CN114274517B - Ultrasonic antenna implantation method, device and readable storage medium - Google Patents
Ultrasonic antenna implantation method, device and readable storage medium Download PDFInfo
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- CN114274517B CN114274517B CN202111424142.7A CN202111424142A CN114274517B CN 114274517 B CN114274517 B CN 114274517B CN 202111424142 A CN202111424142 A CN 202111424142A CN 114274517 B CN114274517 B CN 114274517B
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Abstract
The invention discloses an ultrasonic antenna implantation method, equipment and a readable storage medium, wherein the ultrasonic antenna implantation method comprises the following steps: acquiring information determined by a motion control system combined with a positioning mechanism sensor or a first camera component; performing first analysis on the determined information, and determining the state information of the base material according to the result of the first analysis; positioning the slotting position of the base material in real time based on the state information of the base material; controlling a slotting device to run to the slotting position and slotting the base material by the slotting device; controlling an ultrasonic antenna implantation device to perform ultrasonic wire burying according to a preset route through an ultrasonic technology based on the slotting position of the base material; to complete the implantation of the antenna into the substrate. The technical scheme of the invention can improve the implantation smoothness of the ultrasonic antenna, is suitable for wire diameters and materials with wider range, and base material thicknesses and materials with wider range, and has high implantation efficiency and quality of the antenna.
Description
Technical Field
The present invention relates to an ultrasonic antenna implantation technology, and in particular, to an ultrasonic antenna implantation method, apparatus, and readable storage medium.
Background
The development of radio frequency technology has been studied and applied in the electronic field, but the development of radio frequency technology is limited in the technical fields of the internet of things and wireless charging although the development of radio frequency technology is widely popularized. The magnetic field resonance type wireless charging consists of an energy transmitting device and an energy receiving device, which can exchange energy with each other when the two devices are tuned to the same frequency or resonate at a specific frequency.
In the prior art, the method for implanting the antenna by ultrasonic waves has certain requirements on the wire diameter and the specification material of the base material, so that the wires with different diameters cannot be implanted into the base material rapidly and smoothly, and the method has larger limitation.
Disclosure of Invention
The invention mainly aims to provide an ultrasonic antenna implantation method, ultrasonic antenna implantation equipment and a readable storage medium, and aims to improve the smoothness of ultrasonic antenna implantation and the efficiency of ultrasonic antenna implantation.
The invention aims to solve the problems by adopting the following technical scheme:
An ultrasonic antenna implantation method, comprising the steps of:
acquiring information determined by a motion control system combined with a positioning mechanism sensor or a first camera component; performing first analysis on the determined information, and determining the state information of the base material according to the result of the first analysis;
positioning the slotting position of the base material in real time based on the state information of the base material; controlling a slotting device to run to the slotting position and slotting the base material by the slotting device;
Controlling an ultrasonic antenna implantation device to perform ultrasonic wire burying according to a preset route through an ultrasonic technology based on the slotting position of the base material; to complete the implantation of the antenna into the substrate.
Preferably, the state information of the substrate includes shape information and real-time placement position of the substrate.
Preferably, the grooving positions of the base materials are positioned in real time based on the state information of the base materials; the step of controlling the slotting device to move to the slotting position and slotting the base material by the slotting device comprises the following steps:
determining whether the real-time placing position of the base material is matched with a preset placing position corresponding to the slotting position;
if the real-time placing positions of the base materials are not matched, calculating the deviation between the real-time placing positions and the preset placing positions of the base materials, and adjusting the real-time placing positions of the base materials according to the deviation, so that the real-time placing positions are moved to the preset placing positions.
Preferably, the grooving positions of the base materials are positioned in real time based on the state information of the base materials; the step of controlling the slotting device to move to the slotting position and slotting the base material by the slotting device comprises the following steps:
and acquiring third shooting information shot by a third shooting component, performing third analysis on the third shooting information, and determining the state information of the base material subjected to grooving according to the structure of the third analysis.
Preferably, in the step of acquiring the third image capturing information captured by the third image capturing unit, performing a third analysis on the third image capturing information, and determining the state information of the substrate subjected to the grooving process according to the structure of the third analysis, the method includes the steps of:
Judging whether the slotting structure of the base material subjected to slotting treatment is abnormal or not;
if abnormality occurs, marking as an abnormally grooved substrate; and the step of controlling the ultrasonic antenna implantation device to perform ultrasonic wire embedding according to a preset route is not performed based on the slotting position of the base material.
