CN114324990A - Universal thermal test fixture device for electronic module unit - Google Patents
Universal thermal test fixture device for electronic module unit Download PDFInfo
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- CN114324990A CN114324990A CN202111498089.5A CN202111498089A CN114324990A CN 114324990 A CN114324990 A CN 114324990A CN 202111498089 A CN202111498089 A CN 202111498089A CN 114324990 A CN114324990 A CN 114324990A
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- heat sink
- thermal test
- test fixture
- electronic module
- locking strip
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Abstract
The invention relates to the technical field of thermal test of electronic equipment, in particular to a universal thermal test fixture device of an electronic module unit. The heat sink convenient to flexibly adjust is arranged, the tested modules are connected, installed and adjusted, and the locking strips are matched to realize the connection of modules with different specifications, so that the application range of the clamp is enlarged, and the clamp is more flexible and convenient to use.
Description
Technical Field
The invention relates to the technical field of thermal test of electronic equipment, in particular to a universal thermal test fixture device of an electronic module unit.
Background
With the development trend of high integration level in the electronic industry, the heat consumption of a single module is increasing day by day. In order to reduce the heat dissipation risk of the key module, single module thermal testing is required to be performed at the research and development stage. In the electronic industry, slot-in standard modules are widely used, such as ASAAC standard modules, SEM-D modules, etc., and such modules usually adopt a double heat sink type with heat conduction from the left and right sides of the same plane. A universal and convenient thermal test fixture device will greatly improve the efficiency of thermal testing touch down.
The conventional thermal testing clamping device is independently designed according to the structure of a single module, has high customization and weak universality, has the defects of untight combination, inconvenient clamping or complex device and the like of clamping of a tested unit and a heat sink, and cannot realize quick and effective module thermal testing.
Therefore, there are many portions to be improved during the thermal test of the electronic device, and the structure of the test device needs to be improved so as to quickly clamp the tested module, and a more stable clamping effect needs to be achieved so as to perform a more convenient and reliable thermal test. Therefore, the prior art needs to be optimized and improved, a more reasonable technical scheme is provided, and the problems in the prior art are solved.
Disclosure of Invention
In order to solve the above-mentioned defects in the prior art, the invention provides a universal thermal test fixture device for an electronic module unit, wherein a heat sink and a locking member are adopted to cooperate to clamp and fix a module to be tested, so that clamping is convenient, the convenience of testing is improved, and the testing effect can also be improved.
In order to achieve the purpose, the invention specifically adopts the technical scheme that:
the utility model provides a hot test fixture device of general type of electronic module unit, includes the bottom plate, is provided with many parallel arrangement's draw-in grooves on the bottom plate, is provided with the heat sink that is used for pressing from both sides tight by the test module that relative slip adjusted on the draw-in groove, heat sink with by the supplementary fastening of locking strip between the test module.
According to the fixture device, the bottom plate is used as the carrier plate, the heat sink on the bottom plate can adjust the clamping distance according to requirements, and after the tested module is arranged between the heat sink, the tested module is reinforced through the locking strip, so that the fixture and the tested module are stably and reliably connected. In the subsequent thermal test, the heat sink keeps constant temperature, and the heating capacity test of the tested module in the heated environment is more accurate.
Further, in the present invention, in order to connect the heat sink and the module under test more stably, the following feasible options are optimized and presented: the heat sink is provided with an embedding groove, and the embedding groove faces to the clamped tested module and is matched and clamped with the edge of the clamped module. When the scheme is adopted, the structure of the heat sink is similar to a C shape.
Further, during the process of performing the thermal test, the heat sink maintains a stable temperature, and the thermal test of the module to be tested is prevented from being affected by the temperature change, and the optimization is performed here and one of the feasible options is taken as follows: the heat sink is provided with a flow passage hole, the flow passage hole penetrates from one end of the heat sink to the other end of the heat sink, and the port of the flow passage hole is connected with the liquid cooling connector and introduces constant temperature liquid into the flow passage. When the scheme is adopted, the temperature of the heat sink is always kept fixed.
