CN114276650A - Epoxy resin composition and preparation method thereof - Google Patents
Epoxy resin composition and preparation method thereof Download PDFInfo
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- CN114276650A CN114276650A CN202111304444.0A CN202111304444A CN114276650A CN 114276650 A CN114276650 A CN 114276650A CN 202111304444 A CN202111304444 A CN 202111304444A CN 114276650 A CN114276650 A CN 114276650A
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- epoxy resin
- resin composition
- weight
- dielectric filler
- titanate
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Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 246
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 246
- 239000000203 mixture Substances 0.000 title claims abstract description 148
- 238000002360 preparation method Methods 0.000 title abstract description 11
- 239000000945 filler Substances 0.000 claims abstract description 93
- 239000005011 phenolic resin Substances 0.000 claims abstract description 78
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 76
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 66
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 43
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 28
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 28
- 229910000314 transition metal oxide Inorganic materials 0.000 claims description 24
- 239000000377 silicon dioxide Substances 0.000 claims description 21
- -1 aralkyl phenol Chemical compound 0.000 claims description 19
- 229910002113 barium titanate Inorganic materials 0.000 claims description 19
- 239000012745 toughening agent Substances 0.000 claims description 19
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 18
- 239000003795 chemical substances by application Substances 0.000 claims description 18
- 239000007822 coupling agent Substances 0.000 claims description 18
- 150000002500 ions Chemical class 0.000 claims description 18
- 239000003086 colorant Substances 0.000 claims description 17
- 239000003063 flame retardant Substances 0.000 claims description 17
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 17
- 239000001993 wax Substances 0.000 claims description 17
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 16
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 15
- 239000004305 biphenyl Substances 0.000 claims description 14
- 235000010290 biphenyl Nutrition 0.000 claims description 14
- 239000002516 radical scavenger Substances 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 6
- 239000000194 fatty acid Substances 0.000 claims description 6
- 229930195729 fatty acid Natural products 0.000 claims description 6
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 229910000000 metal hydroxide Inorganic materials 0.000 claims description 5
- 150000004692 metal hydroxides Chemical class 0.000 claims description 5
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 4
- 229930185605 Bisphenol Natural products 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 229920000459 Nitrile rubber Polymers 0.000 claims description 4
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- 239000006229 carbon black Substances 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 229910052593 corundum Inorganic materials 0.000 claims description 4
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 4
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000012170 montan wax Substances 0.000 claims description 3
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 claims description 3
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 3
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 claims description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims description 2
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Inorganic materials O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 claims description 2
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 claims description 2
- 150000004665 fatty acids Chemical class 0.000 claims description 2
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910021485 fumed silica Inorganic materials 0.000 claims description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 2
- 150000002460 imidazoles Chemical class 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 150000002903 organophosphorus compounds Chemical group 0.000 claims description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 2
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 2
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 abstract description 6
- 238000000465 moulding Methods 0.000 abstract description 6
- 239000000047 product Substances 0.000 description 59
- 230000000052 comparative effect Effects 0.000 description 13
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 11
- 238000002156 mixing Methods 0.000 description 11
- 125000000524 functional group Chemical group 0.000 description 10
- 229920006336 epoxy molding compound Polymers 0.000 description 9
- 238000001879 gelation Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000003756 stirring Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 8
- 125000003118 aryl group Chemical group 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000014509 gene expression Effects 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- 239000006082 mold release agent Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
- 238000006467 substitution reaction Methods 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Natural products O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 125000003107 substituted aryl group Chemical group 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000001072 heteroaryl group Chemical group 0.000 description 1
- 239000012796 inorganic flame retardant Substances 0.000 description 1
- 238000005040 ion trap Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 150000003623 transition metal compounds Chemical class 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to an epoxy resin composition, wherein the epoxy resin composition comprises, based on the total weight of the epoxy resin composition: (a)1-12 wt% of epoxy resin, (b)1-8 wt% of phenolic resin, (c)0.1-1 wt% of curing accelerator, (d)30-95 wt% of high dielectric filler, (e)0-35 wt% of low dielectric filler; the high dielectric filler comprises a titanate. The invention also relates to a preparation method of the epoxy resin composition and application of the epoxy resin composition in molding encapsulation.
Description
Technical Field
The invention belongs to the technical field of microelectronic packaging materials, and particularly relates to an epoxy resin composition. The invention and a preparation method thereof also relate to a preparation method of the epoxy resin composition and application of the epoxy resin composition in molding encapsulation.
Background
With the rapid development of current information technology, wireless communication has become a necessity of life. The wireless communication system is composed of a transmitting antenna, a receiving antenna and an antenna, wherein the antenna is responsible for the conversion of electromagnetic energy values in the air and is one of indispensable basic equipment of the communication system. The circuit design related to the antenna depends on passive components such as capacitance or inductance to match the antenna. With the demand for high frequency and high speed signal transmission in 5G and 6G in the future, the antenna size needs to be reduced to the package size, and the aip (antenna in package) comes along. AiP has the advantages of simple system design, small size, and low cost. High dielectric encapsulation materials are the best choice of materials for the design and encapsulation of such antenna devices.
CN 106280275A relates to a high dielectric epoxy molding compound, a preparation method and application thereof, wherein the filler is silicon dioxide particles coated by graphene, and the particle size is 50nm-5 μm. The prepared high-dielectric epoxy molding compound has the advantages of low expansion coefficient, low stress, high dielectric constant, small dielectric loss and good dielectric property frequency stability, and can be used in the field of fingerprint sensor packaging.
Disclosure of Invention
In one aspect, the present invention relates to an epoxy resin composition, wherein the epoxy resin composition comprises, based on the total weight of the epoxy resin composition: (a)1-12 wt% of epoxy resin, (b)1-8 wt% of phenolic resin, (c)0.1-1 wt% of curing accelerator, (d)30-95 wt% of high dielectric filler, (e)0-35 wt% of low dielectric filler; the high dielectric filler comprises a titanate.
In one embodiment, in the epoxy resin composition of the present invention, the titanate is selected from the group consisting of barium titanate, strontium titanate, calcium titanate, lead titanate, and combinations thereof.
In a preferred embodiment, in the epoxy resin composition of the present invention, the titanate is barium titanate.
In another embodiment, the epoxy resin composition of the present invention, the high dielectric filler further comprises a transition metal oxide.
In a preferred embodiment, in the epoxy resin composition of the present invention, the transition metal oxide is selected from the group consisting of iron oxide, titanium oxide, and combinations thereof.
In one embodiment, the content of titanate in the epoxy resin composition of the present invention is 25 to 95% by weight based on the total weight of the epoxy resin composition.
In another embodiment, the epoxy resin composition of the present invention contains the transition metal oxide in an amount of 0.1 to 17% by weight, based on the total weight of the epoxy resin composition.
In yet another embodiment, in the epoxy resin composition of the present invention, the ratio of the weight of titanate to the weight of transition metal oxide is 3 or more based on the total weight of the epoxy resin composition.
In one embodiment, the content of titanium oxide in the transition metal oxide in the epoxy resin composition of the present invention is 0.1 to 12% by weight based on the total weight of the epoxy resin composition.
In another embodiment, the iron oxide content of the transition metal oxide in the epoxy resin composition of the present invention is from 0.1 to 7% by weight, based on the total weight of the epoxy resin composition.
In one embodiment, the total content of the high dielectric filler and the low dielectric filler in the epoxy resin composition of the present invention is 75 to 95% by weight, based on the total weight of the epoxy resin composition.
