CN114286502A - The heat dissipation structure of the control circuit board, the underwater propeller and the water vehicle - Google Patents

Abstract

The present disclosure relates to a heat dissipation structure of a control circuit board, an underwater propeller and a water carrying device. The heat dissipation structure of the control circuit board includes a control circuit board and a mounting seat, the mounting seat is provided with a mounting cavity, and the mounting seat is provided with an opening for the cooling medium to enter the mounting cavity; The seal is located in the installation cavity, the heat-conducting part includes a first heat-conducting part and a second heat-conducting part which are connected to each other, the first heat-conducting part is heat-conductingly connected to the control circuit board, and the first heat-conducting part and the control circuit board are sealed and arranged in the sealing part. The second heat-conducting part is located outside the sealing cavity and inside the installation cavity, and the second heat-conducting part exchanges heat with the cooling medium entering the installation cavity, so as to better dissipate heat to the control circuit board and improve the performance of the control circuit board. Control reliability.

Description

The heat dissipation structure of the control circuit board, the underwater propeller and the water vehicle

technical field

The present disclosure relates to the technical field of waterborne equipment, and in particular, to a heat dissipation structure for a control circuit board, an underwater propeller, and a waterborne vehicle.

Background technique

In existing waterborne devices, such as surfboards, stand-up paddle boards, etc., a control circuit board for controlling the propellers is usually provided on the passenger side of the paddle board. In specific implementation, a battery box for accommodating batteries is provided on the passenger side of the paddle, and the control board is generally installed in the battery box. However, with the development of technology, people have higher and higher requirements for the performance of waterborne vehicles, and the power of the propellers is also increasing. Since the control circuit board integrates many power devices, the control circuit board located in the battery box generates serious heat during the operation of the carrier, which not only increases the power consumption of the thruster, but also increases the control reliability of the control circuit board. reduce.

SUMMARY OF THE INVENTION

In order to solve the above technical problems, the present disclosure provides a heat dissipation structure for a control circuit board, an underwater propeller, and a water carrying device.

In a first aspect, the present disclosure provides a heat dissipation structure for a control circuit board, comprising a control circuit board and a mounting seat with a mounting cavity inside, and the mounting seat is provided with an opening for a cooling medium to enter the mounting cavity;

The heat dissipation structure further includes a heat conducting member and a sealing member having a sealing cavity inside, the sealing member is located in the mounting cavity, the heat conducting member comprises a first heat conducting part and a second heat conducting part which are connected, the first heat conducting part is thermally connected with the control circuit board, and The first heat-conducting part and the control circuit board are sealed in the sealing cavity; the second heat-conducting part is located outside the sealing cavity and in the installation cavity, and the second heat-conducting part exchanges heat with the cooling medium entering the installation cavity.

Optionally, the control circuit board includes a base plate and a heating element disposed on the base plate, the heat conducting member includes a heat dissipation plate, and the heat dissipation plate is disposed on a side of the base plate away from the heat generation element.

Optionally, the heat dissipation plate includes a main body part connected to the base plate and an extension part extending beyond the edge of the base plate. Part of the structure of the extension part and the main body part are located in the sealed cavity and form the first heat conduction part. The portion outside the sealed cavity forms the second heat conducting portion.

Optionally, part of the structure of the protruding portion extends along the thickness direction of the substrate.

Optionally, the material of the sealing member is potting glue, and both the first heat conduction part and the control circuit board are wrapped in the potting glue.

Optionally, the opening is opened on the cavity wall of the installation cavity that is not filled with potting glue.

Optionally, thermal conductive silicone grease is also sandwiched between the base plate and the heat dissipation plate.

Optionally, a through hole is provided on the base plate at a position corresponding to the heating element, the side of the base plate facing away from the heating element is covered with a thermally conductive metal, and the thermally conductive metal covers the through hole and is in thermal contact with the heat dissipation plate, so as to pass the heat of the heating element through. The thermally conductive metal is delivered to the heat sink.

Optionally, thermally conductive silicone grease is sandwiched between the heat-conducting metal and the heat-dissipating plate, so that the heat-conducting metal and the heat-dissipating plate are in heat-conducting contact.

