CN114334930B - Lighting lamp and lamp panel thereof - Google Patents
Lighting lamp and lamp panel thereof Download PDFInfo
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- CN114334930B CN114334930B CN202111659013.6A CN202111659013A CN114334930B CN 114334930 B CN114334930 B CN 114334930B CN 202111659013 A CN202111659013 A CN 202111659013A CN 114334930 B CN114334930 B CN 114334930B
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Abstract
本发明涉及照明灯及其灯板，灯板包括：基板、电路层、至少一个发光芯片组件、多个焊盘和封装胶体；电路层设置于基板上；每一发光芯片组件包括至少两个发光芯片，各发光芯片相邻设置，且相邻的发光芯片之间设置导热反射墙，导热反射墙由相邻的两个发光芯片之间延伸至发光芯片的外侧形成导热反射层，导热反射层的第二面的朝向与各发光芯片的发光方向相同，导热反射层的第二面为反光面。能够提高灯板上单位面积上的发光芯片的数量，提高单位面积上的照明亮度，并且通过在发光芯片之间设置导热反射墙将发光芯片的热量吸收，并传导至导热反射层，使得发光芯片的热量能够在更大面积上散发，避免了热量堆积。
The invention relates to a lighting lamp and a lamp board thereof. The light board comprises: a substrate, a circuit layer, at least one light-emitting chip assembly, a plurality of solder pads and an encapsulation colloid; the circuit layer is arranged on the substrate; each light-emitting chip assembly includes at least two light-emitting chip assemblies Chips, each light-emitting chip is arranged adjacently, and a heat-conducting reflection wall is arranged between the adjacent light-emitting chips. The heat-conducting reflection wall extends from between two adjacent light-emitting chips to the outside of the light-emitting chip to form a heat-conducting reflection layer. The direction of the second surface is the same as the light-emitting direction of each light-emitting chip, and the second surface of the heat-conducting reflection layer is a light-reflecting surface. It can increase the number of light-emitting chips per unit area on the light board, improve the illumination brightness per unit area, and the heat-conducting reflective walls are arranged between the light-emitting chips to absorb the heat of the light-emitting chips and conduct them to the heat-conducting reflective layer, so that the light-emitting chips The heat can be dissipated over a larger area, avoiding heat accumulation.
Description
Technical Field
The invention relates to the technical field of transformers, in particular to an illuminating lamp and a lamp panel thereof.
Background
The lamp panel commonly used for indoor lighting, and the lamp beads of the lamp panel adopt light-emitting diodes (LEDs). The LED lamp beads emit light after being electrified to provide a light source for the panel. In order to improve the illumination brightness per unit area on the lamp panel, the power of the LED needs to be increased, however, the power of the LED is increased, and the problem that the heat generation amount of the LED is increased and the service life is reduced is caused. How to improve the illumination luminance of lamp plate, and avoid giving out heat too big problem is that present urgent need be solved.
Disclosure of Invention
Therefore, it is necessary to provide an illumination lamp and a lamp panel thereof.
A light panel, comprising: the packaging structure comprises a substrate, a circuit layer, at least one light-emitting chip assembly, a plurality of bonding pads and packaging colloid;
the circuit layer is arranged on the substrate;
each light-emitting chip assembly comprises at least two light-emitting chips, each light-emitting chip is arranged adjacently, a heat conduction reflection wall is arranged between the adjacent light-emitting chips, the heat conduction reflection wall extends from the space between the two adjacent light-emitting chips to the outer side of the light-emitting chips to form a heat conduction reflection layer, the first surface of the heat conduction reflection layer is connected with the substrate, the orientation of the second surface of the heat conduction reflection layer is the same as the light-emitting direction of each light-emitting chip, and the second surface of the heat conduction reflection layer is a reflection surface;
each light-emitting chip is provided with two welding feet, and each welding foot is connected with the circuit layer through one welding pad;
the packaging colloid covers the outer side of each light-emitting chip of the light-emitting chip assembly and is connected with the substrate, and at least part of the packaging colloid covers the heat-conductive reflecting layer.
In one embodiment, each of the light emitting chip assemblies includes two light emitting chips, the two light emitting chips are disposed adjacent to each other, and the two light emitting chips are disposed parallel to each other.
