CN114318244A - Pot-lined structure with indirect heating platform - Google Patents
Pot-lined structure with indirect heating platform Download PDFInfo
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- CN114318244A CN114318244A CN202011049693.5A CN202011049693A CN114318244A CN 114318244 A CN114318244 A CN 114318244A CN 202011049693 A CN202011049693 A CN 202011049693A CN 114318244 A CN114318244 A CN 114318244A
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 61
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 34
- 238000000576 coating method Methods 0.000 abstract description 34
- 239000000463 material Substances 0.000 abstract description 25
- 238000001704 evaporation Methods 0.000 abstract description 7
- 230000008020 evaporation Effects 0.000 abstract description 7
- 238000009834 vaporization Methods 0.000 abstract description 3
- 230000008016 vaporization Effects 0.000 abstract description 3
- 238000004544 sputter deposition Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract 1
- 230000000087 stabilizing effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000010949 copper Substances 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 238000010894 electron beam technology Methods 0.000 description 5
- 239000013077 target material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000005566 electron beam evaporation Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000006200 vaporizer Substances 0.000 description 1
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Abstract
本发明提供一种具有间接加热平台的衬锅结构,其包括:锅体,其为碗状结构,并具有容置空间;以及至少一个加热平台,其是形成于该容置空间。借由本发明的实施,可以达成避免镀膜材料喷溅、蒸镀面积最大化、镀膜材料温度更一致以及汽化后所产生的镀率随之稳定的功效。
The invention provides a pot lining structure with an indirect heating platform, which comprises: a pot body, which is a bowl-shaped structure and has an accommodating space; and at least one heating platform, which is formed in the accommodating space. Through the implementation of the present invention, the effects of avoiding the sputtering of the coating material, maximizing the evaporation area, making the temperature of the coating material more consistent, and subsequently stabilizing the coating rate after vaporization can be achieved.
Description
技术领域technical field
本发明为一种具有间接加热平台的衬锅结构,其特别是一种应用于镀膜设备的具有间接加热平台的衬锅结构。The present invention is a pot lining structure with an indirect heating platform, particularly a pot lining structure with an indirect heating platform applied to coating equipment.
背景技术Background technique
如图1所示,现有习知衬锅结构P100,是利用电子枪P10产生的电子束 P11直接轰击靶材/镀膜材料P20,使靶材熔化,进而蒸发后附着到待镀基板上。早期蒸镀大多使用热电阻加热法,但靶材和坩锅与加热源直接接触,能蒸镀的镀膜材料P20种类有限,靶材耗损量大,得到的薄膜纯度也不足。As shown in FIG. 1 , the conventional pot lining structure P100 utilizes the electron beam P11 generated by the electron gun P10 to directly bombard the target/coating material P20 to melt the target and then evaporate and attach to the substrate to be plated. The thermal resistance heating method was mostly used in the early evaporation, but the target and the crucible were in direct contact with the heating source, the types of P20 coating materials that could be evaporated were limited, the target material wastage was large, and the purity of the obtained film was also insufficient.
而电子束蒸镀法,则可有效地改善热蒸镀法的限制。电子束蒸镀法,是利用高能电子束的动能,转换为熔化靶材的热能,并利用靶材在接近熔点时的饱和蒸汽压进行镀膜。此法除了有很好的热转换效率外,蒸镀速率亦能精准控制,靶材种类选择的限制较少,除部分化合物及合金外,多数镀膜材料P20皆能蒸镀。The electron beam evaporation method can effectively improve the limitation of thermal evaporation method. Electron beam evaporation method uses the kinetic energy of high-energy electron beams to convert the thermal energy of melting the target material, and uses the saturated vapor pressure of the target material when it is close to the melting point for coating. In addition to good thermal conversion efficiency, this method can accurately control the evaporation rate, and there are fewer restrictions on the selection of target materials. Except for some compounds and alloys, most coating materials P20 can be evaporated.