Optionally, the cavity wall of the installation cavity is provided with a positioning stopper, and the positioning stopper includes a stopper part sandwiched between the board surface of the control circuit board and the cavity wall, and the stopper part is used to limit the control circuit board along the control The displacement in the thickness direction of the circuit board.

Optionally, the positioning stopper further includes a support portion connected to one side of the stopper portion, a positioning portion is provided on the first heat-conducting portion of the heat dissipation plate, and the positioning portion is pressed against a side edge of the control circuit board away from the positioning stopper, to press the control circuit board on the support.

Optionally, the mounting seat includes a casing, the casing includes a bottom plate and a first wall plate and a second wall plate arranged on the bottom plate, and a first baffle plate and a second baffle plate are also arranged in the casing, and the first wall plate, The first baffle plate, the second wall plate and the second baffle plate are connected end to end to form an installation cavity.

In a second aspect, the present disclosure provides an underwater propeller, including a propeller body and the above-mentioned heat dissipation structure of a control circuit board, wherein the control circuit board is sealed and arranged in a sealing member of the heat dissipation structure, and the mounting seat is connected to the propeller. on the main body, and the mounting seat is also used to connect with the water vehicle.

In a third aspect, the present disclosure provides an underwater vehicle, including a battery, a bearing portion, and the above-mentioned underwater propeller, wherein the battery is electrically connected to the underwater propeller; the battery is provided on the manned side of the bearing portion, and the underwater propeller is The mounting seat is arranged on the water inlet side of the bearing part.

Compared with the prior art, the technical solutions provided by the embodiments of the present disclosure have the following advantages:

In the heat dissipation structure of the control circuit board, the underwater propeller, and the water carrying device provided by the present disclosure, by sealing the first heat-conducting portion of the heat-conducting member and the control circuit board in a sealed cavity, the second heat-conducting portion of the heat-conducting member is exposed to the sealing member and It exchanges heat with the cooling medium, so that the heat generated on the control circuit board will be transferred from the first heat-conducting part of the heat-conducting member to the second heat-conducting part, and dissipate heat by exchanging heat with the cooling medium, which has a cooling effect on the control circuit board. better.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description serve to explain the principles of the disclosure.

In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the accompanying drawings that are required to be used in the description of the embodiments or the prior art will be briefly introduced below. In other words, on the premise of no creative labor, other drawings can also be obtained from these drawings.

1 is a partial cross-sectional schematic diagram of a heat dissipation structure of a control circuit board according to an embodiment of the disclosure;

FIG. 2 is a schematic structural diagram of a control circuit board according to an embodiment of the disclosure;

Fig. 3 is a partial enlarged view at A of Fig. 1;

4 is another schematic partial cross-sectional view of the heat dissipation structure of the control circuit board according to the embodiment of the disclosure;

FIG. 5 is still another partial cross-sectional schematic diagram of the heat dissipation structure of the control circuit board according to the embodiment of the disclosure;

Fig. 6 is a partial enlarged view at B of Fig. 5;

FIG. 7 is a schematic diagram of a connection structure of a control circuit board and a heat sink according to an embodiment of the disclosure;

FIG. 8 is a schematic structural diagram of an underwater propeller according to an embodiment of the disclosure.

Among them, 100, the heat dissipation structure of the control circuit board; 10, the mounting seat; 20, the mounting cavity; 21, the opening; 22, the end cover; 30, the sealing member; 40, the control circuit board; 41, the base plate; 50, heat conduction part; 51, heat dissipation plate; 511, main body part; 512, extension part; 513, first heat conduction part; 514, second heat conduction part; 52, heat conduction silicone grease; 60, positioning block; 61, stop Blocking part; 62, positioning part; 63, supporting part; 70, bottom plate; 71, first wall plate; 72, second wall plate; 73, first baffle plate; 74, second baffle plate; 75, pressing part ;

200, underwater propeller; 201, the main body of the propeller.

Detailed ways

In order to more clearly understand the above objects, features and advantages of the present disclosure, the solutions of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments may be combined with each other under the condition of no conflict.