Further, when the locking strip is provided for reinforcement, various schemes can be adopted, which are not limited only, and the optimization is performed here to show one of the possible options: one side of the locking strip is tightly propped against the clamped module, and the other side of the locking strip is tightly propped against the heat sink. When the scheme is adopted, the module to be tested can be tightly abutted from the horizontal direction or the horizontal direction, and the module to be tested can be tightly abutted with the heat sink.
Still further, further optimize by the installation of test module, adopt vertical direction to support the mode that tightly and set up the locking strip, it is specific: the edge of the clamped module is inserted into the caulking groove and has a gap with the inner top of the caulking groove, the locking strip is positioned in the gap, the upper side of the locking strip abuts against the inner top of the caulking groove, and the lower side of the locking strip abuts against the upper surface of the clamped module. Still further, for the convenience of adjusting the locking strip, optimize here: the locking strip on be provided with the regulating part that is used for adjusting the tight distance of support of locking strip. When adopting such scheme, the regulating part can adopt the helicitic texture to adjust, and the tight height of support of locking strip can be adjusted to rotating the regulating part to realize fastening connection.
Further, in the present invention, the heat sink can be flexibly arranged to mount and fix the tested module, and the number of the tested modules can be arranged in plural, specifically, the following feasible options are given here: the bottom plate is provided with a plurality of pairs of heat sinks, and each pair of heat sinks are respectively used for clamping different tested modules. When the scheme is adopted, one tested module can be installed on one pair of heat sinks, and a plurality of tested modules can also be installed on the pair of heat sinks.
Further, in order to facilitate fixing and adjusting the heat sink, the bottom plate is optimized and improved and one possible option is given as follows: the draw-in groove be the ladder groove, the draw-in groove includes that the notch width at the bottom plate upper surface is less than the notch width at the bottom plate lower surface, upwards passes the connecting piece and penetrates to connect fixedly in the heat sink from the lower surface of bottom plate. When the scheme is adopted, the connecting piece can adopt parts such as bolts and the like which are convenient to adjust and fix.
Compared with the prior art, the invention has the beneficial effects that:
the heat sink convenient to flexibly adjust is arranged, the tested modules are connected, installed and adjusted, and the locking strips are matched to realize the connection of modules with different specifications, so that the application range of the clamp is enlarged, and the clamp is more flexible and convenient to use.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of the overall structure of a module under test clamped by a clamp.
FIG. 2 is a schematic view of a clamp clamping a module under test in front view and an enlarged view of a part of the structure;
fig. 3 is a schematic structural diagram of the heat sink.
Fig. 4 is a schematic structural view of the locking strip.
Fig. 5 is a schematic cross-sectional view of the base plate.
Fig. 6 is a schematic structural view in embodiment 2.
Fig. 7 is a schematic structural view in embodiment 3.
In the above drawings, the meaning of each symbol is: 1. a base plate; 2. a card slot; 3. a heat sink; 4. a flow passage hole; 5. caulking grooves; 6. a module under test; 7. a locking strip; 8. an adjusting member.
Detailed Description
The invention is further explained below with reference to the drawings and the specific embodiments.
It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. Specific structural and functional details disclosed herein are merely illustrative of example embodiments of the invention. This invention may, however, be embodied in many alternate forms and should not be construed as limited to the embodiments set forth herein.
Example 1
Aiming at the phenomena that the application range of a module clamp is small and the use is not flexible enough in the existing electronic module thermal testing process, the electronic module thermal testing method is optimized and used for overcoming the problems in the prior art.
Specifically, as shown in fig. 1, this embodiment discloses a general thermal test fixture device for an electronic module unit, which includes a bottom plate 1, wherein a plurality of parallel slots 2 are provided on the bottom plate 1, a heat sink 3 which is adjusted by relative sliding and is used for clamping a tested module 6 is provided on the slots 2, and the heat sink 3 and the tested module 6 are fastened by a locking strip 7.