In another embodiment, the ratio of the weight of the high dielectric filler to the weight of the low dielectric filler in the epoxy resin composition of the present invention is 2 or more.
In another aspect, the present invention also relates to a process for preparing the epoxy resin composition of the present invention, comprising the steps of: (1) weighing each component and mixing them to obtain a premixed powder, (2) heat mixing and extruding the premixed powder to obtain a product.
In a further aspect, the present invention also relates to the use of the epoxy resin composition of the present invention in a molded package. In a preferred embodiment, in the use of the epoxy resin composition, the mold encapsulation is encapsulation using an encapsulated antenna technique.
Detailed Description
General definitions and terms
All publications, patent applications, patents, and other references mentioned herein are incorporated by reference in their entirety if not otherwise indicated.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the definitions provided herein will control.
All percentages, parts, ratios, etc., are by weight unless otherwise indicated.
When an amount, concentration, or other value or parameter is given as either a range, preferred range, or a pair of upper and lower preferable values or specific values, this is to be understood as specifically disclosing all ranges formed from any pair of any upper range limit or preferred value and any lower range limit or preferred value, regardless of whether ranges are separately disclosed. When numerical ranges are recited herein, unless otherwise stated, the stated ranges are meant to include the endpoints thereof, and all integers and fractions within the ranges. The scope of the invention is not limited to the specific values recited when defining a range. For example, "1-8" encompasses 1, 2, 3, 4, 5, 6, 7, 8, as well as any subrange consisting of any two values therein, e.g., 2-6, 3-5.
The terms "about" and "approximately," when used in conjunction with a numerical variable, generally mean that the value of the variable and all values of the variable are within experimental error (e.g., within 95% confidence interval for the mean) or within ± 10% of the specified value, or more.
The terms "comprising," "including," "having," "containing," or "involving," and other variations thereof herein, are inclusive or open-ended and do not exclude additional unrecited elements or method steps. It will be understood by those skilled in the art that terms such as "including" and "comprising" encompass the meaning of "consisting of …. The expression "consisting of …" excludes any element, step or ingredient not specified. The expression "consisting essentially of …" means that the scope is limited to the specified elements, steps or components, plus optional elements, steps or components that do not materially affect the basic and novel characteristics of the claimed subject matter. It is to be understood that the expression "comprising" covers the expressions "consisting essentially of …" and "consisting of …".
The term "selected from …" means that one or more elements in the later listed groups are independently selected and may include a combination of two or more elements.
When values or range ends are described herein, it is to be understood that the disclosure includes the particular values or ends recited.
The term "one or more" or "at least one" as used herein refers to one, two, three, four, five, six, seven, eight, nine or more.
Unless otherwise indicated, the terms "combination thereof" and "mixture thereof" refer to a multi-component mixture of the elements described, such as two, three, four, and up to the maximum possible multi-component mixture.
Furthermore, no number of elements or components of the invention has been previously indicated and no limitation on the number of occurrences (or presence) of an element or component is intended. Thus, it should be read to include one or at least one and singular forms of a component or ingredient also include the plural unless the numerical value explicitly indicates the singular.
The terms "optionally" or "optionally" as used herein mean that the subsequently described event or circumstance may or may not occur, and that the description includes instances where said event or circumstance occurs and instances where it does not.
The term "alkyl" refers to a straight or branched chain saturated aliphatic hydrocarbon group consisting of carbon and hydrogen atoms, which is attached to the rest of the molecule by a single bond. The alkyl groups described herein typically have from about 1 to about 20 carbon atoms, preferably from about 1 to about 10 carbon atoms, and more preferably from about 1 to about 3 carbon atoms. Non-limiting examples thereof include, but are not limited to, methyl, ethyl, propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, n-hexyl, and the like.
The term "(substituted) means that any one or more hydrogen atoms on a particular atom are replaced with a substituent, provided that the valence of the particular atom is normal and the substituted compound is stable. The groups or structures herein may be optionally substituted with one or more substituents, for example one, two or three substituents. The substituent may be, for example, halogen, alkyl, aryl, cycloalkyl, heteroaryl, and the like.
The term "repeating unit" refers to a combination of atoms linked in a manner on a polymer or oligomer chain that is the basic unit that makes up the polymer chain or oligomer.
As used herein, the term "epoxy molding compound" refers to epoxy molding compounds and epoxy molding compounds. Herein, the epoxy resin composition is used as a molding compound, and thus the "epoxy molding compound" is also referred to as "epoxy resin composition".
The term "Room Temperature (RT)" as used herein means about 25 ℃.
The term "molded package" refers to a semiconductor device having a certain structural shape formed by, for example, a transfer molding method in which an epoxy molding compound is extruded into a mold cavity and a chip is embedded therein, and simultaneously cross-linked, cured and molded. Epoxy molding compounds are required to have good operability, sealing property and insulating property, and to protect chips and electronic circuits from damage caused by external cold, heat, moisture, chemical corrosion, and the like.
Unless otherwise defined, all terms used in the disclosure of the present invention, including technical and scientific terms, have the meaning commonly understood by one of ordinary skill in the art to which the present invention belongs. By way of further example, definitions of terms are included herein to better understand the teachings of the present invention.
Each component of the epoxy resin composition of the present invention will be described in detail below.
(a) Epoxy resin
As used herein, an epoxy resin contains two or more epoxy groups per molecule.
The selection of the appropriate type of epoxy resin helps to achieve the desired properties of the product, such as: suitable Tg, lower shrinkage and coefficient of thermal expansion, etc. The epoxy resin of the present invention includes a multifunctional type epoxy resin and other epoxy resins.
The addition of the polyfunctional epoxy resin increases the cross-linked structure network of the epoxy resin, contributes to the improvement of the glass transition temperature of the product and endows the cured product with low warpage at high temperature. In the repeating unit of the polyfunctional epoxy resin, there are a plurality of functional group substitutions. The position of substitution by the functional group may be on the main chain or on a branch, for example, on an aromatic ring in the main chain, a methylene group in the main chain, or the like. Types of functional groups include, but are not limited to: aryl, substituted aryl, epoxy, and the like. The total number of functional groups in the repeat unit should be more than two, for example: two, three, four, etc. The functional groups in the repeating units may be the same or different.
In one embodiment, the multi-functional epoxy resin is an epoxy resin having two or more epoxy groups in the repeating unit.
In a preferred embodiment, the multi-functional epoxy resin has a structure of the following formula (1):
In a more preferred embodiment, the multifunctional epoxy resin has a structure of the above formula (1), and n is an integer of 3 to 10.
Other epoxy resins contribute to the crosslinking process of the epoxy resin composition, and provide cured products with better properties, such as mechanical properties, electrical properties, and the like. Other epoxy resins include, but are not limited to: o-cresol type epoxy resin, bisphenol type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene phenol type epoxy resin, aralkyl phenol type epoxy resin, naphthol type epoxy resin, or a combination thereof. In one embodiment, the other epoxy resin is a combination of a biphenyl type epoxy resin, a bisphenol type epoxy resin, a dicyclopentadiene phenol type epoxy resin.