Many specific details are set forth in the following description to facilitate a full understanding of the present disclosure, but the present disclosure can also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only a part of the embodiments of the present disclosure, and Not all examples.

Example

FIG. 1 is a partial cross-sectional schematic diagram of a heat dissipation structure of a control circuit board according to an embodiment of the disclosure.

This embodiment provides a heat dissipation structure for a control circuit board. It should be noted that, in this embodiment, the control circuit board is used to control the propeller in the waterborne vehicle as an example for description, and the control circuit board may be located underwater as a whole. Of course, the control circuit board can also be used in other devices, and the case where the control circuit board is used in other devices is similar, and details are not described below.

Referring to FIG. 1 , the heat dissipation structure 100 of the control circuit board includes a control circuit board 40 and a mounting base 10 having a mounting cavity 20 inside. The mounting base 10 is provided with an opening 21 for the cooling medium to enter the mounting cavity 20;

The heat dissipation structure 100 further includes a heat conducting member 50 and a sealing member 30 having a sealing cavity inside. The sealing member 30 is located in the mounting cavity 20 , and the heat conducting member 50 includes a first heat conducting portion 513 and a second heat conducting portion 514 which are connected. The first heat conducting portion 513 is thermally connected to the control circuit board 40, and the first heat-conducting portion 513 and the control circuit board 40 are sealed and arranged in the sealing cavity; the second heat-conducting portion 514 is located outside the sealing cavity and in the mounting cavity 20, and the second The cooling medium entering the installation cavity 20 conducts heat exchange.

In the above solution, by sealing the first heat-conducting portion 513 of the heat-conducting member 50 and the control circuit board 40 in the sealing cavity, the second heat-conducting portion 514 of the heat-conducting member 50 is exposed to the sealing member 30 and exchanges heat with the cooling medium, so that the control circuit The heat generated on the board 40 will be transferred from the first heat-conducting portion 513 of the heat-conducting member 50 to the second heat-conducting portion 514 , and dissipated by heat exchange with the cooling medium, which has a better heat dissipation effect on the control circuit board 40 .

FIG. 2 is a schematic structural diagram of a control circuit board according to an embodiment of the disclosure, and FIG. 3 is a partial enlarged view of part A of FIG. 1 .

Referring to FIG. 2 , the control circuit board 40 includes a substrate 41 and a heating element 42 disposed on the substrate 41 , where the heating element 42 refers to a component that generates serious heat during operation. For example, high-power capacitors, high-power IGBTs, etc. The substrate 41 can be made of a material with high thermal conductivity, and the higher the thermal conductivity, the better the thermal conductivity; in this embodiment, the substrate 41 can be a high thermal conductivity silicone sheet with a thickness of 0.5 mm and a thermal conductivity of 6W. It can be understood that the substrate 41 can also use other commonly used high thermal conductivity materials.

The heat-conducting member 50 may include a heat-dissipating plate 51 , and the heat-dissipating plate 51 is disposed on the side of the substrate 41 away from the heating element 42 . The heat dissipation plate 51 can be a metal with good thermal conductivity, for example, an aluminum plate or the like.

In order to transfer the heat on the control circuit board 40 to the cooling medium, the heat dissipation plate 51 may include a main body portion 511 connected to the base plate 41, and a protruding portion 512 extending beyond the edge of the base plate 41. Part of the structure of the protruding portion 512 extends out of the sealing cavity, and conduct heat exchange with the cooling medium entering the installation cavity 20 . At this time, part of the structure of the extension part 512 and the main body part 511 are located in the sealed cavity and form the first heat conduction part 513 , and the part of the extension part 512 outside the sealed cavity forms the second heat conduction part 514 .

In addition, in order to improve the heat dissipation efficiency in the limited space, the heat dissipation area of the heat dissipation plate 51 may be increased, and the partial structure of the extension portion 512 may be extended along the thickness direction H of the substrate 41 . Exemplarily, referring to FIG. 2 , the protruding portion 512 is bent at an approximate middle position, and the bent portion extends toward the thickness direction H of the substrate 41 , thereby increasing the extension length of the heat dissipation plate 51 .

