CN114355526B - Integrated receiving and transmitting packaging optical assembly - Google Patents
Integrated receiving and transmitting packaging optical assembly Download PDFInfo
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- CN114355526B CN114355526B CN202210144663.5A CN202210144663A CN114355526B CN 114355526 B CN114355526 B CN 114355526B CN 202210144663 A CN202210144663 A CN 202210144663A CN 114355526 B CN114355526 B CN 114355526B
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- 230000003287 optical effect Effects 0.000 title claims abstract description 71
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 11
- 239000013307 optical fiber Substances 0.000 claims abstract description 45
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 36
- 239000010703 silicon Substances 0.000 claims abstract description 36
- 238000004891 communication Methods 0.000 claims abstract description 11
- 230000008878 coupling Effects 0.000 claims description 11
- 238000010168 coupling process Methods 0.000 claims description 11
- 238000005859 coupling reaction Methods 0.000 claims description 11
- 239000000835 fiber Substances 0.000 claims description 8
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000010354 integration Effects 0.000 abstract description 10
- 238000004377 microelectronic Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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- Optical Couplings Of Light Guides (AREA)
Abstract
The invention provides an integrated transceiving packaging optical component, comprising: the light emitting portion, the light receiving portion, the filter, and the optical fiber adapter are integrally packaged by the housing. The integrated mixed packaging mode of the semiconductor integration and the traditional TO packaging is adopted, and the microelectronics and the photoelectronics are combined TO form the semiconductor integrated high-speed optical communication transceiver component, so that the advantages of advanced and mature process technology, high integration, low cost and the like of the silicon-based microelectronics can be fully exerted, and the integrated mixed packaging mode has wide market prospect; the silicon-based modulator is adopted TO realize high-speed communication, has the advantages of high density integration, flexible configuration of laser wavelength and channel number and the like, and can realize more application scenes with high reliability and compactness, multi-wavelength emission and the like by matching with the CW laser packaged in the airtight TO.
Description
Technical Field
The invention belongs to the technical field of photoelectric integrated devices, and particularly relates to an integrated transceiving packaging optical component.
Background
The optical transceiver component is the most important component of optical communication equipment, is mainly used for photoelectric conversion of signals, converts electric signals of the equipment into optical signals at a transmitting end, restores the optical signals into electric signals at a receiving end, and is widely applied to the connection fields of various wired networks such as servers, storage, networks and the like.
The existing optical transceiver component is generally composed of a TO-56 light emitting device, a TO-46 light receiving device, a light filter, a metal piece base and an optical fiber adapter which are distributed, wherein the optical transceiver component and the optical fiber are fixed through the metal piece base, no other active chips except the light filter are arranged in the metal piece base, the structure is relatively simple, the wavelength integration quantity of the emitting end is limited, and the silicon-based photon integration application scheme is not applicable.
Disclosure of Invention
In order to solve the technical problems, the invention provides an integrated transceiving packaging optical component. The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview and is intended to neither identify key/critical elements nor delineate the scope of such embodiments. Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is presented later.
The invention adopts the following technical scheme:
in some alternative embodiments, there is provided an integrated transceiver packaged optical assembly comprising: a light emitting portion, a light receiving portion, an optical filter, and an optical fiber adapter integrally packaged by the housing; the light emitting portion includes: the optical input waveguide end of the silicon-based modulator is coupled with at least one CW laser, and the optical output end of the silicon-based modulator is connected with the optical fiber adapter through the optical filter and is coupled with an optical fiber through the optical fiber adapter TO be output; the light receiving section employs a TO-46 packaged device and is aligned with the optical fiber coupling by reflection from the optical filter and is in electrical communication with an external electrical signal through the circuit board.
Further, the light emitting portion further includes: a driving circuit; the silicon-based modulator and the driving circuit are arranged on the same substrate, one end of the driving circuit is connected with the silicon-based modulator, and the other end of the driving circuit is connected with an external input electric signal through gold wire bonding to the circuit board.
