CN114252903A - Method and device for detecting electron beam spot - Google Patents
Method and device for detecting electron beam spot Download PDFInfo
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- CN114252903A CN114252903A CN202011023329.1A CN202011023329A CN114252903A CN 114252903 A CN114252903 A CN 114252903A CN 202011023329 A CN202011023329 A CN 202011023329A CN 114252903 A CN114252903 A CN 114252903A
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- 238000010894 electron beam technology Methods 0.000 title claims abstract description 121
- 238000000034 method Methods 0.000 title claims abstract description 76
- 238000001514 detection method Methods 0.000 claims abstract description 114
- 230000008569 process Effects 0.000 claims abstract description 61
- 239000011159 matrix material Substances 0.000 claims description 78
- 201000009310 astigmatism Diseases 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 11
- 238000009434 installation Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
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- 229910001369 Brass Inorganic materials 0.000 description 1
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- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/29—Measurement performed on radiation beams, e.g. position or section of the beam; Measurement of spatial distribution of radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
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Abstract
本申请提出一种电子束斑检测方法与装置，装置包括：电子束发生装置、信号采集装置、检测板、真空室和计算机设备。该装置基于计算机设备和信号采集装置的结构，通过计算机设备控制电子束发生装置产生和驱使电子束按照预设轨迹扫描检测板产生过程信号，所述检测装置包括二次电子或背散射电子检测系统、电声信号检测系统、电声信号检测系统、信号发生器和数字扫描发生器。避免了因视角倾斜导致的图像畸变的影响，具有较高的可靠性高和精度，同时大幅提高了检测效率。利用本发明提供的方法和装置用于检测增材制造过程中工件的表面形貌特征和内部分层结构特征,结构简单,藕合性好,不会额外增加成本和复杂性。
The present application provides an electron beam spot detection method and device. The device includes an electron beam generation device, a signal acquisition device, a detection board, a vacuum chamber and computer equipment. The device is based on the structure of a computer device and a signal acquisition device. The computer device controls an electron beam generating device to generate and drive the electron beam to scan a detection plate according to a preset trajectory to generate a process signal. The detection device includes a secondary electron or backscattered electron detection system. , Electro-acoustic signal detection system, electro-acoustic signal detection system, signal generator and digital scanning generator. It avoids the influence of image distortion caused by the tilt of the viewing angle, has high reliability and precision, and greatly improves the detection efficiency. The method and device provided by the present invention are used to detect the surface topography features and internal layered structure features of the workpiece in the process of additive manufacturing, which has a simple structure and good coupling without additional cost and complexity.
Description
Technical Field
The present disclosure relates to electron beam processing and manufacturing, and more particularly, to a method and an apparatus for detecting an electron beam spot.
Background
In recent years, electron beam additive manufacturing technology using electron beams as a high-energy heat source has received great attention and development, but forming accuracy is always an important factor limiting the development. The quality of the electron beam influences the forming precision and quality, and has great significance for the electron beam additive manufacturing process.
Aiming at the current beam spot detector, a four-side planar target holder is adopted, the target holder is a target holder for measuring the beam cross section through single pass, and the target holder and an electron beam are placed at an angle of 50 degrees. This type of backing plate occupies a large space in the vacuum chamber. The target is moved perpendicular to the imaging path under the control of the drive mechanism, which is not suitable for use in a flat vacuum chamber at the undulator.
Disclosure of Invention
The invention provides an electron beam spot detection device and method, which are used for solving the problems of insufficient reliability, low detection precision and low detection efficiency of a detection method in the related technology. The purpose is to provide a target holder of an electron beam spot detector in a vacuum chamber.
An embodiment of an aspect of the present application provides an electron beam spot detection apparatus, including: the device comprises an electron beam generating device, a signal collecting device, a detection plate, a vacuum chamber and computer equipment; the electron beam generating device is used for generating an electron beam and controlling astigmatism, focusing and deflection of the electron beam.
And the computer is used for controlling the electron beam generating device to generate and drive the electron beam to scan the detection plate according to a preset track to generate a process signal, wherein the process signal is a signal generated in the process of scanning the detection plate by the electron beam.
The signal acquisition device is used for acquiring the process signal in real time and comprises a signal sensor, and the signal sensor acquires the process signal; the signal amplifier is connected with the signal sensor and is used for amplifying signals; and the AD acquisition card is connected with the signal amplifier to acquire process signals.