The contents of the multifunctional epoxy resin and other epoxy resins should be kept within appropriate ranges to achieve a product having a high Tg, a low thermal expansion coefficient, good continuous moldability, and the like. The content of the polyfunctional epoxy resin or other epoxy resins is too high, the spiral flow length of the product is reduced, and the fluidity is poor; if the content is too low, the glass transition temperature of the product is lowered, and the degree of warpage is increased. The multifunctional epoxy resin is present in an amount of about 0.01 to 4% by weight, based on the total weight of the epoxy resin composition, for example: about 1.00 wt%, about 1.50 wt%, about 2.00 wt%. Other epoxy resins are present in amounts of about 0.01 to 6 weight percent, based on the total weight of the epoxy resin composition, and are, for example: about 3.50 wt%, about 5.16 wt%, about 6.00 wt%.
The total content of the epoxy resin should be kept within a certain range to help impart proper fluidity, wettability, adhesion, water resistance, mechanical properties, and the like to the product. The total content of epoxy resin in the epoxy resin composition of the present invention may be about 1 to 12% by weight, preferably about 4 to 10% by weight, for example about 4.50%, about 6.76%, about 8% by weight, based on the total weight of the epoxy resin composition.
The multifunctional epoxy resin and other epoxy resins should have low viscosity respectively, so as to improve the addition amount of the filler, especially the addition amount of the high dielectric filler, and further improve the dielectric constant of the epoxy resin composition on the premise of ensuring that the epoxy resin composition has sufficient fluidity and wettability. In one embodiment, the multi-functional epoxy resin has a viscosity of about 0.2 to 2P, such as 0.2 to 1P. In yet another embodiment, the viscosity of the other epoxy resin is from about 0.01P to about 1.5P, such as from about 0.01P to about 1P, from about 0.1P to about 1P.
(b) Phenolic resin
The phenolic resin used in the epoxy resin composition of the present invention contains at least two hydroxyl groups per molecule. The phenolic resin is mainly used as a curing agent and has a linear chain structure. The hydroxyl groups can react with the epoxy resin to form a crosslinked network structure. The phenolic resin of the present invention includes biphenyl type phenolic resin and other phenolic resin.
Other phenolic resins useful in the present invention include, but are not limited to: phenol formaldehyde type phenolic resins, ortho-cresol formaldehyde type resins, aralkyl phenol type phenolic resins, hydroxybenzaldehyde type phenolic resins, multifunctional type phenolic resins, and combinations thereof.
In one embodiment, the other phenolic resin is a multifunctional phenolic resin. The addition of the multifunctional phenolic resin can increase the cross-linked structure network of the epoxy resin, and is beneficial to improving the glass transition temperature of the product and endowing the cured product with low warping property at high temperature. In the repeating units of the multifunctional phenol resin, there are a plurality of functional group substitutions. The position of substitution by the functional group may be on the main chain or on a branch, for example, on an aromatic ring in the main chain, a methylene group in the main chain, or the like. Types of functional groups include, but are not limited to: aryl, substituted aryl, phenolic hydroxyl, and the like. The total number of functional groups in the repeat unit should be two or more, for example: two, three, four, etc. The functional groups in the repeating units may be the same or different. In one embodiment, the multifunctional phenolic resin is a phenolic resin having two or more phenolic hydroxyl groups in the repeating unit.
In a preferred embodiment, the polyfunctional phenol resin is a phenol resin having the following formula (2)
Wherein n is an integer of 3 to 20, preferably 3 to 10; m is an integer from 3 to 20, preferably from 3 to 10.
The content of the biphenyl type phenolic resin and the content of other phenolic resins are respectively kept in a proper range, so that the product has higher Tg, lower thermal expansion coefficient, good curing performance and the like. The content of the biphenyl type phenolic resin or the phenolic resin thereof is too high, the spiral flow length of the product is reduced, and the fluidity is poor; the content is too low, and the glass transition temperature of the product is reduced. The biphenyl phenolic resin is present in an amount of about 0.01 to 4 weight percent, based on the total weight of the epoxy resin composition, for example: about 1.00 wt%, about 1.50 wt%, about 2.00 wt%. Other phenolic resins are present in amounts of about 0.01 to 4 weight percent, based on the total weight of the epoxy resin composition, and are, for example: about 0.40 wt%, about 0.60 wt%, about 0.80 wt%.
The total content of phenolic resin should be kept in a certain range so that the obtained composition has good curing properties, too high total amount of phenolic resin reduces gelation time and fluidity, and too low total amount of phenolic resin does not easily obtain the desired effect. In one embodiment, the total phenolic resin content is about 1 to 8 weight percent, preferably about 1 to 5 weight percent, for example about 1.40 weight percent, about 2.10 weight percent, about 2.80 weight percent, based on the total weight of the epoxy resin composition.
The biphenyl type phenolic resin and other phenolic resins respectively have lower viscosity, so that the addition amount of the filler, particularly the addition amount of the high-dielectric filler, can be increased on the premise of ensuring that the phenolic resin composition has good curing performance, and the dielectric constant of the epoxy resin composition is further increased. In one embodiment, the biphenyl phenolic resin has a viscosity of about 0.5 to 2P. In another embodiment, the viscosity of the other phenolic resin is from about 0.2P to about 10P, for example from about 0.5P to about 8P.
By regulating and controlling the composition, viscosity and content of the epoxy resin and the phenolic resin, the obtained product can keep lower low dielectric filler content, increase the addition amount of high dielectric filler, and simultaneously keep better flowing property of the product, and the increase of the high dielectric filler content can endow the product with higher dielectric constant, thereby being beneficial to the subsequent use of the product.
(c) Curing accelerator
As used herein, the term "cure accelerator" has the same meaning as "catalyst" which is capable of catalyzing or promoting the crosslinking reaction of an epoxy resin with a phenolic resin to form a steric network without affecting the curing properties.
The preferred cure accelerators of the present invention help to achieve a suitable cure speed for the epoxy resin composition to meet a sufficient degree of cure while simultaneously achieving the necessary flow and wetting properties for injection molding filling. The curing accelerator of the present invention may be selected from compounds including, but not limited to, organophosphorus, amines, amidine compounds, imidazole compounds, or combinations thereof, preferably organophosphorus compounds.
The curing accelerator is present in an amount of about 0.1 to 1 weight percent, such as about 0.27 weight percent, about 0.24 weight percent, about 0.21 weight percent, based on the total weight of the epoxy resin composition.
Filler material
The filler added to the epoxy resin composition contributes to improvement of properties of the epoxy resin composition, such as thermal expansion properties, abrasion resistance, moisture resistance, thermal conductivity, electrical characteristics, and the like. The proper performance can be endowed to the product by selectively changing the type, content and size of the filler.
The filler can be classified into a high dielectric filler and a low dielectric filler according to a difference in dielectric constant of the filler material. Generally, when the dielectric constant of the filler is at Si3N4Is referred to as a high dielectric filler when the dielectric constant of (2) is greater than about 7; when the dielectric constant of the filler is SiO2Is called a high dielectric filler when the dielectric constant of (2) is less than or equal to about 3.9.
The particle size of the filler should meet certain requirements to ensure the fluidity of the epoxy resin composition and the coating property of the resin on the surface filler particles. The addition of small sized fillers helps to obtain a product with low warpage. The excessive size of the filler can lead to poor coating performance of the resin on the filler, and the use of the final product is influenced. The maximum particle size of the high dielectric filler should be about 5-20 μm, preferably about 20 μm. The maximum particle size of the low dielectric filler should be about 1-20 μm, preferably about 20 μm.