Further, the light emitting portion further includes: at least one optical isolator; the output end of each CW laser is connected with the optical input waveguide end of the silicon-based modulator through one optical isolator.
Further, the light emitting portion further includes: a first lens; the optical output end of the silicon-based modulator is connected with the optical fiber adapter through the first lens and the optical filter in sequence.
Further, the number of the light receiving parts is at least 1, the light receiving parts adopt PD or APD receiving devices packaged by TO-46, the light path is reflected by the optical filter through active coupling and is coupled with the optical fiber, and the circuit is communicated with the outside through a circuit board.
Further, the light emitting portion further includes: a second lens; the filter is connected with the optical fiber adapter through the second lens.
Further, the output end of the light emitting portion and the input end of the light receiving portion communicate with an external optical communication network through the optical fiber adapter.
Further, the silicon-based modulator includes, but is not limited to, a silicon-based MZ modulator, a micro-ring modulator, and a lithium niobate modulator.
Further, the fiber optic adapters include, but are not limited to, pluggable fiber optic adapters and pigtail fiber optic adapters.
The invention has the beneficial effects that:
1. The invention combines the microelectronics and the photoelectronics TO form the semiconductor integrated high-speed optical communication transceiver component by adopting an integrated mixed packaging mode of integrating the semiconductor integration and the traditional TO packaging, can fully exert the advantages of advanced and mature process technology, high integration, low cost and the like of the silicon-based microelectronics, and has wide market prospect;
2. The silicon-based modulator is adopted TO realize high-speed communication, has the advantages of high density integration, flexible configuration of laser wavelength and channel number and the like, and can realize more application scenes with high reliability and compact multi-wavelength emission and other requirements by matching with the CW laser packaged in the airtight TO.
Drawings
Fig. 1 is a schematic structural diagram of an integrated transceiver package optical component in embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of an integrated transceiver package optical component in embodiment 2 of the present invention;
fig. 3 is a schematic structural diagram of an integrated transceiver package optical component in embodiment 3 of the present invention;
fig. 4 is a schematic structural diagram of an integrated transceiver package optical component in embodiment 4 of the present invention;
FIG. 5 is a schematic diagram of a pluggable optical fiber adapter of the present invention;
Fig. 6 is a schematic structural view of a pigtail fiber optic adapter of the present invention.
Detailed Description
The following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may involve structural, logical, electrical, process, and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in, or substituted for, those of others.
Example 1:
As shown in fig. 1, the present invention provides an integrated transceiver packaged optical module, including: a light emitting portion, a light receiving portion, a filter, and an optical fiber adapter.
Wherein the light emitting portion, the light receiving portion, the optical filter, and the optical fiber adapter are packaged and fixed as one body by the housing, and the housing is a metal housing.
As shown in fig. 1, the light emitting portion includes: silicon-based modulator, CW laser, drive circuit.
The silicon-based modulator and the driving circuit are arranged on the same substrate, one end of the driving circuit is connected with the silicon-based modulator, the other end of the driving circuit is connected with the circuit board through gold wire bonding and is communicated with an external input electric signal, and the driving circuit is mainly used for converting an external input weaker signal into a stronger signal with matched impedance and amplitude to the silicon-based modulator. The light source of the silicon-based modulator is actively coupled TO the waveguide by using a high-power CW laser packaged in a high-reliability airtight TO, and the output light of the silicon-based modulator is connected with the optical fiber adapter through the optical filter and is coupled with the optical fiber through the optical fiber adapter.
The light receiving section includes: the optical receiver, and the optical receiver is aligned with the optical fiber coupling by the filter reflection and in communication with external electrical signals through the circuit board, using the TO-46 package device. Specifically, the light receiving part adopts a TO-46 packaged PD or APD receiving device, namely a TO-46 packaged silicon-based receiving device, the light path is reflected by the optical filter through active coupling and is connected with the optical fiber adapter, the optical fiber adapter and the optical fiber coupling are aligned, and the circuit is communicated with the outside through the circuit board.
