CN114257928A

CN114257928A - Hybrid adhesive and electronic device

Info

Publication number: CN114257928A
Application number: CN202011010021.3A
Authority: CN
Inventors: 陈静; 颜嘉甫
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2020-09-23
Filing date: 2020-09-23
Publication date: 2022-03-29

Abstract

The present disclosure relates to a hybrid adhesive and an electronic device. The mixed glue comprises a colloid and solid particles, wherein the solid particles are mixed in the colloid, the colloid is used for bonding pieces to be bonded, and the solid particles are arranged between two stacked pieces to be bonded.

Description

Hybrid adhesive and electronic device

Technical Field

The disclosure relates to the technical field of terminals, in particular to a mixed glue and an electronic device.

Background

In electronic devices, it is usually necessary to bond two adjacent parts by glue or tape to avoid punching holes in the parts or providing snap-fit structures. However, when the component is used for vibration sound generation, the vibration needs to be transmitted to the vibration sound generating element through the adhesive tape layer, so how to reduce the loss and noise of the sound in the adhesive tape layer and improve the sound generating effect also becomes the research and development direction of the technicians in the field.

Disclosure of Invention

The present disclosure provides a hybrid adhesive and an electronic device to solve the disadvantages of the related art.

According to a first aspect of the embodiments of the present disclosure, a mixed glue is provided, which includes a colloid and solid particles, wherein the solid particles are mixed in the colloid, the colloid is used for bonding to-be-bonded members, and the solid particles are disposed between two stacked to-be-bonded members along with the colloid.

Optionally, the colloid comprises:

a first adhesive tape layer;

a second adhesive tape layer; the solid particles are arranged between the first adhesive tape layer and the second adhesive tape layer, and the first adhesive tape layer and the second adhesive tape layer are respectively used for being adhered with the piece to be adhered.

Optionally, the first tape layer or the second tape layer includes one of the following tape layers:

OCA tape, PET tape, PSA tape.

Optionally, the colloid comprises a liquid colloid, and the solid particles are mixed in the liquid colloid.

Optionally, the solid particles comprise at least one of the following:

carbon nanotube particles, graphite particles, zeolite particles, metal particles.

According to a second aspect of the embodiments of the present disclosure, there is provided an electronic apparatus including:

a sound transmission device;

a piezoelectric thin film layer;

the hybrid glue according to any one of the above embodiments, wherein the hybrid glue is adhered between the microphone component and the piezoelectric thin film layer, and the deformation of the piezoelectric thin film layer drives the microphone component to vibrate.

Optionally, the microphone device includes a display panel or a housing, and the piezoelectric film layer is directly bonded to the display panel or the housing through the mixed glue.

Optionally, the microphone device includes a display panel and a buffer layer, and the buffer layer and the piezoelectric thin film layer are both disposed on the same side of the display panel;

the piezoelectric thin film layer is connected with the buffer layer through the mixed glue, and the buffer layer is connected with the display panel through the mixed glue.

Optionally, the microphone spare includes display panel, buffer layer and static inoxidizing coating, the buffer layer with piezoelectric thin film layer locates static inoxidizing coating with between the display panel, the buffer layer with piezoelectric thin film layer passes through the mixed glue all with the static inoxidizing coating is connected the buffer layer passes through the mixed glue with display panel connects.

Optionally, the buffer layer is disposed adjacent to the piezoelectric thin film layer, or the buffer layer is disposed around at least a portion of the piezoelectric thin film layer, or the piezoelectric thin film layer is disposed around at least a portion of the buffer layer.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

according to the embodiment, the solid particles are mixed in the mixed glue, and the sound propagation speed of the solid particles is greater than that of liquid and gas, so that when the mixed glue is used for bonding the sound generating device, the sound propagation speed in the glue can be improved, and the sound can be transmitted out of the sound generating device laminated with the mixed glue as soon as possible, so that the diffusion in the plane where the sound mixed glue is located can be reduced, the generation of noise signals is reduced, and the signal to noise ratio of the sound is favorably improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

FIG. 1 is a schematic illustration of a hybrid glue shown in accordance with an exemplary embodiment.

FIG. 2 is a schematic illustration of another hybrid glue shown in accordance with an exemplary embodiment.

Fig. 3 is a schematic structural diagram of an electronic device according to an exemplary embodiment.

Fig. 4 is a schematic partial cross-sectional view of the electronic device of fig. 3.

Fig. 5 shows a pressure-deformation curve of the foam and the piezoelectric film layer.

FIG. 6 is a schematic partial cross-sectional view of an electronic device shown in accordance with an example embodiment.

FIG. 7 is a schematic partial cross-sectional view of another electronic device shown in accordance with an example embodiment.

FIG. 8 is a diagram illustrating the positional relationship of a buffer layer and a piezoelectric thin film layer, according to an exemplary embodiment.

FIG. 9 is a diagram illustrating another buffer layer and piezoelectric film layer position relationship, according to an example embodiment.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.