The selection of suitable filler levels is advantageous for improving product performance. The filler content is too high, the flow property of the product is poor, and the subsequent processing is not facilitated; the filler content is too low, the thermal expansion coefficient of the product is increased, the shrinkage rate is increased, the low warpage is lost, and the water absorption rate is increased. In one embodiment, the total content of the high dielectric filler and the low dielectric filler is about 75 to 95 weight percent, such as about 85 weight percent, about 86 weight percent, about 86.5 weight percent, about 88 weight percent, about 87 weight percent, about 90 weight percent, about 93 weight percent, based on the total weight of the epoxy resin composition.
(d) High dielectric filler
The electrical property of the product can be obviously improved by adding the high dielectric filler, and the dielectric constant of the product is improved. The high dielectric constant with proper type and content is selected, and can be used together with other components (such as epoxy resin, phenolic resin, curing accelerator, low dielectric filler and the like) in the epoxy resin composition to realize a product with high dielectric, high wear resistance, moisture resistance and high heat conductivity.
The high dielectric material in the present invention may be a titanate, including but not limited to: barium titanate, strontium titanate, calcium titanate, magnesium titanate, or combinations thereof. In a preferred embodiment, the high dielectric filler is barium titanate.
The content of titanate needs to be maintained within a suitable range to impart excellent properties to the product. The content of the added titanate is too high, the flow property of the product is poor, the subsequent processing is not facilitated, and the cost is obviously increased; the titanate content is too low, the dielectric constant of the product is reduced, the high dielectric property is lost, and the use in the AiP field is not facilitated. In the present invention, the content of titanate is 25 to 95% by weight, preferably 40 to 90% by weight, more preferably 45 to 75% by weight, based on the total weight of the epoxy resin composition, for example: about 50 wt%, about 70 wt%, about 80 wt%, about 90 wt%, about 93 wt%.
The addition of different types of high dielectric fillers can better improve the properties of the epoxy resin composition, such as moisture resistance, abrasion resistance, mechanical properties, etc., after curing. Different types of high dielectric fillers are selected for combined use, so that various properties of the product can be better balanced to meet actual needs, and the production cost is reduced. In one embodiment, the high dielectric filler further comprises a transition metal oxide. The transition metal oxide is added, so that a product with high dielectric property can be obtained on the premise of lower total addition of the high dielectric filler, and the production cost can be reduced. In a preferred embodiment, the transition metal oxide selected for the high dielectric filler of the present invention is iron oxide, titanium oxide or a combination thereof.
The content of the transition metal oxide needs to be kept in a proper range, and the content of the transition metal oxide is too high, so that the fluidity of the product is remarkably reduced, and the subsequent processing and use are not facilitated. The content of transition metal oxide is 0.1 to 17% by weight, for example: about 5 wt%, about 10 wt%, about 15 wt%.
The contents of titanium oxide and iron oxide in the transition metal oxide should be each maintained within a suitable range, and when the content of titanium oxide or iron oxide is excessively high, the flow properties of the product may be significantly reduced. The content of titanium oxide is 0.1 to 12% by weight, based on the total weight of the epoxy resin composition, for example: about 5 wt%, 10 wt%. The content of iron oxide is 0.1 to 7% by weight, based on the total weight of the epoxy resin composition, for example: about 5% by weight.
In the high dielectric filler, when the ratio of the weight of titanate to the weight of transition metal oxide is too low, the content of transition metal compound is relatively too high, the fluidity of the product is remarkably reduced, the viscosity is increased, the gelation time is shortened, the spiral flow length is reduced, and the subsequent processing and use of the product are not facilitated. In the present invention, the ratio of the weight of titanate to the weight of transition metal oxide is 3 or more, for example: about 3.33, about 5, about 6, about 14. When the ratio of the weight of titanate to the weight of transition metal oxide is too high, the production cost may increase. The ratio of the weight of titanate to the weight of transition metal oxide may be 15 or less, preferably 10 or less.
The total content of high dielectric filler needs to be kept within a reasonable range to achieve high dielectric properties of the product. In one embodiment, the high dielectric filler is present in an amount of about 30 to 95 weight percent, preferably 45 to 95 weight percent, more preferably 55 to 75 weight percent, for example about 60 weight percent, about 65 weight percent, about 75 weight percent, about 80 weight percent, about 90 weight percent, about 93 weight percent, based on the total weight of the epoxy resin composition.
(e)Low dielectric filler
The low dielectric filler may be one or more selected from the group consisting of: silica, aluminum hydroxide, magnesium hydroxide, alumina, fumed silica, and the like. In one embodiment, the filler is silica. The shape of the inorganic filler includes, but is not limited to, spherical, rod-like, angular, polygonal, irregular, etc., preferably spherical. The preferred shape contributes to good compatibility between the inorganic filler and the epoxy resin, thereby achieving a suitable spiral flow length. In a preferred embodiment, the filler is spherical silica.
The content of the low dielectric filler should be in a proper range, if the content of the low dielectric filler added is too high, the total content of the filler cannot be too high due to the requirements of maintaining the fluidity, viscosity and the like of the product, and correspondingly, the content of the high dielectric filler which can be added is reduced, so that the high dielectric property of the product cannot be realized. By reasonably regulating and controlling the types, contents, viscosities and other properties of the epoxy resin and the phenolic resin, the low-dielectric filler with lower content can be added, and meanwhile, the good fluidity of the product can be kept. In one embodiment of the present invention, the low dielectric filler component is present in an amount of 0 to 35 weight percent, preferably 0 to 30 weight percent, for example about 27 weight percent, about 21.5 weight percent, about 11.5 weight percent, about 5 weight percent, based on the total weight of the epoxy resin composition. In a preferred embodiment, no low dielectric filler may be added.
The ratio of the weight of the high dielectric filler to the weight of the low dielectric filler should also be kept within a suitable range to provide a product with high dielectric, good flowability and other properties (e.g., mechanical properties, flame retardancy, etc.). In one embodiment, the ratio of the weight of the high dielectric filler to the weight of the low dielectric filler is above 2, preferably from 2 to 20, more preferably from 2 to 10. For example about 2.2, about 3.0, about 6.8, about 16.
(f) Other additives
The epoxy resin compositions of the present invention may also optionally contain one or more other additional ingredients including, but not limited to, ion traps, mold release agents, flame retardants, colorants, coupling agents, tougheners. The additive is present in an amount of about 0.6 to 9 weight percent, based on the total weight of the epoxy resin composition.
The ion scavenger can be used to reduce the mobility of free ions in the epoxy resin composition. Suitable ion scavengers are selected from the group consisting of metal acid salts, hydrated oxides, and combinations thereof, and in the present invention include, but are not limited to: bi2O3、Al2O3、MgO、Sb2O5ZrO and combinations thereof, preferably Al2O3MgO, or a combination thereof. The ion scavenger is present in an amount of about 0.1 to about 1 weight percent, for example about 0.20 weight percent, based on the total weight of the epoxy resin composition.
The preferred mold release agent in the present invention helps to obtain an epoxy resin composition having sufficient fluidity, good delamination resistance, and moisture absorption resistance. The mold release agent of the present invention includes, but is not limited to, montan wax, fatty acid ester wax, fatty acid wax, aliphatic ester wax, polyethylene wax, polypropylene wax, alkyl oligomer wax, amide wax or a combination thereof, preferably fatty acid ester wax. The release agent is present in an amount of about 0.1 to 0.5 weight percent, for example about 0.20 weight percent, based on the total weight of the epoxy resin composition.