Preferably, the ultrasonic antenna implantation device is controlled to move and bury the wire according to a preset route at the slotting position based on the base material; after the step of implanting the antenna into the substrate is completed, the method further comprises:
and acquiring second imaging information shot by a second imaging component on the substrate with the implanted antenna, and performing second analysis on the second imaging information to acquire a second analysis result.
Preferably, in the step of acquiring second imaging information captured by the second imaging component on the substrate completed by the implanted antenna, performing a second analysis on the second imaging information to acquire a second analysis result, the method further includes:
judging whether the implantation condition of the ultrasonic antenna is abnormal or not according to the second analysis result;
if the substrate is abnormal, marking the substrate after the ultrasonic antenna is implanted as an abnormal product; and if no abnormality occurs, marking the substrate after the ultrasonic antenna is implanted as a qualified product.
Preferably, in the step of judging whether the implantation condition of the ultrasonic antenna is abnormal or not according to the result of the second analysis,
If the characterization parameters in the processed base material are matched with the preset characterization parameters, determining that the slotted implanted antenna is normal;
and if the characterization parameters in the processed base material are not matched with the preset characterization parameters, determining that the slotted implanted antenna is abnormal.
Preferably, an ultrasonic antenna implantation apparatus includes a processor, a memory, a slotting program and an ultrasonic antenna implantation program stored on the memory and executable by the processor; wherein the slotting procedure and the ultrasonic antenna implantation procedure, when executed by the processor, implement the steps of the ultrasonic antenna implantation method according to any one of the preceding claims.
Preferably, a readable storage medium has a slotting program and an ultrasonic antenna implantation program stored thereon, wherein the slotting program and the ultrasonic antenna implantation program, when executed by a processor, implement the steps of the ultrasonic antenna implantation method according to any one of the above.
The beneficial effects are that: according to the technical scheme, first shooting information shot by a first shooting component is acquired, first analysis is carried out on the first shooting information, and state information of a base material is determined according to a result of the first analysis; then positioning the slotting position of the base material in real time based on the state information of the base material; controlling a slotting device to run to the slotting position and slotting the base material by the slotting device; finally, controlling the ultrasonic antenna implantation device to move and bury the wire according to a preset route based on the slotting position of the base material; to complete the implantation of the antenna into the substrate; the precise judgment of the slotting position of the base material according to the real-time state information of the base material is realized, and the slotting quality can be ensured; then, the antenna moving buried wire is carried out at the slotting position based on a preset route, so that the smoothness of ultrasonic antenna implantation can be improved, the ultrasonic antenna implantation method is suitable for antennas of more different models, and the implantation efficiency of the antenna is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flowchart of an ultrasonic antenna implantation method according to an embodiment of the invention.
Fig. 2 is a flowchart of an ultrasonic antenna implantation method according to an embodiment of the invention.
Fig. 3 is a schematic diagram showing a hardware structure of an ultrasonic antenna implantation apparatus according to an embodiment of the present invention.
Fig. 4 is a schematic view of a substrate slot-implanted antenna according to a later embodiment of the invention.
Reference numerals illustrate:
| Reference numerals | Name of the name | Reference numerals | Name of the name |
| 1 | Processor and method for controlling the same | 2 | Memory device |
| 3 | Network interface | 4 | User interface |
| 5 | Communication bus |
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture, and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, if "and/or" and/or "are used throughout, the meaning includes three parallel schemes, for example," a and/or B "including a scheme, or B scheme, or a scheme where a and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
As shown in fig. 3, fig. 3 is a schematic structural diagram of an ultrasonic antenna implantation device in a hardware operating environment according to an embodiment of the present invention. The ultrasonic antenna implantation apparatus may include: a processor 1, such as a CPU; a communication bus 5, a user interface 4, a network interface 3 and a memory 2. Wherein a communication bus 5 is used to enable connection communication between these components. The user interface 4 may comprise a Display screen (Display), an input unit such as a Keyboard (Keyboard), the user interface 4 may also comprise a standard wired interface (e.g. for connecting a wired Keyboard, a wired mouse, etc.), a wireless interface (e.g. for connecting a wireless Keyboard, a wireless mouse). The network interface 3 may optionally comprise a standard wired interface (for connecting to a wired network), a wireless interface (e.g. WI-FI interface, bluetooth interface, infrared interface, etc. for connecting to a wireless network). The memory 2 may be a high-speed RAM memory or a stable memory (non-volatile memory), such as a disk memory. The memory 2 may alternatively be a storage device independent of the aforementioned processor 1.