Fig. 1 is a schematic diagram illustrating a structure of a hybrid glue 100 according to an exemplary embodiment. As shown in fig. 1, the mixed glue 100 may include a colloid 1 and solid particles 2, the solid particles 2 may be mixed in the colloid 1, and when the colloid 1 is bonded between two stacked members to be bonded, the solid particles 2 may be disposed between the two stacked members to be bonded along with the colloid 1, and since the sound propagation speed in the medium is greater than that of a liquid and greater than that of a gas, the solid particles 2 are mixed in the colloid 1, and compared with a scheme of completely bonding by using the colloid 1, the sound propagation speed may be increased. Especially, when one of two pieces of waiting to bond that stack up sets up is piezoelectric film layer, the other party is vibration sound production device, piezoelectric film layer can vibrate along the thickness direction according to the signal of telecommunication of sensing, and then promote vibration sound production device through glue 100 and vibrate, and because the vibration of piezoelectric film layer leads to probably causing the mutual slip between piezoelectric film layer and the vibration sound production device in the plane that piezoelectric film layer is located, for adopting glue to bond's technical scheme completely, the propagation velocity of vibration in glue 100 that the disclosure provided can obtain promoting, thereby can reduce the diffusion of vibration in the plane, reduce noise signal's production, be favorable to improving the SNR of sound. Wherein the solid particles 2 may comprise one or a combination of more of carbon nanotube particles, graphite particles, zeolite particles and metal particles.

In an embodiment, still referring to fig. 1, the colloid 1 may include a first tape layer 11 and a second tape layer 12, the solid particles 2 may be disposed between the first tape layer 11 and the second tape layer 12, and the first tape layer 11 and the second tape layer 12 may be respectively bonded to the to-be-bonded members, so that the solid particles 2 may be stably disposed between the two to-be-bonded members, which is beneficial to increasing the propagation speed of sound. The first tape layer 11 may include one of an OCA (Optical clear adhesive) tape, a PET (Polyethylene terephthalate) tape and a PSA (pressure sensitive adhesive) tape, the second tape layer 12 may also include one of an OCA tape, a PET tape and a PSA tape, the first tape layer 11 and the second tape layer 12 may be the same or different, both the first tape layer 11 and the second tape layer 12 may be double-sided tapes, one side of each tape layer may be used to bond solid particles, and the other side of each tape layer may be used to bond a member to be bonded.

In an embodiment, as shown in fig. 2, the colloid 1 may include a liquid glue, the solid particles 2 may be mixed in the liquid glue, and then when the liquid glue is applied to the members to be bonded, the solid particles 2 may also be fixed and stacked between the two members to be bonded, and compared with the embodiment of fig. 1, the embodiment shown in fig. 2 is only required to mix the solid particles 2 in the liquid glue 2, which is beneficial to reducing the difficulty of obtaining the mixed glue 100; compared with the embodiment shown in fig. 2, the embodiment shown in fig. 1 is beneficial to ensuring the distribution uniformity of the solid particles 2, improving the synchronism of sound transmission at each position and improving the sound production effect.

With respect to the hybrid glue 100 provided in the above embodiments, as shown in fig. 3 and fig. 4, the present disclosure also provides an electronic apparatus 200, and the electronic apparatus 200 may include the acoustic device 201, the piezoelectric thin film layer 202, and the hybrid glue 100 as described in any one of the above embodiments. Wherein, this glue mixture 100 can bond between microphone spare 201 and piezoelectric film layer 202, with this, can transmit the vibration to microphone spare 201 through glue mixture 100 when piezoelectric film layer 202 is deformed according to the received signal of telecommunication, and then drive the air vibration through microphone spare 201, sound can be propagated to user's ear, and because mix and have solid particle 2 in the glue mixture 100, can promote the propagation velocity of sound between piezoelectric film layer 202 and microphone spare 201, noise reduction, signal-to-noise ratio is improved.

In an embodiment, as shown in fig. 4, the sound transmission device 201 may include a display panel, and the display panel may be directly bonded to the piezoelectric film layer 202 through the adhesive compound 100, so that the vibration of the piezoelectric film layer 202 may be directly transmitted to the display panel through the adhesive compound 100, so that the display panel performs vibration sound emission, thereby shortening the sound transmission path and reducing the loss of sound during the transmission process. Moreover, through the adhesion between the piezoelectric film layer 202 and the display panel, the display panel can be supported by the piezoelectric film layer 202, and especially when the display panel is a flexible display panel, as can be seen from the pressure-deformation variation curve of the buffer foam and the piezoelectric film layer in fig. 5, the hardness of the piezoelectric film layer is higher, and the deformation of the piezoelectric film layer is smaller than that of the buffer foam under the same pressure, so compared with the technical scheme of supporting by using the buffer foam in the related art, the display panel is supported by the piezoelectric film layer 202 in the present disclosure, the display panel can be vibrated and sounded while the display panel is vibrated, the impact resistance of the display panel is improved, and the display surface is reduced. Of course, in other embodiments, the microphone element 201 may also include a housing, and the piezoelectric film layer 202 may be directly bonded to the housing by the hybrid adhesive 100.