In one embodiment, each of the light emitting chip assemblies includes three light emitting chips, one end of each of the three light emitting chips is disposed near the center of the circle by taking a preset position in the substrate as the center of the circle, the other end of each of the three light emitting chips is radially disposed away from the center of the circle, and an included angle between two adjacent light emitting chips is 120 °.
In one embodiment, the cross-sectional shape of the heat-conducting reflecting wall disposed between two adjacent light-emitting chips is trapezoidal or triangular.
In one embodiment, each of the light emitting chip assemblies includes four light emitting chips, the four light emitting chips are sequentially arranged end to form a square, the heat-conducting reflective wall is disposed on the inner sides of the four light emitting chips, and the heat-conducting reflective wall extends from between two adjacent light emitting chips to the outer sides of the four light emitting chips.
In one embodiment, the cross-sectional shape of the thermally conductive reflective layer is circular.
In one embodiment, a cross-sectional shape of the thermally conductive reflective layer in a direction parallel to a surface of the substrate is the same as a cross-sectional shape of the encapsulant.
In one embodiment, a cross-sectional shape of the encapsulant in a direction perpendicular to the surface of the substrate is a semicircular shape or a circular arc shape.
In one embodiment, the height of the heat-conducting reflecting wall protruding from the substrate is less than the height of each light-emitting chip protruding from the substrate.
An illumination lamp comprises the lamp panel in any one of the above embodiments.
The invention has the beneficial effects that: through setting up the luminescent chip subassembly, each luminescent chip subassembly includes two at least luminescent chip, can improve the quantity of luminescent chip on the lamp plate on the unit area, improve the illumination luminance on the unit area, and absorb luminescent chip's heat through set up the heat conduction reflection wall between luminescent chip, and conduct to the heat conduction reflection stratum, make luminescent chip's heat can give off on a larger scale, avoided the heat to pile up, so that under the condition of improving unit area's luminance, heat dispersion obtains improving, thereby avoided because the too big LED that leads to of heat damages, the life of light has effectively been improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic view of a directional structure of a lamp panel according to an embodiment;
FIG. 2 is an enlarged view of a portion A of FIG. 1;
fig. 3 is a schematic view of another directional structure of the lamp panel according to an embodiment;
FIG. 4 is a schematic view of an arrangement of light emitting chips of the light emitting chip assembly according to an embodiment;
FIG. 5 is a schematic view of an arrangement of light emitting chips of the light emitting chip assembly according to an embodiment;
fig. 6 is a schematic view illustrating an arrangement structure of light emitting chips of the light emitting chip assembly according to an embodiment.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
As shown in fig. 1, fig. 2 and fig. 3, which are lamp panels according to an embodiment of the present invention, include: a substrate 100, a circuit layer 200, at least one light emitting chip assembly 300, a plurality of pads 410, and an encapsulant 500; the circuit layer 200 is disposed on the substrate 100; each of the light emitting chip assemblies 300 includes at least two light emitting chips 310, each of the light emitting chips 310 is disposed adjacent to each other, and a heat conductive reflective wall 610 is disposed between the adjacent light emitting chips 310, the heat conductive reflective wall 610 extends from between the adjacent two light emitting chips 310 to an outer side of the light emitting chips 310 to form a heat conductive reflective layer 620, a first surface of the heat conductive reflective layer 620 is connected to the substrate 100, a second surface of the heat conductive reflective layer 620 faces in the same light emitting direction as the light emitting direction of each of the light emitting chips 310, and a second surface of the heat conductive reflective layer 620 is a light reflective surface; each of the light emitting chips 310 has two solder tails, and each of the solder tails is connected to the circuit layer 200 through one of the bonding pads 410; the encapsulant 500 covers the outer sides of the light emitting chips 310 of the light emitting chip assembly 300 and is connected to the substrate 100, and the encapsulant 500 at least partially covers the heat conductive reflective layer 620.
In this embodiment, the substrate is a Printed Circuit Board (PCB) Board, the Circuit layer 200 is disposed on the surface of the substrate 100, and the Circuit layer 200 is used for connecting a power supply, so that the power supply can supply power to the light emitting chip 310. In this embodiment, the light emitting chip assembly 300 includes a plurality of light emitting chips 310, and the arrangement of the light emitting chips 310 is different according to the number of the light emitting chips, so as to achieve better light emitting effect and better heat dissipation effect. The light emitting chip 310 may also be referred to as a light emitting crystal source, and in this embodiment, the light emitting chip 310 is an LED light emitting chip 310. The positive electrode of the light emitting chip 310 is provided with one solder leg, the negative electrode is provided with another solder leg, and the light emitting chip 310 is connected with the two bonding pads 410 through the two solder legs, so that the circuit layer 200 is accessed to realize electrification.