The output end of the light emitting part and the input end of the light receiving part are communicated with an external optical communication network through the same optical fiber adapter, so that interconnection and intercommunication are realized.
Among them, the silicon-based modulator of the present invention includes, but is not limited to, silicon-based MZ modulator, micro-ring modulator, and lithium niobate modulator.
The optical fiber adapter of the present invention includes, but is not limited to, a pluggable optical fiber adapter and a pigtail optical fiber adapter, wherein the pluggable optical fiber adapter has a structure shown in fig. 5, and the pigtail optical fiber adapter has a structure shown in fig. 6.
Example 2:
The number of CW lasers of the present invention is at least one and the CW lasers employ TO packages. The light input waveguide end of the silicon-based modulator is coupled with at least one CW laser, namely the light source of the silicon-based modulator is actively coupled TO the waveguide by using the CW laser packaged by the high-reliability airtight TO, and the light output end of the silicon-based modulator is connected with the optical fiber adapter through the optical filter and is coupled with the optical fiber through the optical fiber adapter. As shown in fig. 2, based on embodiment 1, the number of CW lasers in this embodiment is two, and in practical application, the number of CW lasers can be increased according to the usage requirement. The invention adopts the silicon-based modulator TO realize high-speed communication, has the advantages of high-density integration, flexible configuration of laser wavelength and channel number and the like, is matched with the CW laser packaged by the airtight TO for integration, and can realize more application scenes with high reliability and compact multi-wavelength emission and the like.
On the basis of embodiment 1, as shown in fig. 2, the light emitting portion in embodiment 2 of the present invention further includes: at least one optical isolator; the output end of each CW laser is connected with the optical input waveguide end of the silicon-based modulator through an optical isolator, namely, each CW laser corresponds to one optical isolator. The main function of the optical isolator is to prevent the optical path from reflecting due to external reasons, so that the light source or the optical path system has adverse effects, and each optical path is provided with one optical isolator, so that the power loss caused by stimulated Brillouin scattering can be reduced.
On the basis of embodiment 1, the light emitting portion in embodiment 2 of the present invention further includes: a first lens. The optical output end of the silicon-based modulator is connected with the optical fiber adapter through the first lens and the optical filter in sequence. The first lens is spatially optically coupled for optical matching, which can improve optical coupling efficiency.
Example 3:
The number of the light receiving parts of the present invention is at least one, as shown in fig. 3, and on the basis of embodiment 2, the number of the light receiving parts in this embodiment is two, and in practical application, the number of the light receiving parts can be increased according to the use requirement.
The light receiving part adopts a PD or APD receiving device packaged by TO-46, the light path is reflected by the optical filter through active coupling and is connected with the optical fiber adapter, and the circuit is communicated with the outside through the circuit board through the optical fiber adapter and the optical fiber coupling alignment.
The plurality of light receiving parts can improve single-fiber transmission capacity through wavelength division multiplexing and can meet application requirements of different speeds.
Example 4:
As shown in fig. 4, on the basis of embodiment 3, the light emitting portion of the present invention further includes: and a second lens. The optical filter is connected with the optical fiber adapter through the second lens, and the second lens plays a role in changing the optical path and improving the coupling efficiency.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.
Claims (8)
1. An integrated transceiver packaged optical assembly, comprising: a light emitting portion, a light receiving portion, an optical filter, and an optical fiber adapter integrally packaged by the housing;
The light emitting portion includes: the optical input waveguide end of the silicon-based modulator is coupled with at least one CW laser, and the optical output end of the silicon-based modulator is connected with the optical fiber adapter through the optical filter and is coupled with an optical fiber through the optical fiber adapter TO be output;
The light receiving part adopts a TO-46 packaging device, is aligned with optical fiber coupling through the reflection of the optical filter, and is communicated with external electric signals through a circuit board, wherein the output end of the light emitting part and the input end of the light receiving part are communicated with an external optical communication network through the optical fiber adapter.