It will be appreciated by those skilled in the art that the ultrasound antenna implant device structure shown in fig. 3 is not limiting of the ultrasound antenna implant device and may include more or fewer components than shown, or may combine certain components, or a different arrangement of components.
As shown in fig. 3, an operating system, a network communication module, a user interface module, and a slotting program and an implanted antenna program may be included in the memory 2 as one type of computer-readable storage medium. The operating system is a program for managing and controlling the dispensing equipment and software resources and supports the operation of a network communication module, a user interface module, a slotting program, an implanted antenna program and other programs or software; the network communication module is used for managing and controlling the network interface 3; the user interface module is used for managing and controlling the user interface 4.
As shown in fig. 1, in the ultrasonic antenna implantation apparatus shown in fig. 3, the ultrasonic antenna implantation apparatus calls a slotting program and an implantation antenna program stored in a memory 2 through a processor 1, and performs the steps of:
s1, acquiring information determined by a motion control system combined with a positioning mechanism sensor or a first camera component; performing first analysis on the determined information, and determining the state information of the base material according to the result of the first analysis;
S2, positioning the slotting position of the base material in real time based on the state information of the base material; controlling a slotting device to run to the slotting position and slotting the base material by the slotting device;
S3, controlling an ultrasonic antenna implantation device to perform ultrasonic wire burying according to a preset route through an ultrasonic technology based on the slotting position of the base material; to complete the implantation of the antenna into the substrate.
According to the technical scheme, first shooting information shot by a first shooting component is acquired, first analysis is carried out on the first shooting information, and state information of a base material is determined according to a result of the first analysis; then positioning the slotting position of the base material in real time based on the state information of the base material; controlling a slotting device to run to the slotting position and slotting the base material by the slotting device; finally, controlling the ultrasonic antenna implantation device to move and bury the wire according to a preset route based on the slotting position of the base material; to complete the implantation of the antenna into the substrate; the precise judgment of the slotting position of the base material according to the real-time state information of the base material is realized, and the slotting quality can be ensured; then, the antenna moving buried wire is carried out at the slotting position based on a preset route, so that the smoothness of ultrasonic antenna implantation can be improved, the ultrasonic antenna implantation method is suitable for antennas of more different models, and the implantation efficiency of the antenna is improved.
In this embodiment, the antenna may be a copper wire; of course, the antenna made of other materials may be used without further limitation.
In this embodiment, the substrate may be a nonmetallic substrate such as PVC, PC, PETG, PET, ABS; of course, the substrate made of other materials is not limited to one.
In some embodiments, the ultrasonic antenna implantation method can utilize ultrasonic waves to implant (embed) copper wires on nonmetallic substrates such as PVC, PC, PETG, PET, ABS, and not only can implant wires with diameters larger than or equal to 0.3mm on nonmetallic substrates according to a pre-programmed path; leads with diameters less than 0.3mm can also be implanted on the nonmetallic substrate according to a pre-programmed path.
Specifically, in S1, the state information of the substrate includes shape information and a real-time placement position of the substrate.
The first camera component comprises a first industrial camera (which may be a CCD vision positioning camera), the vision positioning camera may perform CCD mark point positioning, the material is conveyed to a grooved wire planting platform through a conveying device, the first industrial camera continuously performs wide-angle shooting of pictures in the conveying process, the pictures are sent to a grooving system (a system controlled by a grooving program), the grooving system receives first camera shooting information shot by the first industrial camera, the first camera shooting information is analyzed, the position of the material and the position of the groove in the pictures are analyzed, specifically, an image coordinate system may be established by taking the upper left corner of a field of view of the first industrial camera as an origin of coordinates, the transverse border direction of the field of view is taken as an X axis of the image coordinate system, the longitudinal border direction of the field of view is taken as a Y axis of the image coordinate system, the directions of vertical transverse border and longitudinal border are taken as Z axes of the image coordinate system, the distance of the Z axis is not considered, and the position of the material is taken as an origin to construct an object coordinate system of XYZ, and of course, a person skilled in the art may also establish an image coordinate system and an object coordinate system by any preset origin and an object coordinate system. The coordinates of the material and the grooving in the image in the actual coordinate system can be calculated through the mapping relation between the image coordinate system and the object coordinate system, so that the position of the material and the position of the grooving can be determined.