The encapsulant 500 is used for encapsulating the light emitting chip 310 to protect the light emitting chip 310, and the encapsulant 500 is made of a transparent material, so that light emitted by the light emitting chip 310 can penetrate through the encapsulant 500, and through transmission of the encapsulant 500, the light emitted by the light emitting chip 310 can be refracted to different directions, so that the illumination range is larger, and the illumination brightness in the illumination range is more uniform. In one embodiment, the material of the encapsulant 500 is silicone, that is, the encapsulant 500 is silicone, so that the light emitting chip 310 can be stably encapsulated.
In this embodiment, two sides of the heat-conducting reflective wall 610 are connected to two adjacent light-emitting chips 310, the heat-conducting reflective wall 610 is made of a heat-conducting insulating material, and can effectively isolate the two adjacent light-emitting chips 310, absorb heat of the light-emitting chips 310, and conduct the heat to the heat-conducting reflective layer 620, the material of the heat-conducting reflective layer 620 is the same as that of the heat-conducting reflective wall 610, the heat-conducting reflective wall 610 is integrally connected to the heat-conducting reflective layer 620, so that the heat absorbed by the heat-conducting reflective wall 610 can be conducted to the heat-conducting reflective layer 620, and the heat is dissipated to the outside through the heat-conducting reflective layer 620, thereby the lamp panel has excellent heat dissipation performance.
In addition, in this embodiment, the height of the heat-conductive reflective wall protruding from the substrate 100 is greater than the height of the heat-conductive reflective layer 620 protruding from the substrate 100, so that the height of the heat-conductive reflective wall is greater, which is beneficial to absorb more heat of the light-emitting chip, and the thickness of the heat-conductive reflective layer 620 is smaller, which is beneficial to the heat conduction toward the substrate 100.
In this embodiment, the second surface of the heat-conductive reflective layer 620 is a reflective surface, which can effectively reflect light of each light-emitting chip 310, so as to further improve the light-emitting efficiency and the light-emitting brightness. It should be understood that, since the encapsulant 500 encapsulates the light emitting chip 310, the outer edge of the encapsulant 500 not only refracts the generated light emitted by the light emitting chip 310, but also reflects the light emitted by the light emitting chip 310, which will cause a part of the light to be reflected to the substrate 100 and be lost, and in this embodiment, the heat-conductive reflecting layer 620 can reflect the light reflected by the outer edge of the encapsulant 500 to the outside of the encapsulant 500 again, so that the heat-conductive reflecting layer 620 can not only conduct heat, improve heat dissipation efficiency, but also reflect the light emitted by the light emitting chip 310, so that the illumination brightness is higher. In addition, the heat-conducting reflective wall 610 also has a reflective function, and one surface of the heat-conducting reflective wall 610 facing away from the substrate 100 is a reflective surface, so that light of the light-emitting chips 310 can be reflected between the light-emitting chips 310, and light reflected to the substrate 100 direction by the encapsulant 500 can be reflected to the outer side of the encapsulant 500 again, thereby enabling the overall light-emitting effect of the light-emitting chip assembly 300 to be better and the brightness to be higher.
The encapsulant 500 covers a portion of the thermally conductive reflective layer 620, and at least a portion of the thermally conductive reflective layer 620 extends to the outside of the encapsulant 500, such that the portion of the thermally conductive reflective layer 620 extending to the outside of the encapsulant 500 can radiate heat to the outside well, thereby preventing heat from being lost due to the obstruction of the encapsulant 500.
In the above embodiment, by providing the light emitting chip assemblies 300, each light emitting chip assembly 300 includes at least two light emitting chips 310, the number of light emitting chips 310 on the lamp panel per unit area can be increased, the illumination brightness per unit area is increased, and the heat of the light emitting chips 310 is absorbed by the heat conduction reflection wall 610 arranged between the light emitting chips 310 and conducted to the heat conduction reflection layer 620, so that the heat of the light emitting chips 310 can be dissipated on a larger area, heat accumulation is avoided, so that in the case of increasing the brightness per unit area, the heat dissipation performance is improved, thereby preventing the damage of the LED due to the excessive heat, and effectively prolonging the service life of the illumination lamp.