2. The integrated transceiver packaged optical assembly of claim 1, wherein the light emitting portion further comprises: a driving circuit; the silicon-based modulator and the driving circuit are arranged on the same substrate, one end of the driving circuit is connected with the silicon-based modulator, and the other end of the driving circuit is connected with an external input electric signal through gold wire bonding to the circuit board.
3. The integrated transceiver packaged optical assembly of claim 2, wherein the light emitting portion further comprises: at least one optical isolator; the output end of each CW laser is connected with the optical input waveguide end of the silicon-based modulator through one optical isolator.
4. An integrated transceiver packaged optical assembly according to claim 3, wherein said light emitting portion further comprises: a first lens; the optical output end of the silicon-based modulator is connected with the optical fiber adapter through the first lens and the optical filter in sequence.
5. The integrated transceiver package of claim 4, wherein the number of the light receiving parts is at least 1, and the light receiving parts are PD or APD receiving devices packaged by TO-46, the light path is reflected by the optical filter through active coupling and is coupled with the optical fiber, and the circuit is communicated with the outside through the circuit board.
6. The integrated transceiver packaged optical assembly of claim 5, wherein the light emitting portion further comprises: a second lens; the filter is connected with the optical fiber adapter through the second lens.
7. The integrated transceiver package of claim 1, wherein the silicon-based modulator comprises a silicon-based MZ modulator, a micro-ring modulator, or a lithium niobate modulator.
8. The integrated transceiver package of claim 1, wherein the fiber optic adapter comprises a pluggable fiber optic adapter or a pigtail fiber optic adapter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210144663.5A CN114355526B (en) | 2022-02-17 | 2022-02-17 | Integrated receiving and transmitting packaging optical assembly |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210144663.5A CN114355526B (en) | 2022-02-17 | 2022-02-17 | Integrated receiving and transmitting packaging optical assembly |
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| CN114355526A CN114355526A (en) | 2022-04-15 |
| CN114355526B true CN114355526B (en) | 2024-06-21 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210982820U (en) * | 2019-12-13 | 2020-07-10 | 光为科技(广州)有限公司 | SFP28-SR optical module and optical transmission device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7359641B2 (en) * | 2003-07-28 | 2008-04-15 | Emcore Corporation | Modular optical transceiver |
| CN201438232U (en) * | 2009-07-24 | 2010-04-14 | 飞康技术(深圳)有限公司 | Mixed integration-type OLT optical receiving device |
| US9847840B2 (en) * | 2013-03-15 | 2017-12-19 | Finisar Corporation | Multi-channel transceiver with laser array and photonic integrated circuit |
| CN106019496B (en) * | 2016-05-31 | 2018-05-08 | 武汉光迅科技股份有限公司 | A kind of illuminating source packaging structure and its positioning, coupling process |
| CN109581599B (en) * | 2018-07-04 | 2021-01-12 | 深圳朗光科技有限公司 | Mixed-packaged multi-wavelength single-fiber output optical module and laser |
| CN209514144U (en) * | 2019-01-02 | 2019-10-18 | 深圳市易飞扬通信技术有限公司 | Optical module |
| CN209879077U (en) * | 2019-06-26 | 2019-12-31 | 武汉光迅科技股份有限公司 | Hybrid integrated non-airtight wdm-TOSA packaging structure |
| US11353667B2 (en) * | 2020-05-21 | 2022-06-07 | Cloud Light Technology Limited | Transmitter optical sub-assembly (TOSA) structure and an active alignment method thereof |
| CN113759473B (en) * | 2020-06-05 | 2022-12-30 | 华为技术有限公司 | Transmitting-receiving optical assembly, electronic equipment and optical communication system |
| CN112346182B (en) * | 2020-12-10 | 2021-07-06 | 武汉电信器件有限公司 | Optical module |
| CN215416013U (en) * | 2021-09-07 | 2022-01-04 | 武汉兴思为光电科技有限公司 | Airtight packaged silicon light 400G optical module |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210982820U (en) * | 2019-12-13 | 2020-07-10 | 光为科技(广州)有限公司 | SFP28-SR optical module and optical transmission device |
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