如图2A及图2B所示,现有习知的电子枪P10产生的电子束P11,经磁吸控制元件P30产生180或270度偏向直接发射到蒸发物的表面。此时,针对较为活泼的物质在使用电子枪直接对镀膜材料P20加热时,会造成镀膜材料 P20喷溅或火花四射的状况,此外,现有习知加热的温度以打点为中心散开,因此镀率都很难控制的稳定。As shown in FIG. 2A and FIG. 2B , the electron beam P11 generated by the conventional electron gun P10 is deflected by 180 or 270 degrees through the magnetic attraction control element P30 and directly emitted to the surface of the vaporizer. At this time, when an electron gun is used to directly heat the coating material P20 for a relatively active substance, the coating material P20 will be sprayed or sparked. The plating rate is difficult to control and stabilize.
发明内容SUMMARY OF THE INVENTION
本发明为一种具有间接加热平台的衬锅结构,其是要解决现有习知直接加热的衬锅结构,其所产生的喷溅问题、蒸镀面积较小、镀膜材料溶解不完整、被加热镀膜材料温度不一致、以及汽化后所产生的镀率不稳定…等问题。The present invention is a pot lining structure with an indirect heating platform, which aims to solve the problems of splashing, small evaporation area, incomplete dissolution of coating materials, and problems caused by the conventional direct heating lining pot structure. The temperature of the heating coating material is inconsistent, and the coating rate after vaporization is unstable...etc.
本发明间接式加热方式,亦可适用于高导热的镀膜材料,例如银(Ag)、铜(Cu)、金(Au)、铂(Pt),以避免因为电子枪加热功率过高,造成喷溅问题。The indirect heating method of the present invention is also applicable to coating materials with high thermal conductivity, such as silver (Ag), copper (Cu), gold (Au), platinum (Pt), to avoid splashing caused by excessive heating power of the electron gun question.
本发明提供一种具有间接加热平台的衬锅结构,其包括:锅体,其为碗状结构,并具有容置空间;以及至少一个加热平台,其是形成于该容置空间内。The present invention provides a pot lining structure with an indirect heating platform, which includes: a pot body, which is a bowl-shaped structure and has an accommodating space; and at least one heating platform, which is formed in the accommodating space.
较佳地,其中该加热平台是形成于该容置空间的中央部位。Preferably, the heating platform is formed in the central part of the accommodating space.
较佳地,其中该至少一个加热平台与该锅体为一体成型的结构。Preferably, the at least one heating platform and the pot body are integrally formed.
较佳地,其中该加热平台为底面积大于或等于顶面积的结构。Preferably, the heating platform is a structure with a bottom area greater than or equal to a top area.
较佳地,其中该加热平台为圆锥体、圆柱体、多边形柱体、或多边形锥体的结构。Preferably, the heating platform is in the form of a cone, a cylinder, a polygonal cylinder, or a polygonal cone.
较佳地,其中该加热平台的周边,进一步向外延伸形成有至少一个延伸鳍部。Preferably, the periphery of the heating platform is further formed with at least one extension fin extending outward.
较佳地,其中该加热平台及/或该锅体是以钼或钨所制成。Preferably, the heating platform and/or the pot body are made of molybdenum or tungsten.
借由本发明的实施,至少可以达成下列的进步功效:By the implementation of the present invention, at least the following progressive effects can be achieved:
一、本发明间接式加热方式,可用于低沸点镀膜材料蒸镀,例如砷(As),以避免电子枪直接照射,造成喷溅问题。1. The indirect heating method of the present invention can be used for the evaporation of low-boiling point coating materials, such as arsenic (As), so as to avoid the direct irradiation of the electron gun and cause the problem of sputtering.
二、本发明间接式加热方式,亦可适用于高导热的镀膜材料,例如银 (Ag)、铜(Cu)、金(Au)、铂(Pt),以避免因为电子枪加热功率过高,造成喷溅问题。2. The indirect heating method of the present invention can also be applied to coating materials with high thermal conductivity, such as silver (Ag), copper (Cu), gold (Au), and platinum (Pt), so as to avoid excessive heating power of the electron gun. Splash problem.