In the embodiment of the present disclosure, the material of the sealing member 30 may be potting glue, and both the control circuit board 40 and the first heat conducting portion 513 are encapsulated in the potting glue. During the actual installation, the control circuit board 40 and the heat dissipation plate 51 can be fixed in the installation cavity 20 first, and then the liquid potting glue is poured into the installation cavity 20. After the potting glue solidifies, the solid potting glue will form. The sealed cavity just covers the control circuit board 40 and the main body 511 of the heat dissipation board 51 . It should be noted that the potting glue can also seal part of the structure of the protruding portion 512 inside.

On the one hand, the potting glue can better seal the control circuit board 40 and prevent the cooling medium from entering the control circuit board 40; heat is transferred to the cooling medium. It can be understood that, the sealing member 30 is taken as an example of potting glue for illustration, but the present disclosure is not limited to this, and the sealing member 30 may also be a hollow metal The main body portion 511 only needs to be sealed in the sealing cavity.

FIG. 3 is a partial enlarged view of part A of FIG. 1 .

Referring to FIGS. 2 and 3 , in order to further improve the thermal conductivity of the thermally conductive member 50 , a thermally conductive silicone grease 52 may be sandwiched between the substrate 41 and the heat dissipation plate 51 . In addition, the thermally conductive silicone grease 52 has a certain viscosity before solidification, and can also be used to fix the heat dissipation plate 51 and the substrate 41 .

As mentioned above, the thermally conductive connection between the heat-conducting member 50 and the control circuit board 40 can guide the direct contact between the heat-conducting member 50 and the control circuit board 40, and the heat on the control circuit board 40 is transferred to the heat-conducting member 50, or it can also be the heat-conducting member 50. It is connected to the control circuit board 40 through thermal conductive metal or the like.

In some examples, a through hole is provided on the substrate 41 at a position corresponding to the heating element 42 , a side of the substrate 41 facing away from the heating element 42 is covered with a thermally conductive metal, and the thermally conductive metal covers the through hole and is in thermally conductive contact with the heat dissipation plate 51 , so as to The heat of the heating element 42 is transferred to the heat dissipation plate 51 through the thermally conductive metal. Specifically, the thermally conductive contact between the thermally conductive metal and the radiating plate 51 may be the direct contact between the thermally conductive metal and the radiating plate 51; 51 is in thermal contact. Specifically, the thermally conductive metal is in contact with the thermally conductive silicone grease 52 , and the thermally conductive silicone grease 52 transfers the heat to the heat dissipation plate 51 .

4 is another partial cross-sectional schematic diagram of the heat dissipation structure of the control circuit board according to the embodiment of the disclosure, and FIG. 5 is another partial cross-sectional schematic diagram of the heat dissipation structure of the control circuit board according to the embodiment of the disclosure, FIG. 6 is a partial enlarged view of part B of FIG. 5 .

The structure of the mounting cavity 20 of this embodiment will be described below.

4, FIG. 5, the mounting base 10 includes a casing, the casing includes a bottom plate 70 and a first wall plate 71 and a second wall plate 72 provided on the bottom plate 70, and a first baffle plate 73 and a second wall plate 72 are also provided in the casing. The two baffle plates 74 , the first wall plate 71 , the first baffle plate 73 , the second wall plate 72 , and the second baffle plate 74 are connected end to end to form the installation cavity 20 . It can be understood that the aforementioned potting glue is poured into the installation cavity 20 , and the top of the potting glue is shown by the dotted line in FIG. 4 .

In addition, in order to facilitate the cooling medium to enter the installation cavity 20, an opening 21 is provided on the cavity wall of the installation cavity 20 which is not filled with potting glue as a liquid inlet. Exemplarily, the opening 21 may be provided on the top of the installation cavity 20 , or may be provided on the side wall of the installation cavity 20 .