The flame retardant is a functional auxiliary agent which can endow the epoxy resin composition with a polymer matrix with flame retardancy, and comprises an organic flame retardant and an inorganic flame retardant. The flame retardant of the present invention is one or more selected from the group consisting of: metal hydroxide, zinc borate, phosphine-containing compound, preferably metal hydroxide. The flame retardant is present in an amount of about 0.1 to 5 weight percent, for example about 1.0 weight percent, about 1.5 weight percent, about 2.0 weight percent, about 3.0 weight percent, based on the total weight of the epoxy resin composition.
The coupling agent can improve the compatibility between the components of the epoxy resin composition on the one hand and also provide the function of promoting adhesion on the other hand. The coupling agent of the present invention is selected from the group consisting of trimethoxysilane, mercaptopropyltrimethoxysilane, phenylaminopropyltrimethoxysilane, glycidoxypropyltrimethoxysilane, and combinations thereof. The coupling agent is present in an amount of about 0.1 to 1 weight percent, for example about 0.20 weight percent, based on the total weight of the epoxy resin composition.
The colorant, which is a substance imparting color to the epoxy resin composition, should have good dispersibility, weather resistance, thermal stability, chemical stability. The colorant of the present invention is selected from the group consisting of carbon black, iron yellow, and combinations thereof. The colorant is present in an amount of about 0.1 to 0.5 weight percent, for example about 0.2 weight percent, about 0.23 weight percent, about 0.24 weight percent, based on the total weight of the epoxy resin composition.
The toughening agent can reduce the brittleness and cracking of the material, and improve the toughness, fatigue resistance and bearing strength of the material. The common epoxy resin toughening agent can be a reactive toughening agent or a non-reactive toughening agent. Toughening agents of the present invention include, but are not limited to: epoxy silane epoxy resin, epoxy silicone glycidyl resin, carboxyl terminated nitrile rubber or a combination thereof. The toughening agent is present in an amount of about 0.1 to 1 weight percent, for example about 0.15 weight percent, based on the total weight of the epoxy resin composition.
Epoxy resin composition
The present invention relates to an epoxy resin composition comprising, based on the total weight of the epoxy resin composition:
(a) 1-12% by weight of an epoxy resin,
(b) 1-8% by weight of a phenolic resin,
(c)0.1 to 1% by weight of a curing accelerator,
(d) 30-95% by weight of a high dielectric filler,
(e)0 to 60% by weight of a low dielectric filler, and
optionally (f)0.6 to 9% by weight of one or more additives selected from the group consisting of: 0.1-1 wt% of an ion scavenger; 0.1-0.5 wt% of a mold release agent; 0.1-5 wt% of a flame retardant; 0.1 to 0.5 weight percent of a colorant; 0.1 to 1 weight percent of a coupling agent; 0.1-1 wt% of a toughening agent.
It will be appreciated that the amounts of the components are chosen so that the sum of all components in the product is 100%.
For example, in one preferred embodiment, the epoxy resin composition contains, based on the total weight of the epoxy resin composition: 4.0 wt% of MAR epoxy resin, 1.0 wt% of BP epoxy resin, 1.0 wt% of DCPD epoxy resin, 2.0 wt% of polyfunctional epoxy resin, 2.0 wt% of MAR phenolic resin, 0.8 wt% of polyfunctional phenolic resin, 0.21 wt% of curing accelerator, 27.00 wt% of spherical silica A, 5.0 wt% of iron oxide, 5.0 wt% of titanium oxide, 50.00 wt% of barium titanate, 0.20 wt% of ion scavenger, 0.20 wt% of release agent, 1.0 wt% of flame retardant, 0.20 wt% of coupling agent, 0.24 wt% of colorant, 0.15 wt% of toughening agent.
In another preferred embodiment, the epoxy resin composition contains, based on the total weight of the epoxy resin composition: 4.0 wt% of MAR epoxy resin, 1.0 wt% of BP epoxy resin, 1.0 wt% of DCPD epoxy resin, 2.0 wt% of polyfunctional epoxy resin, 2.0 wt% of MAR phenolic resin, 0.8 wt% of polyfunctional phenolic resin, 0.21 wt% of curing accelerator, 21.50 wt% of spherical silica A, 5.0 wt% of iron oxide, 10.0 wt% of titanium oxide, 50.00 wt% of barium titanate, 0.20 wt% of ion scavenger, 0.20 wt% of release agent, 1.5 wt% of flame retardant, 0.20 wt% of coupling agent, 0.24 wt% of colorant, 0.15 wt% of toughening agent.
In yet another preferred embodiment, the epoxy resin composition contains, based on the total weight of the epoxy resin composition: 4.0 wt% of MAR epoxy resin, 1.0 wt% of BP epoxy resin, 1.0 wt% of DCPD epoxy resin, 2.0 wt% of polyfunctional epoxy resin, 2.0 wt% of MAR phenolic resin, 0.8 wt% of polyfunctional phenolic resin, 0.21 wt% of curing accelerator, 11.00 wt% of spherical silica A, 5.0 wt% of titanium oxide, 70.00 wt% of barium titanate, 0.20 wt% of ion scavenger, 0.20 wt% of release agent, 2.00 wt% of flame retardant, 0.20 wt% of coupling agent, 0.24 wt% of colorant, 0.15 wt% of toughening agent.
In yet another preferred embodiment, the epoxy resin composition contains, based on the total weight of the epoxy resin composition: 4.0 wt% of MAR epoxy resin, 1.0 wt% of BP epoxy resin, 1.0 wt% of DCPD epoxy resin, 2.0 wt% of polyfunctional epoxy resin, 2.0 wt% of MAR phenolic resin, 0.8 wt% of polyfunctional phenolic resin, 0.21 wt% of curing accelerator, 5.00 wt% of spherical silica A, 80.00 wt% of barium titanate, 0.20 wt% of ion scavenger, 0.20 wt% of release agent, 3.0 wt% of flame retardant, 0.20 wt% of coupling agent, 0.24 wt% of colorant, 0.15 wt% of toughening agent.
In yet another preferred embodiment, the epoxy resin composition contains, based on the total weight of the epoxy resin composition: 3.76% by weight of MAR epoxy resin, 1.0% by weight of BP epoxy resin, 0.5% by weight of DCPD epoxy resin, 1.5% by weight of polyfunctional epoxy resin, 1.5% by weight of MAR phenolic resin, 0.6% by weight of polyfunctional phenolic resin, 0.19% by weight of curing accelerator, 90.00% by weight of barium titanate, 0.20% by weight of ion scavenger, 0.20% by weight of mould release agent, 0.20% by weight of coupling agent, 0.20% by weight of colouring agent, 0.15% by weight of toughening agent.
In yet another preferred embodiment, the epoxy resin composition contains, based on the total weight of the epoxy resin composition: 2.50 wt% of MAR epoxy resin, 0.50 wt% of BP epoxy resin, 0.50 wt% of DCPD epoxy resin, 1.00 wt% of polyfunctional epoxy resin, 1.00 wt% of MAR phenolic resin, 0.4 wt% of polyfunctional phenolic resin, 0.15 wt% of curing accelerator, 93.00 wt% of barium titanate, 0.20 wt% of ion scavenger, 0.20 wt% of release agent, 0.20 wt% of coupling agent, 0.20 wt% of colorant, 0.15 wt% of toughening agent.
It will be appreciated by those skilled in the art that for a composition, the sum of all of its ingredients may be 100%.
Preparation method
The invention also relates to a preparation method of the epoxy resin composition, which comprises the following steps:
(1) each component was weighed and mixed to obtain a premixed powder,
(2) the premixed powders were heat mixed and extruded to obtain the product.