In order to make the heat-conductive reflective wall 610 and the heat-conductive reflective layer 620 have both good heat-conductive performance and good reflective performance, in one embodiment, the heat-conductive reflective wall 610 includes a first metal heat-conductive inner core, a first reflective film layer coated on an outer side of the first metal heat-conductive inner core, and a first heat-conductive insulating PI (Polyimide) layer coated on an outer side of the first reflective film layer, the heat-conductive reflective layer 620 includes a second metal heat-conductive inner core, a second reflective film layer coated on an outer side of the second metal heat-conductive inner core, and a second heat-conductive insulating PI layer coated on an outer side of the second reflective film layer, the first metal heat-conductive inner core and the second metal heat-conductive inner core are connected, the first reflective film layer is connected to the second reflective film layer, and the first heat-conductive insulating PI layer and the second heat-conductive insulating PI layer are made of transparent PI, and the thicknesses of the first heat-conducting insulating PI layer and the second heat-conducting insulating PI layer are smaller than the thicknesses of the first light-reflecting film layer and the second light-reflecting film layer, in this embodiment, the thicknesses of the first light-reflecting film layer and the second light-reflecting film layer are 0.15mm to 0.2mm, and the thicknesses of the first heat-conducting insulating PI layer and the second heat-conducting insulating PI layer are 50 μm to 80 μm.
In the embodiment, the first metal heat conducting inner core and the second metal heat conducting inner core are made of metal with high heat conductivity, in one embodiment, the first metal heat conducting inner core and the second metal heat conducting inner core are made of metal copper, the heat conductivity coefficient of the metal copper is 377W/m.K, the metal copper has high heat conductivity, in addition, the metal copper is easy to obtain, has low cost and is a natural good heat conduction carrier, in the embodiment, the metal copper is used as the material of the first metal heat conduction inner core and the second metal heat conduction inner core, so that the first metal heat conducting inner core and the second metal heat conducting inner core can better conduct heat, the first reflecting film layer and the second reflecting film layer are used for reflecting light, and the first reflective film layer and the second reflective film layer have smaller thickness, so that heat is not easy to be blocked, and the heat of the light-emitting chip 310 can be efficiently conducted to the first metal heat-conducting inner core and the second metal heat-conducting inner core. The first heat conduction insulation PI layer and the second heat conduction insulation PI layer have good insulation characteristics, and can avoid short circuit of the light emitting chip 310. It is worth mentioning that, because the thicknesses of the first heat conduction insulation PI layer and the second heat conduction insulation PI layer are smaller, the blocking and absorption of the reflected light by the first heat conduction insulation PI layer and the second heat conduction insulation PI layer can be effectively reduced, and the transparent first heat conduction insulation PI layer and the second heat conduction insulation PI layer can have a certain reflection effect, so that the heat conduction reflection wall 610 and the heat conduction reflection layer 620 have good light reflection performance.
In one embodiment, a method for producing a lamp panel is provided: firstly, a circuit layer 200 is manufactured on a substrate 100, a bonding pad 410 is manufactured on the circuit layer 200, a heat conduction insulation PI is coated at a preset position on the substrate 100, a first metal heat conduction inner core and a second metal heat conduction inner core are formed on the heat conduction insulation PI in a copper plating or deposition mode, mounting grooves are reserved at a position corresponding to the bonding pad 410 and a position where the light-emitting chip 310 is mounted when the first metal heat conduction inner core and the second metal heat conduction inner core are formed, the mounting grooves are used for mounting the light-emitting chip 310 and the bonding pad 410, then, light-emitting films are prepared on the surfaces of the first metal heat conduction inner core and the second metal heat conduction inner core, a first light reflecting film layer and a second light reflecting film layer are respectively formed on the surfaces of the first metal heat conduction inner core and the second metal heat conduction inner core, a first heat conduction insulation PI layer and a second heat conduction insulation PI layer are prepared on the outer sides of the first light reflecting film layer and the second light reflecting film layer, thereby completing the preparation of the heat conductive reflective wall 610 and the heat conductive reflective layer 620, then, welding the light emitting chip 310 in the reserved mounting groove to complete the mounting of the light emitting chip 310, and finally, preparing the encapsulant 500 at the outer side of the light emitting chip 310 to encapsulate the light emitting chip 310.