And the computer is also used for calculating the position deviation, the beam spot roundness and the beam spot size of the electron beam at the detection point according to the process signal, and adjusting the position state matrix, the astigmatism state matrix and the focusing state matrix of the electron beam generating device according to the position deviation, the beam spot roundness and the beam spot size.
The device for detecting the electron beam spots is based on the structures of computer equipment and a signal acquisition device, the electron beam generation device is controlled by the computer equipment to generate and drive an electron beam to scan a detection plate according to a preset track to generate a process signal, the signal acquisition device is used for acquiring the process signal in real time, the computer equipment is used for processing the process signal to determine the position deviation, the beam spot roundness and the beam spot size of the electron beam, and the position state matrix, the astigmatism state matrix and the focusing state matrix are adjusted according to the position deviation, the beam spot roundness and the beam spot size.
In a possible implementation manner of the embodiment of the aspect of the application, the signal sensor is a secondary electron sensor, and the secondary electron detector is made of a conductive material.
In a possible implementation manner of the embodiment of the present application, the detection board is a flat board and has at least one detection point, and the characteristics of the detection point are formed by geometric structures or material differences.
In another aspect, an embodiment of the present application provides an electron beam spot detection method, which is applied to an electron beam spot detection apparatus, where the apparatus includes: electron beam generating device, signal acquisition device, pick-up plate, vacuum chamber and computer equipment, include:
the computer equipment generates control data of the electron beam generating device according to a current detection state matrix and a preset track, and controls the electron beam generating device to drive an electron beam to scan the detection plate according to the preset track, wherein the current detection state matrix refers to a position state matrix, an astigmatism state matrix and a focusing state matrix at the current moment;
the signal acquisition device acquires a process signal in real time in the process of scanning the detection plate by the electron beam, wherein the process signal is a signal generated in the process of scanning the detection plate by the electron beam;
according to the electronic beam spot detection method, the electronic beam generating device is controlled by the computer device to drive the electronic beam to scan the detection plate according to the preset track to generate the process signal, the signal collecting device is used for collecting the process signal in real time, the computer device is used for processing the process signal to determine the position deviation, the beam spot roundness and the beam spot size of the electronic beam, and the position state matrix, the astigmatism state matrix and the focusing state matrix are adjusted according to the position deviation, the beam spot roundness and the beam spot size, so that the electronic beam spot is accurately detected.
In another possible implementation manner of the embodiment of another aspect of the present application, the adjusting position state matrix, the astigmatism state matrix, and the focusing state matrix include:
and stopping scanning-collecting until the position deviation, the beam spot roundness and the beam spot size at the detection point meet the conditions without adjusting the position state matrix, the astigmatism state matrix and the focusing state matrix.
After a scanning-collecting process, adjusting one state matrix of the position state matrix, the astigmatism state matrix and the focusing state matrix;
and after the first adjusted state matrix meets the condition, scanning-collecting the detection points again, randomly selecting one of the two remaining unadjusted state matrices for adjustment, and when the second adjusted state matrix meets the condition, continuously adjusting the remaining one state matrix.
The purpose achieved by the invention is realized by the following technical scheme:
according to the electron beam spot detection method and device, the target holder is designed to be a flat three-dimensional triangle, the middle of the triangle is hollowed, the top and the bottom of the triangle are respectively provided with a through hole, two equilateral faces of the triangle are provided with target installation grooves with scales, semi-transparent and semi-reflective target sheets are installed in the target installation grooves, and the bottom face of the triangle is provided with a target holder installation position.
According to the technical scheme provided by the invention, the target holder of the electron beam spot detector in the vacuum chamber provided by the embodiment of the invention can be used for measuring the positions of the electron beam spot and the reference laser in the flat vacuum chamber at the undulator, reducing the space occupation of the vacuum chamber so as to be suitable for being used in the flat vacuum chamber of the undulator, and realizing the positioning of the electron beam and the reference laser.
In another possible implementation manner of the embodiment of the present application, the detection points on the detection board are detected one by one, or all the detection points are detected simultaneously after the detection board is scanned once.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of an electron beam spot detection apparatus according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a front side of an electron beam spot detector target holder in a vacuum chamber according to an embodiment of the present invention;
FIG. 3 is a schematic flow chart illustrating a method for detecting an electron beam spot according to an embodiment of the present disclosure;
fig. 4 is a schematic flow chart of a parallel connection mode-based detection method according to an embodiment of the present disclosure;
in the figure: 1. top through hole, 2, target plate, 3, bottom through hole, 4, target holder installation position.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application.