Step (1) may also be preceded by grinding the components to a smaller size by a grinding apparatus, such as a ball mill.
The equipment for mixing in step (1) should be such that the components can be mixed homogeneously. In one embodiment, the mixing is performed using a high speed blender. The mixing speed in step (1) is usually about 200 and 300 rpm. The mixing time is generally about 20 to 50 minutes, preferably about 30 minutes.
The components in the step (1) can be added together or one by one into a mixing device.
The equipment for heating and mixing in the step (2) needs to enable all the components to be uniformly heated and mixed. In one embodiment, an extruder is used for mixing. Extruders include, but are not limited to, single screw extruders, twin screw extruders, preferably twin screw extruders. In one embodiment, the extrusion temperature of step (2) is about 90-110 ℃ and the screw speed is about 220 rpm.
In one embodiment, the extrusion of step (2) is followed by cooling, comminuting and post-mixing steps. In another embodiment, the pulverization treatment is performed using a pulverizer. In another embodiment, a post-mixing treatment is performed using a post-mixer.
Performance of
The epoxy resin composition of the present invention has a suitable spiral flow length so that the product has good flowability and filling properties. The spiral flow length can be tested using a spiral flow measurement die. According to EMI-1-66, using a spiral flow measuring die, at a molding temperature of 175 ℃ at 70kg/cm2Measurements were made under injection pressure and 90 second cure time conditions. The flow ability at the time of injection molding is characterized in terms of the length of the path of the resin along the spiral cavity. In one embodiment, the epoxy resin composition of the present invention has a spiral flow length of about 40 inches or more, such as about 47 inches, about 45 inches, about 46 inches, about 50 inches, about 43 inches, within about 90 seconds of curing at 175 ℃.
The epoxy resin composition of the present invention has a suitable gelation time. The gelation time can be determined by a timer measuring the time until gelation of a powder sample of the epoxy molding compound is achieved upon placement on a hot plate. The epoxy resin composition was placed on a curing plate heated to a certain temperature, and the sample was uniformly stirred using a stopwatch before a scraper, and the stopwatch was stopped when the sample gelled, and the time was recorded as the gelation time at the temperature. In one embodiment, the epoxy resin composition of the present invention has a gelation time of 30 to 50 seconds, for example, about 38 seconds, about 37 seconds, about 36 seconds, about 33 seconds, at 175 ℃.
The epoxy resin composition has high thermal hardness, so that the epoxy resin composition can be easily separated from a mold, has good continuous molding performance and is molded at high temperature. The hot hardness was measured by using a hardness meter for a sample after curing. Shore hardness, brinell hardness, rockwell hardness, and the like may be used. In one embodiment, the epoxy resin composition of the present invention has a thermal hardness of about shore 60-90, for example about shore 81, 80, 76, 77, 79, cured at about 175 ℃ for about 90 s.
The epoxy resin composition of the present invention has a suitable viscosity. The viscosity test can be measured, for example, by the following method: the measurement was carried out by a capillary rheometer, model Shimadzu CFT-500D, at 175. + -. 2 ℃ under a load of 10 kgf. In one embodiment, the inventive epoxy resin composition has a viscosity below 30pa.s, preferably below 20pa.s, such as about 17pa.s, about 20pa.s, about 9pa.s, about 16pa.s, about 25pa.s, about 12 pa.s.
The epoxy resin composition has high dielectric property and high dielectric constant. The measurement of the dielectric constant was performed at room temperature using a dielectric constant tester. In one embodiment, the epoxy resin composition of the present invention has a dielectric constant of 8 or more, preferably 10 or more, for example, about 12, about 15, about 18, about 20, about 26, about 28.
The epoxy resin composition has good flame retardance. The test was conducted using a vertical burner model CZF-01, and the block thickness was selected to be 0.25 inch or 0.125 inch, as desired. In one embodiment, the test piece has a thickness of 0.125 inches and the epoxy resin composition of the present invention can pass the UL-94 standard with a flame retardant rating of V-0.
Advantageous effects
In the present invention, the dielectric constant of the epoxy resin can be increased by adding a high dielectric filler. For example, by adding titanate, the dielectric constant of the product is improved. By adding the transition metal oxide, the cost can be reduced while maintaining a high dielectric constant.
On the other hand, by adding a low viscosity resin, the amount of the high dielectric filler to be added can be increased, and the dielectric constant of the resulting high dielectric epoxy resin composition is high. In addition, the composition of the invention has good fluidity and high hardness, and meets the requirement of AiP. The epoxy resin composition has the advantages of high dielectric constant, flame retardance, environmental friendliness, simple process, easiness in industrial application and the like, and can be used for AiP packaging.
Examples
The present invention will be described in further detail with reference to specific examples.
It should be noted that the following examples are only for clearly illustrating the technical solutions of the present invention, and are not intended to limit the present invention. It will be apparent to those skilled in the art that other variations and modifications may be made in the foregoing disclosure without departing from the spirit or essential characteristics of the invention, and it is not desired to exhaustively enumerate all embodiments, but rather those obvious variations and modifications are within the scope of the invention. Unless otherwise indicated, both the instrumentation and reagent materials used herein are commercially available.
Epoxy resin:
polyfunctional epoxy resin: an epoxy resin (MFN) having the structure of formula (2):
wherein n is an integer of 3 to 10; viscosity 0.2-1P;
other epoxy resins: biphenyl type (MAR) epoxy resin, viscosity 0.01-1P;
bisphenol type (BP) epoxy resin, viscosity 0.01-1P;
dicyclopentadiene phenol type (DCPD) epoxy resin, viscosity 0.1-1P.
Phenolic resin:
a polyfunctional phenol resin: a phenolic resin (MFN) having the structure of formula (2):
wherein n is an integer of 3 to 10; m is an integer of 3 to 10; viscosity 0.5-8P;
biphenyl type phenolic resin (MAR) with viscosity of 0.5-2P.
Low dielectric filler: spherical silicon dioxide A with the maximum particle size of 20 μm and D90 with the particle size of 10 μm;
the particle size of the spherical silicon dioxide B and D90 is 1-2 mu m.
High dielectric filler: iron oxide, titanium oxide, barium titanate, the maximum particle size is 20 μm.
An ion scavenger: al (Al)2O3And MgO.
Releasing agent: a combination of montan wax, fatty acid ester wax, available from clariant corporation.
Flame retardant: a metal hydroxide.
Coupling agent: trimethoxysilane, mercaptopropyltrimethoxysilane, phenylaminopropyltrimethoxysilane.
Colorant: carbon black, available from the company Eurycoron.
A toughening agent: carboxyl terminated nitrile rubber available from corning;
composition of
The compositions of comparative examples 1 to 3 are shown in Table 1, and the compositions of examples 1 to 7 are shown in Table 2, and the contents of the respective components are based on the total weight of the epoxy resin composition.
