array substrate and are spaced from each other; the pixel defining layer comprises a plurality of pixel openings, the first electrodes are isolated from each other by the pixel defining layer, and each pixel opening exposes one first electrode; the luminescent material layer is positioned in the pixel opening and covers the first electrode; the second electrode layer covers one side of the luminescent material layer away from the first electrode layer;
the pixel defining layer also includes a second opening in communication with the first opening,
The second electrode layer is electrically connected with the auxiliary electrode through the first opening and the second opening, and the auxiliary electrode and the second electrode layer are respectively and electrically connected with the same power supply end;
The device layer further includes a common layer; at least part of the common layer covers one side of the auxiliary electrode, which is exposed through the first opening and the second opening, away from the array substrate, and the second electrode layer is positioned on one side of the common layer, which is away from the array substrate;
The auxiliary electrode comprises a first metal layer, a second metal layer and a third metal layer which are sequentially stacked along the direction of the array substrate pointing to the device layer;
the auxiliary electrode further comprises a second through hole penetrating at least the second metal layer and the third metal layer, and the second metal layer is retracted relative to the third metal layer at the second through hole;
the common layer and the second electrode layer are provided with third through holes at positions corresponding to the second through holes, and the second through holes and the third through holes are communicated to form first through holes;
The second electrode layer is electrically connected with the second metal layer through a conducting layer at least partially filled in the first through hole, and the second metal layer and the second electrode layer are respectively and electrically connected with the same power supply terminal.
2. The display module of claim 1, wherein the array substrate comprises a planarization layer, the planarization layer being located on a side of the array substrate proximate to the device layer; the auxiliary electrode is positioned in the planarization layer, and the first opening is positioned on one side of the planarization layer facing the device layer.
3. The display module of claim 1, wherein the first metal layer and the third metal layer have a greater corrosion resistance to an etching solution than the second metal layer.
4. A display module according to claim 3, wherein the second metal layer has a conductivity greater than the first and third metal layers.
5. The display module of claim 4, wherein the first metal layer and the third metal layer are made of titanium and the second metal layer is made of aluminum.
6. A method for manufacturing a display module, the method comprising:
Forming an array substrate with auxiliary electrodes, and forming a first opening exposing the auxiliary electrodes on the array substrate;
Sequentially forming a first electrode layer, a pixel defining layer and a luminescent material layer based on the array substrate, and forming a second opening communicated with the first opening at a position of the pixel defining layer corresponding to the auxiliary electrode; the first electrode layer comprises a plurality of first electrodes which are formed on the array substrate and are mutually spaced; the pixel defining layer comprises a plurality of pixel openings, the first electrodes are isolated from each other by the pixel defining layer, and each pixel opening exposes one first electrode; the luminescent material layer is formed in the pixel opening;
Forming a second electrode layer from one side of the pixel defining layer and the luminescent material layer away from the array substrate, the second electrode layer being electrically connected with the auxiliary electrode through the first opening and the second opening;
electrically connecting the auxiliary electrode and the second electrode layer with the same power supply terminal respectively;
the auxiliary electrode comprises a first metal layer, a second metal layer and a third metal layer which are sequentially stacked along the direction of the array substrate pointing to the first electrode layer, and the auxiliary electrode comprises a second through hole penetrating through at least the third metal layer and the second metal layer.
7. The method of claim 6, wherein the step of forming the array substrate with the auxiliary electrode comprises:
forming an array driving layer;
forming a first planarization layer based on the array driving layer;
forming an auxiliary electrode on the first planarization layer;
Forming a second planarization layer from the first planarization layer and a side of the auxiliary electrode away from the array driving layer, and forming a second via hole penetrating at least the third metal layer and the second metal layer while etching the second planarization layer to form a first opening exposing the auxiliary electrode;
The step of forming the second electrode layer includes:
Evaporating a common layer and a second electrode layer from one side of the pixel defining layer and the light-emitting material layer away from the array substrate, wherein the common layer and the second electrode layer form a third through hole at a position corresponding to the second through hole, and the second through hole and the third through hole are communicated to form a first through hole;
after the step of forming the second electrode layer, the method further includes:
And forming a conducting layer at least partially filled in the first through hole, so that the second electrode layer is electrically connected with the second metal layer through the conducting layer.
8. The method of claim 7, wherein the step of forming an auxiliary electrode on the first planarization layer comprises:
sequentially forming a first metal layer, a second metal layer and a third metal layer on the first planarization layer; the corrosion resistance of the first metal layer and the third metal layer to the etching liquid is greater than that of the second metal layer to the etching liquid;
forming a second through hole penetrating at least the third metal layer and the second metal layer;
the step of forming a first electrode layer based on the array substrate includes:
Evaporating a first electrode material based on the array substrate;
And etching the first electrode layer in a patterning way, and laterally etching the second metal layer exposed from the second through hole to enable the second metal layer to shrink inwards relative to the third metal layer at the second through hole.
9. An electronic device, characterized in that the electronic device comprises a display module according to any one of claims 1-5.
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| CN115274788A (en) * | 2022-07-15 | 2022-11-01 | 深圳市华星光电半导体显示技术有限公司 | Display panel and method of making the same |
| CN115275041A (en) * | 2022-07-15 | 2022-11-01 | 深圳市华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
| CN115768172A (en) * | 2022-10-14 | 2023-03-07 | 深圳市华星光电半导体显示技术有限公司 | Display panel, manufacturing method thereof and display device |
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