It should be noted that the mounting seat 10 is generally used to connect with the bearing part of the waterborne device. When the opening 21 is arranged at the top of the mounting cavity, an end cover 22 can be generally provided on the top of the mounting cavity 20 to cover the opening 21, and the end The cover 22 is used for fixed connection with the above-mentioned bearing portion. At this time, the external water can enter the opening 21 through the assembly gap between the end cover 22 and the edge of the opening 21 of the installation cavity 20 , and further enter the interior of the installation cavity 20 .

FIG. 7 is a schematic diagram of a connection structure of a control circuit board and a heat sink according to an embodiment of the disclosure.

Next, the control circuit board 40 and the heat dissipation plate 51 will be described. Referring to FIGS. 5 , 6 and 7 , a positioning block 60 is provided on the cavity wall of the mounting cavity 20 . ) between the board surface and the cavity wall, the stopper 61 is used to limit the displacement of the control circuit board 40 (substrate 41 ) along the thickness direction of the control circuit board 40 (substrate 41 ).

In some examples, a position corresponding to the bottom end of the heat dissipation plate 51 on the cavity wall of the installation cavity 20 is further provided with an engaging limit portion (not shown), and a position corresponding to the top end is further provided with a pressing portion 75 to dissipate heat. The bottom end of the plate 51 can be supported on the locking portion, and the pressing portion 75 presses the heat dissipation plate 51 between the pressing portion 75 and the locking portion from the top of the heat dissipation plate 51 . In this way, the heat dissipation plate 51 can be fixed relative to the mounting cavity 20 .

In addition, the positioning stopper 60 further includes a support portion 63 connected to one side of the stopper portion 61 , a positioning portion 62 is provided on the extending portion 512 of the heat dissipation plate 51 , that is, the first heat conducting portion 513 , and the positioning portion 62 presses against the control The side edge of the circuit board 40 (the base plate 41 ) facing away from the positioning stopper 60 is used to press the control circuit board 40 (the base plate 41 ) against the support portion 63 .

In the heat dissipation structure 100 of the control circuit board provided by this embodiment, the first heat conducting part of the heat conducting member 50 and the control circuit board 40 are sealed in the sealing cavity, and the second heat conducting part of the heat conducting member 50 is exposed to the sealing member 30 and conducts heat with the cooling medium. In this way, the heat generated on the control circuit board 40 will be transferred from the first heat-conducting part of the heat-conducting member 50 to the second heat-conducting part, and the heat will be dissipated through heat exchange with the cooling medium, and the heat dissipation effect on the control circuit board 40 will be better. .

FIG. 8 is a schematic structural diagram of an underwater propeller according to an embodiment of the disclosure.

8, the present embodiment also provides an underwater propeller 200, comprising a propeller body 201 and the heat dissipation structure 100 of the above-mentioned control circuit board, wherein the control circuit board 40 is sealed and arranged in the sealing member 30 of the heat dissipation structure, The mounting seat 10 is connected to the propeller body 201, and the mounting seat 10 is also used for connecting with the bearing part in the waterborne device.

This embodiment also provides a water carrying device, which includes a battery, a carrying portion, and the above-mentioned underwater propeller 200. The battery is electrically connected to the underwater propeller 200; The mounting seat 10 is arranged on the water inlet side of the bearing part. In this way, the battery is set on the water, the control circuit board 40 is set on the water, and the control circuit board 40 is far away from the battery as a heat source, which is beneficial to the heat dissipation of the control circuit board 40 .

It should be noted that the heat dissipation structure of the control circuit board in this embodiment has been described in detail above, and its structure is the same, and can bring the same or similar technical effects, which will not be repeated here. For details, please refer to Description of the previous embodiment.

It should be noted that, in this document, relational terms such as "first" and "second" etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply these There is no such actual relationship or sequence between entities or operations. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device comprising a list of elements includes not only those elements, but also includes not explicitly listed or other elements inherent to such a process, method, article or apparatus. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in a process, method, article or apparatus that includes the element.