Specifically, positioning the slotting position of the base material in real time based on the state information of the base material; the step of controlling the slotting device to move to the slotting position and slotting the base material by the slotting device comprises the following steps:
determining whether the real-time placing position of the base material is matched with a preset placing position corresponding to the slotting position;
if the real-time placing positions of the base materials are not matched, calculating the deviation between the real-time placing positions and the preset placing positions of the base materials, and adjusting the real-time placing positions of the base materials according to the deviation, so that the real-time placing positions are moved to the preset placing positions.
That is, when the substrate is conveyed to the slotting and wire-planting platform through the conveying structure, the first image pickup part is required to pick up the position information and the shape information (the shape information can comprise a single sheet or a coil stock) of the substrate and transmit and analyze the image pickup information of the substrate, and then judge whether the real-time actually placed coordinate position of the substrate is corresponding to the coordinate position when slotting is preset; if the corresponding operation of the slotting device is carried out, the slotting device moves to a preset placement position to slotting the base material; if the real-time placing position of the base material does not correspond to the preset placing position corresponding to the grooving position, controlling the adjusting device to adjust the real-time placing position of the base material to the preset placing position, and finally moving the grooving device to the preset placing position to carry out grooving treatment on the base material; the adjusting device can select a telescopic cylinder, and the adjusting straight plate is driven by a telescopic shaft of the telescopic cylinder to push and adjust the placing position of the base material; the adjusting device can also select a mechanical arm, and the stepping motor drives a high-precision ball screw to drive, so that the mechanical arm is controlled to drive the substrate to adjust the placing position, and the repeated positioning precision can be 0.01mm.
Specifically, positioning the slotting position of the base material in real time based on the state information of the base material; the step of controlling the slotting device to move to the slotting position and slotting the base material by the slotting device comprises the following steps:
and acquiring third shooting information shot by a third shooting component, performing third analysis on the third shooting information, and determining the state information of the base material subjected to grooving according to the structure of the third analysis.
Further, in the step of acquiring the third image capturing information captured by the third image capturing component, performing a third analysis on the third image capturing information, and determining the state information of the substrate subjected to the grooving process according to the structure of the third analysis, the method comprises the following steps:
Judging whether the slotting structure of the base material subjected to slotting treatment is abnormal or not;
If abnormality occurs, marking as an abnormally grooved substrate; and the step of controlling the ultrasonic antenna implantation device to move the buried wire according to a preset route is not performed based on the slotting position of the base material.
Wherein the third camera assembly comprises a first industrial camera (which may be a CCD visual positioning camera) which can take pictures and video in view.
That is, after each grooving process is performed, the state information of the grooved substrate needs to be analyzed and verified; when abnormal operation or other conditions occur, the processed substrate needs to be marked and discarded, and the subsequent antenna implantation process is not executed; therefore, the quality of the base material can be ensured, and meanwhile, the antenna implanted in the defective product can be saved, and the raw materials are wasted.
Specifically, as shown in fig. 2, at the position of the slot based on the base material, controlling the ultrasonic antenna implantation device to perform ultrasonic wire embedding according to a preset route by using an ultrasonic technology; after the step of implanting the antenna into the substrate is completed, the method further comprises:
S4, acquiring second imaging information shot by the second imaging component on the substrate with the implanted antenna, and performing second analysis on the second imaging information to acquire a second analysis result.
The second image pickup part comprises a first industrial camera (which may be a CCD visual positioning camera) which can take pictures and record images in view.
That is, the state information of the finished substrate is analyzed and recorded and stored by the second image pickup means.
Further, in the step of acquiring the second image capturing information captured by the second image capturing component on the substrate completed by the implanted antenna, performing a second analysis on the second image capturing information to acquire a second analysis result, the method further includes:
S5, judging whether the implantation condition of the ultrasonic antenna is abnormal or not according to the second analysis result;
s6, if abnormality occurs, marking the substrate implanted with the ultrasonic antenna as an abnormal product; and if no abnormality occurs, marking the substrate after the ultrasonic antenna is implanted as a qualified product.
That is, after each time of antenna implantation, the state information of the substrate processed by the implanted antenna needs to be analyzed and verified; when abnormal operation or other conditions occur, the processed substrate needs to be marked and discarded; thereby guaranteeing the quality of the substrate leaving the factory.
Specifically, in the step of judging whether the implantation condition of the ultrasonic antenna is abnormal or not according to the result of the second analysis,
If the characterization parameters in the processed base material are matched with the preset characterization parameters, determining that the slotted implanted antenna is normal;
and if the characterization parameters in the processed base material are not matched with the preset characterization parameters, determining that the slotted implanted antenna is abnormal.