Preferably, in this embodiment, the size of the bottom plate 1 is 600mm × 700mm × 10mm, the distance between the slots 2 is 50mm, and the radius of the slot 2 is 2.25 mm. The length of the heat sink 3 is 550 mm. The length of the locking strip 7 is 200mm, and the adjusting stroke range of the locking strip 7 is 16mm to 20 mm. The overall dimension of the electronic module unit is 233.5mm 160mm 25mm, the both sides of the electronic module unit are provided with edges and are used for fastening and matching, and the height of the locking strip 7 is 7 mm.
According to the fixture device, the bottom plate 1 serves as a carrier plate, the heat sink pieces 3 on the bottom plate 1 can adjust the clamping distance according to requirements, and after the tested module 6 is arranged between the heat sink pieces 3, the tested module is reinforced through the locking strips 7, so that the fixture and the tested module 6 are stably and reliably connected. In the subsequent thermal test, the heat sink 3 keeps constant temperature, and the heat capacity test of the tested module 6 in the heated environment is more accurate.
In the present embodiment, in order to connect the heat sink 3 and the module under test 6 more stably, optimization is performed here and one of the following possible options is adopted: as shown in fig. 2 and 3, the heat sink 3 is provided with a caulking groove 5, and the caulking groove 5 faces the clamped module under test 6 and is matched with the edge of the clamped module for clamping. With this arrangement, the heat sink 3 is configured like a C-shape.
During the thermal test, the heat sink 3 maintains a stable temperature, and the thermal test of the tested module 6 is prevented from being influenced by the temperature change, and the optimization is performed and one of the feasible options is adopted: the heat sink 3 is provided with a flow passage hole 4, the flow passage hole 4 penetrates from one end of the heat sink 3 to the other end of the heat sink 3, and the port of the flow passage hole 4 is connected with a liquid cooling connector and introduces constant temperature liquid into the flow passage. With such a scheme, the temperature of the heat sink 3 is always kept constant.
Preferably, the two heat sinks 3 are supplied with liquid in series, and the temperature of the heat sink is 50 ℃.
In the case of the locking strip 7 for reinforcement, a wide variety of solutions can be used, which are not exclusively limiting, and which are optimized and use one of the possible options: as shown in fig. 2 and 4, one side of the locking strip 7 abuts against the clamped module, and the other side abuts against the heat sink 3. When the scheme is adopted, the module to be tested can be tightly abutted from the horizontal direction or the horizontal direction, and the module to be tested 6 and the heat sink 3 can be tightly abutted.
Preferably, further optimize by the installation of test module 6, this embodiment adopts the mode that vertical direction supports tightly to set up locking strip 7, and is specific: the edge of the clamped module is inserted into the embedded groove 5 and has a gap with the inner top of the embedded groove 5, the locking strip 7 is positioned in the gap, the upper side of the locking strip 7 is abutted against the inner top of the embedded groove 5, and the lower side of the locking strip 7 is abutted against the upper surface of the clamped module.
For the convenience of adjusting the locking strip 7, an optimization is made here: the locking strip 7 is provided with an adjusting piece 8 for adjusting the abutting distance of the locking strip 7. When adopting such scheme, adjusting part 8 can adopt the helicitic texture to adjust, and the tight height of supporting of locking strip 7 can be adjusted to rotating adjusting part 8 to realize fastening connection.
In order to facilitate the fixing and adjustment of the heat sink 3, the base plate 1 is here improved optimally and with one of the following possible options: as shown in fig. 5, the card slot 2 is a stepped slot, and the width of the slot on the upper surface of the bottom plate 1 of the card slot 2 is smaller than that of the slot on the lower surface of the bottom plate 1, and the card slot passes through the connecting piece from the lower surface of the bottom plate 1 upwards and penetrates into the heat sink 3 to be connected and fixed. When the scheme is adopted, the connecting piece can adopt parts such as bolts and the like which are convenient to adjust and fix.
Example 2
The embodiment discloses a universal thermal test fixture device of an electronic module unit, and tested units with other sizes are rearranged on the basis of the embodiment 1.
Specifically, as shown in fig. 6, in the present embodiment, the external dimensions of the electronic module unit are Φ 160mm × 24mm, and the height at the heat sink 3 is 7 mm. The two heat sinks respectively supply liquid, and the temperature of the heat sinks is respectively 35 ℃ and 40 ℃.