三、因为加热是由衬埚间接加热镀膜材料,所以镀膜材料溶解更为完整,且镀率控制更为稳定。3. Because the heating is indirectly heating the coating material by the liner, the dissolution of the coating material is more complete, and the control of the coating rate is more stable.
四、可使蒸镀面积最大化,而非传统的单点高温蒸镀源。Fourth, the evaporation area can be maximized instead of the traditional single-point high-temperature evaporation source.
五、使用本发明间接加热式衬锅结构,可以完整的加热镀膜材料,让被加热镀膜材料的温度更一致。以及5. Using the indirect heating type pot lining structure of the present invention, the coating material can be completely heated, so that the temperature of the heated coating material is more consistent. as well as
六、被加热镀膜材料温度控制越稳定,汽化后所产生的镀率也就越稳定。6. The more stable the temperature control of the heated coating material, the more stable the coating rate after vaporization.
为了使任何熟习相关技艺者了解本发明的技术内容并据以实施,且根据本说明书所揭露的内容、申请专利范围及图式,任何熟习相关技艺者可轻易的理解本发明相关的目的及优点,因此将在实施方式中详细叙述本发明的详细特征以及优点。In order for any person skilled in the related art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of the patent application and the drawings, any person skilled in the related art can easily understand the related objects and advantages of the present invention Therefore, the detailed features and advantages of the present invention will be described in detail in the embodiments.
附图说明Description of drawings
图1为现有习知电子枪电子束直接发射到蒸发物表面的衬锅结构。FIG. 1 shows the structure of the lining pot in which the electron beam of the conventional electron gun is directly emitted to the surface of the evaporator.
图2A为现有习知衬锅结构其镀率随着镀膜材料的受热时间而跳动的示意图。FIG. 2A is a schematic diagram of the variation of the coating rate of the conventional conventional pot lining structure with the heating time of the coating material.
图2B为现有习知衬锅结构其加热的温度是以打点为中心散开的示意图。FIG. 2B is a schematic diagram of the conventional conventional pot-lined structure, wherein the heating temperature is spread out with the dots as the center.
图3A为本发明的一种衬锅结构的立体实施例图剖视实施例图。3A is a cross-sectional embodiment view of a three-dimensional embodiment view of a pot lining structure according to the present invention.
图3B为本发明的一种衬锅结构的立体实施例图。FIG. 3B is a three-dimensional embodiment view of a pot lining structure of the present invention.
图4为本发明的一种多个加热平台的衬锅结构实施例图。FIG. 4 is a structural embodiment diagram of a pot lining with multiple heating platforms according to the present invention.
图5A为一种圆柱体加热平台的实施例图。FIG. 5A is an embodiment diagram of a cylindrical heating platform.
图5B为一种多边形锥体加热平台的实施例图。FIG. 5B is an embodiment diagram of a polygonal pyramid heating platform.
图5C为一种多边形柱体加热平台的实施例图。FIG. 5C is an embodiment diagram of a polygonal cylindrical heating platform.
图6为加热平台进一步具有延伸鳍部的衬锅结构实施例图。FIG. 6 is a diagram illustrating an embodiment of the pot lining structure in which the heating platform further has extended fins.
图7A为衬锅结构以加热平台进行均匀温度加热的实施例图。FIG. 7A is a diagram of an embodiment of the pot-lined structure using a heating platform for uniform temperature heating.
图7B为衬锅结构其镀率因镀膜材料受热稳定而稳定镀率的特性曲线图。FIG. 7B is a characteristic curve of the coating rate of the pot-lined structure whose coating rate is stabilized due to the thermal stability of the coating material.