An electron beam spot detection method and apparatus according to an embodiment of the present application will be described below with reference to the drawings.
Fig. 1 is a schematic diagram of an electron beam spot detection method and apparatus according to an embodiment of the present disclosure.
As shown in fig. 1, the electron beam spot detecting apparatus includes: an electron beam generating device 1, a signal collecting device 2, a detection plate 3, a vacuum chamber 5 and a computer device 6.
Wherein the electron beam generating device 1 is used for generating the electron beam 4 and controlling astigmatism, focus and deflection of the electron beam 4, wherein the acceleration voltage of the electron beam generating device 1 can be 60kV, and the power is 0-10 kW.
The electron beam generating apparatus 1 includes an astigmatism coil 11, a focus coil 12, and a deflection coil 13, and controls astigmatism, focus, and deflection of the electron beam 4, respectively. The electron beam 4 is used in a vacuum chamber 5 formed by a pump or a valve.
The computer device 6 controls the electron beam generating device 1 to generate the electron beam 4, and controls the electron beam generating device 1 to drive the electron beam 4 to scan the detecting plate 3 according to a preset track to generate a process signal. Wherein the process signal is a signal generated during the scanning of the electron beam 4 on the detection plate 3, such as a secondary electron signal, a backscattered electron signal, an x-ray signal, and the like.
The sensing plate 3 is located within the vacuum chamber and has structural or material characteristics that cause a change in the process signal.
The signal acquisition device 2 acquires process signals in real time and sends the acquired process signals to the computer device 6. In this embodiment, the signal acquisition device 2 includes a signal sensor 21, a signal amplifier 22 and an AD acquisition card 23. Wherein, the signal sensor 21 is arranged in a vacuum chamber and collects process signals generated by the action of the electron beam 4 and the detection plate 3, such as secondary electron signals, back scattered electrons or x-ray signals and the like; the signal amplifier 22 is connected with the signal sensor 21 and is used for amplifying the process signal; the AD acquisition card 23 is connected to the signal amplifier 22 for converting the amplified process signal into a digital signal for further processing by the computer device 6.
The signal sensor 21 may be a secondary electron sensor, or a back-scattered electron sensor, or an x-ray sensor. Then, different types of sensors can be selected for different process signals, such as secondary electronic sensors for collecting secondary electronic signals; collecting a back scattering electronic signal by using a back scattering electronic sensor; an x-ray signal is acquired with an x-ray sensor.
The computer device 6 processes the process signal and calculates the position deviation of the electron beam, the roundness of the beam spot and the size of the beam spot at the detection point. Meanwhile, the computer device 6 adjusts the size, roundness and position on the detection plate 3 of the electron beam spot by adjusting the parameters of the electron beam generating device 1, thereby calibrating the position state matrix, the focusing state matrix and the astigmatism state matrix.
The position state matrix is composed of position parameters corresponding to all detection points on the detection plate, the focusing state matrix is composed of focusing parameters corresponding to all detection points on the detection plate, and the astigmatism state matrix is composed of astigmatism parameters corresponding to all detection points on the detection plate.
In an embodiment of the present application, the signal sensor 21 is a secondary electronic sensor, and the material of the secondary electronic sensor is a conductive material, such as brass, and the surface of the secondary electronic sensor may be flat or uneven, which is not limited in this application.
In one embodiment of the present application, the detector plate 3 is a flat plate having at least one detection point with specific structural or material characteristics that cause significant changes in the process signal during the electron beam scanning process. Generally, the characteristics of the detection points are constituted by differences in geometrical structure, material properties, and the like. When the electron beam 4 scans the detection points along a predetermined trajectory, which can generate significant signal differences, the computer device 6 processes the process signals to determine the size and focus state of the electron beam spot.