In one embodiment, as shown in fig. 4, each of the light emitting chip assemblies 300 includes two light emitting chips 310, two of the light emitting chips 310 are disposed adjacent to each other, and the two light emitting chips 310 are disposed parallel to each other.
In this embodiment, the two light emitting chips 310 are disposed side by side, and two adjacent edges of the two light emitting chips 310 are parallel to each other, the heat conductive reflective wall 610 is disposed between the two light emitting chips 310, the heat conductive reflective wall 610 is used for isolating the two light emitting chips 310, so as to prevent heat accumulation of the two light emitting chips 310, and in addition, the heat conductive reflective wall 610 is capable of absorbing heat from the two light emitting chips 310 to be conducted to the heat conductive reflective layer 620, thereby achieving heat dissipation.
In this embodiment, the two light emitting chips 310 are disposed side by side, which is beneficial to the concentration of the light emitting directions, and is beneficial to the two light emitting chips 310 having the same light emitting direction, so that the light emitting brightness is higher.
In one embodiment, as shown in fig. 5, each of the light emitting chip assemblies 300 includes three light emitting chips 310, one end of each of the three light emitting chips 310 is disposed near a center of the circle at a predetermined position in the substrate 100, the other end of each of the three light emitting chips 310 is radially disposed away from the center of the circle, and an included angle between two adjacent light emitting chips 310 is 120 °.
It should be understood that the predetermined position of the substrate 100 is a mounting position of each light emitting chip assembly 300, and each predetermined position mounts a light emitting chip assembly 300. In this embodiment, the one end of three luminescent chip 310 sets up in the preset position of base plate 100, and three luminescent chip 310 uses this preset position to set up around this preset position as the centre of a circle, the other end of three luminescent chip 310 court the outside extension of centre of a circle sets up, so that arranging of three luminescent chip 310 is the radial setting that uses preset position as the centre of a circle, the angle of the contained angle between two liang of three luminescent chip 310 is 120, and like this, arranging of three luminescent chip 310 can make luminescent chip subassembly 300 can improve the illumination coverage, and be favorable to the scattering of the light orientation equidirectional not of sending, make the luminance in the illumination zone more even.
In order to match the arrangement shape of the three light emitting chips 310, in one embodiment, the cross-sectional shape of the heat-conducting reflective wall 610 disposed between two adjacent light emitting chips 310 is a trapezoid or a triangle.
In this embodiment, the cross section of the heat-conducting reflective wall 610 in the direction parallel to the surface of the substrate 100 is trapezoidal or triangular, the end with smaller width of the heat-conducting reflective wall 610 is disposed at the end between the two light-emitting chips 310 close to the preset position, and the end with larger width of the heat-conducting reflective wall 610 is disposed at the end between the two light-emitting chips 310 away from the preset position, so that the heat-conducting reflective wall 610 can adapt to the shape of the gap between the two light-emitting chips 310, and the width of the heat-conducting reflective wall 610 can be gradually increased along the direction of heat conduction, so as to increase the connection area with the heat-conducting reflective layer 620, thereby increasing the heat conduction area and improving the heat dissipation efficiency.
In this embodiment, a triangular or trapezoidal isolation groove is formed between every two three light emitting chips 310, the width of the isolation groove gradually increases from one end close to the predetermined position to one end far from the predetermined position, the heat-conducting reflective wall 610 is disposed in the isolation groove, the shape of the heat-conducting reflective wall 610 is the same as that of the isolation groove, the width of the heat-conducting reflective wall 610 is equal to that of the isolation groove, two sides of the heat-conducting reflective wall 610 are connected to the sidewalls of two sides of the isolation groove, i.e., two sides of the heat-conducting reflective wall 610 are connected to the sides of two adjacent light emitting chips 310, so that the heat-conducting reflective wall 610 can absorb the heat of the light emitting chips 310, the heat absorbed by the heat-conducting reflective wall is conducted from the inner side of the light emitting chip assembly 300 to the outer side, because the heat-conducting reflective wall 610 can gradually increase the width along the heat conduction direction, the connection area with the heat-conducting reflective layer 620 can be effectively increased, thereby improving the heat conduction area and improving the heat dissipation efficiency.