In this embodiment, the structure and connection relationship of each part are the same as those in embodiment 1, and are not described herein again.
Example 3
The embodiment discloses a universal thermal test fixture device of an electronic module unit, and tested units with other sizes are rearranged on the basis of the embodiment 1.
Specifically, as shown in fig. 7, in the present embodiment, the heat sink 3 may be flexibly arranged to mount and fix the tested module 6, and the number of the tested modules 6 may be arranged in plural, specifically, one of the following feasible options is adopted here: the base plate 1 is provided with a plurality of pairs of heat sinks 3, and each pair of heat sinks 3 is respectively used for clamping different tested modules 6. With this arrangement, one module under test 6 may be mounted on one pair of heat sinks 3, or a plurality of modules under test 6 may be mounted thereon.
Preferably, the external dimension of the electronic module unit is 160mm multiplied by 120mm multiplied by 24mm, and the height at the heat sink is 6 mm. Liquid is supplied in series, and the temperature of a heat sink is 45 ℃. According to the scheme, four electronic module units can be arranged at the same time.
The above embodiments are just exemplified in the present embodiment, but the present embodiment is not limited to the above alternative embodiments, and those skilled in the art can obtain other various embodiments by arbitrarily combining with each other according to the above embodiments, and any other various embodiments can be obtained by anyone in light of the present embodiment. The above detailed description should not be construed as limiting the scope of the present embodiments, which should be defined in the claims, and the description should be used for interpreting the claims.
Claims (8)
1. A general type of thermal test fixture device of electronic module unit characterized in that: the testing device comprises a bottom plate (1), wherein a plurality of clamping grooves (2) which are arranged in parallel are arranged on the bottom plate (1), heat sink pieces (3) which are adjusted in a relative sliding mode and used for clamping tested modules (6) are arranged on the clamping grooves (2), and the heat sink pieces (3) and the tested modules (6) are fastened in an auxiliary mode through locking strips (7).
2. The universal thermal test fixture apparatus of electronic module unit of claim 1, wherein: the heat sink (3) is provided with an embedding groove (5), and the embedding groove (5) faces to the clamped module to be tested (6) and is matched and clamped with the edge of the clamped module.
3. The universal thermal test fixture apparatus of electronic module unit of claim 2, wherein: the heat sink (3) is provided with a flow passage hole (4), the flow passage hole (4) penetrates from one end of the heat sink (3) to the other end of the heat sink (3), and the port of the flow passage hole (4) is connected with a liquid cooling connector and introduces constant temperature liquid into the flow passage.
4. The universal thermal test fixture apparatus of electronic module unit of claim 1, wherein: one side of the locking strip (7) is tightly propped against the clamped module, and the other side of the locking strip is tightly propped against the heat sink (3).
5. The universal thermal test fixture apparatus of electronic module unit of claim 4, wherein: the edge of the clamped module is inserted into the embedded groove (5) and has a gap with the inner top of the embedded groove (5), the locking strip (7) is positioned in the gap, the upper side of the locking strip (7) abuts against the inner top of the embedded groove (5), and the lower side of the locking strip (7) abuts against the upper surface of the clamped module.
6. Universal thermal test fixture device of electronic module units according to claim 4 or 5, characterized in that: the locking strip (7) is provided with an adjusting piece (8) for adjusting the abutting distance of the locking strip (7).
7. The universal thermal test fixture apparatus of electronic module unit of claim 1, wherein: the testing device is characterized in that a plurality of pairs of heat sinks (3) are arranged on the bottom plate (1), and each pair of heat sinks (3) are respectively used for clamping different tested modules (6).