TABLE 1
| Type of material | Comparative example 1 | Comparative example 2 | Comparative example 3 | Comparative example 4 |
| Epoxy resin (MAR) | 4.00 | 4.00 | 4.00 | 4.00 |
| Epoxy resin (BP) | 1.00 | 1.00 | 1.00 | 1.00 |
| Epoxy resin (DCPD) | 1.00 | 1.00 | 1.00 | 1.00 |
| Epoxy resin (MFN) | 2.00 | 2.00 | 2.00 | 2.00 |
| Phenolic resin (MAR) | 2.00 | 2.00 | 2.00 | 2.00 |
| Phenolic resin (MFN) | 0.80 | 0.80 | 0.80 | 0.80 |
| Curing accelerator | 0.25 | 0.25 | 0.21 | 0.22 |
| Spherical silica A | 83.00 | 10 | 16.50 | 53.00 |
| Spherical silica B | 5.00 | - | - | - |
| Alumina oxide | 78 | - | ||
| Iron oxide | - | - | 5 | - |
| Titanium oxide | - | - | 15.00 | 5.00 |
| Barium titanate | - | - | 50.00 | 30.00 |
| Ion scavenger | 0.20 | 0.20 | 0.20 | 0.20 |
| Release agent | 0.20 | 0.20 | 0.20 | 0.20 |
| Flame retardant | - | - | 1.50 | - |
| Coupling agent | 0.20 | 0.20 | 0.20 | 0.20 |
| Coloring agent | 0.20 | 0.20 | 0.24 | 0.23 |
| Toughening agent | 0.15 | 0.15 | 0.15 | 0.15 |
TABLE 2
| Type of material | Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | Example 6 |
| Epoxy resin (MAR) | 4.00 | 4.00 | 4.00 | 4.00 | 3.76 | 2.50 |
| Epoxy resin (BP) | 1.00 | 1.00 | 1.00 | 1.00 | 1.00 | 0.50 |
| Epoxy resin (DCPD) | 1.00 | 1.00 | 1.00 | 1.00 | 0.50 | 0.50 |
| Epoxy resin (MFN) | 2.00 | 2.00 | 2.00 | 2.00 | 1.50 | 1.00 |
| Phenolic resin (MAR) | 2.00 | 2.00 | 2.00 | 2.00 | 1.50 | 1.00 |
| Phenolic resin (MFN) | 0.80 | 0.80 | 0.80 | 0.80 | 0.60 | 0.40 |
| Curing accelerator | 0.21 | 0.21 | 0.21 | 0.21 | 0.19 | 0.15 |
| Spherical silica A | 27.00 | 21.50 | 11.00 | 5.00 | - | - |
| Iron oxide | 5.00 | 5.00 | - | - | - | - |
| Titanium oxide | 5.00 | 10.00 | 5.00 | - | - | - |
| Barium titanate | 50.00 | 50.00 | 70.00 | 80.00 | 90.00 | 93.00 |
| Ion scavenger | 0.20 | 0.20 | 0.20 | 0.20 | 0.20 | 0.20 |
| Release agent | 0.20 | 0.20 | 0.20 | 0.20 | 0.20 | 0.20 |
| Flame retardant | 1.00 | 1.50 | 2.00 | 3.00 | - | - |
| Coupling agent | 0.20 | 0.20 | 0.20 | 0.20 | 0.20 | 0.20 |
| Coloring agent | 0.24 | 0.24 | 0.24 | 0.24 | 0.20 | 0.20 |
| Toughening agent | 0.15 | 0.15 | 0.15 | 0.15 | 0.15 | 0.15 |
Preparation of
Comparative example 1
Pouring 83 parts of spherical silica A, 5 parts of spherical silica B and 0.2 part of colorant into a high-speed stirrer, stirring for 10 minutes, slowly adding 0.2 part of coupling agent, stirring for 10 minutes, then adding 4 parts of epoxy resin (MAR), 1 part of epoxy resin (BP), 1 part of epoxy resin (DCPD), 2 parts of epoxy resin (MFN), 2 parts of phenolic resin (MAR), 0.8 part of phenolic resin (MFN), 0.25 part of curing accelerator, 0.2 part of ion capture agent and 0.2 part of release agent, stirring for 3 minutes, then adding 0.15 part of flexibilizer, and stirring for 30 minutes to obtain a premix; the premix was heated, mixed and extruded by an extruder at a set temperature (80 ℃, 100 ℃, 100 ℃, 60 ℃, 80 ℃), a feed speed of 9rpm, a host rotation speed of 220rpm, and a blade pair number of 26 pairs, and rapidly cooled and pulverized to obtain a powdery product.
Comparative examples 2 to 4 were obtained by the same preparation operation as in comparative example 1 above, according to the respective compositions.
Example 1
Pouring 27 parts of spherical silica A, 5 parts of titanium oxide, 5 parts of iron oxide, 50 parts of barium titanate and 0.24 part of colorant into a high-speed stirrer, stirring for 10 minutes, slowly adding 0.2 part of coupling agent, stirring for 10 minutes, then adding 4 parts of epoxy resin (MAR), 1 part of epoxy resin (BP), 1 part of epoxy resin (DCPD), 2 parts of epoxy resin (MFN), 2 parts of phenolic resin (MAR), 0.8 part of phenolic resin (MFN), 0.21 part of curing accelerator, 0.2 part of ion scavenger, 0.2 part of release agent and 1.00 part of flame retardant, stirring for 3 minutes, then adding 0.15 part of toughener, and stirring for 30 minutes to obtain a premix; the premix was heated, mixed and extruded by an extruder at a set temperature (80 ℃, 100 ℃, 100 ℃, 60 ℃, 80 ℃), a feed speed of 9rpm, a host rotation speed of 220rpm, and a blade pair number of 26 pairs, and rapidly cooled and pulverized to obtain a powdery product.
Examples 2 to 6 were obtained by the same preparation operation as in example 1 above, according to the respective compositions.
Testing
The obtained epoxy resin compositions were tested for various properties according to the following test methods, and the results are shown in table 3 below.
Spiral flow length: according to EMI-1-66, a spiral flow measuring die was used, at a molding temperature of 175 ℃ C, 70kg/cm2Measurements were made under injection pressure and 90s cure time conditions.
Gelation time: the epoxy resin composition was placed on a curing plate heated to 175 ℃ and a stopwatch was used to stir the sample uniformly before the scraper, and the stopwatch was stopped when the sample gelled, which was the gelation time.
Shore D hardness: the sample after curing at 175 ℃ for about 90 seconds was measured using a durometer.
Viscosity: an Shimadzu capillary rheometer, model CFT 500D, was used, measuring 175 ℃ and a load of 10 Kgf.
Dielectric constant: using a dielectric constant tester, model number QBG-3D, test frequency: 25 KHz-50 MHz.
Flame retardancy: flame retardancy method test was conducted by the method of "UL-94" in which the thickness of the specimen was set to 0.125 inch. The test instrument was a vertical burner model CZF-01.
TABLE 3
The addition of the high dielectric filler can improve the dielectric constant of the product, so that the product has high dielectric performance. Examples 1-6 the dielectric constant of the samples increased significantly, 12 or more, with the use of the high dielectric filler, compared to comparative example 1.
It can be seen from the test results of comparative example 2 that the dielectric properties of comparative example 2 are improved when alumina is added compared to comparative example 1, but still below 6.5. The amount of alumina added is 78 wt%, and the dielectric properties of the product are still lower than those of the product with the low amount of the high dielectric filler of the invention.
The addition of titanate can increase the dielectric constant of the product, and the increase of the content thereof can significantly increase the dielectric constant of the product, and in examples 1 to 6, the dielectric constant of the product is increased to 28 as the content of barium titanate is increased from 50 wt% to 93 wt%.
The addition of proper content of oxide can maintain the high dielectricity and better fluidity of the product and reduce the production cost. In examples 1-2, by adding iron oxide and titanium oxide, the content of barium titanate is reduced compared with examples 3-6, but the dielectric constant of the product is still more than 12, the spiral flow length is more than 45 inches, the viscosity is less than 20Pa.s, and the high dielectric property and the good fluidity are combined, and the production cost is reduced.