In this embodiment, the characterization parameter is matched with the preset parameter, and it is determined whether the characterization parameter is matched with the preset parameter, if so, the slotted implanted antenna is normal, and if not, the slotted implanted antenna is abnormal. The technician may set at least one characterization parameter as a matching condition, for example, the substrate after the processing shown in fig. 4 is finished, and the wiring profile of the antenna in the groove of the substrate is used as a matching condition, so as to obtain whether the wiring profile in the second picture is matched with the preset profile, if so, the slotted implanted antenna is normal, and if not, the slotted implanted antenna is abnormal. Of course, other characterization parameters may also be used as matching conditions.
In this embodiment, whether the notch implanted antenna is abnormal is determined according to the analysis result, if the notch implanted antenna is abnormal, the substrate after the notch implanted antenna is marked as a notch implanted antenna abnormal product, if the notch implanted antenna is normal, the substrate after the notch implanted antenna is marked as a qualified product, so that the abnormal product is distinguished from the qualified product, and the product quality is guaranteed.
Specifically, controlling the ultrasonic antenna implantation device to move and bury the wire according to a preset route at the slotting position based on the base material; after the step of implanting the antenna into the substrate is completed, the method further comprises the following steps:
Monitoring the working operation time of the slotting device and the ultrasonic antenna implantation device in real time, and determining whether the working operation time is greater than a preset threshold value;
and if the working time length is greater than the preset threshold value, controlling a cooling device to perform cooling treatment for the first preset time on the slotting device and the ultrasonic antenna implantation device.
Wherein in some embodiments, the cooling device may be an air cooler or a refrigerator. The first preset time is 10-20min.
In addition, the embodiment of the invention also provides a computer readable storage medium. The computer readable storage medium of the invention stores a slotting program and an ultrasonic antenna implantation program, and the slotting program and the ultrasonic antenna implantation program realize the following steps when being executed by a processor:
s1, acquiring information determined by a motion control system combined with a positioning mechanism sensor or a first camera component; performing first analysis on the determined information, and determining the state information of the base material according to the result of the first analysis;
S2, positioning the slotting position of the base material in real time based on the state information of the base material; controlling a slotting device to run to the slotting position and slotting the base material by the slotting device;
S3, controlling an ultrasonic antenna implantation device to perform ultrasonic wire burying according to a preset route through an ultrasonic technology based on the slotting position of the base material; to complete the implantation of the antenna into the substrate.
Further, the state information of the base material comprises shape information and real-time placement positions of the base material.
Further, positioning the slotting position of the base material in real time based on the state information of the base material; the step of controlling the slotting device to move to the slotting position and slotting the base material by the slotting device comprises the following steps:
determining whether the real-time placing position of the base material is matched with a preset placing position corresponding to the slotting position;
if the real-time placing positions of the base materials are not matched, calculating the deviation between the real-time placing positions and the preset placing positions of the base materials, and adjusting the real-time placing positions of the base materials according to the deviation, so that the real-time placing positions are moved to the preset placing positions.
Further, positioning the slotting position of the base material in real time based on the state information of the base material; the step of controlling the slotting device to move to the slotting position and slotting the base material by the slotting device comprises the following steps:
and acquiring third shooting information shot by a third shooting component, performing third analysis on the third shooting information, and determining the state information of the base material subjected to grooving according to the structure of the third analysis.
Further, in the step of acquiring the third image capturing information captured by the third image capturing component, performing a third analysis on the third image capturing information, and determining the state information of the substrate subjected to the grooving process according to the structure of the third analysis, the method comprises the following steps:
Judging whether the slotting structure of the base material subjected to slotting treatment is abnormal or not;
If abnormality occurs, marking as an abnormally grooved substrate; and the step of controlling the ultrasonic antenna implantation device to move the buried wire according to a preset route is not performed based on the slotting position of the base material.
Further, controlling the ultrasonic antenna implantation device to move and bury the wire according to a preset route at the slotting position based on the base material; after the step of implanting the antenna into the substrate is completed, the method further comprises:
S4, acquiring second imaging information shot by the second imaging component on the substrate with the implanted antenna, and performing second analysis on the second imaging information to acquire a second analysis result.