Specifically, the detection plate 3 is designed to generate a difference in the sensing signals, and further, to calculate the state values of the electron beam, such as the size, the roundness, the focusing state, and the like, by the computer device 6. Therefore, the detection plate 3 should have a distinct feature due to differences in geometrical structure, material properties, and the like. Geometric structures such as cross grooves, grid-shaped grooves, round hole grooves and the like; or cross features, field features, circular slots, heterogeneous circular features, etc. constructed from heterogeneous materials. That is, the detection point can be regarded as being composed of geometric features, and can also be regarded as being composed of differences in physical properties of materials, such as adding a plating/coating on a metal flat plate.
In order to accurately detect the origin of the formed coordinates, in one embodiment of the present application, the detection points on the detection plate 3 are in an M x M array, where M is a positive integer. For example, if the detection matrix is a square matrix having odd rows and odd columns, the coordinates (0,0) of the center point of the center detection point on the detection plate can be used as the origin of the forming coordinates. If the detection point array is a square array with even rows and even columns, the centers of all the detection points of the detection plate can be used as the forming coordinate origin.
In one embodiment of the present application, the detecting plate 3 is a metal flat plate with an array cross slot feature, and the widths of four slots are kept equal, the distances between the centers of adjacent cross slots are equal, and each cross slot center corresponds to one detecting point. The width of the four grooves can be recorded as w, and the distance between the centers of the adjacent cross grooves is recorded as L.
If the number of rows and columns of the reticle feature array is odd, and is denoted as M, then M is 2k +1, k is a natural number, the center reticle is denoted as (0,0), and the array reticle may be denoted as (i, j), i, j is 0, ± 1, ± 2, ·, ± k.
Fig. 2 is a schematic diagram of a 7 × 7 array cross slot detection board according to an embodiment of the present application. Assuming that the center coordinates of the middle cross grooves are (0,0) and the distance between the centers of the adjacent cross grooves is L, a rectangular coordinate system can be established by taking the center coordinates of the middle cross grooves as an original point, the array cross grooves can be marked as (i, j), i, j is 0, ± 1, ± 2, ± 3, and the absolute coordinates of the centers of the cross grooves are (iL, jL) calculated according to the distances between the cross grooves on the detection plate.
In order to implement the above embodiments, the embodiments of the present application further provide an electron beam spot detection method. Fig. 3 is a schematic flow chart of a method and an apparatus for detecting an electron beam spot according to an embodiment of the present disclosure.
The electron beam spot detection method of the embodiment of the application can be applied to the electron beam spot detection device, and the device comprises an electron beam generation device, a signal acquisition device, a detection plate, a vacuum chamber and computer equipment so as to realize detection of the electron beam spot.
As shown in fig. 3, the electron beam spot detection method includes:
step S301, the computer equipment generates control data of the electron beam generating device according to the current detection state matrix and a preset track, and controls the electron beam generating device to drive the electron beam to scan the detection plate according to the preset track.
In this embodiment, the sensing plate is located within the vacuum chamber and has structural or material characteristics that can cause the process signal to change. And the computer equipment generates control data of the electron beam generating device according to the current detection state matrix and the preset track, controls the electron beam generating device to generate an electron beam according to the control data of the electron beam generating device, and controls the electron beam generating device to drive the electron beam to scan the detection plate according to the preset track.
When the preset track of the detection point is determined, a square scanning track surrounding the central point can be generated according to the real coordinates of the current detection point, the track is a closed square side line, the side length of the square is l, and the four scanning lines are respectively parallel to the directions of the x axis and the y axis of the forming coordinate system.
For example, the detection plate is a metal flat plate with an array cross slot feature, the widths of four channels are equal, the distances between the centers of adjacent cross slots are equal, the center of each cross slot corresponds to one detection point, the preset track is as shown in fig. 4, the preset track surrounds the center of the cross slot of the current calibration point and is perpendicular to the four channels respectively, and the lengths of four edges of the preset track are equal.
Step S302, the signal acquisition device acquires process signals in real time in the process of scanning the detection plate by the electron beam.
In the embodiment of the application, in the process that the electron beam scans the detection points on the detection plate according to the preset track, the signal acquisition device can acquire process signals in real time and transmit the acquired process signals to the computer equipment.
The signal acquisition device may include a signal sensor, a signal amplifier and an AD acquisition card, and reference may be made to the above embodiments for a specific process of acquiring a process signal, which is not described herein again.
Step S303, the computer device calculates the position deviation, the beam spot roundness and the beam spot size of the electron beam at the detection point according to the process signal, and adjusts the position state matrix, the astigmatism state matrix and the focusing state matrix according to the position deviation, the beam spot roundness and the beam spot size.