8. The universal thermal test fixture apparatus of electronic module unit of claim 1, wherein: draw-in groove (2) be the ladder groove, draw-in groove (2) include that the notch width at bottom plate (1) upper surface is less than the notch width at bottom plate (1) lower surface, from the lower surface of bottom plate (1) up pass the connecting piece and penetrate to connect fixedly in heat sink (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111498089.5A CN114324990A (en) | 2021-12-09 | 2021-12-09 | Universal thermal test fixture device for electronic module unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111498089.5A CN114324990A (en) | 2021-12-09 | 2021-12-09 | Universal thermal test fixture device for electronic module unit |
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| Publication Number | Publication Date |
|---|---|
| CN114324990A true CN114324990A (en) | 2022-04-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111498089.5A Withdrawn CN114324990A (en) | 2021-12-09 | 2021-12-09 | Universal thermal test fixture device for electronic module unit |
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| CN (1) | CN114324990A (en) |
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| US20050152663A1 (en) * | 2004-01-02 | 2005-07-14 | Bench Samantha R. | Systems, devices and methods for thermal testing of an optoelectronic module |
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| CN204903583U (en) * | 2015-08-25 | 2015-12-23 | 贵州航天计量测试技术研究所 | Big power diode ageing tests anchor clamps of area heat dissipation function |
| CN205196188U (en) * | 2015-12-09 | 2016-04-27 | 成都奇航系统集成有限公司 | Tight lock power adjustable wedge locking strip |
| CN108445417A (en) * | 2018-05-17 | 2018-08-24 | 合肥国轩高科动力能源有限公司 | Square aluminum hull battery constant temperature and constant voltage's test fixture |
| CN111337173A (en) * | 2020-02-28 | 2020-06-26 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | System for measuring locking force of wedge-shaped packaging slot of electronic module |
| CN211387823U (en) * | 2020-01-06 | 2020-09-01 | 许英 | Fixture for machining of radiating tube plate |
| CN212905012U (en) * | 2020-07-15 | 2021-04-06 | 苏州聚点智能科技有限公司 | Protection device of chip test fixture |
| CN113286466A (en) * | 2021-05-21 | 2021-08-20 | 中国电子科技集团公司第二十九研究所 | Integrated locking and heat conducting structure of low-profile electronic module |
| CN113518532A (en) * | 2021-08-23 | 2021-10-19 | 湖南枫蓝信息技术有限公司 | Wedge type locking strip |
-
2021
- 2021-12-09 CN CN202111498089.5A patent/CN114324990A/en not_active Withdrawn
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050152663A1 (en) * | 2004-01-02 | 2005-07-14 | Bench Samantha R. | Systems, devices and methods for thermal testing of an optoelectronic module |
| CN103212932A (en) * | 2013-04-28 | 2013-07-24 | 江苏科技大学 | Combined double-shaft-shoulder friction stir welding fixture |
| CN204591886U (en) * | 2015-04-21 | 2015-08-26 | 成都萨伯电子应用科技有限公司 | A kind of anti-dropping type locking strip |
| CN204903583U (en) * | 2015-08-25 | 2015-12-23 | 贵州航天计量测试技术研究所 | Big power diode ageing tests anchor clamps of area heat dissipation function |
| CN205196188U (en) * | 2015-12-09 | 2016-04-27 | 成都奇航系统集成有限公司 | Tight lock power adjustable wedge locking strip |
| CN108445417A (en) * | 2018-05-17 | 2018-08-24 | 合肥国轩高科动力能源有限公司 | Square aluminum hull battery constant temperature and constant voltage's test fixture |
| CN211387823U (en) * | 2020-01-06 | 2020-09-01 | 许英 | Fixture for machining of radiating tube plate |
| CN111337173A (en) * | 2020-02-28 | 2020-06-26 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | System for measuring locking force of wedge-shaped packaging slot of electronic module |
| CN212905012U (en) * | 2020-07-15 | 2021-04-06 | 苏州聚点智能科技有限公司 | Protection device of chip test fixture |
| CN113286466A (en) * | 2021-05-21 | 2021-08-20 | 中国电子科技集团公司第二十九研究所 | Integrated locking and heat conducting structure of low-profile electronic module |
| CN113518532A (en) * | 2021-08-23 | 2021-10-19 | 湖南枫蓝信息技术有限公司 | Wedge type locking strip |
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Application publication date: 20220412 |
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