Further, in the step of acquiring the second image capturing information captured by the second image capturing component on the substrate completed by the implanted antenna, performing a second analysis on the second image capturing information to acquire a second analysis result, the method further includes:
S5, judging whether the implantation condition of the ultrasonic antenna is abnormal or not according to the second analysis result;
s6, if abnormality occurs, marking the substrate implanted with the ultrasonic antenna as an abnormal product; and if no abnormality occurs, marking the substrate after the ultrasonic antenna is implanted as a qualified product.
Further, in the step of judging whether the implantation condition of the ultrasonic antenna is abnormal or not according to the result of the second analysis,
If the characterization parameters in the processed base material are matched with the preset characterization parameters, determining that the slotted implanted antenna is normal;
and if the characterization parameters in the processed base material are not matched with the preset characterization parameters, determining that the slotted implanted antenna is abnormal.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.
Claims (5)
1. An ultrasonic antenna implantation method, comprising the steps of:
Acquiring information determined by a motion control system combined with a positioning mechanism sensor or a first camera component; performing first analysis on the determined information, and determining the state information of the base material according to the result of the first analysis; wherein the first imaging component comprises a first industrial camera; in the process of conveying the base material to the grooved wire planting platform through the conveying device, the first industrial camera continuously shoots pictures;
Positioning the slotting position of the base material in real time based on the state information of the base material; controlling a slotting device to run to the slotting position and slotting the base material by the slotting device; the state information of the base material comprises shape information and real-time placement positions of the base material;
Positioning the slotting position of the base material in real time based on the state information of the base material; the step of controlling the slotting device to move to the slotting position and slotting the base material by the slotting device comprises the following steps: determining whether the real-time placing position of the base material is matched with a preset placing position corresponding to the slotting position; if the real-time placing positions of the base materials are not matched, calculating the deviation between the real-time placing positions and the preset placing positions of the base materials, and adjusting the real-time placing positions of the base materials according to the deviation so that the real-time placing positions move to the preset placing positions; when the base material is transmitted to the slotting wire-planting platform through the transmission device, the first image pickup component shoots the position information and the shape information of the base material; acquiring third shooting information shot by a third shooting component, performing third analysis on the third shooting information, and determining the state information of the base material subjected to grooving according to the result of the third analysis;
Controlling an ultrasonic antenna implantation device to perform ultrasonic wire burying according to a preset route through an ultrasonic technology based on the slotting position of the base material; to complete the implantation of the antenna into the substrate;
controlling an ultrasonic antenna implantation device to perform ultrasonic wire embedding according to a preset route at the slotting position based on the base material; after the step of implanting the antenna into the substrate is completed, the method further comprises:
acquiring second shooting information shot by a second shooting part on a substrate with an implanted antenna, and performing second analysis on the second shooting information to acquire a second analysis result;
judging whether the implantation condition of the ultrasonic antenna is abnormal or not according to the second analysis result;
if the substrate is abnormal, marking the substrate after the ultrasonic antenna is implanted as an abnormal product; and if no abnormality occurs, marking the substrate after the ultrasonic antenna is implanted as a qualified product.
2. The method according to claim 1, wherein the step of obtaining third imaging information captured by a third imaging means, performing a third analysis on the third imaging information, and determining the state information of the substrate subjected to the grooving process based on the structure of the third analysis, comprises the steps of:
Judging whether the slotting structure of the base material subjected to slotting treatment is abnormal or not;
If abnormality occurs, marking as an abnormally grooved substrate; and the step of controlling the ultrasonic antenna implantation device to move the buried wire according to a preset route is not performed based on the slotting position of the base material.
3. The method of claim 1, wherein in the step of determining whether the ultrasonic antenna is implanted abnormally based on the result of the second analysis,
If the characterization parameters in the processed base material are matched with the preset characterization parameters, determining that the slotted implanted antenna is normal;
and if the characterization parameters in the processed base material are not matched with the preset characterization parameters, determining that the slotted implanted antenna is abnormal.
4. An ultrasonic antenna implantation apparatus, comprising a processor, a memory, and a slotting program and an ultrasonic antenna implantation program stored on the memory and executable by the processor; wherein the slotting procedure and the ultrasonic antenna implantation procedure, when executed by the processor, implement the steps of the ultrasonic antenna implantation method according to any one of claims 1 to 3.
5. A readable storage medium, characterized in that a slotting program and an ultrasonic antenna implantation program are stored on the readable storage medium, wherein the slotting program and the ultrasonic antenna implantation program, when executed by a processor, implement the steps of the ultrasonic antenna implantation method according to any one of claims 1 to 3.
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