In another embodiment, as shown in fig. 6, the sound transmission device 201 may include a display panel 3 and a buffer layer 4, the buffer layer 4 and the display panel 3 may be disposed on the same side of the display panel 3, and the piezoelectric thin film layer 202 may be connected to the buffer layer 4 through the glue mixture 100, and the buffer layer 4 may be connected to the display panel 3 through the glue mixture 100, so as to conduct a sound propagation path from the piezoelectric thin film layer 202 to the buffer layer 4 to the display panel 3. Therefore, the piezoelectric film layer 202 is not directly connected to the display panel 3, so that a certain distance can be formed between the display panel 3 and the piezoelectric film layer 202, and the piezoelectric film layer 202 can serve as a sound cavity to improve the sound production effect.

In a further embodiment, as shown in fig. 7, the microphone device 201 may include a display panel 3, a buffer layer 4 and an electrostatic protection layer 5, wherein the buffer layer 4 and the piezoelectric film layer 202 are both disposed between the display panel 3 and the electrostatic protection layer 5, and the buffer layer 4 and the piezoelectric film layer 202 may be bonded to the electrostatic protection layer 5 by a mixed glue 100, and the buffer layer 4 may also be bonded to the display panel 3 by the mixed glue 100, so that a sound propagation path of the piezoelectric film layer 202-the electrostatic protection layer 5-the buffer layer 4-the display panel 3 may be formed, and electrostatic protection may be performed by the electrostatic protection layer 5, compared to the technical solution shown in fig. 6. Of course, in the embodiment shown in fig. 7, the piezoelectric thin film layer 202 and the buffer layer 4 may be adhered by the mixed glue 100, which is not limited by the disclosure. Furthermore, in the embodiment shown in fig. 4, a buffer layer 4 may also be included, the buffer layer 4 is bonded to the display panel to support the display panel, and the buffer layer 4 may be bonded or not bonded to the piezoelectric thin film layer 202, which is not limited by the present disclosure.

In the above embodiment, the buffer layer 4 may include a foam layer, and a part of the buffer layer 4 is arranged to support the display panel, so that the material used for the piezoelectric thin film layer 202 is reduced, and cost reduction is facilitated. The buffer layer 4 and the piezoelectric thin film layer 202 may be disposed adjacent to each other as shown in fig. 8, or as shown in fig. 9, the buffer layer 4 may be disposed around the piezoelectric thin film layer 202, or in other embodiments, the piezoelectric thin film layer 202 may be disposed around the buffer layer 4, or the buffer layer 4 may be disposed around a portion of the piezoelectric thin film layer 202, or the piezoelectric thin film layer 202 may be disposed around a portion of the buffer layer 4, which is not limited in this disclosure.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. The utility model provides a mix and glue, its characterized in that includes colloid and solid particle, the solid particle mix in the colloid, the colloid is used for bonding the piece of waiting to bond, the solid particle follow the colloid is located between two range upon range of pieces of waiting to bond.

2. The mixing glue of claim 1, wherein the glue body comprises:

a first adhesive tape layer;

3. The hybrid tape of claim 2, wherein the first tape layer or the second tape layer comprises one of the following tape layers:

OCA tape, PET tape, PSA tape.

4. The mixing glue of claim 1, wherein said glue body comprises a liquid glue, and wherein said solid particles are mixed within said liquid glue.

5. The mixing glue of claim 1, wherein said solid particles comprise at least one of:

6. An electronic device, comprising:

a sound transmission device;

a piezoelectric thin film layer;

a compound according to any one of claims 1 to 5, bonded between the microphone element and the piezoelectric film layer, deformation of the piezoelectric film layer driving the microphone element into vibration.

7. The electronic device according to claim 6, wherein the sound-transmitting device includes a display panel or a housing, and the piezoelectric thin film layer is directly bonded to the display panel or the housing through the hybrid adhesive.

8. The electronic device according to claim 6, wherein the sound-transmitting device includes a display panel and a buffer layer, the buffer layer and the piezoelectric thin film layer being disposed on a same side of the display panel;

9. The electronic device of claim 6, wherein the sound-transmitting device comprises a display panel, a buffer layer and an electrostatic protection layer, the buffer layer and the piezoelectric thin film layer are disposed between the electrostatic protection layer and the display panel, the buffer layer and the piezoelectric thin film layer are both connected to the electrostatic protection layer through the mixed glue, and the buffer layer is connected to the display panel through the mixed glue.

10. The electronic device of claim 8 or 9, wherein the buffer layer is disposed adjacent to the piezoelectric thin film layer, or the buffer layer is disposed around at least a portion of the piezoelectric thin film layer, or the piezoelectric thin film layer is disposed around at least a portion of the buffer layer.