It should be understood that the angle between two of the three light emitting chips 310 is 120 °, compared to the case of two, four, etc. of the two light emitting chips, the three light emitting chips are likely to cause uneven light emission, the light of the even number of light emitting chips can be complementary in the non-uniform area of the light emitting intensity, and the three light emitting chips are not likely to be complementary, resulting in uneven light emission, and the shadow phenomenon that is likely to be caused by uneven light emission, in order to avoid uneven light emission of the three light emitting chips, in one embodiment, the heat conductive reflective layer is convexly provided with a light reflecting portion at a position close to the heat conductive reflective wall, the height of the light reflecting portion protruding from the substrate is equal to the height of the heat conductive reflective wall protruding from the substrate, and in this embodiment, the height of the heat conductive reflective wall protruding from the substrate is equal to the height of the light emitting chips protruding from the substrate, and the light scattering layer is provided outside the heat conductive reflective layer, the packaging colloid wraps the outer side of the light scattering layer, the material of the light scattering layer is made of transparent light scattering glass or transparent light scattering resin, therefore, the heat conduction reflecting layer and the light emitting part have the characteristic of light reflection, after the light emitting chip emits light, part of light is reflected to the heat conduction reflecting wall and the light reflecting part under the reflection effect of the light scattering layer and the packaging colloid, the heat conduction reflecting wall, the light reflecting part and the light emitting chip are located at the same height, the light reflected by the heat conduction reflecting wall and the light reflecting part and the light emitted by the light emitting chip are emitted to the light scattering layer from the same height, the light scattering layer is used for scattering and spreading to the outer side, the three light emitting chips, the heat conduction reflecting wall and the light reflecting part form a whole, after the light passes through the light scattering layer, the light can be uniformly irradiated to the outside, and uniform light emitting is achieved.
It should be understood that, in traditional light, the diffusion sheet is located the outside of each LED lamp pearl, and be located the inboard of lamp shade, be used for making LED lamp pearl luminous more even, and in this application, set up a diffusion layer on each luminescent chip subassembly, can make each luminescent chip subassembly luminous more even, avoid because the luminous inhomogeneous that leads to of three luminescent chip combination, avoid because the shadow phenomenon that the luminous inhomogeneous leads to, like this, the light can need not to set up the diffusion sheet, or adopt the less diffusion sheet of thickness, be favorable to reducing the cost of light. In addition, in this embodiment, the light scattering layer is attached on the surface of heat conduction reflection wall, reflection of light portion and luminous chip, and traditional light scattering plate is apart from certain distance with the light source, in this application, keep away from heat conduction reflection wall, the one side of reflection of light portion and luminous chip can the reflection of light portion, so that this partial reflection's light can be through heat conduction reflection wall, the secondary reflection of light portion, make luminous chip and heat conduction reflection wall, reflection of light portion form luminous effect jointly, scattering through the light scattering layer, can make holistic luminous more even. Because the traditional light-diffusing plate is away from the light source by a certain distance, the light emitted by the light source can be reflected on the surface of the light-diffusing plate close to the light source, and the whole light-emitting effect cannot be formed. In this application, because the light scattering layer is attached on the surface of heat conduction reflection wall, reflection of light portion and luminescence chip, the unable reverberation of attached heat conduction reflection wall, reflection of light portion and luminescence chip's surface one side for the light of luminescence chip only reflects in the one side that the light scattering layer kept away from heat conduction reflection wall, reflection of light portion and luminescence chip, thereby has realized foretell luminous effect entirely.
In one embodiment, as shown in fig. 4, each of the light emitting chip assemblies 300 includes four light emitting chips 310, the four light emitting chips 310 are sequentially arranged end to form a square, the heat conductive reflective wall 610 is disposed on the inner sides of the four light emitting chips 310, and the heat conductive reflective wall 610 extends from between two adjacent light emitting chips 310 to the outer sides of the four light emitting chips 310.
In this embodiment, two of the four light emitting chips 310 that are disposed relatively are parallel to each other and are disposed at an interval, and two of the four light emitting chips 310 that are adjacent to each other are perpendicular to each other, so that the four light emitting chips 310 are sequentially arranged end to form a square shape, the inner side forms a reflective groove, the heat-conducting reflective wall 610 is located in the reflective groove, and two of the four light emitting chips 310 that are adjacent to each other are disposed at an interval, so that the heat-conducting reflective wall 610 can penetrate through two gaps between the light emitting chips 310 and extend to the outer sides of the four light emitting chips 310 to form the heat-conducting reflective layer 620. Through with four luminous chips 310 around setting, on the one hand, can further improve luminance, on the other hand, through the reflection of heat conduction reflection wall 610, can increase the illumination zone to make the illumination more even.