The above descriptions are only specific embodiments of the present disclosure, so that those skilled in the art can understand or implement the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure is not intended to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (14)

1. A heat dissipation structure of a control circuit board is characterized by comprising the control circuit board and a mounting seat with a mounting cavity inside, wherein an opening for a cooling medium to enter the mounting cavity is formed in the mounting seat;

the heat dissipation structure further comprises a heat conduction piece and a sealing piece with a sealing cavity inside, the sealing piece is located in the installation cavity and comprises a first heat conduction part and a second heat conduction part which are connected, the first heat conduction part is in heat conduction connection with the control circuit board, and the first heat conduction part and the control circuit board are arranged in the sealing cavity in a sealing mode; the second heat conduction part is located outside the sealing cavity and in the mounting cavity, and the second heat conduction part exchanges heat with a cooling medium entering the mounting cavity.

2. The heat dissipation structure of claim 1, wherein the control circuit board comprises a substrate and a heat generating element disposed on the substrate, and the heat conducting member comprises a heat dissipation plate disposed on a surface of the substrate facing away from the heat generating element.

3. The heat dissipating structure of a control circuit board according to claim 2, wherein the heat dissipating plate includes a main body portion attached to the substrate, and an extension portion extending beyond an outer side of an edge of the substrate, a partial structure of the extension portion and the main body portion being located in the sealed cavity and forming the first heat conducting portion, and a portion of the extension portion located outside the sealed cavity forming the second heat conducting portion.

4. The heat dissipation structure of a control circuit board according to claim 3, wherein a partial structure of the protruding portion extends in a thickness direction of the substrate.

5. The heat dissipation structure of claim 3, wherein the sealing member is made of a potting adhesive, and the first heat conduction portion and the control circuit board are both encapsulated in the potting adhesive.

6. The heat dissipation structure of the control circuit board as claimed in claim 5, wherein the opening is formed on a wall of the mounting cavity not filled with the potting adhesive.

7. The heat dissipation structure of a control circuit board according to any one of claims 2 to 6, wherein a heat conductive silicone grease is further interposed between the substrate and the heat dissipation plate.

8. The heat dissipation structure of the control circuit board as claimed in any one of claims 2 to 6, wherein a through hole is formed in a position of the substrate corresponding to the heat generating element, and a heat conductive metal covers a surface of the substrate facing away from the heat generating element, and covers the through hole and is in heat conductive contact with the heat dissipation plate, so as to transfer heat of the heat generating element to the heat dissipation plate through the heat conductive metal.

9. The heat dissipation structure of a control circuit board according to claim 8, wherein a heat conductive silicone grease is interposed between the heat conductive metal and the heat dissipation plate so that the heat conductive metal is in heat conductive contact with the heat dissipation plate.

10. The heat dissipation structure of the control circuit board according to any one of claims 1 to 6, wherein a positioning stopper is disposed on a cavity wall of the mounting cavity, the positioning stopper includes a stopping portion interposed between a board surface of the control circuit board and the cavity wall, and the stopping portion is configured to limit displacement of the control circuit board in a thickness direction of the control circuit board.

11. The heat dissipating structure of the control circuit board according to claim 10, wherein the positioning block further comprises a supporting portion connected to one side of the blocking portion, and a positioning portion is disposed on the first heat conducting portion of the heat dissipating plate and abuts against a side edge of the control circuit board facing away from the positioning block, so as to press the control circuit board against the supporting portion.

12. The heat dissipation structure of the control circuit board as claimed in any one of claims 3 to 6, wherein the mounting base comprises a housing, the housing comprises a bottom plate and a first wall plate and a second wall plate which are arranged on the bottom plate, a first baffle plate and a second baffle plate are further arranged in the housing, and the first wall plate, the first baffle plate, the second wall plate and the second baffle plate are connected end to form the mounting cavity.

13. An underwater propeller comprising a propeller body and a heat dissipating structure of a control circuit board according to any one of claims 1 to 12, wherein the control circuit board is sealingly disposed in a seal of the heat dissipating structure, and the mount is attached to the propeller body.

14. A water craft comprising a battery, a load bearing portion and an underwater vehicle as claimed in claim 13, said battery being electrically connected to said underwater vehicle; the battery is arranged on the manned side of the bearing part, and the mounting seat in the underwater propeller is arranged on the water inlet side of the bearing part.

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