In comparative example 3, the content of titanium oxide in the high dielectric filler was too high, and the weight ratio of barium titanate and metal oxide was 2.5. The viscosity of the product is increased to 32Pa.s, and the fluidity is poor, so that the subsequent use is not facilitated.
The epoxy resin is prepared by selecting proper components and content, and the obtained product still has very good fluidity and high dielectricity under the condition that the addition amount of the low dielectric filler silicon dioxide is below 30 weight percent.
By selecting proper composition types and contents, the epoxy resin composition has excellent performance, and has the advantages of high dielectric property, good fluidity and the like. By adding a proper content of high dielectric filler, the dielectric constant of the product is increased, and the product has high dielectric property. The addition amount of the superfine high-dielectric filler is increased by adding the low-viscosity resin, and the prepared high-dielectric epoxy resin composition has high dielectric constant and meets the requirement of AiP. The epoxy resin composition has the advantages of high dielectric constant, flame retardance, environmental friendliness, simple process, easiness in industrial application and the like, and can be used for AiP packaging.
Those skilled in the art will recognize, or be able to ascertain using no more than routine experimentation, many equivalents to the specific embodiments of the invention described herein. The appended claims are intended to cover such equivalents. It will be apparent to those skilled in the art that many modifications and variations of the present invention can be made without departing from its spirit and scope. The specific embodiments described herein are provided by way of example only and are not meant to be limiting in any way. The true scope and spirit of the invention is indicated by the appended claims, and the specification and examples are exemplary only.
Claims (14)
1. An epoxy resin composition, wherein,
the epoxy resin composition comprises, based on the total weight of the epoxy resin composition:
(a) 1-12% by weight of an epoxy resin,
(b) 1-8% by weight of a phenolic resin,
(c)0.1 to 1% by weight of a curing accelerator,
(d) 30-95% by weight of a high dielectric filler,
(e)0-35 wt% of a low dielectric filler;
the high dielectric filler comprises a titanate.
2. The epoxy resin composition according to claim 1, wherein,
the titanate is selected from the group consisting of barium titanate, strontium titanate, calcium titanate, lead titanate, and combinations thereof,
preferably, the titanate is barium titanate.
3. The epoxy resin composition according to claim 2, wherein,
the high dielectric filler further comprises a transition metal oxide,
preferably, the transition metal oxide is selected from the group consisting of iron oxide, titanium oxide, and combinations thereof.
4. The epoxy resin composition of any one of claims 1 to 3, wherein,
based on the total weight of the epoxy resin composition,
the content of the titanate is 25-95 wt%; and/or
The content of the transition metal oxide is 0.1-17 wt%, and/or
The ratio of the weight of the titanate to the weight of the transition metal oxide is 3 or more.
5. The epoxy resin composition according to claim 3 or 4, wherein,
based on the total weight of the epoxy resin composition,
the content of titanium oxide in the transition metal oxide is 0.1-12 wt%; and/or
The transition metal oxide contains 0.1 to 7% by weight of iron oxide.
6. The epoxy resin composition of any one of claims 1 to 5, wherein,
the epoxy resin comprises a multifunctional epoxy resin and other epoxy resins selected from o-cresol type epoxy resin, bisphenol type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene phenol type epoxy resin, aralkyl phenol type epoxy resin, naphthol type epoxy resin and combinations thereof; and/or
The phenolic resin comprises a biphenyl type phenolic resin and other phenolic resins selected from the group consisting of phenol formaldehyde type phenolic resins, o-cresol formaldehyde type phenolic resins, aralkyl phenol type phenolic resins, hydroxybenzaldehyde type phenolic resins, multifunctional phenolic resins, and combinations thereof; and/or
The low dielectric filler is selected from the group consisting of silica, aluminum hydroxide, magnesium hydroxide, alumina, fumed silica, and combinations thereof, preferably silica, more preferably spherical silica; and/or
The cure accelerator is selected from the group consisting of organophosphorus compounds, amines, amidine compounds, imidazole compounds, and combinations thereof.
7. The epoxy resin composition of any one of claims 1 to 6, wherein,
based on the total weight of the epoxy resin composition,
the content of the polyfunctional epoxy resin is 0.01-4 wt%; and/or
The content of the other epoxy resin is 0.01-8 wt%; and/or
The content of the biphenyl type phenolic resin is 0.01-4 wt%; and/or
The other phenolic resin accounts for 0.01-4 wt%.
8. The epoxy resin composition of any one of claims 1 to 7, wherein,
the viscosity of the polyfunctional epoxy resin is 0.2-2P; and/or
The viscosity of the other epoxy resin is 0.01-1.5P; and/or
The viscosity of the biphenyl type phenolic resin is 0.5-2P; and/or
The viscosity of the other phenolic resin is 0.5-10P.
9. The epoxy resin composition of any one of claims 1 to 8, wherein,
the maximum grain diameter of the high dielectric filler is 5-20 μm; and/or
The maximum particle size of the low dielectric filler is 1-20 μm.
10. The epoxy resin composition of any one of claims 1 to 9, wherein,
the total content of the high dielectric filler and the low dielectric filler is 75 to 95 wt% based on the total weight of the epoxy resin composition; and/or
The ratio of the weight of the high dielectric filler to the weight of the low dielectric filler is 2 or more.
11. The epoxy resin composition of any one of claims 1-10, wherein,
the epoxy resin composition further comprises optionally one or more (f) additives selected from the group consisting of: ion trapping agent, release agent, flame retardant, coupling agent, coloring agent and toughening agent; wherein,
the ion scavenger is selected from: bi2O3、Al2O3、MgO、Sb2O5ZrO and combinations thereof, preferably Al2O3MgO, or a combination thereof; and/or
The release agent is selected from: montan wax, fatty acid ester wax, fatty acid wax, aliphatic ester wax, polyethylene wax, polypropylene wax, alkyl oligomer wax, amide wax, and combinations thereof, preferably aliphatic ester wax; and/or
The flame retardant is selected from: metal hydroxides, zinc borate, phosphine-containing compounds, and combinations thereof, preferably metal hydroxides, more preferably aluminum hydroxide; and/or
The coupling agent is selected from: trimethoxysilane, mercaptopropyltrimethoxysilane, phenylaminopropyltrimethoxysilane, glycidoxypropyltrimethoxysilane, and combinations thereof; and/or
The colorant is selected from: carbon black, iron yellow, and combinations thereof, preferably carbon black; and/or
The toughening agent is selected from: epoxy silane epoxy based resins, epoxy silicone glycidyl resins, carboxyl terminated nitrile rubbers and combinations thereof, preferably carboxyl terminated nitrile rubbers.
12. The epoxy resin composition of any one of claims 1-11, wherein,
the epoxy resin composition possesses one or more of the following properties:
(1) a dielectric constant of 8 or more, preferably 10 or more;
(2) a spiral flow length of 40 inches or more;
(3) the viscosity is 30Pa.s or less, preferably 20Pa.s or less.
13. A process for preparing the epoxy resin composition of any one of claims 1-12, comprising the steps of:
(1) each component was weighed and mixed to obtain a premixed powder,
(2) the premixed powder is heat mixed and extruded to obtain a product.
14. Use of the epoxy resin composition of any one of claims 1-12 in a mold package.
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