In one embodiment, the cross-sectional shape of the thermally conductive reflective layer 620 is circular. In this embodiment, the sectional shape of the thermally conductive reflective layer 620 in a direction parallel to the surface of the substrate 100 is circular, so that the thermally conductive reflective layer can surround the light emitting chip assembly 300 from the outside and light of the light emitting chip assembly 300 can be uniformly reflected.
In one embodiment, the cross-sectional shape of the heat conductive reflective layer 620 is the same as the cross-sectional shape of the encapsulant 500 in a direction parallel to the surface of the substrate 100.
In this embodiment, the cross-sectional shape of the heat-conductive reflective layer 620 is circular, the cross-sectional shape of the encapsulant 500 is circular, and the diameter of the heat-conductive reflective layer 620 is greater than the maximum diameter of the encapsulant 500, so that the heat-conductive reflective layer 620 can extend to the outside of the encapsulant 500 for heat dissipation, and the heat-conductive reflective layer 620 located at the inside of the encapsulant 500 can well reflect the light of the light-emitting chip 310.
In one embodiment, the cross-sectional shape of the encapsulant 500 in a direction perpendicular to the surface of the substrate 100 is a semicircle or a circular arc.
In this embodiment, the encapsulant 500 is disposed in a hemispherical shape or in an arc shape, the outer edge of the encapsulant 500 is in a semicircular shape or in an arc shape, the light emitting chip 310 is transmitted through the encapsulant 500 and is refracted through an interface between the outer edge of the encapsulant 500 and the air, so that the light of the light emitting chip 310 can be emitted to the outside by the semicircular or arc-shaped surface of the encapsulant 500, and the light of the light emitting chip 310 can be more uniformly emitted to the outside.
In one embodiment, a side of the heat-conducting reflective wall 610 facing away from the substrate 100 is configured as an arc-shaped convex surface, and a convex direction of the arc-shaped convex surface is the same as a convex direction of the encapsulant 500, in this embodiment, a cross-sectional shape of an end of the heat-conducting reflective wall 610 facing away from the substrate 100 is arc-shaped, so that the side of the heat-conducting reflective wall 610 facing away from the substrate 100 is bent to form the arc-shaped convex surface, so that the heat-conducting reflective wall 610 can reflect light of the adjacent light-emitting chips 310 at two sides to an outer side of the encapsulant 500, and in addition, a part of light reflected to the heat-conducting reflective wall 610 by an outer surface of the encapsulant 500 can be reflected again by the arc-shaped convex surface, on one hand, because the arc-shaped convex surface has a larger surface area compared with a plane, the reflective area of the light can be effectively increased, and on the other hand, because of an arc characteristic of the arc-shaped convex surface, the light reflection range can be larger, the whole light emission diffusion of the light emitting chip assembly 300 is facilitated, the illumination range is larger, and the brightness is more uniform.
In one embodiment, the height of the heat-conducting reflective wall protruding above the substrate 100 is less than the height of each light-emitting chip 310 protruding above the substrate 100. In this way, not only can the blocking of the light emitting chip 310 in the direction parallel to the surface of the substrate 100 by the heat conduction light emitting wall be avoided, but also more light can be reflected, so that the reflection effect is better.
In one embodiment, an illumination lamp is provided, which includes the lamp panel described in any one of the above embodiments.
In this embodiment, the lighting lamp may be a panel lamp, may also be an advertisement lamp, and may also be applied to other lighting required in daily life, which is not described redundantly in this embodiment.
In the above embodiment, through setting up the luminescent chip subassembly, each luminescent chip subassembly includes two at least luminescent chip, can improve the quantity of luminescent chip on the lamp plate on the unit area, improve illumination brightness on the unit area, and absorb luminescent chip's heat through set up the heat conduction reflection wall between luminescent chip, and conduct to the heat conduction reflection stratum, make luminescent chip's heat can give off on a larger scale, the heat has been avoided piling up, so that under the condition of improving unit area's luminance, heat dispersion obtains improving, thereby avoided because the too big LED that leads to of heat damages, the life of light has effectively been improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
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