【主要元件符号说明】【Description of main component symbols】
P100:现有习知衬锅结构 P10:电子枪P100: Existing conventional pot lining structure P10: Electron gun
P11:电子束 P20:镀膜材料P11: Electron beam P20: Coating material
P30:磁吸控制元件 100:具有间接加热平台的衬锅结构P30: Magnetic control element 100: Pan-lined structure with indirect heating platform
10:锅体 110:容置空间10: Pot body 110: Accommodating space
20:加热平台 211:圆锥体20: Heating Platform 211: Cone
212:圆柱体 213:多边形柱体212: Cylinder 213: Polygon Cylinder
214:多边形锥体 220:延伸鳍部214: Polygon Cone 220: Extended Fins
具体实施方式Detailed ways
如图3A至图3B所示,本实施例为一种具有间接加热平台的衬锅结构100,其包括:锅体10;以及至少一个加热平台20。本实施例的衬锅结构是要改变传统电子枪P10只能直接加热镀膜材料P20的使用方式,又本实施例的衬锅结构100同样可以适用于一般市售的180度、 270度电子枪P10。As shown in FIGS. 3A to 3B , the present embodiment is a
锅体10,其为碗状结构,并具有容置空间110,以容置待加热的镀膜材料P20,例如是金属的钛(Ti)、银(Ag)、铜(Cu)、金(Au)、铂(Pt)…等、或者非金属的氟化物、砷(As)….等。The
如图4所示,加热平台20可以是单一或多个加热平台20,且形成于锅体10的容置空间110内。又为了使热能够平均传导,当只有单一加热平台20时,加热平台20,特别可以形成于容置空间110的中央部位,以使热能够更均匀的向四周传导。As shown in FIG. 4 , the
为了使热也能够借由锅体10进行传导,因此加热平台20与锅体 10可以为一体成型的结构。又其中加热平台20及/或锅体10可以是以耐高温金属材质,例如钼(Mo)或钨(W)…等所制成。In order to conduct heat through the
如图5A至图5C所示,为了因应不同的产品,因此加热平台20的形体,也可以有更多样化的设计,例如加热平台20为底面积大于或等于顶面积的结构。或者加热平台20为圆锥体211、圆柱体212、多边形柱体213、或多边形锥体214的结构。As shown in FIG. 5A to FIG. 5C , in order to adapt to different products, the shape of the
如图6所示,又为了使热能由加热平台20向四周均匀的向外延伸,因此上述各种加热平台20的周边,可以进一步向外延伸形成有至少一个延伸鳍部220,并借由延伸鳍部220可以将热能进行延伸的传导。As shown in FIG. 6 , in order to uniformly extend the heat energy from the
如图7A及图7B所示,本实施例的衬锅结构100,当以加热平台20进行如镀膜材料P20内箭头所示的均匀温度加热时,可以避面镀膜材料 P20喷溅或火花四射的状况,此外,衬锅结构100其镀率因镀膜材料P20 受热稳定,因而使镀率也随之稳定。As shown in FIG. 7A and FIG. 7B , the
以上所述,仅是本发明的较佳实施例而已,并非对本发明做任何形式上的限制,虽然本发明已以较佳实施例揭露如上,然而并非用以限定本发明,任何熟悉本专业的技术人员,在不脱离本发明技术方案范围内,当可利用上述揭示的技术内容做出些许更动或修饰为等同变化的等效实施例,但凡是未脱离本发明技术方案的内容,依据本发明的技术实质对以上实施例所做的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。The above are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Technical personnel, within the scope of the technical solution of the present invention, can make some changes or modifications to equivalent examples of equivalent changes by using the technical content disclosed above, but any content that does not depart from the technical solution of the present invention, according to the present invention. Any simple modifications, equivalent changes and modifications made to the above embodiments by the technical essence of the invention still fall within the scope of the technical solutions of the present invention.
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JP2013174000A (en) * | 2012-02-27 | 2013-09-05 | Hitachi Zosen Corp | Electron beam vapor deposition apparatus |
CN107058958A (en) * | 2017-05-27 | 2017-08-18 | 京东方科技集团股份有限公司 | One kind evaporation crucible and evaporated device |
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