Wherein, the roundness of the electron beam spot is used for representing the shape of the electron beam spot, and the roundness can be represented by an aspect ratio, an ellipse eccentricity and the like; the beam spot size refers to the beam spot size and may be represented by an equivalent diameter, or elliptical area.
The method of calculating the position deviation of the electron beam, the circularity of the beam spot, and the size of the beam spot at the current detection position will be described by taking the example where the aspect ratio represents the circularity of the electron beam spot, and the equivalent diameter represents the size of the beam spot.
As shown in fig. 4, the parallel detection method includes:
step S401, the computer equipment generates control data of the electron beam generating device according to the current detection state matrix and a preset track, and controls the electron beam generating device to drive the electron beam to scan the detection plate according to the preset track.
For a specific method for generating the control data of the electron beam generating device, reference may be made to the method described in step 301, and details thereof are not repeated herein.
Step S402, in the process of scanning the detection plate by the electron beam, the signal acquisition device acquires process signals in real time.
Step S403, the computer device calculates the position deviation, the beam spot roundness and the beam spot size of the electron beam at each detection point according to the process signal, and adjusts the parameters corresponding to the corresponding detection point in the position state matrix, the astigmatism state matrix and the focusing state matrix according to the position deviation, the beam spot roundness and the beam spot size.
And S404, repeating the steps until the position deviation, the beam spot roundness and the beam spot size meet the conditions without adjusting the position state matrix, the astigmatism state matrix and the focusing state matrix.
The invention relates to a target holder of an electron beam spot detector in a vacuum chamber, which has the following preferred embodiments:
the target holder adopts flat three-dimensional triangle structural design, and triangle-shaped's centre fretwork, and triangle-shaped's top and bottom are opened respectively have the through-hole, and two equilateral faces of triangle-shaped are equipped with the target mounting groove of taking the scale, semi-transparent semi-reflection target piece is equipped with in the target mounting groove, and triangle-shaped's bottom surface is equipped with the target holder installation position.
The left bevel edge and the right bevel edge of the triangle are perpendicular to each other, a rectangular target base is arranged at the bottom of the triangle, and the target seat mounting position is arranged at the bottom of the rectangular target base.
The target sheet mounting groove is a three-side clamping groove type structure with one side opened.
The upper side, the lower side and one side of the target sheet mounting position clamping groove are provided with precise scale marks.
The depth of the through hole at the top and the bottom of the triangle is different, and the precise scale marks at the upper side and the lower side of the target sheet mounting position clamping groove are used for acquiring the position of the through hole.
When the OTR type target is installed, electrons penetrate through the middle hollow part of the target holder to simultaneously obtain beam spot and light spot images on the two target.
The target stand of the electron beam spot detector in the vacuum chamber can measure the positions of the electron beam spot and the reference laser in the flat vacuum chamber at the undulator, reduce the space occupation of the vacuum chamber so as to be suitable for the flat vacuum chamber of the undulator, and realize the positioning of the electron beam and the reference laser.
In this embodiment, after performing scanning-collecting-adjustment on all the detection points once, if any one of the position deviation, the beam spot roundness, and the beam spot size of the electron beam at any one of the detection points does not satisfy the condition, the scanning-collecting is continued, and the state matrix is continued to be adjusted until the position deviation, the beam spot roundness, and the beam spot size of the electron beam at all the detection points satisfy the condition, and the scanning-collecting process is stopped.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. An electron beam spot detection method and apparatus, comprising: the device comprises an electron beam generating device, a signal collecting device, a detection plate, a vacuum chamber and computer equipment;
the electron beam generating device is used for generating an electron beam and controlling astigmatism, focusing and deflection of the electron beam;
the computer equipment is used for controlling the electron beam generating device to generate and drive the electron beam to scan the detection plate according to a preset track to generate a process signal, and the process signal is a signal generated in the process that the electron beam scans the detection plate;
the detection plate is positioned in the vacuum chamber and has structural or material characteristics capable of causing process signals to change;
the signal acquisition device is used for acquiring the process signal in real time and comprises a signal sensor, and the signal sensor acquires the process signal; a signal amplifier connected to the signal sensor for amplifying the process signal; the AD acquisition card is connected with the signal amplifier to acquire the amplified process signal;
the computer equipment is also used for calculating the position deviation, the beam spot roundness and the beam spot size of the electron beam at the detection point according to the process signal, and adjusting the position state matrix, the astigmatism state matrix and the focusing state matrix of the electron beam generating device according to the position deviation, the beam spot roundness and the beam spot size;
the detection plate is a flat plate and is provided with at least one detection point, and the detection point is characterized by being formed by geometrical structures or material differences.
2. The apparatus of claim 1, wherein the process signal is a secondary electron signal, a backscattered electron signal, or an x-ray signal; correspondingly, the signal sensor is a secondary electron sensor, a back-scattered electron sensor or an x-ray sensor.
3. The device of claim 2, wherein the signal sensor is a secondary electron sensor, and the secondary electron sensor is made of a conductive material.
4. An apparatus as claimed in claims 1 to 3, wherein the detector board has an M x M array of detector point features thereon, where M is a positive integer.
5. The apparatus of claim 4, wherein the sensing plate is a flat metal plate featuring an array of cross wells, and wherein the four channels are of equal width and are equidistant from the center of adjacent cross wells.
6. A method of electron beam spot detection, applied to an electron beam spot detection apparatus, the apparatus comprising: electron beam generating device, signal acquisition device, detection board, vacuum chamber and computer equipment, the method comprises:
the computer equipment generates control data of the electron beam generating device according to a current detection state matrix and a preset track, and controls the electron beam generating device to drive an electron beam to scan the detection plate according to the preset track, wherein the current detection state matrix refers to a position state matrix, an astigmatism state matrix and a focusing state matrix at the current moment;
and the computer equipment calculates the position deviation, the beam spot roundness and the beam spot size of the electron beam at the detection point according to the process signal, and adjusts the position state matrix, the astigmatism state matrix and the focusing state matrix according to the position deviation, the beam spot roundness and the beam spot size.
7. The method of claim 6, wherein adjusting the position state matrix, the astigmatism state matrix, and the focus state matrix comprises:
after one scanning-collecting process, adjusting the position state matrix, the astigmatism state matrix and the focusing state matrix;
and stopping scanning-collecting until the position deviation, the beam spot roundness and the beam spot size at the detection point meet the conditions without adjusting the position state matrix, the astigmatism state matrix and the focusing state matrix.
8. The method of claim 7, wherein adjusting the position state matrix, the astigmatism state matrix, and the focus state matrix comprises:
after a scanning-collecting process, adjusting one state matrix of the position state matrix, the astigmatism state matrix and the focusing state matrix;
and after the first adjusted state matrix meets the condition, scanning-collecting the detection points again, randomly selecting one of the two remaining unadjusted state matrices for adjustment, and when the second adjusted state matrix meets the condition, continuously adjusting the remaining one state matrix.
9. The method and the device for detecting the electron beam spots are characterized in that a target holder is designed to be of a flat three-dimensional triangular structure, the middle of the triangle is hollowed, through holes are respectively formed in the top and the bottom of the triangle, semi-transparent and semi-reflective target sheets are installed in target installation grooves, and target holder installation positions are arranged on the bottom surface of the triangle.
10. The beam spot detector target holder of claim 9, wherein the left and right oblique sides of the triangle are perpendicular to each other, the bottom of the triangle is provided with a rectangular target base, the target holder mounting portion is arranged at the bottom of the rectangular target base, and the target sheet mounting groove is of a three-side clamping structure and an open-side clamping groove structure; the upper side, the lower side and one side of the target sheet mounting position clamping groove are provided with precise scale marks.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011023329.1A CN114252903A (en) | 2020-09-25 | 2020-09-25 | Method and device for detecting electron beam spot |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011023329.1A CN114252903A (en) | 2020-09-25 | 2020-09-25 | Method and device for detecting electron beam spot |
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| CN114252903A true CN114252903A (en) | 2022-03-29 |
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| CN202011023329.1A Pending CN114252903A (en) | 2020-09-25 | 2020-09-25 | Method and device for detecting electron beam spot |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023193282A1 (en) * | 2022-04-09 | 2023-10-12 | 华为技术有限公司 | Beam spot measurement method, apparatus, device and medium |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023193282A1 (en) * | 2022-04-09 | 2023-10-12 | 华为技术有限公司 | Beam spot measurement method, apparatus, device and medium |
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Application publication date: 20220329 |